KR101737234B1

KR101737234B1 - Apparatus For Shielding The Electromagnetic Interference Of Wireless Communication Device

Info

Publication number: KR101737234B1
Application number: KR1020150170020A
Authority: KR
Inventors: 권덕식; 이병진; 김학수
Original assignee: 권덕식; 이병진; 김학수
Priority date: 2015-12-01
Filing date: 2015-12-01
Publication date: 2017-05-17

Abstract

Disclosed is an electromagnetic wave shielding device of a wireless communication device. The disclosed electromagnetic wave shielding device comprises: a housing in the form of an enclosure; a circuit board on which a plurality of SMD shield clips are formed in a predetermined pattern when mounted on the bottom of the housing; a conductive shielding shield configured in a thin film form, and fitted into the plurality of SMD shield clips to block electromagnetic interference between circuits on the circuit board; and a cover which closes an opening of the housing while the circuit board and the conductive shielding shield are embedded therein.

Description

TECHNICAL FIELD [0001] The present invention relates to an electromagnetic wave shielding device for a wireless communication device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic wave shielding apparatus of a wireless communication apparatus, and more particularly, to an electromagnetic wave shielding apparatus of a wireless communication apparatus that is built in a housing (also referred to as a housing) of a wireless communication repeater and a wireless communication module, It is possible to shield the electromagnetic waves generated in the inside of the wireless communication device from being radiated to the outside of the housing and to shield the electromagnetic waves flowing from the outside as well as to shield the electromagnetic waves generated between the housing and the adjacent circuits of the module internal circuit board, To an electromagnetic shielding device of a wireless communication device that provides an independent shielding device for minimizing the influence on other circuits.

In general, a wireless communication repeater is used to expand the coverage area and resolve the shadow area between the base station and the terminal. At this time, the signal of the other service provider is filtered and removed so as to receive or reject the signal of another service provider, do. It is used to extend the cell radius of use and base stations to resolve radio shadow areas that can not be serviced by buildings or features, such as in homes, offices, and underground buildings.

Such a repeater is classified into an RF repeater, an optical repeater, a microwave repeater, and a wave-length repeater according to a signal transmission method between a base station and a repeater, and is classified into a domestic repeater, an outdoor repeater, an in-building repeater, , High-power repeater, medium-power repeater, and small-power repeater depending on the repeater output.

In addition, the repeater typically includes a high-power amplifier module for amplifying a signal inside a housing forming an external shape, a feedback cancellation module for filtering a signal and eliminating interference of electromagnetic waves, , A duplexer module for separating signals of the transmission frequency band and the reception frequency band, an RF transceiver module for converting the RF signal and the IF signal to each other, an RF transceiver module for converting an electric signal into an optical signal, A fiber optic tranceiver for converting a signal into a signal, a power supply module (SMPS) for supplying power, and a digital signal processing device.

An electromagnetic wave shielding apparatus of a wireless communication apparatus such as a repeater is provided with a circuit board on which a plurality of mounting holes are formed in a specific pattern and a circuit board on which an edge of the circuit board and a mounting hole A plurality of conductive shielding shields mounted to connect and disconnect the space between the shielding walls of the housing to shield electromagnetic waves between adjacent circuits of the circuit board, And a cover that closes the upper surface opening with the circuit board and the shielding shield embedded therein.

More specifically, FIG. 1 is an exploded view schematically illustrating an electromagnetic wave shielding apparatus of a conventional radio communication apparatus, which includes a high output amplifier, a duplexer for separating signals of a transmission frequency band and a reception frequency band, And an IF signal, a photo-conversion module for converting an electric signal into an optical signal, a digital signal processing device, etc. This is an electromagnetic shielding device for a product which is used for protecting an internal system from heat insulation and electromagnetic interference A circuit board 200 on which a plurality of mounting holes 210 are formed in a specific pattern to be mounted in the housing 100 and an adjacent circuit on the circuit board 200 are shielded by electromagnetic waves A shielding wall 110 is integrally formed inside the housing 100 so as to be connected to the circuit board 200, And a cover 400 to which a plurality of conductive shielding shields 300 are mounted and which closes an upper opening of the housing 100 with the circuit board 200 and the shielding shield 300 embedded therein .

