JP2011044355A - Plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plasma display panel with a structure having a color filter made of organic pigment, with gas released from the color filter restrained from entering a discharge space, and capable of being manufactured using low processing temperature. <P>SOLUTION: The plasma display panel is provided with a front plate 20a equipped with a plurality of display electrode pairs consisting of scanning electrodes and sustaining electrodes on a front-side substrate 2, a rear-face plate 8 having a plurality of address electrodes 10 three-dimensionally crossing the display electrode pairs on a rear-face side substrate 9, barrier ribs 12 zoning a discharge cell each at a crossing point of each address electrode and display electrode pair, and equipped with phosphor layers between the barrier ribs, a color filter 22 arranged on the front plate in correspondence to the phosphor layer of each discharge cell, and an inorganic coating layer 21 formed covering the color filter for restraining permeation of gas released from the color filter. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a plasma display panel (hereinafter referred to as PDP), and more particularly to improvement of a front plate portion in an AC driven surface discharge type PDP.

  The PDP is a display device that displays an image by causing plasma discharge of a gas such as Ne, Xe, or Ar, and exciting and emitting phosphors with generated ultraviolet rays to convert them into visible light. This PDP includes an alternating current (hereinafter referred to as AC) drive type and a direct current (hereinafter referred to as DC) drive type. The AC drive type is superior to the DC drive type in terms of performance in terms of luminance, light emission efficiency, and lifetime, and the PDP is the main driving method.

  An example of the configuration of a typical AC surface discharge type PDP as an AC drive type is shown in FIGS. FIG. 14 is a perspective view showing a part of the PDP in a state where the front plate 1 and the back plate 8 are separated. FIG. 15 shows a state in which the front plate 1 and the back plate 8 of FIG. 14 are combined, and is a cross-sectional view along the direction crossing the scan electrode 3 and the sustain electrode 4 in FIG.

  The front plate 1 has a configuration in which display electrode pairs 5 including scan electrodes 3 and sustain electrodes 4 that perform surface discharge are arranged in parallel on the surface of a transparent and insulating front side substrate 2. Scan electrode 3 and sustain electrode 4 are each composed of transparent electrodes 3a, 4a formed on the surface of front substrate 2 and bus electrodes 3b, 4b formed thereon. The bus electrodes 3b and 4b are made of, for example, silver (Ag) and a glass frit material as a binding material thereof. A front-side dielectric layer 6 is formed so as to cover the display electrode pair 5, and a protective film 7 is formed thereon.

  On the other hand, on the back plate 8, address electrodes 10 for writing image data are arranged in a direction orthogonal to the display electrode pair 5 on the front side substrate 2 on the surface of the transparent and insulating back side substrate 9. And the upper surface thereof is covered with the back-side dielectric layer 11. A partition wall 12 is formed on the back side dielectric layer 11. The barrier ribs 12 have a cross beam shape formed by vertical barrier ribs 12a formed extending in a direction parallel to the address electrodes 10 and horizontal barrier ribs 12b formed in a direction orthogonal thereto. Each pixel is defined by a region surrounded by the vertical barrier ribs 12a and the horizontal barrier ribs 12b. In each pixel region, a red (R) phosphor layer 13r, a green (G) phosphor layer 13g, a blue color (blue) (corresponding to the address electrode 10) are formed on the side surface of the partition wall 12 and the surface of the back side dielectric layer 11. B) A phosphor layer 13b (collectively referred to as “phosphor layer 13”) is formed by coating.

  The front plate 1 and the back plate 8 face each other so that the display electrode pair 5 and the address electrode 10 form a matrix. A space surrounded by the vertical barrier ribs 12a and the horizontal barrier ribs 12b between the front plate 1 and the rear plate 8 becomes a discharge space 14 of each pixel. Corresponding to each discharge space 14, the display electrode pair 5 and the address electrode 10 are three-dimensionally crossed to form a discharge cell 15. A black stripe 16 is formed between the display electrode pair 5 of the front plate 1 so as to face the top of the horizontal partition wall 12b.

  The outer peripheral portions of the front plate 1 and the back plate 8 are sealed by a sealing material such as glass frit (not shown), and a discharge gas composed of a mixed gas of neon (Ne) and xenon (Xe) in the discharge space 14. Is enclosed. For example, a discharge gas having a Xe ratio of 10% is used, and the discharge gas is sealed at a pressure of about 450 Torr (about 60 kPa).

  In the PDP having the above configuration, ultraviolet light is generated by gas discharge, and the phosphor layer 13 of each color of R, G, B is excited by the generated ultraviolet light to emit light, thereby performing color display. That is, when an AC voltage of several tens to several hundreds of kHz is applied between the sustain electrode 4 and the scan electrode 3 via the bus electrodes 3b and 4b and discharged, the excited Xe atoms are generated when returning to the ground state. The phosphor layer 13 can be excited by ultraviolet rays. By this excitation, the phosphor layer 13 generates colored light according to the applied material. If a pixel and a color to be emitted are selected by the address electrode 10, a necessary color can be emitted in a predetermined pixel portion, and a color image can be displayed.

  In the AC drive type PDP having such a configuration, the front-side dielectric layer 6 formed on the display electrode pair 5 exhibits a specific current limiting function, and therefore has a longer life than the DC drive type PDP. . The front-side dielectric layer 6 is formed by a printing / firing method after the display electrode pair 5 and the black matrix 16 are formed and it is necessary to securely cover them. The protective film 7 is provided to prevent the front-side dielectric layer 6 from being sputtered by plasma discharge, and is required to be a material having excellent sputtering resistance. For this reason, magnesium oxide (MgO) is often used.

  In the PDP as described above, a configuration is known in which the front-side dielectric layer 6 interposed between the display electrode pair 5 and the discharge space is replaced with a dielectric thin plate 17 such as a microsheet as shown in FIG. It has been.

  In this case, the protective film 7 is formed on the discharge space 14 side of the dielectric thin plate 17. Further, the display electrode pair 5 including the transparent electrodes 3a and 4a and the bus electrodes 3b and 4b is provided on the other surface which is the front side. Further, a transparent insulating film 18 is formed so as to cover the display electrode pair 5. Then, the discharge space 14 side of the dielectric thin plate 17 is sealed to the back-side substrate 9 with a sealing material such as low-melting glass. On the other hand, a fixed gap 19 is provided on the dielectric thin plate 17, and the front side substrate 2 as a transparent protective substrate is joined.

  Thus, by using the dielectric thin plate 17 instead of the front-side dielectric layer 6, the conventional complicated manufacturing process for forming the dielectric layer can be simplified. Further, by sealing the dielectric thin plate 17 to the back side substrate 9 with a sealing material such as low melting point glass, the front side substrate 2 is not exposed to high temperatures during the manufacturing process.

Here, the microsheet is a thin dielectric sheet such as borosilicate glass mainly composed of silicon dioxide (SiO ₂ ) and boron trioxide (B ₂ O ₃ ). The thickness is about 30 μm and at most about 50 μm. Such a microsheet is widely used as, for example, a sheet of a liquid crystal display device, and has high heat resistance and low expansion rate.

  On the other hand, for example, Patent Documents 1 and 2 describe a configuration in which a color filter layer is provided to improve color purity, improve contrast of image display, and the like. Patent Documents 1 and 2 describe that an organic material that is vulnerable to high temperatures can be used for the color filter layer by using a dielectric thin plate (paragraphs 0027, 0035, 0041, Patent Document 1). 0092, paragraph 0021 of Patent Document 2.

  That is, if the dielectric thin plate 17 is sealed to the back side substrate 9 with a sealing material such as low melting glass, the front side substrate 2 can be avoided from being exposed to a high temperature during the manufacturing process. Therefore, if the front side substrate 2 is provided with a color filter, the color filter can be formed of an organic material that is weak at high temperatures, and the optical characteristics can be improved. In that case, the color filter is formed on the inner surface side of the front substrate 2 in alignment with the patterns of the three primary color phosphor layers 13r, 13g, and 13b, and also in black stripes in alignment with the positions of the barrier ribs 12. The

  When a color filter is provided in the PDP, the bright place contrast is improved as described below. That is, the color filter transmits a specific wavelength band, but does not transmit other wavelength bands. Usually, a red color filter transmits a red wavelength band (for example, 590 to 700 nm). The blue color filter transmits a blue wavelength band (for example, 400 to 490 nm). The green color filter transmits the green wavelength band (490 to 590 nm). In particular, in the case of a color filter using an organic pigment, when light enters, wavelengths other than a specific wavelength band are not transmitted and are absorbed by the color filter.

  External light (for example, white light) is light having a continuous spectrum in a wavelength region (visible light region) of 400 to 700 nm. When external light is incident on a color filter using an organic pigment, the red color filter transmits only a wavelength band of 590 to 700 nm, and absorbs light in other wavelength bands. The blue color filter transmits only the wavelength band of 400 to 490 nm, and absorbs light in other wavelength bands. The green color filter transmits only the wavelength band of 490 to 590 nm and absorbs light of other wavelength bands. Accordingly, since the outside light other than the specific wavelength band of each color filter is absorbed, the outside light that is transmitted through the color filter and reflected by the back plate or the like and radiated from the panel is greatly reduced.

  For example, 100% transmittance of each specific wavelength band of the color filter (red color filter: 590 to 700 nm, blue color filter: 400 to 490 nm, green color filter: 490 to 590 nm), transmission in other wavelength bands Assuming that the rate is 0% and the reflectance of the back plate or the like is 100%, only 1/3 of the external light incident on the color filter is emitted from the panel. When there is no color filter, all the incident external light is reflected by the back plate and emitted from the panel.

