JP2011049551A - Vacuum suction nozzle - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem wherein even if the speed of a mounting machine is improved and dark-color ceramic is used to improve the mounting accuracy, the image input level (luminance) of reflection light from an end (suction surface) of a suction nozzle is still high when detecting the position of an object to be sucked by casting light from the camera side, and therefore the position of the object to be sucked cannot be easily detected and the mounting accuracy is inferior. <P>SOLUTION: A vacuum suction nozzle 1 has a suction surface 2 for vacuum-sucking an object to be sucked at the end. The suction surface 2 has a plurality of grooves, and a maximum cross-sectional height Rt of a roughness curve in a specific direction described in JIS B 0601(2001) of the suction surface 2 is ≥0.18 μm and ≤0.4 μm and an average length Rsm of a contour curve component of the suction surface 2 is ≥0.01 mm and ≤0.08 mm. Due to this structure of the suction surface 2, there is no displacement or falling of a sucked object and the time to detach the sucked object can be shortened, which improves the mounting accuracy and transfer efficiency. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a vacuum suction nozzle that is suitably used in an electronic component mounting machine for mounting a chip-shaped electronic component such as a chip capacitor or a chip resistor on a circuit board.

  Conventionally, chip-shaped electronic components such as chip capacitors and chip resistors are adsorbed by vacuum suction to the suction surface at the tip of the vacuum suction nozzle provided in the electronic component mounting machine, and are then transported as they are. Mounted in place. At this time, the position of the chip-shaped electronic component is measured by irradiating light, and the reflected light reflected by the chip-shaped electronic component is received by a CCD camera, and the chip-shaped electronic component is received by an image analyzer. This is done by analyzing the shape and position of the electrode.

  For example, in Patent Document 1, ceramics having excellent wear resistance are used at the tip of a suction nozzle that sucks a chip component, and when the tip of such a suction nozzle is photographed with a camera, the tip part of the suction nozzle is better than the chip component. It is disclosed that the position of a chip component is detected by configuring with a low image input level color (dark color, for example, a black ceramic color).

Japanese Patent Laid-Open No. 2-90700

  However, in recent years, there are more and more circuit boards and electronic components to be mounted on them in the process of moving the vacuum suction nozzle at high speed to pick up electronic components on the tray and moving the electronic components to the circuit board as they are for mounting. Since the number of electronic components to be mounted tends to increase in size, it is necessary to reduce the time for the vacuum suction nozzle to pick up the electronic components and place them on the mounting position of the circuit board. Yes. Further, there is a case where it is difficult to distinguish the reflected light from the suction surface of the vacuum suction nozzle and the reflected light from the object to be adsorbed, and there is room for improvement in that the position of the object to be adsorbed can be easily detected.

  Therefore, according to the present invention, when the object to be adsorbed is vacuum-adsorbed to the tip and transferred, the position of the object to be adsorbed and the fall are small, and the time for removing the object to be adsorbed from the adsorption surface at the transfer destination is shortened. Furthermore, an object of the present invention is to provide an empty suction nozzle that can easily detect the position of an object to be adsorbed and has improved mounting accuracy and moving efficiency.

The vacuum suction nozzle of the present invention is a vacuum suction nozzle having a suction surface for vacuum-sucking an object to be sucked at the tip, the suction surface having a plurality of grooves, and in a roughness curve in a specific direction. The maximum cross-sectional height Rt of the roughness curve described in JIS B 0601 (2001) is 0.18 μm or more and 0.4 μm or less, and the average length Rsm of the contour curve element is 0.01 mm or more and 0.08 mm or less. To do.

  The vacuum suction nozzle of the present invention is characterized in that, in the above configuration, the suction surface has an arithmetic average roughness Ra in a specific direction of 0.02 μm or more and 0.06 μm or less.

Moreover, the vacuum suction nozzle of the present invention is characterized in that, in each of the above configurations, the suction surface is made of ceramics.

  Furthermore, the vacuum suction nozzle of the present invention, in the above-described configuration, contains an additive containing a metal oxide whose main component of the ceramic is a zirconia containing a stabilizer and whose hardness is lower than that of the main component. It is characterized by this.

  Furthermore, the vacuum suction nozzle of the present invention is characterized in that, in the above configuration, the metal oxide contains at least iron oxide.

  Furthermore, the vacuum suction nozzle of the present invention is characterized in that, in the above configuration, the surface area per unit area of the suction surface on which the iron oxide is vacuum-sucked is 20% or more and 40% or less.

  Furthermore, the vacuum suction nozzle of the present invention is characterized in that, in the above configuration, the maximum crystal grain size of the iron oxide is 2 μm or more and 9 μm or less.

  According to the vacuum suction nozzle of the present invention, a vacuum suction nozzle having a suction surface for vacuum-sucking an object to be adsorbed at the tip, and the suction surface has a plurality of grooves. A slight air leak occurs through the groove between the object to be adsorbed and the adsorption surface of the vacuum adsorption nozzle when vacuum adsorption is performed, so abrupt adsorption occurs when the vacuum adsorption nozzle approaches the object to be adsorbed. It is difficult to prevent the position of the object to be adsorbed from shifting. In addition, when the object to be adsorbed is detached from the adsorption surface, there is no sticking due to vacuum, so there is less failure to remove the object to be adsorbed, the time can be shortened, and the response operation is quick, improving mounting accuracy and transfer efficiency. be able to.

Moreover, since the maximum cross-sectional height Rt of the roughness curve described in JIS B 0601 (2001) in the roughness curve in a specific direction is 0.18 μm or more and 0.4 μm or less, the adsorption surface has light irradiated on the adsorption surface. Can be diffusely reflected or, in some cases, reflected in a direction different from the direction of the CCD camera. This makes it easy to distinguish between the reflected light from the suction surface of the vacuum suction nozzle and the reflected light from the object to be attracted, so that the position can be easily detected and the mounting accuracy is improved.

An example of a structure when the vacuum suction nozzle of this embodiment is assembled | attached to the holding member of an electronic component mounting machine is shown, (a) is a perspective view, (b) is a longitudinal cross-sectional view of (a). It is the schematic which shows the structure of the electronic component mounting apparatus which mounts a chip-shaped electronic component on a circuit board using the electronic component mounting machine provided with the vacuum suction nozzle of this embodiment. An example of the suction surface of the vacuum suction nozzle of this embodiment is shown, (a) is a diagram showing a case where the outer shape of the suction surface is circular, and (b) is a case where the outer shape of the suction surface is rectangular. (C) is a figure which shows the case where the external shape of an adsorption | suction surface is an ellipse shape. It is a front view which shows the method of measuring the resistance value between the front-end | tip of the vacuum suction nozzle of the vacuum suction nozzle of this embodiment, and the rear end of a flange.

