JP2011029353A - Dispensing device and method of calibration of dispensing nozzle - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a dispensing device which achieves highly accurate correction of the position of a dispensing nozzle to a camera; and to provide a method of calibration of the dispensing nozzle. <P>SOLUTION: A dispensing device includes: a movable stage for placing and holding a substrate with a chip mounted; a dispensing nozzle for filling an underfill agent; and an imaging means. In the dispensing device and a method of calibration of the dispensing nozzle, this imaging means includes a function of performing image recognition of the position of the mounted chip and a function of performing image recognition of the position of the dispensing nozzle. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a dispensing apparatus and a dispensing nozzle calibration method. More specifically, the present invention relates to a dispensing apparatus that fills a gap between a substrate and a mounting chip mounted on the substrate with an underfill agent under reduced pressure, and a calibration method for a dispense nozzle provided in a dispenser that fills the underfill agent.

  FIG. 11 is a schematic view showing an example of a conventional dispensing apparatus. As shown in FIG. 11, a conventional dispensing apparatus 400 includes a chamber 520, a decompression unit 460, a movable stage 710, a camera 720, a dispenser 730, a control device 90, and the like.

  A basic operation of the dispensing apparatus 400 will be described. It is assumed that the substrate K on which the chip C is mounted is placed and held on the movable stage 710. The inside of the chamber 520 is decompressed by the decompression means 460. After the chamber 520 reaches a predetermined set pressure and stabilizes, the camera 720 reads the appearance of the chip C or the alignment mark on the substrate K and sends the image data to the control device 90. The control device 90 calculates the position information of the chip C from the read image data. Based on the position information, the control device 90 moves the movable stage 710 in each of the X, Y, and θ directions so that the dispensing nozzle (needle) 730N in the dispenser 730 can fill the optimal filling position with the underfill agent. Alignment is performed by driving. After this alignment, the dispenser 730 is driven downward in the Z direction and discharges the underfill agent. The underfill agent discharged around the chip by the dispenser 730 enters between the chip C and the substrate K. When the discharge of the underfill agent is completed, the void inside the underfill agent is eliminated by opening the chamber 520 to the atmosphere.

  In general, in such a dispensing apparatus 400, it is necessary to detach and replace the dispenser 730 along with maintenance work such as long-time use and cleaning. At the time of attachment / detachment or replacement, if the positional relationship of the tip center of the dispensing nozzle 730N with respect to the optical axis of the camera 720 is lost (if the position of the dispensing nozzle 730N is shifted), the dropping position is shifted by that amount. Become. For this reason, it is important that the position of the dispensing nozzle 730N with respect to the camera 720 is accurately set, and calibration (position correction) is performed every time the dispenser 730 is replaced.

  For example, in the method described in Patent Document 1 below, an underfill agent (resin) is dropped (discarded) from the dispense nozzle 730N for position measurement at each of the positioned coordinate positions. The dropped position measurement underfill agent is imaged with a camera to determine the actual drop position coordinates of each underfill agent. From the difference between the actual drop coordinate position and the coordinate position of the dispense nozzle 730N when it is dropped, the deviation between the actual drop position of the dispense nozzle 730N and the position of the dispense nozzle 730N when it is dropped is obtained. The position of the dispensing nozzle 730N with respect to the camera is corrected by obtaining the average value of this deviation.

  In addition, there is a method in which the position of the dispensing nozzle 730N is imaged by a camera 740 provided in the lower part of the chamber 520, and the position of the dispensing nozzle 730N is read and the position is corrected.

JP 2004-55739 A

  However, in the method described in Patent Document 1, the dropped underfill agent bleeds with time, and the accurate center position cannot be specified, and as a result, the position of the dispense nozzle relative to the camera cannot be corrected accurately. There was a problem.

  Further, in the method of imaging with the camera 740 provided in the lower part of the chamber 520, it is necessary to arrange two cameras, and the structure of the apparatus is complicated. In addition, the dispensing nozzle 730N takes an image after the movable stage 710 is temporarily retracted. In particular, in the case where the movable stage 710 is a large stage, there is a problem that the size of the chamber 520 is increased with retraction.

  The present invention has been made in view of such a problem, and an object of the present invention is to provide a dispensing apparatus and a dispensing nozzle calibration method that can realize the correction of the position of the dispensing nozzle with respect to the camera with high accuracy.

