JP2011054587A - Carrying device of substrate tape - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a carrying device for carrying a substrate tape capable of stably applying a back tension to the substrate tape for a long period of time. <P>SOLUTION: In each of a main conveyance section moving clamper 31 for carrying the substrate tape 3 and a back tension moving clamper 15 for applying the back tension to the substrate tape 3, a surface abutting on the substrate tape 3 in upper nails 25, 30 and lower nails 22b, 36b for clamping the substrate tape 3 is formed nearly on a flat surface, and the longitudinal direction and thickness direction of the upper nails 25, 30 and the lower nails 22b, 36b disposed on the substrate tape are disposed at the side in a conveyance direction P and at the side in a width direction, respectively. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a substrate tape transport device.

In general, an electronic component such as a semiconductor device is mounted (attached) on a substrate tape such as a flexible insulating tape, a sealing resin such as a synthetic resin is applied around the electronic component, and then heat-cured and resin-sealed. Things are widely done.
These series of operations use a continuous substrate tape, and each process of mounting electronic components, applying sealing resin to the periphery of electronic components, and heating and curing the sealing resin is performed continuously in each device. Is called.
When transporting the substrate tape, back tension is applied so that the substrate tape does not sag in the transport direction. If the slack occurs during transport, the substrate tape is not transported to the desired transport position, and each electronic component is not mounted at the desired position, or sealing resin is not applied to the desired position, and the electronic component is properly sealed. I can't do that.

In Patent Document 1, as shown in FIG. 5, the tape 10 is fed in the pitch feed direction (conveyance direction) by the pitch feed drive device (P feed device), and the back tension drive device (BT device) is sent. An apparatus for applying tension to the tape 10 is disclosed.
Specifically, as shown in FIG. 5 (c), the tape 10 is fed in the pitch feed direction when the P feed gear 8b of the P feed device rotates in the tape feed direction, and the BT gear 8a of the BT device feeds the tape. A desired tension is applied by rotating in a direction opposite to the direction.
In this case, in the BT device, as shown in FIG. 2, the sprocket teeth 9 of the sprocket gear 8 mesh with the sprocket holes 11 formed in the tape 10 to apply the tension to the tape 10.

In Patent Document 2, as illustrated in FIG. 6, a tension roller 102 for applying tension to the tape 100 is arranged with respect to a feed roller 101 that feeds the tape 100 forward.
In this case, the feed roller 101 and the tension roller 102 are rubber rollers, and the tape contact surface is a rubber material.
Alternatively, as shown in FIG. 2, the second feed roller 42 existing before the first feed roller 21 starts to rotate before the first feed roller 21 starts to rotate, and there is no slack in the tape 12. I am trying to run on. The first feed roller 21 and the second feed roller 42 are rubber rollers, and the tape contact surface is a rubber material.

Japanese Patent Laying-Open No. 2006-213432 ([0013], [0026] to [0027], FIG. 2, FIG. 5, etc.) JP 2004-165615A ([0005], [0009], [0068], FIG. 6, FIG. 2, etc.)

  In Patent Document 1, since the sprocket teeth 9 of the sprocket gear 8 of the back tension drive device (BT device) mesh with the sprocket holes 11 formed in the tape 10 and apply the tension to the tape 10, the sprocket teeth 9 has a risk of breaking the sprocket hole 11 of the tape 10. In particular, when the tape 10 is formed of a synthetic resin thin plate, the risk increases. Moreover, when the tape 10 is transported at a high speed, the reaction force of the sprocket teeth 9 applied to the sprocket holes 11 becomes strong, and the sprocket holes 11 are more easily broken. In addition, when the tape 10 is intermittently fed, when the tape 10 starts to be fed from the stopped state, the reaction force of the sprocket teeth 9 applied to the sprocket holes 11 becomes strong, and the sprocket holes 11 are more easily broken.

  Patent Document 2 discloses a feed roller 101 and a tension roller 102 in the case of FIG. 6 and a first feed roller 21 and a second feed roller in the case of FIG. 2 in order to prevent the rubber roller from coming into contact with the tape. Since both 42 are composed of rubber rollers, the contact surface of each roller with the tape tends to wear. In particular, in order to prevent the tape from sagging, the pressing force with which each roller presses the tape is considerably high. Therefore, compared to the roller not intended to prevent the sagging, the roller is likely to be worn, and once the wear occurs. And wear increases. This is because the tape is sandwiched between the rollers, and the contact portion with the tape is in line contact with each roller. Accordingly, it is impossible to prevent the tape from sagging, or a strong pressing force is applied to the tape, and the wear of each roller is further promoted, resulting in mischievous deformation of the tape. Furthermore, there is a risk that the roller is likely to be unevenly worn, the tape transport speed becomes unstable, and the sealing resin cannot be applied to a desired position of the electronic component.

An object of the present invention is to solve the above-mentioned problems, and to provide a substrate tape transport device capable of stably applying a back tension to a substrate tape for a long period of time when transporting the substrate tape. To do.

The substrate tape transport device according to Embodiment 1 of the present invention is a substrate tape transport device that constitutes a substrate that is at least part of an electronic component, and a transport unit for transporting the substrate tape in a predetermined transport direction; A back tension applying unit that applies a back tension in a direction opposite to the transport direction to the substrate tape, and the transport unit transports a substrate tape clamped in the transport direction in the transport direction; A transfer unit holding clamper that holds the substrate tape when the substrate tape is not transferred and does not hold when the substrate tape is transferred; and the back tension applying unit holds the substrate tape during the transfer and is moved in the transfer direction. The back tension moving clamper and the back tension moving clamper are moved in the transport direction by the transport unit moving clamper. And a back tension applying means for applying a back tension that prevents movement in the transport direction to the back tension moving clamper, and the transport unit moving clamper and the back tension moving clamper are connected to the surface of the substrate tape. A front surface contact portion that contacts the back surface of the substrate tape, and a rear surface contact portion that cooperates with the front surface contact portion to sandwich the substrate tape. The front surface contact portion and the back surface contact portion are substantially flat. It is characterized by being formed.

According to the configuration of the first embodiment of the present invention, when the substrate tape is transported and when the back tension is applied, the substrate tape can be reliably transported without being damaged. Moreover, the initial good state can be maintained over a long period of time.
That is, when the transport unit moving clamper transports (moves) the substrate tape in the transport direction, the back tension applying unit applies the back tension to the substrate tape. In this state, the transport unit moving clamper transports the substrate tape with a powerful transport force that overcomes the back tension while holding the substrate tape between the front surface contact portion and the back surface contact portion. Therefore, the transport unit moving clamper is pulled in the transport direction while firmly holding the substrate tape. Therefore, a strong pressing force and a tension in the transport direction act on the pinched substrate tape portion. However, since the front surface contact portion and the back surface contact portion of the transport unit moving clamper are formed in a substantially flat surface, the front surface contact portion and the back surface contact portion sandwich the substrate tape in a relatively wide area. Therefore, local pressing force and tension are not applied to the substrate tape. That is, the pressing force and the tension are applied to the substrate tape over a relatively wide area of the front surface contact portion and the back surface contact portion without any trouble. Therefore, the substrate tape can be reliably transported without being damaged, and a good state can be maintained for a long time.

On the other hand, when the back tension moving clamper is moved in the transport direction by the transport unit moving clamper, the back tension applying unit applies back tension to the substrate tape against the transport force of the transport unit moving clamper. is doing. The back tension moving clamper is transported and moved in the transport direction by the transport unit moving clamper with a back tension applied. Accordingly, the back tension moving clamper is given the back tension and the tension pulled in the transport direction by the transport unit moving clamper. Therefore, a strength that can withstand the back tension and the tension in the transport direction is required at the portion of the back tension moving clamper where the substrate tape is sandwiched. However, since the front surface contact portion and the back surface contact portion of the back tension moving clamper are formed in a substantially flat surface, the front surface contact portion and the back surface contact portion sandwich the substrate tape in a relatively wide area. Therefore, local pressing force and tension are not applied to the substrate tape. That is, the pressing force and the tension are applied to the substrate tape over a relatively wide area of the front surface contact portion and the back surface contact portion without any trouble. Therefore, it is possible to reliably carry out the predetermined conveyance without damaging the substrate tape, and to maintain a good state for a long time.

In the substrate tape transport apparatus according to Embodiment 2 of the present invention, at least one of the front surface contact portion and the back surface contact portion in the transport portion moving clamper and the back tension moving clamper is a claw portion, and the flat surface of the claw portion is provided. Is characterized in that the dimension on the conveyance direction side is long and the dimension on the width direction side orthogonal to the conveyance direction is shorter than the dimension on the conveyance direction side.

According to the configuration of the embodiment 2 of the present invention, the following operational effects are obtained.
First, since the shape of the flat surface of the claw portion is formed such that the dimension in the transport direction is longer than the dimension in the width direction, the tension that pulls in the transport direction by the transport section moving clamper is surely applied to the substrate tape. Similarly, the tension that is relatively pulled in the reverse conveying direction by the back tension moving clamper can be reliably applied to the substrate tape. In addition, since the claw portion is formed long in the transport direction, it is possible to prevent the substrate tape from being distorted or slack since the substrate tape is held over a long distance.
On the other hand, since the dimension of the flat surface of the claw portion is shorter in the width direction perpendicular to the transport direction than the dimension in the transport direction, the area on the center side of the substrate tape can be used effectively. For example, when the electronic component is mounted on the center side of the substrate tape, the area in the center side of the substrate tape can be secured widely because the dimension in the width direction of the claw portion is short, and the electronic side is located on the center side. Parts can be arranged efficiently.
In addition, the above-mentioned effect can be obtained by configuring at least one of the front surface contact portion and the back surface contact portion of the transport unit moving clamper and the back tension moving clamper with a claw unit.
In addition, it is preferable that the claw portions are disposed on both sides of the substrate tape in the width direction because distortion and sagging in the width direction of the substrate tape are further prevented.

A substrate tape transport device according to Embodiment 3 of the present invention is the substrate tape transport device according to Embodiment 2, wherein the front surface contact portion and the back surface contact portion of the transport portion moving clamper and the back tension moving clamper are The claw portion.

