JP2011045821A - Adhesive application apparatus and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive application apparatus and method capable of reducing the consumption of an adhesive and shortening setting time of the adhesive to bond in a short time. <P>SOLUTION: The adhesive application apparatus 10 which applies the adhesive to an adhesion face is provided with: a pressurizing cylinder 13 that extrudes the adhesive 30 from a cartridge 11, to which the adhesive 30 is filled, to the outside through an application nozzle 14; a pump 15 with a heater that supplies heated gas to the application nozzle 14; and a controller 17 that controls the operation of the pump 15 with the heater so that the heated gas G is supplied to the application nozzle 14 interlocking with the operation of the pressurizing cylinder 13. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an adhesive application device and an application method for applying an adhesive to an adhesion surface of an object to be bonded. More specifically, the present invention relates to an adhesive coating apparatus and a coating method capable of reducing the amount of adhesive used and shortening the curing time of the adhesive to bond an object to be bonded in a short time.

  In general, the adhesive is applied while the adhesive is pushed out of the cartridge with a pressure piece. For this reason, if the adhesive pushed out from the cartridge is interrupted, the sealing effect is lost, so the adhesive is filled in the cartridge in a state close to vacuum.

  For example, when an adhesive is used as a sealing material for electronic parts, it is necessary to prevent gaps from occurring after application and curing. In other words, in order to absorb the effects of warpage and steps of two parts to be bonded, And in order to apply | coat to the adhesion location of 2 components without a gap, it is necessary to apply | coat the adhesive agent of the quantity which can ensure sufficient height. Therefore, the actual situation is that the adhesive is applied with a margin so as to be surely sealed on the bonding surfaces of the two parts. For this reason, there existed a problem that the usage-amount of an adhesive agent will increase.

  Therefore, for example, Patent Document 1 describes that a fine hollow body (organic balloon or inorganic balloon) made of an organic material or an inorganic material or an appropriate amount of bubbles is stably contained in an adhesive. In this way, by using balloons or bubbles in the adhesive, the amount of adhesive applied to the adhesive surface can be reduced.

JP 05-066542 A

  However, although the technique described in Patent Document 1 described above can reduce the amount of adhesive used, there is a problem that it cannot be bonded in a short time. This is because no measures are taken to shorten the curing time of the adhesive. For this reason, when the adhesive is applied with a margin so as to be surely sealed, the amount of adhesive used is reduced, but the time until the adhesive cures is long and short. Could not be glued.

  Therefore, the present invention has been made to solve the above-described problems, and it is possible to reduce the amount of adhesive used and to apply the adhesive in a short time by shortening the curing time of the adhesive. An object is to provide an apparatus and a coating method.

  One aspect of the present invention made in order to solve the above problems is an extrusion apparatus for extruding an adhesive to the outside through a coating nozzle from a cartridge filled with the adhesive in an adhesive application apparatus that applies an adhesive to an adhesive surface. A member, a gas supply means for supplying heated gas to the application nozzle, and an operation of the gas supply means so that the heated gas is supplied to the application nozzle in conjunction with the operation of the extrusion member. And a controller for controlling.

  In this adhesive application device, the adhesive is pushed out from the cartridge through the application nozzle by the extrusion member and applied. At this time, the controller controls the operation of the gas supply means in conjunction with the operation of the pushing member, and the heated gas is supplied from the gas supply means to the application nozzle. Note that examples of the gas mixed into the adhesive include air and inert gas (such as nitrogen).

  In this way, by mixing the heated gas into the coating nozzle, the heated bubbles are mixed with the adhesive. As a result, the adhesive mixed with heated bubbles is discharged from the application nozzle and applied to the adhesive surface. Here, when air bubbles are mixed in the adhesive, the volume of the adhesive increases. Therefore, when the same amount as before the bubble mixing is applied, the amount of the adhesive used is reduced as compared with before the bubble mixing. That is, the amount of adhesive applied to the adhesive surface can be reduced. Further, since the heated gas is mixed with the adhesive, the curing of the adhesive is promoted, so that the adhesive can be bonded in a short time. That is, according to this adhesive application device, the amount of adhesive used can be reduced, and the curing time of the adhesive can be shortened to bond in a short time.

  In the above-described adhesive application device, it is desirable that a gas pulverizer that finely pulverizes the gas supplied from the gas supply means and mixes it with the adhesive is provided at the tip of the application nozzle.

  If the air bubbles mixed in the adhesive are large, there is a possibility that the adhesive strength and the sealing performance of the adhesive may be reduced. Therefore, in this adhesive application device, a gas pulverizer that finely pulverizes the gas supplied from the gas supply means and mixes it with the adhesive is provided at the tip of the application nozzle. Thereby, a fine bubble can be mixed with the adhesive within the application nozzle, and the adhesive mixed with the fine bubble can be discharged from the application nozzle. As a result, it is possible to reliably prevent the adhesive strength and the sealing performance of the adhesive from being deteriorated due to gas mixing.