In order to solve the above problems, the invention described in claim 1
A dispensing device that fills a gap between a substrate and a chip mounted on the substrate with an underfill agent under reduced pressure,
A movable stage for mounting and holding the substrate on which the chip is mounted;
A dispensing nozzle filled with the underfill agent;
Imaging means, and this imaging means,
A dispensing apparatus having a function of recognizing an image of the position of the mounted chip and a function of recognizing an image of the position of the dispensing nozzle.

The invention described in claim 2
When the imaging unit recognizes an image of the position of the dispense nozzle using a height changing unit that changes a height direction of the imaging unit and an optical path changing unit provided on a side wall of the movable stage, The dispensing apparatus according to claim 1, wherein the dispensing apparatus has a function of moving to a focal position of the imaging unit.

The invention according to claim 3
A dispensing nozzle calibration method provided in a dispensing apparatus that fills a gap between a substrate and a mounting chip mounted on the substrate with an underfill agent under reduced pressure,
The dispensing apparatus has a movable stage for placing and holding a substrate on which a chip is mounted, an optical path changing means provided on a side wall of the movable stage, a dispensing nozzle for discharging the underfill agent, the mounting chip, and the Imaging means for imaging the dispense nozzle,
Disposing the optical path changing means below the dispensing nozzle;
Moving the imaging means to a position where the dispensing nozzle can recognize an image via the optical path changing means;
Recognizing the dispensing nozzle with the imaging means, and obtaining a displacement amount from a dispensing nozzle reference position and an actual dispensing nozzle position obtained from a design value of the dispensing apparatus;
A calibration method for a dispense nozzle having

  According to the dispensing apparatus of the first aspect, since the imaging unit has the function of recognizing the position of the chip and the function of recognizing the position of the dispensing nozzle, the position of the dispensing nozzle can be accurately imaged. Recognize and correct position. Therefore, unlike the conventional method of obtaining the correction amount based on the position of the underfill agent thrown away by the dispense nozzle, the center position of the dispense nozzle is accurately determined without bleeding the dropped underfill agent over time. Can be identified. As a result, it is possible to accurately correct the position of the dispensing nozzle with respect to the imaging unit.

  According to the dispensing apparatus of the second aspect, the imaging unit uses the height changing unit that varies the height direction of the imaging unit and the optical path changing unit provided on the side wall of the movable stage to When recognizing the position, it has a function of moving to the focal position of the imaging means. Therefore, even when the position of the dispensing nozzle is out of the field of view of the imaging means that recognizes the position of the chip, the image can be recognized accurately.

  According to the dispense nozzle calibration method according to claim 3, the step of disposing the optical path changing means below the dispense nozzle and the imaging means at a position where the dispense nozzle can be recognized through the optical path changing means. And a step of recognizing an image of the dispense nozzle by the imaging means, and obtaining a displacement amount from a dispense nozzle reference position obtained from a design value of the dispense apparatus and an actual dispense nozzle position. Therefore, correction of the position of the dispensing nozzle with respect to the imaging unit can be realized with high accuracy.

FIG. 1 is a partial front sectional view of a mounting system provided with a dispensing apparatus according to the present invention. 1 is a partial front sectional view of a dispensing apparatus according to the present invention. It is a front fragmentary sectional view which shows the principal part of this invention. It is a front partial top view which shows the principal part of this invention. It is a figure which shows the supply system of an underfill agent. It is a flowchart which shows the outline | summary of the operation | movement procedure of a mounting system. It is a flowchart which shows the operation | movement procedure of the data acquisition step for nozzle calibration. It is a flowchart which shows the operation | movement procedure of an underfill agent supply step. It is a flowchart which shows the operation | movement procedure of a dispensing step. It is a figure for demonstrating operation | movement of the data acquisition step for nozzle calibration. It is the schematic which shows an example of the conventional dispensing apparatus.

  Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. 1 is a partial front sectional view of a mounting system equipped with a dispensing apparatus according to the present invention, FIG. 2 is a partial front sectional view of a dispensing apparatus according to the present invention, and FIG. 3 is a partial front view showing a main part of the present invention. FIG. 4 is a front partial plan view showing the main part of the present invention, and FIG. 5 is a view showing an underfill agent supply system. In each configuration diagram, the three axes of the Cartesian coordinate system are X, Y, and Z, the horizontal direction of the paper is the X direction, the direction orthogonal to the paper is the Y direction, the vertical direction is the Z direction, and the rotation direction about the Z axis is the θ direction. And

  As shown in FIG. 1, the mounting system 1 has a configuration in which a substrate loader 2, a chip mounting device 3, a dispensing device 4, and a substrate unloader 8 are arranged in this order, and includes a control device 9. Although not shown in the drawings from the substrate loader 2 to the substrate unloader 8, a substrate transfer means for transferring the substrate K along the transfer path V is provided. This substrate transfer means is configured by a robot that holds the substrate K and has an extendable arm, or a rail member with a roller that is configured to be able to run the substrate K.

  The substrate loader 2 is a device that sequentially supplies the substrates K to the chip mounting device 3, and includes an oven 22 that can keep the substrates K warm together with the substrate magazine 21 that can store a plurality of substrates K, and a standby for waiting the substrates K. A stage 23 is provided. A heater for keeping the substrate K at an appropriate temperature is embedded in the standby stage 23.

  The chip mounting device 3 is a device that mounts the chip C on the substrate K supplied from the substrate loader 2. The chip mounting device 3 fixes and holds the substrate K in a predetermined position and can be driven in each of the X, Y, and θ directions. A chip stocker 32 for stocking the chip C to be mounted with its bump forming surface facing upward, and a chip reversing section for taking out the chip C from the chip stocker 32 by vacuum suction and inverting the chip C so that the bump forming surface faces downward 33, the two-field camera 34 configured to be able to simultaneously acquire the position information of the upper chip C and the lower substrate K, and the non-bump-formed surface of the chip C reversed by the chip reversing unit 33 And a bonding head 35 for mounting and pressing the chip C on the substrate K while holding. A heater for heating and keeping the substrate K at an appropriate temperature is embedded in the movable stage 31.

  The dispensing device 4 is a device that fills the gap between the substrate K and the chip C mounted on the substrate K with an underfill agent. As shown in FIG. 2, the chamber 52, the movable stage 71, the camera 72, A pressure sensor 75, a dispenser 73, a vacuum pump 46, and the like are provided.

  The camera 72 corresponds to the imaging means of the present invention. As the camera 72, for example, a CCD camera or the like is applied.

  The chamber 52 includes a first gate valve 42 and a second gate valve 43 provided so as to be openable and closable. In addition, it is connected to a vacuum pump 46 via a pipe and an opening / closing valve 62 and includes an opening valve 47 for releasing the internal vacuum pressure to the atmosphere. A transparent window 54 is provided on the upper surface of the chamber 52 to enable the camera 72 to image the inside of the chamber 52.

  The movable stage 71 includes a holding surface 71H capable of fixing and holding a substrate K to be filled with an underfill agent (that is, the substrate K on which the chip C is mounted). Here, the height of the holding surface 71H is defined as a reference height in the following description. The holding surface 71H is provided with a large number of fine holes for holding the substrate K by vacuum suction, and these fine holes are connected to a vacuum pump (not shown). Further, the movable stage 71 is configured to be driven in the X, Y, and θ directions by the stage driving unit 74. Inside the movable stage 71, a heater is embedded to heat and keep the substrate K fixed and held at an appropriate temperature. As shown in FIGS. 3 and 4, two prisms 75 a and 75 b are disposed on the side wall portion of the movable stage 71. The two prisms 75a and 75b are attached with their reflecting surfaces facing each other. The horizontal distance L0 between the two prisms 75a and 75b facing each other is substantially equal to the horizontal distance between the camera 72 and the dispensing nozzle 73N. More specifically, it is equal to the horizontal distance between the optical axis of the imaging lens in the camera 72 and the axis line of the dispensing nozzle 73N. Further, the maximum height L2 of the reflecting surfaces of the two prisms 75a and 75b is the same as that of the prisms 75a and 75b, and is set to a position lower than the holding surface 71H used as a reference for the height.

  The prisms 75a and 75b correspond to the optical path changing means of the present invention. The optical path changing means is not limited to the prisms 75a and 75b, and a mirror may be used.