The housing 100 and the cover 400 shield the electromagnetic waves from the outside of the wireless communication device and provide a circuit connection between the integrated shielding wall 110 of the housing 100 and the circuit board 200. [ A plurality of conductive shielding shields 300 for each of the circuit parts inside the wireless communication device are separated into independent spaces to form an airtight space that does not affect electromagnetic waves or frequencies and other circuits, Thereby preventing signal distortion or transmission loss due to interference.

In this electromagnetic shielding apparatus, the circuit board 200 in which a plurality of mounting holes 210 are formed in a specific pattern is formed in the shielding wall 110 of the housing 100 and the conductive shielding Since the shield 300 must be applied for inter-circuit shielding where interference is generated, the circuit board 200 is fabricated by machining to form a plurality of mounting holes 210 in a specific pattern for the shielding wall and the shielding shields 110 and 300 .

In addition, the housing 100 may be formed by machining a portion of the metal body excluding the integral shielding wall 110 to a MCT (machining center) process, etc., in order to form an integrated shielding wall 110 for shielding inter- A housing having an integral shielding wall is fabricated by die-casting, which is a method of manufacturing a casting-type housing using a die mold, and is then cut The time required for machining is shortened.

In addition, the conductive shielding shield 300 is formed by mounting a plurality of conductive shielding shields 300 on the portion where the integrated shielding wall 110 is not formed for inter-circuit connection on the circuit board 200 and by bolt assembly .

2 is a schematic view of an electromagnetic wave shielding apparatus of a conventional radio communication apparatus. In FIG. 1, a plurality of mounting holes 210 are formed in a specific pattern on a housing 100 having a shielding wall 110 integrally formed thereon The circuit board 200 is mounted and the integrated shielding wall 110 and the conductive shielding shield 300 are fixedly mounted by bolt assembly for shielding between circuits in which the interference occurs, The electromagnetic shielding apparatus is constructed by covering the cover 400 which is closed in a state where the substrate 200 and the shielding shield 300 are embedded.

1, the integrated shielding wall 110 or the conductive shielding shield 300 and the housing 100 are formed as separate parts, so that the electromagnetic shielding apparatus of the conventional radio communication apparatus can be constructed of bolts The workability is significantly lowered, and the conductive shielding shield 300 and the shielding wall 110 are added, resulting in a high production cost.

Also, due to the process of cutting a large part of the inner space of the metal of the housing 100 except for the integrated shielding wall 110 by machining the MCT (machining center) in order to form the shielding wall 110 integrally with the housing 100 The housing 100, which is required to be mass-produced in order to compensate for the disadvantages, is a method of manufacturing a casting-type housing by a mold frame Die-casting process is mainly used, but it takes a lot of time and cost to manufacture a mold, and the cross-section of the housing 100 cast by the mold frame is not clean, so that the surface has to be used after post-processing.

Korea Public Utility Model Publication No. 20-2009-0010137 (2009.10.07) Korean Patent Publication No. 10-2004-0060260 (Jul. 2004) Korean Patent Publication No. 10-1040078 (June, 2011) Korean Patent Publication No. 10-1326601 (November 31, 2013)

Disclosure of Invention Technical Problem [8] The present invention has been made to solve the above-mentioned problems of the prior art, and it is an object of the present invention to provide a radio communication apparatus, In order to prevent the interference between the internal circuit and the method that can be efficiently manufactured, the conductive shielding wall which minimizes the production cost is formed by the SMD shield clip The present invention has been made after trying to develop various wireless communication electronic component transmitting and receiving devices that can maximize the shielding effect as well as improve workability upon assembly.

Accordingly, it is an object of the present invention to provide a method for reducing manufacturing cost by simplifying a manufacturing process by cutting a continuous housing formed of an extruding mold into a desired length and eliminating a post-processing process on the surface during housing processing, It is an object of the present invention to provide an electromagnetic wave shielding device of a wireless communication device that can reduce costs by reducing the cost of material and work efficiency by assembling.

It is another object of the present invention to provide an electromagnetic wave shielding apparatus for a radio communication apparatus that improves the cost, appearance, weight, and the like of a radio communication apparatus that can maximize the electromagnetic wave shielding performance.