According to the configuration of the embodiment 3 of the present invention, the front surface contact portion and the back surface contact portion are the claw portions, and the shape of the flat surface of the claw portion is long in the transport direction and orthogonal to the transport direction. Since the dimension in the width direction is shorter than the dimension in the transport direction, the function and effect described in Embodiment 2 of the present invention can be further exhibited.
That is, on the front surface and the back surface of the substrate tape, the shape of the flat surface of the claw portion is formed longer than the dimension in the width direction in the transport direction, and the flat surface positions of the claw portions on the front surface side and the back surface side are approximately one. When doing so, the claw portions on the front surface side and the back surface side can securely hold the substrate tape, the tension pulling in the transport direction by the transport unit moving clamper can be reliably applied to the substrate tape, Similarly, a tension that is relatively pulled in the reverse conveying direction by the back tension moving clamper can be reliably applied to the substrate tape. In addition, since the claw portion is formed long in the transport direction, the substrate tape is sandwiched over a long distance, so that it is possible to prevent the substrate tape from being distorted or slack.
Moreover, since the dimension of the width direction orthogonal to a conveyance direction is shorter than the dimension of the said conveyance direction in the surface side and back surface side in a substrate tape, the area of the center side of a substrate tape can be used effectively.

As described above, since the front and back surfaces of the substrate tape are clamped by the claws, the pressing force (clamping force) per unit area is increased, and the tension that is pulled in the transport direction by the transport unit moving clamper is increased accordingly. The substrate tape can be reliably applied, and similarly, the tension pulled in the reverse conveying direction by the back tension moving clamper can be reliably applied to the substrate tape.
In addition, it is more preferable that the nail | claw part is arrange | positioned at the both sides of the width direction of a board | substrate tape, and the distortion and sagging of the width direction of a board | substrate tape are prevented. However, the nail | claw part may be arrange | positioned only at one side of the width direction of a board | substrate tape.

A substrate tape transport device according to Embodiment 4 of the present invention is the substrate tape transport device according to any one of Embodiments 1 to 3, wherein the back tension applying portion is attached to the back tension moving clamper. A back tension holding clamper that is disposed adjacent to and holds the substrate tape when the substrate tape is not transferred and does not hold the substrate tape when the substrate tape is transferred; the transfer unit holding clamper and the back tension holding clamper have the surface contact portion It is comprised by the said nail | claw part, The said back surface contact part is comprised by the rail shape which mounts the said board | substrate tape, It is characterized by the above-mentioned.

According to the configuration of the embodiment 4 of the present invention, the following operational effects are obtained.
The transport unit holding clamper and the back tension holding clamper are configured to sandwich the substrate tape when the substrate tape is not transported and do not sandwich the substrate tape when the substrate tape is transported. That is, the transport unit holding clamper and the back tension holding clamper are for holding the substrate tape at a predetermined position when the substrate tape is not transported, and the tension or back tension in the transport direction as in the transport is performed. It is not applied to the substrate tape. Therefore, the substrate tape may be held in a predetermined state. For this reason, the said surface contact part can be comprised by the said nail | claw part, and the said back surface contact part can be comprised in the rail shape which mounts the said substrate tape, ie, the rail shape whose area which receives a substrate tape is wider than the said nail | claw part. . The substrate tape is reliably guided and supported by a wide rail-shaped receiving portion and is securely held by the claw portion. For this reason, tampering damage and distortion are not caused to the substrate tape.

A substrate tape transport device according to Embodiment 5 of the present invention is the substrate tape transport device according to any one of Embodiments 1 to 2, wherein the transport unit transports the transport unit moving clamper. A moving clamper driving means for moving in the direction or the reverse conveying direction is provided.

According to the above configuration, the transfer unit moving clamper can transfer the substrate tape in the transfer direction by driving the moving clamper driving means while sandwiching the substrate tape.
The moving clamper driving means includes, for example, a ball screw that meshes with the transfer unit moving clamper and a servo motor that rotationally drives the ball screw.

The substrate tape transport device according to Embodiment 6 of the present invention is the substrate tape transport device according to any one of Embodiments 1 to 5, wherein the back tension applying means is configured such that the transport unit moving clamper is a substrate. The back tension moving clamper that is moved in the transport direction while the front surface contact portion and the back surface contact portion are sandwiching the substrate tape when the tape is sandwiched and transported in the transport direction. A timing belt that is driven by meshing with the timing belt, and when the timing belt is driven, the back tension that is smaller than the transport force against the transport force in the transport direction by the transport unit moving clamper is applied to the timing belt. And a back tension generating section to be applied.

According to the above configuration, since the back tension moving clamper meshes with the timing belt, the interlocking of both is performed reliably and the structure is simple.
Further, when the timing belt is driven, the back tension generating unit can apply a back tension to the substrate tape via the timing belt and the transport unit moving clamper. At this time, the optimal back tension can be applied if the back tension of the back tension generating portion can be set appropriately.
The back tension generating portion applies a back tension to the timing belt when the timing belt is driven, and is, for example, connected to the drive shaft of the timing belt and adjacent to the drive shaft in the axial direction. . The back tension generating part induces a reaction force (back tension) when driven by, for example, a magnetic force action between a magnet and a magnetic part that repels or attracts.
The back tension generating unit may use any principle as long as it can apply a back tension to the timing belt when the timing belt is driven.

A substrate tape transport device according to Embodiment 7 of the present invention is the substrate tape transport device according to Embodiment 6, and includes a control unit that controls operations of the transport unit and the back tension applying unit, and the control unit In the stage before the start of the transport of the substrate tape, the transport unit holding clamper of the transport unit is closed to sandwich the mounting tape, the back tension moving clamper is opened, and the back tension moving clamper is moved to a predetermined direction in the transport direction side. The timing belt driving means is driven so as to drive the timing belt until it moves to the position, and then the back tension moving clamper is closed and the mounting tape is clamped before the conveying unit holding clamper is opened, and the conveying unit is held. After opening the clamper, the timing belt driving means is driven to A dynamic clamper is driven to a predetermined position opposite to the conveying direction to apply a back tension to the substrate tape via the back tension moving clamper, and when the substrate tape is conveyed, the conveying unit moving clamper and the back After closing the tension moving clamper, the conveying unit holding clamper is not opened and the mounting tape is not clamped. After that, the conveying unit moving clamper and the back tension moving clamper are closed to clamp the mounting tape, and the moving clamper driving means And the transfer unit moving clamper is moved in the transfer direction to apply a back tension to the substrate tape via the back tension moving clamper.

According to the above configuration, the control unit can first arrange the substrate tape at a predetermined work start position before the start of the conveyance of the substrate tape, and perform a series of conveyance from the predetermined start position on the substrate tape. In addition, since the application state of the back tension can be maintained, the start position of the substrate tape can be accurately ensured. Therefore, for example, the sealing resin can be reliably discharged to a predetermined position of the electronic component mounted on the substrate tape.
On the other hand, when the substrate tape is conveyed, the substrate tape is conveyed while applying a back tension, so that the substrate tape and the mounted electronic component can be reliably conveyed to a predetermined position without the substrate tape slackening. .

  The substrate tape transport device according to Embodiment 8 of the present invention is the substrate tape transport device according to any one of Embodiments 1 to 7, in which the sealing resin to the electronic component mounted on the substrate tape is used. A processing apparatus for performing application and heat-curing of the sealing resin, in order toward the transport direction, a sealing resin application unit that applies the sealing resin to the electronic component, and heat-curing the sealing resin The back tension applying unit is disposed on the reverse conveyance direction side with respect to the sealing resin application unit, and the conveyance unit includes the sealing resin application unit, the heat curing unit, and the like. It is arrange | positioned in the intermediate position of this, and the other side of the said conveyance direction with respect to the said thermosetting part, It is characterized by the above-mentioned.

According to the above configuration, the back tension applying unit is disposed on the near side in the transport direction with respect to the sealing resin application unit, and the transport unit includes the sealing resin application unit and the heat curing unit. And an electronic component mounted on the substrate tape in a state where a back tension is applied to the substrate tape. The sealing resin is applied.
In addition, since the transport unit is disposed at an intermediate position between the sealing resin application unit and the heat curing unit and on the front side in the transport direction with respect to the heat curing unit, it is reliable even though it is a long substrate tape. Can be transported. In addition, the substrate tape is not loosened in the heat-curing portion by the back tension applying portion, and therefore the heating is performed at a stable position and angle with respect to the sealing resin coating portion. It can be cured with good heat.

1 is an overall layout diagram of a processing apparatus for applying a sealing resin to an electronic component mounted on a substrate tape and heat-curing the sealing resin in the first embodiment of the present invention. It is principal part sectional drawing in the AA position of FIG. 1, Comprising: It is principal part sectional drawing of the movement clamper of a back tension provision part. It is principal part sectional drawing in the BB position of FIG. 1, Comprising: It is principal part sectional drawing of the holding | maintenance clamper of a back tension provision part. The principal part top view of the mounting tape in 1st Embodiment of this invention. The principal part sectional drawing of the main conveyance part movement clamper in 1st Embodiment of this invention. The control system block diagram in 1st Embodiment of this invention. FIG. 3 is a state diagram of each step in a stage before the start of conveyance of the substrate tape in the first embodiment of the present invention. FIG. 3 is a state diagram of each step during conveyance of the substrate tape according to the first embodiment of the present invention. The back tension movement clamper in the modification of this invention is shown, (1) is sectional drawing of a principal part, (2) is a right view of (1).

  Hereinafter, the present invention will be described based on specific embodiments.

[First Embodiment]
1st Embodiment of this invention applies the board | substrate tape conveying apparatus to the processing apparatus 1 which performs application | coating of sealing resin to the electronic component mounted in the board | substrate tape, and heat-hardening of sealing resin.

〔overall structure〕
FIG. 1 is an overall layout diagram of a processing apparatus 1 for applying a sealing resin to an electronic component mounted on the substrate tape and heat-curing the sealing resin.
FIG. 1 shows the overall arrangement relationship.
The processing apparatus 1 includes a sealing resin coating device 4 that applies a sealing resin to the semiconductor device 2 using a substrate tape 3 on which a semiconductor device (IC, LSI, etc.) 2 as an electronic component is mounted, and this coating. A heat curing device 5 for heat curing the sealing resin.

The substrate tape 3 is a flexible insulating tape made of a synthetic resin such as a polyimide resin and made of a thin plate having a width of 35 mm or 48 mm, and the semiconductor device 2 is bonded to a predetermined position on the surface of the flexible insulating tape.
A conductive pattern (not shown), which is a wiring portion made of copper, aluminum, or the like, is formed on the upper surface of the substrate tape 3, and each electrode of the semiconductor device 2 is electrically connected to the inner end of each conductive pattern. The semiconductor device 2 is thus mounted on the substrate tape 3.
A sealing resin, which will be described later, is applied to the outer periphery and the upper surface that are the periphery of the semiconductor device 2 and cured to form a sealing resin portion.

