JP2011035165A - Structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To save on the space of a part where frame bodies are adjacent to each other. <P>SOLUTION: A structure M1 has two frame bodies 10a and 10b provided to an electronic circuit wiring board 1. The frame bodies 10a and 10b respectively have mutually adjacent sidewalls 14a and 14b, the sidewalls 14a and 14b have a plurality of partial sidewalls 11a and 11b fixed to the base substance, and the partial sidewalls of the other frame body have a shape to be fixed on the line connecting the fixing positions where the adjacent partial sidewalls of one frame body are respectively fixed to the electronic circuit wiring board 1. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a structure having a structure in which two or more frames are arranged.

  There are various types of frame parts including a wall that is arranged on an electronic circuit wiring board (printed circuit board) and surrounds a specific area on which electronic parts are mounted. Examples of such frame parts include electromagnetic wave shielding parts (shields), spacers (bases), reinforcing parts that increase the rigidity of electronic circuit wiring boards, and the like. Conventionally, when two or more frame parts are arranged adjacent to each other on an electronic circuit wiring board, arrangement and structure of the frame parts that can reduce dead space have been proposed.

  For example, Patent Document 1 discloses a structure of an electromagnetic wave shielding component that can reduce the mounting area occupied by the component on an electronic circuit wiring board.

  FIG. 18 is an example of a conventional configuration disclosed in Patent Document 1, and is an exploded view showing the arrangement and structure of electromagnetic shielding components provided on an electronic circuit wiring board. FIG. 19 is an exploded view showing an electromagnetic wave shielding component provided on the electronic circuit wiring board shown in FIG. 18 and an electromagnetic wave shielding cover covering them. FIG. 20 is a top view showing details of the vicinity of a portion where a metal frame (shield frame) included in the electromagnetic wave shielding component (shield) shown in FIG. 18 is adjacent.

  The electronic circuit wiring board 101 is provided with a connection terminal (pattern) for connecting to an electronic component, and connecting the electronic component necessary for obtaining a desired function to the connection terminal, A circuit is formed by conductively connecting the electronic component, whereby the electronic circuit wiring board 101 obtains the intended function. Since some electronic components mounted on the electronic circuit wiring board 101 emit electromagnetic waves or are influenced by external electromagnetic waves, it is necessary to shield them from each other.

  The regions 103a, 103b, and 103c are regions for mounting components that need to shield each other, and are surrounded by a ground pattern (GND pattern) 102 for mounting the metal frames 110a, 110b, and 110c. It has been broken. That is, the electronic circuit wiring board 101 on which electronic components are mounted is provided with a ground pattern 102 on which a metal frame is mounted. The ground pattern 102 attaches the electronic circuit wiring board 101 to three component mounting regions 103a. , 103b, and 103c.

  In these component mounting areas 103a, 103b, and 103c, electronic components that should shield electromagnetic waves from each other are mounted.

  Then, metal frames 110a, 110b, and 110c that bear a part of the electromagnetic wave shielding function are installed along the ground pattern 102 so as to surround the component mounting regions 103a, 103b, and 103c. The metal frame bodies 110a, 110b, and 110c have a frame shape, have wall portions extending in a direction perpendicular to the electronic circuit wiring board 101, and are disposed adjacent to each other. Each of the metal frames 110a, 110b, and 110c is provided with connection terminals (solder terminals) 111a, 111b, and 111c for mounting the metal frame on the electronic circuit wiring board.

  Then, the connection terminals 111a, 111b, and 111c of the metal frames 110a, 110b, and 110c arranged in this manner and the ground pattern 102 on the electronic circuit wiring board 101 are joined together by, for example, solder, so that the electronic Connection between the circuit wiring board 101 and the metal frames 110a, 110b, and 110c is mechanically and electrically performed.

  At this time, as shown in FIG. 20, the metal frame bodies 110a, 110b, and 110c are arranged so that the connection terminals 111a, 111b, and 111c of the adjacent metal frame bodies are alternately arranged at positions adjacent to each other. . Thereby, the mounting positions of the metal frame bodies 110a, 110b, 110c and the metal frame bodies 110a are made as close as possible to improve the mounting density.

  In addition, Patent Document 2 discloses a technique in which a surface solder portion for installing a shield case on a ground pattern of a printed board is formed only on one side of the shield case. And when the shield case disclosed in Patent Document 2 is installed in a pair on the printed circuit board, the shield case can be installed side by side so that the surface solder portions of each shield case do not face each other. , To reduce dead space.

  As shown in FIG. 19, the electromagnetic wave shielding cover 120 can be mounted so as to cover the open portions of the upper surfaces of the metal frames 110a, 110b, 110c installed on the electronic circuit wiring board 101 in a lump. It has become.

  Further, by attaching the electromagnetic wave shielding cover 120 to the upper part of the metal frames 110a, 110b, and 110c, the electromagnetic wave shielding cover 120 and the metal frames 110a, 110b, and 110c are conductively connected to form an electromagnetic wave shielding structure. Is done.

  Then, the electromagnetic wave shielding between the electronic components mounted in the regions 103a, 103b, and 103c is performed by the electromagnetic wave shielding structure.

JP 2001-160698 A (released on June 12, 2001) JP 2001-144487 A (published May 25, 2001)

  When mounting the frame body component on the electronic circuit wiring board, the component mounting clearance and the electronic component are connected to the electronic circuit wiring board 101 in order to prevent the frame body components from interfering with each other due to the dimensional tolerance and mounting accuracy of the frame body component. An insulation clearance between the connection terminals on the electronic circuit wiring board 101 for conductive connection is required.

  Moreover, also when performing the process which carries out the conductive connection of various electronic components using the solder with respect to the electronic circuit wiring board 101, the clearance for performing this process is needed.

  Hereinafter, as an example of the soldering process, a necessary clearance will be described while describing a method of printing solder using a metal mask. For example, solder printing using a metal mask is performed as follows.

  First, a molten conductive material for mounting an electronic component, for example, a solder paste, is printed on the electronic circuit wiring board 101 provided with a connection terminal (pattern) for each electronic component.

  The solder paste is generally applied as follows. That is, first, a metal mask having an opening hole at a location where solder supply is required is brought into close contact with the substrate. Next, the solder paste is filled into the opening of the metal mask using a squeegee or the like from above. Thereafter, the metal mask is separated from the electronic circuit wiring board. Thereby, the solder filled in the opening hole of the metal mask remains on the electronic circuit wiring board.

  After the solder is applied, necessary electronic components are mounted on the electronic circuit wiring board, and in this state, heat is applied simultaneously to the electronic circuit wiring board 101 and the mounted electronic components and solder paste using a reflow furnace or the like. As a result, the solder is melted and cooled to solidify the solder, thereby joining the connection terminals provided on the electronic circuit wiring board 101 and the connection terminals of the electronic components mounted thereon.

  Here, when printing solder using a metal mask in this way, the following clearance is required.

  First, in order to normally open an opening hole in a metal mask, a clearance for creating an opening hole provided between adjacent opening holes is necessary. And the printing clearance for preventing the adjacent solders from contacting at the time of solder printing and component mounting is required. In particular, component mounting is performed on printed solder, and the solder spreads out. Therefore, it is necessary to ensure a sufficient interval between adjacent solders.

  According to the above-described conventional structure such as the electromagnetic wave shielding component, the electromagnetic waves using the metal frames 110a, 110b, and 110c are respectively provided between the regions 103a, 103b, and 103c where the electronic components that need to be shielded from each other are mounted. It was necessary to provide a shielding wall. For this reason, it is necessary to have a width for mounting the metal frames 110a, 110b, 110c and various clearances associated with the mounting, and the regions 103a, 103b, 103c cannot be made closer than these widths. . Therefore, the area on the electronic circuit wiring board 101 cannot be effectively used for mounting various components, and the waste is large.

  The design specifications for component mounting are not unique, but the width necessary for mounting electronic components is examined using the example shown in FIG. 21 as follows. This figure is a cross-sectional view taken along line XX shown in FIG.

  As illustrated in FIG. 21, when the metal frame 110 a and the metal frame 110 c are arranged adjacent to each other, it is generally necessary to secure the next width as the width W <b> 105 of the ground pattern 102.

  That is, the mounting widths W101a and W101b of the shielding wall provided perpendicular to the electronic circuit wiring board 101 corresponding to the two metal frames 110a and 110c, and the metal frame provided horizontally to the electronic circuit wiring board 101 The mounting area W102 of any one of the connection terminals 111a and 111c of the bodies 110a and 110c, the mounting position displacement clearance W103 between the metal frame 110a (110c) and the connection terminal 111c (111a), the metal frame 110a, Fillet creation areas W104a and W104b provided on one side or both sides of 110c are required.

  In addition, as a clearance between the ground pattern 102 and the electronic components mounted on the portions of the regions 103a and 103c close to the metal frames 110a and 110c, an insulation clearance, an electronic component mounted on the regions 103a and 103c, and a metal A mounting clearance between the frames 110a and 110c, a solder printing clearance, and the like are required.

  Further, depending on the component mounting specifications, it is necessary to additionally provide a clearance for creating a metal mask opening between the metal frames 110a and 110c, a solder printing clearance, and the like.

  As described above, in the conventional technique, when two or more regions 103a, 103b, and 103c on which electronic components are mounted are adjacent to the metal frames 110a, 110b, and 110c having walls so as to surround each region, There has been a problem that a lot of clearance areas must be secured.

  In particular, a part having a large shape is difficult to maintain the flatness of the part, so that it is difficult to perform joint joining with solder as described above. That is, when an area for mounting an electronic component that needs to be shielded from electromagnetic waves becomes wide, the electromagnetic shielding component cannot be increased to a certain extent.

  For this reason, it is necessary to divide the area into a plurality of smaller areas. Along with this, an electromagnetic wave shielding component is provided for each divided region, and mounting and joining are performed on the electronic circuit wiring board.

  Therefore, the number of adjacent portions between the electromagnetic wave shielding components increases, and various clearances are required in the adjacent portions. As a result, there arises a problem that a useless area (dead space) such as various clearances that do not contribute to integration of electronic components or the like further increases.

  The present invention has been made in view of the above problems, and an object of the present invention is to obtain a structure capable of saving space in a portion where frames are adjacent to each other.

  In order to solve the above problems, a structure according to the present invention is a structure in which two frames are provided on a base, and the two frames each have adjacent portions adjacent to each other. The adjacent portion includes a plurality of attachment portions attached to the base body, and the other frame body is on a line connecting attachment positions at which adjacent attachment portions of the one frame body are attached to the base body. It is characterized by having a shape that can be attached to the mounting part.

  According to the above configuration, in the adjacent portion where the two frames are adjacent to each other, the attachment positions of the two frames are arranged on a common line.

  Here, conventionally, the attachment region of one adjacent part and the attachment region of the other adjacent part are arranged on separate lines, and there is a gap between the two lines. On the other hand, in this invention, since it has located in a line on a common line, the said gap | interval is lose | eliminated, As a result, there exists an effect that space saving can be achieved at the part which frames adjoin.

  Further, in the structure according to the present invention, the attachment portion is a partition plate that partitions the inside and the outside of the frame body, and adjacent partition plates in the one frame body are separated to form a gap portion, It is preferable that the partition plate in the other frame is disposed in the gap portion.

  Specifically, in the present invention, the attachment portion is a partition plate that partitions the inside and the outside of the frame body, and adjacent partition plates in the one frame body are spaced apart to form a gap portion. It can be set as the structure by which the said partition plate in said other frame is arrange | positioned at a part.

  Moreover, in the structure which concerns on this invention, it is preferable that the partition plate provided in said one said frame and the partition plate provided in said other said frame are arrange | positioned at intervals. .

  According to the above configuration, the partition plate provided on the one frame body and the partition plate provided on the other frame body are arranged at intervals, so that they are mounted on a line. A clearance can be ensured between the partition plates on the region. This prevents a situation in which the frames cannot interfere with each other due to frame dimensional tolerances or mounting position deviations, etc., and stress acts on the structure, causing the partition plate to be damaged by contact. Can be reduced.

  In the structure according to the present invention, it is preferable that the frame is a conductor, and the interval is defined based on the wavelength of the electromagnetic wave to be shielded.

  According to the above configuration, the frame body is a conductor, and the interval is defined based on the wavelength of the electromagnetic wave to be shielded. Thereby, a desired shielding effect can be obtained. The said space | interval can be prescribed | regulated based on the relationship described in FIG. 5 of patent document 1 of a prior art, for example.

