JP2011048256A - Optical connector and optical transceiver - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical connector which has a condensing lens function mounted on an optical transceiver, and capable of appropriately performing optical communication without changing designs of other components, even when the arrangement position of the condensing lens is too far away from the position of the lead frame of the optical transceiver. <P>SOLUTION: The optical connector includes: a connector housing 2 where an optical connecter on the other side is engaged; and the optical transceiver 20, stored in the connector housing 2, for transmitting/receiving an optical signal to/from the tip end face 30a of an optical fiber 30. The optical transceiver 20 includes: the lead frame 21; a ceramic substrate 22 arranged on the lead frame 21; a photoelectric conversion element 23 arranged on the ceramic substrate 22; and a resin molded part 24 molded of a light-propagatable resin material, having the condensing lens 24a integrally formed therewith above the photoelectric conversion element 23, and also, arranged on the outer peripheries of the lead frame 21, the ceramic substrate 22 and the photoelectric conversion element 23. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an optical connector that is fitted to a counterpart optical connector and has a function of transmitting and receiving an optical signal to and from an optical fiber of the counterpart optical connector, and an optical that is accommodated in the optical connector and performs a transmission and reception function. Related to transceivers.

  For example, in order to cope with an increase in capacity and speed of transmission information in an automobile, an optical communication system using an optical fiber cable has been adopted in the automobile. As one of in-vehicle optical communication components constituting such an optical communication system, an optical connector incorporating an optical transceiver (FOT: Fiber Optical Transceiver) is used.

  As shown in FIGS. 5 and 6, this type of conventional optical connector 50 includes a connector housing 51 into which a counterpart optical connector (not shown) is fitted, and a shield case 52 that covers the outer periphery of the connector housing 51. And a pair of lens sleeves 53 disposed in the connector housing 51 and a pair of optical transceivers 54 disposed in the connector housing 51 (see Patent Document 1).

  The connector housing 51 has a fitting tip wall 60 inside, and is partitioned into a connector fitting chamber 61 and a component housing chamber 62 with the fitting tip wall 60 as a boundary. A mating connector (not shown) is fitted into the connector fitting chamber 61. A surface on the connector fitting chamber 61 side of the fitting tip wall 60 is a connector fitting tip surface 60a. Cylindrical optical fiber positioning portions 63 protrude from the fitting tip wall 60 toward the connector fitting chamber 61 at two locations. When the mating connector (not shown) is fitted, the tip of the optical fiber 70 of the mating connector (not shown) is positioned by the optical fiber positioning unit 63 (see FIG. 6). The inside of each optical fiber positioning part 63 is penetrated by the component storage chamber 62.

  Each lens sleeve 53 has a condensing lens 53a disposed at the front end and a light guide path portion 53b disposed on the rear end side. The condensing lens 53a faces the opening of the light positioning portion 63 and accommodates components. Arranged in the chamber 62.

  Each optical transceiver 54 is arranged in the component housing chamber 62 at the rear end position of the light guide path portion 53 b of each lens sleeve 53. Each optical transceiver 54 includes a lead frame 54a, a photoelectric conversion element 55 disposed on the lead frame 54a, and a resin molding portion 54c that is disposed on the outer periphery of the lead frame 54a and the photoelectric conversion element 55 and fixes these components. I have. For example, one of the pair of photoelectric conversion elements 55 is a light emitting element and the other is a light receiving element.

  In the above configuration, the light propagated through the optical fiber 70 is emitted from the tip surface 70a toward the condenser lens 53a, passes through the lens sleeve 53, and is focused at the position of the light receiving photoelectric conversion element 55. Is done. The light receiving photoelectric conversion element 55 converts the received light signal into an electric signal. Further, when the light emitting photoelectric conversion element 55 emits light based on the electrical signal on the transmission side, the light passes through the lens sleeve 53 and becomes substantially parallel light at the condensing lens 53a, from the front end surface 70a of the optical fiber 70. The light enters the optical fiber 70.

