JP2011049224A - Solid electrolytic capacitor and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solid electrolytic capacitor that is high in occupation rate of a capacitor element and high in productivity. <P>SOLUTION: In the solid electrolytic capacitor, a cathode part of a solid electrolyte type capacitor element 1 comprises a first cathode layer 14 formed on an outer peripheral surface of a dielectric layer 13 and a second cathode layer 15 formed on an outer peripheral surface of the first cathode layer 14. On the outer peripheral surface of the dielectric layer 13, an insulating layer 16 having an electric insulation property is formed in a region nearby an anode terminal 3, and the first cathode layer 14 is formed in a region different from the formation region of the insulating layer 16. Here, the insulating layer 16 is formed by electrically insulating a part of an electrolyte layer, formed on the outer peripheral surface of the dielectric layer 13, at a position nearby the anode terminal 3, and the first cathode layer 14 is formed of the remaining part of the electrolyte layer. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a solid electrolytic capacitor and a method for manufacturing the same.

  FIG. 12 is a cross-sectional view showing a conventional solid electrolytic capacitor. As shown in FIG. 12, the conventional solid electrolytic capacitor includes a solid electrolytic capacitor element (100), an anode terminal (111), and a cathode terminal (112), which are contained in an exterior resin (120). Buried. The capacitor element (100) includes a dielectric layer (103) formed on the surface of the anode body (101) in which the anode lead (102) is planted, and an electrolyte layer (104) on the dielectric layer (103). It is comprised by forming a cathode layer (105) through this.

  The anode terminal (111) and the cathode terminal (112) expose the anode terminal surface (115) and the cathode terminal surface (116) on the lower surface (120a) of the exterior resin (120), respectively. A pillow member (114) is electrically joined to the surface of the anode terminal (111) opposite to the anode terminal surface (115) by welding means such as laser welding, and the tip of the pillow member (114) The tip (102a) of the anode lead (102) of the capacitor element (100) is electrically connected to this portion. On the other hand, a part of the cathode layer (105) of the capacitor element (100) is electrically connected to the surface of the cathode terminal (112) opposite to the cathode terminal surface (116).

  As shown in FIG. 12, in the conventional solid electrolytic capacitor, in order to maintain electrical insulation between the cathode layer (105) of the capacitor element (100) and the anode terminal (111), the cathode layer (105) And the anode terminal (111) are spaced apart from each other in the direction from the anode terminal (111) to the cathode terminal (112) (see, for example, Patent Document 1). For this reason, the conventional solid electrolytic capacitor has a low occupation ratio of the capacitor element (100).

  Therefore, as shown in FIG. 13, the cathode layer (105) and the anode terminal (111) of the capacitor element (100) are arranged so that a part of them faces each other, and the cathode layer (105) and the anode terminal are arranged. A solid electrolytic capacitor has been proposed in which an insulating tape (130) having electrical insulating properties is interposed between surfaces facing (111) (see, for example, Patent Document 2).

JP 2008-91784 A JP 2001-338841 A

  However, the solid electrolytic capacitor shown in FIG. 13 has an insulating tape (130) in a region of the outer peripheral surface of the cathode layer (105) of the capacitor element (100) facing the anode terminal (111) in the manufacturing process. ) Or affixing an insulating tape (130) to a region of the surface opposite to the anode terminal surface (115) of the anode terminal (111) that faces the cathode layer (105) Was necessary. For this reason, the productivity of the solid electrolytic capacitor is reduced, and the cost is increased.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a solid electrolytic capacitor having a high occupation ratio of capacitor elements and high productivity.

A solid electrolytic capacitor according to the present invention includes a solid electrolytic capacitor element in which a dielectric layer is interposed between an anode part and a cathode part, and the cathode part of the capacitor element is formed on the outer peripheral surface of the dielectric layer. The first cathode layer and the second cathode layer formed on the outer peripheral surface of the first cathode layer, and an anode terminal is electrically connected to the anode portion of the capacitor element, A cathode terminal is electrically connected to the cathode portion.
Here, on the outer peripheral surface of the dielectric layer, an insulating layer having electrical insulation is formed in a region near the anode terminal, and the first cathode layer is formed in a region different from the region where the insulating layer is formed. Is formed. The insulating layer is formed by electrically insulating a part of the electrolyte layer formed on the outer peripheral surface of the dielectric layer at a position in the vicinity of the anode terminal, and the first cathode layer is a remaining part of the electrolyte layer. It is formed by a part.