  Hereinafter, an example of this embodiment will be described.

  FIG. 1 shows an example of a configuration when the vacuum suction nozzle of this embodiment is assembled to a holding member of an electronic component mounting machine, (a) is a perspective view, and (b) is a longitudinal sectional view of (a). is there.

The vacuum suction nozzle assembly 7 shown in FIG. 1 has a suction surface 2 for sucking and holding an electronic component (not shown) as an object to be suctioned by the vacuum suction nozzle 1 by vacuum suction. A cylindrical portion 5 provided on the side, and a tapered portion provided toward the cylindrical portion 5 on the side facing the suction surface 2 of the cylindrical portion 5, and a root portion facing the suction surface 2 of the cone portion 4. It is the structure which has the head 6 provided in the end surface side. An inner hole that penetrates the cylindrical portion 5 and opens to the suction surface 2 extends to the conical portion 4 and the head 6 and opens on the surface of the head 6 to form the suction hole 3.

  The holding member 10 having a receiving portion 11 fitted to the head 6 of the vacuum suction nozzle 1 and having the suction hole 12 so as to communicate with the suction hole 3 is provided in the head 6 of the vacuum suction nozzle 1. The vacuum suction nozzle 1 is attached to an electronic component mounting machine (not shown) via the holding member 10.

  Next, FIG. 2 schematically shows a configuration of an electronic component mounting apparatus for mounting a chip-shaped electronic component on a circuit board using the electronic component mounting machine including the vacuum suction nozzle 1 of the present embodiment.

  The electronic component mounting apparatus 20 shown in FIG. 2 is directed toward the vacuum suction nozzle 1 provided in the electronic component mounting machine 14, the tray 16 in which the electronic components 15 are arranged, and the electronic component 15 sucked by the vacuum suction nozzle 1. , A CCD camera 18 for receiving the reflected light of the light 17, and an image analysis device 19 for processing the reflected light (image) received by the CCD camera 18.

  In the electronic component mounting apparatus 20, when the vacuum suction nozzle 1 moves to the tray 16 and sucks the electronic components 15 arranged on the tray 16, the light 17 moves to the electronic component 15 sucked by the vacuum suction nozzle 1. The CCD camera 18 receives the reflected light that is reflected when the light hits the body or electrode of the electronic component 15, and the position of the electronic component 15 is detected by the image analyzer 19 based on the image received by the CCD camera 18. The vacuum suction nozzle 1 that sucks the electronic component 15 is moved to a predetermined position on the circuit board (not shown) based on the data, and the electronic component 15 is mounted on the surface of the circuit board. is there.

The vacuum suction nozzle 1 of the present embodiment is a vacuum suction nozzle 1 having a suction surface 2 that vacuum-sucks an object to be adsorbed at the tip, and the suction surface 2 is a JIS roughness curve in a specific direction.
It is important that the maximum section height Rt of the roughness curve described in B 0601 (2001) is 0.18 μm or more and 0.4 μm or less, and the average length Rsm of the contour curve elements is 0.01 mm or more and 0.08 mm or less.

  In the present embodiment, the suction surface 2 has a plurality of grooves, and these grooves are arranged in parallel or substantially in parallel. Note that “substantially parallel” means that the grooves do not intersect each other on the suction surface. And as a specific direction, the direction orthogonal to this groove | channel is meant, and it is following consent. The specific direction is not limited to the direction orthogonal to the groove, and can be set arbitrarily.

  FIG. 3 shows an example of the suction surface of the vacuum suction nozzle of the present embodiment. FIG. 3A is a view showing a case where the outer shape of the suction surface is circular. FIG. 3B is a diagram showing the outer shape of the suction surface being rectangular. (C) is a figure which shows the case where the external shape of an adsorption | suction surface is an ellipse shape.

As shown in FIGS. 3A to 3C, the vacuum suction nozzle 1 has a plurality of grooves 8 arranged substantially in parallel on the suction surface 2 for vacuum-sucking an object to be sucked. 3 (a) to 3 (c), when the object to be adsorbed is vacuum-sucked, a slight gap is formed between the object to be adsorbed and the suction surface 2 of the vacuum suction nozzle 1 via the groove 8. As a result, air flows in from the gap, and therefore, when the vacuum suction nozzle 1 approaches the object to be adsorbed, abrupt adsorption does not occur and the position shift of the object to be adsorbed can be suppressed. Further, when the object to be adsorbed departs from the adsorption surface 2, sticking due to vacuum is reduced, so that the vacuum adsorbing nozzle 1 moves to the tray 16 without desorbing the object to be adsorbed (hereinafter referred to as “detachment failure”). ) Is less likely to occur, and the time required for detachment can be shortened and the response operation is fast, so that mounting accuracy and transfer efficiency can be improved.

Further, the suction surface 2 has a maximum cross-sectional height Rt of a roughness curve described in JIS B 0601 (2001) in a roughness curve in a direction orthogonal to the groove 8 (specific direction) in a range from 0.18 μm to 0.4 μm. For example, if the cross-sectional shape of the groove 8 on the suction surface 2 is wavy, the light irradiated on the suction surface 2 on the surface of the groove 8 is diffusely reflected, or in some cases, the direction of the CCD camera. It can also be reflected in different directions. At this time, the reflected light from the suction surface of the vacuum suction nozzle and the reflected light from the object to be sucked can be easily distinguished, so that the position can be easily detected and the mounting accuracy is improved.

In particular, when the maximum cross-sectional height Rt of the roughness curve in the direction perpendicular to the groove 8 is 0.18 μm or more and 0.4 μm or less, an appropriate inflow of air from the groove 8 occurs when the object to be adsorbed is vacuum-adsorbed. Therefore, the position shift can be suppressed by abrupt suction, and the strength of the suction is not greatly reduced. Therefore, the object to be adsorbed is less dropped during the transfer, and the time taken to remove the object to be adsorbed from the adsorption surface 2 at the transfer destination can be shortened, so that mounting accuracy and transfer efficiency are improved.

If the maximum cross-sectional height Rt is less than 0.18 μm, the inflow of air from the groove 8 is reduced, so that it is necessary to pay attention to misalignment at the time of adsorption, and sticking to the adsorption surface 2 at the transfer destination. Since sticking tends to occur, it becomes easy to cause a defect in the detachment of the object to be adsorbed, and it takes time to detach the object to be adsorbed. Conversely, when the maximum cross-sectional height Rt exceeds 0.4 μm, the inflow of air from the groove 8 increases and the force for adsorbing the object to be adsorbed tends to decrease.