  In the above-described adhesive application device, it is preferable that the controller controls the operation of the gas supply means so that the mixing ratio of the gas to the adhesive pushed out from the application nozzle is kept constant.

  With such a configuration, since the adhesive mixed with a certain ratio of gas is discharged from the application nozzle, it is possible to apply an adhesive with a stable quality. As a result, it is possible to more reliably prevent a decrease in adhesive strength and adhesive sealing performance due to gas mixing.

  Another aspect of the present invention, which has been made to solve the above problems, is an adhesive application method for applying an adhesive to an adhesive surface using an application nozzle, wherein the gas heated in the application nozzle is finely pulverized. Then, it is applied while being mixed with an adhesive.

  In this adhesive application method, the gas heated in the application nozzle is finely pulverized and applied to the adhesive while being applied. For the reasons described above, the amount of adhesive used is reduced and the curing time of the adhesive is reduced. Since it is shortened, it can be bonded in a short time.

  In the above-mentioned adhesive application method, it is desirable to apply while keeping the mixing ratio of the gas to the adhesive constant.

  By doing so, it is possible to apply a stable quality adhesive mixed with a certain proportion of gas to the bonding surface, and reliably prevent the adhesive strength and adhesive sealing performance from deteriorating due to the mixing of gas. can do.

  According to the adhesive application device and the application method according to the present invention, as described above, the amount of adhesive used is reduced and the curing time of the adhesive is shortened without reducing the adhesive strength and the sealing performance of the adhesive. And can be bonded in a short time.

It is a schematic block diagram which shows the outline of the adhesive agent coating apparatus which concerns on this Embodiment. It is sectional drawing to which the A section (tip part of an application nozzle) shown in Drawing 1 was expanded. It is a flowchart which shows the content of the adhesive application control in an adhesive agent coating apparatus.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying an adhesive application device and an application method of the present invention will be described below in detail with reference to the drawings. In the present embodiment, an adhesive application device that applies a silicone adhesive used as a sealing material for electronic components is exemplified. Therefore, the adhesive application device according to the present embodiment will be described with reference to FIGS. FIG. 1 is a schematic configuration diagram showing an outline of an adhesive application device according to the present embodiment. FIG. 2 is an enlarged cross-sectional view of a portion A (tip portion of the application nozzle) shown in FIG.

As shown in FIG. 1, the adhesive application device 10 includes a cartridge 11, a cartridge holder 12, a pressure cylinder 13, an application nozzle 14, a pump 15 with a heater, a conduit 16, a controller 17, and an XY. A stage 18 is provided.
The cartridge 11 is filled with a silicone adhesive 30 to be applied to the workpiece W in a substantially vacuum state. The cartridge 11 is held and fixed to the adhesive application device 10 by a cartridge holder 12. A pressure cylinder 13 is attached to the rear end (upward in FIG. 1) of the cartridge 11. The pressure cylinder 13 pushes the adhesive 30 in the cartridge 11 to the outside. The pressure cylinder 13 is connected to the controller 17 and operates based on an adhesive application instruction from the controller 17 (lowers in FIG. 1). The adhesive 30 is pushed out of the cartridge 11 by the operation of the pressure cylinder 13.

  On the other hand, a coating nozzle 14 is attached to the tip of the cartridge 11 (downward in FIG. 1). As a result, the adhesive 30 pushed out from the cartridge 11 is supplied to the application nozzle 14, discharged from the application nozzle 14, and applied to the adhesion surface of the workpiece W placed on the XY stage 18. Yes. The cartridge holder 12 can be raised and lowered, and the interval between the discharge port of the application nozzle 14 and the workpiece W can be adjusted by the raising and lowering operation of the cartridge holder 12. Then, by moving the XY stage 18, the adhesive can be applied to the entire adhesive surface of the workpiece W. The XY stage 18 is connected to the controller 17 and moves in a preset direction (XY direction) in conjunction with the operation of the pressurizing cylinder 13.

  Here, a flexible conduit 16 for introducing the gas G mixed in the adhesive 30 is connected to the tip of the coating nozzle 14. The other end of the conduit 16 is connected to a pump 15 with a heater. The heater-equipped pump 15 supplies the compressed gas G heated to a predetermined temperature, and is connected to the controller 17. As the supply gas G, an inert gas such as air or nitrogen can be used. Further, the heating temperature of the supply gas G may be room temperature or higher, preferably 50 ° C. or higher. This is because the curing time of the adhesive can be shortened. In this embodiment, air heated to 70 to 80 ° C. is used. If the heating temperature is increased too much (for example, if it is higher than 80 ° C. in the case of KE1833BK manufactured by Shin-Etsu Chemical Co., Ltd.), the adhesive is cured at the tip of the application nozzle 14 while the adhesive is not being applied. There is a fear. Then, the pump 15 with a heater operates the pressurized compressed gas G so that the mixing ratio of the heated compressed gas G with respect to the adhesive 30 is kept constant in conjunction with the operation of the pressurizing cylinder 13 according to an instruction from the controller 17. The application nozzle 14 is supplied through a conduit 16. In the present embodiment, the mixing ratio (volume ratio) of air to the adhesive is set to 4: 1.