  In the solid electrolytic capacitor, even when the capacitor element and the anode terminal are arranged close to each other, an insulating layer is interposed between the first cathode layer and the anode terminal of the capacitor element, or the first cathode layer and the anode terminal Two cathode layers (cathode portions) are arranged apart from the anode terminal by the amount of the insulating layer. Therefore, in the above solid electrolytic capacitor, the electrical insulation between the cathode portion and the anode terminal of the capacitor element is difficult to break, and in the solid electrolytic capacitor in which the capacitor element and the anode terminal are arranged close to each other, the capacitor element The occupation rate of will increase.

  In the specific configuration of the solid electrolytic capacitor, the insulating layer is formed by heating a part of the electrolyte layer formed on the outer peripheral surface of the dielectric layer at a position near the anode terminal, so that a part of the electrolyte layer is electrically It is formed by insulation.

  In another specific configuration of the solid electrolytic capacitor, the insulating layer is formed by irradiating a part of the electrolyte layer formed on the outer peripheral surface of the dielectric layer with laser at a position near the anode terminal. Is formed by electrical insulation.

A method of manufacturing a solid electrolytic capacitor according to the present invention includes a solid electrolytic capacitor element in which a dielectric layer is interposed between an anode part and a cathode part, and the cathode part of the capacitor element is an outer peripheral surface of the dielectric layer. And a second cathode layer formed on the outer peripheral surface of the first cathode layer, and an anode terminal is electrically connected to the anode portion of the capacitor element. This is a method of manufacturing a solid electrolytic capacitor in which a cathode terminal is electrically connected to the cathode portion of the capacitor element, and includes a capacitor element body manufacturing process, an insulating process, and a mounting process.
In the capacitor element body manufacturing step, a capacitor element body to be the capacitor element, wherein an electrolyte layer is formed on the outer peripheral surface of the dielectric layer, and the second cathode layer is formed on the outer peripheral surface of the electrolyte layer, A capacitor element body is produced in which a region to be disposed in the vicinity of the anode terminal is exposed in the outer peripheral surface of the electrolyte layer.
In the insulating step, after the capacitor element body manufacturing step, the portion of the electrolyte layer of the capacitor element body that is to be disposed in the vicinity of the anode terminal is electrically insulated to form an insulating layer, The first cathode layer is formed by a portion that is not electrically insulated.
In the mounting step, after the insulating step is performed, the capacitor element body is mounted on the anode terminal and the cathode terminal with the insulating layer facing the anode terminal and the cathode terminal, and the anode portion of the capacitor element body Is connected to the anode terminal, and the cathode portion of the capacitor element body is connected to the cathode terminal.

  In the above manufacturing method, even when the capacitor element body and the anode terminal are arranged close to each other in the mounting step, an insulating layer is interposed between the first cathode layer and the anode terminal, or the first cathode layer and the second cathode The layer (cathode part) is arranged away from the anode terminal by the amount of the insulating layer. Therefore, in the solid electrolytic capacitor manufactured by the above manufacturing method, the electrical insulation between the cathode portion and the anode terminal of the capacitor element is hardly broken, and the capacitor element and the anode terminal are disposed close to each other. In the solid electrolytic capacitor, the occupation ratio of the capacitor element is increased.

  In the specific configuration of the above manufacturing method, in the insulating step, the portion of the electrolyte layer of the capacitor element body that is to be disposed in the vicinity of the anode terminal is heated to electrically insulate the portion. To form the insulating layer.

  In another specific configuration of the manufacturing method, in the insulating step, the portion of the electrolyte layer of the capacitor element body that is to be disposed in the vicinity of the anode terminal is irradiated with a laser, The insulating layer is formed by electrically insulating the portion.