  Furthermore, since the average length Rsm of the contour curve element in the roughness curve in the direction orthogonal to the groove 8 is set to 0.01 mm or more and 0.08 mm or less, for example, for mounting the electronic component 15 on the mounting position of the circuit board. When analyzing the position detection image, the reflected light from the suction surface 2 of the surrounding vacuum suction nozzle 1 is reflected in a direction different from the reflected light from the electronic component even if the electronic component 15 is irradiated with light. The reflected light can be distinguished from the reflected light of the electronic component 15, the position can be easily detected, and the mounting accuracy is improved.

  When the average length Rsm of the contour curve element exceeds 0.08 mm, irregular reflection is reduced on the suction surface 2 and it is difficult to distinguish the reflected light from the suction surface 2 and the reflected light from the electronic component 15. Therefore, the position detection tends to be difficult. On the contrary, when the average length Rsm of the contour curve element is less than 0.01 mm, the interval between the grooves 8 becomes small, so that irregular reflection on the suction surface 2 increases, and the brightness of the suction surface 2 increases, and the electronic component 15 increases. Tends to be difficult to distinguish from the reflected light.

  The plurality of grooves 8 arranged substantially in parallel on the suction surface 2 may be formed in any direction on the surface of the suction surface 2. For example, the electronic component mounting apparatus 20 shown in FIG. When the vacuum suction nozzle 1 of the present embodiment is used in such an apparatus, the amount of reflected light received by the CCD camera 18 is not increased when the light irradiated from the light 17 is reflected by the suction surface 2. Therefore, it is preferable to attach the vacuum suction nozzle 1 to the electronic component mounting device 20 so that the light irradiated from the light 17 strikes the row-shaped grooves 8 formed on the suction surface 2 as vertically as possible.

  From this point, the vacuum suction nozzle 1 of the electronic component mounting apparatus 20 moves in the direction of the arrow in FIG. 2, but the suction surface 2 has a shape such as a rectangle or an ellipse instead of a circle or rectangle. In the case where the length is short or long, the vacuum suction nozzle 1 is often mounted so that the moving direction thereof is perpendicular to the longitudinal direction of the shape. As shown in 3 (b) and (c), it is preferable to form it parallel to the longitudinal direction of the shape of the suction surface 2.

  Further, the suction surface 2 of the vacuum suction nozzle 1 preferably has an arithmetic average roughness Ra in a direction orthogonal to the groove 8 of 0.02 μm or more and 0.06 μm or less.

  According to the vacuum suction nozzle 1 of the present embodiment, when the suction surface 2 has an arithmetic average roughness Ra in a direction orthogonal to the groove 8 of 0.02 μm or more and 0.06 μm or less, the suction surface 2 on the surface of the groove 8. It is possible to diffusely irradiate the light applied to the lens, or in some cases, to reflect in a direction different from the direction of the CCD camera. Therefore, the reflected light from the object to be attracted and the reflected light from the attracting surface 2 can be easily distinguished, and the position can be easily detected, so that the mounting accuracy is improved. In addition, when the object to be adsorbed is vacuum-adsorbed, there is an appropriate inflow of outside air from the groove 8, so that the displacement can be suppressed and the strength of adsorption is not greatly reduced. Accordingly, the object to be adsorbed during transfer is less dropped and the time for removing the object to be adsorbed from the adsorption surface 2 at the transfer destination can be shortened, so that the mounting accuracy and the transfer efficiency are improved.

  When the arithmetic average roughness Ra is 0.02 μm or less, the inflow of air from the groove 8 is reduced, so that the position shift is likely to occur when the object to be adsorbed is adsorbed, and the adsorbing surface at the transfer destination. The time for removing the object to be adsorbed from 2 becomes longer. On the other hand, if the arithmetic average roughness Ra exceeds 0.06 μm, the inflow of air from the groove 8 increases, so that the force to adsorb the object to be adsorbed is reduced and the object to be adsorbed is transferred when it is transferred. Sometimes things fall down.

Note that the maximum cross-sectional height Rt, the average length Rsm of the contour curve element, and the arithmetic average roughness Ra in the roughness curve in the direction orthogonal to the groove 8 of the suction surface 2 are based on JIS B 0601 (2001). The measurement length and cut-off value were 4.8 mm and 0.8 mm, the stylus diameter was 5 μm, the stylus scanning speed was set to 0.5 mm / second, and the measurement was performed. The average value of the points.

  Moreover, it is preferable that the vacuum suction nozzle 1 comprises the suction surface 2 from ceramics. If the adsorption surface 2 is made of ceramics, for example, even if the electronic component 15 is repeatedly used as an object to be adsorbed, the adsorption surface 2 can be prevented from being worn or damaged at an early stage. As such ceramics, for example, alumina ceramics, zirconia ceramics, or silicon nitride ceramics can be suitably used. If the vacuum suction nozzle 1 as a whole, not limited to the suction surface 2, is made of ceramics, it is more effective for reducing wear and breakage.

  Furthermore, it is preferable that the ceramic used for the vacuum suction nozzle 1 of the present embodiment includes a conductivity imparting agent.

  If the ceramic used for the vacuum suction nozzle 1 contains a conductivity-imparting agent, even if it is a single insulating ceramic, the vacuum suction nozzle has a desired appropriate resistance value by including the conductivity-imparting agent. 1 can be produced.

When the vacuum suction nozzle 1 of this embodiment has semiconductivity, for example, if the resistance value between the front end and the rear end of the vacuum suction nozzle 1 is set to 10 ³ to 10 ¹¹ Ω, the vacuum suction nozzle 1 Since the static electricity can be grounded (static elimination) through the holding member 10 and the electronic component mounting machine 20 even if the motor moves at high speed and is charged by static electricity generated by friction with air, the surrounding electrons are removed from the vacuum suction nozzle 1. It can be suppressed that static electricity is rapidly discharged to the component 15 or the like and the surrounding electronic component 15 is damaged by discharge. Even when the vacuum suction nozzle 1 approaches the electronic component 15, since the static electricity of the vacuum suction nozzle 1 has been neutralized, the phenomenon that the electronic component 15 blows off due to the repulsive force of static electricity can be suppressed. If this resistance value is less than 10 ³ Ω, if the static electricity is charged in the parts around the vacuum suction nozzle 1, it is easy to be discharged from them, and the adsorbed electronic parts 15 are electrostatically destroyed. There is a risk of problems. Further, if it exceeds 10 ¹¹ Ω, it becomes easy to charge static electricity generated in the vacuum suction nozzle 1, and when the vacuum suction nozzle 1 approaches the electronic component 15, the phenomenon that the electronic component 15 blows off due to the repulsive force of static electricity may occur. There is a risk of becoming.

