JP2011020200A - System for cutting optical film and method for cutting the optical film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a system for cutting an optical film capable of suitably cutting the optical film, and also to provide a method for cutting the optical film. <P>SOLUTION: The optical films F11, F21 and adhesive layers F14, F24 are cut at a position opposite to a convex curved face 100a without cutting mold release films F12, F22 while the mold release films F12, F22 are made to abut on the convex curved face 100a of a pedestal 100 during applying tension to the optical films F11, F21 sent from rolled webs R1, R2. Accordingly, the ends of the optical films F11, F21 that are cut are held to be set apart from each other after cutting by the tension applied to the optical films F11, F21, so that the ends of the optical films F11, F21 are prevented from causing deterioration of the respective ends of the optical films F11, F21 by contacting with each other and from generating foreign matters by chipped paste, and the optical films F11, F21 can be suitably cut. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an optical film cutting system and an optical film cutting method for feeding the optical film from a roll original formed by winding the optical film in a roll shape and cutting the optical film into a predetermined size.

  In JP-A-2006-142445 (Patent Document 1), as an example of an aspect when cutting an optical film, the optical film is placed on a placement surface of a pedestal 14 having a convex curved surface. A method for cutting an optical film is disclosed. In the said patent document 1, although the case where the optical film of a sheet | seat is cut | disconnected is described, it is not described about the case where an optical film is sent out from a roll original fabric and cut | disconnected.

  In JP 2007-260865 A (Patent Document 2), a horizontal cut cradle 80 is provided by a round blade that feeds the photosensitive laminate film 22 from the roll 22a and moves along the width direction orthogonal to the conveying direction. A method for cutting (half-cutting) the photosensitive laminate film 22 while leaving a part thereof is disclosed.

JP 2006-142445 A JP 2007-260865 A

  In the method as described in Patent Document 1, the cutting blade 13 is lowered from above and cut while pressing the optical film in a state where the elastic body 15 is pressed on both sides across the cutting position of the optical film of the single wafer. In this case, the optical film is held on the pedestal 14 only by the elastic body 15, and the force for holding the position does not act on the optical film itself. Therefore, the pressing force of the elastic body 15 on both sides of the cutting position with respect to the optical film is not affected. Depending on the balance, the cutting position may be shifted. In particular, when the slope of the portion facing the elastic body on the convex curved surface of the pedestal 14 is steep, the elastic body 15 may be greatly displaced along the convex curved surface when pressing the optical film. In this case, the optical film cannot be pressed well, and there is a high possibility that the cutting position is greatly shifted.

  Moreover, in Patent Document 1, it is described that the elastic body 15 is provided in the cutting machine via a spring mechanism in order to prevent the optical film from being excessively pressed, but such a configuration is adopted. When the pressing force of the elastic body 15 against the optical film is relaxed, the pressing force of the elastic body 15 on both sides sandwiching the cutting position with respect to the optical film increases, and the cutting position may be greatly shifted.

  On the other hand, in the method as in Patent Document 2, the photosensitive laminate film 22 is cut (half-cut) on the horizontal cut receiving base 80 instead of on the convex curved surface as in Patent Document 1. In this case, the cut surfaces become rough due to contact between the cut surfaces during cutting. For example, when the pressure-sensitive adhesive layer is cut together, the pressure-sensitive adhesive layers on the cut surfaces attract each other and are not glued or pulled on the pressure-sensitive adhesive layer. There is a risk that marks will be left behind. This problem will be described below with reference to the drawings.

  FIG. 7 is a schematic side view showing an example of the cutting device 6 for the optical film F31 fed out from the roll roll R, and shows a case where the optical film F31 is cut on the horizontal placement surface 200a. The cutting device 6 includes a pedestal 200, a cutter 201, and a pressing member 202. The upper surface of the pedestal 200 forms a horizontal placement surface 200a, and a part of the optical film F31 fed from the roll original fabric R is placed on the placement surface 200a. The optical film F31 is cut by the cutter 201 at a position facing the pedestal 200. The cutter 201 is composed of a round blade having a blade formed over the entire outer periphery of the disc, and the circular blade is slid (running) on the optical film F31 in a direction orthogonal to the transport direction of the optical film F31. The optical film F31 is cut. When the optical film F31 is cut, the optical film F31 is pressed toward the mounting surface 200a side of the pedestal 200 from above by a pair of pressing members 202 provided on both sides of the cutter 201. The pressing member 202 is made of an elastic member such as rubber.