  In order to properly perform optical communication within the optical connector 50, the distance L1 between the distal end surface 70a of the optical fiber 70 and the condensing lens 53a, and the distance between the condensing lens 53a and the photoelectric conversion element 55. It is necessary to keep L2 (L2: change depending on focal length or the like) at an appropriate distance. Here, the position of the front end surface 70a of the optical fiber 70 when the mating optical connector (not shown) is fitted is specified with reference to the connector fitting front end surface 60a of the connector housing 51. The positions of the condenser lens 53a and the photoelectric conversion element 55 are determined based on the position of the distal end surface 70a. The condensing lens 53a and the photoelectric conversion element 55 are arranged at the specified positions.

  By the way, the present applicant has proposed that the lens sleeve 53 is eliminated by mounting a condensing lens function in the optical transceiver 54 to reduce the number of parts (see Patent Document 2).

  Even when an optical transceiver 54 equipped with a condensing lens function is employed, the optical transceiver 54 is installed without changing the size of the optical connector 50 or the form of the lead frame 54a that is an internal component of the optical transceiver 54. There is a request to do.

JP 2006-215273 A JP 2001-66469 A

  However, if the condenser lens 53a and the photoelectric conversion element 55 are arranged at appropriate positions for optical communication under the above request, there are the following problems. That is, the main body side of the optical transceiver 54 (location having the lead frame 54a) needs to be arranged at a position that does not protrude from the connector fitting tip surface 60a. Therefore, it is necessary to arrange the condenser lens 53a at a position sufficiently protruded from the lens. Then, if the position of each photoelectric conversion element 55 is arranged on the lead frame 54a, the distance from the condensing lens 53a is too large, and proper optical communication cannot be performed.

  Therefore, the present invention has been made to solve the above-described problems, and is provided with a condensing lens function in an optical transceiver, and the arrangement position of the condensing lens is more appropriate than the position of the lead frame of the optical transceiver. It is an object of the present invention to provide an optical connector capable of performing proper optical communication without changing the design of other components even when the distance is too far beyond the distance that enables reliable optical communication. In addition, the present invention is also equipped with a condensing lens function, and even when the arrangement position of the condensing lens is too far away from the position of the lead frame to enable proper optical communication. Another object of the present invention is to provide an optical transceiver that enables appropriate optical communication without changing the design of other components.

  According to a first aspect of the present invention, an optical signal is transmitted and received between a connector housing having a connector fitting chamber into which a mating optical connector is fitted, and the distal end surface of the optical fiber, which is accommodated in the connector housing. An optical transceiver, wherein the optical transceiver has a lead frame, a pedestal disposed on the lead frame, a photoelectric conversion element disposed on the pedestal, and a condensing lens above the photoelectric conversion element. An optical connector comprising a resin molding portion formed of a resin material that is integrally formed and disposed on the outer periphery of the lead frame, the pedestal, and the photoelectric conversion element.

  Invention of Claim 2 is the optical connector of Claim 1, Comprising: The said base has an internal conduction part which connects between the surface conduction | electrical_connection part arrange | positioned at the upper surface, and the surface conduction | electrical_connection part arrange | positioned at the bottom face, The photoelectric conversion element is an optical connector characterized in that the photoelectric conversion element is electrically connected to the lead frame through a conduction path via the internal conduction part and a conduction path via a conduction wire.

  A third aspect of the present invention is the optical connector according to the second aspect, wherein the pedestal has a step surface at an intermediate position between the upper surface and the bottom surface, and extends over the upper surface, the step surface, and a side surface therebetween. The auxiliary surface conducting portion is disposed, and the conduction path through the conducting wire is between the photoelectric conversion element and the auxiliary surface conducting portion on the upper surface, and the auxiliary surface conducting portion on the step surface. An optical connector comprising: a lead wire connected to the lead frame.

  According to a fourth aspect of the present invention, a lead frame, a pedestal disposed on the lead frame, a photoelectric conversion element disposed on the pedestal, and a condenser lens are integrally formed at a position above the photoelectric conversion element. In addition, the optical transceiver includes a resin molding portion that is disposed on the outer periphery of the lead frame, the pedestal, and the photoelectric conversion element and is formed of a resin material capable of propagating light.