  Here, FIG. 4 is a front view showing a method of measuring the resistance value between the front end and the rear end of the vacuum suction nozzle 1, and one electrode 60 is brought into contact with the suction surface 2 which is the front end of the vacuum suction nozzle 1. The other electrode 60 is shown in contact with the end face of the head 6 as the rear end. These electrodes 60 and 60 are connected to an electric resistance measuring device (not shown), and an arbitrary voltage is applied between the front and rear electrodes 60 and 60 of the vacuum suction nozzle 1 to perform vacuum suction. What is necessary is just to measure the resistance value between the front-end | tip of the nozzle 1, and a rear end. The voltage applied at the time of measurement may be set in accordance with the shape, material and resistance value of the vacuum suction nozzle 1, and there is no problem as long as it is in the range of about 10 to 1500V.

  As such semiconductive ceramics, for example, alumina ceramics is an insulating ceramic, but it has a feature that it is inexpensive and has excellent wear resistance, and a conductivity imparting material such as titanium carbide or titanium nitride is used. If it is added, it will have appropriate conductivity, and by using this, it is possible to produce a vacuum suction nozzle 1 that has excellent wear resistance and also has appropriate conductivity. Similarly, zirconia ceramics is a high-strength material. By adding a conductivity-imparting material such as iron oxide, titanium oxide, or zinc oxide, it has moderate conductivity. However, it is difficult to break, and the vacuum suction nozzle 1 having appropriate conductivity can be produced. Moreover, the silicon carbide ceramics can produce the vacuum suction nozzle 1 which adjusted the resistance value by adding carbon.

  Furthermore, the ceramic used for the vacuum suction nozzle 1 of the present embodiment is preferably a black ceramic.

  When black ceramics are used for the vacuum suction nozzle 1, when the electronic component 15 sucked by the vacuum suction nozzle 1 is irradiated with the light 17 and photographed with the CCD camera 18, the electronic component 15 is clearly reflected by the reflected light of the light 17. As shown, the background of the electronic component 15 becomes dark because the vacuum suction nozzle 1 is made of black ceramics, and the outline of the electronic component 15 becomes clear. For this reason, the image analysis device 19 can easily recognize the shape of the electronic component 15 sucked by the vacuum suction nozzle 1, so that there is an advantage that the mounting accuracy when mounting on the circuit board is improved.

  Examples of black ceramics include zirconia, alumina, and silicon carbide to which a black conductivity imparting material is added. Further, even with ceramics having other color tones such as brown and blue, the same effects as black ceramics can be obtained by making the color tone darker.

  For example, as a conductivity imparting material that can be used as a dark color tone that is black or brown or blue added to alumina ceramics, iron oxide, nickel oxide, titanium carbide, titanium nitride and the like can be mentioned. Iron oxide and titanium carbide are preferable as the conductivity imparting material from which black ceramics can be obtained. Examples of the conductivity imparting material that can be used as a dark color tone added to zirconia ceramics, such as black, brown or blue, include iron oxide, titanium oxide, cobalt oxide, chromium oxide, nickel oxide, Among these, iron oxide is preferable as a conductivity imparting material from which black ceramics can be obtained. As the silicon carbide ceramics, those containing carbon and imparting conductivity are preferable as the black ceramics.

  Moreover, it is preferable that the vacuum suction nozzle 1 contains an additive containing a metal oxide whose main component of ceramics is zirconia containing a stabilizer and whose hardness is lower than that of the main component.

  The reason why it is preferable to use zirconia ceramics containing a stabilizer for the ceramics used in the vacuum suction nozzle 1 is that the mechanical strength as ceramics is high. In particular, in the case of the vacuum suction nozzle 1 having a cylindrical portion 5 and having a small diameter as in the vacuum suction nozzle 1 shown in FIG. When the 15 is mounted on the substrate, the adjacent part and the tip of the vacuum suction nozzle 1 are in contact with each other, so that the cylindrical portion 5 is easily damaged. Therefore, it is preferable to use zirconia ceramics having high mechanical strength as ceramics. As the stabilizer contained in the zirconia ceramics at this time, yttria, ceria, magnesia, etc. may be used. If these stabilizers are contained in an amount of about 2 to 8 mol%, zirconia having sufficient mechanical strength in practical use. Become ceramics. The average crystal particle diameter of zirconia is preferably 3 μm or less. By making the average crystal particle diameter of zirconia 3 μm or less, the crystal particles are less likely to fall off when grinding or mirror-finishing the suction surface 2 when the vacuum suction nozzle 1 is manufactured or repaired. Chipping is less likely to occur on the suction surface 2.

Further, even when the suction surface 2 has a small vacuum suction nozzle 1 of 0.7 mm or less, the suction surface of the vacuum suction nozzle 1 is mounted when the electronic component 15 that is an object to be sucked is mounted on the circuit board. It is possible to suppress the occurrence of a problem that a part of 2 is damaged due to contact with an electronic component that has been previously mounted or a component that has been mounted around.

  In the vacuum suction nozzle 1, it is preferable that the metal oxide as the additive contains at least iron oxide. When the ceramic containing zirconia as a main component contains at least iron oxide as a metal oxide, a desired resistance value can be easily obtained even by firing in an air atmosphere. Further, since iron oxide has a lower hardness than the main component zirconia, the workability is improved when the groove 8 is formed on the suction surface 2 of the vacuum suction nozzle 1 after firing by grinding or polishing, so that a desired groove is obtained. Can be produced.

The content of the metal oxide is particularly preferably 10 to 40% by mass, and all of it may be iron oxide, but in addition to iron oxide, at least cobalt oxide, chromium oxide, nickel oxide, and titanium oxide. One type may be included. That is, when the metal oxide as an additive contains at least iron oxide, the ceramic mainly composed of zirconia becomes semiconductive, and a more preferable black color tone can be obtained. Further, since the hardness is lower than that of zirconia, the workability of the groove 8 by grinding or polishing of the suction surface 2 after firing is improved. Moreover, when titanium oxide is contained in addition to iron oxide, impurities contained in iron oxide or zirconia and titanium oxide form a compound, and this compound suppresses the grain growth of iron oxide. The mechanical strength of the ceramic as the main component can be improved. The titanium oxide content is more preferably 0.5 to 1%. If the content of titanium oxide is less than 0.5%, the effect of suppressing the grain growth of iron oxide is small, and 1
This is because the color tone of ceramics containing zirconia as a main component tends to be slightly thin when it exceeds 50%.

Thus, if the content of the metal oxide containing iron oxide is in the range of 10 to 40% by mass, the resistance value between the front and rear ends of the vacuum suction nozzle 1 is 10 ⁵ to 10 ⁹ Ω. Due to the semiconductive nature of the range, it becomes difficult for static electricity to be generated on the vacuum suction nozzle 1, and when the vacuum suction nozzle 1 approaches the electronic component 15, the electronic component 15 blows off due to the repulsive force of static electricity, or charged static electricity It is possible to reduce the occurrence of the problem that the electronic component 15 adsorbed by the electric discharge is instantaneously destroyed by electrostatic discharge. Further, if the content of the metal oxide containing at least iron oxide is in the range of 10 to 40% by mass, the color tone is preferable to those in the range where the content of the metal oxide is less than 10% by mass, and at least Since the content of zirconia, which is the main component, is relatively larger than that in which the content of the metal oxide containing iron oxide is in a range larger than 40% by mass, the mechanical strength tends to increase, which is preferable.