  In still another specific configuration of the manufacturing method, in the capacitor element body manufacturing step, the electrolyte layer is formed on the outer peripheral surface of the dielectric layer using a conductive polymer.

  The solid electrolytic capacitor according to the present invention has a high occupation rate of the capacitor element and high productivity. According to the manufacturing method according to the present invention, such a solid electrolytic capacitor can be manufactured.

FIG. 1 is a cross-sectional view showing a solid electrolytic capacitor according to an embodiment of the present invention. FIG. 2 is an enlarged cross-sectional view showing the main part of the solid electrolytic capacitor. FIG. 3 is a cross-sectional view illustrating a capacitor element body manufacturing process of the method for manufacturing a solid electrolytic capacitor. FIG. 4 is a perspective view for explaining the peeling step of the manufacturing method. FIG. 5 is a perspective view for explaining the state of the capacitor element body after execution of the peeling step. FIG. 6 is a perspective view for explaining an insulating process of the manufacturing method. FIG. 7 is a perspective view for explaining the state of the capacitor element body after execution of the insulation process. FIG. 8 is a cross-sectional view for explaining the pillow member installation step of the manufacturing method. FIG. 9 is a cross-sectional view illustrating the mounting process of the manufacturing method. FIG. 10 is a cross-sectional view illustrating an exterior resin forming step and a cutting step in the method for manufacturing a solid electrolytic capacitor. FIG. 11 is a cross-sectional view showing a modification of the solid electrolytic capacitor. FIG. 12 is a cross-sectional view showing an example of a conventional solid electrolytic capacitor. FIG. 13 is a cross-sectional view showing another example of a conventional solid electrolytic capacitor.

Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings.
FIG. 1 is a cross-sectional view showing a solid electrolytic capacitor according to an embodiment of the present invention. As shown in FIG. 1, the solid electrolytic capacitor of this embodiment includes a lead type solid electrolytic capacitor element (1), an anode terminal (3), and a cathode terminal (4), which are exterior resin. (2) It is buried inside.

The anode terminal (3) and the cathode terminal (4) each have an anode terminal surface (31) and a cathode terminal surface (41) exposed from the lower surface (2a) of the exterior resin (2). (31) and the cathode terminal surface (41) constitute a pair of lower surface electrodes of the solid electrolytic capacitor.
The capacitor element (1) is mounted on the anode terminal (3) and the cathode terminal (4), and the lower surface of the capacitor element (1) is opposite to the anode terminal surface (31) of the anode terminal (3). It faces the surface (upper surface (32)) and faces the surface (upper surface (42)) of the cathode terminal (4) opposite to the cathode terminal surface (41).

  The capacitor element (1) has an anode body (11) in which an anode lead (12) is planted. Here, the anode body (11) is formed of a porous sintered body made of a valve action metal, and a metal such as tantalum, niobium, titanium, aluminum or the like is used as the valve action metal.

  The anode lead (12) has a base end portion (122) embedded in the anode body (11), and a distal end portion (121) drawn out from the surface of the anode body (11). The anode lead (12) is formed of the same or different valve action metal as the valve action metal forming the anode body (11), and the anode body (11) and the anode lead (12) are electrically connected to each other. It is connected to the.

  A dielectric layer (13) is formed on the surface of the anode body (11) and the surface of the root portion of the tip (121) of the anode lead (12). The dielectric layer (13) is composed of an oxide film formed on the surface of the anode body (11) and an oxide film formed on the surface of the root portion of the tip portion (121) of the anode lead (12). Yes. These oxide films are formed by immersing the anode body (11) and anode lead (12) in an electrolytic solution such as phosphoric acid aqueous solution or adipic acid aqueous solution, and electrochemically exposing the exposed surfaces of the anode body (11) and anode lead (12). It is formed by oxidization (anodic oxidation).

  On the outer peripheral surface of the dielectric layer (13), as shown in FIG. 2, an insulating layer (16) having electrical insulation properties is formed in a region facing the upper surface (32) of the anode terminal (3) and in the vicinity thereof. ) Is formed, the first cathode layer (14) is formed in a region different from the region where the insulating layer (16) is formed.

