JP2011035099A - Laser light source unit - Google Patents

Laser light source unit Download PDF

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JP2011035099A
JP2011035099A JP2009178793A JP2009178793A JP2011035099A JP 2011035099 A JP2011035099 A JP 2011035099A JP 2009178793 A JP2009178793 A JP 2009178793A JP 2009178793 A JP2009178793 A JP 2009178793A JP 2011035099 A JP2011035099 A JP 2011035099A
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light source
semiconductor element
laser
circuit board
source unit
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JP5493556B2 (en
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Hideaki Kusano
秀昭 草野
Yasushi Nagasaka
泰志 長坂
Atsushi Nagaoka
敦 長岡
Takahiro Matsuo
隆宏 松尾
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Konica Minolta Business Technologies Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser light source unit having a laser semiconductor element without being moved by thermal expansion of a circuit board. <P>SOLUTION: This laser light source unit includes: a circuit board mounted with a laser semiconductor element having a plurality of light emitting points; a light source holder including three projecting parts abutting on the front face of the laser semiconductor element; and an elastic member for pressing the circuit board toward the light source holder at three pressing points by elastic force. The distances of the three pressing points from two of the projecting parts are equal to each other. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、レーザ光源ユニットに関する。   The present invention relates to a laser light source unit.

レーザビームプリンタ等の光源として、特許文献１および２に記載されているように、複数の発光点を有するマルチビームレーザ半導体素子を用いたレーザ光源ユニットが使用されるようになっている。そのようなマルチビームレーザ半導体素子を用いる場合、発光点の配列されている発行面をレンズ等を保持する光源ホルダの光軸に対して厳密に直交させることが重要である。   As described in Patent Documents 1 and 2, a laser light source unit using a multi-beam laser semiconductor element having a plurality of light emitting points is used as a light source for a laser beam printer or the like. When such a multi-beam laser semiconductor element is used, it is important to make the issuance surface on which the light emitting points are arranged strictly orthogonal to the optical axis of the light source holder holding the lens or the like.

特許文献２に記載されているように、多数の発光点を有するレーザ半導体素子は、モールドパッケージ化された半導体チップからなる。このようなレーザ半導体素子は、パッケージの発光面側の周縁部が、位置決めのための基準面となっているのが普通である。   As described in Patent Document 2, a laser semiconductor element having a large number of light emitting points is composed of a semiconductor chip molded into a package. In such a laser semiconductor element, the peripheral portion on the light emitting surface side of the package is usually a reference surface for positioning.

従って、特許文献２に記載されているように、光源ホルダにレーザ半導体素子の基準面に当接する突起を設け、弾性部材によって、光源ホルダにレーザ半導体素子を実装した回路基板を押圧することで、レーザ半導体素子の基準面を光源ホルダの突起に押し付け、これによって、レーザ半導体素子を光源ホルダの光軸に直交するように取り付ける。   Therefore, as described in Patent Document 2, the light source holder is provided with a protrusion that contacts the reference surface of the laser semiconductor element, and the elastic member presses the circuit board on which the laser semiconductor element is mounted on the light source holder. The reference surface of the laser semiconductor element is pressed against the protrusion of the light source holder, thereby attaching the laser semiconductor element so as to be orthogonal to the optical axis of the light source holder.

レーザ半導体素子の駆動は、多数のレーザダイオードの電流を制御する必要があるため、パッケージ化された集積回路からなる駆動用ＩＣを、レーザ半導体素子とともに、回路基板上に実装することが合理的である。   Since it is necessary to control the current of a large number of laser diodes when driving a laser semiconductor element, it is reasonable to mount a driver IC composed of a packaged integrated circuit on a circuit board together with the laser semiconductor element. is there.