On the left side of FIG. 1, the sealing resin coating device 4 described above is arranged. From the left end of the sealing resin coating device 4, the substrate tape 3 having the semiconductor device 2 mounted on the upper surface is inserted into the sealing resin coating device 4 and conveyed to the right side of FIG.
In this case, the substrate tape 3 before being inserted into the sealing resin coating device 4 is already wound on a reel (not shown) with the semiconductor device 2 mounted on the upper surface, or the upper surface of the substrate tape 3 The semiconductor device 2 is transported from a previous process.
In the center of the sealing resin coating device 4 in FIG. 1 is a sealing resin coating portion 6 for coating the semiconductor device 2 with a sealing resin, and on the left side (the opposite side to the transport direction P) is the transport direction P. A back tension applying unit 7 that applies a back tension, which is a tension in the reverse conveying direction Q, which is the reverse direction, to the substrate tape 3, and the substrate tape 3 is conveyed to the right side (conveying direction P side) of the sealing resin application unit 6. The main conveyance part 8 which is a conveyance part conveyed in the direction P side is provided.

As described above, the heat curing device 5 heats the substrate tape 3 conveyed from the sealing resin coating device 4 and cures the applied sealing resin.
The heat curing device 5 includes a first turn roller 9 disposed on the right side of FIG. 1 so as to guide the substrate tape 3 that has been conveyed and reverse the conveyance direction by 180 degrees, and above and to the left of the first turn roller 9. The second turn roller 10 arranged to guide the substrate tape 3 to change the conveying direction upward by about 90 degrees, and the second turn roller 10 arranged close to the upper side of the second turn roller 10 to guide the substrate tape 3 and to convey the direction about 90 degrees That is, a third turn roller 11 that changes to the right in FIG. 1, and a heater (not shown) that is disposed in the vicinity of each of the turn rollers 9, 10, 11 and heats the substrate tape 3, particularly the applied sealing resin. And preferably, the heating unit 12 having an exhaust device for exhausting the generated gas, and the substrate tape 3 disposed on the right side of the third turn roller 11 and having the sealing resin heat-cured are transported in the transport direction P. And a furnace outlet conveyor section 13 for.

The third turn roller 11 is configured to be movable like a two-dotted line under the acting force in the reverse conveyance direction R, and is attached to the substrate tape 3 from the main conveyance unit holding clamper 34 to the furnace outlet conveyance unit holding clamper 38. Tension can be applied to remove slack. In order for the third turn roller 11 to receive the acting force in the reverse conveying direction R, a swing lever 60 is provided, one end of which can swing around the rotation axis of the second turn roller 10, and the third turn roller 11 is rotatably supported at the other end of the swing lever 60. A string 61 tied to the other end of the swing lever 60 is tied to a weight 63 via a small roller 62. Accordingly, the weight 63 receives the gravity and tends to descend downward (vertical direction) in FIG. 1, so that the swing lever 60 tries to swing in the reverse transport direction R via the string 61, so The 3-turn roller 11 also tries to swing in the reverse transport direction R. Accordingly, the third turn roller 11 receives an acting force in the reverse conveyance direction R and can move like a two-dotted line, and the third turn roller 11 moves from the third turn roller 11 to the furnace outlet conveyance unit 13 (furnace outlet conveyance unit) on the conveyance direction P side. The substrate tape 3 up to the holding clamper 38, etc.) and the substrate tape 3 from the third turn roller 11 to the main conveyance section 8 (main conveyance section holding clamper 34, etc.) in the reverse conveyance direction Q side are tensioned to remove slack. be able to.
The heating unit 12 is configured by arranging the above-described heater from the vicinity of the entrance where the substrate tape 3 is conveyed to the heat curing device 5 to the right side of the turn roller 11.
The substrate tape 3 carried out from the furnace outlet transport unit 13 is wound around a reel (not shown) or transported to the next process.

Details will be described below.
[Sealing resin application part]
The sealing resin application part 6 is generally configured as follows.
The sealing resin application unit 6 is disposed between the back tension applying unit 7 and the main transport unit 8 and is used for discharging the sealing resin to the periphery and the upper surface of each semiconductor device 2 on the substrate tape 3. A plurality of needles 14 are provided. The plurality of needles 14 are arranged at equal intervals on the conveyance direction P side.
The needle 14 includes a bonded wire including a conductive bonding portion between the electrode of the semiconductor device 2 and the conductive pattern disposed on the substrate tape 3 around each semiconductor device 2 mounted on the substrate tape 3, and further necessary Accordingly, an appropriate amount of liquid epoxy resin or the like as a sealing resin is discharged to the outer peripheral portion, the upper surface, the lower surface, or the like of the semiconductor device 2. The needle 14 discharges an appropriate amount of the sealing resin to each semiconductor device 2 of the substrate tape 3 that has been conveyed at a predetermined timing. During the time (about 10 seconds) during which the plurality of needles 14 are discharging the sealing resin, the conveyance of the substrate tape 3 is stopped. The sealing resin may be a synthetic resin other than an epoxy resin. Further, the sealing resin includes those other than the synthetic resin as long as the semiconductor device 2 can be sealed.

[Back tension application part]
The back tension applying unit 7 provided in the sealing resin coating device 4 will be described in detail.
The back tension applying unit 7 includes a back tension moving clamper 15 that sandwiches the substrate tape 3 and moves it in the carrying direction P during the carrying, and the back tension moving clamper 15 moves in the carrying direction P by the main carrying unit 8 described above. Torque control device 16 as a back tension applying means for applying back tension in a direction that prevents movement in the transport direction P side to the back tension moving clamper 15 (for example, “Perma Torque”, a trade name of Koshin Seiko Co., Ltd.). )), The timing belt 17 and the stepping motor 18 as the back tension movement clamper driving means for moving the back tension movement clamper 15 in the conveyance direction P side or the reverse conveyance direction Q side, and the first engagement with the timing belt 17. On the gear 19 and its conveying direction P side A second gear 20 which is tangent arranged, has a back tension holding the clamper 21 which is held so as not to clamp moving the substrate tape 3 when not transporting the substrate tape 3.

Here, the back tension moving clamper 15 and the back tension holding clamper 21 are configured to hold or release (not hold) the substrate tape 3. Among them, the back tension moving clamper 15 can move together with the substrate tape 3 in the transport direction P side or the reverse transport direction Q side when holding the substrate tape 3, and the back tension holding clamper 21 can be moved in both directions. First, the substrate tape 3 is held or released at a predetermined fixed position. Details thereof will be described later.
The timing belt 17 is a belt formed in a closed loop shape. When the back tension moving clamper 15 moves to the transport direction P side or the reverse transport direction Q side, the meshing portion with the back tension moving clamper 15 is not. Move together. The timing belt 17 is held by a first gear 19 and a second gear 20.
A torque control device 16 and a stepping motor 18 are connected to the rotation shaft of the first gear 19.

  When a rotational force is applied to the rotational shaft from the outside, the torque control device 16 has a predetermined resistance against the rotational force, for example, by a magnetic action between a magnet disposed on the rotational shaft and a magnetic component disposed on the periphery thereof. Induces rotational braking force. Accordingly, when the substrate tape 3 is transported in the transport direction Q side by the main transport unit 8 with the back tension moving clamper 15 clamped (clamped) the substrate tape 3, the transport force is the back tension moving clamper 15 To the timing belt 17, the first gear 19, its rotating shaft, and the torque control device 16. Then, the torque control device 16 applies a predetermined rotational resistance, that is, a brake torque to the rotating shaft by the magnetic action described above. Therefore, by this brake torque, the main transport unit 8 transports the substrate tape 3 toward the transport direction Q, so that a back tension in the reverse transport direction Q is applied to the substrate tape 3.

Here, the structure and operation of the back tension moving clamper 15 other than those described above will be described.
FIG. 2 is a side view of the main part of the back tension moving clamper 15 cut at the position AA in FIG. 1 and viewed toward the arrow AA.
In FIG. 2, 22 is a back tension moving clamper base.
The back tension moving clamper base 22 is made of metal (aluminum or the like) or synthetic resin, holds the substrate tape 3 with a pair of upper and lower claws, and meshes with a timing belt attached to the lower end 22a with a small screw or the like. The plate 64 meshes with the timing belt 17. That is, the upper teeth 64 a formed on the upper surface of the timing belt meshing plate 64 mesh with the inner teeth 17 b formed on the inner side of the main body 17 a of the timing belt 17.
The timing belt 17 is made of an elastic material such as hard synthetic rubber, and the timing belt meshing plate 64 is made of hard synthetic rubber, metal, or hard synthetic resin.
Accordingly, when the timing belt 17 moves, the inner teeth 17b mesh with the upper teeth 64a, so that the back tension moving clamper base 22 also moves in the same direction.

In FIG. 2, a pair of left and right lower claws 22 b and 22 b protrude upward from the upper portion of the back tension moving clamper base 22 to support the lower surface of the substrate tape 3.
Moving clamper cylinders 23 and 23 are accommodated and disposed at the outer positions of the lower claws 22b and 22b of the back tension moving clamper base 22, respectively. Cylinder shafts 23a and 23a protrude above the movable clamper cylinders 23 and 23 so as to be movable up and down, and the cylinder shafts 23a and 23a are connected to upper claw holders 24 and 24 at their tips.
The upper claws 25 and 25 are held by the upper claws holders 24 and 24 so that the upper surface of the substrate tape 3 can be pressed by the lower ends of the upper claws 25 and 25. The upper claws 25, 25 are made of metal (stainless steel or the like), synthetic resin, or hard synthetic rubber.
When a control signal from the control unit described later is input to the moving clamper cylinders 23, 23, the cylinder shafts 23a, 23a move up and down, and the upper claw holders 24, 24 and the upper claws 25, 25 also move in the vertical direction. Will move.

The lower claws 22b and 22b and the upper claws 25 and 25 have the same planar position, and both can clamp (clamp) the substrate tape 3.
The lower nails 22b and 22b have a thickness of 2 to 3 mm at the upper end in contact with the substrate tape 3, a length of 30 to 50 mm, and the lower nails of the upper claws 25 and 25 in contact with the substrate tape 3 have a thickness of 0.5 to 1.5 mm. The length is 30-50 mm. The upper claws 25, 25 are thinner than the lower claws 22b, 22b, and the length is the same as the lower claws 22b, 22b. The lower claws 22b and 22b are made of metal (stainless steel or the like), synthetic resin, or hard synthetic rubber.
The lower claws 22b and 22b and the upper claws 25 and 25 press and clamp the substrate tape 3 over the entire length (30 to 50 mm).