  Moreover, in the structure which concerns on this invention, it is preferable that the partition plate provided in said one said frame and the partition plate provided in said other said frame are arrange | positioned without gap.

  According to the above configuration, the partition plate provided on the one of the frame bodies and the partition plate provided on the other of the frame bodies are arranged without gaps. The structure becomes fixed. Thereby, even if the stress which moves each frame with respect to a base | substrate is applied, it can suppress that a frame moves.

  In the structure according to the present invention, a cover that covers the two frames is provided, and the base body, the frames, and the cover are formed of a material that shields electromagnetic waves, or are made of the material. It is preferably coated.

  According to the said structure, in the space enclosed by the said base | substrate, each said frame, and the said cover, it can function as an electromagnetic wave shield which prevents that electromagnetic waves leak outside or electromagnetic waves penetrate | invade from the exterior. In addition, as a material which shields electromagnetic waves, electroconductive materials, such as SUS (Stainless Used Steel), can be used, for example.

  The cover preferably includes a fixing portion for fixing the two frame bodies.

  According to the above configuration, since the cover includes the fixing portion that fixes the two frame bodies, the two frame bodies can be fixed by the fixing portion. For this reason, even if stress is applied to the structure, it is possible to suppress the above-described portions from moving individually and, for example, being separated.

  In the structure according to the present invention, each of the frames includes a top plate that closes the upper portion, and the base body and the frames are formed of or covered with a material that shields electromagnetic waves. It is preferable.

  According to the said structure, in the space enclosed by each frame provided with the said base | substrate and the said top plate, it can function as an electromagnetic wave shield which prevents that electromagnetic waves leak outside or electromagnetic waves penetrate | invade from the exterior.

  In order to solve the above problems, the structure according to the present invention is such that the first base provided with the first frame and the second base provided with the second frame face each other, By disposing the second frame so as to be adjacent to each other, each frame provided on the two bases includes an adjacent part adjacent to each other, and each of the adjacent parts includes a plurality of parts attached to the bases. The other base is provided on the other base with a line connecting the mounting positions where the adjacent mounting parts in the frame provided on one base are respectively attached to the base. It is characterized in that it has a shape such that the attachment portion in the frame body provided in can be attached.

  According to the above configuration, the first base body provided with the first frame body and the second base body provided with the second frame body face each other, and the first frame body and the second frame body are adjacent to each other. By being arranged, each frame provided on the two bases has an adjacent portion adjacent to each other.

  And each said adjacent part is provided with the some attachment part attached to each said base | substrate, and the attachment position in which the adjacent attachment part in the frame provided in one base | substrate is each attached to the said base | substrate is provided. The shape is such that the attachment portion of the frame body provided on the other base is attached to the line on the other base opposite to the connecting line.

  Conventionally, the attachment region of one adjacent part and the attachment region of the other adjacent part are arranged on separate lines, and there is a gap between two lines. On the other hand, in the present invention, since the mounting positions on the two bases are aligned on the lines facing each other, the gap is eliminated, and as a result, space saving is achieved in the portion where the frames are adjacent to each other. There is an effect that it can be realized.

  In the structure according to the present invention, it is preferable that the base body and the frame bodies are formed of a material that shields electromagnetic waves or are covered with the material.

  According to the said structure, the electromagnetic wave from the outside can be shielded in the space enclosed by the said base | substrate and each said frame. In addition, as a material which shields electromagnetic waves, electroconductive materials, such as SUS (Stainless Used Steel), can be used, for example.

  Furthermore, since one of the substrates functions as a cover for the frame provided on the other substrate, it is not necessary to prepare a cover or the like to be attached to the frame to shield electromagnetic waves.

  Moreover, in the structure which concerns on this invention, it is preferable to provide the clip member hold | maintained on both sides of the attachment part in said 2 frame.

  According to the said structure, since a clip member hold | maintains on both sides of the attaching part in said two frame bodies, the said part can be mutually fixed.

  Thereby, even if stress is applied to the structure, it is possible to suppress the above-described portions from moving individually and being separated, for example.

  Further, the structure according to the present invention includes a clip member that holds the mounting portion between the two frame bodies and is formed of a material that shields electromagnetic waves or is covered with the material. It is preferable.

  According to the said structure, since a clip member hold | maintains on both sides of the attaching part in said two frame bodies, the said part can be mutually fixed.

  Thereby, even if stress is applied to the structure, it is possible to suppress the above-described portions from moving individually and being separated, for example.

  Furthermore, since the clip member is formed of a material that shields electromagnetic waves or is covered with the material, the effect of shielding electromagnetic waves in adjacent portions can be improved.

  In the structure according to the present invention, the clip member preferably has higher rigidity than the base body, and preferably has rigidity equal to or higher than each frame. .

  According to the above configuration, it is possible to avoid the inconvenience that the clip member is damaged before the base body or the frame body is damaged due to the stress.

  In the structure according to the present invention, there are three or more attachment portions provided in the adjacent portion of the one frame body, and the attachment position of a certain attachment portion and the attachment portion adjacent to the attachment portion are the above. It is preferable that the line connecting the mounting position is bent with respect to the line connecting the mounting position of the certain mounting portion and the mounting position of the other mounting portion adjacent to the mounting portion.

  In the case where the adjacent portions are configured in a straight line, even when a force that bends about a straight line that is different from the linear direction and passes through the direction parallel to the base is applied, the base is hardly deformed.

  This is because the adjacent portion as the rigid body is configured in a straight line as described above, and the straight line and the shaft intersect, so that the rigidity with respect to the bending force is provided.

  On the other hand, when a force that bends about the straight line is applied, the frame on the base body is likely to be deformed. This is because the straight line and the axis are the same or parallel, and thus the above-described rigidity cannot be obtained. For this reason, with the linear direction as the center, the attachment part provided in the adjacent part in one frame body and the attachment part provided in the adjacent part in the other frame body are pulled in opposite directions to each other. May be damaged.

  On the other hand, according to the above configuration, the line connecting the attachment position of a certain attachment portion and the attachment position of one attachment portion adjacent to the attachment portion is the same as the attachment position of the certain attachment portion and the attachment portion. Is bent with respect to a line connecting the mounting position of the other mounting portion adjacent to the first mounting portion.

  Thereby, the adjacent part as a rigid body is comprised on the some straight line from which a direction differs. Therefore, even if a force that bends a certain axis is applied, the shaft intersects at least one of the plurality of straight lines, and therefore has rigidity against the bending force.

  Moreover, according to the said structure, the length between the both ends of an adjacent part becomes long rather than the case where an adjacent part is comprised in a straight line. Thereby, the rigidity with respect to the stress which causes the base to warp can be obtained by the length which is longer than the case where the adjacent portion is configured in a straight line.

  In the structure according to the present invention, it is preferable that the two frame bodies have the same shape.

  According to the above configuration, since the two frames have the same shape, the components of the two frames can be shared. Thereby, for example, it is also possible to create each frame using the same mold. As a result, it is possible to suppress an increase in cost for manufacturing the frame.

  Moreover, in the structure which concerns on this invention, it is preferable to provide a conductive contact part in the upper part of each frame in each said adjacent part.

  According to the above configuration, in each of the adjacent portions, the conductive contact portion is provided on the upper portion of each frame body, so that a good connection can be obtained when urged by the component made of the conductive material from the upper portion.

  For example, it is assumed that the conductive contact portion is energized by a cover for shielding electromagnetic waves or a substrate.

  In the structure according to the present invention, two frame bodies each have adjacent portions that are adjacent to each other, and the adjacent portions include a plurality of attachment portions that are attached to the base body, and one frame. The shape is such that the attachment portion of the other frame is attached on the line connecting the attachment positions where the attachment portions adjacent to each other are attached to the base body.

  In the structure according to the present invention, the first base body provided with the first frame body and the second base body provided with the second frame body face each other, and the first frame body and the second frame body are By being arranged so as to be adjacent to each other, each frame body provided on the two bases has an adjacent part adjacent to each other, and each of the adjacent parts has a plurality of attachment parts attached to the bases. And the frame provided in the other base on the line in the other base where the lines connecting the mounting positions where the adjacent mounting portions in the base provided in one base are respectively attached to the base are opposed to each other. The shape is such that the mounting portion is attached.

  Therefore, there is an effect that it is possible to save space in a portion where the frames are adjacent to each other.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view showing an example of an embodiment according to the present invention and showing a structure composed of an electronic circuit wiring board and two frames disposed adjacently on the electronic circuit wiring board. FIG. 2 is a perspective view showing a state in which two frames are mounted adjacent to each other on the electronic circuit wiring board in FIG. 1. It is arrow sectional drawing in the BB line shown in FIG. It is the perspective view shown in detail about a part of adjacent part of the two frames shown in FIG. It is the top view which extracted the whole adjacent part of the two frames shown in FIG. It is a disassembled perspective view which shows the electromagnetic wave shielding cover with which the upper surface of the two frames shown in each said figure is mounted | worn. It is the top view shown about the structural example in the case of making 4 frames adjoin. The exploded perspective view which shows an example of embodiment which concerns on this invention, and shows the structure which has the structure where the frame bodies were adjacently arranged by superimposing two electronic circuit wiring boards provided with the frame body It is. FIG. 9 is a perspective view showing a state in which two frames are mounted adjacent to each other on the electronic circuit wiring board in FIG. 8. In FIG. 9, the illustration of one electronic circuit wiring board is omitted. It is the shape figure which looked at the clip member for incorporating in a frame from three directions, (a) shows the side which looked at the clip member from one direction, and (b) looked at the clip member from the upper surface. (C) shows the side which looked at the clip member from other directions. The example which concerns on an example which concerns on this invention is shown, It is the enlarged view which looked at the adjacent part of the frame with which a structure is provided from the upper surface. The example which concerns on an example which concerns on this invention is shown, The state which the clip member shown in FIG. 11 was attached to the adjacent part of the frame with which a structure is provided is the enlarged view seen from the upper surface of the adjacent part of a frame. is there. It is an upper surface figure showing an example of an embodiment concerning the present invention and showing an adjacent portion of a frame with which a structure is provided in detail. The relationship between the reinforcing plate provided on the base and the reinforcing effect is shown, (a) is a front view showing one side of the base provided with the reinforcing plate, and (b) is provided with the reinforcing plate. FIG. It is an upper surface figure which showed an example of an embodiment concerning the present invention and extracted the whole adjacent part of two frames with which a structure is provided. It is arrow sectional drawing in the FF line shown in FIG. It is an example of a conventional configuration disclosed in Patent Document 1, and is an exploded view showing the arrangement and structure of electromagnetic shielding components provided on an electronic circuit wiring board. FIG. 19 is an exploded view showing an electromagnetic wave shielding component provided on the electronic circuit wiring board shown in FIG. 18 and an electromagnetic wave shielding cover covering them. It is a top view which shows the detail of the location periphery of the metal frame which the electromagnetic wave shielding component shown in FIG. 18 adjoins. It is arrow sectional drawing in the XX line shown in FIG.

  Each embodiment of the present invention will be described below with reference to the drawings. Throughout the drawings, members having the same function are denoted by the same reference numerals, and redundant description thereof is omitted.

[Embodiment 1]
One embodiment of the present invention is described below with reference to FIGS.

  FIG. 1 shows an example of an embodiment according to the present invention, and is an exploded perspective view showing an electronic circuit wiring board and a structure composed of two frames disposed adjacently on the electronic circuit wiring board. FIG. 2 is a perspective view showing a state in which the two frames in FIG. 1 are mounted adjacent to each other on the electronic circuit wiring board.

  3 is a cross-sectional view taken along the line BB shown in FIG. 2, and FIG. 4 is a perspective view showing in detail a part of the adjacent portions of the two frames shown in FIG. .

  FIG. 5 is a top view in which the entire adjacent portions of the two frames shown in FIG. 2 are extracted.

(About components of electronic circuit wiring board)
The structure M1 according to the present embodiment is configured to include an electronic circuit wiring board (base) 1, a ground pattern 2, and frames 10a and 10b.

  The electronic circuit wiring board 1 for mounting electronic components is a substantially rectangular substrate for mounting necessary electronic components and the like, and is a so-called printed circuit board. A circuit that realizes a desired function is configured by mounting electronic components or the like on the electronic circuit wiring board 1. Electronic components are mounted on the electronic circuit wiring board 1 by using, for example, surface mounting technology (SMT). A wiring pattern is printed on the printed circuit board, and the electronic components are connected to each other by the wiring pattern.