  FIG. 8 is a schematic side view showing an example of a possible aspect of the optical film F31. When cutting the optical film F31, first, as shown in FIG. 8A, in a state where the optical film F31 is placed on the placement surface 200a of the base 200, the optical film F31 is pressed by a pair. The member 202 is pressed toward the mounting surface 200a side of the base 200 from above. Note that a release film F32 is bonded to the optical film F31 via an adhesive layer, and the release film F32 is placed so as to be in contact with the placement surface 200a of the pedestal 200.

  In this state, as shown in FIG. 8B, the cutter 201 is on the optical film F31 in a state orthogonal to the conveying direction of the optical film F31 with the tip of the cutter 201 in contact with the surface of the optical film F31. The optical film F31 is cut by sliding (running). In this example, the release film F32 is not cut, and the optical film F31 and the pressure-sensitive adhesive layer are cut (half cut). Thus, when the optical film F31 is cut, the tip of the cutter 201 enters the optical film F31, so that the optical films F31 on both sides sandwich the cutting position and slide slightly in the direction away from the cutting position. To do. Therefore, as shown in FIG. 8B, the tip of each pressing member 202 that presses the optical film F31 is curved in a direction away from the cutting position, and the release film F32 that is not cut is outside. It becomes the state pulled toward.

  Thereafter, as shown in FIG. 8 (c), when the cutter 201 is retracted, and as shown in FIG. 8 (d), each pressing member 202 is retracted upward, the release film F32 that is not cut is removed. Tension is released. Therefore, as shown in FIG.8 (d), the edge parts of the cut | disconnected optical film F31 may slide toward the direction which mutually approaches, and may contact. In such a case, as described above, the cut surfaces become rough due to contact between the cut surfaces, and the adhesive layer of the cut surfaces attracts each other to cause glue chipping, or a mark is generated on the pressure-sensitive adhesive layer, resulting in blemishes, There is a risk of becoming.

  This invention is made | formed in view of said situation, Comprising: It aims at providing the optical film cutting system and optical film cutting method which can cut | disconnect an optical film more favorably.

  As a result of intensive studies in order to solve the above problems, the present invention has been completed.

  The optical film cutting system according to the first aspect of the present invention is an optical film cutting system for feeding the optical film from a roll original formed by winding the optical film into a roll shape and cutting it into a predetermined size. And applying a tension to the optical film fed from the roll material while transporting the optical film, and attaching the tension to the optical film applied by the transport device via an adhesive layer. A cutting device that cuts the optical film and the adhesive layer without cutting the combined release film, and the cutting device includes a pedestal on which a convex curved surface is formed, and a convex curved surface of the pedestal A cutter that cuts the optical film and the pressure-sensitive adhesive layer at a position facing the convex curved surface in a state of contacting the release film. And features.

  According to this configuration, in the state where the release film is brought into contact with the convex curved surface of the pedestal while applying tension to the optical film fed out from the roll, the optical film is not cut. The adhesive layer can be cut at a position facing the convex curved surface. Thereby, the edge parts of the cut | disconnected optical film are hold | maintained in the state mutually separated after the cutting | disconnection by the tension | tensile_strength provided to the said optical film. Therefore, the ends of the cut optical film are in contact with each other, and it is possible to prevent each end of the optical film from being deteriorated and foreign matter from being generated due to the chipping of the adhesive. Can be cut.

  Moreover, the tension | tensile_strength can be given to an optical film, and the said optical film can be cut | disconnected in the state pressed on the convex-curved surface side of the base. Thereby, it is possible to prevent the optical film from being displaced during cutting, and to cut the optical film with high accuracy. In particular, by cutting the optical film and the pressure-sensitive adhesive layer without cutting the release film, the position of the optical film and the pressure-sensitive adhesive layer can be held by the release film, so that it is not necessary to hold the vicinity of the cutting position. The optical film can be cut with high accuracy.