  As shown in FIG. 3, the insulating layer (16) electrically insulates a part of the electrolyte layer (62) formed on the outer peripheral surface of the dielectric layer (13) at a position facing the anode terminal (3) and in the vicinity thereof. The first cathode layer (14) is formed by the remaining part of the electrolyte layer (62). Here, the electrolyte layer (62) is formed using a conductive polymer such as polypyrrole on the outer peripheral surface of the dielectric layer (13).

  Specifically, the insulating layer (16) irradiates a part of the electrolyte layer (62) with a laser L at a position facing the anode terminal (3) and a position near the anode terminal (3), thereby the electrolyte layer (62). ) Is heated to 300 ° C. or higher and thermally decomposed, whereby a part of the electrolyte layer is electrically insulated.

  As shown in FIG. 2, in the dielectric layer (13), the surface of the edge portion (131) located on the lead-out side of the anode lead (12) is positioned on the surface of the edge portion (131). A second insulating layer (17) formed by electrically insulating part of the electrolyte layer (62) is provided. This prevents the anode lead (12) and the first cathode layer (14) from being electrically short-circuited on the surface of the tip (121) of the anode lead (12).

  As shown in FIG. 1, a second cathode layer (15) is formed on the outer peripheral surface of the first cathode layer (14). The second cathode layer (15) is composed of a carbon layer (not shown) formed on the first cathode layer (14) and a silver paste layer (not shown) formed on the carbon layer. The first cathode layer (14) and the second cathode layer (15) are electrically connected to each other.

  In the capacitor element (1), the anode body (11) and the anode lead (12) constitute the anode part of the capacitor element (1), and the first cathode layer (14), the second cathode layer (15), This constitutes the cathode part of the capacitor element (1).

  Each of the anode terminal (3) and the cathode terminal (4) is subjected to a plating treatment on the surface of a copper terminal forming member (not shown) serving as a base material of these terminals, thereby obtaining a nickel layer, a palladium layer, and a gold layer. It is comprised by forming the plating layer (not shown) which consists of. Various materials other than copper can be used for the material of the terminal forming member. Moreover, various metals other than nickel, palladium, and gold can be used for the material of the plating layer.

  A pillow member (33) is electrically joined to the upper surface (32) of the anode terminal (3) by welding means such as laser welding. Specifically, by performing laser welding on the facing surface between the pillow member (33) and the anode terminal (3), a part of the plating layer of the anode terminal (3) and a part of the pillow member (33) are formed. By melting and integrating, the pillow member (33) and the anode terminal (3) are electrically joined to each other. The pillow member (33) is formed using a metal such as iron (42 alloy), nickel, or tantalum.

  As shown in FIG. 1, the tip (121) of the anode lead (12) of the capacitor element (1) is fixed to the tip (33a) of the pillow member (33) by laser welding. On the other hand, a partial region of the outer peripheral surface of the cathode layer (15) which becomes the lower surface of the capacitor element (1) is bonded to the upper surface (42) of the cathode terminal (4) with a conductive adhesive. Thus, the anode part of the capacitor element (1) is electrically connected to the anode terminal (3) via the pillow member (33), and the cathode part of the capacitor element (1) is connected via the conductive adhesive. It is electrically connected to the cathode terminal (4).

Next, a method for manufacturing the solid electrolytic capacitor will be described.
FIG. 3 is a cross-sectional view illustrating a capacitor element body manufacturing process of the method for manufacturing a solid electrolytic capacitor. As shown in FIG. 3, in the capacitor element body manufacturing step, a capacitor element body (71) to be the capacitor element (1) is manufactured.

The capacitor element body (71) produced in this step is formed on the surface of the anode body (11) in which the lead forming member (61) to be the anode lead (12) is planted and the anode body (11). Dielectric layer (13), an electrolyte layer (62) formed on the outer peripheral surface of the dielectric layer (13), and a second cathode layer (15) formed on the outer peripheral surface of the electrolyte layer (62). The region R to be disposed at a position facing the anode terminal (3) in the outer peripheral surface of the electrolyte layer (62), and a region in the vicinity thereof are the second cathode layer (15). It is exposed without being covered by. Here, the electrolyte layer (62) is formed by using a conductive polymer such as polypyrrole on the outer peripheral surface of the dielectric layer (13).
In the capacitor element body (71), the dielectric layer (13) and the electrolyte layer (62) are also formed on the surface of the lead portion (611) from the anode body (11) of the lead forming member (61). Is formed.

