JP2011038179A - Chemical polishing solution, and method for producing the same - Google Patents
Chemical polishing solution, and method for producing the same Download PDFInfo
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Abstract
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本発明は、アルミニウム製品やその合金の表面を平滑化すると共に化学研磨が施された表面に充分な光沢を付与することができる化学研磨液に関する。 The present invention relates to a chemical polishing liquid that can smoothen the surface of an aluminum product or an alloy thereof and impart sufficient gloss to the surface subjected to chemical polishing.
化学研磨液としては、硝酸を除く無機酸と、タングステン化合物とを配合した化学研磨液がある（特許文献１参照）。 As the chemical polishing liquid, there is a chemical polishing liquid in which an inorganic acid excluding nitric acid and a tungsten compound are blended (see Patent Document 1).
本発明は、化学研磨の際、有毒ガスが発生することなく、アルミニウム製品やその合金の表面を平滑化すると共に化学研磨が施された表面に充分な光沢を付与することができる。 The present invention smoothes the surface of an aluminum product or an alloy thereof and can impart sufficient gloss to the surface subjected to chemical polishing without generating toxic gas during chemical polishing.
本発明は、リン酸、ピロリン酸又は硫酸のいずれかを一種以上有する酸成分１００質量部と、マンガンイオン、亜鉛イオン、鉄イオン、ニッケルイオン、錫イオン、鉛イオン、銅イオン、銀イオン、白金イオン又は金イオンのいずれかと反応させた硫酸、リン酸又はピロリン酸のいずれかを一種以上有する金属酸化物５質量部以上４５質量部以下を有する化学研磨液である。 The present invention includes 100 parts by mass of an acid component having at least one of phosphoric acid, pyrophosphoric acid or sulfuric acid, manganese ions, zinc ions, iron ions, nickel ions, tin ions, lead ions, copper ions, silver ions, platinum It is a chemical polishing liquid having 5 to 45 parts by mass of metal oxide having at least one of sulfuric acid, phosphoric acid and pyrophosphoric acid reacted with either ions or gold ions.
酸成分としては、リン酸であるのが好ましい。 The acid component is preferably phosphoric acid.
金属酸化物としては、硫酸銅であるのが好ましい。 The metal oxide is preferably copper sulfate.
本発明に係る化学研磨液には、粘性付与剤２０質量部以上１００質量部以下を配合するのが好ましい。粘性付与剤としては、グリセリン、１，３−ブタンジオール又は１，４−ブタンジオールのいずれか一種又は混合体であるのが好ましく、さらに好ましくはグリセリンである。 The chemical polishing liquid according to the present invention preferably contains 20 to 100 parts by mass of a viscosity imparting agent. The viscosity imparting agent is preferably glycerin, 1,3-butanediol or 1,4-butanediol, or a mixture thereof, more preferably glycerin.
本願の他の発明は、リン酸、ピロリン酸又は硫酸のいずれかを一種以上有する酸成分１００質量部と、マンガンイオン、亜鉛イオン、鉄イオン、ニッケルイオン、錫イオン、鉛イオン、銅イオン、銀イオン、白金イオン又は金イオンのいずれかと反応させた硫酸、リン酸又はピロリン酸のいずれかを一種以上有する金属酸化物を５質量部以上４５質量部以下、及び、粘性付与剤２０質量部以上１００質量部以下を有する化学研磨液の製造方法であって、酸成分１００質量部に金属酸化物の配合量の３０％から７０％の範囲内でのいずれかの配合量を配合した後、金属酸化物を溶解させて第一化学研磨液を作成し、粘性付与剤に金属酸化物の残りの配合量（７０％から３０％の範囲内でのいずれかの配合量）を配合した後、金属酸化物を溶解させて第二化学研磨液を作成し、第一化学研磨液と第二化学研磨液を混合する化学研磨液の製造方法である。 Another invention of the present application is that 100 parts by mass of an acid component having at least one of phosphoric acid, pyrophosphoric acid or sulfuric acid, manganese ions, zinc ions, iron ions, nickel ions, tin ions, lead ions, copper ions, silver 5 parts by mass or more and 45 parts by mass or less of a metal oxide having one or more of sulfuric acid, phosphoric acid or pyrophosphoric acid reacted with any one of ions, platinum ions or gold ions, and 20 parts by mass or more of a viscosity imparting agent 100 A method for producing a chemical polishing liquid having a mass part or less, wherein 100 parts by mass of an acid component is blended with any blending amount in the range of 30% to 70% of the blending amount of the metal oxide, and then oxidized with metal. The first chemical polishing liquid is prepared by dissolving the product, and after the remaining compounding amount of the metal oxide (any compounding amount in the range of 70% to 30%) is blended with the viscosity-imparting agent, metal oxidation is performed. Dissolved Te create a second chemical polishing solution, a method for producing a chemical polishing solution for mixing the first chemical polishing liquid and the second chemical polishing solution.
