JP2011059966A - Ic tag, method for manufacturing the same, and method for using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC tag which can be reused irrespective of the shape or surface condition of an object on which the IC tag is set, a method for manufacturing the IC tag and a method for using the IC tag. <P>SOLUTION: An IC tag 101 is manufactured by arranging an antenna 2 electrically bonded to an IC chip 3 in a lower case 1b, filling the lower case 1b with thermosetting resin 4, arranging fixture mounting parts 5a and 5b in alignment with fixture mounting parts 5c and 5d, respectively, putting an upper cover 1a over the lower case 1b, heating it, hardening the thermosetting resin 4, and fixing the lower case 1b and the upper cover 1a. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an IC tag, a method for manufacturing the IC tag, and a method for using the IC tag, which perform non-contact communication and write and read information.

  In recent years, an IC tag having an IC chip and an antenna having a non-contact type communication function, performing non-contact type communication, and writing and reading a large amount of information has been used in article management in the field of sales and logistics, It has been used for pharmaceutical management in the medical field.

  In any application, the IC tag needs to be attached to an article to be managed by being attached via an adhesive layer or the like. However, since the articles to be managed have various external shapes and various surface states, it may be difficult to affix them via an adhesive layer or the like. There is a need for a method of attaching a to an article.

  As a method of attaching an IC tag to an article without using an adhesive layer or the like, for example, in Patent Document 1, a band part that is elongated and has flexibility, and the other end of the band part provided on one end side of the band part. A binding band composed of a binding part to which the side is fixed, a rod-like IC tag (or RFID tag) body arranged in close contact along the band part, and the IC tag main body in close contact with the band part in a contracted state The IC tag is attached to the article by using an IC tag with a fixture that is provided with a heat shrinkable tube and the IC tag main body being spaced apart from the binding part. A method of mounting is described.

JP 2008-33706 A

  However, in the conventional IC tag with a fixture, the band portion that binds the article is processed in advance with a predetermined synthetic resin into a predetermined dimension so as to correspond to various shapes and surface conditions of the article. However, it is necessary to prepare a plurality of types of IC tags with attachments having different band sizes and materials, and there is a problem that there is no versatility.

  Furthermore, since the IC tag with a conventional fixture is fixed to the article with a binding band that cannot be removed except by cutting once, the IC tag cannot be removed from the article and reused. There was a problem that the cost of management was high.

  An object of the present invention is to provide an IC tag that can be reused regardless of the shape and surface state of an article to be mounted, a method for manufacturing the IC tag, and a method for using the IC tag.

  According to the present invention, there is provided an IC tag configured by embedding an IC chip and an antenna for performing non-contact communication in a housing portion, and the fixture mounting portion penetrating in the thickness direction is formed in the housing portion. An IC tag characterized by providing two or more is obtained.

  Further, according to the present invention, there is obtained the above-described IC tag, wherein the fixture attaching portion includes a slit reaching the outer surface.

  Further, according to the present invention, the housing part is filled with the lower case made of resin, which houses the IC chip and the antenna, the upper lid made of resin that seals the lower case, and the lower case The above-described IC tag comprising an IC chip and a thermosetting resin in which the antenna is embedded is obtained.

  According to the present invention, the step of electrically connecting the IC chip and the antenna, the step of injecting resin into a mold to form the lower case and the upper lid, and the IC chip on the lower case And the step of filling the thermosetting resin after housing the antenna, and the upper cover is overlaid on the lower case to cure the thermosetting resin so as to form the fixture mounting portion. The method for manufacturing an IC tag described above is characterized in that the method includes a step of bonding the upper lid to a case.

  Further, according to the present invention, a string-like or belt-like fixture is wound around an article, passed through the fixture attachment portion, and then the fastener is tied and attached in the vicinity of the fixture attachment portion. The method for using the above IC tag is obtained.

  In the present invention, by providing a plurality of fixture attachment portions on the housing portion, a string-like or belt-like fixture is wound around the fixture attachment portion, passed through the fixture attachment portion, and then attached to the fixture. An IC tag can be attached to the article by tying a fixture near the part. Furthermore, the IC tag can be easily removed from the article by unfastening the knot of the fixture.

  Furthermore, in the present invention, a plurality of fixture mounting portions provided in the housing portion are provided with slits reaching from the side surface of the housing portion, so that the string-like or belt-like portion of the article is passed through the slit, and the housing portion It is possible to move to a fixture mounting portion provided in a plurality of positions, and it is possible to attach a housing portion to an article. Furthermore, the string-like or belt-like portion of the article can be passed through this slit and moved out of the fixture attaching portion provided in the casing portion, and the IC tag can be easily removed from the article.