  On the surface of the electronic circuit wiring board 1, regions 3a and 3b and a ground pattern 2 are provided.

  The areas 3a and 3b are areas for mounting electronic components and the like on the electronic circuit wiring board 1. In the present embodiment, the areas 3a and 3b are illustratively substantially rectangular areas. The regions 3a and 3b are exemplarily regions having the same shape.

  The ground pattern 2 is for mounting the frames 10a and 10b having walls around the electronic circuit wiring board 1, and is continuously provided so as to surround the areas 3a and 3b.

  The regions 3 a and 3 b are provided across the region A of the ground pattern 2.

  The frame bodies 10a and 10b are frame-shaped members having side walls around the frame bodies 10a and 10b, and are attached on the ground pattern 2 so as to be along the circumferences of the substantially rectangular regions 3a and 3b. At this time, the frames 10 a and 10 b are adjacent to each other in the area A of the ground pattern 2.

  Further, the side wall of the frame 10 a is configured by an adjacent side wall 14 (adjacent portion) a and a non-adjacent side wall 13 a that extend in a direction perpendicular to the electronic circuit wiring board 1. In the present embodiment, for example, the frame bodies 10a and 10b have the same shape. That is, the side wall of the frame 10b is also constituted by the adjacent side wall (adjacent portion) 14b and the non-adjacent side wall 13b extending in the vertical direction with respect to the electronic circuit wiring board 1.

  Here, in the drawing, a top plate 16a having a central opening is provided on the upper surfaces of the frame bodies 10a and 10b. For this reason, as shown in FIG. 3, the cross section of the frame 10a is an inverted L-shape. However, the present invention is not limited to this, and the frame bodies 10a and 10b may include a top plate that covers the entire upper surface of the frame bodies 10a and 10b. The shape of the frame bodies 10a and 10b is not limited as long as it is a shape having a wall around it, and can be changed according to the application.

  An opening 12a is provided in the adjacent side wall 14a of the frame 10a. That is, the adjacent side wall 14a of the frame 10a is configured by an opening (gap portion) 12a and a partial side wall (attachment portion, partition plate) 11a other than the opening 12a.

  Similarly, the adjacent side wall 14b of the frame 10b is provided with an opening 12b. That is, the adjacent side wall 14b of the frame body 10b includes the opening 12b and the partial side wall 11b other than the opening 12b.

  The non-adjacent side walls 13a and 13b of the frame bodies 10a and 10b are not provided with openings as provided in the adjacent side walls 14a and 14b, but are formed with wall surfaces that extend over three sides. In the present embodiment, the non-adjacent side walls 13a and 13b of the frame bodies 10a and 10b are formed with wall surfaces extending over three sides. However, the present invention is not limited to this and can be appropriately changed depending on the application. It may be perforated and may be provided with a slit.

  The frames 10a and 10b can function as spacers that hold a space between the electronic circuit wiring board 1 and another substrate provided thereabove. In this case, it is desirable that the frames 10a and 10b have sufficient rigidity, for example, higher rigidity than the electronic circuit wiring board 1.

  When the frame bodies 10a and 10b function as spacers, if the frame bodies 10a and 10b have sufficient rigidity, a wall extending in a direction perpendicular to the electronic circuit wiring board 1 is provided around the frame bodies 10a and 10b. Even if force is applied from the other substrate, the frames 10a and 10b can function as a cradle for the other substrate.

  Further, the frame bodies 10 a and 10 b can increase the breaking strength of the electronic circuit wiring board 1 by using a material having higher rigidity than the electronic circuit wiring board 1.

  The frame bodies 10a and 10b shown in the present embodiment are only examples until they get tired, and any number of parts and any number of components on the electronic circuit wiring board can be provided as long as the frame bodies provided with surrounding walls have adjacent side walls. It may be provided, and the combination is not limited.

  Further, the adjacent side walls 14 a and 14 b and the non-adjacent side walls 13 a and 13 b of the frames 10 a and 10 b also serve as connection terminals for connecting to the ground pattern 2.

  As shown in FIG. 4, a clearance 18 is provided between the partial side walls 11a and 11b.

(About the details of the adjacent side wall)
Next, details of the adjacent side wall will be described.

  As described above, the frames 10a and 10b are arranged in the region A of the ground pattern 2 so that the respective side walls are adjacent to each other. That is, the frames 10a and 10b are adjacent to each other on one of the four side walls.

  The adjacent side walls 14a and 14b are provided with a plurality of openings 12a and 12b, respectively.

  When viewed from the frame body 10a, the partial side wall 11b of the adjacent frame body 10b is inserted into the opening 12a provided in the adjacent side wall 14a, and the frame bodies 10a and 10b are arranged. That is, the opening 12a of the frame body 10a is a gap portion for arranging the partial side wall 11b of the frame body 10b.

  On the other hand, when viewed from the frame body 10b, the partial side wall 11a of the adjacent frame body 10a is inserted into the opening 12b provided in the adjacent side wall 14b, and the frame bodies 10a and 10b are arranged. That is, the opening 12b of the frame body 10b is a gap portion for arranging the partial side wall 11b of the frame body 10a.

  In the present embodiment, as shown in FIG. 5, in the adjacent portions of the frame bodies 10a and 10b, the partial side wall 11a of the frame body 10a and the partial side wall 11b of the frame body 10b are alternately straight on the CC line. They are arranged in a line on the line. Here, as shown in FIG. 4, a clearance 18 is provided between the partial side wall 11a and the partial side wall 11b arranged in a line. Thus, the clearance 18 is provided so that the structure cannot be formed due to interference between the partial side wall 11a and the partial side wall 11b due to displacement of the mounting positions of the frames 10a and 10b, dimensional tolerance, and the like. This is in order to reduce inconveniences and crash damage.

  It should be noted that the electronic circuit wiring board 1 and the frames 10a and 10b are joined in the same manner as other electronic components are mounted on the electronic circuit wiring board using a molten conductive metal, for example, solder paste as described above. It can be carried out.

  As described above, the adjacent side wall 14a included in the frame 10a, the adjacent side wall 14b included in the non-adjacent side wall 13a and the lower side of the non-adjacent side wall 13b, and the ground pattern 2 of the electronic circuit wiring board 1 are formed using solder. Thus, the electronic circuit wiring board 1 is mechanically fixed. The frames 10a and 10b and the electronic circuit wiring board 1 constitute a structure on which electronic components are mounted.

(Action / Effect)
As described above, in the structure M1 according to this embodiment, in the structure M1 in which the electronic circuit wiring board 1 is provided with the two frames 10a and 10b, the frames 10a and 10b are adjacent to the adjacent side walls 14a. 14b, the adjacent side walls 14a, 14b are provided with a plurality of partial side walls 11a, 11b attached to the base body, and the adjacent partial side walls in one frame body are the electronic circuit wiring board 1. The partial side wall of the other frame body is attached to the line connecting the attachment positions attached to each other.

  In other words, the structure M1 is characterized in that the frame bodies 10a and 10b having side walls extending in the direction perpendicular to the electronic circuit wiring board 1 have adjacent side walls 14a and 14b adjacent to each other, The adjacent side walls 14a and 14b are provided with a plurality of openings 12a and 12b, and the partial side walls 11a and 11b other than the openings are alternately arranged. That is, in this embodiment, the partial side walls 11a and 11b of the frame bodies 10a and 10b are not arranged at the positions facing each other in the places where the frame bodies 10a and 10b are adjacent.

  In another expression, it can also be said that in the frame bodies 10a and 10b according to the present embodiment, the partial side walls 11a and 11b are arranged alternately and alternately in the adjacent portions.

  Due to this feature point, the width W3 of the ground pattern 2 may be a width obtained by combining the thickness W1 of one of the frames 10a and 10b and the widths W2a and W2b of the fillet forming regions provided on one side or both sides thereof.

  On the other hand, as shown in FIG. 21, in the prior art, as the width W105 of the ground pattern, the thicknesses W101a and W101b of the two shielding wall portions of the metal frames 110a and 110c, and the mounting area W102 of the connection terminal , And the mounting position displacement clearance W103 between the metal frame 110a (110c) and the connection terminal 111c (111a) and the fillet creation regions W104a and W104b provided on one side or both sides of the metal frames 110a and 110c. Was necessary.

  Therefore, in the structure M1 according to the present embodiment, compared to the prior art shown in FIG. 21, the width W3 of the ground pattern 2, the thickness W101a (or W101b) of one metal frame, and the connection terminal The mounting area W102 and the mounting position deviation clearance W103 need not be included, and the mounting occupation area can be further reduced, so that mounting with a small area becomes possible. As a result, the electronic circuit wiring board 1 itself can be downsized.

  In the present invention, the minimum width W5 to be secured between the electronic components mounted in the regions 3a and 3b is the width W3 of the ground pattern 2 and the ground pattern 2 and each of the regions 3a and 3b. A width combined with insulating clearances W4a and W4b provided between the electronic components is sufficient.

  Further, the printing clearance is examined as follows.

  18 to 21, the connection terminals 111a, 111b, and 111c are connected to the electronic circuit wiring board when the electromagnetic wave shielding components 110a, 110b, and 110c are connected to the electronic circuit wiring board 101. The configuration is horizontal to 101.

  On the other hand, in this embodiment, the partial side walls 11a and 11b as connection terminals are configured to be perpendicular to the electronic circuit wiring board 1.

  Therefore, in the above prior art example, the contact area with respect to the electronic circuit wiring board is increased by at least the area of the connection terminals 111a, 111b, and 111c.

  For this reason, when the electromagnetic wave shielding component is mounted from above after solder printing, the area for spreading the solder is larger in the above-described conventional technology, and it is necessary to ensure a large solder printing clearance.

  On the other hand, in this embodiment, even if the components are mounted after solder printing, the contact area with respect to the electronic circuit wiring board is smaller than that of the above prior art, so that the amount of solder spreading is reduced. Less solder printing clearance required.

  For this reason, in this embodiment, it is also possible to configure so that the width of the grounding pattern 2 including the fillet creation region is sufficient without providing a print clearance.

  Thus, according to the present invention, there is an effect that it is possible to save space in a portion where the frames are adjacent to each other.

  Furthermore, in this embodiment, since the contact area can be made smaller than that of the above prior art, the amount of molten conductive material such as solder necessary for mounting the frames 10a and 10b on the electronic circuit wiring board 1 is used. The cost can be reduced in the frame mounting process.

  In the present embodiment, the frame bodies 10a and 10b shown in FIG. 1 have the same shape. Therefore, for example, it is possible to create the frames 10a and 10b using the same mold. Thus, with respect to the frame body, it is possible to share components, and thus it is possible to suppress an increase in component manufacturing costs.

(Modification)
In addition, the electronic circuit wiring board 1 does not necessarily need to be a board | substrate which mounts a circuit, and a shape is not limited. The electronic circuit wiring board 1 shown in the present embodiment is a plate-like substrate, but it is also possible to use a substrate having a curved surface, for example.

  Further, the ground pattern 2 may be continuously provided so as to surround the areas 3a and 3b as in the above example, and unlike the above examples, the ground pattern 2 may be surrounded around the areas 3a and 3b. It may be provided intermittently. For example, in the adjacent side walls 14a and 14b, the ground pattern 2 may be intermittent between one partial side wall and the other partial side wall. That is, the ground pattern 2 may be intermittent in the clearance 18 on the adjacent side walls 14 a and 14 b.

  Moreover, there is no limitation in the material for producing frame 10a, 10b, For example, a metal material may be used and non-metallic materials, such as a timber and a resin material, may be used, and it selects suitably according to a use. Can do.

  In this embodiment, the frame body is attached to the base body by soldering. However, when the material of the frame body is changed to the material shown in the above-described modified example, a means corresponding to each material is appropriately selected. Then, the frame body may be bonded to the substrate. For example, in the case of a frame such as wood or resin material, the frame may be bonded to the substrate using an adhesive.

  Moreover, in this embodiment, it was the structure which provides a clearance between the partial side wall of one frame, and the partial side wall of the other frame in the adjacent part of a frame. However, the present invention is not limited to this, and a configuration may be adopted in which clearances are not provided and the partial side wall bodies are arranged without gaps. In this case, the frame bodies 30a and 30b are fitted to each other at adjacent portions, whereby the frame bodies 30a and 30b can be mechanically fixed.

