JP2011018947A - Method for observing printed board - Google Patents

Method for observing printed board Download PDF

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JP2011018947A
JP2011018947A JP2010239758A JP2010239758A JP2011018947A JP 2011018947 A JP2011018947 A JP 2011018947A JP 2010239758 A JP2010239758 A JP 2010239758A JP 2010239758 A JP2010239758 A JP 2010239758A JP 2011018947 A JP2011018947 A JP 2011018947A
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background
light
conductive material
circuit board
printed circuit
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JP5033907B2 (en
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Koichi Inoue
耕一 井上
Kensuke Yoshida
謙介 吉田
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Fujikura Ltd
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Abstract

PROBLEM TO BE SOLVED: To easily observe a printed board from both front and rear sides when observing a connection terminal part of the printed board and an outer shape of the board.SOLUTION: In a method for observing the printed board, the printed board 1, where a wiring pattern of a conductive material is printed on a base material, is placed on a background 19 of a stage 13 having the background 19 with a background color. A surface of the printed board 1 is irradiated with irradiation light, and the conductive material exposed to the base material on the printed board 1 is observed by an observation means 11 from a side irradiated with the irradiation light. In this case, a wavelength is used for transmitting the irradiating light through the base material. Additionally, when the printed board 1 is observed from a front-surface side at which the conductive material is exposed to the base material, the background 19 of the stage 13 has the background color that does not reflect the irradiation light. Contrarily, when the printed board 1 is observed from a rear-surface side, the background 19 of the stage 13 has the background color for reflecting the irradiation light.

Description

この発明は、プリント基板の観察方法に関し、特にフレキシブルプリント回路基板の接続端子部や回路部や前記回路基板の外形を例えばＣＣＤカメラなどの観察手段にて観察する際にフレキシブルプリント回路基板を表面側及び／又は裏面側のいずれからでも観察するプリント基板の観察方法に関する。   The present invention relates to a method for observing a printed circuit board, and in particular, when observing the connection terminal portion and circuit section of a flexible printed circuit board and the outer shape of the circuit board with an observation means such as a CCD camera, for example, And / or a method of observing a printed circuit board that is observed from either the back side.

従来、プリント基板としてはフレキシブルプリント回路基板（以下、単に「ＦＰＣ」という）がある。このＦＰＣは、例えばポリイミドあるいはポリエチレンテレフタレート（ＰＥＴ）からなる基材としての絶縁フィルムの上に、例えば銅からなる箔状の導電材を印刷などして配線パターンを形成し、さらに回路保護部材としてオーバレジストが配線パターンの上に積層されて構成している。また、接続端子部にはオーバレジストが形成されておらず、導電材が剥き出しとなっている。   Conventionally, as a printed board, there is a flexible printed circuit board (hereinafter simply referred to as “FPC”). In this FPC, a wiring pattern is formed on an insulating film as a base material made of polyimide or polyethylene terephthalate (PET), for example, by printing a foil-like conductive material made of copper, for example. A resist is laminated on the wiring pattern. Further, no over resist is formed on the connection terminal portion, and the conductive material is exposed.

従来、プリント基板の観察方法としては、上記のＦＰＣは、ＦＰＣの接続端子部や回路部に照射光をあててＣＣＤカメラや顕微鏡などの観察部を備えた観察手段により検出して観察あるいは検査が行われる。例えば、プリント基板の表面に対して斜め方向から赤外波長域の照射光を照射し、プリント基板上方への反射光によりプリント基板の配線パターンを観察するものがある（例えば、特許文献１参照）。   Conventionally, as a method for observing a printed circuit board, the above FPC can be observed or inspected by irradiating irradiation light to a connection terminal portion or a circuit portion of the FPC and detecting it by an observation means having an observation portion such as a CCD camera or a microscope. Done. For example, there is one that irradiates the surface of a printed circuit board with irradiation light in an infrared wavelength region from an oblique direction, and observes the wiring pattern of the printed circuit board by reflected light upward from the printed circuit board (see, for example, Patent Document 1). .

特開平８−２２２８３２号公報JP-A-8-222832

ところで、上述した従来のプリント基板の観察方法においては、例えばプリント基板の接続端子部の導電材を観察するには、接続端子部の基材に露出している導電材の表面側から照射光をあててＣＣＤカメラや顕微鏡などの観察手段により観察して位置決めや他の部材を装着するなどの作業をしており、場合によってはプリント基板の接続端子部の裏面側（導電材が露出している表面側とは反対側）から前記導電材を観察したいものもあるが、それができないという問題点があった。   By the way, in the conventional printed circuit board observation method described above, for example, in order to observe the conductive material of the connection terminal portion of the printed circuit board, irradiation light is irradiated from the surface side of the conductive material exposed on the base material of the connection terminal portion. The work is performed by observing with an observation means such as a CCD camera or a microscope, and positioning or mounting other members. In some cases, the back side of the connection terminal portion of the printed circuit board (the conductive material is exposed) Although there is a thing which wants to observe the said electrically conductive material from the surface opposite side), there existed a problem that it was not possible.