本発明は、化学研磨液を上述の構成で形成したため、有毒ガスが発生することなく、アルミニウム製品やその合金の表面を平滑化すると共に化学研磨が施された表面に充分な光沢を付与することができる。 In the present invention, since the chemical polishing liquid is formed with the above-described configuration, the surface of the aluminum product or its alloy is smoothed and a sufficient gloss is imparted to the surface subjected to the chemical polishing without generating toxic gas. Can do.
他の発明である化学研磨液の製造方法は、上述の第一化学研磨液と第二化学研磨液を混合するため、金属酸化物の酸成分と粘性付与剤への最適な比率かつ安定した状態での溶解が確保できるのである。 Another method of manufacturing a chemical polishing liquid according to the present invention is to mix the first chemical polishing liquid and the second chemical polishing liquid described above, so that the optimum ratio of metal oxide to the acid component and the viscosity-imparting agent and a stable state are obtained. It is possible to ensure dissolution in
本発明は、リン酸、ピロリン酸又は硫酸のいずれかを一種以上有する酸成分１００質量部と、マンガンイオン、亜鉛イオン、鉄イオン、ニッケルイオン、錫イオン、鉛イオン、銅イオン、銀イオン、白金イオン又は金イオンのいずれかと反応させた硫酸、リン酸又はピロリン酸のいずれかを一種以上有する金属酸化物５質量部以上４５質量部以下を有する化学研磨液である。 The present invention includes 100 parts by mass of an acid component having at least one of phosphoric acid, pyrophosphoric acid or sulfuric acid, manganese ions, zinc ions, iron ions, nickel ions, tin ions, lead ions, copper ions, silver ions, platinum It is a chemical polishing liquid having 5 to 45 parts by mass of metal oxide having at least one of sulfuric acid, phosphoric acid and pyrophosphoric acid reacted with either ions or gold ions.
本発明の化学研磨液において、リン酸、ピロリン酸又は硫酸のいずれかを一種以上有する酸成分１００質量部配合したのは、化学研磨の対象であるアルミニウム製品やその合金の表面を溶解するためである。酸成分としては、リン酸が好ましい。銅よりイオン化傾向の大きい金属としては、アルミニウム、亜鉛、鉄、ニッケル、錫、鉛がある。 In the chemical polishing liquid of the present invention, 100 parts by mass of an acid component having at least one of phosphoric acid, pyrophosphoric acid or sulfuric acid was blended in order to dissolve the surface of the aluminum product or its alloy which is the object of chemical polishing. is there. As the acid component, phosphoric acid is preferable. Metals having a higher ionization tendency than copper include aluminum, zinc, iron, nickel, tin, and lead.
