JP2011019501A - Seeding method and seeding apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a seeding apparatus capable of automatically forming bed soil composed of burned earth, sowing and forming a cover soil layer composed of the burned earth, and sufficiently express effect of using the burned earth. <P>SOLUTION: The seeding apparatus is configured to include a hopper for storing the bed soil, cover soil and seeds and delivering each of those components at a certain speed. After killing seeds of weeds and living bodies causing for damage by pest insects included in the soil, the soil is put into the hopper to form the bed soil and cover soil and sow the seeds. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a sowing apparatus for sowing seeds of agricultural crops in a field and a sowing method using the sowing apparatus, and more particularly to a method of suppressing the generation of weeds and pest damage after sowing.

  Organic farming that does not use chemicals such as chemical fertilizers and herbicides has been proposed and practiced for the purpose of environmental preservation and food safety. Fertilizers can be dealt with by using compost etc., but there are problems in growing crops without using other chemicals, such as measures against pests and weeding.

  As a coping method, it is known that performing treatment such as heating the soil to kill the seeds of weeds and living organisms that are the source of pests and diseases will have a certain effect. As an example of such a method, Patent Document 1 discloses that soil that may be contaminated with pathogenic bacteria, weed seeds, pests, grass roots, and the like is pulverized and then treated with thermal power to obtain a burned clay. Technology is disclosed. However, what is disclosed here is a process in which a single device is used to perform a series of steps of returning to the field after cultivating the soil while plowing the soil, and the device becomes large and expensive. There is.

  In order to ensure the effect of using the clay, when sowing, seeds are sown on the layer of the clay that has been formed to a certain thickness, and seeds are then seeded with a certain thickness of the clay. It needs to be covered, and it takes a lot of trouble. As a technique for coping with this, Patent Document 2 discloses a seeding device that can automatically supply floor soil, seeds, and covering soil. However, this document does not necessarily disclose ten mechanisms for effectively using the clay.

  JP 2000-125742 A   JP 2009-095250 A

  Therefore, the problem of the present invention is that it is possible to automatically perform the formation and sowing of a floor soil layer made of baked earth, and the formation of a cover soil layer also made of baked earth, and sufficiently exhibit the effect of using the baked earth. It is to provide a sowing device.

  In order to solve the above-mentioned problems, the present invention provides a seeding device capable of simply forming, sowing, and forming a soil covering layer, and a soil layer and a soil covering layer that can effectively use a clay. This is a result of studying the structure of the seeding device necessary for realizing the structure.

  That is, the present invention includes a first hopper for storing floor soil, a second hopper for storing cover soil, a third hopper for storing seeds, and a means for pulling the three hoppers. A function to form a floor soil layer having a certain thickness by discharging the floor soil from the hopper of the above, a function to sow on the floor soil layer by the third hopper, from the second hopper The sowing apparatus has a function of discharging the covering soil and forming a covering soil layer that covers the seeded floor soil layer in a band shape with a constant thickness.

  Further, the present invention is the sowing apparatus, wherein the discharge port of the first hopper has means for forming a groove having a certain depth and width in the field soil.

  The seeding device as described above, wherein the second hopper is provided with a pressure reducing roller.

  Further, the present invention provides a heat treatment to the floor soil and the covering soil, thereby killing a living body that hinders crop growth, including seeds of weeds and pathogens, and then using the seeding device, the heat treatment. A floor soil layer having a constant thickness is formed of the floor soil that has been subjected to the treatment, seeded on the floor soil layer, and further formed into a strip shape having the constant thickness of the cover soil that has been subjected to the heat treatment. It is a sowing method characterized by forming a covering soil layer.

  Alternatively, the present invention is the sowing method, wherein the groove has a depth of 10 to 50 mm and a width of 30 to 100 mm.

  In the seeding device of the present invention, means for forming a groove having a certain depth and width in the field soil is provided at the portion of the floor soil outlet, so that a floor soil layer and a cover soil layer are formed in the groove. It is possible to obtain a floor soil layer and a cover soil layer made of baked earth that do not easily flow out or collapse, and sowing can be performed between the two layers.