  According to the present invention, a string-like or belt-like fixture having an arbitrary length is wound around an article, passed through a plurality of fixture attachment portions provided in the housing portion, and then the fixture is placed near the fixture attachment portion. Tie and attach. Furthermore, the IC tag can be easily attached to and detached from the article by unraveling the knot of the fixture, and the article is further passed through a slit provided so as to reach the fixture attachment part from the side surface of the housing part. By moving the string-like or belt-like part of the belt to the fixture attaching part provided in the housing part, or by moving it out of the fixture attaching part, the string-like or belt-like part can be used without using the string-like or belt-like fastener. Thus, an IC tag that can be used repeatedly, regardless of the shape of the article to be mounted, a method for manufacturing the IC tag, and a method for using the IC tag can be obtained.

The figure explaining 1st Embodiment of the IC tag of this invention. AA sectional view taken on the line AA of FIG. The figure explaining 2nd Embodiment which mounted | wore the goods with 1st Embodiment of the IC tag of this invention. The figure explaining 3rd Embodiment of the IC tag of this invention. The figure explaining 4th Embodiment which mounted | wore goods with 3rd Embodiment of the IC tag of this invention.

  Embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a diagram for explaining a first embodiment of an IC tag according to the present invention, and describes an IC tag and a method for manufacturing the IC tag according to the present invention.

  The IC tag 101 according to the first embodiment includes an IC chip 3 having a non-contact communication function and an antenna 2 electrically joined to the IC chip 3 via the electrode terminal 102a and the electrode terminal 102b. To embed. The casing is configured by a substantially sun-shaped upper lid 1a, a substantially sun-shaped lower case 1b, and a thermosetting resin 4, and the upper lid 1a via the thermosetting resin 4 filled in the lower case 1b. Are bonded and integrated. The upper lid 1a is a disk-shaped resin flat plate, and is prepared by providing a fixture mounting portion 5a and a fixture mounting portion 5b having a substantially semicircular opening in the vicinity of the center of the flat plate. The lower case 1b is a resin box having a circular outer shape, and is fixed in a space in which the IC chip 3 and the antenna 2 are accommodated and in the vicinity of the center in the bottom of the box with a substantially semicircular opening. A tool mounting portion 5c and a fixture mounting portion 5d are provided and manufactured. The IC chip 3 and the antenna 2 are embedded in the filled thermosetting resin 4 and housed inside the casing.

  As shown in FIG. 1, the IC tag 101 has an antenna 2 electrically joined to the IC chip 3 disposed in the lower case 1b, and is then filled with a thermosetting resin 4, and a fixture attachment portion 5a and fixture attachment. The upper cover 1a is placed on the lower case 1b and heated to cure the thermosetting resin 4 so that the lower case 1b and the upper cover 1a are disposed. Is fixed and produced.

  FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1 and shows a state of the lower case 1b after filling the thermosetting resin 4 before the upper lid 1a is overlaid. As shown in FIG. 2, the lower case 1b is provided with concave sections that house the IC chip 3 and the antenna 2, respectively, and these parts are separated by a fixture mounting portion 5c and a fixture mounting portion 5d. Yes.

  The IC chip 3 only needs to have a non-contact communication function, and may use any frequency. For example, an IC chip having a non-contact communication function using frequencies of 13.56 MHz and 900 to 10 GHz can be used, and it is preferable to select as appropriate.

  The antenna 2 is preferably selected as appropriate in accordance with the non-contact communication function of the IC chip 3. For example, an antenna manufactured by winding, an antenna obtained by etching a metal foil on a substrate, an antenna obtained by punching a metal foil, or the like can be used, and it is preferable to select as appropriate.

  The lower case 1b and the upper lid 1a are produced by injection molding a resin. As the resin to be used, a general resin for injection molding can be used, and it is preferable to appropriately select the resin. For example, PBT (polybutylene terephthalate), PA (polyamide), PC (polycarbonate), POM (polyacetal), ABS (acryl butadiene styrene), and the like.

  As the thermosetting resin 4, a general thermosetting resin can be used, and it is preferable to select as appropriate. For example, there are epoxy resin, unsaturated polyester resin, phenol resin and the like.

(Second Embodiment)
FIG. 3 is a diagram for explaining a second embodiment in which the first embodiment of the IC tag of the present invention is mounted on an article, and describes a method for using the IC tag according to the present invention for the article. It is.