FIG. 4 illustrates the relationship of the planar arrangement of the lower claws 22b and 22b and the upper claws 25 and 25 with respect to the substrate tape. As shown in FIG. 4, the upper claws 25, 25 are arranged on both ends of the substrate tape 3 in the width direction of the substrate tape 3 (in the direction orthogonal to the transport direction P). The vertical direction is arranged along the transport direction P, and the thickness direction of the upper claws 25, 25 is arranged in the width direction of the substrate tape 3. Although not shown in FIG. 4, the lower claws 22 b and 22 b are arranged at the same positions as the upper claws 25 and 25.
Since the length directions of the upper claws 25 and 25 and the lower claws 22b and 22b are arranged along the transport direction P, when the upper claws 25 and 25 and the lower claws 22b and 22b clamp the substrate tape 3 from above and below, In addition, the substrate tape 3 can be reliably clamped, and even when the substrate tape is subjected to a conveying force in the conveying direction, the substrate tape 3 can be prevented from slipping and reliably clamped. In addition, since the upper claws 25, 25 and the lower claws 22b, 22b are arranged at both ends in the width direction of the substrate tape 3, coupled with the fact that the upper claws 25, 25 and the lower claws 22b, 22b are formed thinly, The non-clamping area on the center side in the width direction of the substrate tape 3 increases, the area where the semiconductor device 2 is arranged increases, and the utilization efficiency of the substrate tape 3 can be improved.

Next, the structure and operation of the back tension holding clamper 21 other than those described above will be described.
FIG. 3 is a side view of the main part of the back tension holding clamper 21 cut at the BB position in FIG. 1 and viewed in the direction of the arrow BB.
In FIG. 3, reference numeral 26 denotes a back tension holding cumper base.
The back tension holding cumper base 26 is made of metal (such as stainless steel) or synthetic resin.
In FIG. 3, a pair of left and right rails 27 and 27 are disposed on the upper portion of the back tension holding cumper base 26. The rails 27 and 27 are L-shaped in cross section, and support the lower surface of the substrate tape 3 with L-shaped inner upper surfaces 27a and 27a. The rails 27 and 27 are fixed to the apparatus main body and do not move.
Holding clamper cylinders 28 and 28 are housed and disposed at positions outside the rails 27 and 27 of the back tension holding cumper base 26. Above the holding clamper cylinders 28, 28, cylinder shafts 28a, 28a project so as to be movable up and down, and the cylinder shafts 28a, 28a are connected to upper claw holders 29, 29 at their tips.
The upper claws 30 are held by the upper claws holders 29 and 29 so that the upper surface of the substrate tape 3 can be pressed by the lower ends of the upper claws 30 and 30. The upper claws 30 and 30 are made of metal (stainless steel or the like), synthetic resin, or hard synthetic rubber.
When a control signal is input from the control unit to the holding clamper cylinders 28 and 28, the cylinder shafts 28a and 28a move up and down, so that the upper claw holders 29 and 29 and the upper claws 30 and 30 also move up and down. become.

The upper claws 30, 30 overlap the inner upper surfaces 27 a, 27 a of the rails 27, 27 as planar positions, and both can clamp the substrate tape 3.
The width in the width direction in which the inner upper surfaces 27a and 27a are in contact with the substrate tape 3 is 2 to 5 mm, wider than the lower claws 22b and 22b, and the inner upper surfaces 27a and 27a have a length of 50 mm or more. Further, the thickness of the lower end where the upper claws 30 and 30 are in contact with the substrate tape 3 is 0.5 to 1.5 mm, and the length is 30 to 50 mm. The thickness of the upper claws 30 and 30 is narrower than the width of the inner upper surfaces 27a and 27a of the rail, and the length is shorter than the inner upper surfaces 27a and 27a.

FIG. 4 illustrates the relationship of the planar arrangement of the upper claws 30, 30 with respect to the substrate tape 3.
As shown in FIG. 4, the upper claws 30, 30 are arranged on both ends of the substrate tape 3 in the width direction of the substrate tape 3 (in the direction orthogonal to the transport direction P). The vertical direction is arranged along the conveyance direction P, and the thickness direction of the upper claws 30, 30 is arranged in the width direction of the substrate tape 3. Although not shown in FIG. 4, the inner upper surfaces 27 a and 27 a of the rail are arranged so as to cover the planar positions of the upper claws 30 and 30, but are longer than the upper claws 30 and 30 in the conveyance direction P. Is formed.
The fact that the length directions of the upper claws 30 and 30 are arranged along the transport direction P enables the substrate tape 3 to be reliably clamped as described above. Further, since the upper claws 30 are disposed at both ends in the width direction of the substrate tape 3, the unclamped area on the center side in the width direction of the substrate tape 3 increases, and the area where the semiconductor device 2 is disposed increases. Thus, the utilization efficiency of the substrate tape 3 can be improved.

  In FIG. 4, the planar arrangement relationship between the upper claws 25 and 25 and the upper claws 30 and 30 of the back tension moving clamper 15 and the back tension holding clamper 21 is the same at both ends of the substrate tape 3 in the width direction of the substrate tape 3. It is a planar position, and is the transport direction P in each length direction. Further, both upper claws 25, 25, 30, and 30 are the same in thickness and length, and are formed thin as described above. The length of 30 to 50 mm can be made longer than the arrangement pitch between the semiconductor device 2 arranged on the substrate tape 3 and the semiconductor device 2 arranged adjacent to the substrate tape 3. In that case, the upper claws 25, 25, 30, 30 can clamp the semiconductor device mounting region in which at least one semiconductor device 2 is arranged on the substrate tape in the transport direction. Since distortion of the semiconductor device mounting region can be reliably prevented, it is possible to prevent unnecessary stress such as strain on the mounted semiconductor device 2 from being applied.

[Main transport section 8]
The main transport unit 8 as a transport unit is arranged in the transport direction P from the sealing resin coating unit 6 described above in the sealing resin coating device 4 of FIG. 1, transports the substrate tape 3, Alternatively, the substrate tape 3 that is being transported is held.
The main transport unit 8 is engaged with the main transport unit moving clamper 31 as a transport unit moving clamper that sandwiches the substrate tape 3 and moves in the transport direction P side during the transport, and the main transport unit moving clamper 31 is screw-engaged with the main transport unit. A moving rotary shaft 32 for moving the partial movement clamper 31 in the transport direction P side or the reverse transport direction Q side, a servo motor 33 for rotating the rotary shaft 32 for movement in accordance with a control signal from the control unit, and a substrate tape 3 And a main transport unit holding clamper 34 as a transport unit holding clamper that clamps and holds the substrate tape 3 so as not to move when it is not transported. The tip of the moving rotary shaft 32 is pivotally supported by a moving rotary bearing 35.

The main transport unit moving clamper 31 has almost the same structure as the back tension moving clamper 15 described above. The main transport unit moving clamper 31 is different from the above-described back tension moving clamper 15 in the configuration of the drive units of both. That is, the drive unit configuration of the back tension moving clamper 15 includes the timing belt 17, the torque control device 16, the stepping motor 18, the first gear 19, and the second gear 20. On the other hand, the driving unit configuration of the main transport unit moving clamper 31 is for moving to move the main transport unit moving clamper 31 to the transport direction P side or the reverse transport direction Q side by screw engagement with the main transport unit moving clamper 31. A rotating shaft 32 and a servo motor 33 that rotates the moving rotating shaft 32 according to a control signal from the control unit are provided.
FIG. 5 is a cross-sectional view of the main part of the main transport unit moving clamper 31 corresponding to FIG.
In FIG. 5, a screw hole 36a of a female screw is formed in the lower center of the main transfer unit moving clamper base 36, and the above-described moving rotary shaft 32 having a male screw cut on the outer periphery of the screw hole 36a. Screwed. Since the servo motor 33 is connected to the moving rotating shaft 32, the moving rotating shaft 32 is rotated by rotating the servo motor 33 from side to side in response to a control signal from the control unit. The partial movement clamper base 36 is moved to the transport direction P side or the reverse transport direction Q side.

The structure and material of the back tension moving clamper 15 are the same as those of the above-described back tension moving clamper 15 except for the configuration of the driving unit of the main transport unit moving clamper 31. That is, the lower claws 36b and 36b, the holding clamper cylinders 41 and 41, the upper claw holders 55 and 55, and the upper claws 54 and 54 of the main transport unit moving clamper 31 are the same as those in FIG. .
Therefore, in response to a control signal from the control unit, the pair of upper claws 54 and 54 of the main transport unit moving clamper 31 is lowered by the moving clamper cylinders 41 and 41 to clamp the substrate tape 3 together with the lower claws 36b and 36b. The substrate tape 3 can be transported to a predetermined position on the transport direction P side by the rotation of the servo motor 33. Conversely, the control signal from the control unit causes the pair of upper claws 54, 54 of the main transport unit moving clamper 31 to rise by the moving clamper cylinders 41, 41 to release the clamping of the substrate tape 3, and then the servo motor 33. By reverse rotation, the main transport unit moving clamper 31 itself can be moved to the original predetermined position on the reverse transport direction Q side.

The configuration and material of the main transport unit holding clamper 34 are the same as those of the back tension holding clamper 21 described above.
That is, the main part sectional view is the same as FIG. Therefore, the rail 27 of the back tension holding clamper 21 can be extended in the transport direction P side and also used as the rail of the main transport unit holding clamper 34.

[Reactor exit transfer section]
The furnace outlet transport section 13 as another transport section has almost the same configuration as the main transport section 8, and the material is also the same.
The difference of the configuration of the furnace outlet transport unit 13 from the main transport unit 8 is that in the main transport unit 8, the servo motor 33 is disposed on the reverse transport direction Q side (left side in FIG. 1) from the position of the main transport unit moving clamper 31. On the other hand, the servo motor 39 of the furnace outlet transport section 13 is arranged on the transport direction P side (right side in FIG. 1) from the furnace outlet transport section moving clamper 37 which is another transport section moving clamper. .
Other than that, it has the same configuration and operation as the main transfer unit 8, and the furnace exit transfer unit moving clamper 37 and the furnace exit transfer unit holding clamper 38 as another transfer unit holding clamper are the main transfer unit moving clamper. 31 and the main transport unit holding clamper 34. Therefore, the cross-sectional view of the main part of the furnace outlet transfer unit moving clamper 37 is the same as that in FIG. 5, and the cross-sectional view of the main part of the furnace outlet transfer unit holding clamper 38 is the same as in FIG.