According to an aspect of the present invention, there is provided an electromagnetic wave shielding apparatus comprising: a housing; A circuit board on which a plurality of SMD shield clips are formed in a predetermined pattern when mounted on a bottom surface of the housing; A conductive shielding shield in the form of a thin film that is fitted to the plurality of SMD shielding clips to block electromagnetic interference between circuits on the circuit board; And a cover that closes the opening of the housing in a state where the circuit board and the conductive shielding shield are enclosed.

The housing has an extruded upper portion < RTI ID = 0.0 > open "

" or "

&Quot;, and a front plate and a rear plate coupled to the front and rear surfaces of the housing main body.

The conductive shielding shield may be formed by cutting and bending a conductive shielding shield member made of a thin film.

The upper end and the side end of the conductive shielding shield may be formed with upper end protrusions and side protrusions that minimize a gap between the conductive shielding shield and the cover, and a gap between the conductive shielding shield and the side wall of the housing.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to provide an SMD shield clip mounted on a circuit board so as to minimize radio wave interference between circuits on a circuit board and radio waves induced outside the housing, And a top projection and a side projection are formed to maintain elasticity so as to minimize the gap between the housing and the cover, thereby shielding the interference between the internal circuits and the electromagnetic waves generated outside. In this case, it is possible to cut with a shielding structure that is desired by the user by using a thin film-type conductive shielding shield, so there is no need to form a fixed shielding wall between internal circuits in the manufacture of a housing, and a long processing time and cost , It is possible to fabricate an efficient housing because it is made by extruding mold, which is not die-casting, but has a long sectional area, is made by cutting only length, and the surface is clean after post-processing. Due to the feature, the area on the circuit board can be more efficiently used, and the cost and size of the entire structure can be reduced. In addition, since the conductive shielding shield is inserted into the SMD shield clip mounted on the circuit board, it is very effective to improve the workability compared to the mounting structure through the operation of the conventional bolt.

In other words, the electromagnetic wave shielding apparatus of the wireless communication apparatus of the present invention has a simple structure that is manufactured by an aluminum extrusion die to shield electromagnetic waves radiated to the outside of the apparatus and does not require post-processing on the surface after processing, A circuit board on which a conventional mounting hole is not required in a specific pattern to be mounted on the circuit board; a lightweight simplified conductive shielding shield which shields interference between circuits of the circuit board; an SMD shield clip for inserting the conductive shielding shield into the circuit board; And a cover that closes the opening of the housing while maintaining the state of the conductive shielding shield that shields interference between the housing and the circuit.

Accordingly, it is an object of the present invention to simplify the assembling structure of the circuit board and the housing to improve the manufacturing cost and workability of the housing and to reduce the weight of the product and improve the shielding performance due to the lightweight and simplified conductive shielding shield including the housing .

In addition, the conductive shielding shield of the present invention has an upper protrusion and a side protrusion which minimize the gap between the housing and the cover, thereby maximizing the shielding performance.

1 is an exploded view schematically showing an example of an electromagnetic wave shielding apparatus of a radio communication apparatus according to the prior art.
2 is an assembled view schematically showing an electromagnetic wave shielding apparatus of a radio communication apparatus according to the prior art of FIG.
3 is an exploded view schematically illustrating an electromagnetic wave shielding apparatus of a wireless communication apparatus according to an embodiment of the present invention.
4 is an assembled view schematically showing an electromagnetic wave shielding apparatus of a wireless communication apparatus according to an embodiment of the present invention.
5 is a structural view of an elastic conductive shielding shield inserted into an SMD shield clip of a wireless communication device internal circuit board according to an embodiment of the present invention.
FIG. 6 is a view showing a film-type conductive shielding shield member for cutting and forming the conductive shielding shield of FIG. 5; FIG.
FIG. 7 is an assembled view of an elastic conductive shielding shield according to an embodiment of the present invention shown in FIG. 5 and a resilient protruding portion for minimizing the gap between the housing and the cover to be pressed and attached to the cover and the housing.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, and advantages of the present invention will become more readily apparent from the following description of preferred embodiments with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

In this specification, when an element is referred to as being on another element, it may be directly formed on another element, or a third element may be interposed therebetween. Also in the figures, the thickness of the components is exaggerated for an effective description of the technical content.