  As shown in FIG. 3, the IC tag 101 is used by wrapping a rubber band-like fixing tool 6 around the article 103 and routing it around the fixing tool mounting part 5e and the fixing tool mounting part 5f. The fixture 6 is tied in the vicinity of the fixture attachment portion 5f and attached to the article 103. Although not shown, the knot of the fixing tool 6 is released and the IC tag 101 is removed from the article 103.

  In addition, as demonstrated in FIG. 1, the fixture attachment part 5e and the fixture attachment part 5f correspond to the fixture attachment part 5a and the fixture attachment part 5c, respectively, and the fixture attachment part 5b and the fixture attachment part 5d. It is the fixture attachment part produced by arranging so that the upper cover 1a was piled up on the lower case 1b, and it joined via the thermosetting resin 4. FIG. The fixture attachment portion 5e is obtained by joining the fixture attachment portion 5a and the fixture attachment portion 5c, and the fixture attachment portion 5f is obtained by joining the fixture attachment portion 5b and the fixture attachment portion 5d.

  In the present embodiment, the fixing device 6 is described using a rubber band, but the fixing device 6 can be appropriately selected according to the shape and surface state of the article to be attached, and the shape may be a string. . The length may be a length that allows the article to be mounted to be wound once and then drawn through the fixture attachment portion to form a knot in the vicinity of the fixture attachment portion. Further, the article may be wound several times and should be set longer. Any material may be used as long as it does not affect the non-contact communication of the IC tag. For example, cloth, plastic, or the like can be used.

  The article 103 to which the IC tag is to be attached in the present embodiment has a curved portion on the outer shape of the article, the surface of the article is smooth, and the binding band portion of the conventional IC tag with a fixture has an article. It was an article that was difficult to tie and wear. For example, a glass bottle or a PP (polypropylene) resin container.

(Third embodiment)
FIG. 4 is a diagram for explaining a third embodiment of the IC tag according to the present invention, and describes another form of the IC tag according to the present invention and a method for manufacturing the IC tag.

  The IC tag 104 according to the third embodiment is configured by embedding an IC chip 13 having a non-contact communication function and an antenna 12 electrically joined to the IC chip 13 in a casing. The casing is configured by a substantially sun-shaped upper lid 11a, a substantially sun-shaped lower case 11b, and a thermosetting resin 14, and the upper lid 11a is interposed via the thermosetting resin 14 filled in the lower case 11b. Are bonded and integrated. The upper lid 11a is a substantially disk-shaped resin flat plate, and is provided with a fixture mounting portion 5g and a fixture mounting portion 5h having a substantially semicircular opening in the vicinity of the central portion of the flat plate. The slit 15c is provided from 5g toward the outer periphery, and the slit 15d is provided from the fixture attaching portion 5h toward the outer periphery. The lower case 11b is a resin box having a substantially circular outer shape, and the shape of the opening is approximately semicircular in the space in which the IC chip 13 and the antenna 12 are accommodated and in the vicinity of the center in the bottom of the box. The fixture attachment portion 5i and the fixture attachment portion 5j are provided, the slit 15a is provided from the fixture attachment portion 5i toward the outer periphery, and the slit 15b is provided from the fixture attachment portion 5j toward the outer periphery. The IC chip 13 and the antenna 12 are embedded in the filled thermosetting resin 14 and housed inside the casing.

  As shown in FIG. 4, the IC tag 104 has the antenna 12 electrically joined to the IC chip 13 disposed in the lower case 11b, and is then filled with a thermosetting resin 14, and the fixture attaching portion 5g and the fixture attached. Portion 5i, fixture attachment portion 5h and fixture attachment portion 5j, slit 15b and slit 15d, slit 15a and slit 15c are arranged to coincide with each other, upper lid 11a is overlaid on lower case 11b, heated, and thermoset The resin 14 is cured, and the lower case 11b and the upper lid 11a are fixedly manufactured.

  Each of the IC chip 13, the antenna 12, the lower case 11b, the upper lid 11a, and the thermosetting resin 14 constituting the IC tag 104 according to the present embodiment is the IC according to the first embodiment shown in FIG. The IC chip 3, the antenna 2, the lower case 1b, the upper lid 1a, and the thermosetting resin 4 constituting the tag 101 can be used.

(Fourth embodiment)
FIG. 5 is a diagram for explaining a fourth embodiment in which the third embodiment of the IC tag of the present invention is mounted on an article, and a method of using another form of IC tag according to the present invention for an article. Is described.