Japanese Patent No. 3849735 Japanese Patent Laid-Open No. 10-177845

  As described above, it is desirable to use an organic pigment as a color filter material that absorbs external light other than the specific wavelength band in order to improve the bright place contrast by providing a color filter in the PDP. However, in order to use an organic pigment color filter, it is necessary to solve the following problems.

  As described in Patent Documents 1 and 2, a color filter is formed on the inner surface of the front substrate, and on the color filter side surface of the dielectric thin plate, a display electrode pair consisting of a transparent electrode and a bus electrode, In the case of the structure in which the insulating layer covering the display electrode pair is formed, there are the following problems. That is, since the color filter is disposed on the front substrate, the distance between the light source (phosphor surface) and the color filter is long, and the viewing angle dependency of image display is strong. In particular, when the width of the bus electrode is narrowed and thickened to increase the aperture ratio, the distance between the color filter and the light source becomes longer and the viewing angle dependency becomes stronger.

  In other words, when the color filter is arranged on the front substrate, the light generated from the light source (phosphor surface) passes through the light source, the dielectric thin plate, the insulating layer, and the color filter before reaching the color filter. Therefore, the color filter is separated from the light source by the thickness of the dielectric thin plate and the electrode. When the bus electrode is attached to the dielectric thin plate, the insulating layer is a layer that fills a space between the bus electrode and the dielectric thin plate. Further, since the phosphor layer is also formed on the bottom side of the partition wall, in the case of light from the bottom side of the partition wall, the color filter is further separated by the height of the partition wall.

  For example, consider a case where a color filter is formed on the front side substrate separately for each discharge cell. It is assumed that light emission occurs on the surface of the protective film formed on the dielectric thin plate. (Accurately, since the phosphor emits light, there is also light emission at a position lower than the protective film by about 100 to 150 μm by the height of the partition wall). Considering when only one point emits red light, in the normal case, only one point on the screen should be identified as red. The emitted light passes through the dielectric thin plate and the insulating layer and reaches the color filter.

  When refraction and reflection are not considered, the emitted light spreads isotropically in the dielectric thin plate and the insulating layer. Here, considering the case where the color filter is separated from the light source, since the position where the light is emitted and the position of the color filter are the same when viewed from the front, the emitted red light passes through the color filter and is emitted to the outside.

  On the other hand, when the viewpoint is slightly inclined, there is a position where the red light is seen through the blue and green color filters. At this time, since the red wavelength band is cut, it does not appear to emit light. Depending on where you look, it can be a screen with a single red glow, or it may look dark. This is a problem that occurs when light emission is viewed through a color filter that should not be transmitted. When the light emission location and the position of the color filter are close, the emitted light passes through the nearby color filter to be transmitted and does not pass through the color filter that should not be transmitted a little far away, so there is no viewing angle dependency.

  Considering that this viewing angle dependency is a phenomenon that occurs due to the large distance between the light emitting part and the color filter, it is ideal to place the color filter between the dielectric thin plate and the protective film. is there. However, in order to use an organic pigment, it is necessary to consider that it cannot endure the high temperature process at the time of panel sealing. If it is an inorganic pigment, it is possible to arrange it at an ideal position, but it is desirable to use an organic pigment because of its poor optical properties.

  The viewing angle dependency is particularly problematic when the width of the bus electrode needs to be narrowed and thickened in order to reduce the light shielding by the bus electrode as much as possible and increase the light extraction efficiency. Since the bus electrode has a function of supplying a discharge current to each cell, the resistance value of the bus electrode increases when the bus electrode becomes thin. Therefore, a voltage drop (= discharge current × bus electrode resistance value) occurs, and a predetermined voltage cannot be applied to each cell. Therefore, even when the width of the bus electrode is narrowed, it is necessary to make the resistance value of the bus electrode equal or less. In order to reduce the resistance value of the bus electrode to the same or lower while making the bus electrode thinner, it is necessary to make the bus electrode thicker (high aspect ratio shape). As a result, the unevenness of the bus electrode becomes large, and thus the insulating layer must be thickened. Therefore, the distance from the light source (phosphor surface) to the color filter is increased, and the viewing angle dependency is emphasized.

  Moreover, when providing a color filter in PDP, it is desirable to use the color filter which consists of an organic pigment as above-mentioned. However, when a color filter made of an organic pigment is used, the release gas (for example, hydrocarbon, carbon dioxide, etc.) enters the discharge space from the organic material that is the constituent material of the color filter, and the release gas adheres to the protective film, thereby protecting The film is contaminated and the discharge start voltage is increased, which adversely affects the discharge operation.

  In view of the above, the present invention provides a plasma display panel having a configuration including a color filter made of an organic pigment and capable of suppressing the emission gas from the color filter from entering the discharge space. Objective.

  Even when the aperture ratio is improved by reducing the width of the bus electrode by having a color filter made of an organic pigment, the influence on the viewing angle dependency by increasing the thickness of the bus electrode is affected. An object of the present invention is to provide a plasma display panel that can be suppressed.

  In order to solve the above-described problems, a plasma display panel having a first configuration according to the present invention includes a front plate in which a plurality of display electrode pairs including scan electrodes and sustain electrodes are provided on a front substrate, and a rear substrate. A plurality of address electrodes that are three-dimensionally crossed with the display electrode pair are provided, and a partition wall for partitioning discharge cells is provided at an intersection of the address electrode and the display electrode pair, and a phosphor layer is provided between the partition walls. A back plate, a color filter disposed on the front plate corresponding to the phosphor layer of each discharge cell, and the color filter are formed so as to cover the color filter, and control of emission gas from the color filter is suppressed. And an inorganic coat layer.

  The plasma display panel according to the second configuration of the present invention includes a front plate provided with bus electrodes for forming a plurality of display electrode pairs including scan electrodes and sustain electrodes on a front substrate, and a rear substrate. A plurality of address electrodes that are three-dimensionally intersected with the display electrode pair are provided, a partition wall for partitioning discharge cells is provided at an intersection of the address electrode and the display electrode pair, and a phosphor layer is provided between the partition walls. A back plate, a thin plate for dielectric disposed between the front plate and the back plate, and the front plate and the thin plate for dielectric corresponding to the bus electrodes so as to form the plurality of display electrode pairs. And a color filter disposed between the front plate and the dielectric thin plate so as to correspond to the phosphor layer of each discharge cell.

  According to the first configuration, by providing the inorganic coat layer that covers the color filter, it is possible to effectively suppress the permeation of the emission gas from the color filter and to prevent the emission gas from entering the discharge space. . Moreover, it becomes possible to arrange | position a color filter in the position close | similar to an inorganic coat layer, and, thereby, viewing angle dependence is reduced. Accordingly, it is possible to improve the light extraction efficiency by maintaining the viewing angle dependency in a favorable range, making the bus electrode thinner and thicker, and improving the aperture ratio.

  Moreover, according to the said 2nd structure, permeation | transmission of the emitted gas from a color filter can be effectively suppressed by the thin plate for dielectric materials. Further, by providing the bus electrode on the front substrate, the color filter can be disposed in the vicinity of the dielectric thin plate, thereby reducing the viewing angle dependency. Accordingly, it is possible to improve the light extraction efficiency by maintaining the viewing angle dependency in a favorable range, making the bus electrode thinner and thicker, and improving the aperture ratio.

Sectional drawing which shows a part of PDP of the 1st aspect in Embodiment 1 of this invention. Sectional drawing which shows a part of PDP of the 2nd aspect Sectional drawing which shows the principal part of the PDP The top view which shows the planar shape of the color filter in embodiment of this invention The top view which shows the other example of the planar shape of the color filter Sectional drawing which shows a part of PDP of the 1st aspect in Embodiment 2 of this invention. Sectional drawing which shows a part of PDP of the 2nd aspect Sectional drawing which shows a part of PDP of the 1st aspect in Embodiment 3 of this invention. Sectional drawing which shows a part of PDP of the 2nd aspect Sectional drawing which shows a part of PDP of the 1st structural example of the 1st aspect in Embodiment 4 of this invention. Sectional drawing which shows a part of PDP of the 2nd structural example of the 1st aspect Sectional drawing which shows a part of PDP of the 3rd structural example of the 1st aspect. Sectional drawing which shows a part of PDP of the 1st structural example of the said 2nd aspect. Sectional drawing which shows a part of PDP of the 2nd structural example of the said 2nd aspect. Sectional drawing which shows a part of PDP of the 3rd structural example of the said 2nd aspect. Sectional drawing which shows a part of PDP of the 1st structural example of the said 3rd aspect. Sectional drawing which shows a part of PDP of the 2nd structural example of the said 3rd aspect. Sectional drawing which shows a part of PDP of the 1st structural example of the 1st aspect in Embodiment 5 of this invention. Sectional drawing which shows a part of PDP of the 2nd structural example of the 1st aspect Sectional drawing which shows a part of PDP of the 3rd structural example of the 1st aspect. Sectional drawing which shows a part of PDP of the 1st structural example of the said 2nd aspect. Sectional drawing which shows a part of PDP of the 2nd structural example of the said 2nd aspect. Sectional drawing which shows a part of PDP of the 3rd structural example of the said 2nd aspect. Sectional drawing which shows a part of PDP of the 1st structural example of the said 3rd aspect. Sectional drawing which shows a part of PDP of the 2nd structural example of the said 3rd aspect. Sectional drawing which shows a part of PDP of the 1st aspect in Embodiment 6 of this invention. Sectional drawing which shows a part of PDP of the 2nd aspect Sectional drawing which shows a part of PDP of the 3rd aspect The perspective view which showed a part of PDP of a prior art example in the state which isolate | separated the front plate 1 and the back plate 8. Sectional drawing which shows the state by which the front plate 1 and the back plate 8 of FIG. 14 were united. Sectional drawing which shows a part of other structural example of PDP of a prior art example

  The plasma display panel of the present invention can take the following aspects based on the above-described configuration.