Moreover, it is preferable that the vacuum suction nozzle 1 has an area per unit area of iron oxide of the suction surface 2 to be vacuum-sucked in a range of 20% to 40%. When the suction surface 2 of the vacuum suction nozzle 1 containing iron oxide in the main component zirconia and fired is black, and the area of iron oxide per unit area is 20% or more, when the suction surface 2 is irradiated with light When the electronic component 15 is adsorbed on the adsorption surface 2, the main body (not shown) of the electronic component 15 is a white ceramic or electrode. In many cases, gold plating or silver plating (not shown) is applied, and since these have a lot of reflected light and the luminance exceeds 100, the image analysis device 19 performs image processing to distinguish between the suction surface 2 and the electronic component 15. Easy position detection. If the iron oxide area per unit area is 40% or less, the iron oxide on the surface of the suction surface 2 is formed when the grooves 8 are formed on the suction surface 2 of the vacuum suction nozzle 1 after firing by grinding or polishing. Accordingly, the surface of the suction surface 2 is not easily roughened due to an increase in surface roughness (for example, Rt) due to abnormal degranulation. When vacuum-sucking and transporting, air hardly leaks from the suction surface 2, and the electronic component 15 is not easily dropped.

  The vacuum suction nozzle 1 preferably has a maximum crystal grain size of iron oxide on the suction surface 2 for vacuum suction of 2 μm or more and 9 μm or less. If the maximum crystal grain size of the iron oxide is 2 μm or more, the iron oxide particles on the surface of the suction surface 2 are moderately formed when the grooves 8 are formed on the suction surface 2 of the vacuum suction nozzle 1 after firing by grinding or polishing. Thus, the groove 8 is formed by graining, so that the workability is improved and the desired groove 8 can be produced. Further, if the maximum crystal grain size of iron oxide is 9 μm or less, when the groove 8 is formed by grinding or polishing, the surface roughness (for example, Rt) increases due to abnormal grain removal, so Since the surface state does not easily become rough, when the electronic component 15 is vacuum-sucked and transported, air hardly leaks from the suction surface 2 and the electronic component 15 is not easily dropped.

  Next, a method for manufacturing the ceramic vacuum suction nozzle 1 of the present embodiment will be described.

  As ceramics which comprise the vacuum suction nozzle 1 of this invention, well-known materials, such as silicon carbide, an alumina, and the zirconia containing a stabilizer, can be used.

  For example, a raw material in which 95% by mass of silicon carbide and 5% by mass of alumina as a sintering aid are mixed into a ball mill and pulverized to a predetermined particle size to produce a slurry, which is then spray dried using a spray dryer To form granules.

  Next, if the kneaded material obtained by putting the granules and the thermoplastic resin into a kneader and kneading while heating is put into a pelletizer, pellets as a raw material for injection molding (injection molding) can be obtained. it can. In addition, as a thermoplastic resin thrown into the kneader, an ethylene vinyl acetate copolymer, polystyrene, an acrylic resin, or the like may be added in an amount of about 10 to 25% by mass with respect to the mass of the ceramic. The heating temperature may be set to 140 to 180 ° C. The kneading conditions may be appropriately set according to the type and particle size of ceramics and the type of thermoplastic resin.

  And if the obtained pellet is thrown into an injection molding machine (injection molding machine) and injection molded, a molded body to be the vacuum suction nozzle 1 is obtained. At this time, since the obtained molded body is usually accompanied by a runner in which extra raw materials obtained by injection molding are cooled and solidified, it is cut before degreasing.

  The silicon carbide may be fired in a vacuum atmosphere or in an inert gas atmosphere such as argon or helium. The maximum temperature is 1900-2200 ° C., and the holding time at the maximum temperature is 1-5 hours. That's fine.

  Furthermore, in the case where zirconia ceramics, alumina ceramics and the like containing a stabilizer are used as the ceramics constituting the vacuum suction nozzle 1 of the present embodiment, as the conductivity imparting material, iron oxide, cobalt oxide, chromium oxide and It is possible to use at least one kind of nickel oxide, titanium carbide, titanium nitride, or titanium oxide. Moreover, it is preferable that at least iron oxide is included as the conductivity imparting material.

  For example, zirconia containing yttria as a stabilizer is mixed in an amount of 35% by mass with 65% by mass of iron oxide, and this raw material is put into a ball mill and pulverized to a predetermined particle size to produce a slurry. If a granule is formed by spray-drying using a dryer, and then injected into an injection molding machine and injection-molded by the same method as described above, a molded body to be the vacuum suction nozzle 1 is obtained.

  In addition, in order to obtain the shape of the vacuum suction nozzle 1 of the present embodiment, a molding die capable of obtaining the shape of the vacuum suction nozzle 1 is produced based on a general injection molding method, and this is installed in an injection molding machine. Injection molding. Thereby, the vacuum suction nozzle 1 having a desired shape can be easily obtained.

  Here, as the firing conditions of zirconia ceramics and alumina ceramics, when the conductivity imparting material contains at least one of iron oxide, cobalt oxide, chromium oxide, nickel oxide and titanium oxide, or the conductivity imparting material has at least iron oxide. In the case where it contains, the maximum temperature may be set in the range of 1300 to 1500 ° C. by firing in the air atmosphere, and the holding time at the maximum temperature may be 1 to 5 hours. When the conductivity imparting material is titanium carbide, the maximum temperature is in the range of 1400 to 1800 ° C., the holding time at the maximum temperature is 1 to 5 hours, in a vacuum atmosphere or an inert gas atmosphere such as argon. Can be fired. Further, when the conductivity imparting material is titanium nitride, in addition to the vacuum atmosphere or the inert atmosphere, firing may be performed in a nitrogen gas atmosphere. Thereby, moderate electroconductivity can be provided to the vacuum suction nozzle 1 made of ceramics.

  Moreover, as a method for controlling the area ratio of iron oxide in the unit area of the adsorption surface 2, the sintered body can be adjusted by adjusting the content of iron oxide or by adjusting the maximum temperature during firing and the holding time at the maximum temperature. The amount of iron oxide deposited on the surface layer can be controlled. It should be noted that the amount of iron oxide deposited on the surface layer of the sintered body can be further controlled by adjusting the temperature lowering time during firing. Furthermore, if the content of iron oxide is excessively increased, the mechanical strength may be lowered. Therefore, the iron oxide content per unit area of the adsorption surface 2 while keeping the content of iron oxide within a certain range. To increase the maximum temperature, it is most effective to increase the maximum temperature and extend the holding time.