[Embodiment 2]
Another embodiment of the present invention is described below with reference to FIG. In the present embodiment, in the structure M1 shown with reference to FIGS. 1 to 5, a frame body that is formed of a material that shields electromagnetic waves or that is covered with the material is used. A structure in which an electromagnetic wave shielding cover for shielding is attached will be described. In addition, the following shows that by covering the upper surface of each frame, electromagnetic waves from the outside can be blocked, and electronic components mounted in each region can be prevented from being affected by electromagnetic waves.

(Configuration example)
First, details of the configuration will be described with reference to FIG. FIG. 6 is an exploded perspective view showing an electromagnetic wave shielding cover (cover, fixing portion) 15 attached to the upper surfaces of the frames 10a and 10b shown in FIGS.

  In the present embodiment, the frame bodies 10a and 10b shown in FIGS. 1 to 5 are made of a conductive material such as SUS (Stainless Used Steel) that can block electromagnetic waves, or a material covered with the material. . For this reason, the frames 10a and 10b function as an electromagnetic wave shielding component having an electromagnetic wave shielding effect (hereinafter referred to as a shielding effect). That is, the partial side wall 11a, the non-adjacent side wall 13a and the top plate 16a included in the adjacent side wall 14a of the frame 10a, and the partial side wall 11b, the non-adjacent side wall 13b and the top plate 16b included in the adjacent side wall 14b of the frame 10b are shielded. Has an effect.

  Here, the opening 12a provided in the adjacent side wall 14a and the opening 12b provided in the adjacent side wall 14b do not have a shielding effect, but the partial side wall 11a provided in the adjacent side wall 14a and the partial side wall 11b provided in the adjacent side wall 14b are provided. The electromagnetic waves coming and going in the lateral direction can be blocked by being alternately arranged in a row in the form of being inserted into the openings of each other.

  In FIG. 6, other structural features are the same as those of the structure M1 described above, and thus the description thereof is omitted.

  The frame bodies 10a and 10b are attached to the ground pattern 2 so as to surround the areas 3a and 3b. In the present embodiment, the frames 10a and 10b are attached by joining the frames 10a and 10b to the ground pattern 2 by using a molten conductive metal such as a solder paste. Thereby, the frames 10a and 10b are conductively connected to the ground pattern 2 provided on the electronic circuit wiring board 1.

  The electromagnetic wave shielding cover 15 is made of a material having a shielding effect, and is attached to the upper surfaces of the frame bodies 10a and 10b so as to cover the open areas of the upper surfaces of the frame bodies 10a and 10b. While 10b is fixed mechanically, the electromagnetic wave shielding cover 15 and the frames 10a and 10b thereby constitute an electromagnetic wave shielding structure having an electromagnetically shielded space inside. Therefore, the electronic component mounted in each area | region inside an electromagnetic wave shielding structure can avoid the influence of electromagnetic waves.

  Thus, in the figure, each of the frame bodies 10a and 10b has a frame shape having an open top plate on the upper surface thereof, and therefore, an electromagnetic wave shielding cover that electromagnetically shields the upper surfaces of the frame bodies 10a and 10b. By mounting 15, an electromagnetic wave shielding structure that obtains a shielding effect on the regions 3 a and 3 b is configured.

  However, the present invention is not limited to this, and each of the frames 10a and 10b may be provided with a top plate that can block the entire upper surface and thereby can be shielded electromagnetically. The shielding cover 15 can be omitted.

  Moreover, the connection method of frame body 10a, 10b and the electromagnetic wave shielding cover 15 is not limited, For example, there exists a fitting method etc. which provided the screwing, protrusion, and the fitting hole.

(Action / Effect)
The feature of the structure according to the present embodiment is that in the structure of the structure M1, the frame bodies 10a and 10b are made of an electromagnetic wave shielding material, and an electromagnetic wave shielding cover 15 is further provided. Therefore, the structure according to the present embodiment has the following functions and effects in addition to the functions and effects of the above embodiment.

[Ease of repair work]
According to the above configuration, the frame bodies 10a and 10b, which are the electromagnetic wave shielding components of the present invention, are provided with the openings 12a and 12b in the adjacent side walls 14a and 14b. Therefore, a space required for performing the soldering process. It is easy to ensure, and the structure has excellent repairability when incomplete soldering occurs.

  For example, when the solder is melted in a reflow furnace or the like and the partial side walls 11a and 11b of the adjacent side walls 14a and 14b are joined to the electronic circuit wiring board 1, the electronic circuit wiring board 1 is heated by the heat when melting the solder, For example, it may be deformed by warping. When the electronic circuit wiring board 1 is deformed, the shape of the lower part of the adjacent side walls 14a, 14b is not matched with the shape of the deformed electronic circuit wiring board 1, and as a result, the partial side walls 11a, 11b, the electronic circuit wiring board 1, There may be a gap between them. And in the part which such a clearance gap produced, soldering will become incomplete.

  In this way, for parts that are incompletely soldered, for example, a repair work is performed in which a heat is applied locally using, for example, a soldering hand, or a new solder is applied to obtain a normal joined state. .

  In general, a component having a shielding effect has an electromagnetic wave shielding effect, and therefore a material that is formed of a material that shields electromagnetic waves or is covered with the material is used. As such a material, a metal material is mainly used. In addition to an electromagnetic wave shielding effect, the metal material has a high thermal conductivity and a high heat dissipation effect.

  Therefore, even if heat is locally applied to a component having such a large heat dissipation effect, the heat is dissipated, and a large amount of heat and time are required to increase the temperature for melting the solder.

  For this reason, in the above-described repairing operation, the molten conductive material that joins the partial side walls 11a and 11b and the ground pattern 2 of the electronic circuit wiring board 1 is deteriorated by applying heat with a solder hand for a long time. There is a risk of damage due to a decrease in bonding reliability, such as inability to maintain sufficient conductive properties and connection strength, and application of unnecessary heat to the electronic components mounted in the periphery. Therefore, improvement in work efficiency of repair work is desired.

  In particular, in the structure of the electromagnetic wave shielding components 110a, 110b, and 110c disclosed in Patent Document 1, the metal material is formed around the opposing portions of the electronic circuit wiring board 101 and the connection terminals 111a, 111b, and 111c of the electromagnetic wave shielding components. It has been developed and the heat dissipation effect is extremely high.

  On the other hand, according to the present invention, the electronic circuit wiring board 1 and the partial side walls 11a and 11b of the frame bodies 10a and 10b are developed with a metal material at a location close to the joint portion as compared with the technique described in Patent Document 1. Accordingly, the heat radiation effect of the electromagnetic wave shielding component when the heat is locally applied by a soldering hand or the like is weakened.

  Therefore, according to the present invention, in the repair work, the solder can be melted with a smaller amount of heat and time than in the technique described in Patent Document 1, so that the work efficiency of the repair work is improved.

  For this reason, it is possible to suppress deterioration of reliability such as conductive characteristics and bonding strength due to deterioration of the conductive melt material and damage of surrounding parts related to repair of the soldered state.

  Further, the frame bodies 10a and 10b have an inverted L-shaped cross section as shown in FIG. 3, and are formed in a frame shape as shown in FIG. Thereby, both sides of the connection terminals 11a and 11b are widely opened, and workability can be improved such that a repair device such as a soldering hand can be applied from both sides.

[About heat dissipation]
It will be described that the structure according to the present embodiment is excellent in heat dissipation of unnecessary heat generated by the electronic component mounted on the electronic circuit wiring board 1.

  The electronic components mounted on the electronic circuit wiring board 1 generate a considerable amount of heat because current flows. Electronic components, particularly semiconductors, can cause malfunctions when the ambient temperature rises, so it is desirable to have a structure that can dissipate heat as much as possible.

  In the structure disclosed in Patent Document 1, the electromagnetic wave shielding parts 110a, 110b, and 110c are covered with the electromagnetic wave shielding cover 120 so that the space on the areas 103a, 103b, and 103c on which the parts that need to shield electromagnetic waves are mounted and the adjacent parts thereof. Air is sealed in the space and air flow is restricted. For this reason, when an electronic component mounted in one of the regions 103a, 103b, and 103c generates heat, heat is radiated to the outside from a part of the electromagnetic wave shielding cover 120 that covers the electromagnetic wave shielding component surrounding the one region. become.

  On the other hand, in the structure according to the present invention, as shown in FIG. 6, in order to obtain a shielding effect for the regions 3a and 3b on which the electronic components on the electronic circuit wiring board 1 are mounted, the frame 10a Although an electromagnetic wave shielding cover is mounted on the upper surface of 10b, a clearance 18 is provided between the partial side walls 11a and 11b. For this reason, the regions 3 a and 3 b are not completely sealed, and air can convect between the regions 3 a and 3 b through the clearance 18. Further, for example, the region in the frame 10a surrounding the region 3a is adjacent not only to the frame 10a but also to the adjacent side wall 11b of 10b at the location where the frames 10a and 10b are adjacent. Therefore, when an electronic component mounted on one of the regions 3a and 3b generates heat, the frames 10a and 10b are not only from a part of the electromagnetic wave shielding cover 15 that covers the frame surrounding the one region. The heat can be radiated to the outside from the entire electromagnetic wave shielding cover 15 that covers both. Thereby, since the heat radiation area becomes large, the structure has superior heat radiation characteristics as compared with the example disclosed in Patent Document 1.

[Electromagnetic wave shielding characteristics]
As described above, according to the configuration of the present embodiment, a clearance 18 that is a slit-shaped opening is provided between the frames 11a and 11b as shown in FIG. If the longest opening length in the clearance 18 is made sufficiently small with respect to the wavelength of the electromagnetic waves to be shielded from each other of the electronic components mounted in the regions 3a and 3b, the electromagnetic wave shielding effect can be maintained. The relationship between the shielding effect, the opening length, and the wavelength of the electromagnetic wave to be shielded is described in FIG.

  As described above, the size of the clearance 18 can be increased depending on the wavelength of the electromagnetic wave to be shielded and the required shielding effect, which can lead to a reduction in the mounting difficulty.

  The longest opening length in the form shown in FIG. 4 is the diagonal length of the clearance 18.

  The electromagnetic wave shielding cover 15 preferably has higher rigidity than the electronic circuit wiring board 1 and preferably has rigidity equal to or higher than that of the frames 10a and 10b. By mounting the electromagnetic wave shielding cover 15 on the upper surfaces of the frame bodies 10a and 10b, the frame bodies 10a and 10b are connected more firmly than when the electromagnetic wave shielding cover 15 is not mounted, and the frame bodies 10a and 10b are individually connected. Moving can be suppressed.

  For this reason, for example, even if stress is applied to the electronic circuit wiring board 1, the stress is prevented from concentrating on the adjacent portions of the frames 10a and 10b, and the adjacent portions of the frames 10a and 10b are damaged by the stress. Reduce.

  Thus, the electromagnetic wave shielding cover 15 has both a function of shielding electromagnetic waves and a function of restricting movement of each frame. Therefore, it is not necessary to prepare individual parts in order to obtain these functions, and it is possible to suppress an increase in the number of parts constituting the structure, and to reduce the cost for manufacturing.

[Embodiment 3]
Another embodiment of the present invention is described below with reference to FIG. In the embodiments shown so far, there are two areas for mounting electronic components. On the other hand, this embodiment demonstrates the case where three or more area | regions are provided in the electronic circuit wiring board 1. FIG. FIG. 7 is a top view showing a configuration example when four frames are adjacent to each other.

  As shown in the figure, the structure M2 according to the present embodiment includes the electronic circuit wiring board 1, the ground pattern 22, the frames 20a, 20b, 20c, and 20d, and an electromagnetic shielding cover (not shown).

  On the surface of the electronic circuit wiring board 1, areas 21a, 21b, 21c, 21d, and 21e for mounting electronic components are provided, and a ground pattern 22 is provided so as to surround them. The frame bodies 20a, 20b, 20c, and 20d are frame-shaped members having side walls around them, and are made of an electromagnetic wave shielding material as described in the above embodiment.

  That is, in this embodiment, five areas are surrounded by four frames. More specifically, the frame bodies 20a, 20b, and 20c are joined to the ground pattern 22 so as to surround the regions 21a, 21b, and 21c, respectively. The frame 20d is attached to the ground pattern 22 so as to surround the two areas 21d and 21e.