Embodiments described herein will be described with reference to cross-sectional views and / or plan views that are ideal illustrations of the present invention. In the drawings, the thicknesses of the films and regions are exaggerated for an effective description of the technical content. Thus, the shape of the illustrations may be modified by manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include changes in the shapes that are produced according to the manufacturing process. For example, the etched area shown at right angles may be rounded or may have a shape with a certain curvature. Thus, the regions illustrated in the figures have attributes, and the shapes of the regions illustrated in the figures are intended to illustrate specific forms of regions of the elements and are not intended to limit the scope of the invention. Although the terms first, second, etc. have been used in various embodiments of the present disclosure to describe various components, these components should not be limited by these terms. These terms have only been used to distinguish one component from another. The embodiments described and exemplified herein also include their complementary embodiments.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. The terms "comprises" and / or "comprising" used in the specification do not exclude the presence or addition of one or more other elements.

In describing the specific embodiments below, various specific details have been set forth in order to explain the invention in greater detail and to assist in understanding it. However, it will be appreciated by those skilled in the art that the present invention may be understood by those skilled in the art without departing from such specific details. In some instances, it should be noted that portions of the invention that are not commonly known in the description of the invention and are not significantly related to the invention do not describe confusing reasons to explain the present invention.

Hereinafter, an electromagnetic wave shielding apparatus of a wireless communication apparatus according to an embodiment of the present invention will be described with reference to FIG. 3 to FIG.

The electromagnetic wave shielding apparatus of the wireless communication apparatus according to the embodiment of the present invention may be applied to an electronic component module for wireless communication embedded in a housing of a mobile communication repeater or the like, for example, a high-power amplifier module for amplifying a signal, An interference cancellation module for filtering the signal and eliminating the interference of electromagnetic waves, a duplexer module for separating signals of the transmission frequency band and the reception frequency band, an RF conversion device for converting the RF signal and the IF signal to each other An RF transceiver module, a fiber optic transceiver that converts an electrical signal into an optical signal or an optical signal into an electrical signal, a power supply module (SMPS) that supplies power, and a digital signal processing device And can be applied to various electronic module modules for wireless communication, such as the housing 500, the circuit board 600, And a shielding shield 700 and cover 800.

The housing 500 has a predetermined length,

A front plate 510 and a rear plate 520 which are coupled to the front and rear surfaces of the housing main body 501. The housing body 501 has a rectangular housing shape.

The housing main body 501, the front plate 510, and the rear plate 520 are made of a metal material, and the housing main body 501 is formed by extrusion-

Shaped metal member can be cut to a predetermined length.

The housing 500 may be made of aluminum to shield the electromagnetic waves radiated to the outside of the device.

The circuit board 600 is provided with a plurality of SMD shield clips 610 on which various electronic components are mounted and on which the conductive shielding shield 700 can be inserted for shielding electromagnetic waves between adjacent circuits, with soldered parts in a specific pattern. At this time, the SMD shield clip 610 allows the conductive shielding shield 700 to be inserted therein.

It will be appreciated that a plurality of SMD shield clips 610 fixed in a specific pattern by soldering may vary in various forms depending on the arrangement of various electronic components of the circuit board 600 and circuit characteristics.

Further, the circuit board 600 is formed in a plate shape and can be mounted so as to be seated on the bottom surface of the housing 500.

The conductive shielding shield 700 forms a magnetically independent space inside the housing 500 to form electromagnetic shielding between adjacent circuits of the circuit board 600. The conductive shielding shield 700 is made of a conductive shielding material and is formed in the form of a thin film so that it can be inserted into the SMD shield clip 610. [

The conductive shielding shield 700 of the present invention can be cut and bent into a specific pattern and inserted into the SMD shield clip 610 when circuits on the circuit board 600 are to form an independent region. The conductive shielding shield 700 may be formed by cutting and folding a long conductive shielding shield member (far end) through a device such as a jig.

In order to form a separate region on the circuit board 600 in order to form an independent region, the conductive shielding shield 700 may be mounted on a necessary portion of the film- The conductive shielding shield 700 can be manufactured by cutting and / or bending and inserted into the SMD shield clip 610. Since a gap is formed between the housing 500 and the cover 800 when the SMD shield clip 610 is mounted, The conductive shielding shield 700 may be formed with elastic upper end protrusions 710 and side surface protrusions 720 to completely remove electromagnetic waves.