しかしながら、駆動用ＩＣは、発熱を伴うため、レーザ光源ユニットの使用によって、回路基板を熱膨張させることになる。レーザ半導体素子の基準面と光源ホルダの突起とは、圧接されているだけで互いに固定される訳ではないので、回路基板が熱膨張すると、レーザ半導体素子の発光面が光軸に直交する方向に移動してしまう問題がある。   However, since the driving IC generates heat, the circuit board is thermally expanded by using the laser light source unit. Since the reference surface of the laser semiconductor element and the protrusion of the light source holder are merely pressed together and are not fixed to each other, when the circuit board is thermally expanded, the light emitting surface of the laser semiconductor element is in a direction perpendicular to the optical axis. There is a problem of moving.

特開２０００−１６２５３５号公報JP 2000-162535 A 特開２００４−６５９２号公報Japanese Patent Laid-Open No. 2004-6592

前記問題点に鑑みて、本発明は、回路基板の熱膨張によってレーザ半導体素子が移動しないレーザ光源ユニットを提供することを課題とする。   In view of the above problems, an object of the present invention is to provide a laser light source unit in which a laser semiconductor element does not move due to thermal expansion of a circuit board.

前記課題を解決するために、本発明によるレーザ光源ユニットは、複数の発光点を有するレーザ半導体素子が実装された回路基板と、前記レーザ半導体素子の前面に当接する３つの突起部を備える光源ホルダと、弾性力によって、３つの押圧点において、前記回路基板を前記光源ホルダに向かって押圧する弾性部材とを有し、前記３つの押圧点は、２つの前記突起部からの距離が等しいものとする。   In order to solve the above-described problems, a laser light source unit according to the present invention includes a circuit board on which a laser semiconductor element having a plurality of light emitting points is mounted, and a light source holder including three protrusions that abut on the front surface of the laser semiconductor element. And an elastic member that presses the circuit board toward the light source holder at three pressing points by elastic force, and the three pressing points have the same distance from the two protrusions. To do.

この構成によれば、押圧点から２つの突起部までの距離が等しいので、回路基板が全体的に均等に熱膨張したとき、押圧点を支点として、３つの突起部に対して作用するスライド圧力が均等になる。これにより、各突起部において、回路基板の熱膨張によってレーザ半導体素子に作用するスライド圧力が相殺され、レーザ半導体素子の滑り移動が防止できる。   According to this configuration, since the distance from the pressing point to the two protrusions is equal, when the circuit board thermally expands evenly as a whole, the slide pressure acting on the three protrusions with the pressing point as a fulcrum Becomes even. Thereby, in each protrusion part, the slide pressure which acts on a laser semiconductor element by the thermal expansion of a circuit board is canceled, and the sliding movement of a laser semiconductor element can be prevented.

また、本発明のレーザ光源ユニットにおいて、前記回路基板は、前記レーザ半導体素子を駆動するための集積回路パッケージがさらに実装され、前記押圧点のいずれかは、前記レーザ半導体素子の中心と前記集積回路パッケージの中心とを結ぶ直線の上に位置してもよい。   In the laser light source unit of the present invention, the circuit board is further mounted with an integrated circuit package for driving the laser semiconductor element, and any one of the pressing points includes the center of the laser semiconductor element and the integrated circuit. It may be located on a straight line connecting the center of the package.

この構成によれば、発熱体である集積回路パッケージの近傍だけが熱膨張したとき、集積回路パッケージに最も近い押圧点は、回路基板の熱膨張によっても、レーザ半導体素子の中心方向に直交する方向にずれることがなく、位置ずれが小さい。また、他の２つの押圧点は、集積回路パッケージから遠く、回路基板の熱膨張が小さくなるので、位置ずれが小さい。これによって、集積回路パッケージの発熱による３つの押圧点の位置ずれが小さくて済み、レーザ半導体素子の移動を抑制できる。   According to this configuration, when only the vicinity of the integrated circuit package, which is a heating element, is thermally expanded, the pressing point closest to the integrated circuit package is a direction orthogonal to the center direction of the laser semiconductor element even by the thermal expansion of the circuit board. The position shift is small. Further, the other two pressing points are far from the integrated circuit package, and the thermal expansion of the circuit board is small, so that the positional deviation is small. Thereby, the positional deviation of the three pressing points due to heat generation of the integrated circuit package can be small, and the movement of the laser semiconductor element can be suppressed.