  That is, in the plasma display panel having the first configuration, the color filter is provided on the surface of the front substrate, the display electrode pair is provided on the color filter, and the inorganic coat layer is formed of the display electrode pair. It can be set as the structure provided on the said color filter containing.

  The display electrode pair is provided on the surface of the front substrate, the color filter is provided on the front substrate so as to cover the display electrode pair, and the inorganic coat layer is provided on the color filter. Can be configured.

  In addition, an overcoat layer may be provided on at least one of the upper surface of the color filter and the upper surface of the display electrode pair.

  Moreover, it can be set as the structure provided with the organic dielectric material layer in the said front side board | substrate side of the said inorganic coat layer.

  Further, in the plasma display panel of the second configuration, the bus electrode is embedded in the front substrate while exposing only the surface, the transparent electrode is formed on the surface of the dielectric thin plate, and the color filter The transparent electrode may be covered and formed on the dielectric thin plate.

  Further, the bus electrode is embedded in the front substrate while exposing only the surface, the color filter is formed on a surface of the dielectric thin plate facing the bus electrode, and the transparent electrode is the color filter. It may be configured to be formed on the front side substrate including the top or the bus electrode surface.

  In addition, the bus electrode is embedded in the front side substrate with only the surface exposed, the color filter is formed on the front side substrate including the bus electrode surface, and the transparent electrode is formed of the dielectric thin plate. It can be configured to be formed on a surface or on the color filter.

  Further, the bus electrode is embedded in the front substrate so that only the surface is exposed, the transparent electrode is formed on the front substrate including the bus electrode surface, and the color filter covers the transparent electrode. It may be configured to be formed on the front substrate.

  The bus electrode is disposed on the front substrate, the color filter is formed between the bus electrodes on the front substrate surface, and the transparent electrode includes the bus electrode surface. It can be configured to be formed on or on the surface of the dielectric thin plate.

  The bus electrode is disposed on the front substrate, a low reflection layer is formed between the bus electrodes on the front substrate surface, and the transparent electrode is formed on the surface of the dielectric thin plate. The color filter may be formed on the dielectric thin plate so as to cover the transparent electrode.

  The bus electrode is disposed on the front substrate, a low reflection layer is formed between the bus electrodes on the front substrate surface, and the color filter is opposed to the bus electrode of the dielectric thin plate. The transparent electrode can be formed on the color filter or on the low reflection layer including the bus electrode surface.

  The bus electrode is disposed on the front substrate, a low reflection layer is formed between the bus electrodes on the front substrate surface, and the color filter includes the bus electrode surface on the low reflection layer. The transparent electrode can be formed on the surface of the dielectric thin plate or on the color filter.

  Further, the bus electrode is disposed on the front substrate, a low reflection layer is formed between the bus electrodes on the front substrate surface, and the transparent electrode includes the bus electrode surface on the low reflection layer The color filter may be formed on the low reflection layer so as to cover the transparent electrode.

  The bus electrode is disposed on the front substrate, a low reflective layer and the color filter are sequentially formed between the bus electrodes on the front substrate surface, and the transparent electrode is disposed on the bus electrode surface. It can be set as the structure formed on the surface of the said color filter containing or the said thin plate for dielectrics.

  Further, the color filter is formed on the surface of the dielectric thin plate, an overcoat layer is formed to cover the color filter, and the transparent electrode is formed on the surface of the overcoat layer. Can do.

  Further, the bus electrode is embedded in the front substrate so that only the surface is exposed, the color filter is formed on the surface of the front substrate including the bus electrode surface, and the overcoat is formed so as to cover the color filter. A layer may be formed, and the transparent electrode may be formed on the surface of the overcoat layer.

  Further, the bus electrode is disposed on the front substrate, a low reflection layer is formed between the bus electrodes on the front substrate surface, and the low reflection layer including the bus electrode surface is formed on the surface of the low reflection layer. A color filter is formed, an overcoat layer is formed so as to cover the color filter, and the transparent electrode is formed on the surface of the overcoat layer.

  The bus electrode is disposed on the front substrate, the color filter and an overcoat layer are sequentially formed between the bus electrodes on the front substrate surface, and the transparent electrode is formed on the bus electrode surface. It can be set as the structure formed on the surface of the said overcoat layer containing.

  The refractive index of the front substrate may be less than 1.15 times the refractive index of the color filter.

  Further, a transparent insulating layer is interposed between the front substrate and the color filter, and the refractive indexes of the front substrate and the transparent insulating layer are each less than 1.15 times the refractive index of the color filter. It can be.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The basic configuration of the PDP according to the embodiment of the present invention is the same as that of the conventional PDP shown in FIGS. Accordingly, the same elements as those shown in FIG. 16 are described with the same reference numerals, and the overlapping description is simplified.

(Embodiment 1)
The PDP in the first embodiment will be described with reference to FIGS. 1A to 1C. 1A and 1B are cross-sectional views showing a part of two configuration examples of the PDP in the first exemplary embodiment. 1C is a cross-sectional view showing a main part in FIG. 1B.

  A basic configuration of the present embodiment will be described with reference to FIG. 1A. In this PDP, the front plate 20a includes a front substrate 2, transparent electrodes 3a and 4a, bus electrodes 3b and 4b, a color filter 22 made of an organic pigment, and an inorganic coat layer 21. The inorganic coat layer 21 is formed so as to cover the color filter 22, and has a function of suppressing the permeation of the released gas from the color filter 22 and preventing the gas from entering the discharge space 14. It is also desirable to have a function of preventing the color filter from being discolored by ultraviolet rays generated during discharge. This is because when a color filter made of an organic pigment is used, the color filter may be discolored due to the influence of ultraviolet rays generated during discharge.

  The transparent electrodes 3a and 4a and the bus electrodes 3b and 4b constitute a plurality of display electrode pairs 5 including the scan electrodes 3 and the sustain electrodes 4 as in the conventional example. The back plate 8 has the same structure as that of the conventional example shown in FIGS. In the rear plate 8, a plurality of address electrodes 10 that are three-dimensionally intersected with the display electrode pair 5 are provided on the rear substrate 9, and discharge cells are formed at the intersections of the address electrode 10 and the display electrode pair 5. A partition wall 12 that partitions the discharge space 14 is provided, and a phosphor layer (not shown, see FIGS. 14 to 16) is provided between the partition walls 12.

  In the configuration of the first mode shown in FIG. 1A, the color filter 22 is provided on the surface of the front substrate 2, the transparent electrodes 3a and 4a are provided on the color filter 22, and the bus electrodes 3b and 4b are transparent electrodes 3a, 4a is provided. Therefore, the inorganic coat layer 21 is provided on the color filter 22 including the transparent electrodes 3a and 4a and the bus electrodes 3b and 4b.

  On the other hand, in the configuration of the second mode shown in FIG. 1B, the transparent electrodes 3a and 4a are provided on the surface of the front substrate 2, the bus electrodes 3b and 4b are provided on the transparent electrodes 3a and 4a, and the color filter 22 is provided. The transparent electrodes 3a and 4a and the bus electrodes 3b and 4b are provided on the front substrate 2 so as to cover them. Therefore, the inorganic coat layer 21 is provided on the color filter 22.

  In order to employ the configuration in which the inorganic coating layer 21 is provided as described above, as shown in FIG. 1C (a), the end of the color filter 22 (region surrounded by the alternate long and short dash line A) has a gentle inclination. It is desirable to form so as to have. If this inclination is steep or vertical as shown in FIG. 1C (b), or is opposite as shown in FIG. 1C (c), stress is generated and cracking occurs when the inorganic coat layer 21 is provided. There is a case.

  In the present embodiment, the color filter 22 includes an organic pigment and a resin as main components, but it is desirable to use a material having heat resistance up to 250 ° C. or 300 ° C. In other words, the inorganic coating layer 21 (and a protective film to be described later) needs to have heat resistance enough to form a film by physical vapor deposition, chemical vapor deposition, or sputtering.

The inorganic coat layer 21 is made of a transparent inorganic material (for example, SiO ₂ , Al ₂ O ₃ , Y ₂ O ₃ , MgO, CaO, SrO, etc.) and has a thickness of about several μm. A function of suppressing the gas released from the organic matter such as the color filter 22 from entering the discharge space 14 is provided. It is also desirable to have a function of cutting out ultraviolet rays so that ultraviolet rays radiated in the discharge space 14 do not hit organic substances such as the color filter 22. For example, when the inorganic coat layer is SiO ₂ , the short wavelength (147 nm) of the ultraviolet rays generated during the discharge of the PDP can be blocked by the inorganic coat layer. However, it is difficult to block the long wavelength (173 nm) of the ultraviolet rays generated during the discharge of the PDP with the inorganic coat layer (SiO ₂ ). Therefore, after forming the SiO ₂ layer, a layer that does not transmit ultraviolet light may be further laminated. That is, in the case of SiO ₂ , ultraviolet rays (173 nm) due to discharge can be blocked by providing a protective film (MgO, CaO, SrO, etc.).