FIG. 4 is a perspective view for explaining a peeling step of the method for manufacturing the solid electrolytic capacitor. FIG. 5 is a perspective view for explaining the state of the capacitor element body after execution of the peeling step. The peeling process is a process executed after the capacitor element body manufacturing process.
First, before performing the peeling step, a plurality of capacitor element bodies (71) are arranged in a line, and the lead portion (611) of the lead forming member (61) of each capacitor element body (71) is connected to the carrier bar (70 ) (See FIG. 4).

  Thereafter, as shown in FIG. 4, in the peeling process, the laser irradiation device (701) is scanned along the carrier bar (70) to thereby draw out the lead forming members (61) of the capacitor element bodies (71). (611) is irradiated with the laser L. In this way, as shown in FIG. 5, a part of the dielectric layer (13) and the electrolyte layer (62) formed on the surface of the lead part (611) is left in the vicinity of the base and other parts are left. Is peeled off, thereby exposing the surface of the lead portion (611).

  At this time, the heat generated by the irradiation of the laser L is transmitted to the electrolyte layer (62) remaining on the surface of the lead portion (611) of the lead forming member (61) to the edge portion formed by laser peeling. As a result, the edge is electrically insulated and the second insulating layer (17) is formed.

  FIG. 6 is a perspective view for explaining an insulating process of the method for manufacturing the solid electrolytic capacitor. FIG. 7 is a perspective view for explaining the state of the capacitor element body after execution of the insulation process. An insulation process is a process performed after execution of a peeling process.

  As shown in FIG. 6, in the insulating process, the outer peripheral surface of the electrolyte layer (62) of the capacitor element body (71) is scanned by scanning the laser irradiation device (701) along the carrier bar (70). The exposed portion, specifically, the portion to be disposed at the position facing the anode terminal (3) and the portion in the vicinity thereof are irradiated with the laser L. At this time, the output of the laser L is set to be smaller than the output of the laser L used in the peeling process, and the electrolyte layer (62) irradiated with the laser L is set to be heated to 300 ° C. or higher. .

  Of the electrolyte layer (62), the portion irradiated with the laser L is heated to 300 ° C. or higher and thermally decomposed. Therefore, the portion is electrically insulated, and an insulating layer (16) is formed as shown in FIG. On the other hand, the first cathode layer (14) is formed by the portion of the electrolyte layer (62) that is not electrically insulated.

  FIG. 8 is a cross-sectional view for explaining a pillow member installation step in the method for manufacturing a solid electrolytic capacitor. As shown in FIG. 8, in the pillow member installation step, first, a frame body (5) including an anode frame (51) serving as an anode terminal (3) and a cathode frame (52) serving as a cathode terminal (4). And a pillow member (33) is installed on the upper surface (512) of the anode frame (51) of the frame body (5).

  Here, each of the anode frame (51) and the cathode frame (52) is subjected to a plating process on the surface of a copper frame forming member (not shown) serving as a base material of these terminals, so that a nickel layer, a palladium layer , A plated layer (not shown) made of a gold layer is formed. Various materials other than copper can be used as the material of the frame forming member. Moreover, various metals other than nickel, palladium, and gold can be used for the material of the plating layer.

  After the pillow member (33) is installed on the upper surface (512) of the anode frame (51), laser welding is performed on the opposing surfaces of the pillow member (33) and the anode frame (51). Thereby, a part of the plating layer of the anode frame (51) and a part of the pillow member (33) are melted and integrated, and as a result, the pillow member (33) and the anode frame (51) are electrically connected to each other. Will be joined.