また、本発明のレーザ光源ユニットにおいて、前記３つの押圧点は、前記レーザ半導体素子の外側にあってもよい。   In the laser light source unit of the present invention, the three pressing points may be outside the laser semiconductor element.

この構成によれば、回路基板に形成した穴を貫通するネジによって回路基板を押圧するような簡単な構造にできる。   According to this configuration, a simple structure can be achieved in which the circuit board is pressed by a screw that passes through a hole formed in the circuit board.

また、本発明のレーザ光源ユニットにおいて、前記弾性部材は、前記光源ホルダに対して３点で固定されてもよい。   In the laser light source unit of the present invention, the elastic member may be fixed at three points with respect to the light source holder.

この構成によれば、３つの押圧点に作用する弾性部材の弾性力を均等にすることができ、レーザ半導体素子を３つの突起部に対して均等な力で押圧してレーザ半導体素子を安定して固定できる。   According to this configuration, the elastic force of the elastic member acting on the three pressing points can be equalized, and the laser semiconductor element is pressed against the three protrusions with an equal force to stabilize the laser semiconductor element. Can be fixed.

本発明によれば、押圧点から２つの突起部までの距離が等しいので、各突起部に対する回路基板の熱膨張による各押圧点を支点としたスライド圧力の変化が均等になる。また、集積回路パッケージに最も近い押圧点が、発光中心に向かう方向に直交する方向にずれることがないので、レーザ半導体素子の位置ずれを抑制できる。   According to the present invention, since the distance from the pressing point to the two protruding portions is equal, the change in the slide pressure with the pressing point as a fulcrum by the thermal expansion of the circuit board with respect to each protruding portion becomes equal. In addition, since the pressing point closest to the integrated circuit package does not shift in the direction orthogonal to the direction toward the light emission center, the positional deviation of the laser semiconductor element can be suppressed.

本発明の光源ユニットを用いるレーザ露光器の構成図である。It is a block diagram of the laser exposure device using the light source unit of this invention. 本発明の第１実施形態の光源ユニットの分解斜視図である。It is a disassembled perspective view of the light source unit of 1st Embodiment of this invention. 図２の光源ユニットの断面図である。It is sectional drawing of the light source unit of FIG. 図２の光源ユニットのレーザ半導体素子の正面図である。It is a front view of the laser semiconductor element of the light source unit of FIG. 図２の光源ユニットの回路基板の背面図である。It is a rear view of the circuit board of the light source unit of FIG. 本発明の第２実施形態の光源ユニットの回路基板の背面図である。It is a rear view of the circuit board of the light source unit of 2nd Embodiment of this invention. 本発明の第３実施形態の光源ユニットの回路基板の背面図である。It is a rear view of the circuit board of the light source unit of 3rd Embodiment of this invention. 本発明の第４実施形態の光源ユニットの回路基板の背面図である。It is a rear view of the circuit board of the light source unit of 4th Embodiment of this invention.

これより、本発明の実施形態について、図面を参照しながら説明する。図１に、本発明の光源ユニットを用いる画像形成装置用レーザ露光器の光学系の構成を示す。レーザ露光器は、複数のレーザダイオードが平面上に配列して形成されたレーザ半導体素子１と、レーザダイオード１が射出したレーザ光を平行光線に整形するコリメータレンズ２と、レーザ光線を集光させる集光レンズ３と、レーザ光を反射して主走査方向に走査するように偏向させる回転体である偏向器４と、レーザ光を合焦させる第１走査レンズ５および第２走査レンズ６と、レーザ光を折り返す反射鏡７とからなる。レーザ露光器は、帯電した感光体８にレーザ光を照射して、感光体８上に静電潜像を形成する。   Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 shows a configuration of an optical system of a laser exposure device for an image forming apparatus using the light source unit of the present invention. The laser exposure device condenses the laser beam, a laser semiconductor element 1 formed by arranging a plurality of laser diodes on a plane, a collimator lens 2 for shaping the laser beam emitted from the laser diode 1 into a parallel beam, and the like. A condenser lens 3; a deflector 4 that is a rotating body that reflects and deflects the laser light so as to scan in the main scanning direction; a first scanning lens 5 and a second scanning lens 6 that focus the laser light; It comprises a reflecting mirror 7 that turns back the laser beam. The laser exposure device irradiates the charged photoconductor 8 with laser light to form an electrostatic latent image on the photoconductor 8.