For example, when the inorganic coat layer is Y ₂ O ₃ , both the short wavelength and the long wavelength of the ultraviolet rays generated during the discharge of the PDP can be blocked by the inorganic coat layer.
The color filter 22 is disposed corresponding to the phosphor layer in each discharge space 14. The planar shape of the color filter 22 is shown in FIG. 2A. It consists of a red filter layer 22r, a blue filter layer 22b, a green filter layer 22g, and a black stripe 22k. The black stripes 22k are arranged corresponding to the partition walls 12. Another example of the planar shape of the color filter 22 is shown in FIG. 2B. It consists of a red filter layer 22r, a blue filter layer 22b, a green filter layer 22g, and a black stripe 22k. The black stripes 22k are arranged corresponding to only the vertical partition walls 12.

In order to produce the front plate 20a in the configuration of FIG. 1A, the following manufacturing method can be used. First, the color filter 22 is formed on the front side substrate 2 by a photolithography method or an ink jet method. For example, assume that the heat resistance temperature of the color filter is 250 ° C. Next, after forming an ITO film by sputtering or the like in a region where the transparent electrodes 3a and 4a are to be formed (temperature less than 250 ° C.), an electrode pattern of the transparent electrodes 3a and 4a is formed by etching. Next, after forming a metal film (Cr / Cu / Cr or the like) by sputtering or the like in a region where the bus electrodes 3b and 4b are to be formed (temperature less than 250 ° C.), an electrode pattern of the bus electrodes 3b and 4b is formed by etching. To do. In order to form the inorganic coat layer 21, a film such as SiO ₂ is formed by chemical vapor deposition or sputtering in a range that sufficiently covers the region where the color filter 22 is formed (temperature of less than 250 ° C.).

  In order to produce the front plate 20b in the configuration of FIG. 1B, the following manufacturing method can be used. First, the process up to the formation of the bus electrodes 3b and 4b may be the same as the conventional process, and thus the description thereof is omitted. Next, the color filter 22 is formed by a photolithography method or an ink jet method. Further, the inorganic coat layer 21 is formed in the same manner as in the configuration of FIG. 1A described above.

  The process for producing the PDP after producing the front plate 20a or 20d as described above can be performed as follows. First, after depositing a protective film on the prepared front plate 20a or 20d (temperature less than 250 ° C.), the front plate 20a or 20d and the back plate 8 are positioned in a space in which the atmosphere is controlled without being exposed to the atmosphere. Combine.

  Next, the seal paste formed on the back plate 8 in a space in which the atmosphere is controlled is locally heated with, for example, a laser to seal the front plate and the back plate. At that time, the temperature of the region in which the color filter 22 is formed is maintained at a temperature lower than 250 ° C. (basically, room temperature). Next, after exhausting, gas is introduced and the exhaust pipe is chipped off. The exhaust pipe is preferably connected to the rear substrate 9 in advance.

  When the panel is assembled and sealed in a place other than the space where the atmosphere is controlled, for example, in the atmosphere, the protective film is hydroxylated. In general, there is a step of heating while exhausting and returning the hydroxylation of the protective film. For example, in the case of MgO, the temperature needs to be 300 ° C. or higher.

  In the present embodiment, after deposition of the protective film, by performing paneling in a space in which the atmosphere is controlled, there is no need to return the hydroxylation of the protective film, and the process can be performed at a temperature of less than 250 ° C. As described above, the PDP can be manufactured without deterioration of the process of the color filter 22 by forming it at a temperature lower than 250 ° C. in all steps. The color filter may not transmit infrared rays. This eliminates the need to provide an infrared cut filter on the front substrate 2.

(Embodiment 2)
The PDP in Embodiment 2 will be described with reference to FIGS. 3A and 3B. 3A and 3B are cross-sectional views showing part of two configuration examples of the PDP in the second exemplary embodiment.

  The present embodiment is characterized in that overcoat layers 23a and 23b are added to the configuration of the first embodiment. The overcoat layers 23 a and 23 b are formed to flatten the surface of the color filter 22. This is because it is difficult to form the transparent electrodes 3a and 4a on the color filter 22 if the color filter 22 has poor flatness (large irregularities).

  The configuration of the first aspect shown in FIG. 3A corresponds to the configuration shown in FIG. 1A of the first embodiment. That is, in the front plate 20c, the color filter 22 is provided on the surface of the front substrate 2 and the overcoat layer 23a is formed thereon. Transparent electrodes 3a and 4a and bus electrodes 3b and 4b are sequentially formed on the overcoat layer 23a, and an overcoat layer 23b is formed thereon. Therefore, the inorganic coat layer 21 is provided on the overcoat layer 23b.

  On the other hand, the configuration of the second mode shown in FIG. 3B corresponds to the configuration shown in FIG. 1B of the first embodiment. That is, in the front plate 20d, the transparent electrodes 3a and 4a and the bus electrodes 3b and 4b are sequentially formed on the surface of the front substrate 2, and the overcoat layer 23c is formed thereon. The color filter 22 is formed on the overcoat layer 23c, and the overcoat layer 23d is formed thereon. Therefore, the inorganic coat layer 21 is provided on the overcoat layer 23d.

  As described above, the unevenness can be reduced by forming the overcoat layers 23a to 23d. It is sufficient that the element can be completely formed along the unevenness in the next process, but if it cannot be formed, a space is created. In this state, when a strong electric field is applied when driving the panel, dielectric breakdown occurs. If the overcoat layers 23a to 23d are provided, occurrence of such a situation can be suppressed.

  The overcoat layers 23a to 23d are formed of an acrylic resin, an epoxy resin, or a polyimide resin and are transparent. The thickness is about 2 μm. It has heat resistance of 250 ° C or 300 ° C.

  In the case of the overcoat layers 23a and 23d in the previous stage of the color filter 22, by setting the refractive index to the same level as that of the color filter 22, it is possible to suppress total reflection of external light at the interface between the overcoat layers 23a and 23d and the color filter 22. can do.

  The overcoat layers 23a to 23d can be formed using a printing apparatus such as a slit coater (temperature of less than 250 ° C.). Moreover, according to the structure of this Embodiment, formation of the inorganic coat layer 21 which covers organic substances, such as overcoat layers 23a-23d and the color filter 22, is not performed at each process, but it performs collectively. Thus, the process can be shortened.

  As in the first embodiment, the end portions of the color filter 22 and the overcoat layers 23a to 23d have a gentle slope.

(Embodiment 3)
The PDP in Embodiment 3 will be described with reference to FIGS. 4A and 4B. 4A and 4B are cross-sectional views showing a part of two configuration examples of the PDP in the third exemplary embodiment.

  This embodiment is characterized in that an organic dielectric layer 24 is added to the configuration of the second embodiment. The organic dielectric layer 24 is formed in order to compensate the thickness of the dielectric layer on the electrode and ensure a dielectric strength. Details will be described later.

  The configuration of the first aspect shown in FIG. 4A corresponds to the configuration shown in FIG. 3A of the second embodiment. That is, in the front plate 20e, the color filter 22 is provided on the surface of the front substrate 2 and the overcoat layer 23a is formed thereon. Transparent electrodes 3a and 4a and bus electrodes 3b and 4b are sequentially formed on the overcoat layer 23a, and an overcoat layer 23b is formed thereon. Further, an organic dielectric layer 24 is formed on the overcoat layer 23b, and an inorganic coat layer 21 is provided thereon.

  On the other hand, the configuration of the second mode shown in FIG. 4B corresponds to the configuration shown in FIG. 3B of the second embodiment. That is, in the front plate 20f, the transparent electrodes 3a and 4a and the bus electrodes 3b and 4b are sequentially formed on the surface of the front substrate 2, and the overcoat layer 23c is formed thereon. The color filter 22 is formed on the overcoat layer 23c, and the overcoat layer 23d is formed thereon. Further, the organic dielectric layer 24 is formed on the overcoat layer 23d, and the inorganic coat layer 21 is provided thereon.

  4A and 4B, the organic dielectric layer is disposed immediately below the inorganic coat layer, but the positional relationship between the organic dielectric layer and the color filter may be reversed. Thereby, the color filter and the light emission source can be brought close to each other.

  The organic dielectric layer 24 is made of acrylic resin, epoxy resin, or polyimide resin and is transparent. The thickness is about 10 to 20 μm. It is desirable to have heat resistance of about 250 ° C or 300 ° C.

  Hereinafter, securing the withstand voltage as a function obtained by providing the organic dielectric layer 24 will be described. For example, in the case of the structure of the first mode of FIG. 3A in Embodiment 2, the inorganic coat layer 21 and the overcoat layer 23b function as substitute elements for the dielectric layer on the discharge space side. 3B, the overcoat layers 23c and 23d, the color filter 22, and the inorganic coat layer 21 function as substitute elements for the dielectric layer on the discharge space side. Thereby, it is possible to withstand a strong electric field applied when the panel is driven.