FIG. 9 is a cross-sectional view illustrating a mounting process of the method for manufacturing a solid electrolytic capacitor. A mounting process is a process performed after execution of an insulation process and a pillow member installation process.
First, before executing the mounting process, the capacitor element body (71) is separated from the carrier bar (70) by cutting the lead portion (611) of the lead forming member (61) of each capacitor element body (71). (See FIG. 7). Thereby, the capacitor element (1) is completed.

  Thereafter, as shown in FIG. 9, the capacitor element (1) is mounted on the frame body (5) in the mounting step. At this time, the capacitor element (1) has the insulating layer (16) directed toward the frame body (5).

Next, the exposed surface of the tip portion (121) of the anode lead (12) of the capacitor element (1) is brought into contact with the tip surface (33a) of the pillow member (33), and laser welding is performed on the contact surface, whereby the anode The leading end (121) of the lead (12) is fixed to the leading end surface (33a) of the pillow member (33). As a result, the anode lead (12) and the pillow member (33) are electrically connected.
A part of the outer peripheral surface of the second cathode layer (15) of the capacitor element (1) is bonded to the upper surface (522) of the cathode frame (52) using a conductive adhesive. As a result, the cathode layer (15) and the cathode frame (52) are electrically connected.

  FIG. 10 is a cross-sectional view illustrating an exterior resin forming step and a cutting step in the method for manufacturing a solid electrolytic capacitor. The exterior resin forming process is a process executed after the mounting process is executed. As shown in FIG. 10, in the exterior resin forming step, the exterior resin (2) is formed around the capacitor element (1), thereby the capacitor element (1) and the pillow member (33 ), An anode frame (51) and a cathode frame (52) are embedded. At this time, the lower surface (511) of the anode frame (51) and the lower surface (521) of the cathode frame (52) are exposed from the lower surface (2a) of the exterior resin (2). In this way, the block body (72) is produced in the exterior resin forming step.

A cutting process is a process performed after execution of an exterior resin formation process. As shown in FIG. 10, in the cutting step, the block body (72) produced in the exterior resin forming step is cut. Specifically, by cutting the block body (72) along the line AA, the exterior resin (2) and the anode frame (51) are cut along the same plane. Further, the exterior resin (2) and the cathode frame (52) are cut along the same plane by cutting the block body (72) along the line BB.
By performing the cutting process, the anode frame (51) and the cathode frame (52) are partially cut to form the anode terminal (3) and the cathode terminal (4), and as shown in FIG. Thus, the solid electrolytic capacitor is completed.

  In the above manufacturing method, even when the capacitor element (1) and the anode frame (51) are arranged close to each other in the mounting process, the gap between the first cathode layer (14) and the anode frame (51) of the capacitor element (1). Or the first cathode layer 14 and the second cathode layer 15 (cathode part) are separated from the anode frame 51 by the amount of the insulating layer 16. Will be placed. Therefore, in the solid electrolytic capacitor produced by the above manufacturing method, the electrical insulation between the cathode portion and the anode terminal (3) of the capacitor element (1) is not easily broken, and the capacitor element (1) and the anode are not broken. In the solid electrolytic capacitor produced by arranging the terminal (3) in close proximity, the occupation ratio of the capacitor element (1) is increased.

In addition, each part structure of this invention is not restricted to the said embodiment, A various deformation | transformation is possible within the technical scope as described in a claim.
For example, the solid electrolytic capacitor having the lead type capacitor element (1) and various configurations adopted in the manufacturing method thereof are applied to a solid electrolytic capacitor having a foil-shaped capacitor element (8) as shown in FIG. I can do it.

  As shown in FIG. 11, in the foil-shaped capacitor element (8), the first region (811) in which the dielectric layer (13) is formed on the surface of the foil-shaped anode body (81) and the dielectric layer. There is a second region (812) in which (82) is not formed, and on the outer peripheral surface of the dielectric layer (13), there is an insulating layer having electrical insulating properties in the region near the anode terminal (3). 16) is formed, while the first cathode layer (14) is formed in a region different from the region where the insulating layer (16) is formed. A second cathode layer (15) is formed on the outer peripheral surface of the first cathode layer (14).