  The optical film cutting system according to a second aspect of the present invention is characterized in that the cutting device has a pressing member that is disposed on both sides of the cutting position of the optical film and presses the optical film to the pedestal side. To do.

  According to this configuration, the optical film is effectively prevented from being displaced by pressing the optical film to the pedestal side with the pressing members disposed on both sides across the cutting position, and the optical film is further accurately Can be cut well.

  The optical film cutting system according to a third aspect of the present invention is characterized in that the cutting device cuts the optical film and the adhesive layer by sliding the cutter in the width direction of the optical film.

  According to this structure, the contact area with respect to the optical film of a cutter can be made small compared with the structure which presses and cuts an optical film with a cutter from upper direction. In the configuration in which the optical film is pressed and cut from above with a cutter, it is difficult to reduce the dimensional error over the entire longitudinal direction of the cutter along the width direction of the optical film, so the optical film of the cutter as in the present invention. By reducing the contact area with respect to the dimensional error in the contact area, the optical film can be cut with high accuracy.

  An optical film cutting method according to a fourth aspect of the present invention is an optical film cutting method for feeding the optical film out of a roll original formed by winding the optical film into a roll shape and cutting it into a predetermined size. A transfer step of transferring the optical film while applying tension to the optical film fed from the roll material, and affixing the optical film to which the tension is applied by the transfer step via an adhesive layer. A cutting step for cutting the optical film and the pressure-sensitive adhesive layer without cutting the combined release film. In the cutting step, a convex curved surface formed on a pedestal is brought into contact with the release film. In this state, the optical film and the adhesive layer are cut with a cutter at a position facing the convex curved surface.

  According to this structure, the optical film cutting method which has an effect similar to the optical film cutting system which concerns on 1st this invention can be provided.

  The optical film cutting method according to a fifth aspect of the present invention is characterized in that, in the cutting step, the optical film is pressed to the pedestal side by pressing members arranged on both sides of the cutting position of the optical film. To do.

  According to this structure, the optical film cutting method which has an effect similar to the optical film cutting system which concerns on 2nd this invention can be provided.

  The optical film cutting method according to a sixth aspect of the present invention is characterized in that, in the cutting step, the optical film and the pressure-sensitive adhesive layer are cut by sliding the cutter in the width direction of the optical film.

  According to this structure, the optical film cutting method which has an effect similar to the optical film cutting system which concerns on 3rd this invention can be provided.

The figure for demonstrating an example of the laminated structure of a 1st, 2nd optical film Schematic side view showing one configuration example of the conveying device and the cutting device The schematic side view which showed an example of the aspect at the time of cut | disconnecting an optical film with the cutting device of FIG. The schematic perspective view which showed an example of the aspect at the time of cut | disconnecting an optical film with the cutting device of FIG. Distribution diagram of dimensional accuracy when a sheet product is half-cut on a convex curved surface similar to the apparatus shown in FIGS. Distribution diagram of dimensional accuracy when a sheet product is fully cut on a convex curved surface similar to the apparatus shown in FIGS. Schematic side view showing an example of a cutting device for an optical film fed from a roll material The schematic side view which showed an example of the aspect considered as a cutting | disconnection aspect of an optical film

  One embodiment of the present invention will be described below. FIG. 1 is a diagram for explaining an example of a laminated structure of first and second optical films.

(Optical film)
Examples of the optical films F11 and F21 cut by the present invention include a polarizing film, a retardation film, a brightness enhancement film, and a combination laminated film of two or more of these films. Adhesive layers F14 and F24 are formed on one surface of the optical films F11 and F21 so as to be attached to the optical display unit W. A release film F12 for protecting the adhesive layers F14 and F24, F22 is provided. Further, surface protective films F13 and F23 are provided on the other surfaces of the optical films F11 and F21 via pressure-sensitive adhesive layers F15 and F25. Specific configurations of these films will be described later. Hereinafter, the optical films F11 and F21 in which the surface protective films F13 and F23 and the release films F12 and F22 are laminated may be referred to as sheet products F1 and F2. However, the structure in which the pressure-sensitive adhesive layers F15 and F25 and the surface protection films F13 and F23 are omitted may be employed.