  As shown in FIG. 2, a gas pulverizer 19 is provided at the connection portion of the conduit 16 in the coating nozzle 14. The gas pulverizer 19 has a mesh structure, and pulverizes the heated compressed gas G supplied from the conduit 16 into fine bubbles. When the adhesive 30 passes through the gas pulverizer 19, the heated compressed gas G that has become fine bubbles is mixed into the adhesive 30 at a constant rate. Thereby, the bubble mixed adhesive 30a having a stable quality (a constant air mixing rate) is discharged from the application nozzle 14.

  Next, an adhesive application method by the adhesive application device 10 having the above-described configuration will be described with reference to FIG. FIG. 3 is a flowchart showing the contents of adhesive application control in the adhesive application device.

  When the workpiece W is placed at a predetermined position on the XY stage 18, in the adhesive application device 10, the controller 17 issues an adhesive application instruction for applying the adhesive to the bonding surface of the workpiece W to each part. (Step S1). Then, the pressure cylinder 13 that has received this adhesive application instruction is activated (step S2). Specifically, it moves downward in FIG. 1 so as to compress the adhesive 30 in the cartridge 11. Also, the heater-equipped pump 15 that has received the adhesive application instruction operates (step S3). As a result, the heated compressed gas G is supplied to the tip of the coating nozzle 14 via the conduit 16.

  Here, when the heat-compressed gas G is mixed in the adhesive 30 as it is, there is a possibility that the adhesive strength is lowered or the adhesive sealing performance is lowered. However, in the adhesive application device 10, at the tip of the application nozzle 14, the heated compressed gas G, which has been made into fine bubbles by the gas pulverizer 19, is mixed into the adhesive 30 pushed out from the cartridge 11, and the bubbles are mixed. Agent 30a is formed. Then, the controller 17 outputs the output of the pump 15 with the heater so that the mixing ratio of the heated compressed gas G to the adhesive 30 is kept constant (in this embodiment, adhesive: gas = 4: 1). It is controlled. Then, the bubble mixed adhesive 30 a is discharged from the application nozzle 14 and applied to the adhesion surface of the workpiece W. At this time, the XY stage 18 receives the adhesive application instruction from the controller 17 and moves the workpiece W placed according to a preset movement pattern. Thereby, application | coating of the adhesive agent to the adhesion surface of the workpiece | work W is started. As described above, since the bubble-containing adhesive 30a mixed with the gas G at a certain ratio is discharged from the application nozzle 14, the bubble-containing adhesive 30a having a stable quality can be applied to the bonding surface of the workpiece W. . As a result, it is possible to reliably prevent the adhesive strength and the sealing performance of the adhesive from being deteriorated due to the mixing of the gas G.

  Further, when bubbles are mixed with the adhesive, the volume of the adhesive is increased. Therefore, when the same amount as before the bubble mixing is applied, the amount of the adhesive used is reduced as compared with before the bubble mixing. That is, the usage amount of the adhesive 30 applied to the bonding surface of the workpiece W can be reduced. In the present embodiment, the amount of adhesive 30 used can be reduced by about 20%.

  Then, the controller 17 determines whether or not to continue issuing the adhesive application instruction to each part (step S4). At this time, if the application instruction from the controller 17 is continued, that is, if the application of the adhesive to the adhesive surface of the workpiece W has not been completed (S4: YES), the process returns to step S2, and step S2 Repeat the process of ~ S4. Thereby, application | coating of the adhesive agent to the adhesion surface of the workpiece | work W progresses. On the other hand, when the application instruction from the controller 17 is not continued, that is, when the application of the adhesive to the bonding surface of the workpiece W is completed (S4: NO), the pressure cylinder 13 is stopped (step S5), and the heater The attached pump 15 stops (step S6). Thereby, application | coating of the bubble mixing adhesive agent 30a to the adhesion surface of the workpiece | work W is complete | finished.

  Thereafter, the workpiece is replaced and the adhesive is applied to a new workpiece in the same manner as described above. Then, a non-illustrated adhesive (electronic component) is bonded to the workpiece W to which the bubble-containing adhesive 30a is applied, and the bubble-containing adhesive 30a is cured to bond the adhesive to the workpiece W. .