(Control part)
Next, the control part which controls operation | movement of each part of the processing apparatus 1 is demonstrated.
FIG. 6 is a control system block diagram in which the control controller 40 serving as the control unit controls the back tension applying unit 7, the main transport unit 8, and the furnace outlet transport unit 13.
The control controller 40 includes a central processing unit and a storage unit that stores in advance control programs for controlling the following operations, and additionally stores the operation status of each unit.

The controller 40 first controls the operation of each part of the back tension applying unit 7.
The controller 40 operates the electromagnetic valve 45 to operate the moving clamper cylinders 23 and 23. That is, the cylinder shafts 23a and 23a of the movable clamper cylinders 23 and 23 are moved up and down, and the upper claws 25 and 25 in FIG. When the upper claws 25, 25 are lowered, the substrate tape 3 is clamped by the lower claws 22b, 22b. Conversely, when it is raised, the clamp of the substrate tape 3 is released.
The controller 40 operates the electromagnetic valve 46 to operate the holding clamper cylinders 28, 28, and moves the cylinder shafts 28a, 28a up and down. By this vertical movement, the upper claws 30 and 30 in FIG. 3 are raised and lowered. When the upper claws 30 are lowered, the board tape 3 is clamped by the rails 27 and 27. Conversely, when it is raised, the clamp of the substrate tape 3 is released.
The controller 40 controls the rotation of the stepping motor 18 by operating the driver 51. By rotating the stepping motor 18, the first gear 19, the timing belt 17, and the back tension moving clamper 15 are moved by a predetermined amount in the transport direction P side or the reverse transport direction Q side.

The controller 40 further controls the operation of each part of the main transport unit 8.
The controller 40 operates the electromagnetic valve 47 to operate the movable clamper cylinders 41 and 41 shown in FIG. 5 to move the cylinder shafts 41a and 41a up and down. As a result of this up and down movement, the upper claws 54 and 54 are raised and lowered. Let When the upper claws 54 are lowered, the substrate tape 3 is clamped by the lower claws 36b and 36b. Conversely, when it is raised, the clamp of the substrate tape 3 is released.
The controller 40 operates the electromagnetic valve 48 to operate the holding clamper cylinders 43 and 43, and moves the cylinder shaft up and down. By this vertical movement, the upper nail is raised and lowered. When the upper nail is lowered, the substrate tape 3 is clamped by the rail. Conversely, when it is raised, the clamp of the substrate tape 3 is released. These structures are the same as those in FIG.
The controller 40 controls the rotation of the servo motor 33 by operating the driver 52. By rotating the servo motor 33, the main transport unit moving clamper 31 screw-engaged with the moving rotary shaft 32 is moved by a predetermined amount in the transport direction P side or the reverse transport direction Q side. This structure is illustrated in FIG.

The controller 40 further controls the operation of each part of the furnace outlet transport unit 13.
The controller 40 operates the electromagnetic valve 49 to operate the movable clamper cylinders 42 and 42, moves the cylinder shaft up and down, and raises and lowers the upper claw by this up and down movement. When the upper nail is lowered, the substrate tape 3 is clamped by the lower nail. Conversely, when it is raised, the clamp of the substrate tape 3 is released. These structures are the same as those in FIG.
The controller 40 operates the electromagnetic valve 50 to operate the holding clamper cylinders 44, 44, and moves the cylinder shaft up and down. By this vertical movement, the upper nail is raised and lowered. When the upper nail is lowered, the substrate tape 3 is clamped by the rail. Conversely, when it is raised, the clamp of the substrate tape 3 is released. These structures are the same as those in FIG.
The controller 40 controls the rotation of the servo motor 39 by operating the driver 53. By rotating the servo motor 39, the furnace outlet transport unit moving clamper 37 that is screw-engaged with the moving rotary shaft 32 is moved by a predetermined amount in the transport direction P side or the reverse transport direction Q side. This structure is the same as in FIG.

Next, the operation of each unit controlled by the controller 40 will be described.
[Reverse transfer operation]
When the substrate tape 3 is transported to apply the sealing resin to the semiconductor device 2 mounted on the substrate tape 3, the substrate tape 3 is regularly arranged along the transport direction P of the substrate tape 3 (longitudinal direction of the substrate tape 3). Each semiconductor device 2 must be accurately transported to a predetermined position of the sealing resin application part 6. Therefore, before starting the operation of applying the sealing resin, the substrate tape 3 is inserted and set in the sealing resin application device 4 and the heat curing device 5 as shown in FIG. The substrate tape 3 must be positioned at the position.
FIG. 7 illustrates the reverse transport operation process for transporting the substrate tape 3 in the reverse transport direction in order to set the substrate tape 3 at a predetermined initial position for transport. In order to actually set the substrate tape 3 at a predetermined initial position for conveyance, the reverse conveyance operation step and the conveyance operation step described later (the operation step for conveying the substrate tape 3 in the conveyance direction P side) Are appropriately combined.
(1) to (4) in FIG. 7 illustrate the process of the reverse conveyance work operation for each process.

First, as shown in FIG. 7 (1), the back tension holding clamper 21, the main transfer unit holding clamper 34, and the furnace outlet transfer unit holding clamper 38 clamp the substrate tape 3.
That is, the electromagnetic valves 46, 48, and 50 are operated by the command of the controller 40, and the upper claws 30 are lowered by driving the holding clamper cylinders 28, 43, and 44, and the back tension holding clamper 21 and the main conveyance unit are held. The clamper 34 and the furnace outlet transport unit holding clamper 38 clamp the substrate tape 3. The downward arrow of (1) in FIG. 7 means a clamped state where clamping is performed as described above. That is, the upper claws of the holding clampers 21, 34, 38 are lowered as described above, and the upper claws are combined with the rails to hold the substrate tape 3. Accordingly, the substrate tape 3 is not conveyed by the holding clampers 21, 34, and 38 but is held at the clamp position.
On the other hand, each moving clamper 15, 31, 37 does not clamp the substrate tape 3.
That is, the electromagnetic valves 45, 47, 49 are operated by the command of the controller 40, and the upper claws 25, 54 are raised by driving the movable clamper cylinders 23, 41, 42. The transport unit moving clamper 31 and the furnace outlet transport unit moving clamper 37 are not clamped (unclamped). The upward arrow in (1) in FIG. 7 means the unclamped state. That is, the upper claws of the movable clampers 15, 31, and 37 are not lifted as described above, and the substrate tape 3 is not sandwiched between the upper claws and the lower claws.

Next, each of the moving clampers 15, 31, and 37 in the unclamped state is moved to a predetermined position (right position in FIG. 7 (1)) when moved in the transport direction P side.
That is, the movement of the back tension moving clamper 15 is driven by the forward rotation of the stepping motor 18 by the output of the drive signal from the driver 51, and the movement of the main transport unit moving clamper 31 is The movement of the furnace outlet transfer section moving clamper 37 is performed by the forward rotation drive of the servo motor 39 by the output of the drive signal from the driver 53 by the forward rotation drive of the servo motor 33 by the output of the drive signal. The state in which the movable clampers 15, 31, and 37 are moved to the predetermined positions on the transport direction P side is the state (1) in FIG.
Hereinafter, in the operation of each moving clamper 15, 31, 37 and each holding clamper 21, 34, 38, the movement in the respective clamped state, unclamped state, transport direction P side or reverse transport direction Q side is shown in FIG. As described above, based on the command of the controller 40, the electromagnetic valves 45-50 are operated and the clamper cylinders 23, 28, 41, 43, 42, 44 are operated. The stepping motor 18 and the servo motors 33 and 39 are rotated forward or backward by driving signals output from the drivers 51, 52, and 53. (Both in FIG. 8).

Next, as shown in (2) of FIG. 7, the movable clampers 15, 31, and 37 clamp the substrate tape 3. That is, the upper claws of the movable clampers 15, 31 and 37 are lowered by the movable clamper cylinders 23, 41 and 42, and the upper claws are coupled with the lower claws to sandwich the substrate tape 3.
Thereafter, each holding clamper 21, 34, 38 releases the clamp of the substrate tape (unclamped). This unclamping state is performed by the upper claws of the holding clampers 21, 34, 38 being lifted by the holding clamper cylinders 23, 41, 42.
Therefore, even if each holding clamper 21, 34, 38 is in an unclamped state, each moving clamper 15, 31, 37 clamps the substrate tape 3, so that the substrate tape 3 does not move.

Next, as shown in (3) of FIG. 7, the stepping motor 18 is driven to rotate in the reverse direction so as to move the back tension moving clamper 15 to the reverse conveying direction Q side. Therefore, back tension is applied to the substrate tape 3 by the back tension moving clamper 15.
Immediately after the reverse rotation drive of the stepping motor 18, the servo motor 33 and the servo motor 39 are driven in reverse rotation to move the main transfer unit moving clamper 31 and the furnace outlet transfer unit moving clamper 37 in the reverse transfer direction Q side. . At that time, since the stepping motor 18 is reversely driven, the back tension moving clamper 15 moves to a predetermined position on the reverse conveying direction Q side.
The movement of each moving clamper 15, 31, 37 in the reverse conveyance direction Q side continues until the reference position of the substrate tape 3 reaches the conveyance start position. The fact that the reference position of the substrate tape 3 has reached the conveyance start position is detected, for example, by image recognition that the leading semiconductor device 2 mounted on the substrate tape 3 has reached a predetermined position of the sealing resin application unit 4. It is done by things.
When it is detected as described above that the reference position of the substrate tape 3 has reached the transfer start position, the servo motor 33 and the servo motor 39 are stopped by the command of the controller 40, and the main transfer unit moving clamper 31 and the furnace outlet are stopped. The movement of the transport unit moving clamper 37 in the reverse transport direction Q side stops. The predetermined position on the reverse conveyance direction Q side is a starting point for regular conveyance work of the substrate tape 3.

At this time, the stepping motor 18 continues to be driven in the reverse rotation, so that the back tension moving clamper 15 tries to move in the reverse conveying direction Q side. At this time, the back tension movement clamper 15 cannot move in the reverse conveyance direction Q side because the main conveyance unit moving clamper 31 is stopped, but the substrate between the main conveyance unit movement clamper 31 and the above-described torque control device 16. A predetermined value of back tension is applied to the tape 3.
The substrate tape 3 between the main transfer unit moving clamper 31 and the furnace outlet transfer unit moving clamper 37 is attached to the third turn roller 11 by the swing lever 60, string 61, small roller 62, and weight 63 described above. Since the acting force in the reverse conveying direction R is acting, there is no slack, distortion or the like.