本発明に係る化学研磨液において、マンガンイオン、亜鉛イオン、鉄イオン、ニッケルイオン、錫イオン、鉛イオン、銅イオン、銀イオン、白金イオン又は金イオンのいずれかと反応させた硫酸、リン酸又はピロリン酸のいずれかを一種以上有する金属酸化物を配合したのは、酸成分で溶解させたアルミニウム製品やその合金の金属自体を、溶解させると共に、その金属より還元され易い金属イオンを用いて酸化還元反応させ、さらに、酸成分エッチングによる表面粗化を防止するためである。具体的には、アルミニウムイオンよりイオン化傾向の低いマンガンイオン、亜鉛イオン、鉄イオン、ニッケルイオン、錫イオン、鉛イオン、銅イオン、銀イオン、白金イオン又は金イオンを放出する金属酸化物を用いる。これらイオンは、化学研磨の対象となる金属のイオン化傾向を加味して選択される。 In the chemical polishing liquid according to the present invention, sulfuric acid, phosphoric acid or pyrolline reacted with any of manganese ion, zinc ion, iron ion, nickel ion, tin ion, lead ion, copper ion, silver ion, platinum ion or gold ion A metal oxide containing at least one of acids is mixed with an aluminum product dissolved with an acid component or an alloy metal itself, and redox using metal ions that are more easily reduced than the metal. This is for reacting and further preventing surface roughening due to acid component etching. Specifically, a metal oxide that emits manganese ions, zinc ions, iron ions, nickel ions, tin ions, lead ions, copper ions, silver ions, platinum ions, or gold ions that have a lower ionization tendency than aluminum ions is used. These ions are selected in consideration of the ionization tendency of the metal to be subjected to chemical polishing.
金属酸化物の配合量は、酸成分１００質量部に対して、５質量部以上４５質量部以下がよく、好ましくは８質量部以上３５質量部以下、さらに好ましくは１２質量部以上３０質量部以下である。金属酸化物の配合量は、少なくすると酸化還元反応が少なくなって酸成分エッチングによる表面粗化を防止する力が弱くなる傾向にあり、多くすると金属酸化物の溶解に時間が長くなるため、上述の範囲が好ましい。 The compounding amount of the metal oxide is preferably 5 parts by mass or more and 45 parts by mass or less, preferably 8 parts by mass or more and 35 parts by mass or less, more preferably 12 parts by mass or more and 30 parts by mass or less with respect to 100 parts by mass of the acid component. It is. If the amount of the metal oxide is decreased, the redox reaction tends to decrease and the ability to prevent surface roughening due to acid component etching tends to be weakened. If the amount is increased, the time required for dissolution of the metal oxide increases. The range of is preferable.
粘性付与剤を配合したのは、化学研磨の反応の際、化学研磨の対象物である金属製品の表面を均等に化学反応させるのではなく、表面の凹凸の凸部分だけを優先的に溶解させると共に酸成分による溶解を穏やかにするためである。 Viscosity agent was added in the chemical polishing reaction, rather than causing the surface of the metal product, which is the object of chemical polishing, to chemically react evenly, only the convex and concave portions of the surface are preferentially dissolved. At the same time, the dissolution by the acid component is moderated.
粘性付与剤としては、上述の効果を発揮するものをいい、具体的には水溶性高沸点有機溶剤、増粘多糖類がある。水溶性高沸点有機溶剤としては、グリセリン、ブタンジオール類、プロパンジオール類、エチレングリコール、ペンタジオール等の炭素数２〜５の多価アルコール、テトラヒドロフルフリルアルコール等ヒドロキシアルキル基置換環状エーテルがある。増粘多糖類としては、ペクチンがある。これら粘性付与剤として、グリセリン、１，３−ブタンジオール又は１，４−ブタンジオールのいずれか一種又は混合体であるのが好ましい。 Viscosity-imparting agents are those that exhibit the above-described effects, and specifically include water-soluble high-boiling organic solvents and thickening polysaccharides. Examples of the water-soluble high boiling point organic solvent include glycerin, butanediols, propanediols, polyhydric alcohols having 2 to 5 carbon atoms such as ethylene glycol and pentadiol, and hydroxyalkyl group-substituted cyclic ethers such as tetrahydrofurfuryl alcohol. As a thickening polysaccharide, there is pectin. As these viscosity-imparting agents, glycerin, 1,3-butanediol, or 1,4-butanediol is preferably one or a mixture.