In other words, the conductive shielding shield 700 can be attached to the SMD shield clip 610 by cutting the long-formed film-type conductive shielding shield member to a desired length and size, bending it into a desired pattern, and mounting it.

The cover 800 is formed of a metal such as aluminum for protecting and dissipating the electronic parts of the circuit board 600 from external impacts and the circuit board 600 and the conductive shielding shield 700 are formed on the housing 500 The upper protrusion 710 of the conductive shielding shield may be fixed to the upper edge of the housing 500 so as to close the upper surface opening of the housing 500 while the cover 800 is being pressed by the cover 800 so as to maintain the embedded state.

As described above, since the conductive shielding shield 700 of the present invention is a method of cutting and bending a film-shaped conductive shielding shielding member to a pattern desired by the user for shielding electromagnetic waves between parts on the circuit board 600, It is not necessary to provide the integral shielding wall in the housing of the housing 500, so that the method of manufacturing the housing 500 is simplified and a complicated production drawing is not required.

Accordingly, when the housing 500 of the present invention is manufactured, the housing main body 501 can be applied with the most efficient aluminum extrusion dies. That is, in the housing main body 501 of the present invention, a metal body of a long extruded aluminum material is cut to a predetermined length to make a housing body 501 having a desired length, and the front and rear openings of the housing main body 501 The housing 500 can be easily manufactured by assembling the front plate 510 and the rear plate 520 to be covered.

In the present invention, a plurality of connection terminals or connectors (not shown) for transmitting and receiving RF signals for electrical connection with other electronic component modules or via an antenna are provided on the front, rear, and side surfaces of the housing 500 And may be electrically connected to the circuit board 600 inside the housing 500.

4 is an assembled view of an electromagnetic wave shielding apparatus of a wireless communication apparatus according to an embodiment of the present invention. The front plate 510 and the rear plate 520 are assembled to a housing main body 501 made of the extrusion mold of FIG. The housing 500 is completed and a circuit board 600 formed by brazing a plurality of SMD shield clips 610 in a specific pattern is mounted on the bottom surface of the housing 500. The film-type conductive shielding shield 700 is inserted into the SMD shield clip 610 of the circuit board 600 so as to shield the circuit where the interference occurs. The opening of the upper surface of the housing 500 is electrically connected to the circuit board 600, The electromagnetic shielding apparatus can be constructed by covering the cover 800 that is closed in a state where the shield shield 700 is embedded.

FIG. 5 illustrates an embodiment of a conductive shielding shield 700, and FIG. 6 illustrates a conductive shielding shield 701 for fabricating the conductive shielding shield 700 of FIG.

The conductive shielding shield 700 is fabricated from a conductive shielding shielding member 701 made of a conductive thin film and has a thickness equal to or greater than a skin depth in consideration of a frequency to be used, 600) should be able to completely block the interference between circuits.

The conductive shielding shield 700 may have a plurality of upper protrusions 710 at the upper end and side protrusions 720 at the sides thereof. Here, the intervals of the V-shaped grooves 712 formed between the plurality of upper protrusions 710 are formed at regular intervals, for example, at intervals of 2 mm and 3 mm. The upper protrusion 710 minimizes or eliminates the gap between the upper end of the conductive shielding shield 700 and the cover 800 and the side protrusion 720 prevents the side surface of the conductive shielding shield 700 and the housing 500, Thereby minimizing or eliminating the clearance between the side walls.

The plurality of upper protrusions 710 serve not only to minimize the gap between the upper end of the conductive shielding shield 700 and the cover 800 but also to prevent the conductive shielding shielding member 701 from being cut or bent to a desired length And a function for easily recognizing a desired point.

In this embodiment, the conductive shielding shield 700 is formed by cutting a long film-shaped conductive shielding shielding member 701, and the conductive shielding shielding member 701 may have a length or a reel- have.