  Here, a partition 23 that separates the regions 21d and 21e is provided at the center of the frame 20d, and the inside of the frame 20d is divided into two regions. The partition 23 is also made of an electromagnetic wave shielding material as described in the above embodiment, and thus the inside of the frame 20d is partitioned by the partition 23, so that the electromagnetic waves between the regions 3d and 3e can be shielded. .

  As shown in FIG. 7, when viewed from the upper surface of the electronic circuit wiring board 1, the shapes of the frames 20a, 20b, and 20d are substantially quadrangular. The frame 20c has an L-shape when viewed from the upper surface of the electronic circuit wiring board 1.

  In addition, the frame bodies 20a, 20b, 20c, and 20d are provided with a top plate on the upper surface, but are opened except the outer peripheral portion, and the regions 21a, 21b, 21c, 21d, and 21e are opened. It has become.

  Then, an electromagnetic wave shielding cover (not shown) as already described in the above embodiment is attached so as to cover the upper surfaces of the frames 20a, 20b, 20c, and 20d.

  As described above, the frames 20a, 20b, 20c, and 20d provided on the electronic circuit wiring board 1 and the electromagnetic shielding cover (not shown) go back and forth between the regions 21a, 21b, 21c, 21d, and 21e. The structure M2 that shields the electromagnetic waves to be formed is configured.

  Next, the positional relationship between the frames 20a, 20b, 20c, and 20d will be described.

  As shown in FIG. 7, frame bodies 20a and 20b are adjacent on one side, and adjacent frame bodies 20a and 20b form a rectangle.

  Here, one side of the rectangle formed by the frame body 20a and the frame body 20b is adjacent to one side of the frame body 20c. Further, two sides of the frame body 20c and a part of the two sides of the frame body 20d are adjacent to each other.

  About the structure of the adjacent part between each frame, since it is as above-mentioned, the description is abbreviate | omitted.

(Modification)
In the present embodiment, the number of regions on the electronic circuit wiring board 1 on which the components that need to be shielded against electromagnetic waves are mounted is five. However, the number of regions is not limited to this. Any number is possible as much as possible. In this case, prepare the required number of frames.

  At this time, as described above, it is also possible to provide a partition that can shield electromagnetic waves inside the frame body and to divide the frame into a plurality of regions. By providing the partition in this manner, it is possible to shield electromagnetic waves between the regions with a smaller number of frames than the number of regions. Further, the number of regions and frames, the shape of the regions and frames, and the partitions provided in the frames can be changed as appropriate, and the combinations thereof are not limited.

  Further, the frame bodies 20a, 20b, 20c, and 20d have been described as being made of a conductive material having a shielding effect. However, the present invention is not limited to this, and a material other than the conductive material is used when the shielding effect is not necessary. It is also possible. Further, when the shielding effect is not necessary, the electromagnetic wave shielding cover can be omitted.

[Embodiment 4]
A further embodiment of the present invention will be described below with reference to FIGS. In this embodiment, one frame is provided on each of the two electronic circuit wiring boards, and the two electronic circuit wiring boards provided with the frame are arranged so that the surfaces on which the frames are provided face each other. An example in which the frames provided on each of the electronic circuit wiring boards are arranged adjacent to each other is shown.

  FIG. 8 shows an example of an embodiment according to the present invention. A structure having a structure in which frames are adjacently arranged by overlapping two electronic circuit wiring boards provided with frames. It is a disassembled perspective view shown. FIG. 9 is a perspective view showing a state in which the two frames in FIG. 8 are mounted adjacent to each other on the electronic circuit wiring board. FIG. 10 is a diagram in which the electronic circuit wiring board (second base) 31b is not shown in FIG.

(About structure parts)
The structure M3 according to the present embodiment includes a partial body M3a including an electronic circuit wiring board (first base) 31a, a ground pattern 32a, and a frame (first frame) 40a, and an electronic circuit wiring board (second base). ) 31b, a ground pattern 32b, and a partial body M3b including a frame (second frame) 40b, and the partial body M3a and the partial body M3b are superposed.

  First, the configuration before the partial bodies M3a and M3b are overlaid will be described below. In the present embodiment, for example, the electronic circuit wiring board 31a, the ground pattern 32a, and the frame body 40a, and the electronic circuit wiring board 31b, the ground pattern 32b, and the frame body 40b have the same shape and the same characteristics, respectively. .

  Accordingly, the partial body M3b has a configuration according to the partial body M3a. Therefore, as an example, the electronic circuit wiring board 31a, the ground pattern 32a, and the frame body 40a constituting the partial body M3a will be described below. The description of is omitted.

  In FIG. 8, an electronic circuit wiring board 31a for mounting electronic parts is a substantially rectangular board for mounting necessary electronic parts and the like, and is a so-called printed board. As in the above embodiments, a circuit that realizes a desired function is configured by mounting electronic components and the like on the electronic circuit wiring board 31a. Electronic components are mounted on the electronic circuit wiring board 31a using, for example, SMT.

  Regions 33a and 33c and a ground pattern 32a are provided on the surface of the electronic circuit wiring board 31a, and a frame 40a is mounted on the ground pattern 32a so as to surround the region 33a.

  The regions 33a and 33c provided on the electronic circuit wiring board 31a are regions for mounting electronic components and the like.

  The region 33c is a region surrounded by a frame provided on the other electronic circuit wiring board when the electronic circuit wiring boards 31a and 31b are overlapped.

  Also in the present embodiment, for example, the regions 33a and 33c are illustratively substantially rectangular regions as in the embodiment illustrated with reference to FIGS. In addition, the regions 33a and 33c are exemplarily regions having the same shape.

  Further, the regions 33a and 33c are arranged across the region D1 of the ground pattern 32a.

  The ground pattern 32a is for mounting the frame body 40a having a wall around it on the electronic circuit wiring board 31a, and is provided so as to surround the regions 33a and 33c.

  The frame body 40a is a frame-shaped member having side walls around it. The frame body 40a is attached on the ground pattern 32a so as to surround the area 33a in the electronic circuit wiring board 31a.

  Further, the side surface of the frame body 40a extends in a direction perpendicular to the electronic circuit wiring board 31a, and is constituted by an adjacent side wall (adjacent portion) 44a and a non-adjacent side wall 43a.

  An opening 42a is provided in the adjacent side wall 44a. That is, the adjacent side wall 44a of the frame body 40a includes the opening 42a and the partial side wall (attachment portion) 41a other than the opening 42a.

  The non-adjacent side wall 43a of the frame body 40a is not provided with an opening as provided in the adjacent side wall 44a, and a wall surface continuous over three sides is formed.

  Here, as shown in FIG. 8, a top plate 45a having an opening at the center is provided on the upper surface of the frame body 40a.

  However, the present invention is not limited to this, and the frame body 40a may include a top plate that covers the entire upper surface of the frame body 40a. Further, the shape of the frame body 40a is not limited as long as the frame body 40a has a wall around the frame body 40a, and can be changed according to the application.

  As described above, the description of the partial body M3a also applies to the partial body M3b. In FIG. 8, in the partial body M3a, the frame body 40a, the electronic circuit wiring board 31a, the ground pattern 32a, the regions 33a and 33c, the adjacent side wall 44a, the non-adjacent side wall 43a, the opening 42a, the partial side wall 41a, and the top plate 45a are In the partial body M3b, the frame body 40b, the electronic circuit wiring board 31b, the ground pattern 32b, the regions 33b and 33d, the adjacent side wall 44 (adjacent portion) b, the non-adjacent side wall 43b, the opening portion 42b, and the partial side wall 41 (attachment portion). B) Corresponds to the top plate 45b.

(About structure)
Next, the structure M3 having a structure in which the partial body M3a and the partial body M3b are overlaid will be described.

  As shown in FIGS. 9 and 10, the structure M3 includes a frame 40a of the partial body M3a and a region 33d of the partial body M3b, and a frame 40b of the partial body M3b and a region 33c of the partial body M3a. Are superposed so as to face each other. Accordingly, in the structure M3, the frame 40a of the partial body M3a and the frame 40b of the partial body M3b are arranged adjacent to each other in the regions D1 and D2.

  That is, in the structure M3, the electronic circuit wiring board 31a of the partial body M3a and the electronic circuit wiring board 31b of the partial body M3b face each other, and the frame body 40a of the partial body M3a and the frame body 40b of the partial body M3b are adjacent to each other. It is a structure.

  Thereby, in the adjacent portions of the frame body 40a and the frame body 40b, the partial side wall 41a of the frame body 40a and the partial side wall 41b of the frame body 40b are alternately arranged so as to be aligned in a straight line in the regions D1 and D2. Is done.

  Thus, since the structure M3 is configured to include the frame body 40a and the frame body 40b between the electronic circuit wiring board 31a and the electronic circuit wiring board 31b, the electronic circuit wiring board 31a and the electronic circuit wiring board 31b The interval can be kept constant. In other words, the frame body 40a and the frame body 40b function as spacers that keep the distance between the electronic circuit wiring boards 31a and 31b constant.

  In the present embodiment, the electronic circuit wiring board 31a and the electronic circuit wiring board 31b are configured as separate substrates, but the present invention is not limited thereto. For example, the electronic circuit wiring board 31a and the electronic circuit wiring board 31b can be changed to one flexible substrate that can be bent. In this case, a structure having a structure in which the frames 40a and 40b and the ground patterns 32a and 32b are provided on the flexible substrate, and the flexible substrates are bent so that the frames 40a and 40b are disposed adjacent to each other. Can be obtained.

  In the present embodiment, the frame bodies 40a and 40b and the ground patterns 32a and 32b are provided only on one side of the electronic circuit wiring boards 31a and 31b. However, the present invention is not limited to this, and the above-described frame body is provided on both sides. In addition, a ground pattern may be provided. A plurality of electronic circuit wiring boards provided with a frame and a ground pattern on both sides can be stacked, thereby obtaining a structure having a laminated structure in which electronic circuit wiring boards and frames are alternately arranged. Can do. At this time, the electronic components to be mounted on the electronic circuit wiring board may be mounted on both sides of the electronic circuit wiring board or only on one side, and the design can be arbitrarily changed.

(Action / Effect)
In the structure M3 according to the present embodiment, the electronic circuit wiring board 31a provided with the frame body 40a and the electronic circuit wiring board 31b provided with the frame body 40b are opposed to each other, and the frame body 40a and the frame body 40b are provided. By being arranged adjacent to each other, each frame provided on the electronic circuit wiring boards 31a and 31b includes adjacent side walls 44a and 44b, and the adjacent side walls 44a and 44b are arranged on the electronic circuit wiring boards 31a and 31b. Attachment having partial side walls 41a and 41b attached to the upper grounding pattern, and adjacent partial side walls of the frame provided on one electronic circuit wiring board are respectively attached to the one electronic circuit wiring board The shape is such that the partial side wall of the frame provided on the other electronic circuit wiring board is attached to the line on the other substrate where the lines connecting the positions are opposite. .

  Conventionally, the attachment region of one adjacent part and the attachment region of the other adjacent part are arranged on separate lines, and there is a gap between two lines. On the other hand, in the present invention, the mounting positions on the two electronic circuit wiring boards are aligned on the lines facing each other, so that the gap is eliminated, and as a result, the frame bodies are adjacent to each other. There is an effect that the space can be saved.

  Further, according to the configuration of the present embodiment, since the partial side walls 41a and 41b are arranged alternately on the opposing lines, the occupied volume of the adjacent portions of the frame bodies 40a and 40b is equivalent to one adjacent wall. Just do it.

  More specifically, in the portion where each frame body is adjacent, conventionally, the thickness of two adjacent side walls of each frame body and the clearance between the frame bodies (in particular, the frame bodies 40a and 40b are the electronic circuit wiring board 31a, The structure of the present embodiment requires a region that is combined with the clearance of the fillet formed to increase the connection strength with the electronic circuit wiring board when conductively connected to 31b with solder or the like. Therefore, it is only necessary to prepare a region having a thickness corresponding to one adjacent side wall of the frame. Thereby, an occupation area can be reduced.

(Modification)
In the structure M3, the ground pattern 32a may be provided continuously so as to surround the areas 33a, 33c, or may be provided intermittently so as to surround the areas 33a, 33c. Similarly, in the structure M3, the ground pattern 32b may be provided continuously so as to surround the areas 33b, 33d, or may be provided intermittently so as to surround the areas 33b, 33d. .