図２および図３に、本発明の第１実施形態のレーザ光源ユニット９を示す。このレーザ光源ユニット９は、図１のレーザ半導体素子１およびコリメータレンズ２を一体に保持するものである。具体的には、レーザ光源ユニット９は、コリメータレンズ２を保持する光源ホルダ１０に、弾性部材１１を介して、レーザ半導体素子１を実装した回路基板１２を取り付けてなる。   2 and 3 show a laser light source unit 9 according to the first embodiment of the present invention. The laser light source unit 9 holds the laser semiconductor element 1 and the collimator lens 2 shown in FIG. Specifically, the laser light source unit 9 is formed by attaching a circuit board 12 on which the laser semiconductor element 1 is mounted to a light source holder 10 that holds the collimator lens 2 via an elastic member 11.

弾性部材１１は、弾性のある樹脂からなり、中央がレーザ半導体素子１を受け入れられるように開口した、概略環状の部材である。弾性部材１１は、光軸Ｘの周りに均等（等距離、等間隔）に配置された３つのネジ１３によって光源ホルダ１０に取り付けられる。また、弾性部材１１には、光軸Ｘの周りに、ネジ１３の間に均等に配置されるネジ１４によって、回路基板１２が取り付けられる。   The elastic member 11 is a substantially ring-shaped member that is made of an elastic resin and that is open so that the center can receive the laser semiconductor element 1. The elastic member 11 is attached to the light source holder 10 by three screws 13 arranged equally (equal distance, equal interval) around the optical axis X. Further, the circuit board 12 is attached to the elastic member 11 by screws 14 that are evenly arranged between the screws 13 around the optical axis X.

光源ホルダ１０には、レーザ光の光路となる開口の周りに、レーザ半導体素子１の前面に当接する３つの突起部１５が形成されている。また、回路基板１２には、レーザ半導体素子１を駆動するための駆動回路を備える集積回路パッケージ１６が実装されている。   The light source holder 10 is formed with three protrusions 15 that are in contact with the front surface of the laser semiconductor element 1 around an opening serving as an optical path of the laser light. An integrated circuit package 16 including a drive circuit for driving the laser semiconductor element 1 is mounted on the circuit board 12.

図４に示すように、レーザ半導体素子１は、中央に３２個のレーザダイオード１７が配列して形成された発光面１８を有しており、発光面１８に平行に形成されたモールドパッケージの前面の外周部が、光源ホルダ１０の突起部１５に当接することでレーザ光の方向を定める基準面１９となる。   As shown in FIG. 4, the laser semiconductor element 1 has a light emitting surface 18 in which 32 laser diodes 17 are arranged in the center, and the front surface of the mold package formed in parallel to the light emitting surface 18. The reference portion 19 that determines the direction of the laser light is brought into contact with the protrusion 15 of the light source holder 10.

図３に示すように、弾性部材１１の厚みは、光源ホルダ９の突起部１５にレーザ半導体素子１の基準面１９を当接させたときの光源ホルダ９の本体と回路基板１２との隙間よりも僅かに小さく、弾性変形して、弾性力によって、回路基板１２を介してレーザ半導体素子１を突起部１５に対して押圧する。   As shown in FIG. 3, the thickness of the elastic member 11 is determined by the gap between the main body of the light source holder 9 and the circuit board 12 when the reference surface 19 of the laser semiconductor element 1 is brought into contact with the protrusion 15 of the light source holder 9. Is slightly smaller, elastically deformed, and the laser semiconductor element 1 is pressed against the protrusion 15 via the circuit board 12 by elastic force.