  Here, since the two parts to be bonded are electronic parts and an adhesive is applied as a sealing material, it is necessary to prevent a gap between the two parts from being applied and cured. However, in order to absorb the influence of the warp and step of the two parts to be bonded, in other words, in order to apply the adhesive without gaps to the bonding part of the two parts, an amount of adhesive that can secure a sufficient height is used. It is necessary to apply. For this reason, since the bubble-containing adhesive 30a is applied to the workpiece W with a margin, there is a possibility that the time until the bubble-containing adhesive 30a is cured may be increased.

  However, since the heated gas G is mixed in the bubble-containing adhesive 30a, the curing of the bubble-containing adhesive 30a is promoted, so that the curing time is shortened. That is, adhesion (bonding) between the workpiece W and the adhesive can be completed in a short time. In the present embodiment, the curing time of the adhesive could be reduced to half. In this way, by applying the adhesive using the adhesive application device 10 according to the present embodiment, the amount of adhesive used is reduced, and the curing time of the adhesive is shortened to bond in a short time. be able to. In addition, after bonding (bonding) the adhesive to the workpiece W, the adhesive strength and the sealing performance of the adhesive were examined. However, the strength and the adhesive strength before using the adhesive 30 before the heat-compressed gas G was mixed were also increased. There was almost no decrease in performance.

  As described above in detail, according to the adhesive application device 10 according to the present embodiment, the heated compressed gas G from the heater-equipped pump 15 is converted into fine bubbles by the gas pulverizer 19 at the tip of the application nozzle 14. Then, it is mixed in the adhesive 30 pushed out from the cartridge 11, and a bubble mixed adhesive 30a is formed. The operation of the pressure cylinder 13 that pushes the adhesive 30 out of the cartridge 11 and the output of the pump 15 with the heater are controlled by the controller 17 so that the mixing ratio of the heated compressed gas G to the adhesive 30 in the bubble-containing adhesive 30a is constant ( It is controlled to be kept at adhesive: gas = 4: 1).

  The stable quality bubble-mixed adhesive 30 a formed in this way is applied to the adhesive surface of the workpiece W via the application nozzle 14. For this reason, the adhesive strength and the sealing performance due to the mixing of the gas G are surely prevented, and the usage amount of the adhesive 30 is reduced, and the curing time of the adhesive 30 (bubble-containing adhesive 30a) is shortened. And can be bonded in a short time.

  It should be noted that the above-described embodiment is merely an example and does not limit the present invention in any way, and various improvements and modifications can be made without departing from the scope of the invention. For example, in the above-described embodiment, the case where a silicone adhesive is used as the adhesive is exemplified, but the present invention is applied to any thermosetting adhesive other than the silicone adhesive (for example, an epoxy adhesive). be able to. Moreover, although the electronic component is illustrated as an object to be bonded, the present invention can be applied to a component other than the electronic component.

  Further, in the above-described embodiment, the workpiece W is moved and the adhesive is applied to the entire bonding surface. However, the workpiece W may be fixed and the cartridge 11 may be moved to apply the adhesive. . Furthermore, in the above-described embodiment, the cartridge 11 is moved up and down to adjust the gap between the coating nozzle 14 and the workpiece W. Instead of moving the cartridge 11 up and down, the XY stage 18 may be moved up and down. Good.

DESCRIPTION OF SYMBOLS 10 Adhesive application | coating apparatus 11 Cartridge 13 Pressure cylinder 14 Application | coating nozzle 15 Pump 16 with a heater 16 Conduit 17 Controller 19 Gas crusher 30 Adhesive 30a Bubble mixing adhesive G Gas W Workpiece

Claims (5)

In an adhesive application device that applies an adhesive to the adhesive surface,
An extrusion member for extruding the adhesive to the outside through a coating nozzle from a cartridge filled with the adhesive;
A gas supply means for supplying heated gas to the coating nozzle;
An adhesive coating apparatus comprising: a controller that controls the operation of the gas supply means so that the heated gas is supplied to the coating nozzle in conjunction with the operation of the extruding member. In the adhesive application device according to claim 1,
An adhesive applicator characterized in that a gas pulverizer for finely pulverizing the gas supplied from the gas supply means and mixing it into the adhesive is provided at the tip of the application nozzle. In the adhesive application device according to claim 1 or 2,
The said controller controls the operation | movement of the said gas supply means so that the mixing ratio of the said gas with respect to the adhesive extruded from the said coating nozzle may be maintained constant. In the adhesive application method for applying the adhesive to the adhesive surface using the application nozzle,
A method of applying an adhesive, wherein the gas heated in the application nozzle is finely pulverized and applied to the adhesive while being mixed. In the adhesive application method according to claim 4,
An adhesive application method comprising applying the gas while maintaining a constant mixing ratio of the gas to the adhesive.

Images