粘性付与剤の配合量は、酸成分１００質量部に対して、２０質量部以上１００質量部以下がよく、好ましくは３０質量部以上８０質量部以下、さらに好ましくは３５質量部以上６０質量部以下である。粘性付与剤の配合量は、少なくすると化学研磨対象物の表面の凹凸に沿って化学研磨する傾向が強くなり、多くすると酸化還元反応の反応が遅くなるため、上述の範囲が好ましい。 The blending amount of the viscosity-imparting agent is preferably 20 parts by mass or more and 100 parts by mass or less, preferably 30 parts by mass or more and 80 parts by mass or less, more preferably 35 parts by mass or more and 60 parts by mass or less with respect to 100 parts by mass of the acid component. It is. If the blending amount of the viscosity imparting agent is decreased, the tendency to perform chemical polishing along the unevenness of the surface of the chemical polishing object becomes strong, and if it is increased, the reaction of the oxidation-reduction reaction is delayed.
他の発明は、化学研磨液の製造方法である。
この製造方法は、リン酸、ピロリン酸又は硫酸のいずれかを一種以上有する酸成分１００質量部と、マンガンイオン、亜鉛イオン、鉄イオン、ニッケルイオン、錫イオン、鉛イオン、銅イオン、銀イオン、白金イオン又は金イオンのいずれかと反応させた硫酸、リン酸又はピロリン酸のいずれかを一種以上有する金属酸化物を５質量部以上４５質量部以下、及び、粘性付与剤２０質量部以上１００質量部以下を有する化学研磨液の製造方法であって、酸成分１００質量部に金属酸化物の配合量の３０％から７０％の範囲内でのいずれかの配合量を配合した後、金属酸化物を溶解させて第一化学研磨液を作成し、粘性付与剤に金属酸化物の残りの配合量（７０％から３０％の範囲内でのいずれかの配合量）を配合した後、金属酸化物を溶解させて第二化学研磨液を作成し、
第一化学研磨液と第二化学研磨液を混合する化学研磨液の製造方法である。
Another invention is a method for producing a chemical polishing liquid.
This production method comprises 100 parts by mass of an acid component having at least one of phosphoric acid, pyrophosphoric acid or sulfuric acid, manganese ions, zinc ions, iron ions, nickel ions, tin ions, lead ions, copper ions, silver ions, 5 parts by mass or more and 45 parts by mass or less of a metal oxide having at least one of sulfuric acid, phosphoric acid or pyrophosphoric acid reacted with either platinum ion or gold ion, and 20 to 100 parts by mass of a viscosity imparting agent. A method for producing a chemical polishing liquid having the following, wherein 100 parts by mass of an acid component is compounded with any compounding amount within the range of 30% to 70% of the compounding amount of the metal oxide, First, the first chemical polishing liquid is dissolved and the remaining compounding amount of the metal oxide (any compounding amount in the range of 70% to 30%) is added to the viscosity-imparting agent. Dissolve Create a second chemical polishing solution,
It is a method for producing a chemical polishing liquid in which a first chemical polishing liquid and a second chemical polishing liquid are mixed.
この化学研磨液に金属製品を浸漬させてその表面を化学研磨する際の液温は、好ましくは６０〜１５０℃、さらに好ましくは８０〜１２０℃であり、液温が低いと光沢を充分に付与し難くなり、液温が高いと研磨面に凹凸が生じやすい傾向にある。化学研磨液への浸漬時間は金属製品の組成や寸法、予熱の有無、液温等に応じて適宜設定され、好ましくは２０秒間〜２０分間、さらに好ましくは１分間から１２分間である。金属製品の化学研磨液への浸漬時間を２０秒程度の短時間とする一方、浸漬回数を数回行うと、金属製品の凹凸の凸部だけがより研磨されるため、特に優れた光沢を得ることができる。 The liquid temperature when the surface is chemically polished by immersing a metal product in this chemical polishing liquid is preferably 60 to 150 ° C., more preferably 80 to 120 ° C. When the liquid temperature is low, sufficient gloss is imparted. When the liquid temperature is high, the polished surface tends to be uneven. The immersion time in the chemical polishing liquid is appropriately set according to the composition and dimensions of the metal product, the presence or absence of preheating, the liquid temperature, and the like, and is preferably 20 seconds to 20 minutes, more preferably 1 minute to 12 minutes. While the immersion time of the metal product in the chemical polishing solution is set to a short time of about 20 seconds, when the number of immersions is performed several times, only the convex and concave portions of the metal product are more polished, so that particularly excellent gloss is obtained. be able to.