図５に、回路基板１２のネジ１４が貫通するねじ穴の位置、つまり、弾性部材１１が回路基板１２を光源ホルダ９に向かって押圧する３つの押圧点２０の位置と、レーザ半導体素子１に当接する３つの突起部１５の位置と、集積回路パッケージ１６の位置との関係を示す。   FIG. 5 shows the positions of screw holes through which the screws 14 of the circuit board 12 pass, that is, the positions of three pressing points 20 where the elastic member 11 presses the circuit board 12 toward the light source holder 9, and the laser semiconductor element 1. The relationship between the positions of the three projecting portions 15 that abut and the position of the integrated circuit package 16 is shown.

図示するように、本実施形態では、各押圧点２０は、３つの突起部１５の中で近い方の２つからの距離が全て等しい。このような配置において、各押圧点２０におけるネジ１４の回路基板１２に対する押圧力が同じであれば、回路基板１２が全体的に熱膨張したとき、回路基板１２の熱膨張が、各押圧点２０を支点としてレーザ半導体素子１を発光面に平行な方向に移動させようとするスライド圧力が、各突起部１５に当接する位置で等しくなり、レーザ半導体素子１の滑り移動を生じさせない。   As shown in the figure, in the present embodiment, each of the pressing points 20 has the same distance from the closest two of the three protrusions 15. In such an arrangement, if the pressing force of the screw 14 against the circuit board 12 at each pressing point 20 is the same, the thermal expansion of the circuit board 12 is caused by the thermal expansion of the circuit board 12 when the circuit board 12 is thermally expanded as a whole. As a fulcrum, the slide pressure for moving the laser semiconductor element 1 in the direction parallel to the light emitting surface is equal at the position where it abuts on each projection 15, and the laser semiconductor element 1 does not slide.

また、本実施形態では、１つの押圧点が、レーザ半導体素子１の中心（光軸Ｘ）と集積回路パッケージ１６の中心とを結ぶ直線の上に位置する。レーザ半導体素子１を駆動すると、集積回路パッケージ１６がジュール損によって発熱し、回路基板１２の集積回路パッケージ１６の近傍だけを大きく不均等に熱膨張させて回路基板１２を歪ませ得る。   In the present embodiment, one pressing point is located on a straight line connecting the center (optical axis X) of the laser semiconductor element 1 and the center of the integrated circuit package 16. When the laser semiconductor element 1 is driven, the integrated circuit package 16 generates heat due to Joule loss, and only the vicinity of the integrated circuit package 16 of the circuit board 12 can be thermally expanded largely and unevenly to distort the circuit board 12.

集積回路パッケージ１６の近傍に位置する押圧点２０において、回路基板１２の熱膨張による歪みは、レーザ半導体素子１の中心の方向にのみ作用し、横方向への歪みを生じない。また、集積回路パッケージ１６から遠い２つの押圧点２０では、回路基板１２の熱膨張が小さく、殆ど歪みを受けない。従って、３つの押圧点２０には、集積回路パッケージ１６の発熱による歪みが殆ど生じず、レーザ半導体素子１の位置ずれが起こらない。   At the pressing point 20 located in the vicinity of the integrated circuit package 16, the distortion due to the thermal expansion of the circuit board 12 acts only in the direction of the center of the laser semiconductor element 1 and does not cause a distortion in the lateral direction. Further, at the two pressing points 20 far from the integrated circuit package 16, the thermal expansion of the circuit board 12 is small and hardly receives distortion. Accordingly, the three pressing points 20 are hardly distorted due to heat generation of the integrated circuit package 16, and the laser semiconductor element 1 is not displaced.