  In the above-described embodiment, in the insulating step, a part of the electrolyte layer (62) that becomes the insulating layer (16) is irradiated with the laser L, whereby a part of the electrolyte layer (62) is heated and electrically insulated. However, the present invention is not limited to this, and a part of the electrolyte layer (62) to be the insulating layer (16) may be heated and electrically insulated by using various heating means.

(1) Capacitor element
(11) Anode body
(12) Anode lead
(13) Dielectric layer
(14) First cathode layer
(15) Second cathode layer
(16) Insulation layer
(3) Anode terminal
(4) Cathode terminal
(62) Electrolyte layer
(71) Capacitor element body

Claims (7)

A solid electrolytic capacitor element having a dielectric layer interposed between an anode part and a cathode part. The cathode part of the capacitor element includes a first cathode layer formed on the outer peripheral surface of the dielectric layer, and the first cathode layer. And a second cathode layer formed on the outer peripheral surface of one cathode layer. An anode terminal is electrically connected to the anode part of the capacitor element, while a cathode terminal is electrically connected to the cathode part of the capacitor element. Connected solid electrolytic capacitors,
On the outer peripheral surface of the dielectric layer, an insulating layer having electrical insulation is formed in a region near the anode terminal, and the first cathode layer is formed in a region different from the region where the insulating layer is formed. The insulating layer is formed by electrically insulating a part of the electrolyte layer formed on the outer peripheral surface of the dielectric layer at a position near the anode terminal, and the first cathode layer is formed of the electrolyte layer. A solid electrolytic capacitor characterized by being formed by the remaining portion.   The insulating layer is formed by electrically insulating a part of the electrolyte layer by heating a part of the electrolyte layer formed on the outer peripheral surface of the dielectric layer at a position near the anode terminal. Item 10. A solid electrolytic capacitor according to Item 1.   The insulating layer is formed by irradiating a portion of the electrolyte layer formed on the outer peripheral surface of the dielectric layer with a laser at a position near the anode terminal to electrically insulate a portion of the electrolyte layer. The solid electrolytic capacitor according to claim 1 or 2. A solid electrolytic capacitor element having a dielectric layer interposed between an anode part and a cathode part. The cathode part of the capacitor element includes a first cathode layer formed on the outer peripheral surface of the dielectric layer, and the first cathode layer. And a second cathode layer formed on the outer peripheral surface of one cathode layer. An anode terminal is electrically connected to the anode part of the capacitor element, while a cathode terminal is electrically connected to the cathode part of the capacitor element. A method of manufacturing a solid electrolytic capacitor connected to each other,
A capacitor element body to be the capacitor element, wherein an electrolyte layer is formed on the outer peripheral surface of the dielectric layer, and the second cathode layer is formed on the outer peripheral surface of the electrolyte layer, A capacitor element body manufacturing step for manufacturing a capacitor element body in which a region to be disposed in the vicinity of the anode terminal is exposed;
After the capacitor element body manufacturing step, the insulating layer was formed by electrically insulating the portion of the electrolyte layer of the capacitor element body that would be disposed in the vicinity of the anode terminal, and was not electrically insulated. An insulating step in which the first cathode layer is formed by a portion;
After performing the insulating step, the capacitor element body is mounted on the anode terminal and the cathode terminal with the insulating layer facing the anode terminal and the cathode terminal, and the anode portion of the capacitor element body serves as the anode terminal. And a mounting step of connecting a cathode portion of the capacitor element body to a cathode terminal.   In the insulating step, by heating a portion of the electrolyte layer of the capacitor element body that is to be disposed in the vicinity of the anode terminal, the portion is electrically insulated to form the insulating layer. Item 5. A method for producing a solid electrolytic capacitor according to Item 4.   In the insulating step, a portion of the electrolyte layer of the capacitor element body that is to be disposed in the vicinity of the anode terminal is irradiated with a laser to electrically insulate the portion to form the insulating layer The manufacturing method of the solid electrolytic capacitor of Claim 4 or Claim 5 to do.   The method for producing a solid electrolytic capacitor according to claim 4, wherein, in the capacitor element body manufacturing step, the electrolyte layer is formed on the outer peripheral surface of the dielectric layer using a conductive polymer.

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