Next, as shown in FIG. 7 (4), the holding clampers 21, 34, and 38 are brought into a clamped state.
That is, the upper claws of the holding clampers 21, 34, and 38 are lowered and sandwich the substrate tape 3 together with the rails.
Accordingly, in this state, as described above, the back tension is applied to the substrate tape 3 between the back tension moving clamper 15 and the main transport unit moving clamper 31, and the back tension holding clamper 21 and the main transport unit holding clamper 34 are applied. Back tension is also applied to the substrate tape 3 between the two.
In this state, the driving of the stepping motor 18 is stopped.
With the above preparation operation, the substrate tape 3 is set at the conveyance start reference position, and an appropriate back tension is applied to the substrate tape 3. Therefore, the distortion and looseness of the substrate tape 3 are removed, and the subsequent application of the sealing resin is performed at an accurate position.

[Transfer work operation]
The transport work operation is first performed in order to set the substrate tape 3 at a predetermined initial position for transport in combination with the reverse transport work operation described above.
When the preparatory operation for setting the substrate tape 3 at the predetermined initial position for transport is completed, the actual transport operation is performed.
This transfer work operation is performed as shown in FIG. In (1) to (4) of FIG. 8, the operation state of the related apparatus is displayed for each process.
The state of (1) in FIG. 8 is the state in which the back tension holding clamper 21, the main transfer unit holding clamper 34, and the furnace outlet transfer unit holding clamper 38 are clamped as shown in FIG. , 34, 38 are in a state where the upper claws are lowered and the substrate tape 3 is clamped together with the rails. In this state, the back tension is applied to the substrate tape 3 between the back tension holding clamper 21 and the main transport unit holding clamper 34 as described above. Further, as described above, the substrate tape 3 between the main transport unit moving clamper 31 and the furnace outlet transport unit moving clamper 37 has a third turn by the aforementioned swing lever 60, string 61, small roller 62, and weight 63. Since the acting force in the reverse conveyance direction R acts on the roller 11, there is no slack, distortion, or the like.
In this state, the back tension moving clamper 15, the main transport unit moving clamper 31, and the furnace exit transport unit moving clamper 37 are predetermined positions on the left side of the reverse transport Q side, which is a position corresponding to the transport start reference position of the substrate tape 3. (Left side position in FIG. 8) and in an unclamped state.

  While the holding clampers 21, 34, and 38 clamp the substrate tape 3, the sealing resin application unit 6 applies the sealing resin around the semiconductor device 2.

Next, when the sealing resin application unit 6 finishes applying the sealing resin to the periphery of the semiconductor device 2, as shown in (2) of FIG. Clamp 3 That is, the upper claws of the movable clampers 15, 31, and 37 are lowered by the movable clamper cylinders, and the upper claws are combined with the lower claws to sandwich the substrate tape 3.
Thereafter, each holding clamper 21, 34, 38 releases the clamp of the substrate tape (unclamped). This unclamped state is performed by the upper claws of the holding clampers 21, 34, 38 being lifted by the holding clamper cylinders.
Here, even if each holding clamper 21, 34, 38 is in an unclamped state, since each moving clamper 15, 31, 37 has already clamped the substrate tape 3, the back tension of the substrate tape 3 is removed. Is not.

Next, as shown in FIG. 8 (3), the main transport unit moving clamper 31 and the furnace outlet transport unit moving clamper 37 are moved in the transport direction P side. These movements are performed by driving the servo motor 33 and the servo motor 39 to rotate forward. At this time, the stepping motor 18 is not driven.
When the main transport unit moving clamper 31 and the furnace exit transport unit moving clamper 37 move in the transport direction P side, the substrate tape 3 clamped thereto is similarly transported in the transport direction P side. When the next semiconductor device 2 arranged on the reverse conveyance direction Q side of the semiconductor device 2 coated with the sealing resin is conveyed to the sealing resin application position of the sealing resin application unit 6 by this conveyance, The next semiconductor device 2 is detected by detection means such as an image recognition means, and the servo motor 33 and the servo motor 39 are stopped by a command from the controller 40, and the main transfer unit moving clamper 31 and the furnace outlet transfer unit moving clamper 37 are transferred. The movement to the direction P side also stops. The stop position of the conveyed substrate tape 3 is a setting position where the sealing resin application unit 6 applies the sealing resin to the next semiconductor device 2.

  As described above, when the servo motor 33 and the servo motor 39 are driven to rotate in the forward direction, the main transport unit moving clamper 31 and the furnace outlet transport unit moving clamper 37 move to the transport direction P side with the substrate tape 3 clamped. Since the back tension moving clamper 15 clamps the substrate tape 3, it is moved in the transport direction P side. When the back tension moving clamper 15 is moved in the transport direction P side, the back tension movement clamper 15 is moved as described above. The timing belt 17 meshing with the lower part of the clamper 15 moves. The timing belt 17 is conveyed by the inner tooth 17b portion (the upper side portion in FIG. 8 (3)) meshed with the upper teeth 64a of the timing belt meshing plate 64 held by the lower end 22a of the back tension moving clamper 15. It moves to the direction P side. Accordingly, the first gear 19 that meshes with the internal teeth of the timing belt 17 rotates, and the torque control device 16 that is coaxial with the first gear rotates.

However, as described above, when a torque is applied to the rotating shaft of the torque control device 16, a rotational resistance force that prevents the rotating force of the rotating shaft is induced by an internal magnetic action. This rotational resistance is substantially constant. Therefore, the rotational resistance force of the torque control device 16 is transmitted to the substrate tape 3 via the first gear 19, the timing belt 17, and the back tension moving clamper 15. Accordingly, a constant back tension is applied to the transport force that the substrate tape 3 is transporting in the transport direction P side by the main transport unit moving clamper 31 and the furnace outlet transport unit moving clamper 37.
The back tension is set to be smaller than the tension (transport force) on the transport direction P side by the main transport unit moving clamper 31 and the furnace exit transport unit moving clamper 37. Is applied, and the conveyance is performed in a state where there is no slack distortion. Therefore, the rotational resistance force of the torque control device 16 needs to be set under the condition that the back tension is smaller than the conveying force as described above.
The substrate tape 3 between the main transfer unit moving clamper 31 and the furnace outlet transfer unit moving clamper 37 is attached to the third turn roller 11 by the swing lever 60, string 61, small roller 62, and weight 63 described above. Since the acting force in the reverse conveying direction R is acting, there is no slack, distortion or the like.

Next, as shown in FIG. 8 (4), each holding clamper 21, 34, 38 clamps the substrate tape 3, and a series of conveyance is completed.
In this state, the sealing resin application unit 6 applies the sealing resin to the next semiconductor device 2.

The next new transport operation is the state shown in (4) of FIG. 8, that is, in the clamped state in which the holding clampers 21, 34, 38 clamp the substrate tape 3, and the movable clampers 15, 31, 37 are not clamped. After that, the back tension moving clamper 15, the main transfer unit moving clamper 31, and the furnace exit transfer unit moving clamper 37 are set to the transfer initial predetermined position in FIG. 8 (1) (the left position in FIG. 8 (1)). return. This returning operation is performed by rotating the stepping motor 18, the servo motor 33, and the servo motor 39 in reverse.
However, the next transfer operation is performed from (1) of FIG. 8, and the above is repeated many times.

  The above series of operations is controlled by the controller 40 based on a program stored in the storage device. In particular, the forward rotation drive and reverse rotation drive of each of the stepping motor 18, the servo motor 33, and the servo motor 39, the drive start and stop timings, the transfer speed, and the transfer stop time, as well as the semiconductor device by the sealing resin application unit 6 The control controller 40 also controls the application of the sealing resin to 2, the detection of the transport position of the substrate tape 3 (image recognition), and the start of transport when the transport start position is detected.

As described above, since the back tension is applied to the substrate tape 3 by the back tension applying unit 7, the substrate tape 3 is not loosened or distorted during the preparation operation and the transport operation, and the accurate. The substrate tape 3 can be transported to the transport position. Therefore, the sealing resin application operation to the semiconductor device 2 by the sealing resin application part 6 can be performed accurately.
Moreover, both the back tension moving clamper 21 and the main transport unit moving clamper 31 clamp the substrate tape 3 with the upper and lower claws, and the surfaces of the upper and lower nails contacting the front and back surfaces of the substrate tape 3 are flat, that is, Since it is formed in a flat shape, the substrate tape 3 can be pinched securely and without damaging the substrate tape. In particular, since each of the claws is formed long in the conveyance direction P side and thin in the width direction, a long distance can be clamped on the conveyance direction P side of the substrate tape 3, so that it can slide on the substrate tape. Absent. Moreover, local slack and distortion of the substrate tape 3 can be prevented by clamping a long distance. In addition, since each upper nail and lower nail is formed thin in the width direction of the substrate tape 3, the center side of the substrate tape 3 is widened, and the semiconductor device 2 having a large area can be arranged, or a plurality thereof can be arranged. Can do. Since each said upper nail | claw and lower nail | claw are arrange | positioned at the both-sides edge side of the width direction of the board | substrate tape 3, it can prevent reliably that the board | substrate tape 3 is loosened or distorted in the width direction.
In addition, the effect | action about the main conveyance part movement clamper 31 is similarly acquired also in the furnace exit conveyance part movement clamper 37. FIG.

  Here, the length, thickness, and clamping force of the upper and lower claws of the back tension moving clamper 21 and the main transport unit moving clamper 31 must satisfy the following conditions. That is, when the substrate tape 3 clamped by the upper and lower claws of the main transport unit moving clamper 31 is transported in the transport direction P, even if a transport force greater than the back tension is applied with the back tension applied. It is necessary that the upper and lower claws of the main transport unit moving clamper 31 are set so as not to slide with the substrate tape 3. In addition, when the main transport unit moving clamper 31 transports the substrate tape 3 in the transport direction P side as described above with the upper and lower claws clamped by the back tension moving clamper 21, the torque control device 16 counteracts. Even if the force is applied, the upper and lower claws of the back tension moving clamper 21 are clamped without slipping with the substrate tape 3, and are set so that they can be moved together with the substrate tape 3 in the conveying direction P side by the main conveying unit moving clamper 31. It is necessary to be.

  In addition, since the said upper nail | claw and the lower nail | claw are formed thinly and it presses relatively and pinches | interposes the substrate tape 3, compared with the case where the said thickness is thick, it clamps | pinches the substrate tape 3 partially. As a result, the pressing force can be reliably held without being dispersed. Therefore, the main transport unit moving clamper 31 can securely clamp the substrate tape 3 and transport it in the transport direction P side, and the back tension moving clamper 21 can reliably back tension the substrate tape 3 during transport. Can be granted.

