JP2011052258A5

JP2011052258A5 -

Info

Publication number: JP2011052258A5
Application number: JP2009201261A
Authority: JP
Filing date: 2009-09-01
Publication date: 2012-07-19
Anticipated expiration: 2029-09-01

Description

本発明者等は、前記課題を解決すべく検討した結果、図６に示す長さが揃ったリード線１８，１８を具備する半導体装置用部材１０と、長さが異なるリード線１８ａ，１８ｂを具備する半導体装置用部材１０′が装着された治具３０を、図５に示す様に、電解金めっき液２８に浸漬して電解金めっきを施した後、金めっきの剥離性能を有し、且つ電解質が添加された剥離液に浸漬して、治具３０の第１電極２４を陰極にして直流電流を給電する電解剥離を試みた。
かかる電解剥離によれば、治具３０の第１電極２４に非接触状態のリード線１８ｂに形成されていた置換金めっき層は剥離され、リード線１８ｂに施した下地めっきが露出し、第１電極２４に接触している他のリード線１８等と明らかに色調が異なり、且つ他のリード線１８に形成された電解金めっき層の厚さは殆ど変わらないことを見出した。 As a result of studies to solve the above problems, the present inventors have found that the semiconductor device member 10 having the lead wires 18 and 18 having the same length shown in FIG. 6 and the lead wires 18a and 18b having different lengths are provided. As shown in FIG. 5, the jig 30 having the semiconductor device member 10 ′ is immersed in an electrolytic gold plating solution 28 and subjected to electrolytic gold plating. In addition, it was immersed in a stripping solution to which an electrolyte was added, and electrolytic stripping in which a direct current was fed using the first electrode 24 of the jig 30 as a cathode was attempted.
According to such electrolytic stripping, the displacement gold plating layer formed on the lead wire 18b in a non-contact state with the first electrode 24 of the jig 30 is stripped, and the base plating applied to the lead wire 18b is exposed, so that the first It has been found that the color tone is clearly different from that of the other lead wires 18 that are in contact with the electrode 24 , and the thickness of the electrolytic gold plating layer formed on the other lead wires 18 is hardly changed.

すなわち、本発明者等は、前記課題を解決する手段として、電子部品用部材を構成する本体部材の表面を形成する金属と電気的に絶縁されて装着された複数の金属部材の各一端部を治具内に挿入して、前記一端部の各々の少なくとも一部が前記治具内に設けられた陰極としての第１電極に接触状態とした後、陽極としての第２電極が浸漬された電解めっき液に前記電子部品用部材及び治具を浸漬し、前記第１電極と第２電極との間に電流を印加して、前記金属部材の各露出面に電解めっき層を形成し、次いで、前記治具に一端部が挿入された電子部品用部材を、前記電解めっき層を形成するめっき金属を剥離する剥離性能を有し、且つ電解質が添加された剥離液に浸漬して、前記電解めっきの際に、前記第１電極と接触することなく非通電状態となった金属部材の表面に形成された置換めっき層を選択的に剥離するように、前記治具内の陰極としての第１電極と前記剥離液に浸漬された陽極としての第３電極との間に、直流電流を印加する置換めっき層の剥離方法を提供できる。
本発明者等が提供した課題を解決する手段において、下記の好ましい態様を上げることができる。
電子部品用部材としては、本体部材としての金属製のステムに形成された複数の貫通孔の各々に挿通された金属部材としてのリード線が、前記貫通孔の各々に充填された絶縁層によって、前記ステムと電気的に絶縁されている電子部品用部材を好適に用いることができる。
また、電解めっきとして、電解金めっきを採用し、剥離液として金めっき用の剥離液を好適に用いることができる。 That is, the present inventors, as means for solving the above problems, each end portion of a plurality of metal members that are electrically insulated from the metal forming the surface of the body member constituting the electronic component member. Electrolysis in which at least a part of each of the one end portions is brought into contact with a first electrode as a cathode provided in the jig and then a second electrode as an anode is immersed in the jig. The electronic component member and jig are immersed in a plating solution, an electric current is applied between the first electrode and the second electrode, and an electrolytic plating layer is formed on each exposed surface of the metal member. The electroplating member is immersed in a stripping solution having a stripping performance for stripping a plating metal forming the electrolytic plating layer and an electrolyte added to the electronic component member having one end inserted in the jig. In the non-energized state without contact with the first electrode. A first electrode as a cathode in the jig and a third electrode as an anode immersed in the stripping solution so as to selectively peel the displacement plating layer formed on the surface of the metal member. A displacement plating layer peeling method in which a direct current is applied between them can be provided.
In the means for solving the problems provided by the present inventors, the following preferred embodiments can be raised.
As an electronic component member, a lead wire as a metal member inserted into each of a plurality of through holes formed in a metal stem as a main body member is formed by an insulating layer filled in each of the through holes, An electronic component member that is electrically insulated from the stem can be suitably used.
Moreover, electrolytic gold plating is employ | adopted as electrolytic plating, and the stripping solution for gold plating can be used suitably as stripping solution.