  In the structure M3, in the adjacent part of the frame body, the partial side wall 41a and the partial side wall 41b may be arranged without gaps without providing a clearance between the partial side wall 41a and the partial side wall 41b.

  In this case, the frame bodies 40a and 40b are fitted to each other and mechanically fixed at adjacent portions.

  More specifically, since adjacent adjacent side walls 41a and 41b are in contact with each other, movement in the direction in which the adjacent side walls 41a and 41b are arranged is suppressed.

  Further, since the adjacent side wall 41a of the frame 40a is in contact with the top plate 45b provided on the upper surface of the opening 42b of the frame 40b at the portion attached to the ground pattern 32a, the frames 40a and 40b are in contact with each other. The movement in the direction of approaching is suppressed. The same applies to the adjacent side wall 41b of the frame 40b.

  Thereby, even if the force to a specific direction is added, the relative positional relationship between the electronic circuit wiring boards 40a and 40b can be maintained.

[Embodiment 5]
A further embodiment of the present invention will be described below with reference to FIGS. In the present embodiment, a structure M3 ′ in which the frame body included in each partial structure in the structure M3 shown in the above embodiment is configured with a conductive material or the like will be described.

  Details of the configuration will be described below.

  In the structure M3 ′ according to this embodiment, the frame bodies 40a and 40b shown in FIGS. 8 to 10 are made of a conductive material such as SUS that can block electromagnetic waves. For this reason, the frame bodies 40a and 40b function as an electromagnetic wave shielding component having a shielding effect. That is, the adjacent side wall 44a, the non-adjacent side wall 43a and the top plate 45a of the frame body 40a, and the adjacent side wall 44b, the non-adjacent side wall 43b and the top plate 45b of the frame body 40b have a shielding effect.

  Further, a GND layer is provided on the surface layer or the inner layer of the electronic circuit wiring boards 31a and 31b so that the electronic circuit wiring boards 31a and 31b obtain a shielding effect.

  The frame bodies 40a and 40b are attached to the ground patterns 32a and 32b so as to surround the regions 33a and 33b, respectively. As described above, the frames 40a and 40b can be attached using a molten conductive metal such as a solder paste. Thereby, the frame bodies 40a and 40b are joined to the ground patterns 32a and 32b provided on the electronic circuit wiring boards 31a and 31b. Thereby, the frame bodies 40a and 40b are conductively connected to the ground patterns 32a and 32b provided on the electronic circuit wiring board 1.

  In addition, in the region 33a and the region 33d surrounded by the frame body 40a, electronic components and the like that do not need to shield electromagnetic waves from each other are mounted. Here, an electronic component or the like may be mounted only in one of the region 33a and the region 33d. Similarly, in the region 33b and the region 33c surrounded by the frame body 40b, an electronic component or the like that does not need to shield electromagnetic waves from each other may be mounted in each of the region 33b and the region 33c, and any of the region 33b and the region 33c may be mounted. Electronic components or the like may be mounted only on one of them.

  At this time, the frame bodies 40a and 40b may be brought into contact with electromagnetic wave shielding components mounted in the regions 33d and 33c and electronic components intended for conductive connection between the electronic circuit wiring boards.

  The electronic component intended to be conductively connected is, for example, a plate spring-like conductive connector component generally called a “contact spring”, and includes frame bodies 40a and 40b, electronic circuit wiring board 1 and the like. It refers to a component that has a configuration that makes contact with each other.

  In this way, in addition to electrical connection to the ground patterns 32a and 32b by solder, the frame members 40a and 40b are brought into contact with the electronic components intended for conductive connection, so that the electronic components and the electronic circuit wiring board 1 Can be reduced, and the ground characteristics of the frame bodies 40a and 40b can be made better and more stable.

  Each of the frame bodies 40a and 40b is configured so as not to come into contact with electronic components that are mounted on the regions 33d and 33c and are not intended for conductive connection.

  8 to 10, other structural features are the same as those of the structure M3 described above, and thus the description thereof is omitted.

  In the structure M3 ′ thus configured, the electronic circuit wiring boards 31a and 31b and the frame body 40a, and the electronic circuit wiring boards 31a and 31b and the frame body 40b are respectively spaces in which electromagnetic waves from the outside are blocked. Form.

  With the structure of the structure M3 ′, it is possible to realize shielding of electromagnetic waves between the electronic components mounted in the regions 33a and 33d and the electronic components mounted in the regions 33b and 33c.

  Further, a gap may be generated between the partial side wall 41a of the frame body 40a and the partial side wall 41b of the frame body 40b due to dimensional tolerances of parts.

  That is, an opening is formed by the partial side wall 41a of the frame body 40a, the partial side wall 41b of the frame body 40b, and the electronic circuit wiring boards 31a and 31b.

  If the length of the diagonal line of the opening is sufficiently small with respect to the wavelength of the electromagnetic waves to be shielded from each other of the electronic components mounted in the regions 33a, 33b, 33c, and 33d as in the second embodiment, the desired shielding effect is maintained. can do.

(Action / Effect)
As described above, in the structure M3 ′, the structure M3 ′ according to the present embodiment is provided with the electromagnetic wave shielding layer that shields electromagnetic waves on the surface layer or the inner layer of the electronic circuit wiring boards 31a and 31b in the structure M3. Is made of a conductive material or a material whose surface is processed so as to be able to block electromagnetic waves.

  According to the structure M3 ′ according to the present embodiment, in addition to the functions and effects exhibited by the structure M3, the following functions and effects are achieved.

  Moreover, in this embodiment, as shown in FIG. 8, it is set as the structure which provides the top plates 45a and 45b by which the center part except the edge part of the connection part with a side wall was opened on the upper surface of frame 40a, 40b. . Here, the structure M3 ′ has a structure in which the frame bodies 40a and 40b are opposed to each other, and one electronic circuit wiring board is provided on the upper surface of the frame body provided on the other electronic circuit wiring board. And functions as an electromagnetic wave shielding cover that shields electromagnetic waves.

  Therefore, there is no need to separately prepare a member for covering each frame body, such as the electromagnetic wave shielding cover 15 as shown in FIG.

  Due to the structure of the structure M3 ′, it is not necessary to separately prepare an electromagnetic wave shielding cover, and therefore it is possible to suppress an increase in the number of parts, and accordingly, manufacturing costs can be suppressed.

  In addition, by mounting components in the areas 33c and 33d, it is possible to effectively use the space existing on the upper surface of the electronic component mounting locations in the areas 33a and 33b to perform component placement. For this reason, the area | region on an electronic circuit wiring board can be utilized efficiently for components mounting.

  In this embodiment, the top plates 45a and 45b included in the frame bodies 40a and 40b are provided with openings, but the top plates 45a and 45b are provided if no electronic components are mounted in the regions 33c and 33d. It is good also as a structure by which the upper part of area | region 33a, 33b is coat | covered by top plate 45a, 45b, without providing an opening part.

[Embodiment 6]
Another embodiment of the present invention is described below with reference to FIGS. In the present embodiment, in the structure having the frame as shown in each of the above embodiments, a structure in which a mechanism for restricting the movement is provided in a portion where the frame is adjacent so that the frame does not move individually. An example is given for M4. Below, the example which comprises the clip member M4a as a mechanism which restrict | limits movement to the partial structure M4b which has a frame, and comprises the structure M4 is demonstrated.

  FIG. 11 is a shape diagram showing the clip member used in the present embodiment from three directions. (A) shows one side surface of the clip member, and (b) shows the clip member as viewed from above. (C) shows the other side of a clip member.

  FIG. 12 is an enlarged view of an adjacent portion of the frame body according to the structure as shown in each of the embodiments as seen from above.

  FIG. 13 is an enlarged view of the state in which the clip member shown in FIG. 11 is attached to the adjacent portion of the frame body according to each of the embodiments described above, as viewed from the upper surface of the adjacent portion of the frame body. is there.

(Configuration of clip member)
First, the configuration of the clip member M4a will be described with reference to FIG.

  As shown in FIG. 11, the clip member M4a is incorporated in the adjacent portions of the frame bodies 50a and 50b, thereby sandwiching the frame bodies 50a and 50b and thereby fixing the frame bodies 50a and 50b. It is.

  The clip member M4a is shaped like a long and thin flat plate bent into a U shape near its center, and the thickness of the partial side walls (attachment portions) 52a and 52b of the frame bodies 50a and 50b is between them. It can be pinched.

  In the present embodiment, the clip member M4a is illustratively formed of a conductive material such as SUS.

  A plurality of leaf springs 56 and 57 are formed on the flat plate constituting the clip member M4a. For this reason, the clip member M4a can fix the frame bodies 50a and 50b to each other by the elasticity of the leaf spring portions 56 and 57 when incorporated in the adjacent portions of the frame bodies 50a and 50b. Moreover, since the leaf | plate spring parts 56 and 57 are formed with the electroconductive material, when it integrates in the adjacent part of frame 50a, 50b, it serves as a connection part for conducting conductive connection with frame 50a, 50b.

  The clip member M4a preferably has a rigidity equal to or higher than that of the frame bodies 50a and 50b so that the clip member M4a does not easily deform even when stress is applied.

(Structure structure)
Next, a method of configuring the built-in structure M4 in the adjacent portions of the frame bodies 50a and 50b included in the partial structure M4b will be described with reference to FIG.

  As shown in FIG. 12, the partial structure M4b includes an electronic circuit wiring board 1, a ground pattern 2, and frames 50a and 50b.

  The frames 50 a and 50 b are mounted on the ground pattern 2 provided on the electronic circuit wiring board 1. Note that the frames 50a and 50b are illustratively made of a material having a shielding effect as described in the above embodiment.

  Here, the frames 50a and 50b include adjacent side walls 51a and 51b, respectively. Adjacent side walls 51a and 51b include partial side walls 52a and 52b and openings 53a and 53b.

  The feature points of the adjacent side walls 51a and 51b, the partial side walls 52a and 52b, and the openings 53a and 53b are the same as those of the adjacent side walls 14a and 14b, the partial side wall 11a, and the opening 12a shown in FIG. In addition, the features and functions of the top plate (not shown) and the non-adjacent side walls (not shown) of the partial structure M4b are the same as those in each of the above embodiments, and the description thereof is omitted.

  Here, the difference between the structure M1 shown in FIG. 2 and the partial structure M4b will be described as follows. Unlike the structure M1, as shown in FIG. 12, in the partial structure M4b, a fitting insertion opening 55 for incorporating the clip member M4a is provided on the side surface of the adjacent portion of the frames 50a and 50b.

(Incorporation of clip member)
The clip member M4a is incorporated into the adjacent portions of the frame bodies 50a and 50b by being inserted into the insertion opening 55 from one side surface of the adjacent portions of the frame bodies 50a and 50b. As described above, the structure M4 is configured by incorporating the clip member M4a into the partial structure M4b including the frames 50a and 50b mounted on the ground pattern 2 provided on the electronic circuit wiring board 1. .

  As shown in FIG. 13, when the clip member M4a is incorporated into the adjacent portions of the frame bodies 50a and 50b, the leaf spring portion 56 has the three side walls included in the partial side wall 52b due to the elasticity of the spring in the region 3b. The biasing is performed from the side toward the region 3a. Similarly, the leaf spring portion 57 urges the two side walls included in the partial side wall 52a from the region 3a side to the region 3b side by the elasticity of the spring. Thereby, the clip member M4a is conductively connected to the frames 50a and 50b and is connected to the ground pattern 2 via the frames 50a and 50b.

(Action / Effect)
As described above, the structural body M4 according to the present embodiment is obtained by sandwiching the partial side walls 52a and 52b of the adjacent portions with the clip member M4a in the partial structural body M4a.

  With the above configuration, since the frames 50a and 50b are sandwiched and fixed by the clip member M4a, even if stress is applied to the electronic circuit wiring board 1, the frames 50a and 50b, the frames 50a and 50b, It can be suppressed that the partial side walls 52a and 52b provided in the adjacent portions of 50b are individually moved and separated, for example.

  Further, when the clip member M4a is incorporated in the adjacent portions of the frames 50a and 50b, the clip member M4a closes the openings 53a and 53b, so that better electromagnetic shielding characteristics can be obtained.