以下、本発明に係る実施例を、表１を参照しつつ、比較例を用いて詳細に説明する。 Hereinafter, examples according to the present invention will be described in detail using comparative examples with reference to Table 1.
表１記載の化学研磨液の評価は次の方法で行った。 The chemical polishing liquid described in Table 1 was evaluated by the following method.
＜光沢＞
実施例・比較例の化学研磨液で化学研磨した試験片と未処理品とを目視にて観察し、次の評価基準にて評価を行った。試験片はアルミニウム製の板であり、表面をサンドペーパーで荒くして光沢をなくしたものを用いた。
◎：優れた光沢を有する
○：良好な光沢を有する
△：光沢が不十分
<Glossy>
The test pieces chemically treated with the chemical polishing liquids of Examples and Comparative Examples and untreated products were visually observed and evaluated according to the following evaluation criteria. The test piece was an aluminum plate, and the surface was roughened with sandpaper to remove gloss.
◎: Excellent gloss ○: Good gloss △: Insufficient gloss
＜平滑度＞
実施例・比較例の化学研磨液で化学研磨した試験片と未処理品とを目視にて観察し、次の評価基準にて評価を行った。
◎：優れた平滑度を有する
○：良好な平滑度を有する
△：平滑度が不十分
<Smoothness>
The test pieces chemically treated with the chemical polishing liquids of Examples and Comparative Examples and untreated products were visually observed and evaluated according to the following evaluation criteria.
A: Excellent smoothness B: Good smoothness B: Insufficient smoothness
＜液溶解時間＞
実施例・比較例の化学研磨液に溶解させる硫酸銅の燐酸およびグリセリンへの溶解時間を時計計測し、次の評価基準にて評価を行った。
◎：溶解時間が比較的短い（２０分未満）
○：溶解時間がやや長い（２０分以上１時間未満）
△：溶解時間が長い（１時間以上）
<Solution time>
The dissolution time of copper sulfate to be dissolved in the chemical polishing liquids of Examples and Comparative Examples in phosphoric acid and glycerin was measured by clock and evaluated according to the following evaluation criteria.
A: Dissolution time is relatively short (less than 20 minutes)
○: Dissolution time is slightly long (20 minutes or more and less than 1 hour)
Δ: Long dissolution time (1 hour or more)
各実施例、比較例の化学研磨液について説明する。実施例１の化学研磨液は、表１に記載の配合で製造したものであり、酸成分としてのリン酸１００質量部、金属酸化物としての銅イオンと反応させた硫酸（硫酸銅）１５質量部、及び、粘性付与剤としてのグリセリン５０質量部を混合したものである。 The chemical polishing liquid of each example and comparative example will be described. The chemical polishing liquid of Example 1 was manufactured with the formulation shown in Table 1, and 100 parts by mass of phosphoric acid as an acid component and 15 parts of sulfuric acid (copper sulfate) reacted with copper ions as a metal oxide. And 50 parts by mass of glycerin as a viscosity-imparting agent are mixed.
表１にあるように、実施例１の化学研磨液は、光沢、平滑度、表面状態及び液溶解時間のいずれにおいても良好な値であった。 As shown in Table 1, the chemical polishing liquid of Example 1 had good values in all of gloss, smoothness, surface condition, and liquid dissolution time.
本実施例１の化学研磨液の製造方法について説明する。
実施例１の化学研磨液の製造方法は、酸成分たるリン酸１００質量部に金属酸化物たる硫酸銅のうちの硫酸銅５水塩７．５質量部を混合して第一化学研磨液を製造し、粘性付与剤たるグリセリン５０質量部に硫酸銅５水塩７．５質量部を混合して第二化学研磨液を製造し、さらに、この第一化学研磨液と第二化学研磨液を混合したものである。
この製造方法にあっては、硫酸銅を二液に分けて溶解しているため、一液に溶解するより短い時間で溶解することができた。
A method for producing the chemical polishing liquid of Example 1 will be described.