剥離液４０に浸漬された半導体装置用部材１０，１０′を装着した治具３０の第１電極２４を、図２に示す様に、電解めっきの際と同様に、陰極となるように直流電源４４と結線し、且つ剥離液４０に浸漬されている第３電極４２が陽極となるように直流電源４４と結線して、直流電源４４から第１電極２４と第３電極４２との間に直流電流を印加する。かかる電解剥離によって、半導体装置用部材１０のリード線１８，１８には、第１電極２４から通電され、その露出面に形成された電解金めっき層は剥離されない。
一方、半導体装置用部材１０′のリード線１８ｂは、治具３０の第１電極２４と非接触状態である。このため、半導体装置用部材１０′のリード線１８ｂに形成された置換金めっき層には、剥離液４０の剥離作用が直接作用し、置換金めっき層を選択的に剥離できる。 As shown in FIG. 2, a DC power supply is used so that the first electrode 24 of the jig 30 mounted with the semiconductor device members 10 and 10 'immersed in the stripping solution 40 becomes a cathode as in the case of electrolytic plating. 44 is connected to the DC power source 44 so that the third electrode 42 immersed in the stripping solution 40 becomes an anode, and the DC power source 44 connects the first electrode 24 and the third electrode 42 with a DC current. Apply current. By such electrolytic peeling, the lead wires 18 and 18 of the semiconductor device member 10 are energized from the first electrode 24, and the electrolytic gold plating layer formed on the exposed surface is not peeled off.
On the other hand, the lead wire 18 b of the semiconductor device member 10 ′ is not in contact with the first electrode 24 of the jig 30. Therefore, the peeling action of the stripping solution 40 acts directly on the displacement gold plating layer formed on the lead wire 18b of the semiconductor device member 10 ', and the displacement gold plating layer can be selectively peeled off.

Claims

Insert one end of each of the plurality of metal members that are electrically insulated from the metal forming the surface of the body member constituting the electronic component member into the jig, and at least one of each of the one end portions. After the portion is in contact with the first electrode as the cathode provided in the jig,
Each of the metal members is exposed by applying a current between the first electrode and the second electrode by immersing the electronic component member and the jig in an electrolytic plating solution in which the second electrode as an anode is immersed. Forming an electrolytic plating layer on the surface,
Next, the electronic component member having one end inserted in the jig has a peeling performance for peeling the plating metal forming the electrolytic plating layer, and is immersed in a peeling solution to which an electrolyte is added, During the electroplating, the first electrode as the cathode in the jig is selectively peeled off the replacement plating layer formed on the surface of the metal member which is in a non-energized state without contacting the first electrode. A displacement plating layer peeling method, wherein a direct current is applied between one electrode and a third electrode as an anode immersed in the peeling solution.

As an electronic component member, a lead wire as a metal member inserted into each of a plurality of through holes formed in a metal stem as a main body member is formed by the insulating layer filled in each of the through holes. The displacement plating layer peeling method according to claim 1, wherein a member for electronic parts that is electrically insulated from the stem is used.

The displacement plating layer peeling method according to claim 1, wherein electrolytic gold plating is employed as the electrolytic plating, and a peeling solution for gold plating is used as the peeling solution.