(Modification)
In the present embodiment, the clip member M4a is inserted into the insertion opening 55 from one side in the side surface direction of the frames 50a, 50b, but is not limited thereto. The clip member M4a may be configured so that the clip member M4a can be assembled from both sides in the side surface direction of the frame bodies 50a and 50b. Depending on the shape of the frame bodies 50a and 50b, the clip member can be incorporated from the middle. is there.

  In the present embodiment, the clip member M4a is connected to the ground pattern 2 via the frames 50a and 50b. However, the connection between the clip member M4a and the ground pattern 2 is not limited to the above example as long as the connection with the same potential as the GND of the electronic circuit wiring board 1 can be made.

  In the above configuration, it is desirable that the clip member M4a has a size that fits in a clearance area between the frame bodies 50a and 50b and the electronic components mounted in the areas 3a and 3b. Thereby, without preparing a space for incorporating the clip member M4a separately, the clearance area between the frames 50a and 50b and the electronic components mounted in the areas 3a and 3b can be effectively used, and the dead space is not widened. .

  In the present embodiment, the clip member M4a is made of a conductive material. However, the present invention is not limited to this, and the clip member M4a may be made of a nonconductive material when there is no need to shield electromagnetic waves. The same applies to the frames 50a and 50b and other members.

  Moreover, in this embodiment, the frame bodies 50a and 50b move separately on the electronic circuit wiring board 1 by pinching | interposing the frame bodies 50a and 50b mounted adjacently on the electronic circuit wiring board 1 with the clip member M4a. Although the structure in which the mechanical restriction is provided has been described, the method is not limited to the above contents. For example, when a cabinet, housing, or other exterior is separately provided, the electronic circuit wiring board and the electromagnetic wave shielding component are strongly sandwiched by the exterior or the like to obtain a single rigid body, thereby obtaining the same effect as described above.

  Note that the clip member M4a according to this embodiment can be applied by providing the insertion opening 55 in the structure disclosed in each of the above embodiments.

[Embodiment 7]
Still another embodiment of the present invention will be described below with reference to FIG. In the present embodiment, a structure in which adjacent side walls are not arranged in a straight line in a portion where two frame bodies are adjacent to a ground pattern provided on an electronic circuit wiring board will be described. And it demonstrates that this structure can obtain effects, such as rigidity with respect to a deformation | transformation, in an electronic circuit wiring board rather than the structure which arrange | positions an adjacent side wall on a straight line.

  FIG. 14 is a top view showing in detail the adjacent portion of the frame provided in the structure according to the present embodiment. As shown in the figure, the structure M6 includes an electronic circuit wiring board 1, a ground pattern 2, and frames 60a and 60b. In the structure M6, the frames 60a and 60b are mounted on the ground pattern 2 provided on the electronic circuit wiring board 1. Note that the frame bodies 60a and 60b are exemplarily made of a material having a shielding effect like the frame bodies 10a and 10b shown in FIG.

  In addition, an opening 66 is provided in the structure M6. The opening 66 is similar in shape to the fitting insertion opening 55 of the structure M5.

  The structure M6 includes an electronic circuit wiring board 1 on which a ground pattern 2 is provided. Two frames 60a and 60b are mounted on the ground pattern. The frame bodies 60a and 60b are adjacent to each other in part, and are provided with adjacent side walls (adjacent parts) 61a and 61b, respectively.

  Further, the adjacent side wall 61a includes partial side walls (attachment portions) 62a to 62e and openings 63a to 63e. The adjacent side wall 61b includes partial side walls (attachment portions) 64a to 64e and openings 65a to 65e.

  Regarding the feature points of the adjacent side walls 61a and 61b, the partial side walls 62a to 62e, 64a to 64e, and the openings 63a to 63e, 65a to 65e, the partial side walls 52a and 52b and the openings 53a and 53b shown in FIG. Except for the difference in the number, it is the same as each of the partial side walls 52a, 52b and the openings 53a, 53b. Note that the features and functions of the top plate (not shown) and the non-adjacent side walls (not shown) of the structure M6 are the same as those in each of the above embodiments, and thus the description thereof is omitted.

(Shape of adjacent part)
As shown in FIG. 14, the partial side walls 62a and 62b of the adjacent side wall 61a are arranged side by side on one straight line G1-G1 so as to be inserted into the openings 65a and 65b of the adjacent side wall 61b. On the other hand, in the figure, the partial side walls 64a and 64b of the adjacent side wall 61b are arranged side by side on one straight line G1-G1 so as to be inserted into the openings 63a and 63b of the adjacent side wall 61a. Thereby, the partial side walls 62a and 62b and the partial side walls 64a and 64b of the adjacent side walls 61a and 61b are arranged in a line in the order of the partial side wall 62a, the partial side wall 64a, the partial side wall 62b, and the partial side wall 64b on the straight line G1-G1, respectively. Placed in.

  Further, as shown in FIG. 14, the partial side walls 62d and 62e of the adjacent side wall 61a are arranged side by side on one straight line G3-G3 so as to be inserted into the openings 65d and 65e of the adjacent side wall 61b. Yes. On the other hand, in the figure, the partial side walls 64d and 64e of the adjacent side wall 61b are arranged side by side on one straight line G3-G3 so as to be inserted into the openings 63d and 63e of the adjacent side wall 61a. Thereby, the partial side walls 62d and 62e and the partial side walls 64d and 64e of the adjacent side walls 61a and 61b are arranged in a line in the order of the partial side wall 62d, the partial side wall 64d, the partial side wall 62e, and the partial side wall 64e on the straight line G3-G3. Placed in.

  As shown in FIG. 14, the partial side wall 62 c of the adjacent side wall 61 a and the partial side wall 64 c of the adjacent side wall 61 b are inserted into the other openings, whereby the partial side wall of the adjacent side wall 61 a. 62c and the partial side wall 64c of the adjacent side wall 61b are arranged side by side on one straight line G2-G2.

  The straight line G2-G2 formed by the partial side wall 62c of the adjacent side wall 61a and the partial side wall 64c of the adjacent side wall 61b is closer to the region 3a than the straight line G1-G1 formed by the partial side walls 62a, 64a, 62b and 64b. It is bent.

  On the other hand, the straight line G2-G2 is bent toward the region 3b with respect to the straight line G3-G3 formed by the partial side walls 64e, 62e, 64d, and 62d.

  Thus, the partial side walls 62a to 62e and 64a to 64e are not arranged in a straight line, and are bent between the partial side wall 64b and the partial side wall 62c and between the partial side wall 64c and the partial side wall 62d. Are arranged.

(Action / Effect)
In the structure M6 shown in the present embodiment, although the partial side walls are alternately arranged in adjacent portions of the two frames, they are not arranged on a straight line.

  Before describing the effect of not arranging the partial side walls in a straight line in the adjacent portions of the two frame bodies, the reinforcing effect of the base when a reinforcing plate is provided on the base will be described.

[Reinforcing effect]
The relationship between the reinforcing plate provided on the base and the reinforcing effect will be described with reference to FIG. FIG. 15 is a schematic diagram for explaining a reinforcing effect when a reinforcing plate is provided on a base. FIG. 15A is a front view showing one side surface of a base body provided with a reinforcing plate, and FIG. 15B is a top view showing the base body provided with a reinforcing plate from above.

  2A is a front view of the base body 81 as viewed in the direction of the arrow K2 in FIG. 2B, and FIG. 2B is a top view of the base body 81. FIG.

  Here, the case where the base plate 81 is not provided with the reinforcing plate 80 as shown in FIG. 15 will be described. In this case, the rigidity of the base body 81 against the deformation in the direction of the arrow K3 shown in FIG. (B) It becomes a weak state compared with the rigidity with respect to the deformation | transformation to the direction of the arrow K1 and the arrow K2.

  Therefore, as shown in FIGS. 15A and 15B, when the plate-like reinforcing plate 80 is provided so as to extend in the vertical direction with respect to the base 81 in the base 81, generally, The following reinforcing effects can be obtained. The rigidity of the reinforcing plate 80 is assumed to be stronger than the rigidity of the base body 81.

  First, by providing the reinforcing plate 80, a reinforcing effect can be obtained against deformation caused by a force that bends about a straight line intersecting one side surface R1 and the other side surface R2 of the reinforcing plate 80 as an axis. .

  In particular, since the rigidity of the reinforcing plate 80 is stronger than the rigidity of the base body 81, the rigidity against the deformation in the arrow K3 direction is strengthened compared to the deformation in the arrow K1 direction.

  For example, since the straight lines L1 to L3 shown in FIG. 15B intersect the side surfaces R1 and R2 of the reinforcing plate 80, providing the reinforcing plate 80 prevents bending with respect to the straight lines L1 to L3. Stiffness is improved.

  On the other hand, since the straight lines L4 to L6 shown in FIG. 15B do not intersect the side surfaces R1 and R2 of the reinforcing plate 80, the bending effect about the straight lines L4 to L6 has a great reinforcing effect. I can't.

  Particularly for bending with the straight line L4 as an axis, the reinforcing plate 80 is plate-shaped and does not have much thickness in the direction of the arrow K1, so that the deformation force due to bending is distributed near the side surface R1 and the side surface R2 of the reinforcing plate 80. . As a result, the base 81 is likely to be deformed at the connection portion between the reinforcing plate 80 and the base 81.

  Hereinafter, in this way, a straight line that does not intersect with the reinforcing plate 80 itself and a line that intersects with the reinforcing plate 80, but a straight line that does not intersect with the side surface R1 and the side surface R2 of the reinforcing plate 80 are collectively collected and do not simply intersect with the reinforcing plate 80. This is called a straight line.

  Also, in general, the reinforcement with the reinforcement plate becomes weaker as the distance from the reinforcement plate increases, so that the reinforcement effect is not limited to that with a single reinforcement plate, and a plurality of reinforcement plates are provided for reinforcement. Is desirable.

  Specifically, it is preferable to provide a reinforcing plate so as to sandwich both sides of the region to be reinforced. Furthermore, it is more preferable that the reinforcing plate is a frame that surrounds the four sides of the region to be reinforced. Thereby, in the area | region enclosed by the reinforcement board of the frame, the distance from a reinforcement board can be made more uniform, and the location where reinforcement is weak can be reduced.

[Reinforcing effect by frame]
Subsequently, referring to FIGS. 2, 4, and 12 again, the reinforcing effect of the frame body will be examined.

  According to FIG. 2, it can be said that the regions 3a and 3b to be reinforced are surrounded on the four sides by the frames 10a and 10b as reinforcing plates, and a preferable reinforcing effect is obtained.

  Here, the non-adjacent side walls 13a and 13b and the partial side walls 11a and 11b of the frames 10a and 10b contribute to the reinforcing effect. That is, for example, in FIG. 4, since the partial side walls 11 a and 11 b are not disposed in the clearance 18 portion, the clearance 18 portion has a reinforcing effect against bending with a straight line passing through the clearance 18 as an axis. Does not contribute.

  However, referring to FIG. 2, even a straight line passing through the clearance 18 intersects with the non-adjacent side walls 13 a and 13 b on the extended line of the straight line. For this reason, the reinforcement effect can be substantially obtained by the existence of the non-adjacent side walls 13a and 13b even with respect to the bending with the straight line as an axis.

  On the other hand, in the partial structure M4b shown in FIG. 12, since the insertion opening 55 is provided, there is a portion where the reinforcing effect is weak in the vicinity of the portion where the clip member M4a is inserted. Specifically, the straight line EE direction in which the clip member M4a is inserted is a direction that does not intersect the partial side walls 52a and 52b as the reinforcing plates. For this reason, the reinforcing effect is weak in the straight line EE direction.

  For this reason, the straight line EE direction corresponds to a portion where the reinforcing effect is relatively weaker than the direction intersecting the partial side walls 52a and 52b. That is, the straight line EE direction in FIG. 12 corresponds to the straight line L4 direction in FIG.

  It should be noted that a certain degree of reinforcement effect can be expected even in the direction not intersecting with the partial side walls 52a and 52b as the reinforcing plates due to the presence of the frames 50a and 50b. Regarding the strength in such a direction, the force for maintaining the L-shaped shape of the tops of the frames 50a and 50b, the strength against bending of the frames 50a and 50b, the frames 50a and 50b, and the electronic circuit It depends on the connection strength with the wiring board 1.

  When a force that bends about the straight line EE direction shown in FIG. 12 is applied, the partial side wall 51a is pulled along with the frame 50a in the direction of the region 3a, and the partial side wall 51b is in the direction of the region 3b. Then, the frame 50b is pulled together.