  Further, the maximum crystal grain size of iron oxide can be controlled by the maximum temperature of firing and the holding time of the maximum temperature. In order to increase the maximum crystal grain size of iron oxide, by increasing the maximum temperature or lengthening the holding time, grain growth of the iron oxide crystal is promoted and the maximum crystal grain size can be increased. If you want to keep the maximum grain size of iron oxide small, reduce the maximum temperature and holding time of firing to suppress grain growth of iron oxide, or add titanium oxide to zirconia. Combined with the contained impurities, the grain growth of iron oxide can be suppressed.

In this embodiment, iron oxide is Fe ₂ O ₃ , chromium oxide is Cr ₂ O ₃ , cobalt oxide is CoO, nickel oxide is NiO, and titanium oxide is TiO _2. It doesn't matter if it exists.

In addition, the vacuum suction nozzle 1 after firing is polished by barrel processing or the like so that the conductivity of the surface of the ceramic is not lower than the inside or does not vary and become unstable. You may keep it.

  And as a method of producing the groove | channel 8 substantially parallel to each other in the suction surface 2 of a vacuum suction nozzle, the method of processing the suction surface 2 using a surface grinder should just be employ | adopted.

  Hereinafter, examples of the present embodiment will be described.

As the main component of the ceramic, zirconia containing 3 mol% of yttria was selected as a stabilizer, and iron oxide, chromium oxide and titanium oxide were added to the total amount of the ceramic, respectively. Weighed to be 1 and 2. And the sample No. in Table 1 Water was added to the raw materials 1 and 2 and pulverized and mixed with a ball mill to prepare slurries. These slurries were spray-dried using a spray dryer to prepare granules. Then, a total of 20 parts by mass of ethylene vinyl acetate copolymer, polystyrene and acrylic resin was added to 100 parts by mass of these granules, and the mixture was put into a kneader and kneaded while maintaining a temperature of about 150 ° C. to prepare a clay. . Next, the obtained kneaded material was put into a pelletizer to produce pellets as raw materials for injection molding. Then, the pellets were put into a known injection molding machine, and molded bodies to be the vacuum suction nozzle 1 and the flange (holding member) 10 shown in FIG.

  And after putting this molded object into a drier and drying it, the maximum temperature was made into the range of 1400 +/- 50 degreeC in the atmospheric atmosphere which is an oxidizing atmosphere, and the holding time in the maximum temperature was baked for 1 to 5 hours, respectively. A sintered body was obtained.

Then, with respect to the obtained sintered body, grooves arranged substantially parallel to the suction surface 2 as shown in FIG. 3A are formed in the cylindrical portion 5 of the vacuum suction nozzle 1 serving as the suction surface 2. 8 using an MSG-612 CNC type surface grinder manufactured by Mitsui High-Tech Co., Ltd., with a grinding wheel count of # 400 to # 1500, a grinding stone feed speed of 50 to 300 mm / min, and a cutting depth of the grinding stone of 1 to 5 μm Each sample of a vacuum suction nozzle as shown in Table 2 was produced.

  Next, regarding the obtained sintered body of the vacuum suction nozzle 1, the maximum cross-sectional height Rt of the roughness curve of the suction surface 2 and the average length Rsm of the contour curve element, the occurrence rate of misalignment during suction, and suction The relationship between the incidence of falling during transportation, the rate of separation failure during release of suction, and reflected light was investigated.

Note that the maximum cross-sectional height Rt and the average length Rsm of the contour curve elements in the roughness curve in the direction orthogonal to the groove 8 of the suction surface 2 of the vacuum suction nozzle 1 are the same as when each sample was produced. Then, a measurement sample having an outer size of 10 mm × 10 mm and a thickness of 0.5 mm was separately prepared and measured. As a measuring instrument at this time, a TalySurf S4C type surface roughness measuring instrument manufactured by Taylor Hobson was used, and the measurement was performed according to JIS B 0601 (2001). At this time, the measurement length and cut-off value are 4.8 mm and 0.8 mm, the stylus diameter is 5 μm, the scanning speed of the stylus is set to 0.5 mm / second, and the groove is the direction of the grinding groove of the measurement sample. Measured perpendicular to 8. The number of measurements was 10 and the measurement result was the average value.

  The vacuum suction nozzle assembly 7 assembled with the vacuum suction nozzle 1 and the flange 10 is mounted on the electronic component mounting machine 14 and operated to vacuum the 0603 type electronic component 15 (dimension 0.6 mm × 0.3 mm). An adsorption test was performed, the rate of occurrence of misalignment at the time of adsorption of the electronic component 15, the rate of occurrence of dropping at the time of conveyance, and the electronic component 15 were carried to the mounting position. The rate of occurrence of so-called separation failure that returned to the position of was examined by repeating 100,000 times of each sample.

  For the reflected light from the suction surface 2, the amount of reflected light was compared by measuring the luminance.

The brightness measurement of the suction surface 2 of the vacuum suction nozzle 1 is set using a white LED having a wavelength of 400 to 750 nm as a light source so that the distance from the suction surface 2 is 20 to 40 mm and the irradiation angle is 45 °. Furthermore, a general-purpose CCD camera (double speed black and white camera model CV-020 manufactured by KEYENCE) was set facing the vacuum suction nozzle 1 and image processing was performed with 256 gradations to calculate the luminance value. The number of measurements was 10 and the measurement result was the average value.

  The obtained results are shown in Tables 1 and 2.

From the results shown in Table 2, the sample No. 2 is outside the scope of the present embodiment and the state of the suction surface 2 is a mirror surface. In the case of 1-1, 2-1, there is no appropriate air inflow from the groove 8, the occurrence rate of misalignment and the occurrence of separation failure at the time of suction of the electronic component 15 are as high as 3%, and the suction surface The reflected light from 2 increased and the brightness became very high. In addition, the sample No. 1 in which the maximum cross-sectional height Rt in the roughness curve in the direction orthogonal to the groove 8 of the suction surface 2 is less than 0.18 μm. In 1-2 and 2-2, since the inflow of air from the groove 8 is reduced, the rate of occurrence of misalignment when adsorbed and the rate of occurrence of defective separation from the transfer destination are both slightly 0.05%. it was high. In addition, the sample No. in which the maximum cross-sectional height Rt of the roughness curve of the adsorption surface 2 exceeds 0.4 μm. In 1-6 and 2-6, since the inflow of air from the groove 8 increased and the adsorbing force decreased, the drop occurrence rate of the electronic component 15 was slightly increased to 0.5%. In addition, the sample No. 2 in which the average length Rsm of the contour curve element in the roughness curve in the direction orthogonal to the groove 8 of the suction surface 2 is less than 0.01 mm. In 1-7 and 2-7, since the luminance was slightly higher than 100, it can be seen that the reflected light from the suction surface 2 increased. In addition, the sample No. in which the average length Rsm of the contour curve element exceeds 0.08 mm is used. Since the luminance of 1-10 and 2-10 is also slightly higher than 100, the reflected light from the suction surface 2 is less likely to be irregularly reflected, making it difficult to distinguish it from the reflected light from the electronic component 15. It can be seen that the position cannot be easily detected.