  Invention of Claim 5 is the optical transceiver of Claim 4, Comprising: The said base has an internal conduction part which connects between the surface conduction | electrical_connection part arrange | positioned at the upper surface, and the surface conduction | electrical_connection part arrange | positioned at the bottom face, The photoelectric conversion element is an optical transceiver that is electrically connected to the lead frame through a conduction path via the internal conduction part and a conduction path via a conduction wire.

  The invention according to claim 6 is the optical transceiver according to claim 5, wherein the pedestal has a step surface at an intermediate position between the upper surface and the bottom surface, and extends over the step surface on the upper surface and a side surface therebetween. The auxiliary surface conduction part is arranged between the photoelectric conversion element and the auxiliary surface conduction part on the upper surface, and the auxiliary surface conduction part on the step surface. And an optical transceiver characterized in that each is connected by a conductive wire.

  According to the first aspect of the present invention, the optical transceiver is provided with a condenser lens function, and the condenser lens is sufficiently separated from the lead frame of the optical transceiver due to the relationship with the position of the front end surface of the optical fiber. Even when there is a need to place it at a different position, the photoelectric conversion element is placed on the lead frame via a pedestal. Appropriate optical communication can be performed without changing the design of components (connector housing, lead frame, etc.).

  Further, when it is desired to change the position of the photoelectric conversion element with respect to the condensing lens, it can be easily changed by changing the height of the pedestal.

  According to the invention of claim 2, in addition to the effect of the invention of claim 1, the electrical connection of the photoelectric conversion element to the lead frame can be performed similarly to the case where the photoelectric conversion element is arranged directly on the lead frame. .

  According to the invention of claim 3, in addition to the effect of the invention of claim 2, the wire bonding work can be performed in a narrow space, the difficulty of the wire bonding work is lowered, and the reliability of the wire bonding is improved.

  According to the fourth aspect of the present invention, the condenser lens function is mounted, and it is necessary to dispose the condenser lens at a position sufficiently separated from the lead frame due to the relationship with the position of the tip surface of the optical fiber. Even if there is, the photoelectric conversion element is placed on the lead frame via the pedestal, so the photoelectric conversion element can be installed at the optimum optical communication position for the condenser lens, and other components (lead frame, etc.) Appropriate optical communication can be performed without changing the design.

  Further, when it is desired to change the position of the photoelectric conversion element with respect to the condensing lens, it can be easily changed by changing the height of the pedestal.

  According to the invention of claim 5, in addition to the effect of the invention of claim 4, the electrical connection of the photoelectric conversion element to the lead frame can be performed in the same manner as the case where the photoelectric conversion element is directly arranged on the lead frame. .

  According to the invention of claim 6, in addition to the effect of the invention of claim 5, the wire bonding work can be performed in a narrow space, the difficulty of the wire bonding work is lowered, and the reliability of the wire bonding is improved.

1A is a cross-sectional view of an optical connector, and FIG. 1B is a cross-sectional view of an optical transceiver according to an embodiment of the present invention. 1 shows an embodiment of the present invention, in which (a) is a perspective view of a ceramic substrate, and (b) is a front view of the ceramic substrate. It is sectional drawing of the optical transceiver of a modification. (A) is a perspective view of the ceramic substrate of a modification, (b) is a front view of the ceramic substrate of a modification. It is a disassembled perspective view of the optical connector of a prior art example. It is sectional drawing of the optical connector of a prior art example.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment)
1 and 2 show an embodiment of the present invention. FIG. 1A is a sectional view of an optical connector 1, FIG. 1B is a sectional view of an optical transceiver 20, and FIG. FIG. 2B is a front view of the ceramic substrate 22.

  As shown in FIG. 1A, an optical connector 1 includes a connector housing 2 into which a mating optical connector (not shown) is fitted, a shield case 10 that covers the outer periphery of the connector housing 2, and a connector housing 2. And a pair of optical transceivers 20 (FOT: Fiber Optical Transceiver).