  The camera 72 is configured to be able to transmit image data obtained by imaging to the control device 9. The camera 72 is installed at a position where the inside of the chamber 52 can be imaged from the outside of the chamber 52 through the transparent window 54. The camera 72 can capture images at two heights, a nozzle recognition height 72Ha and a substrate recognition height 72Hb. The vertical relationship between the two heights is 72Ha <72Hb, and the depth of focus is designed to match the nozzle and the substrate at each position. The camera 72 reciprocates between two heights by driving an air cylinder 76 or the like. Normally, the camera 72 is at the position of the substrate recognition height 72Hb, and becomes the height of the nozzle recognition height 72Ha when the dispense nozzle 73N is calibrated. Moreover, the light emission part which emits a flash simultaneously with imaging is provided.

  The air cylinder 76 corresponds to the height changing means of the present invention. The height changing means is not limited to the air cylinder 76, and the height of the camera 72 may be changed by combining a servo motor and a ball screw.

  Thus, since the camera 72 has the function of recognizing the position of the chip C and the function of recognizing the position of the dispensing nozzle 73N, the position of the dispensing nozzle 73N is accurately recognized and corrected. I can do it. Therefore, unlike the conventional method of obtaining the correction amount based on the position of the underfill agent discarded by the dispense nozzle 73N, the center position of the dispense nozzle 73N is not dripped with the passage of time. It can be accurately identified. As a result, the correction of the position of the dispensing nozzle 73N with respect to the camera 72 can be realized accurately.

  Further, when the camera 72 recognizes an image of the position of the dispensing nozzle 73N using the air cylinder 76 that changes the height direction of the camera 72 and the prisms 75a and 75b provided on the side wall of the movable stage, the camera 72 It has a function of moving to 72 focal positions. Therefore, even when the position of the dispensing nozzle 73N is out of the field of view of the camera 72 that recognizes the position of the chip C, the image can be accurately recognized.

  Returning to FIG. 2, the pressure sensor 75 is configured to be able to measure the pressure in the chamber 52 and transmit the measured value to the control device 9.

  The dispenser 73 includes a dispense nozzle 73N that discharges an underfill agent, and can be driven in the Z direction. The dispenser 73 is connected to the first storage part 66 and the second storage part 67 via the check valve 69, the pipe 68 and the three-way valve 65. The 1st storage part 66 and the 2nd storage part 67 are comprised by the syringe container which can store a predetermined amount of underfill agents, respectively. The pipe 68 is connected to the vacuum pump 46 via the open / close valve 64.

  The three-way valve 65 can be switched to the following A mode, B mode, and C mode. That is, in the A mode, as shown in FIG. 5, only the first storage unit 66 and the dispenser 73 communicate with each other. In the B mode, only the second storage unit 67 and the dispenser 73 communicate with each other. In C mode, neither the 1st storage part 66 and the dispenser 73, the 2nd storage part 67 and the dispenser 73, nor the 1st storage part 66 and the 2nd storage part 67 communicates.

  Returning to FIG. 1, the substrate unloader 8 is a device for sequentially taking out the substrates K that have been filled with the underfill agent from the dispensing device 4, and similarly to the substrate loader 2, a substrate magazine 81 that can accommodate a plurality of substrates K. And an oven 82 that can keep the substrate K warm.

  The control device 9 includes an input / output device such as a touch panel, appropriate hardware mainly including a memory chip and a microprocessor, a hard disk device incorporating a computer program for operating the hardware, and data communication with each component. The mounting system 1 is configured to send a command signal for performing a series of operations to each component. A part of the series of operations may be performed by a PLC (programmable logic controller).

  The calibration characteristic of the present invention is performed by a calibration program incorporated in advance in the storage means of the control device 9. The calibration program is based on the reference position of the dispensing nozzle 73N obtained from the design value of the dispensing apparatus 4 (for example, input to the control apparatus 9 by the teaching operation) and the actual position of the dispensing nozzle 73N obtained by the camera 72. , A program for obtaining the displacement as the first correction amount.

  Next, the operation of the mounting system 1 configured as described above will be described with reference to FIGS. 6 is a flowchart showing an outline of the operation procedure of the mounting system 1, FIG. 7 is a flowchart showing the operation procedure of the nozzle calibration data acquisition step, FIG. 8 is a flowchart showing the operation procedure of the underfill agent supply step, and FIG. FIG. 10 is a flowchart for explaining the operation of the nozzle calibration data acquisition step.