On the other hand, the maximum cross-sectional height Rt in the roughness curve in the direction orthogonal to the groove 8 of the suction surface 2 within the range of the present embodiment is 0.18 μm or more and 0.4 μm or less. Sample No. 2 in which the average length Rsm of the contour curve elements in the roughness curve in the direction perpendicular to the groove 8 is 0.01 mm or more and 0.08 mm or less. Since 1-3-3 to 1-5, 1-8 to 1-9, 2-3 to 2-5, 2-8 and 2-9 have an appropriate inflow of air from the groove 8, Since the occurrence rate of misalignment is 0.02% or less and the strength of adsorption of the object to be adsorbed does not drop significantly, the electronic component 15 does not fall during transfer, and the occurrence rate of separation failure from the transfer destination is 0.02% or less. It can be seen that the time taken to remove the electronic component 15 from the suction surface 2 can be shortened, so that the mounting accuracy and the transfer efficiency are improved.

Moreover, since the average length Rsm of the contour curve element in the roughness curve in the direction orthogonal to the groove 8 of the suction surface 2 is 0.01 mm or more and 0.08 mm or less, the reflected light of the light irradiated on the suction surface 2 is The brightness was less than 100 because of moderate diffuse reflection. The electronic component 15 has a high luminance if the main body is white, and even if it is black, the surroundings are provided with electrodes or leads plated with gold, nickel, silver, or the like. Often has a brightness of over 150,
Identification by the difference in luminance between the suction surface 2 and the electronic component 15 is easy, and the position of the electronic component 15 can be easily detected.

  As described above, according to the vacuum suction nozzle 1 of the present embodiment, when the object to be adsorbed is vacuum-adsorbed to the tip and transferred, the object to be adsorbed is not displaced or dropped, and the adsorbed surface 2 is moved from the transfer destination. The time for separating the object to be adsorbed can be shortened, and when the object to be adsorbed departs from the adsorption surface 2, since there is no sticking by vacuum, the occurrence of defective separation of the object to be adsorbed can be reduced, As a result, a vacuum suction nozzle with high mounting accuracy and transfer efficiency can be obtained.

  Next, the arithmetic average roughness Ra in the direction orthogonal to the groove 8 of the suction surface 2 of the vacuum suction nozzle 1 causes the electronic component 15 when the electronic component 15 is repeatedly sucked, transported and detached by the suction surface 2. The relationship with adsorption failure was investigated.

  Sample No. used in Example 1 Arithmetic average in the vertical direction with respect to the groove 8 of the suction surface 2 from the samples having the same maximum cross-sectional height Rt and average length Rsm as 1-4 and 2-4, respectively, as shown in Table 3 Select samples with roughness Ra less than 0.02 μm, 0.02 μm, 0.06 μm and 0.06 μm, and use these samples in the same manner as in Example 1 to generate the positional deviation of the adsorbed electronic component 15 Then, the incidence of fall and the rate of separation failure were investigated.

  The results are shown in Table 3.

From the results in Table 3, the sample No. whose arithmetic average roughness Ra in the direction orthogonal to the groove 8 of the adsorption surface 2 is less than 0.02 μm is obtained. In 1-4-1 and 2-4-1, the occurrence rate of misalignment and the occurrence rate of separation failure at the time of suction of the electronic component 15 were both slightly high, from 0.01 to 0.03%. However, there was little occurrence of falling. When the maximum cross-sectional height Rt of the roughness curve is 0.18 to 0.4 μm and the average length Rsm of the contour curve element is 0.01 to 0.08 mm, the groove is formed when the arithmetic average roughness Ra is less than 0.02 μm. There was little inflow of air from 8, and the occurrence of the displacement of the adsorption position and the occurrence of poor separation of the object to be adsorbed were somewhat high.

In addition, Sample No. with arithmetic average roughness Ra exceeding 0.06 μm. In 1-4-4 and 2-4-4, the position deviation of the object to be adsorbed was 0.004%, and the occurrence rate of separation failure was 0%, both of which were good results. However, 0.006% and 0.005% were slightly higher. The electronic component mounting apparatus 20 is often programmed so that a corrective action can be automatically performed when misalignment or separation failure occurs. However, if the electronic component mounting apparatus 20 falls during transfer, the electronic component mounting apparatus 20 Is automatically stopped, and it is necessary for the person to recover after removing the fallen object, and the fall occurrence rate is required to be 0%.

  Sample No. 1-4-2 and 1-4-3 and 2-4-2 and 2-4-3 had a slight occurrence rate of misalignment of 0-0.01%, but the incidence rate of drop and separation failure was None of the results were satisfactory.

  From this, it can be seen that the suction surface 2 having the grooves 8 can further reduce the occurrence of suction defects if the arithmetic average roughness Ra is in the range of 0.02 to 0.06 μm.

Next, the main component is zirconia as in Example 1, and 0 to 45% by mass of iron oxide (Fe ₂ O ₃ ) which is a metal oxide as an additive, and chromium oxide (Cr ₂ O ₃ ), cobalt oxide. The vacuum adsorption nozzle 1 containing (CoO), nickel oxide (NiO), and titanium oxide (TiO ₂ ) in the range shown in Table 4 was prepared, and the firing maximum temperature and the holding time of the maximum temperature in the atmospheric firing were changed. Thus, a vacuum suction nozzle 1 was produced.

  The amount of iron oxide deposited on the surface layer of the sintered body and the maximum crystal grain size of iron oxide are considered to correlate with increasing the maximum firing temperature and increasing the maximum temperature holding time. Therefore, firing was performed by changing the maximum temperature in the range of 1400 to 1500 ° C. and the holding time of the maximum temperature in the range of 1 to 4 hours.

Further, the obtained sintered body was polished in the same manner as in Examples 1 and 2, the maximum cross-sectional height Rt of the roughness curve in the direction perpendicular to the groove 8 on the suction surface 2 was 0.3 μm, and the average length of the contour curve elements Rsm is 0.02m
m, and a sample was prepared so that the arithmetic average roughness Ra was 0.03 μm. In order to obtain the desired roughness, the roughness of the grinding wheel can be finely adjusted by changing the dress of the grinding wheel from ordinary copper to iron, and hence the surface roughness of the suction surface 2 can be controlled. It becomes.