  In order not to cause dielectric breakdown, the dielectric layer needs to have a certain thickness or more. However, when the inorganic coat layer 21 is formed by sputtering or chemical vapor deposition, it takes time to form the film. On the other hand, the color filter 22 needs to be formed by patterning for each color, and it is difficult to form a particularly thick filter by the photoresist method. Further, when the color filter 22 is thickened, the transmittance is lowered. Therefore, it is difficult to form a dielectric layer having a thickness that does not cause dielectric breakdown without sacrificing the optical characteristics of the color filter 22. Rather, the color filter 22 emphasizes optical characteristics, and the thickness should be an optimum value for extracting the characteristics for each color.

  Moreover, since the overcoat layers 23b, 23c, and 23d function to suppress the unevenness of the electrodes and the color filter 22, it is required to enter the unevenness without a gap. That is, it is desirable that the overcoat layers 23b, 23c, and 23d have a low viscosity. However, it is difficult to thickly form a low clay.

  Furthermore, the dielectric layer is an important component that determines the discharge start voltage and the amount of wall charges accumulated. That is, in order to lower the discharge start voltage, it is necessary to make the thickness of the dielectric layer as thin as possible. The amount of wall charge accumulation is proportional to the capacitance of the dielectric layer, and the capacitance of the dielectric layer is determined by the thickness and dielectric constant of the dielectric layer. By making the amount of accumulated wall charges appropriate, light emission efficiency, luminance, and drive margin can be ensured. As described above, in order to ensure the withstand voltage, the dielectric layer needs to have a minimum thickness, and the discharge start voltage is as low as possible by setting the amount of wall charge accumulation to an appropriate value. It is necessary to set the thickness of the dielectric layer.

  As described above, for the inorganic coat layer 21, the overcoat layers 23b, 23c, and 23d, and the color filter 22, materials for drawing out the respective unique characteristics are determined. At this time, when the design is performed in consideration of the thickness and the wall charge amount, the selection range of the material is narrowed. Therefore, by introducing the organic dielectric layer 24, the wall charge amount and thickness of the panel can be controlled by the organic dielectric layer.

  Specifically, the inorganic coat layer 21, the overcoat layers 23b to 23d, and the color filter 22 are thinned, and the organic dielectric layer 24 is thickened. As a result, it is the organic dielectric layer that dominates the thickness of the portion that takes the place of the dielectric. Further, by reducing the thickness of the inorganic coat layer 21, the overcoat layers 23b to 23d, and the color filter 22, the respective capacities become large values. Since the organic dielectric layer 24 is thicker than the inorganic coat layer 21, the overcoat layers 23b to 23d, and the color filter 22, the capacity is reduced. Further, by reducing the dielectric constant, the capacitance of each of the inorganic coat layer 21, the overcoat layers 23b to 23d, and the color filter 22 can be reduced.

  The wall charge is determined by the combined capacitance of all the layers instead of the dielectric. Since the inorganic coat layer 21, the overcoat layers 23b to 23d, the color filter 22, and the organic dielectric layer 24 are configured in series, they are governed by the one having the smallest capacity. That is, it is dominated by the organic dielectric layer 24. Accordingly, the wall charge amount can be controlled by the organic dielectric layer 24. In particular, in the case of a color filter, since the material is different for each color, if the capacitance (thickness, dielectric constant) is different for each color, variations in discharge voltage for each color (for each discharge cell) are likely to occur. On the other hand, as in this embodiment, the thickness and wall charge amount are controlled by the organic dielectric layer, thereby suppressing the variation for each color.

  In the third embodiment, unlike the first and second embodiments, the organic dielectric layer 24 has a certain thickness to suppress dielectric breakdown. Since the wall charge amount can be controlled by controlling the thickness and the dielectric constant, the color filter 22, the inorganic coat layer 21, and the overcoat layers 23a to 23d can be formed without worrying about the wall charge amount and dielectric breakdown. Therefore, it is only necessary to select a material that can exhibit the most characteristics, and the range of material selection is widened.

  The organic dielectric layer 24 can be formed using a printing apparatus such as a slit coater. Further, according to the configuration of the present embodiment, the formation of the inorganic coat layer 21 covering the organic substance such as the organic dielectric layer 24, the overcoat layers 23a to 23d, and the color filter layer 22 is not performed in each step. The process can be shortened by carrying out all at once.

  Further, as in the first embodiment, the end portions of the color filter, the overcoat layer, and the organic dielectric layer have a gentle inclination.

(Embodiment 4)
The PDP in Embodiment 4 will be described with reference to FIGS. 5A to 7B. 5A to 5C are cross-sectional views showing a part of three PDPs of the first configuration example according to the fourth embodiment. 6A to 6C are cross-sectional views illustrating a part of the PDP having three configuration examples according to the second aspect. FIG. 7A to FIG. 7B are cross-sectional views showing a part of the PDP in the two configuration examples of the third aspect.

  In the present embodiment, instead of the structure provided with the inorganic coat layer 21 in the case of the first to third embodiments, the structure using a thin dielectric plate suppresses the transmission of the emitted gas from the color filter, and discharges. It is characterized by suppressing discoloration of the color filter due to ultraviolet rays sometimes generated. In the structure provided with the inorganic coat layer 21, the low temperature process must be adapted, whereas the structure using the dielectric thin plate eliminates the need to consider the process temperature, The effect of expanding the selection range of materials can be obtained.

  Further, according to the structure using the dielectric thin plate, since an organic substance can be used for the front substrate, an effect of easily making the refractive index close to that of the color filter can be obtained. In other words, in the structure using the inorganic coat layer, the temperature increases at the time of sealing, so it is difficult to make the front side substrate from organic material. In the case of the structure using the dielectric thin plate, the back plate and the dielectric thin plate are used. This is because the temperature is high when sealing the substrate, but it can be processed at a low temperature when bonding the front substrate to the back plate including the dielectric thin plate.

<Basic Configuration in Embodiment 4>
A basic configuration common to the PDP of Embodiment 4 will be described with reference to FIG. 5A. First, the front plate 20g includes, as a basic configuration, a transparent and insulating front substrate 25 and bus electrodes 3b and 4b provided on the inner surface thereof.

  The back plate 8 has the same structure as that of the conventional example shown in FIGS. Furthermore, a dielectric thin plate 17 is disposed between the front plate 20 g and the back plate 8. That is, a “back side structure” in which the upper portion of the back plate 8 is sealed by the dielectric thin plate 17 is formed. The transparent electrodes 3a and 4a and the color filter 22 are arranged between the front plate 20a and the dielectric thin plate 17 in various modes.

  In short, the basic configuration of the fourth embodiment is a configuration in which a transparent electrode and a color filter are disposed between a front plate (front substrate + bus electrode) and a back structure (back plate + dielectric thin plate). It is. However, it does not mean that a structure in which the transparent electrode and the color filter are combined is formed, and the transparent electrode and the color filter are respectively disposed on either the inner surface side of the front plate or the rear surface structure. Means.

  The transparent electrodes 3a and 4a and the bus electrodes 3b and 4b constitute a plurality of display electrode pairs 5 including the scan electrodes 3 and the sustain electrodes 4 as in the conventional example. In the rear plate 8, a plurality of address electrodes 10 that are three-dimensionally intersected with the display electrode pair 5 are provided on the rear substrate 9, and discharge cells are formed at the intersections of the address electrode 10 and the display electrode pair 5. A partition wall 12 that partitions the discharge space 14 is provided, and a phosphor layer (not shown, see FIGS. 14 to 16) is provided between the partition walls 12.

  In order to fabricate the PDP having the above-described configuration, it is possible to apply a modification of a part of a conventionally known manufacturing process. First, in order to manufacture the back plate 8, the address electrodes 10, the partition walls 12, and the phosphor layer are formed on the back side substrate 9 by a screen printing method and a sand blast method, respectively. An MgO protective film (not shown) is formed on the dielectric thin plate 17. The MgO protective film is formed by an electron beam evaporation method in a range where a protective film of a dielectric thin plate is to be attached. Further, in order to manufacture the front plate 20g, bus electrodes 3b and 4b (also transparent electrodes 3a and 4a depending on the configuration example) are formed on the inner surface of the front substrate 25. This process will be described later.

  Thereafter, the dielectric thin plate 17 on which the MgO protective film is formed is brought into close contact with the partition wall 12 of the back plate 8 and sealed with a low melting point glass (not shown), filled with a discharge gas and chipped off. Thereafter, a color filter 22 (also transparent electrodes 3a and 4a depending on the configuration example) is formed on the dielectric thin plate 17. Next, the dielectric thin plate 17 and the front plate 20g sealed on the back plate 8 are bonded together with an adhesive at room temperature, for example, to form a panel.

  As described above, the color filter 22 can be formed by directly drawing on the dielectric thin plate 17 by inkjet or the like after chip-off. Therefore, since the color filter 22 can be formed after sealing, an organic pigment can be used. Further, by forming the color filter 22 after sealing, misalignment due to sealing can be avoided. That is, even if the position is adjusted with a solid seal frit before sealing, the seal frit may melt and change shape when sealed, and the position may be displaced at that time. If 22 is formed, alignment deviation does not occur at the time of sealing. The color filter 22 includes the black stripe as described above, and is formed at the position of the top of the vertical partition wall and the horizontal partition wall, that is, at the boundary of the pixel. Alternatively, it may be formed only at the top of the vertical partition including black stripes.

<First Aspect of Embodiment 4>
Next, with reference to FIGS. 5A to 5C, three configuration examples of the first aspect of the fourth embodiment will be described. In the PDP of the first aspect, the bus electrodes 3b and 4b are embedded in the front substrate 25 with only the surface exposed, and the color filter 22 is on the surface of the dielectric thin plate 17 facing the bus electrodes 3b and 4b. Is formed.