In the manufacturing method of the chemical polishing liquid of Example 1, 7.5 parts by mass of copper sulfate pentahydrate of copper sulfate, which is a metal oxide, is mixed with 100 parts by mass of phosphoric acid, which is an acid component, to prepare a first chemical polishing liquid. The second chemical polishing liquid is manufactured by mixing 7.5 parts by mass of copper sulfate pentahydrate with 50 parts by mass of glycerin as a viscosity imparting agent. It is a mixture.
In this manufacturing method, since copper sulfate was dissolved in two liquids, it was able to be dissolved in a shorter time than in one liquid.
また、この製造方法の他の実施例として、表には記載しないが、実施例１の配合比で、第一化学研磨液への硫酸銅５水塩１０質量部、第二化学研磨液への硫酸銅５水塩５質量部とした場合、先の製造方法の実施例とほぼ同様な効果を得た。 Moreover, although it does not describe in a table | surface as another Example of this manufacturing method, with the compounding ratio of Example 1, 10 mass parts of copper sulfate pentahydrate to a 1st chemical polishing liquid, to a 2nd chemical polishing liquid In the case of 5 parts by mass of copper sulfate pentahydrate, substantially the same effect as in the previous example of the production method was obtained.
実施例２から実施例１４について、比較例１から６を比較しつつ詳細に説明する。 Example 2 to Example 14 will be described in detail while comparing Comparative Examples 1 to 6.
実施例２は、硫酸銅５水塩を２１質量部、グリセリン４０質量部とした以外は、実施例１と同様な化学研磨液である。この実施例２は実施例１と同様な評価を得た。 Example 2 is a chemical polishing liquid similar to Example 1 except that the copper sulfate pentahydrate is 21 parts by mass and glycerin 40 parts by mass. In Example 2, the same evaluation as in Example 1 was obtained.
実施例３は、実施例１のグリセリンを０質量部とした以外は、実施例１と同様な化学研磨液である。本実施例は、平滑度が実施例１より評価が低かったが、製品としては問題ないものであった。 Example 3 is the same chemical polishing liquid as Example 1 except that the glycerin of Example 1 was changed to 0 part by mass. In this example, the smoothness was lower than that of Example 1, but there was no problem as a product.
実施例４は、実施例１のグリセリンを１０質量部とした以外は、実施例１と同様な化学研磨液である。本実施例は、平滑度が実施例１より評価が低かったが、製品としては問題ないものであった。 Example 4 is the same chemical polishing liquid as Example 1 except that the glycerin of Example 1 was changed to 10 parts by mass. In this example, the smoothness was lower than that of Example 1, but there was no problem as a product.
実施例５は、硫酸銅５水塩を２１質量部、グリセリンを１，３−ブタンジオール５０質量部とした以外は、実施例１と同様な化学研磨液である。本実施例は実施例１と同様な評価を得た。 Example 5 is the same chemical polishing liquid as Example 1 except that 21 parts by mass of copper sulfate pentahydrate and 50 parts by mass of 1,3-butanediol were used for glycerin. In this example, the same evaluation as in Example 1 was obtained.
実施例６は、硫酸銅５水塩を２５質量部、グリセリンをペクチン４０質量部とした以外は、実施例１と同様な化学研磨液である。本実施例も実施例１と同様な評価を得た。 Example 6 is a chemical polishing liquid similar to Example 1 except that 25 parts by mass of copper sulfate pentahydrate and 40 parts by mass of glycerin are used. In this example, the same evaluation as in Example 1 was obtained.
実施例７は、硫酸銅５水塩を８質量部、グリセリン４０質量部とした以外は、実施例１と同様な化学研磨液である。本実施例は硫酸銅が少ないので実施例１に比べて光沢がやや悪くなった。 Example 7 is the same chemical polishing liquid as Example 1 except that 8 parts by mass of copper sulfate pentahydrate and 40 parts by mass of glycerin are used. In this example, since the amount of copper sulfate was small, the gloss was slightly worse than that in Example 1.