  The IC tag 104 is used as follows. First, as shown in FIG. 5, a clothing tag 16 made of a rectangular cloth and having both ends sewn on the article 105 is passed through the slit 15e and the slit 15f, and the fixture mounting portion 5k and the fixture mounting portion. The IC tag 104 is attached to the article 105. Although not shown, the clothing tag 16 is passed through the slit 15e and the slit 15f, moved from the fixture attachment portion 5k and the fixture attachment portion 5l to the outside of the IC tag 104, and the IC tag 104 is removed from the article 105.

  Furthermore, the fixture attachment portion 5k and the fixture attachment portion 5l of the IC tag 104 are the same as the fixture attachment portion 5e and the fixture attachment portion 5c of the IC tag 101 according to the first embodiment shown in FIG. In addition, a belt-like fixing tool 6 made of rubber can be used, and the IC tag 104 can be attached to the article 103 and further can be removed.

  Note that the fixture attachment portion 5k, the fixture attachment portion 5l, the slit 15e, and the slit 15f are the fixture attachment portion 5g, the fixture attachment portion 5i, the fixture attachment portion 5h, and the fixture as described in FIG. The mounting portion 5j, the slit 15a and the slit 15c, the slit 15b and the slit 15d are arranged so as to coincide with each other, and the upper lid 11a is overlaid on the lower case 11b and joined through the thermosetting resin 14. It is. The fixture attachment portion 5k is a joint of the fixture attachment portion 5g and the fixture attachment portion 5i, and the fixture attachment portion 5l is a joint of the fixture attachment portion 5h and the fixture attachment portion 5j. The slit 15e is obtained by joining the slit 15a and the slit 15c, and the slit 15f is obtained by joining the slit 15b and the slit 15d.

  The article 105 that is the target of IC tag mounting in this embodiment needs to take into account the appearance of the article when the IC tag is mounted. An IC tag is an article that is difficult to ensure in appearance. For example, clothes displayed in the sales space.

  As mentioned above, although embodiment of this invention was described using drawing, this invention is not limited to these embodiment, Even if there is a change of a member and a structure in the range which does not deviate from the meaning of this invention. It is included in the present invention. For example, in the above-described embodiment, the shape of the upper lid and the lower case is a disc shape or a substantially disc shape, but it is not always necessary to have such a structure, and other shapes such as a triangle, a quadrangle, etc. Similarly, it forms an embodiment of the present invention. Further, in the above embodiment, the shape of the opening of the fixture mounting portion is substantially semicircular, but it is not necessarily such a structure, and other shapes such as a circle, a triangle, a quadrangle, etc. Similarly, it forms an embodiment of the present invention. In the above-described embodiment, the number of fixing member mounting portions is described as two. However, it is not always necessary to have such a structure. Forms. That is, it goes without saying that the present invention also includes various modifications and corrections that would be obvious to those skilled in the art.

1a, 11a Upper lid 1b, 11b Lower case 2, 12 Antenna 3, 13 IC chip 4, 14 Thermosetting resin 5a, 5b, 5c, 5d, 5e, 5f, 5g, 5h, 5i, 5j, 5k, 5k, 5l Mounting part 6 Fixing tool 15a, 15b, 15c, 15d, 15e, 15f Slit 16 Clothing tag 101, 104 IC tag 103, 105 Article 102a, 102b Electrode terminal

Claims (5)

  An IC tag configured by embedding an IC chip and an antenna that perform non-contact communication in a casing, and the casing is provided with two or more fixture attachment portions penetrating in the thickness direction. IC tag characterized by   The IC tag according to claim 1, wherein the fixture mounting portion includes a slit reaching an outer surface.   The housing includes a lower case made of resin that houses the IC chip and the antenna, an upper lid made of resin that seals the lower case, and fills the lower case to embed the IC chip and the antenna. The IC tag according to claim 1, further comprising a thermosetting resin.   Electrically connecting the IC chip and the antenna; injecting resin into a mold to mold the lower case and the upper lid; and housing the IC chip and the antenna in the lower case, Filling the thermosetting resin, and superimposing the upper lid on the lower case to cure the thermosetting resin so as to form the fixture attachment portion, and joining the upper lid to the lower case The method for manufacturing an IC tag according to any one of claims 1 to 3, wherein:   The cord-like or belt-like fixture is wound around an article, passed through the fixture attachment portion, and then the fixture is tied and attached in the vicinity of the fixture attachment portion. The use method of the IC tag in any one.

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