  In the first configuration example of the first mode shown in FIG. 5A, the transparent electrodes 3a, 4a are formed on the surface of the dielectric thin plate 17, and the color filter 22 covers the transparent electrodes 3a, 4a to cover the dielectric thin plate. 17 is formed.

  In the second configuration example of the first mode shown in FIG. 5B, the color filter 22 is formed on the surface of the dielectric thin plate 17, and the transparent electrodes 3a and 4a are formed on the color filter 22.

  In the third configuration example of the first mode shown in FIG. 5C, the color filter 22 is formed on the surface of the dielectric thin plate 17, and the transparent electrodes 3a and 4a include the front-side substrate 25 including the bus electrodes 3b and 4b. Formed on top.

  The front plate 20g and the back plate 8 are joined as follows. That is, in the first configuration example, between the front plate 20g and the color filter 22 on the dielectric thin plate 17, in the second configuration example, between the front plate 20g and the transparent electrodes 3a and 4a on the dielectric thin plate 17, the third In the configuration example, the area between the transparent electrodes 3a and 4a on the front plate 20g and the color filter 22 on the dielectric thin plate 17 is a bonding location, and the periphery of the panel is bonded with an adhesive. In the case of an adhesive that does not cause total reflection between the adhesive and the color filter, that is, an adhesive having a refractive index close to that of the color filter, the entire panel may be bonded with the adhesive. Thereby, since external light is incident on the color filter, reflection of external light can be suppressed, and a decrease in bright place contrast due to the provision of the color filter can be suppressed.

  That is, the photopic contrast is the ratio of the brightest luminance to the darkest luminance in a bright space. The darkest luminance is usually the luminance of the panel when displaying black, the luminance emitted from the panel is insignificant, and reflection by external light in a bright space becomes dominant. Therefore, if the reflection of external light can be suppressed, the darkest luminance is lowered, resulting in an increase in bright place contrast. From the above, when a color filter is used to increase the bright place contrast, it is important to reduce the transmittance other than the specific wavelength band.

  In the first mode of the fourth embodiment (FIG. 5A), the transparent electrodes 3a, 4a and the bus electrodes 3b, 4b are arranged via the color filter 22 and are not directly connected. The voltage applied to the bus electrodes 3 b and 4 b by the drive circuit is also applied to the transparent electrodes 3 a and 4 a by capacitive coupling via the color filter 22. In the following various configuration examples, the same applies to the case where the transparent electrodes 3a and 4a and the bus electrodes 3b and 4b are arranged via the color filter 22.

<Second Mode of Embodiment 4>
Next, with reference to FIGS. 6A to 6C, three configuration examples of the second aspect of the fourth embodiment will be described. Also in the PDP of the second mode, the bus electrodes 3b and 4b are embedded in the front substrate 25 with only the surface exposed. The difference from the first embodiment is that the color filter 22 is formed on the front substrate 25 including the bus electrodes 3b and 4b.

  In the first configuration example of the first mode shown in FIG. 6A, the transparent electrodes 3 a and 4 a are formed on the surface of the dielectric thin plate 17.

  In the second configuration example of the first mode illustrated in FIG. 6B, the transparent electrodes 3 a and 4 a are formed on the color filter 22 on the front substrate 25.

  In the third configuration example of the first mode shown in FIG. 6C, the transparent electrodes 3a and 4a are formed on the front substrate 25 including the surfaces of the bus electrodes 3b and 4b, and the color filter 22 covers the transparent electrodes 3a and 4a. It is formed on the front substrate 25.

  The front plate 20g and the back plate 8 are joined as follows. That is, in the first configuration example, between the color filter 22 on the front plate 20g and the transparent electrodes 3a and 4a on the dielectric thin plate 17, in the second configuration example, the transparent electrodes 3a and 4a on the front plate 20g and the dielectric Between the thin plates 17, in the third configuration example, the connection between the color filter 22 on the front plate 20 g and the dielectric thin plate 17 is a joint portion. The front side substrate 25 and the back plate 8 are bonded to the peripheral part of the panel or the entire panel using an adhesive. Since the adhesive layer is formed at a position after transmission through the color filter 22, even if the adhesive layer is formed on the entire panel and total reflection occurs at the interface between the color filter and the adhesive layer, the color filter causes the external light to pass through. Is sufficiently attenuated, so that the contrast of the light place does not decrease.

<Third Aspect of Embodiment 4>
Next, two configuration examples of the third aspect of the fourth embodiment will be described with reference to FIGS. 7A to 7B. In the PDP of the third aspect, the bus electrodes 3b and 4b constituting the front plate 20h are not embedded, but are formed on the inner side surface of the front side substrate 2, and the color filter 22 is provided on the front side substrate surface 2. It is formed between 3b and 4b. The heights of the color filter 22 and the bus electrodes 3b and 4b are aligned.

  In the first configuration example shown in FIG. 7A, the transparent electrodes 3a and 4a are formed on the color filter 22 including the surfaces of the bus electrodes 3b and 4b.

  In the second configuration example shown in FIG. 7B, the transparent electrodes 3 a and 4 a are formed on the surface of the dielectric thin plate 17.

  The front plate 20h and the back plate 8 are joined as follows. That is, in the first configuration example, between the transparent electrodes 3a, 4a on the front plate 20h and the dielectric thin plate 17, in the second configuration example, the color filter 22 on the front plate 20h and the transparent electrode 3a on the dielectric thin plate 17 are used. Between 4a becomes a joint location. The front side substrate 25 and the back plate 8 are bonded to the peripheral part of the panel or the entire panel using an adhesive.

<Description of Element Member in Embodiment 4>
Examples of element members for configuring the above PDP will be described below.

  The front substrate 25 for forming the front plate 20g is a transparent substrate, and it is desirable to use a material having a refractive index comparable to that of the color filter 22. In the case of the front plate 20g having a structure in which the bus electrodes 3b and 4b are embedded, the bus electrodes 3b and 4b are formed on the front substrate 25, and the space between the bus electrodes and the bus electrodes is filled with the same material as the front substrate 25.

  As the bus electrodes 3b and 4b, a single layer constituent film such as low resistance silver, aluminum, copper or the like, or a laminated constituent film such as a chromium / copper two layer structure, or a chromium / copper / chromium three layer structure is printed -It can form using thin film formation techniques, such as baking and sputtering method.

Examples of the dielectric thin plate 17 include borosilicate glass mainly containing silicon dioxide (SiO ₂ ) and boron trioxide (B ₂ O ₃ ), and borosilicate non-alkali containing a large amount of BaO and Al ₂ O _3. A thin dielectric sheet such as glass is used. The thickness is about 10 to 40 μm and at most about 50 μm. Alternatively, a thick dielectric sheet may be used for sealing, and then polished and thinned (10 to 40 μm) to form the dielectric thin plate 17.

  The adhesive layer is transparent and has an insulating property. For example, an epoxy adhesive, an acrylic adhesive, or the like.

  The color filter 22 has a thickness of several μm. Color filters using organic pigments used in liquid crystal displays can be used. Red, blue, green, and black between colors. You may make it not permeate | transmit infrared rays. Thereby, it is not necessary to provide an infrared cut filter on the front substrate 25.

  As the transparent electrodes 3a and 4a, for example, indium tin oxide (ITO), tin oxide (SnO2), zinc oxide (ZnO), or the like can be used. Since the thickness is about several hundred nm, there is no influence of the step.

  Further, the front substrate 25 may have a function. For example, a protective substrate for protecting from an external impact, a black stripe disposed on the bus electrode, an antireflection film, an electromagnetic wave shield, an ultraviolet ray prevention film (preventing deterioration of organic substances such as a color filter), and the like.

(Embodiment 5)
The PDP in the fifth embodiment will be described with reference to FIGS. 8A to 10B. FIG. 8A to FIG. 8C are cross-sectional views showing a part of three PDPs of the first configuration example according to the fifth embodiment. FIG. 9A to FIG. 9C are cross-sectional views showing a part of a PDP having three configuration examples of the second mode. FIG. 10A to FIG. 10B are cross-sectional views showing a part of a PDP having two configuration examples of the third mode.

<Basic Configuration in Embodiment 5>
A basic configuration common to the PDP of Embodiment 5 will be described with reference to FIG. 8A. First, the front plate 20h is composed of the front substrate 2, the bus electrodes 3b and 4b provided on the inner surface side thereof, and the low reflection layer 26 formed between the bus electrodes 3b and 4b.

  The configuration of the back-side structure in which the upper portion of the back plate 8 is sealed with the dielectric thin plate 17 is the same as that of the fourth embodiment. The transparent electrodes 3a and 4a and the color filter 22 are arranged between the front plate 20h and the dielectric thin plate 17 in various modes.

  In short, the basic configuration of the fifth embodiment is that a transparent electrode and a color filter are provided between a front plate (front substrate + bus electrode + low reflection layer) and a back structure (back plate + dielectric thin plate). It is an arranged configuration.

  When the bus electrodes 3b and 4b are thin and thick, the color filter 22 is inevitably thick in the third embodiment of the fourth embodiment. As the color filter 22 becomes thicker, the transmittance decreases, so that the amount of transmitted light emitted by the phosphor decreases and the luminance decreases. By forming a low reflection layer between the bus electrodes 3b and 4b, it is not necessary to make the color filter 22 thick, so this problem is suppressed. Further, special processing for embedding the bus electrodes 3b and 4b is not necessary.