  As shown in FIG. 1, the first optical film F11 includes a first polarizer F11a, a first film F11b provided on one side of the first optical film F11 via an adhesive layer (not shown), and an adhesive layer on the other side. It is comprised with the 2nd film F11c provided through (not shown). Similarly, the second optical film F21 includes a second polarizer 21a, a third film F21b provided on one surface of the second polarizer 21a via an adhesive layer (not shown), and an adhesive layer (not shown) on the other side. It is comprised with the 4th film F21c provided through this. However, the laminated structure of the second sheet product F2 may not be the same configuration as the first sheet product F1.

  The first and second films F11b and F11c are, for example, polarizer protective films (for example, triacetyl cellulose film, PET film, etc.). The second film F11c is bonded to the optical display unit surface side via the first pressure-sensitive adhesive layer F14. A surface treatment can be applied to the first film F11b. Examples of the surface treatment include a hard coat treatment, an antireflection treatment, a treatment for the purpose of prevention of sticking, diffusion or antiglare, and the like. The first release film F12 is bonded to the second film F11c via the first pressure-sensitive adhesive layer F14. Further, the surface protective film F13 is bonded to the first film F11b through the adhesive layer F15. However, a configuration in which the polarizer protective film is provided only on the surface opposite to the first release film F12 side by omitting the second film F11c may be used.

  The third and fourth films F21b and F21c are, for example, polarizer protective films (for example, triacetyl cellulose film, PET film, etc.). The fourth film F21c is bonded to the optical display unit surface side via the second pressure-sensitive adhesive layer F24. The third film F21b can be subjected to a surface treatment. Examples of the surface treatment include a hard coat treatment, an antireflection treatment, a treatment for the purpose of prevention of sticking, diffusion or antiglare, and the like. The second release film F22 is bonded to the fourth film F21c via the second pressure-sensitive adhesive layer F24. Further, the surface protective film F23 is bonded to the third film F21b through the adhesive layer F25. However, a configuration in which the polarizer protective film is provided only on the surface opposite to the second release film F22 side by omitting the fourth film F21c may be employed.

In this embodiment,
A first roll raw material formed by winding the belt-shaped first sheet product F1 in a roll shape, and a second roll formed by winding the belt-shaped second sheet product F2 in a roll shape. An original fabric is prepared. The widths of the first roll original fabric and the second roll original fabric depend on the bonding size of the optical display unit W, and are formed with different widths.

  The prepared first roll original is held rotatably, and the first sheet product F1 is fed out while rotating the first roll original using the first conveying device, so that the first sheet product F1 is on the downstream side. It is conveyed to. Similarly, the prepared second roll original is held rotatably, and the second sheet product F2 is fed out while rotating the second roll original using the second conveying device, whereby the second sheet product F2. Is conveyed downstream. A first cutting device and a second cutting device are provided in the middle of the conveyance path. The first optical film F11 is cut by the first cutting device, and the second optical film F21 is cut by the second cutting device. Is done.

  The first cutting device includes a first optical film F11 on which the first release film F12 is bonded without cutting the first release film F12, and a surface bonded on the first optical film F11. The protective film F13 is cut into a predetermined size. At this time, the adhesive layer F14 formed between the first release film F12 and the first optical film F11 is also cut. Examples of the cutting means include a cutter and other known cutting means.

  The 2nd cutting device does not cut | disconnect the 2nd mold release film F22, but the 2nd optical film F21 by which the said 2nd mold release film F22 was bonded together, and the surface bonded by the 2nd optical film F21 The protective film F23 is cut into a predetermined size. At this time, the pressure-sensitive adhesive layer F24 formed between the second release film F22 and the second optical film F21 is also cut. Examples of the cutting means include a cutter and other known cutting means.