  The connector housing 2 has an outer wall 3 surrounded by a rectangular frame shape, and a fitting tip wall 4 arranged on the tip side thereof, and a connector fitting chamber 5 is provided inside thereof. A mating optical connector (not shown) is fitted into the connector fitting chamber 5. A surface on the connector fitting chamber side of the fitting tip wall 4 is a connector fitting tip surface 4a. The position where the connector housing (not shown) of the mating optical connector (not shown) abuts against the connector fitting tip surface 4a is an appropriate fitting position. Cylindrical optical fiber positioning portions 6 protrude toward the connector fitting chamber 5 at two locations on the fitting tip wall 4. When the mating connector (not shown) is fitted, the tip of the optical fiber 30 of the mating connector (not shown) is positioned by the optical fiber positioning unit 6. The connector housing 2 has an optical transceiver fixing wall 7 on the opposite side of the fitting front end wall 4 to the connector fitting chamber 5.

  Each optical transceiver 20 is fixed to the optical transceiver fixing wall 7, and is arranged in a state where the condensing lens 24 a protrudes into the optical fiber positioning unit 6. The optical connector 1 is manufactured by forming a pair of optical transceivers 20 by insert molding (primary molding), and then secondary-molding the connector housing 2 using the pair of optical transceivers 20 as internal parts of the insert molding.

  As shown in detail in FIG. 1B, each optical transceiver 20 includes a lead frame 21, a ceramic substrate 22 that is a pedestal disposed on the lead frame 21, and a photoelectric conversion disposed on the ceramic substrate 22. An element 23 is provided on the outer periphery of the lead frame 21, the ceramic substrate 22, and the photoelectric conversion element 23, and includes a resin molding portion 24 that fixes these members.

  One end of the lead frame 21 protrudes outward from the connector housing 2. A portion of the protruding lead frame 21 is an external terminal 21a (shown in FIG. 1A). The external terminal 21a is bent in a substantially right angle in the vicinity of projecting outward from the connector housing 2, and is thus set in a desired direction and position.

  As shown in detail in FIGS. 2A and 2B, the ceramic substrate 22 is a rectangular block. The height H of the ceramic substrate 22 is set to a dimension that is a distance L3 at which the photoelectric conversion element 23 can perform appropriate optical communication with a condenser lens 24a described below. The ceramic substrate 22 has an internal conduction portion 22c that communicates between the surface conduction portion 22a disposed on the top surface and the surface conduction portion 22b disposed on the bottom surface. Both the surface conductive portions 22a and 22b and the internal conductive portion 22c are produced by, for example, metal plating.

  One of the pair of photoelectric conversion elements 23 is a light emitting element, and the other is a light receiving element. Each photoelectric conversion element 23 has electrodes (not shown) on the upper surface and the lower surface. An electrode (not shown) on the lower surface is electrically connected to a predetermined lead frame 21 by a surface conductive portion 22a on the upper surface of the ceramic substrate 22, an internal conductive portion 22c, and a surface conductive portion 22c on the lower surface. An electrode (not shown) on the upper surface is electrically connected to a predetermined lead frame 21 by a conductive wire 25. That is, each photoelectric conversion element 23 is electrically connected to each lead frame 21 by a conduction path using the internal conduction part 22 c and a conduction path using the conduction wire 25.

  The resin molding part 24 is integrally formed with a condensing lens 24a from a resin material capable of transmitting light. Thereby, the condensing lens function is mounted on the optical transceiver 20. The condensing lens 24a is disposed at a position that is a predetermined distance (L1 described in the conventional example) with respect to the position of the distal end surface 30a of the optical fiber 30 of the mating optical connector (not shown). Yes. This position is a position sufficiently away from the position of the lead frame 21.