図６に、本発明の第２実施形態のレーザ光源ユニット９ａの３つの突起部１５と、３つの押圧点２０と、集積回路パッケージ１６との位置関係を示す。尚、これ以降の説明において、第１実施形態と同じ構成要素には同じ符号を付して、重複する説明を省略する。   FIG. 6 shows a positional relationship among the three protrusions 15, the three pressing points 20, and the integrated circuit package 16 of the laser light source unit 9 a according to the second embodiment of the present invention. In the following description, the same components as those in the first embodiment are denoted by the same reference numerals, and redundant description is omitted.

本実施形態では、突起部１５が、レーザ半導体素子１の中心軸周りに不均等に配置されている。しかしながら、本実施形態においても、各押圧点２０は、近くの２つの突起部１５からの距離が全て一定である。つまり、本実施形態では、３つの押圧点２０も、レーザ半導体素子１の中心軸周りに不均等に配置されている。   In the present embodiment, the protrusions 15 are unevenly arranged around the central axis of the laser semiconductor element 1. However, also in the present embodiment, each pressing point 20 has a constant distance from the two adjacent protrusions 15. That is, in the present embodiment, the three pressing points 20 are also unevenly arranged around the central axis of the laser semiconductor element 1.

本実施形態のような配置であっても、回路基板１２の熱膨張によって生じる、各押圧点２０を支点とするレーザ半導体素子１に対するスライド圧力が、各突起部１５との当接位置において相殺され、レーザ半導体素子１の滑り移動が防止される。   Even in the arrangement as in the present embodiment, the slide pressure with respect to the laser semiconductor element 1 having each pressing point 20 as a fulcrum generated by the thermal expansion of the circuit board 12 is canceled at the contact position with each protrusion 15. The sliding movement of the laser semiconductor element 1 is prevented.

また、本実施形態においても、１つの押圧点２０が、レーザ半導体素子１の中心と集積回路パッケージ１６の中心とを結ぶ直線の上に位置し、集積回路パッケージ１６の発熱により、回路基板１２が部分的に熱膨張しても、レーザ半導体素子１の取り付け状態に変化を及ぼさない。   Also in this embodiment, one pressing point 20 is located on a straight line connecting the center of the laser semiconductor element 1 and the center of the integrated circuit package 16, and the circuit board 12 is heated by the heat generated by the integrated circuit package 16. Even if it is partially thermally expanded, the attachment state of the laser semiconductor element 1 is not changed.

図７に、本発明の第３実施形態のレーザ光源ユニット９ｂの３つの突起部１５と、３つの押圧点２０と、集積回路パッケージ１６との位置関係を示す。本実施形態では、集積回路パッケージ１６から遠い２つの突起部１５が、集積回路パッケージ１６および集積回路パッケージ１６に最も近い突起部１５からの距離が等しく、集積回路パッケージ１６から遠い２つの突起部１５の間の距離が集積回路パッケージ１６に最も近い突起部１５からの距離よりも短くなっている。   FIG. 7 shows the positional relationship among the three protrusions 15, the three pressing points 20, and the integrated circuit package 16 of the laser light source unit 9b according to the third embodiment of the present invention. In the present embodiment, the two protrusions 15 far from the integrated circuit package 16 have the same distance from the integrated circuit package 16 and the protrusion 15 closest to the integrated circuit package 16, and the two protrusions 15 far from the integrated circuit package 16. Is shorter than the distance from the protrusion 15 closest to the integrated circuit package 16.

また、本実施形態では、３つの押圧点２０は、３つの突起部１５の内、それぞれ、遠い側の２つの突起部１５までの距離が等しくなるように配置されている。本実施形態の配置でも、熱膨張した回路基板１２がレーザ半導体素子１を突起部１５に押圧された位置において光軸に直交する方向に押し出そうとする力が互いに相殺し合い、レーザ半導体素子１を移動させない。   Moreover, in this embodiment, the three press points 20 are arrange | positioned so that the distance to the two protrusion parts 15 of the far side among the three protrusion parts 15 may become equal respectively. Even in the arrangement of the present embodiment, the forces of the thermally expanded circuit board 12 trying to push out the laser semiconductor element 1 in the direction perpendicular to the optical axis at the position where the laser semiconductor element 1 is pressed by the protrusion 15 cancel each other. Do not move.