  The first optical film F11 cut as described above is bonded to one surface of the optical display unit W via the pressure-sensitive adhesive layer F14 by the first bonding device after removing the first release film F12. be able to. Moreover, after the 2nd release film F22 is removed, the cut | disconnected 2nd optical film F21 can be bonded by the 2nd bonding apparatus to the other surface of the optical display unit W via the adhesive layer F24. . However, the process of bonding the optical films F11 and F21 to the optical display unit W is not limited to the structure performed continuously in the cutting process, and may be performed separately. That is, the optical films F11 and F21 cut as described above may be circulated and bonded to the optical display unit W at a place different from that at the time of cutting.

  In the first and second cutting steps, the method of cutting other members of the sheet products F1 and F2 (half-cut method) without cutting the release films F12 and F22 has been described. According to such a configuration, the optical films F11 and F21 and the pressure-sensitive adhesive layer F14 can be obtained without cutting the release films F12 and F22 bonded to the optical films F11 and F21 via the pressure-sensitive adhesive layers F14 and F24. F24 can be cut and the release films F12 and F22 can be peeled from the optical films F11 and F21 before the bonding process to the optical display unit W. That is, since the adhesive layers F14 and F24 which are the bonding surfaces of the optical films F11 and F21 can be configured not to be exposed until just before the bonding, foreign matters are mixed into the bonding surfaces of the optical films F11 and F21. Can be prevented.

  In particular, by cutting the optical films F11 and F21 and the adhesive layers F14 and F24 without cutting the release films F12 and F22, the cut optical films F11 and F21 using the release films F12 and F22 as carriers. The pressure-sensitive adhesive layers F14 and F24 can be transported. Therefore, since the transport device for the optical films F11 and F21 can be configured more simply, the manufacturing cost of the optical display device can be further reduced.

(Optical display unit)
Examples of the optical display unit W to which the first optical film F11 or the second optical film F21 cut according to the present invention is bonded include a glass substrate unit of a liquid crystal cell, an organic EL light emitting unit, and the like.

  FIG. 2 is a schematic side view showing an example of the configuration of the conveying devices 12 and 22 and the cutting devices 16 and 26. In the following description, a case will be described in which the first transport device 12 and the first cutting device 16 and the second transport device 22 and the second cutting device 26 have the same configuration. However, it is not limited to such a configuration, and only one of the first transport device 12 and the first cutting device 16 or the second transport device 22 and the second cutting device 26 has a configuration as described below. You may have.

  The first roll original fabric R1 is formed by winding the first sheet product F1 in a roll shape around the core A1. Similarly, the second roll raw fabric R2 is formed by winding the second sheet product F2 around the core A2 in a roll shape.

  The conveying devices 12 and 22 include one or a plurality of rollers, and convey the sheet products F1 and F2 sent out from the rolls R1 and R2 by the rollers. A predetermined tension is applied to the sheet products F1 and F2 delivered from the rolls R1 and R2 directly by the rolls R1 and R2 or indirectly by the roller. This tension may be directly applied to the optical films F11 and F21, and the tension acting on the release films F12 and F22 is applied to the optical films F11 and F21 via the adhesive layers F14 and F24. May also be provided.

  The cutting devices 16 and 26 include a pedestal 100 on which a convex curved surface 100a is formed, a cutter 101 that can be cut at a position facing the convex curved surface 100a of the pedestal 100, and transporting the cutter 101 to sheet products F1 and F2. And a pair of pressing members 102 disposed on both sides across the direction. In this example, the pedestal 100 is disposed such that the convex curved surface 100 a faces upward, and the pressing member 102 is disposed above the pedestal 100.

  As the cutter 101, a round blade in which a blade is formed over the entire outer periphery of the disk can be employed. In this case, the front end of the cutter 101 made of the round blade is in contact with the sheet products F1 and F2, and is parallel to the sheet products F1 and F2 and perpendicular to the conveying direction of the sheet products F1 and F2. By sliding (running) the cutter 101 in the direction (width direction), the optical films F11 and F21 can be cut well. However, the cutter 101 is not limited to the configuration in which the round blade slides, and may be configured to cut with a blade other than the round blade or other cutting means.