実施例８は、硫酸銅５水塩を２１質量部、グリセリン３０質量部とした以外は、実施例１と同様な化学研磨液である。本実施例はグリセリンが少ないので実施例１に比べ平滑度がやや悪くなった。 Example 8 is the same chemical polishing liquid as Example 1 except that 21 parts by mass of copper sulfate pentahydrate and 30 parts by mass of glycerin are used. In this example, since the amount of glycerin was small, the smoothness was slightly worse than that in Example 1.
実施例９は、硫酸銅５水塩を２１質量部、グリセリン８０質量部とした以外は、実施例１と同様な化学研磨液である。本実施例はグリセリンが多くなり実施例１に比べ光沢がやや悪くなった。 Example 9 is a chemical polishing liquid similar to Example 1 except that the copper sulfate pentahydrate is 21 parts by mass and glycerin 80 parts by mass. In this example, the amount of glycerin was increased and the gloss was slightly deteriorated as compared with Example 1.
実施例１０は、硫酸銅５水塩を３５質量部、グリセリン４０質量部とした以外は、実施例１と同様な化学研磨液である。本実施例は硫酸銅が多くなったので硫酸銅の溶解時間が長くなった。 Example 10 is a chemical polishing liquid similar to Example 1 except that 35 parts by mass of copper sulfate pentahydrate and 40 parts by mass of glycerin are used. In this example, since the amount of copper sulfate increased, the dissolution time of copper sulfate was increased.
実施例１１は、実施例１のリン酸をピロリン酸とした以外は、実施例１と同様な化学研磨液である。本実施例は実施例１と同様な評価を得た。 Example 11 is the same chemical polishing liquid as Example 1 except that the phosphoric acid of Example 1 was changed to pyrophosphoric acid. In this example, the same evaluation as in Example 1 was obtained.
実施例１２は、実施例１のリン酸をリン酸９０質量部及び硫酸１０質量部の混合体とした以外は、実施例１と同様な化学研磨液である。本実施例は実施例１と同様な評価を得た。 Example 12 is a chemical polishing liquid similar to Example 1 except that the phosphoric acid of Example 1 is a mixture of 90 parts by mass of phosphoric acid and 10 parts by mass of sulfuric acid. In this example, the same evaluation as in Example 1 was obtained.
実施例１３は、実施例１の硫酸銅５水塩をリン酸錫とした以外は、実施例１と同様な化学研磨液である。本実施例は実施例１と同様な評価を得た。 Example 13 is the same chemical polishing liquid as Example 1 except that the copper sulfate pentahydrate of Example 1 was tin phosphate. In this example, the same evaluation as in Example 1 was obtained.
実施例１４は、実施例２に比べ、グリセリンの配合量を極端に多くしたものである。グリセリンの配合量が多すぎると光沢を与えることと平滑を与えるのに時間がかかった。 In Example 14, compared with Example 2, the amount of glycerin was extremely increased. When the amount of glycerin was too large, it took time to give gloss and smoothness.
比較例１は、実施例１に比べ、硫酸銅５水塩の配合量を極端にしたものである。本比較例は、光沢がかなり悪くなり、平滑度もやや悪くなった。 In Comparative Example 1, compared with Example 1, the compounding amount of copper sulfate pentahydrate is extreme. In this comparative example, the gloss was considerably deteriorated and the smoothness was slightly deteriorated.
比較例２は、実施例２に比べ、硫酸銅５水塩の配合量を極端に多くしたものである。硫酸銅５水塩の配合量が多くなると硫酸銅の溶解時間がかなり遅くなった。 In Comparative Example 2, compared with Example 2, the blending amount of copper sulfate pentahydrate is extremely increased. As the amount of copper sulfate pentahydrate increased, the dissolution time of copper sulfate was considerably delayed.