  Thereby, the frame bodies 50a and 50b peel from the attachment part of the grounding pattern 2, or the frame bodies 50a and 50b deform | transform. Alternatively, the electronic circuit wiring board 1 may be broken around the straight line EE.

  The peeling of the frames 50a and 50b will be described more specifically as follows. As described above, on the ground pattern 2, the partial side wall 51 a and the partial side wall 51 b are pulled in opposite directions on both sides of the clearance portion 18. For this reason, the shorter the distance between the partial side wall 51a and the partial side wall 51b, the more easily the frame bodies 50a and 50b are peeled off from the attachment portion of the ground pattern 2.

  In addition, specific examples of the deformation of the frame bodies 50a and 50b include a case where the L-shaped portion of the top plate is deformed and extended, or the partial side walls 51a and 51b are bent.

[Effects due to partial sidewalls not being aligned]
Next, an effect obtained by not arranging the partial side walls in a straight line in adjacent portions of the two frames will be described.

  First, as described above, in the adjacent portions of the two frames, when the partial side walls are arranged in a straight line, the reinforcing effect is not obtained for the bending with the straight line as an axis. However, in a region surrounded by the frame body, a reinforcing effect is obtained so as to obtain rigidity with respect to bending about the respective straight lines in adjacent portions of the two frame bodies.

  For example, since the adjacent portion is bent between the partial side wall 64b and the partial side wall 62c, the straight line G1-G1 intersects with the non-adjacent side wall as the reinforcing plate at the location indicated by the symbol H. For this reason, even when a force that bends about the straight line G1-G1 is applied, a reinforcing effect can be obtained. Since the straight line G3-G3 is symmetrical with the straight line G1-G1, the same reinforcing effect can be obtained.

  Further, although the straight line G2-G2 is also abbreviated in FIG. 14, the straight line G2-G2 intersects with a non-adjacent side wall as a reinforcing plate on the straight line, so that the straight line G2-G2 is bent around the axis. Even when force is applied, a reinforcing effect can be obtained in the same manner.

  In this way, even when the opening 66 is provided in the structure M6, unlike the structure M5, the straight line extending in the opening direction of the opening intersects the non-adjacent side wall as the reinforcing plate. Therefore, a reinforcing effect can be obtained.

  However, the structure is not limited to this, and the structure M6 may have a structure in which the opening 66 is not provided. In this case, a part of the frame bodies 60a and 60b intersects with a straight line extending in the opening direction of the opening, so that the reinforcing effect due to the presence of a part of the frame bodies 60a and 60b can be obtained to some extent. it can.

  If the strength of the connection between the electronic circuit wiring board 1 and the frame bodies 60a and 60b is greater than the rigidity against bending of the frame bodies 60a and 60b, the following effect is further obtained.

  First, regarding the frame body 60b, when a force is applied to the electronic circuit wiring board 1 so as to bend about the straight line G1-G1, the partial side wall 64b aligned on the straight line G1-G1 is in the direction of the arrow J1. It will be pulled. On the other hand, the partial side walls 64c aligned on the straight line G2-G2 are pulled in the direction of the arrow J2. Here, if the force pulling the partial side wall 64b in the direction of the arrow J1 is f1, and the angle formed by the straight line G2-G2 and the straight line G1-G1 is the angle θ, the force f2 pulling the partial side wall 64c is f1. cos θ times, which is smaller than f1.

  That is, in the adjacent portions of the two frames, the partial side walls are not arranged in a straight line, thereby reducing the force applied to the bent portion when a force that bends the electronic circuit wiring board 1 is applied. Can do.

  As a result, the rigidity against a bending force can be improved.

  Moreover, the length of an adjacent part can be made longer than the case where it arrange | positions on a straight line. Rigidity against stress that causes the electronic circuit wiring board 1 to warp can be obtained by the length of the adjacent portion.

  For this reason, even if the stress which causes the electronic circuit wiring board 1 to warp is applied to the adjacent portions of the two frames, the stress can be dispersed in the adjacent portions.

  In addition, it is possible to prevent stress from being concentrated on specific portions of the side walls of each part, and as a result, the electronic circuit wiring board 1 and the electronic components mounted on the electronic circuit wiring board 1 can be damaged. Can be reduced.

  Thus, the arrangement of the partial side walls may be an arrangement on a bent line. The arrangement of the partial side walls can be changed as appropriate according to the shape of the regions 3a and 3b, for example. For this reason, structure M6 has the effect that the freedom degree concerning the design of arrangement of the partial side wall in the adjacent part of two frames can be raised.

  Furthermore, since the arrangement of the partial side walls may be bent in this way, the degree of freedom in designing the regions 3a and 3b surrounded by the frame bodies 60a and 60b is improved.

[Embodiment 8]
Still another embodiment of the present invention will be described below with reference to FIGS. 16 and 17. In the present embodiment, a structure M7 having a structure in which plate-like conductive connection terminals are provided on two adjacent frames mounted on a ground pattern provided on an electronic circuit wiring board will be described.

  FIG. 16 is a top view in which the entire adjacent portions of two frames included in the structure according to the present embodiment are extracted. 17 is a cross-sectional view taken along line FF shown in FIG.

  The structure M7 includes the electronic circuit wiring board 1 provided with the ground pattern 2. Two frames 70a and 70b are mounted on the ground pattern. The frame bodies 70a and 70b are adjacent to each other in part, and the adjacent parts include adjacent side walls (adjacent parts) 71a and 71b, respectively. In the present embodiment, each configuration included in the frames 70a and 70b is configured by a conductive material.

  The adjacent side walls 71a and 71b include partial side walls (mounting portions) 72a and 72b, openings 73a and 73b, and conductive connection terminals (conductive contact portions) 74a and 74b.

  Since the adjacent side walls 71a and 71b, the partial side walls 72a and 72b, and the openings 73a and 73b are the same as those described in the above embodiments, the description thereof is omitted.

  The conductive connection terminals 74a and 74b are plate-like members provided between the adjacent side walls 71a and 71b. As shown in FIG. 17, the conductive connection terminals 74a and 74b are bent obliquely outward. ing.

  In addition, since the conductive connection terminals 74a and 74b are made of a conductive material, the frames 70a and 70b are conductively connected to conductive connection parts such as circuits arranged on the upper surfaces of the frames 70a and 70b. Can do.

  For example, when the electromagnetic wave shielding cover 15 shown in FIG. 6 is mounted on the upper portions of the frames 70a and 70b, the electromagnetic wave shielding cover 15 can be conductively connected.

  Further, for example, in the structure M3 shown with reference to FIG. 8 and the like, it can be conductively connected to the ground pattern 32a or 32b of the other electronic circuit wiring board to be overlaid.

  The conductive connection terminals 74a and 74b are urged from the upper surface to be connected when the electromagnetic wave shielding cover 15 as described above is mounted or when the other electronic circuit wiring board is overlapped. 74a and 74b function as leaf springs, and a good connection can be obtained.

  As a result, the structure M7 according to the present embodiment has better electromagnetic wave shielding characteristics.

  The conductive connection terminals 74a and 74b can be created as follows. For example, as a method of providing the opening portions 73a and 73b in the adjacent side walls 71a and 71b, it is conceivable to provide a cut in the continuous plate-like adjacent side walls 71a and 71b.

  When this method is used, it is possible to use the method to create the conductive connection terminals 74a and 74b, instead of removing all the wall surfaces corresponding to the portions where the openings are to be provided. That is, the conductive connection terminals 74a and 74b can be created by removing a part of the wall surface corresponding to the portion where the opening is to be provided and causing the remainder to move obliquely upward.

[Musubi]
The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

  The present invention can be used for reducing the size of the circuit board because the space for arranging the frame on the circuit board can be reduced.

1 Electronic circuit board (base)
2 Grounding pattern 3a, 3b Area 10a, 10b Frame 11a, 11b Partial side wall (mounting part, partition plate)
12a, 12b Opening (gap)
13a, 13b Non-adjacent side wall 14a, 14b Adjacent side wall (adjacent part)
15 Electromagnetic wave shielding cover (cover, fixed part)
16a, 16b Top plate 18 Clearance 20a, 20b, 20c, 20d Frame 21a, 21b, 21c, 21d Area 22 Ground pattern 23 Partition 31a, 31b Electronic circuit wiring board (first base, second base)
32a, 32b Grounding pattern 33a-33b Region 40a, 40b Frame (first frame, second frame)
41a, 41b Partial side wall (mounting part)
42a, 42b Opening 43a, 43b Non-adjacent side wall 44a, 44b Adjacent side wall (adjacent part)
45a, 45b Top plate 50a, 50b Frame 51a, 51b Adjacent side wall (adjacent part)
52a, 52b Partial side wall (mounting part)
53a, 53b Opening 55 Insertion opening 56, 57 Leaf spring 60a, 60b Frame 61a, 61b Adjacent side wall (adjacent part)
62a-62e Partial side wall (mounting part)
63a-63e opening part 64a-64e partial side wall (attachment part)
65a-65e Opening part 70a, 70b Frame 71a, 71b Adjacent side wall (adjacent part)
72a, 72b Partial side wall (mounting part)
73a, 73b Openings 74a, 74b Conductive connection terminals (conductive contact portions)
M1, M2, M3, M3 ′, M4, M6, M7 Structure M3a Partial M3b Partial M4a Clip Member M4b Partial Structure

Claims (16)

A structure in which two frames are provided on a base body,
The two frames have adjacent portions adjacent to each other,
The adjacent part is
A plurality of attachment portions attached to the base body, and
A structure characterized in that a mounting portion in the other frame is attached to a line connecting adjacent mounting portions in one frame to the mounting positions to be attached to the base body. The mounting portion is a partition plate that partitions the inside and outside of the frame,
The adjacent partition plates in the one frame body are spaced apart to form a gap,
The structure according to claim 1, wherein the partition plate in the other frame is arranged in the gap.   3. The structure according to claim 2, wherein the partition plate provided on the one of the frame bodies and the partition plate provided on the other of the frame bodies are arranged with a space therebetween. .   The structure according to claim 3, wherein the frame is a conductor, and the interval is defined based on a wavelength of an electromagnetic wave to be shielded.   The structure according to claim 2, wherein the partition plate provided on the one of the frames and the partition plate provided on the other of the frames are arranged without a gap. A cover for covering the two frames is provided,
The structure according to any one of claims 1 to 5, wherein the base body, the frame bodies, and the cover are formed of a material that shields electromagnetic waves or are covered with the material.   The structure according to claim 6, wherein the cover includes a fixing portion that fixes the two frames. Each of the frames includes a top plate that closes the upper part,
The structure according to any one of claims 1 to 5, wherein the base body and the frame bodies are formed of a material that shields electromagnetic waves or are covered with the material. The first base body provided with the first frame body and the second base body provided with the second frame body face each other, and the first frame body and the second frame body are disposed adjacent to each other, Each frame provided on the two bases includes an adjacent portion adjacent to each other,
Each of the above adjacent parts
A plurality of attachment portions attached to each of the substrates, and
An attachment portion in a frame provided on the other base on a line in the other base, where lines connecting the mounting positions of the adjacent bases in the frame provided on one base face each other. A structure characterized by having a shape to which can be attached.   The structure according to claim 9, wherein the base body and the frame bodies are formed of a material that shields electromagnetic waves or are covered with the material.   The structure according to any one of claims 1 to 10, further comprising a clip member that holds the mounting portion between the two frame bodies.   The clip member that holds the mounting portion between the two frame bodies, the clip member being formed of a material that shields electromagnetic waves or covered with the material. The structure according to any one of 8, 8 and 10.   13. The clip member according to claim 11, wherein the clip member has higher rigidity than the base body, and has rigidity equal to or higher than each frame body. Structure. There are three or more attachment parts provided in the adjacent part in the one frame body,
A line connecting the attachment position of a certain attachment portion and the attachment position of one attachment portion adjacent to the attachment portion is the line between the attachment position of the certain attachment portion and the other attachment portion adjacent to the attachment portion. The structure according to any one of claims 1 to 10, wherein the structure is bent with respect to a line connecting the mounting position.   The structure according to any one of claims 1 to 14, wherein the two frame bodies have the same shape.   16. The structure according to any one of 1 to 15, wherein in each of the adjacent portions, a conductive contact portion is provided on an upper portion of each frame.

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