  The convex curved surface 100a of the pedestal 100 extends from one end to the other end in the width direction of the sheet products F1 and F2 in a direction perpendicular to the transport direction of the sheet products F1 and F2, and is convex along the transport direction. It has a curved shape. Part of the sheet products F1 and F2 sent out from the rolls R1 and R2 by the conveying devices 12 and 22 are placed on the convex curved surface 100a of the base 100. At this time, the release films F12 and F22 bonded to the optical films F11 and F21 via the adhesive layers F14 and F24 come into contact with the convex curved surface 100a of the base 100 so as to be pressed from above, The sheet products F1 and F2 are curved along the convex curved surface 100a.

  In the example of FIG. 2, the entire convex curved surface 100a of the pedestal 100 is configured to abut against the release films F12 and F22, that is, curved at a position where the curvature of the convex curved surface 100a faces the convex curved surface 100a. The configuration is the same as the curvature of the sheet products F1 and F2 to be performed. However, the configuration is not limited to this, and a configuration in which only a part of the convex curved surface 100a abuts on the release films F12 and F22 may be employed. In this case, the curvature of the convex curved surface 100a may be smaller than the curvature of the sheet products F1 and F2 that are curved at a position facing the convex curved surface 100a.

  At the time of cutting, the surface protective films F13 and F23, and the adhesive layer are cut by the cutter 101 at a position facing the convex curved surface 100a in a state where the convex curved surface 100a of the base 100 is in contact with the release films F12 and F22. F15 and F25, the optical films F11 and F21, and the adhesive layers F14 and F24 are cut in the width direction (direction parallel to the cores A1 and A2). At this time, the release films F12 and F22 are not cut, but are cut in the above-described half-cut mode.

  The pair of pressing members 102 are disposed so as to extend in the width direction on both sides of the cutting position of the optical films F11 and F21. When not cutting, the pair of pressing members 102 are retracted upward so as not to contact the sheet products F1 and F2. At the time of cutting, the pair of pressing members 102 approaches the pedestal 100 side and presses the optical films F11 and F21 from the upper side toward the convex curved surface 100a side of the pedestal 100 via the surface protective films F13 and F23. . The pressing member 102 is formed of an elastic member such as rubber.

  In this embodiment, the release films F12 and F22 are brought into contact with the convex curved surface 100a of the pedestal 100 while applying tension to the optical films F11 and F21 fed from the rolls R1 and R2. Without cutting the mold films F12 and F22, the optical films F11 and F21 and the adhesive layers F14 and F24 can be cut at a position facing the convex curved surface 100a. Thereby, the edge parts of the cut | disconnected optical films F11 and F21 are hold | maintained in the state mutually separated after the cutting | disconnection by the tension | tensile_strength provided to the said optical films F11 and F21. Therefore, the ends of the cut optical films F11 and F21 are in contact with each other, and it is possible to prevent each end of the optical films F11 and F21 from being deteriorated, and foreign matter can be prevented from being generated due to adhesive chipping. The optical films F11 and F21 can be cut more favorably.

  Further, by applying tension to the optical films F11 and F21, the optical films F11 and F21 can be cut in a state of being pressed toward the convex curved surface 100a side of the base 100. Thereby, it can prevent that position shift of optical film F11, F21 arises at the time of a cutting | disconnection, and can cut optical film F11, F21 accurately. In particular, the optical films F11 and F21 and the adhesive layers F14 and F24 are cut by the release films F12 and F22 by cutting the optical films F11 and F21 and the adhesive layers F14 and F24 without cutting the release films F12 and F22. Thus, the optical film can be accurately cut without pressing the vicinity of the cutting position. That is, the pressing member 102 can be omitted.

  However, as in the present embodiment, if the optical films F11 and F21 are pressed toward the pedestal 100 with the pressing members 102 arranged on both sides of the cutting position, the positional deviation of the optical films F11 and F21 occurs. Therefore, the optical films F11 and F21 can be cut more accurately.