  Therefore, weeds can no longer be germinated in the section of the sown soil that has been sown, and weeding can be done only with the interstice using an existing weeder. No weeding is required. In addition, since the soil is sterilized and disinfected by heating in advance, the occurrence of pest damage can be suppressed.

  The figure which shows an example of the seeder which concerns on embodiment of this invention, FIG. 1 (a) is sectional drawing of a side, FIG.1 (b) is a front view.   Sectional drawing of the floor soil layer and cover soil layer which were formed with the sowing apparatus of this invention.

  Next, embodiments of the present invention will be described with reference to specific drawings. FIG. 1 is a view showing an example of a seeding apparatus according to an embodiment of the present invention, FIG. 1 (a) is a side sectional view, and FIG. 1 (b) is a front view. Moreover, FIG. 2 is the figure which showed typically the cross section of the floor soil layer and cover soil layer which were formed with the sowing apparatus of this invention.

  1 and 2, 1 is a seeding device, 2 is a first hopper that stores floor soil, 3 is a second hopper that stores covering soil, 4 is a third hopper that stores seeds, and 5 is floor soil. A discharge port, 6 is a cover discharge port, 7 is a seed discharge port, 8a and 8b are stirring devices, 9 is a blade for forming grooves in the field soil, 10 is a pressure reducing roller, 11 is field soil, and 12 is a floor soil layer. , 13 is a cover layer, and 14 is a seed. In addition, the arrow of FIG. 1 shows the advancing direction of the sowing apparatus 1.

  This seeding device is pulled by an external traction device such as a tractor, and the field soil 11 is dug up in a direction perpendicular to the traveling direction by a blade 9 provided at a portion of the floor soil discharge port 5 to form a groove. Is done. After pouring from the respective hoppers in the order of floor soil, seed, and covering soil into the groove, the surface is smoothed by the pressure-reducing roller 10, and the structure as shown in FIG. 2 can be obtained.

  In addition, since the seeds of weeds buried in the deep part are difficult to germinate, the depth and width into which the clay is poured, that is, the optimum value of the depth and width of the groove is empirically a depth of 10 to 50 mm, The inventor has grasped that the width is about 30 to 100 mm.

  As described above, according to the present invention, it is possible to provide a sowing apparatus and a method of using the sowing apparatus that can suppress weeds and pest damage by using the clay, and contribute to the development of organic agriculture. Can do. It should be noted that the present invention is not limited to the above-described embodiment, and can be conceived by those having ordinary knowledge in the field of the present invention, and design changes within a range not departing from the gist including various modifications and corrections Of course, the present invention is included in the present invention.

DESCRIPTION OF SYMBOLS 1 Sowing apparatus 2 1st hopper 3 2nd hopper 4 3rd hopper 5 Floor soil discharge port 6 Cover soil discharge port 7 Seed discharge port 8a, 8b Agitation device 9 Blade 10 Pressure reduction roller 11 Field soil 12 Floor soil layer 13 Cover soil Layer 14 seed

Claims (5)

  A first hopper for storing floor soil; a second hopper for storing covering soil; a third hopper for storing seed; and means for pulling the three hoppers; A function of discharging and forming a floor soil layer having a band shape with a certain thickness, a function of sowing on the floor soil layer by the third hopper, and discharging the covering soil from the second hopper The sowing apparatus has a function of forming a covering soil layer that covers the seeded soil layer in a band shape with a certain thickness.   The seeding device according to claim 1, wherein the discharge port of the first hopper has means for forming a groove having a certain depth and width in the field soil.   The seeding device according to claim 1 or 2, wherein the second hopper is provided with a pressure reducing roller.   The seeding apparatus according to any one of claims 1 to 3, after killing a living body that hinders crop growth, including seeds of weeds and pathogens, by heat-treating the floor soil and the covering soil. After forming grooves in the field soil, forming a floor soil layer having a certain thickness made of the floor soil subjected to the heat treatment, seeding on the floor soil layer, further heat treatment A sowing method comprising forming a covering soil layer having a band shape with a certain thickness made of covering soil.   The seeding method according to claim 4, wherein the groove has a depth of 10 to 50 mm and a width of 30 to 100 mm.

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