  As shown in FIG. 6, the operation of the mounting system 1 is performed in the order of nozzle calibration data acquisition step S0, underfill agent supply step S1, chip mounting step S2, and dispensing step S3.

  In the following description, the dispensing apparatus 4 is in the following initial state. That is, both the first gate valve 42 and the second gate valve 43 are closed. The open valve 47 is open, and the pressure in the chamber 52 is atmospheric pressure. In addition, a sufficient amount of underfill agent is stored in the first storage unit 66 and the second storage unit 67, the three-way valve 65 is set to the C mode, and the open / close valve 64 is closed. The set pressure in the chamber 52 (the target pressure value of the reduced pressure) is P2. The dispenser 73 is replaced by replacement or cleaning, and the calibration is not performed.

  First, as shown in step S0 of FIG. 6, since the dispenser 4 has not been calibrated after the dispenser 73 has been replaced (yes in step S10), the dispenser 73 is used for calibration of the mounting position of the dispenser 73. An operation of acquiring one correction amount is performed.

  Details of step S0 are shown in FIG. First, the release valve 47 is closed. Subsequently, the open / close valve 62 is opened until the inside of the chamber 52 reaches the set pressure P2. Thereby, the pressure in the chamber 52 is gradually reduced (step S01). After the pressure in the chamber 52 reaches the set pressure P2, the stage drive unit 74 drives the movable stage 71 so that the dispense nozzle 73N of the dispenser 73 is positioned above the prism 75a, and at the same time, the camera 72 detects the nozzle recognition height. It descends to 72 Ha (step 02). As shown in FIG. 10, the distance between the prisms 75a and 75b is equal to the horizontal distance between the optical axis of the imaging lens in the camera 72 and the axis of the dispense nozzle 73N. Therefore, when the dispensing nozzle 73N comes above the prism 75a, the imaging lens of the camera 72 comes above the prism 75b (steps 03 and 04). In this state, the camera 72 irradiates with flash light, captures the bottom image of the dispense nozzle 73N obtained through the prism 75a and the prism 75b through the transparent window 54, and sends the image data to the control device 9. The control device 9 determines the mounting displacement of the dispenser 73 based on the image data sent from the camera 72 and a reference position obtained from the design value of the dispensing device 4 (for example, input to the control device 9 by a teaching operation). Obtained (step S06). The reference position is a position when the dispensing nozzle 73N is ideally attached to the camera 72 without displacement from a predetermined position. This attachment displacement is used as the first correction amount during the dispensing operation described later. Subsequently, the opening valve 47 is once opened to return the pressure in the chamber 52 to atmospheric pressure (step S07), and then the opening valve 47 is closed again. In parallel with this operation, the camera 72 rises to the board recognition height 72Hb.

  When the calculation of the first correction amount is completed, an operation of supplying the underfill agent to the dispenser 73 is performed in the dispensing apparatus 4 as in step S1 of FIG. 6 prior to the chip mounting operation. Details of step S1 are shown in FIG. Since the three-way valve 65 is in the C mode, the inside of the pipe 68 is sealed (step S11). For this reason, the dispenser 73 does not communicate with the first reservoir 66 and the second reservoir 67, and the underfill agent is not guided to the dispenser 73. In this state, the opening / closing valve 64 is opened (step S12), and the inside of the pipe 68 is decompressed (step S13). When the inside of the pipe 68 becomes equal to or lower than the setting P2 of the chamber 52 (Yes in Step S14), the open / close valve 64 is closed (Step S15).

  Subsequently, the three-way valve 65 is set to the A mode (step S17). In A mode, since the 1st storage part 66 and the dispenser 73 are connected, the underfill agent stored by the 1st storage part 66 is sent into the dispenser 73 via the piping 68. FIG. Since the inside of the pipe 68 is held at P <b> 2, the underfill agent fed into the dispenser 73 is prevented from entraining bubbles in the pipe 68. If there is not a sufficient amount of the underfill agent in the first reservoir 66 (No in step S16), the three-way valve 65 is set to the B mode to receive the supply of the underfill agent from the second reservoir 67 (step S18). .