  Furthermore, in this embodiment, compared with the structure which presses and cut | disconnects optical film F11, F21 from upper direction with a cutter, the contact area with respect to optical film F11, F21 of the cutter 101 can be made small. In the configuration in which the optical films F11 and F21 are pressed and cut from above with a cutter, it is difficult to reduce the dimensional error over the entire longitudinal direction of the cutter along the width direction of the optical films F11 and F21. By reducing the contact area of the cutter 101 with respect to the optical films F11 and F21 as described above, the dimensional error in the contact area can be effectively reduced, and the optical film can be cut accurately.

  FIG. 3 is a schematic side view showing an example of an aspect when the optical films F11 and F21 are cut by the cutting devices 16 and 26 of FIG. FIG. 4 is a schematic perspective view showing an example of an aspect when the optical films F11 and F21 are cut by the cutting devices 16 and 26 of FIG. When cutting the optical films F11 and F21, first, as shown in FIGS. 3A and 4A, the sheet products F1 and F2 are placed on the convex curved surface 100a of the base 100. The sheet products F1 and F2 are pressed from above by the pair of pressing members 102 toward the convex curved surface 100a side of the base 100.

  In this state, as shown in FIGS. 3B and 4B, the optical films F11 and F21 are cut by sliding in the width direction with the cutter 101 in contact with the sheet products F1 and F2. The At this time, the release films F12 and F22 are not cut. Thus, when the optical films F11 and F21 are cut, the tip of the cutter 101 enters the optical films F11 and F21, so that the optical films F11 and F21 on both sides move away from the cutting positions with the cutting position in between. Slide slightly in the direction. Therefore, as shown in FIG.3 (b), the front-end | tip part of each press member 102 which is pressing optical film F11, F21 curves toward the direction away from a cutting position, and is not cut | disconnected release film F12 , F22 is pulled outward.

  After cutting the optical films F11 and F21 as described above, the cutter 101 is retracted as shown in FIGS. 3 (c) and 4 (c). Thereafter, as shown in FIGS. 3D and 4D, the pressing force of each pressing member 102 on the optical films F11 and F21 is released by retracting each pressing member 102 upward.

  In this embodiment, the pressing member 102 is cut by cutting the optical films F11 and F21 and the adhesive layers F14 and F24 in a state where tension is applied to the release films F12 and F22 that are in contact with the convex curved surface 100a of the pedestal 100. Even after the retreat, as shown in FIGS. 3D and 4D, the ends of the cut optical films F11 and F21 can be held in a state of being well separated. . Therefore, the contact between the ends of the cut optical films F11 and F21 can be effectively prevented, and the optical films F11 and F21 can be cut better.

  However, in the said embodiment, although the structure where the convex curved surface 100a of the base 100 contact | abuts from the downward direction with respect to the release films F12 and F22 is shown, it is not restricted to such a structure, For example, of the base 100 For example, the convex curved surface 100a may be in contact with the release films F12 and F22 from above.

  In the following, when the optical films F11 and F21 are cut on the convex curved surface using the apparatus as shown in FIGS. 2 to 4 (Example), and on the plane using the apparatus as shown in FIGS. About the case where the optical films F11 and F21 are cut (comparative example), the experimental results performed while changing the tension applied to the optical films F11 and F21 will be described.

First, Table 1 below shows experimental results when the optical films F11 and F21 are cut on the convex curved surface using an apparatus as shown in FIGS. As can be seen from Table 1, when a tension of 200 N or more is applied to the optical films F11 and F21, the optical films F11 and F21 are broken. Moreover, when the tension | tensile_strength provided to optical film F11, F21 is less than 35N, the comparatively big glue chip | tip and the trace of a lot of adhesives will arise in the cut optical film F11, F21. Therefore, the tension applied to the optical films F11 and F21 is preferably 35N or more and less than 200N. Moreover, if the tension | tensile_strength provided to optical film F11, F21 is 50N or more and 150N or less, neither a chipping paste nor the trace of an adhesive will arise, and it is more preferable.