また、本実施形態においても、１つの押圧点２０が、レーザ半導体素子１の中心と集積回路パッケージ１６の中心とを結ぶ直線の上に位置するため、集積回路パッケージ１６の発熱により、回路基板１２が部分的に熱膨張しても、レーザ半導体素子１の移動を抑制できる。   Also in this embodiment, since one pressing point 20 is located on a straight line connecting the center of the laser semiconductor element 1 and the center of the integrated circuit package 16, the circuit board 12 is generated by heat generation of the integrated circuit package 16. Even if it partially expands thermally, the movement of the laser semiconductor element 1 can be suppressed.

さらに、図８に、本発明の第４実施形態のレーザ光源ユニット９ｃの３つの突起部１５と、３つの押圧点２０と、集積回路パッケージ１６との位置関係を示す。本実施形態が示すように、３つの押圧点２０を、それぞれ、遠い側の２つの突起部１５までの距離が等しくなるように配置する場合も、３つの突起部１５が、レーザ半導体素子１を中心に均等に配置されていなくてもよい。   Further, FIG. 8 shows the positional relationship among the three protrusions 15, the three pressing points 20, and the integrated circuit package 16 of the laser light source unit 9 c according to the fourth embodiment of the present invention. As shown in this embodiment, even when the three pressing points 20 are arranged so that the distances to the two far-side projecting portions 15 are equal to each other, the three projecting portions 15 are provided with the laser semiconductor element 1. It does not have to be evenly arranged in the center.

１…レーザ半導体素子
２…コリメータレンズ
９，９ａ，９ｂ，９ｃ…レーザ光源ユニット
１０…光源ホルダ
１１…弾性部材
１２…回路基板
１３…ネジ
１４…ネジ
１５…突起部
１６…集積回路パッケージ
２０…押圧点 DESCRIPTION OF SYMBOLS 1 ... Laser semiconductor element 2 ... Collimator lens 9, 9a, 9b, 9c ... Laser light source unit 10 ... Light source holder 11 ... Elastic member 12 ... Circuit board 13 ... Screw 14 ... Screw 15 ... Projection part 16 ... Integrated circuit package 20 ... Press point

Claims (4)

複数の発光点を有するレーザ半導体素子が実装された回路基板と、
前記レーザ半導体素子の前面に当接する３つの突起部を備える光源ホルダと、
弾性力によって、３つの押圧点において、前記回路基板を前記光源ホルダに向かって押圧する弾性部材とを有し、
前記３つの押圧点は、２つの前記突起部からの距離が等しいことを特徴とするレーザ光源ユニット。 A circuit board on which a laser semiconductor element having a plurality of light emitting points is mounted;
A light source holder comprising three protrusions contacting the front surface of the laser semiconductor element;
An elastic member that presses the circuit board toward the light source holder at three pressing points by elastic force;
The laser light source unit, wherein the three pressing points have the same distance from the two protrusions. 前記回路基板は、前記レーザ半導体素子を駆動するための集積回路パッケージがさらに実装され、
前記押圧点のいずれかは、前記レーザ半導体素子の中心と前記集積回路パッケージの中心とを結ぶ直線の上に位置することを特徴とする請求項１に記載のレーザ光源ユニット。 The circuit board is further mounted with an integrated circuit package for driving the laser semiconductor element,
2. The laser light source unit according to claim 1, wherein any one of the pressing points is located on a straight line connecting a center of the laser semiconductor element and a center of the integrated circuit package. 前記３つの押圧点は、前記レーザ半導体素子の外側にあることを特徴とする請求項１または２に記載のレーザ光源ユニット。   The laser light source unit according to claim 1, wherein the three pressing points are outside the laser semiconductor element. 前記弾性部材は、前記光源ホルダに対して３点で固定されることを特徴とする請求項１から３のいずれかに記載のレーザ光源ユニット。   The laser light source unit according to claim 1, wherein the elastic member is fixed at three points with respect to the light source holder.
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