  In order to manufacture the PDP having the above-described configuration, a process similar to the manufacturing process described in the fourth embodiment can be employed.

<First Aspect of Embodiment 5>
Next, with reference to FIGS. 8A to 8C, three configuration examples of the first aspect of the fifth embodiment will be described. In the PDP of the first aspect, the color filter 22 is formed on the surface of the dielectric thin plate 17 facing the bus electrodes 3b and 4b.

  In the first configuration example of the first mode shown in FIG. 8A, the transparent electrodes 3a, 4a are formed on the surface of the dielectric thin plate 17, and the color filter 22 covers the transparent electrodes 3a, 4a and covers the dielectric thin plate. 17 is formed.

  In the second configuration example shown in FIG. 8B, the color filter 22 is formed on the surface of the dielectric thin plate 17, and the transparent electrodes 3 a and 4 a are formed on the color filter 22.

  In the third configuration example shown in FIG. 8C, the color filter 22 is formed on the surface of the dielectric thin plate 17, and the transparent electrodes 3a and 4a are formed on the low reflection layer 26 including the surfaces of the bus electrodes 3b and 4b. ing.

  The front plate 20h and the back plate 8 are joined as follows. That is, in the first configuration example, between the front plate 20h and the color filter 22 on the dielectric thin plate 17, in the second configuration example, between the front plate 20h and the transparent electrodes 3a and 4a on the dielectric thin plate 17, the third In the configuration example, the area between the transparent electrodes 3a, 4a on the front plate 20h and the color filter 22 on the dielectric thin plate 17 is a bonding location, and the periphery of the panel is bonded with an adhesive. In the case of an adhesive that does not cause total reflection between the adhesive and the color filter, that is, an adhesive having a refractive index close to that of the color filter, the entire panel may be bonded with the adhesive. When the low reflective layer 26 serves as an adhesive, the entire panel can be bonded.

<Second Aspect of Embodiment 5>
Next, with reference to FIGS. 9A to 9C, three configuration examples of the second aspect of the fifth embodiment will be described. In the PDP of the second aspect, the color filter 22 is formed on the low reflection layer 26 including the surfaces of the bus electrodes 3b and 4b. The bus electrodes 3b and 4b and the low reflection layer 26 are set to have the same height.

  In the first configuration example of the second mode shown in FIG. 9A, the transparent electrodes 3 a and 4 a are formed on the surface of the dielectric thin plate 17.

  In the second configuration example shown in FIG. 9B, the transparent electrodes 3 a and 4 a are formed on the color filter 22.

  In the third configuration example shown in FIG. 9C, the transparent electrodes 3a and 4a are formed on the low reflection layer 26 including the surfaces of the bus electrodes 3b and 4b, and the color filter 22 covers the transparent electrodes 3a and 4a. Formed on top.

  The front plate 20h and the back plate 8 are joined as follows. That is, in the first configuration example, between the color filter 22 on the front plate 20h and the transparent electrodes 3a and 4a on the dielectric thin plate 17, in the second configuration example, the transparent electrodes 3a and 4a on the front plate 20h and the dielectric Between the thin plates 17, in the third configuration example, the connection between the color filter 22 on the front plate 20 h and the dielectric thin plate 17 is a joint portion. The front side substrate 25 and the back plate 8 are bonded to the peripheral part of the panel or the entire panel using an adhesive.

<Third Aspect of Embodiment 5>
Next, two configuration examples of the third aspect of the fifth embodiment will be described with reference to FIGS. 10A to 10B. In the PDP of the third mode, the low reflection layer 26 and the color filter 22 are sequentially formed between the bus electrodes 3 b and 4 b on the front substrate surface 2. The heights of the color filter 22 and the bus electrodes 3b and 4b are aligned. The low reflective layer 26 is formed to a height in the middle of the gap between the bus electrodes 3b and 4b, and the color filter 22 is formed for the rest. The height of the color filter and the bus electrode are aligned. Since it is not necessary to increase the thickness of the color filter, a decrease in luminance can be suppressed.

  In the first configuration example shown in FIG. 10A, the transparent electrodes 3a and 4a are formed on the color filter 22 including the surfaces of the bus electrodes 3b and 4b.

  In the second configuration example shown in FIG. 10B, the transparent electrodes 3 a and 4 a are formed on the surface of the dielectric thin plate 17.

  The front plate 20h and the back plate 8 are joined as follows. That is, in the first configuration example, between the transparent electrodes 3a, 4a on the front plate 20h and the dielectric thin plate 17, in the second configuration example, the color filter 22 on the front plate 20h and the transparent electrode 3a on the dielectric thin plate 17 are used. Between 4a becomes a joint location. The front side substrate 25 and the back plate 8 are bonded to the peripheral part of the panel or the entire panel using an adhesive.

<Description of Element Member of Embodiment 5>
The low reflection layer 26 can be formed of a material based on a transparent insulator such as an acrylic resin or an epoxy resin. The material is not necessarily the same as that of the front substrate 25. It may have an adhesive function, and in that case, it is not necessary to use an additional adhesive.

  For the function of the low reflection layer 26, a material having a refractive index close to that of the color filter 22 is used. In addition, it is desirable to change the refractive index in the low reflection layer 26 partially without making it uniform. For example, the refractive index is changed from A to B with respect to the refractive index A of the front substrate 25 and the refractive index B of the color filter 22. For this purpose, for example, the low reflective layer 26 is formed as a laminated structure of a plurality of layers having different refractive indexes so that the refractive index changes sequentially.

(Embodiment 6)
A PDP according to the sixth embodiment will be described with reference to FIGS. 11 to 13 are cross-sectional views showing a part of the PDP in the first to third aspects in the sixth embodiment.

<Basic Configuration in Embodiment 6>
A basic configuration common to the PDP according to the sixth embodiment will be described with reference to FIG. The basic configuration of the PDP in the present embodiment is the same as that in the fourth or fifth embodiment. The feature of this embodiment is that an overcoat layer 23e is formed so as to cover the surface of the color filter 22.

  Therefore, the basic configuration of the sixth embodiment is that a transparent electrode and ((a front plate + bus electrode (+ low reflection layer)) and a back side structure (back plate + dielectric thin plate) are placed between Color filter + overcoat layer) is arranged.

  The overcoat layer 23e is formed in order to flatten the surface of the color filter 22 as in the case of the second embodiment.

  In order to manufacture the PDP having the above-described configuration, a process similar to the manufacturing process described in the fourth embodiment can be employed.

<First to third aspects of the sixth embodiment>
Three aspects of the sixth embodiment will be described with reference to FIGS.

  In the first mode shown in FIG. 11, the color filter 22 is formed on the surface of the dielectric thin plate 17, the overcoat 23e layer is formed so as to cover the color filter 22, and the transparent electrode 3a is formed on the surface of the overcoat layer 23e. 4a is formed. The color filter 22 can be formed by direct drawing with an inkjet or the like.

  In the second mode shown in FIG. 12, the color filter 22 is formed on the surface of the low reflection layer 26 including the surfaces of the bus electrodes 3b and 4b, the overcoat layer 23f is formed to cover the color filter 22, and the overcoat layer 23f. Transparent electrodes 3b and 4b are formed on the surface.

  In the third mode shown in FIG. 13, the low reflection layer 26, the color filter 22, and the overcoat layer 23 g are sequentially formed between the bus electrodes 3 b and 4 b on the front side substrate surface 2. The height of the overcoat layer 23g and the bus electrodes 3b and 4b are aligned. Transparent electrodes 3b and 4b are formed on the surface of the overcoat layer 23g including the bus electrodes 3b and 4b.

  The front plate 20h and the back plate 8 are joined as follows. That is, in the first configuration example, the area between the front plate 20h and the transparent electrodes 3a and 4a on the dielectric thin plate 17 is a bonding location, and the periphery of the panel is bonded with an adhesive. In the case of an adhesive that does not cause total reflection between the adhesive and the color filter, that is, an adhesive having a refractive index close to that of the color filter, the entire panel may be bonded with the adhesive. When the low reflective layer 26 serves as an adhesive, the entire panel can be bonded. In the second configuration example, the transparent electrodes 3a, 4a on the front plate 20h and the dielectric thin plate 17 are joined, and in the third configuration example, the transparent electrodes 3a, 4a on the front plate 20h and the dielectric thin plate 17 are joined. Then, the peripheral part of the panel or the entire panel is bonded using an adhesive.

  In the second mode of the sixth embodiment (FIG. 12), the transparent electrodes 3a and 4a and the bus electrodes 3b and 4b are arranged via the color filter 22 and the overcoat layer 23f and are not directly connected. In this state, the voltage applied to the bus electrodes 3b and 4b by the drive circuit is also applied to the transparent electrodes 3a and 4a by capacitive coupling via the color filter 22 and the overcoat layer 23f.

<Description of Element Member of Embodiment 6>
The overcoat layers 23e to 23g are made of a transparent insulator. In the case of the first form, it is desirable that the refractive index is close to the color filter 22. As a general material, a thermosetting type based on an acrylic resin or an epoxy resin can be used.

(Embodiment 7)
About PDP in Embodiment 7, the structure similar to the above-mentioned Embodiment 1-6 can be used. Therefore, the present embodiment will be described with reference to the drawings showing those embodiments. The feature of the present embodiment is that the refractive index of the color filter 22 and the color filter on the front side are suppressed in order to suppress a decrease in bright place contrast caused by external reflection of a large incident angle at the interface of the color filter. That is, the relationship between the refractive indexes of the element members adjacent to 22 is defined.