Table 2 below shows experimental results when the optical films F11 and F21 are cut on a plane using an apparatus as shown in FIGS. As can be seen from Table 2, even when the experiment was conducted under the same conditions as in Table 1 above, when the tension applied to the optical films F11 and F21 was 35 N, a large chipping and a large amount of adhesive were pulled. Not only will the marks be left, but the cut surface will also become dirty. Further, even when the tension applied to the optical films F11 and F21 is in the range of 35N or more and less than 200N, the cut surface has irregularities and a relatively large amount of pressure-sensitive adhesive traces. Thus, it can be seen that the optical films F11 and F21 can be cut better when the optical films F11 and F21 are cut on the convex curved surface than when the optical films F11 and F21 are cut on a flat surface.

  Next, when the sheet products F1 and F2 are half-cut on the convex curved surface using the apparatus shown in FIGS. 2 to 4 (Example), the sheet products F1 and F2 are completely formed on the same convex curved surface. Compared with the case of cutting (full cut) (comparative example). FIG. 5 shows a distribution diagram of dimensional accuracy when the sheet products F1 and F2 are half-cut on a convex curved surface similar to the apparatus shown in FIGS. FIG. 6 shows a distribution diagram of dimensional accuracy when the sheet products F1 and F2 are fully cut on the same convex curved surface as the apparatus shown in FIGS. 5 and 6, the median standard value is 40 mm.

  As can be seen from the experimental results shown in FIG. 5 and FIG. 6, the median value of the standard values when the sheet products F1 and F2 are half-cut (FIG. 5) than when they are full-cut (FIG. 6). Neighboring sizes can be easily obtained, and variations in size are small. From this experimental result, it can be seen that the sheet products F1 and F2 that are half-cut on the convex curved surface can be cut more accurately than the full-cut case.

DESCRIPTION OF SYMBOLS 12 1st conveying apparatus 16 1st cutting apparatus 22 2nd conveying apparatus 26 2nd cutting apparatus 100 Base 100a Convex-curved surface 101 Cutter 102 Press member F11 1st optical film F12 1st release film F14 1st adhesive layer F21 1st 2 optical film F22 2nd release film F24 2nd adhesive layer R1 1st roll original fabric R2 2nd roll original fabric

Claims (6)

An optical film cutting system for sending out the optical film from a raw roll formed by winding the optical film into a roll, and cutting the film into a predetermined size,
A transporting device for transporting the optical film while applying tension to the optical film fed from the roll material;
The release film bonded via the adhesive layer to the optical film to which tension is applied by the transport device is provided with a cutting device that cuts the optical film and the adhesive layer without cutting.
The optical film and the adhesive at the position where the cutting device faces the convex curved surface in a state where the convex curved surface of the base is formed and the convex curved surface of the base is in contact with the release film An optical film cutting system comprising: a cutter for cutting a layer.   2. The optical film cutting system according to claim 1, wherein the cutting device includes pressing members that are arranged on both sides of the cutting position of the optical film and press the optical film toward the pedestal.   The optical film cutting system according to claim 1 or 2, wherein the cutting device cuts the optical film and the pressure-sensitive adhesive layer by sliding the cutter in the width direction of the optical film. An optical film cutting method for feeding out the optical film from a roll original formed by winding the optical film into a roll, and cutting the film into a predetermined size,
A transporting step for transporting the optical film while applying tension to the optical film fed from the roll material;
A cutting step of cutting the optical film and the pressure-sensitive adhesive layer without cutting the release film bonded via the pressure-sensitive adhesive layer to the optical film to which tension is applied by the transporting step;
In the cutting step, the optical film and the adhesive layer are cut by a cutter at a position facing the convex curved surface in a state where the convex curved surface formed on the pedestal is in contact with the release film. An optical film cutting method.   5. The optical film cutting method according to claim 4, wherein, in the cutting step, the optical film is pressed toward the pedestal side by pressing members disposed on both sides of the cutting position of the optical film.   The optical film cutting method according to claim 4 or 5, wherein, in the cutting step, the optical film and the pressure-sensitive adhesive layer are cut by sliding the cutter in the width direction of the optical film.

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