  In the optical connector 1 having the above-described configuration, a mating optical connector (not shown) is fitted, and the light transmitted through the optical fiber 30 of the mating optical connector (not shown) is transmitted from the distal end surface 30a. The light is emitted toward the condenser lens 24 a, passes through the resin molding portion 24, and is focused at the position of the photoelectric conversion element 23 for light reception. The light receiving photoelectric conversion element 23 converts the received optical signal into an electric signal. Further, when the light-emitting photoelectric conversion element 23 emits light based on the electrical signal on the transmission side, the light passes through the resin molding portion 24 and becomes substantially parallel light at the condenser lens 24a, and the distal end surface 30a of the optical fiber 30. More incident on the optical fiber 30. In this way, conversion between an optical signal and an electric signal is performed in the optical connector 1.

  As described above, in the optical transceiver 20 in which the condenser lens 24 a is integrally formed, the photoelectric conversion element 23 is disposed on the lead frame 21 of the optical transceiver 20 via the ceramic substrate 22. Accordingly, in the optical transceiver 20 having the condenser lens function, the condenser lens 24a is attached to the lead frame 21 of the optical transceiver 20 based on the relationship with the position of the distal end surface 30a of the optical fiber 30 as in this embodiment. Even when it is necessary to dispose at a position sufficiently away from the condenser lens 24a, the photoelectric conversion element 23 can be installed at an optimum optical communication position with respect to the condenser lens 24a. Appropriate optical communication can be performed without changing the design of the lead frame 21 and the like.

  Further, when it is desired to change the position of the photoelectric conversion element 23 with respect to the condensing lens 24a, it can be easily changed by changing the height H of the ceramic substrate 22.

  Since the ceramic substrate 22 has a small coefficient of linear expansion and a high thermal conductivity, the reliability of optical communication can be secured without being adversely affected by the temperature rise due to ambient temperature changes and the heat generated by the photoelectric conversion element 23 itself.

  The ceramic substrate 22 has an internal conductive portion 22c that communicates between the surface conductive portion 22a disposed on the top surface and the surface conductive portion 22b disposed on the bottom surface. The photoelectric conversion element 23 is electrically connected to each lead frame 21 by a conduction path using the internal conduction part 22 c and a conduction path via the conduction wire 25. Therefore, electrical connection of the photoelectric conversion element 23 to the lead frame 21 can be performed in the same manner as when the photoelectric conversion element 23 is directly disposed on the lead frame 21.

(Modified example of optical transceiver)
3 and 4 show a modification of the optical transceiver 20A, FIG. 3 is a cross-sectional view of the optical transceiver 20A, FIG. 4A is a perspective view of the ceramic substrate 22A, and FIG. 4B is a front view of the ceramic substrate 22A. It is.

  As shown in FIG. 3, the optical transceiver 20 </ b> A is mainly different from the configuration of the ceramic substrate 22 </ b> A that is a pedestal as compared with the embodiment. That is, the ceramic substrate 22A has a step surface 22d at an intermediate position between the top surface and the bottom surface. Similarly to the above-described embodiment, the ceramic substrate 22A includes an internal conduction portion 22c that communicates between the surface conduction portion 22a disposed on the top surface and the surface conduction portion 22b disposed on the bottom surface. In addition, the ceramic substrate 22A separately has an auxiliary surface conduction portion 26 disposed over the upper surface, the step surface 22d, and the side surface therebetween. And the conduction | electrical_connection path | route using a conduction | electrical_connection wire is between a photoelectric conversion element 23 and the auxiliary surface conduction | electrical_connection part 26 on an upper surface, and between the auxiliary | assistant surface conduction | electrical_connection part 26 and the lead frame 21 on the level | step difference surface 22d. 25a and 25b are connected to each other.

  Since the other configuration is the same as that of the above-described embodiment, the same components in the drawings are denoted by the same reference numerals and the description thereof is omitted.

  In this modification, conductive wires 25a and 25b connect between the photoelectric conversion element 23 and the auxiliary surface conductive portion 26 on the upper surface, and between the auxiliary surface conductive portion 26 on the step surface 22d and the lead frame 21, respectively. Has been. Therefore, the wire bonding work can be performed in a narrow space, the difficulty of the wire bonding work is reduced, and the reliability of the wire bonding is improved.