Further, the pressure (the pressing force per unit area) that the upper claws 25, 25, 54, 54 and the lower claws 22 b, 22 b, 36 b, 36 b in the back tension moving clamper 15 and the main transport unit moving clamper 31 are pressed together. ) Is higher than the pressure (pressing force per unit area) that the upper claws 30 and 30 and the inner upper surfaces 27a and 27a of the rail in the back tension holding clamper 21 and the main transport unit holding clamper 34 are pressed together (the pressing force per unit area). (Strong) is preferable. This is because the back tension moving clamper 15 applies a back tension to the substrate tape 3 when the main transport unit moving clamper 31 transports the substrate tape 3 in the transport direction P side. , 25, 54, 54 and the lower claws 22b, 22b, 36b, 36b can be prevented from slipping with the substrate tape 3. Further, when the back tension moving clamper 15 reversely conveys the substrate tape 3 in the reverse conveying direction Q side, a back tension is applied to the substrate tape 3, so that the upper claws 25 of the respective moving clampers 15 and 31 are provided. 25, 54, 54 and the lower claws 22b, 22b, 36b, 36b can be prevented from slipping with the substrate tape 3.

On the other hand, in each holding clamper 21, 34, 38, the substrate tape 3 is clamped by the upper claw and the rail. When each holding clamper 21, 34, 38 clamps the substrate tape 3, the substrate tape 3 is not transported in the transport direction P side or reversely transported in the reverse transport direction Q side. What is necessary is just to hold | maintain the substrate tape 3 currently performed. Accordingly, each holding clamper 21, 34, 38 stably supports the substrate tape 3 with a rail having a contact area larger than that of the claw on the back side at the time of each clamping, and the upper side from the surface side of the substrate tape 3 is supported. It is preferable to press with a nail. The clamping force at this time can be made weaker than the clamping force of each moving clamper 15, 31, 37.
Note that the width in the width direction of the rail is not particularly restricted when the semiconductor device 2 is mounted on the surface of the substrate tape 3, and is free. However, electronic components such as the semiconductor device 2 are not limited. When mounted on the back surface of the substrate tape 3, when the wiring is arranged on the back surface, it is necessary to keep the width dimension so as to escape.

[Second Embodiment]
In the first embodiment, a sealing resin application unit 6 is disposed between the back tension applying unit 7 and the main transport unit 8, and the back tension applying unit 7 is backed to the substrate tape 3 between the main transport unit 8. It provided tension.
In the second embodiment, a mounting device (not shown) for placing and joining the semiconductor device 2 on the substrate tape 3 is disposed between the back tension applying unit 7 and the main transport unit 8. is there.
The mounting apparatus grips the semiconductor device 2 and places it on a predetermined position on the surface of the substrate tape 3, joins the semiconductor device 2 and the substrate tape 3 with an adhesive, etc. Conductive connection is made between the electrode and the wire. Alternatively, the mounting apparatus grasps the semiconductor device 2 and places it on a predetermined position on the surface of the substrate tape 3, and thermally couples the electrode formed on the lower surface of the semiconductor device 2 and the conductive pattern disposed on the substrate tape 3. However, conduction and joining may be performed at once.
In the above case, the sealing resin coating device 6 described above is disposed between the main transport unit 8 and the heat curing device 5, and the sealing resin is applied to the periphery of the semiconductor device 2. A heat curing device 5 is disposed at a position ahead of the conveyance direction P.
The configurations of the back tension applying unit 7, the main transfer unit 8, and the furnace exit transfer unit 13 are the same as those in the first embodiment.
Accordingly, since the back tension is applied to the substrate tape 3 between the back tension applying unit 7 and the main transport unit 8, the substrate tape 3 is not loosened or distorted, and the semiconductor device 2 is accurately connected to the substrate tape 3. Can be mounted at a predetermined position.

[Third Embodiment]
The third embodiment is a substrate tape transport device that transports the substrate tape 3 to a plating tank in order to perform wiring at predetermined positions on the surface of the substrate tape 3.
In the first embodiment, the sealing resin application unit 6 is arranged between the back tension applying unit 7 and the main transport unit 8, and the back tension applying unit 7 is backed to the substrate tape 3 between the main transport unit 8. It provided tension.
In the third embodiment, a plating tank is disposed between the back tension applying section 7 and the main transport section 8 so that the transported substrate tape 3 is transported to the plating tank and is transported out of the plating tank after plating. It is a thing.

The plating tank may be an electrolytic plating tank or an electroless plating tank.
In the plating process on the substrate tape 3, for example, after the semiconductor device 3 is placed and fixed on the substrate tape 3, a wiring pattern for conducting with each electrode of the semiconductor device 3 is formed on the surface of the substrate tape 3.
Therefore, since the back tension is applied to the substrate tape 3 conveyed to the electrolytic plating tank, the substrate tape 3 is subjected to a plating process without being bent or distorted. Therefore, the wiring pattern can be formed at an accurate position and can be satisfactorily applied without causing a short circuit.
The configurations of the back tension applying unit 7 and the main transport unit 8 are the same as those in the first embodiment.

[Modification 1]
In each clamper of each embodiment, the upper nail is fixed to the upper nail holder. In that case, the contact surface of the upper claw with the substrate tape must be adjusted to be parallel to the surface of the substrate tape. In particular, for the contact surface of the upper nail with the substrate tape, it is important to adjust the parallelism on the conveyance direction P side (longitudinal direction of the upper nail).
In Modification 1, the upper nail has an elastic portion, and even when the contact surface of the upper nail with the substrate tape is not slightly parallel to the surface of the substrate tape, This is a structure having an elastic part so that the contact surface can be uniformly contacted with the surface of the substrate tape.
The elastic part provided structure is obtained by bonding a rubber plate member to the substrate tape side of the upper nail body held by the upper nail holder and bonding the upper nail portion to the substrate tape side of the rubber plate member, for example. The board tape side plane of the upper claw part presses the surface of the board tape.
Therefore, even when the substrate tape contact plane of the upper nail is not somewhat parallel to the surface of the substrate tape, the rubber plate member is elastically deformed by the upper nail descending and pressing the substrate tape together with the lower nail, It will be in contact with the substrate tape over the entire length of the upper nail in the conveyance direction P side (longitudinal direction of the upper nail), and at the same time, the pressing force is also made uniform over the entire length. Therefore, it is possible to more reliably prevent the upper nail from sliding with the surface of the substrate tape and to more reliably apply the back tension to the substrate tape.

The elastic part provided structure can be applied to other than the back tension moving clamper 15, and includes a main transfer part moving clamper 31, a furnace outlet transfer part moving clamper 37, a back tension holding clamper 21, a main transfer part holding clamper 34, a furnace. In the exit conveyance part holding | maintenance clamper 38, you may apply to each upper nail | claw, and may apply to the lower nail | claw of each clamper, or a rail part.
In addition, the structure having the elastic portion is not limited to the above-described structure, and may be another mechanism. In short, when pressing the substrate tape, the surface in contact with the substrate tape is not parallel but parallel. As long as the upper nail, the lower nail, and the rail structure can be adjusted to any shape, any elastic portion provided structure may be adopted.
Therefore, the elastic part equipped structure can be configured only by configuring the upper nail or the lower nail with an elastic material, for example. For example, the upper claws 25, 30, and 54 of FIGS. 2, 3, and 5 are made of a hard synthetic rubber material. Then, even when the contact surfaces of the upper claws 25, 30, 54 with the substrate tape 3 are not somewhat parallel to the substrate tape 3, the material of the upper nails has elasticity, so that the upper nail substrate tape 3 is placed on the surface of the substrate tape 3. The contact surface is familiar and can be pressed and pressed well over almost the entire length of the nail.
In the above-mentioned elastic part equipped structure, the upper nail or the lower nail may be formed of a metal material or a hard plastic material, and the elastic plate may be bonded to the side of the upper nail or the lower nail that contacts the substrate tape. The elastic plate may be a hard synthetic rubber or an elastic plastic material.

[Modification 2]
In each clamper of each embodiment, the upper nail is fixed to the upper nail holder. In that case, the contact surface of the upper claw with the substrate tape must be adjusted to be parallel to the surface of the substrate tape. In particular, the adjustment of the parallelism on the conveyance direction P side (longitudinal direction of the upper claw) is important.
In the second modification, the upper claw can swing with respect to the upper claw holder.
With this swing mechanism, when the upper claw presses the substrate tape, the contact surface of the upper claw with the substrate tape conforms to the surface of the substrate tape, so that the upper claw contacts the substrate tape over its entire length in the longitudinal direction. The pressing force is also made uniform over the entire length.
FIG. 9 illustrates a specific example of the second modification. FIG. 9 (1) is a cross-sectional view of the main part in which the above-described swing mechanism is used for the back tension moving clamper 15, and FIG. 9 (2). FIG. 10 is a right side view of (1) of FIG. 9. FIG. 9 is obtained by adding the swing mechanism to the structure around the upper claw 25 of FIG.

In FIG. 9, the swing mechanism uses an upper claw holding pin 58 when holding the upper claw 56 on the upper claw holder 57. The upper claw holding pin 58 penetrates the upper claw 56 and is driven into the upper claw holder 57. A coil spring 59 is disposed between the hook at the tip of the upper nail holding pin 58 and the upper nail 56, and the coil spring 59 presses the upper nail 56 against the upper nail holder 57, and the upper nail 56 extends over the upper nail holder 57. The claw holding pin 58 is not rattled.
The upper claw 56 is held so as to be able to swing in the left-right direction S as shown in FIG.

Accordingly, when the upper claw 56 is lowered by the moving clamper cylinder 23 as shown in FIG. 2, the substrate tape 3 is sandwiched from above and below by the lower claw 22b. At that time, the contact surface of the upper claw 56 with the substrate tape 3 is not parallel to the substrate tape 3, and the front end in the transport direction P in the longitudinal direction ((2) right end in FIG. 9) is in contact with the substrate tape 3. Even when the tip of the reverse conveyance direction Q side (the left end of (2) in FIG. 9) is slightly separated from the substrate tape 3 and a gap is formed, if the upper claw 56 is further lowered, the upper claw 56 The tip in the reverse transport direction Q side (the left end of (2) in FIG. 9) is lowered at the center, that is, closer to the substrate tape 3 side. Therefore, the upper claw 56 contacts the substrate tape 3 over the entire length in the transport direction P side (longitudinal direction), and the pressing force by the upper claw 56 and the lower claw 22b is also made uniform.
In the above description, the case where the swing mechanism is used on the upper claw 56 side is described. However, the swing mechanism may be used on the lower claw side. That is, even when the contact surface of the lower nail with the substrate tape 3 is not somewhat parallel to the substrate tape 3, when the upper nail is further lowered, the lower nail swings around the lower nail holding pin and is the same as above. Further, the upper and lower claws can be in contact with the substrate tape 3 over the entire length in the transport direction P (longitudinal direction), and the pressing force between the upper and lower claws can be made uniform.