For the maximum crystal grain size of iron oxide, a digital camera is attached to a metal microscope, an arbitrary place is selected, and an image taken at a magnification of 200 times is image analysis software (A image kun) for an area of 1.0 x 0.8 cm square. : Asahi Kasei Engineering Co., Ltd.)

Although not shown in Table 4, three-point bending strength was also measured for reference. The composition and firing conditions are the same as those described in Table 4, and the length is 30 mm, the width is 10 mm, and the thickness is 0.8 mm.
In accordance with ISO17565: 2003 (JIS R 1601), a load of 0.5 mm / min is applied to the center of the plate-like body with a span of 20 mm until the plate-like body breaks. The maximum load was measured (not shown). For each sample, ten samples for strength measurement were prepared and measured, and the average value of the measured values was used as a reference value for the mechanical strength of each sample.

  The results are shown in Table 4.

  As can be seen from the results in Table 4, sample No. 1 containing at least iron oxide as an additive. 4-1 to 4-4, 5-1 to 5-4, 6-1 to 6-4, 7-1 to 7-7, 8, 9, 10 and 11 are samples containing no oxide as an additive. No. 3 and Sample No. having an oxide other than iron oxide as an additive. It was found that the brightness of the suction surface 2 tended to be lower than 12, and the occurrence rate of misalignment and the defect rate of separation were relatively low and good. Although not shown in Table 4, the sample No. 4-1 to 4-4, 5-1 to 5-4, 6-1 to 6-4, 7-1 to 7-7, 8, 9, 10, and 11 are directed to the adsorption surface 2 as compared with the sample No 3. The workability of the groove 8 was good.

  Further, Sample No. containing 10 to 40% by mass of a metal oxide as an additive. 4-1 to 4-4, 5-1 to 5-4, 6-1 to 6-4, 7-1 to 7-7, 9 and 10 are sample Nos. The brightness of the suction surface 2 tends to be lower than 8 and 12, and it was found that the occurrence rate of misalignment and the occurrence rate of separation failure are relatively low and good. Sample No. 4-1 to 4-4, 5-1 to 5-4, 6-1 to 6-4, 7-1 to 7-7, 9 and 10 are sample Nos. Compared to 11, the ratio of zirconia, which is the main component, was relatively large, and thus mechanical strength tended to be high.

In addition, the sample No. 1 in which the area of the iron oxide per unit area of the adsorption surface 2 is 20 to 40%. In 5-1 to 7-3 and 11, the brightness of the suction surface 2 was as good as less than 80, and the total of the occurrence rates of the suction position shift, drop, and separation failure was 0.05% or less. Further, the sample No. 1 in which the maximum crystal grain size of iron oxide is in the range of 2 to 9 μm. 4-2,4-3,5-2,5-3,7-
2,7-3,7-5,7-6 and 8 to 10 were excellent results with no occurrence of dropping.

  From this, if the iron oxide is included as a metal oxide and the area of the iron oxide per unit area of the adsorption surface 2 is 20 to 40%, the luminance of the adsorption surface 2 can be kept low, and the adsorption failure rate is also low. It can be seen that it can be lowered. Furthermore, it can be seen that the maximum crystal grain size of iron oxide should be 2 to 9 μm in order to suppress the occurrence of falling. And these manufacturing methods contain 20-40 mass% of iron oxides, the maximum temperature of baking is 1400-1460 degreeC, and the desired vacuum adsorption is adjusted by adjusting the retention time of the maximum temperature in the range of 1-3 hours. The nozzle 1 can be obtained.

  In addition, Sample No. in which the total amount of metal oxides including iron oxide is less than 10% by mass. 8 and 12, the total of misalignment and separation failure rate at the time of suction exceeds 0.05%, and the brightness is slightly high at 80. Furthermore, although not shown in the table, the workability of the groove 8 is Slightly bad result. Further, Sample No. in which the content of the metal oxide containing iron oxide exceeds 40% by mass. No. 11 was excellent in luminance and workability of the groove 8, but was not shown in the table, but the mechanical strength was low.

  Sample No. having a metal oxide content in the range of 10 to 40% by mass. In Nos. 9 and 10, the incidence of poor adsorption was low, and the brightness, the workability of the grooves 8 and the mechanical strength were all good.

  Sample No. From 8 to 10, it was found that the maximum temperature of firing was sequentially changed, but when titanium oxide was included, suppression of the maximum crystal grain size of iron oxide was working.

  From these results, it was found that the metal oxide preferably contains iron oxide, but may contain chromium oxide, cobalt oxide and nickel oxide.

Although not described in Table 4, aluminum oxide, which is a metal oxide having a hardness higher than that of zirconia ceramics, is used instead of iron oxide as an additive in the same manufacturing method as Sample No. 6-4 in Table 4. Sample X containing 30% by mass was prepared. When the workability of the groove 8 of this sample X and sample No. 6-4 was carried out, the cutting time of the groove 8 was shorter for sample No. 6-4.
It was found that processability was good.

1: Vacuum suction nozzle 2: Suction surface 3: Suction hole 4: Conical part 5: Cylindrical part 6: Head 7: Vacuum suction nozzle assembly 8: Groove
10: Holding member
11: Receiver
14: Electronic component mounting machine
15: Electronic components
16: Tray
19: Image analyzer
20: Electronic component mounting device

Claims (7)

A vacuum suction nozzle having a suction surface for vacuum-sucking an object to be adsorbed at the tip, the suction surface having a plurality of grooves, and in accordance with JIS B 0601 (2001) in a roughness curve in a specific direction. A vacuum suction nozzle characterized in that the maximum cross-sectional height Rt of the described roughness curve is 0.18 μm or more and 0.4 μm or less, and the average length Rsm of the contour curve element is 0.01 mm or more and 0.08 mm or less. . 2. The vacuum suction nozzle according to claim 1, wherein the suction surface has an arithmetic average roughness Ra in the specific direction of 0.02 μm or more and 0.06 μm or less. The vacuum suction nozzle according to claim 1, wherein the suction surface is made of ceramics. The vacuum suction nozzle according to claim 3, wherein the ceramic main component is zirconia containing a stabilizer, and an additive containing a metal oxide having a hardness lower than that of the main component is contained. . The vacuum suction nozzle according to claim 4, wherein the metal oxide includes at least iron oxide. The vacuum suction nozzle according to claim 5, wherein an area of the iron oxide per unit area of the suction surface to be vacuum-sucked is 20% or more and 40% or less. " The vacuum suction nozzle according to claim 6, wherein the maximum crystal grain size of the iron oxide is 2 μm or more and 9 μm or less.