  That is, when there is a step on the surface where the wire bonding operation is performed, the larger the step, the larger the space required for performing the wire bonding operation. If the wire bonding operation is to be performed in a narrow space as much as possible, sufficient consideration is required so that the conductive wire does not contact the edge of the upper surface of the ceramic substrate 22, increasing the difficulty of the wire bonding operation and reducing the reliability. On the other hand, if this modification is used, the number of wire bonding operations is two. However, since the step of each wire bonding operation is small, the wire bonding operation can be performed in a narrow space. At the same time, the difficulty of wire bonding is reduced and the reliability of wire bonding is improved.

  In addition, in the said embodiment and modification, although the base was formed with the ceramic substrate 22, you may form with members other than a ceramic substrate. The member is preferably made of a material having a small linear expansion coefficient and high thermal conductivity, like the ceramic substrate 22.

  In the embodiment and the modification, the photoelectric conversion element 23 is a light emitting element and a light receiving element, but may be a light receiving and emitting element.

DESCRIPTION OF SYMBOLS 1 Optical connector 2 Connector housing 4a Connector fitting front end surface 5 Connector fitting chamber 20, 20A Optical transceiver 21 Lead frame 22, 22A Ceramic substrate 22a, 22b Surface conduction part 22c Internal conduction part 22d Step surface 23 Photoelectric conversion element 24 Resin molding Portion 24a Condensing lens 25, 25a, 25b Conductive wire 26 Auxiliary surface conducting portion 30 Optical fiber 30a Tip surface

Claims (6)

A connector housing having a connector fitting chamber into which a mating optical connector is fitted;
An optical transceiver that is housed in the connector housing and transmits and receives an optical signal to and from a distal end surface of the optical fiber;
The optical transceiver includes a lead frame, a pedestal disposed on the lead frame, a photoelectric conversion element disposed on the pedestal, and a condenser lens integrally formed at a position above the photoelectric conversion element. An optical connector comprising: a resin molded portion formed of a resin material disposed on an outer periphery of the lead frame, the base, and the photoelectric conversion element, and capable of propagating light. The optical connector according to claim 1,
The pedestal has an internal conductive portion that communicates between a surface conductive portion disposed on the top surface and a surface conductive portion disposed on the bottom surface, and the photoelectric conversion element includes a conductive path through the internal conductive portion and a conductive wire. An optical connector characterized in that the optical connector is electrically connected to the lead frame by a conduction path through the connector. The optical connector according to claim 2,
The pedestal has a step surface at an intermediate position between the top surface and the bottom surface, and has an auxiliary surface conduction portion disposed across the top surface, the step surface, and a side surface therebetween,
The conduction path through the conduction wire is a conduction wire between the photoelectric conversion element and the auxiliary surface conduction part on the upper surface, and between the auxiliary surface conduction part on the step surface and the lead frame, respectively. An optical connector characterized by being connected.   A lead frame; a pedestal disposed on the lead frame; a photoelectric conversion element disposed on the pedestal; and a condensing lens integrally formed at a position above the photoelectric conversion element; and the lead frame, An optical transceiver comprising a pedestal and a resin molded portion disposed on an outer periphery of the photoelectric conversion element and formed of a resin material capable of propagating light. An optical transceiver according to claim 4, wherein
The pedestal has an internal conductive portion that communicates between a surface conductive portion disposed on the top surface and a surface conductive portion disposed on the bottom surface, and the photoelectric conversion element includes a conductive path through the internal conductive portion and a conductive wire. An optical transceiver characterized in that the optical transceiver is electrically connected to the lead frame by a conduction path through the antenna. The optical transceiver according to claim 5, comprising:
The pedestal has a step surface at an intermediate position between the top surface and the bottom surface, and has an auxiliary surface conduction portion disposed across the top surface, the step surface, and a side surface therebetween,
The conduction path through the conduction wire is a conduction wire between the photoelectric conversion element and the auxiliary surface conduction part on the upper surface, and between the auxiliary surface conduction part on the step surface and the lead frame, respectively. An optical transceiver configured by connecting.

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