  In order to suppress a decrease in bright place contrast due to reflection of external light, when external light enters the panel, it is desirable to transmit the color filter after passing through the front substrate. However, when external light is incident at a critical angle or more, total reflection occurs at the interface between the front substrate and the color filter, so that all light is reflected without the attenuation effect of the external light by the color filter, and the contrast in the bright place. Decreases. When the critical angle is small, total reflection occurs for almost all of the external light incident at various angles, which has a great effect on lowering the bright place contrast.

  Therefore, in this embodiment, in order to suppress external light reflection before the color filter transmission due to the provision of the color filter and to improve the bright place contrast, the element member and the color on the front side of the color filter 22 are used. The critical angle at the interface of the filter 22 is set large. That is, the refractive indexes of the front side substrates 2 and 25 and the color filter 22 are set to the same level. When a transparent insulating layer is interposed between the front side substrates 2 and 25 and the color filter 22, the refractive indexes of the front side substrates 2 and 25, the transparent insulating layer, and the color filter 22 are made approximately the same.

  Specifically, the refractive indexes of the front side substrates 2 and 25 are set to be less than 1.15 times the refractive index of the color filter 22. Alternatively, when a transparent insulating layer (low reflection layer, adhesive layer, overcoat layer, organic dielectric layer, etc.) is interposed between the front side substrates 2 and 25 and the color filter 22, the front side substrates 2 and 21 and transparent Each of the insulating layers has a refractive index of less than 1.15 times the refractive index of the color filter 22. As a result, a critical angle θ that is sufficiently larger than 58 °, which is the critical angle determined from the material of the conventional glass substrate and color filter, can be obtained, and a PDP in which the reduction of the contrast in the bright place is sufficiently suppressed practically can be obtained. Can do. In particular, since a color filter using an organic pigment is used, in order to make the refractive indexes of the color filter and the front substrate close to each other, it is preferable that the front substrate is an organic transparent substrate.

  The PDP of the present invention has a configuration including a color filter made of an organic pigment, and it is possible to suppress the emission gas from the color filter from entering the discharge space and to produce it using a low process temperature. It is useful as a wall-mounted TV or a large monitor.

DESCRIPTION OF SYMBOLS 1, 20a-20h Front board 2,25 Front side board | substrate 3 Scan electrode 3a, 4a Transparent electrode 3b, 4b Bus electrode 4 Sustain electrode 5 Display electrode pair 6 Front side dielectric layer 7 Protective film 8 Back board 9 Back side board 10 Address electrode 11 Rear side dielectric layer 12 Partition 12a Vertical partition 12b Horizontal partition 13 Phosphor layer 13r Red (R) phosphor layer 13g Green (G) phosphor layer 13b Blue (B) phosphor layer 14 Discharge space 15 Discharge cell 16 Black stripe 17 Thin plate for dielectric 18 Insulation coating film 19 Gap 21 Inorganic coating layer 22 Color filter 23, 23a, 23b, 23c, 23d Overcoat layer 24 Organic dielectric layer 26 Low reflection layer

Claims (22)

A front plate provided with a plurality of display electrode pairs consisting of scan electrodes and sustain electrodes on a front side substrate;
A plurality of address electrodes that are three-dimensionally crossed with the display electrode pair are provided on a back side substrate, and a partition that partitions discharge cells is provided at the intersection of the address electrode and the display electrode pair, and a phosphor is provided between the partitions. A back plate provided with a layer;
A color filter disposed on the front plate in correspondence with the phosphor layer of each discharge cell;
A plasma display panel comprising: an inorganic coat layer that is formed by covering the color filter and suppresses permeation of gas emitted from the color filter. The color filter is provided on the surface of the front substrate,
The display electrode pair is provided on the color filter,
The plasma display panel according to claim 1, wherein the inorganic coat layer is provided on the color filter including the display electrode pair. The display electrode pair is provided on the surface of the front substrate,
The color filter is provided on the front substrate so as to cover the display electrode pair,
The plasma display panel according to claim 1, wherein the inorganic coating layer is provided on the color filter.   The plasma display panel according to claim 1, wherein an overcoat layer is provided on at least one of an upper surface of the color filter and an upper surface of the display electrode pair.   The plasma display panel according to claim 1, further comprising an organic dielectric layer on the front substrate side of the inorganic coat layer. A front plate provided with bus electrodes for constituting a plurality of display electrode pairs consisting of scan electrodes and sustain electrodes on a front substrate;
A plurality of address electrodes that are three-dimensionally crossed with the display electrode pair are provided on a back side substrate, and a partition that partitions discharge cells is provided at the intersection of the address electrode and the display electrode pair, and a phosphor is provided between the partitions. A back plate provided with a layer;
A dielectric thin plate disposed between the front plate and the back plate;
A transparent electrode disposed between the front plate and the dielectric thin plate so as to correspond to the bus electrode so as to constitute the plurality of display electrode pairs;
A plasma display panel comprising: a color filter disposed between the front plate and the dielectric thin plate so as to correspond to the phosphor layer of each discharge cell.   The bus electrode is embedded in the front substrate while exposing only the surface, the transparent electrode is formed on the surface of the dielectric thin plate, and the color filter covers the transparent electrode and the dielectric thin plate The plasma display panel according to claim 6 formed on the top.   The bus electrode is embedded in the front substrate while exposing only the surface, the color filter is formed on a surface of the dielectric thin plate facing the bus electrode, and the transparent electrode is formed on the color filter or The plasma display panel according to claim 6, wherein the plasma display panel is formed on the front substrate including the bus electrode surface.   The bus electrode is embedded in the front side substrate with only the surface exposed, the color filter is formed on the front side substrate including the bus electrode surface, and the transparent electrode is on the surface of the dielectric thin plate. The plasma display panel according to claim 6, wherein the plasma display panel is formed on the color filter.   The bus electrode is embedded in the front-side substrate with only the surface exposed, the transparent electrode is formed on the front-side substrate including the bus electrode surface, and the color filter covers the transparent electrode and covers the front surface The plasma display panel according to claim 6, wherein the plasma display panel is formed on a side substrate.   The bus electrode is disposed on the front substrate, the color filter is formed between the bus electrodes on the front substrate surface, and the transparent electrode is on the color filter including the bus electrode surface or The plasma display panel according to claim 6, wherein the plasma display panel is formed on a surface of the dielectric thin plate.   The bus electrode is disposed on the front substrate, a low reflection layer is formed between the bus electrodes on the front substrate surface, the transparent electrode is formed on a surface of the dielectric thin plate, The plasma display panel according to claim 6, wherein a color filter is formed on the dielectric thin plate so as to cover the transparent electrode.   The bus electrode is disposed on the front substrate plate, a low reflection layer is formed between the bus electrodes on the front substrate surface, and the color filter faces the bus electrode of the dielectric thin plate. The plasma display panel according to claim 6, wherein the plasma display panel is formed on a surface, and the transparent electrode is formed on the color filter or on the low reflection layer including the bus electrode surface.   The bus electrode is disposed on the front substrate, a low reflection layer is formed between the bus electrodes on the front substrate surface, and the color filter is formed on the low reflection layer including the bus electrode surface The plasma display panel according to claim 6, wherein the transparent electrode is formed on a surface of the dielectric thin plate or on the color filter.   The bus electrode is disposed on the front substrate, a low reflective layer is formed between the bus electrodes on the front substrate surface, and the transparent electrode is formed on the low reflective layer including the bus electrode surface The plasma display panel according to claim 6, wherein the color filter is formed on the low reflection layer so as to cover the transparent electrode.   The bus electrode is disposed on the front substrate, a low reflective layer and the color filter are sequentially formed between the bus electrodes on the front substrate surface, and the transparent electrode includes the bus electrode surface. The plasma display panel according to claim 6, wherein the plasma display panel is formed on a color filter or on a surface of the dielectric thin plate.   The color filter is formed on a surface of the thin dielectric plate, an overcoat layer is formed to cover the color filter, and the transparent electrode is formed on the surface of the overcoat layer. Plasma display panel.   The bus electrode is embedded in the front side substrate with only the surface exposed, and the color filter is formed on the surface of the front side substrate including the bus electrode surface, and an overcoat layer covers the color filter. The plasma display panel according to claim 6, wherein the transparent electrode is formed on the surface of the overcoat layer.   The bus electrode is disposed on the front substrate, a low reflection layer is formed between the bus electrodes on the front substrate surface, and the color filter is formed on the surface of the low reflection layer including the bus electrode surface. The plasma display panel according to claim 6, wherein an overcoat layer is formed to cover the color filter, and the transparent electrode is formed on a surface of the overcoat layer.   The bus electrode is disposed on the front substrate, the color filter and an overcoat layer are sequentially formed between the bus electrodes on the front substrate surface, and the transparent electrode includes the bus electrode surface The plasma display panel according to claim 6, wherein the plasma display panel is formed on a surface of the overcoat layer.   21. The plasma display panel according to claim 1, wherein the refractive index of the front substrate is less than 1.15 times the refractive index of the color filter.   7. A transparent insulating layer is interposed between the front substrate and the color filter, and the refractive indexes of the front substrate and the transparent insulating layer are each less than 1.15 times the refractive index of the color filter. 21. The plasma display panel according to any one of -20.

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