The swing mechanism can be applied to other than the back tension moving clamper 15, and includes a main transport unit moving clamper 31, a furnace outlet transport unit moving clamper 37, a back tension holding clamper 21, a main transport unit holding clamper 34, In the furnace exit conveyance part holding clamper 38, it may be applied to each upper claw part, or may be applied to the lower claw part and rail part of each clamper.
Further, the swing mechanism described above is not limited to the structure shown in FIG. In short, any clamping mechanism may be used as long as the upper claw, the lower claw, and the rail can be adjusted to be parallel even when the surface in contact with the substrate tape is not somewhat parallel when clamping the substrate tape.

[Modification 3]
In each embodiment, the torque control device 16 based on magnetic action is used as the back tension applying means. However, any method other than the torque control device 16 may be used as long as the back tension can be applied.
For example, a spring wound in a coil shape is inserted into a circular inner periphery of a container wheel fixed to the processing apparatus 1, an inner end of the spring is attached to a container rotating shaft arranged at the center of the container wheel, and an outer end of the spring is attached The container wheel is kept in frictional contact with the circular inner peripheral wall. The container rotation shaft is connected to the rotation shaft of the first gear 19 that meshes with the timing belt 17. However, when the timing belt 17 is moved, the container rotating shaft is connected to the rotating shaft of the first gear 19 rotated by the rotation of the timing belt 17, so that the outer end of the mainspring is opposed to the rotation inside the circular shape. A brake that frictionally slides with the peripheral wall and prevents the movement of the timing belt is applied. Accordingly, a braking force is applied to the timing belt 17, but a back tension is also applied to the substrate tape 3 via the back tension moving clamper 15 meshed with the timing belt 17. Accordingly, when the substrate tape 3 is transported in the transport direction P side, back tension in the reverse transport direction Q side is applied.

[Modification 4]
In each embodiment, the timing belt 17 is used as the back tension applying means, but the first gear 19 rotates in conjunction with the movement of the back tension moving clamper 15 in the transport direction P side and the reverse transport direction Q side. Any structure may be used.
For example, a plate-like member made of a rigid body and having a plurality of teeth formed on the upper surface and the lower surface thereof is prepared, and the teeth on the upper surface mesh with the teeth formed on the lower side of the back tension moving clamper 15, and the lower surface The teeth may mesh with the external teeth of the first gear 19, and the plate member may be guided and held so as to be movable in the transport direction P side and the reverse transport direction Q side.

[Modification 5]
In the first embodiment, when the length of the substrate tape 3 from the back tension applying section 7 to the furnace outlet transport section 13 is relatively short, the main transport section 8 is not disposed and the function of the main transport section 8 is controlled by the furnace. The outlet transport unit 13 may be provided, and the back tension may be applied to the substrate tape 3 between the furnace outlet transport unit 13 and the back tension applying unit 7.
Alternatively, in FIG. 1, when the substrate tape 3 carried out from the furnace outlet transport unit 13 is automatically wound by a take-up reel or the like, the furnace outlet transport unit 13 may be omitted.

The board | substrate tape conveying apparatus of this invention can be utilized for the sealing resin application | coating apparatus which apply | coats sealing resin continuously around the electronic component arrange | positioned at the board | substrate tape. In addition, the present invention can be applied to a continuous mounting apparatus in which electronic components are arranged on a substrate tape and are electrically connected to the substrate tape. Furthermore, the present invention can be applied to a plating apparatus for continuously plating a substrate tape.
The electronic component mounting body mounted on the substrate tape is individually cut from the substrate tape and used in, for example, a mobile phone, an electronic timepiece, a small electronic calculator, a personal computer, and the like.
In addition to the above, the present invention can be applied to a substrate tape that is not used as a part of an electronic component, and may be a metal tape for continuous press processing. It may be a transport device that uses the back tension applying means of the present invention in order to apply the toner.

1: processing device, 2: semiconductor device, 3: substrate tape, 4: sealing resin coating device, 5: heat curing device, 6: sealing resin coating unit, 7: back tension applying unit, 8: main transport unit, 9: 1st turn roller, 10: 2nd turn roller, 11: 3rd turn roller, 12: heating unit, 13: furnace outlet transport unit, 14: needle, 15: back tension moving clamper, 16: torque control device, 17: Timing belt, 17a: Main body, 17b: Internal teeth, 18: Stepping motor, 19: First gear, 20: Second gear, 21: Back tension holding clamper, 22: Back tension moving clamper base, 22a: Lower end 22b, 36b: Lower nail, 23, 41, 42: Moving clamper cylinder, 23a, 28a, 41a: Cylinder shaft, 24, 29, 55: Upper nail Ruder, 25, 30, 54, 56: Upper claw, 26: Back tension holding clamper base, 27: Rail, 27a: Inner upper surface, 28, 43, 44: Holding clamper cylinder, 31: Main transfer unit moving clamper, 32 : Rotary shaft for movement, 33, 39: Servo motor, 34: Clamper for holding main transfer part, 35: Rotary bearing for movement, 36: Main transfer part moving clamper base, 36a: Screw hole, 37: Movement of furnace outlet transfer part Clamper, 38: Furnace outlet transport section holding clamper, 40: Control controller, 45-50: Electromagnetic valve, 51-53: Driver, 58: Upper claw holding pin, 59: Coil spring, 60: Swing lever, 61: String, 62: Small roller, 63: Weight, 64: Timing belt meshing plate, 64a: Upper teeth, P: Transport direction, Q, R: Reverse transport direction, S: Left-right direction

Claims (8)

A substrate tape transport device that constitutes a substrate that is at least a part of an electronic component,
A transport unit for transporting the substrate tape in a predetermined transport direction;
A back tension applying unit that applies a back tension in a direction opposite to the transport direction to the substrate tape,
The transport unit includes a transport unit moving clamper that transports the substrate tape sandwiched during transport in the transport direction, and a transport unit holding clamper that grips the substrate tape when the substrate tape is not transported and does not sandwich the substrate tape during transport. Have
The back tension applying part is
A back tension movement clamper that sandwiches the substrate tape during the conveyance and is moved in the conveyance direction, and when the back tension movement clamper is moved in the conveyance direction by the conveyance unit movement clamper, the back tension movement clamper Back tension applying means for applying a back tension that prevents movement in the transport direction,
The transport unit moving clamper and the back tension moving clamper are:
A surface contact portion that contacts the surface of the substrate tape; and a back surface contact portion that contacts the back surface of the substrate tape and cooperates with the surface contact portion to sandwich the substrate tape.
The substrate tape transport device, wherein the front surface contact portion and the back surface contact portion are formed in a substantially flat surface. It is a board | substrate tape conveying apparatus described in Claim 1, Comprising:
At least one of the front surface contact portion and the back surface contact portion in the transport unit moving clamper and the back tension moving clamper is a claw unit,
As for the shape of the said flat surface of the said nail | claw part, the dimension by the side of the said conveyance direction is long, The dimension by the side of the width direction orthogonal to the said conveyance direction is shorter than the dimension by the side of the said conveyance direction, The board | substrate tape conveying apparatus characterized by the above-mentioned. It is a board | substrate tape conveying apparatus described in Claim 2, Comprising:
The substrate tape transport device, wherein the front surface contact portion and the back surface contact portion of the transport portion moving clamper and the back tension moving clamper are the claw portions. A substrate tape transport device according to any one of claims 1 to 3,
The back tension applying unit is disposed in the vicinity of the back tension moving clamper, and has a back tension holding clamper that holds the substrate tape when the substrate tape is not transported and does not sandwich the substrate tape when transported.
The transfer tape holding clamper and the back tension holding clamper are characterized in that the front surface contact portion is configured by the claw portion and the back surface contact portion is configured in a rail shape on which the substrate tape is placed. Transport device. A substrate tape transport device according to any one of claims 1 to 4,
The transport unit is
2. A substrate tape transport apparatus comprising: a moving clamper driving means for moving the transport unit moving clamper in the transport direction or the reverse transport direction. It is a board | substrate tape conveying apparatus described in any one of Claim 1 or Claim 5,
The back tension applying means is
When the transport unit moving clamper is transporting and moving in the transport direction while sandwiching the substrate tape, the front surface contact portion and the back surface contact portion are moved in the transport direction while sandwiching the substrate tape. A timing belt driven by meshing with the back tension moving clamper,
A back tension generating section that applies the back tension smaller than the transport force to the timing belt against the transport force in the transport direction by the transport section moving clamper when the timing belt is driven. The board | substrate tape conveying apparatus characterized by the above-mentioned. A substrate tape transport apparatus according to claim 6,
A control unit for controlling operations of the transport unit and the back tension applying unit;
The controller is
In the stage before the start of transport of the substrate tape, the transport section holding clamper of the transport section is closed to sandwich the mounting tape, the back tension moving clamper is opened, and the back tension moving clamper is moved to a predetermined position on the transport direction side. The timing belt driving means is driven to drive the timing belt until it moves, and then the back tension moving clamper is closed and the mounting tape is clamped before the transport unit holding clamper is opened. After opening, the timing belt driving means is driven to drive the back tension moving clamper to a predetermined position on the opposite side to the conveying direction to apply back tension to the substrate tape via the back tension moving clamper. Let
At the time of transporting the substrate tape, after the transport unit moving clamper and the back tension moving clamper are closed, the transport unit holding clamper is not opened and the mounting tape is not sandwiched. Thereafter, the transport unit moving clamper and the back tension moving clamper are The mounting tape is closed, and the moving clamper driving means is driven to move the transfer unit moving clamper in the transfer direction, thereby applying a back tension to the substrate tape via the back tension moving clamper. A substrate tape transport device. The substrate tape transport device according to any one of claims 1 to 7, wherein the processing device performs application of a sealing resin to the electronic component mounted on the substrate tape and heat curing of the sealing resin. Because
In order toward the transport direction, a sealing resin application part for applying the sealing resin to the electronic component, and a heating and curing part for the sealing resin are provided,
The back tension applying part is disposed on the reverse conveyance direction side with respect to the sealing resin application part,
The transport part is disposed at an intermediate position between the sealing resin application part and the heat curing part, and at a front side in the transport direction with respect to the heat curing part. apparatus.

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