In the present invention, the conductive shielding shield member 701 is formed in a plate shape as shown in FIG. 6, and a plurality of upper protrusions 710 are integrally formed at the upper end thereof, so that the conductive shielding shield member 701 The upper protrusion 710 may be bent at a predetermined angle, and a part of both ends of the cut conductive shielding member 701 may be bent to form a side protrusion 720 to be used .

7 illustrates an embodiment of mounting the housing 500 of the conductive shielding shield 700. The conductive shielding shield 700 includes an upper protrusion that is resilient in the upper portion in contact with the cover 800 to completely perform electromagnetic wave shielding 710 so that the cover 800 is pressed when the cover 800 is mounted and the gap between the side cutting portions of the conductive shielding shield 700 contacting the housing 500 when the housing 500 is mounted It is possible to form the side projection 720 having elasticity for blocking.

The plurality of upper protrusions 710 are integrally formed at the upper end of the conductive shielding shield 700 and bent at a predetermined angle at the upper end of the conductive shielding shield 700 so that the cover 800 covers the upper surface of the housing 500 The plurality of upper projections 710 are pressed by the cover 800 so that the plurality of upper projections 710 form an elastic force to press the cover 800. [

The side surface protrusions 720 are integrally formed at both ends of the conductive shielding shield 700 and bent at a predetermined angle so that the conductive shielding shields 700 are attached to the SMD shield clip 610 720 are pressed against the side walls of the housing 500.

A plurality of SMD shield clips 610 are soldered together with the components in a specific pattern on the circuit board 600 in order to shield the electromagnetic waves between the adjacent circuits on the circuit board 600 and the SMD shield clips 610 are provided with the conductive shielding shields 700 ) Can be plugged in.

Although the housing main body 501 of the housing 500 of the present invention is made of aluminum, the present invention is not limited thereto. The housing main body 501 has an electromagnetic wave shielding function capable of shielding electromagnetic waves radiated to the outside of the device, But it may be made of other metals.

In the meantime, the housing main body 501 of the present invention has the upper opened "

But the present invention is not limited thereto. The housing main body 501 of the present invention may have a predetermined length, and may be formed by cutting a predetermined length of an extruded metal member having a predetermined length, , Open up and down "

Quot; shaped extruded metal member, in which case the housing of the present invention is "

The housing body can be formed by cutting a predetermined length of a metal member having a predetermined shape and a front plate 510 and a rear plate 520 on the front and back surfaces, An SMD shield clip, a conductive shielding shield, and a circuit board are separately formed on the upper and lower portions of the housing, respectively, when the housing of this type is used, A cover can be constituted.

Although the present invention has been described in connection with the housing body 501 in which the front plate 510 and the rear plate 520 are coupled to both sides of the housing body 501 in a rectangular housing shape, The front plate 510 and the rear plate 520 may be formed of a plurality of pieces and the housing 500 may be cut into a plurality of pieces, May be formed in a shape having a polygonal shape rather than a rectangular shape.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It will be understood by those skilled in the art that many changes and modifications of the present invention can be made without departing from the spirit and scope of the appended claims. Accordingly, all such appropriate modifications and changes, and equivalents thereof, should be regarded as within the scope of the present invention.

500 ... housing
510 ... front plate
520 ... rear plate
600 ... circuit board
700 ... conductive shielding shield
800 ... Cover

Claims

A housing-shaped housing;
A circuit board mounted on a bottom surface of the housing and having a plurality of SMD shield clips soldered in a predetermined pattern;
A conductive shielding shield in the form of a thin film that is fitted to the plurality of SMD shielding clips to block electromagnetic interference between circuits on the circuit board; And
And a cover that closes the opening of the housing in a state where the circuit board and the conductive shielding shield are embedded,
Wherein the conductive shielding shield is formed by cutting and bending a conductive shielding shield member made of a thin film type and being inserted into the plurality of SMD shielding clips,
Wherein upper and lower ends of the conductive shielding shield are formed with upper protrusions and side protrusions that minimize a gap between the conductive shielding shield and the cover and a gap between the conductive shielding shield and the side wall of the housing. Electromagnetic wave shielding device.

The method according to claim 1,
The housing has an extruded upper portion < RTI ID = 0.0 > open "

" or "

&Quot;, and a front plate and a rear plate coupled to front and back surfaces of the housing main body. The electromagnetic wave shielding apparatus of claim 1,

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