比較例３は、実施例１に比べ、硫酸銅５水塩とグリセリンの配合量を極端に少なくしたものである。硫酸銅とグリセリンが共に極端に少ないと、光沢と平滑度が共にかなり悪くなった。 In Comparative Example 3, compared with Example 1, the blending amount of copper sulfate pentahydrate and glycerin is extremely reduced. When both copper sulfate and glycerin were extremely small, both gloss and smoothness deteriorated considerably.
比較例４は、実施例１に比べ、硫酸銅５水塩の配合量を極端に少なくすると共にグリセリンの配合量を極端に多くしたものである。硫酸銅が極端に少なく、グリセリンが極端に多いと、光沢と平滑度が共にかなり悪くなった。 In Comparative Example 4, as compared with Example 1, the amount of copper sulfate pentahydrate is extremely reduced and the amount of glycerin is extremely increased. When the amount of copper sulfate was extremely small and the amount of glycerin was extremely large, both gloss and smoothness deteriorated considerably.
比較例５は、実施例１に比べ、硫酸銅５水塩の配合量を極端に多くすると共にグリセリンの配合量を極端に少なくしたものである。硫酸銅が極端に多く、グリセリンが極端に少ないと、平滑度はやや悪くなり、硫酸銅の溶解時間はかなり遅くなった。 In Comparative Example 5, as compared with Example 1, the amount of copper sulfate pentahydrate is extremely increased and the amount of glycerin is extremely decreased. When the amount of copper sulfate was extremely large and the amount of glycerin was extremely small, the smoothness deteriorated somewhat and the dissolution time of copper sulfate was considerably delayed.
比較例６は、実施例１に比べ、硫酸銅５水塩とグリセリンの配合量を極端に多くしたものである。硫酸銅とグリセリンが共に極端に多くなると、光沢も平滑度もかなり悪くなり、硫酸銅の溶解時間もかなり遅くなった。 In Comparative Example 6, compared with Example 1, the compounding amount of copper sulfate pentahydrate and glycerin was extremely increased. When both copper sulfate and glycerin were extremely increased, both gloss and smoothness were considerably deteriorated, and the dissolution time of copper sulfate was considerably delayed.
Claims (6)
マンガンイオン、亜鉛イオン、鉄イオン、ニッケルイオン、錫イオン、鉛イオン、銅イオン、銀イオン、白金イオン又は金イオンのいずれかと反応させた硫酸、リン酸又はピロリン酸のいずれかを一種以上有する金属酸化物５質量部以上４５質量部以下を有する化学研磨液。 100 parts by mass of an acid component having at least one of phosphoric acid, pyrophosphoric acid or sulfuric acid,
Metal having one or more of sulfuric acid, phosphoric acid or pyrophosphoric acid reacted with any of manganese ion, zinc ion, iron ion, nickel ion, tin ion, lead ion, copper ion, silver ion, platinum ion or gold ion A chemical polishing liquid having 5 to 45 parts by mass of oxide.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104164671A (en) * | 2014-08-12 | 2014-11-26 | 瓮福（集团）有限责任公司 | Aluminum alloy two-acid smokeless polishing additive and preparation method thereof |
| JP2020090698A (en) * | 2018-12-04 | 2020-06-11 | 日本表面化学株式会社 | Chemically polished composition and method for producing metal material |
| CN115353808A (en) * | 2022-07-13 | 2022-11-18 | 锦矽半导体(上海)有限公司 | Polishing solution for nickel coating |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104164671A (en) * | 2014-08-12 | 2014-11-26 | 瓮福（集团）有限责任公司 | Aluminum alloy two-acid smokeless polishing additive and preparation method thereof |
| JP2020090698A (en) * | 2018-12-04 | 2020-06-11 | 日本表面化学株式会社 | Chemically polished composition and method for producing metal material |
| JP7188746B2 (en) | 2018-12-04 | 2022-12-13 | 日本表面化学株式会社 | Chemical polishing composition and method for producing metal material |
| CN115353808A (en) * | 2022-07-13 | 2022-11-18 | 锦矽半导体(上海)有限公司 | Polishing solution for nickel coating |
| CN115353808B (en) * | 2022-07-13 | 2024-01-23 | 锦矽半导体(上海)有限公司 | Polishing solution for nickel plating |
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