  Subsequently, the chip mounting operation in step S2 of FIG. 6 is performed. Each substrate K stocked in the substrate magazine 21 is kept at a predetermined constant temperature in the oven 22. The substrate transfer means supplies each substrate K stocked in the substrate magazine 21 to the chip mounting apparatus 3 one by one through the standby stage 23.

  In the chip mounting device 3, the chip reversing unit 33 is driven in the X, Y, and Z directions, and is taken out by vacuum-sucking the bump forming surface of the chip C stocked in the chip stocker 32. Thereafter, the chip C is reversed so that the bump forming surface faces downward by being rotated around the horizontal axis J1. The bonding head 35 is driven in the X, Y, and Z directions to take out the inverted chip C from the chip reversing unit 33 by vacuum suction. Then, the two-field camera 34 reads the positions of the chip C and the substrate K, and based on the position information, the movable stage 31 is driven in each of the X, Y, and θ directions to align the chip C and the substrate K (alignment). )I do. Thereafter, the bonding head 35 is driven downward in the Z direction, and the chip C held by vacuum suction is mounted on the mounting location on the substrate K and is heated and pressurized.

  Subsequently, the dispensing operation in step S3 of FIG. 6 is performed. Details of step S3 are shown in FIG. In the dispensing apparatus 4, the first gate valve 42 is opened (step S 31), and the substrate K on which the chip C is mounted by the chip mounting apparatus 3 is carried into the chamber 52 by the substrate transfer means and placed on the movable stage 71. It is held (step S32). When the substrate K is carried into the chamber 52, the first gate valve 42 is closed (step S33).

  The on-off valve 62 is opened until the pressure in the chamber 52 reaches the set pressure P2. Thereby, the inside of the chamber 52 is gradually depressurized, and after the pressure reaches the set pressure P2 (step S34), the second correction amount for alignment is obtained as follows. That is, the stage drive unit 74 drives the movable stage 71 so that the chip C to be applied with the underfill agent is positioned below the camera 72 of the dispenser 73 (step S35). The camera 72 images the appearance or alignment mark of the chip C through the transparent window 54, and sends the image data to the control device 9 (step S36). The height of the camera 72 at this time is the board recognition height 72Hb.

  The control device 9 obtains the displacement between the position of the chip C and the reference chip position as the second correction amount based on the image data sent from the camera 72 (step S37). The chip position is a position when the chip C is ideally attached to the substrate K without displacement from a predetermined position.

  The movable stage 71 is driven in each of the X, Y, and θ directions based on the first correction amount obtained in step S06 and the second correction amount obtained in step S37, so that the dispenser 73 is in the chip C. Alignment is performed so that the optimal filling position can be filled with the underfill agent (step S38). The dispenser 73 is driven downward in the Z direction, discharges the underfill agent from the dispense nozzle 73N, and fills the gap between the substrate K and the chip C with the underfill agent (step S39). When the filling operation is finished, the dispenser 73 returns to the original position above the Z direction.

  Thus, according to the dispensing apparatus 4, the camera 72 displays an image of the dispensing nozzle 73N guided by the prism 75a that is driven and disposed below the dispensing nozzle 73N and the prism 75b that has the reflecting surface opposed to the prism 75a. The control device 9 calculates the first correction amount for calibration based on the image data obtained by the imaging. That is, the imaging camera 72 directly recognizes the position of the dispensing nozzle 73N in the dispenser 73. Thus, unlike the conventional method of obtaining the correction amount based on the position of the underfill agent discarded by the dispense nozzle 73N, the dropped underfill agent does not bleed over time, and the dispense nozzle The center position of 73N can be specified accurately. As a result, it is possible to accurately correct the position of the dispensing nozzle 73N with respect to the imaging camera 72.

  Further, the maximum height L2 of the reflecting surfaces of the two prisms 75a and 75b is the same, and is lower than the holding surface 71H as a reference for the height. On the other hand, the substrate K is held by vacuum suction on the holding surface 71H. Due to such a positional relationship, the displacement from the reference position can be obtained in a state where the dispensing nozzle 73N is brought close to the chip C mounted on the substrate K. Accordingly, since the maximum height L2 of the reflecting surfaces of the prisms 75a and 75b is arranged at a position lower than the holding surface 71H, the displacement of the position of the dispensing nozzle 73N that is generated when the actual underfill agent is discharged is more accurately measured. I can do it.

  Further, in the dispensing apparatus 4, the vacuum pump 46 depressurizes the inside of the pipe 68 connecting the storage unit 66 and the dispenser 73 to P2 before introducing the underfill agent from the storage unit 66 to the dispenser 73 (step S7, In step S3), the pipe 68 can be filled with the underfill agent in a state where there is no air accumulation in the pipe 68. As a result, the underfill agent can be prevented from entraining bubbles. Further, the vacuum pump 46 decompresses the inside of the chamber 52 to P2 prior to the discharge operation of the underfill agent by the dispenser 73 (see step S21, step S16, and step S17), so bubbles were included in the underfill agent. But it goes out. Therefore, the dispenser 73 can supply the substrate K with an underfill agent that does not contain bubbles.

  After the filling operation is completed, the substrate K is placed in the chamber 52 under a reduced pressure of the set pressure P2 for a predetermined time. Thereby, the penetration of the underfill agent into the gap between the substrate K and the chip C can be promoted, and the time required for the penetration can be shortened. When the predetermined time has elapsed (Yes in step S40), the release valve 47 is opened, and the inside of the chamber 52 returns to atmospheric pressure (step S41). Subsequently, the second gate valve 43 is opened (step S42), and the substrate K is unloaded (step S43).

  In the mounting operation described above, the heaters in the ovens 22 and 82, the standby stage 23, and the movable stages 31 and 71 are controlled so that the substrate K is kept at 80 to 120 ° C. Thereby, since the substrate K is kept at a predetermined temperature throughout substantially the entire mounting process including a series of steps, the substrate K can be prevented from absorbing moisture and warping due to a rapid temperature change. it can.

DESCRIPTION OF SYMBOLS 1 Mounting system 2 Substrate loader 3 Chip mounting device 4 Dispensing device 8 Substrate unloader 9 Control device 21 Substrate magazine 22 Oven 23 Standby stage 31 Movable stage 32 Chip stocker 34 Two field of view camera 35 Bonding head 42 First gate valve 43 Second gate Valve 46 Vacuum pump 47 Open valve 52 Chamber 54 Transparent window 62 Open / close valve 64 Open / close valve 65 Three-way valve 66 Storage means 68 Pipe 69 Check valve 71 Movable stage 72 Camera 73 Dispenser 75 Pressure sensor 76 Air cylinder 81 Substrate magazine 82 Oven 90 Controller L0 Horizontal distance L2 Maximum height 400 Dispensing device 460 Pressure reducing means 520 Chamber 710 Movable stage 71H Holding surface 720 Camera 7 30 Dispenser 73N Dispensing nozzle 740 Camera 75a Prism 75b Prism 72Ha Nozzle recognition height 72Hb Substrate recognition height 730N Dispensing nozzle

Claims (3)

A dispensing device that fills a gap between a substrate and a chip mounted on the substrate with an underfill agent under reduced pressure,
A movable stage for mounting and holding the substrate on which the chip is mounted;
A dispensing nozzle filled with the underfill agent;
Imaging means, and this imaging means,
A dispensing apparatus comprising: a function of recognizing the position of the mounted chip; and a function of recognizing an image of the position of the dispensing nozzle. When the imaging unit recognizes an image of the position of the dispense nozzle using a height changing unit that changes a height direction of the imaging unit and an optical path changing unit provided on a side wall of the movable stage, The dispensing apparatus according to claim 1, which has a function of moving to a focal position of the imaging unit. A dispensing nozzle calibration method provided in a dispensing apparatus that fills a gap between a substrate and a mounting chip mounted on the substrate with an underfill agent under reduced pressure,
The dispensing apparatus has a movable stage for placing and holding a substrate on which a chip is mounted, an optical path changing means provided on a side wall of the movable stage, a dispensing nozzle for discharging the underfill agent, the mounting chip, and the Imaging means for imaging the dispense nozzle,
Disposing the optical path changing means below the dispensing nozzle;
Moving the imaging means to a position where the dispensing nozzle can recognize an image via the optical path changing means;
Recognizing the dispensing nozzle with the imaging means, and obtaining a displacement amount from a dispensing nozzle reference position obtained from a design value of the dispensing apparatus and an actual dispensing nozzle position;
Dispensing nozzle calibration method comprising:

Images