例えば、上記のプリント基板の裏面側から観察できないので、表面側からＣＣＤカメラや顕微鏡などの観察手段により観察すると同時に、この観察手段のデータを元にして他の基板をプリント基板の裏面に組み付けるための製造装置をプリント基板の裏面側に設けなければならないので、装置全体が複雑になり、作業性も低下するという問題点が生じる。   For example, since the above-mentioned printed circuit board cannot be observed from the back side, it is observed from the front side by an observation means such as a CCD camera or a microscope, and at the same time, another board is assembled on the back side of the printed board based on the data of this observation means. Since the manufacturing apparatus must be provided on the back side of the printed circuit board, the entire apparatus becomes complicated and the workability is lowered.

さらには、プリント基板の表面側及び裏面側のいずれかからでも観察できると、プリント基板を反転しなくても良いので大幅な能率向上を図れるが、それができないという問題点があった。   Furthermore, if it can be observed from either the front surface side or the back surface side of the printed circuit board, it is not necessary to reverse the printed circuit board, so that a significant improvement in efficiency can be achieved.

また、従来のプリント基板の観察方法では、接続端子部や回路部を観察することはできるが、プリント基板自体の外形を観察することはできないという問題点があった。   Further, in the conventional method for observing a printed board, there is a problem that the connection terminal part and the circuit part can be observed, but the outer shape of the printed board itself cannot be observed.

この発明は上述の課題を解決するためになされたものである。   The present invention has been made to solve the above-described problems.

この発明のプリント基板の観察方法は、背景色を有する背景部を備えたステージの前記背景部上に、基材に導電材の配線パターンを印刷したプリント基板を載置し、このプリント基板の表面に対して照射光を照射すると共に前記照射光を照射した側から前記プリント基板の外形を観察手段で観察する際に、
前記照射光が前記基材を透過しない波長であると共に前記ステージの背景部が前記照射光を反射する背景色であることを特徴とするものである。 According to the printed circuit board observation method of the present invention, a printed circuit board in which a wiring pattern of a conductive material is printed on a base material is placed on the background section of a stage having a background section having a background color. When observing the outer shape of the printed circuit board with the observation means from the side irradiated with the irradiation light with respect to the irradiation,
The irradiation light has a wavelength that does not pass through the substrate, and the background portion of the stage has a background color that reflects the irradiation light.

以上のごとき課題を解決するための手段から理解されるように、この発明のプリント基板の観察方法によれば、プリント基板を表面側から観察するときは、導電材の部分では照射光が反射するので観察手段により白く検出し、基材の部分では照射光が基材を透過し、この透過した照射光はステージの背景部の背景色で反射しないので観察手段により黒く検出するので、導電材の部分を明瞭に観察できる。   As understood from the means for solving the above problems, according to the printed circuit board observation method of the present invention, when observing the printed circuit board from the surface side, the irradiated light is reflected at the conductive material portion. Therefore, it is detected white by the observation means, and the irradiated light is transmitted through the substrate at the base portion, and since the transmitted irradiation light is not reflected by the background color of the background portion of the stage, it is detected black by the observation means. The part can be observed clearly.

一方、プリント基板を裏面側から観察するときは、基材の部分では照射光が基材を透過し、この透過した照射光はステージの背景部の背景色で反射し、この反射光は再び前記基材を透過して観察手段によりで白く検出し、導電材がある部分の基材の裏面では照射光が透過せず観察手段により黒く検出するので、導電材の部分を明瞭に観察できる。   On the other hand, when the printed circuit board is observed from the back side, the irradiated light is transmitted through the base material at the base portion, and the transmitted irradiated light is reflected by the background color of the background portion of the stage. The white light is detected by the observation means through the base material, and the irradiation light is not transmitted on the back surface of the base material where the conductive material is present, and the black color is detected by the observation means, so that the conductive material portion can be clearly observed.

したがって、プリント基板の表面側及び裏面側のいずれからでも導電材を容易に効率よく且つ明瞭に観察でき、簡単な構造であるので安価である。   Therefore, the conductive material can be easily and efficiently observed clearly from either the front side or the back side of the printed circuit board, and is inexpensive because it has a simple structure.

また、この発明のプリント基板の観察方法によれば、プリント基板を裏面側から観察するときは、基材の部分では照射光が基材を透過し、この透過した照射光はステージの背景部の背景色で反射し、この反射光は再び前記基材を透過して観察手段により白く検出し、導電材がある部分の基材の裏面では照射光が透過せず観察手段により黒く検出するので、プリント基板を裏面側からでも導電材の部分を容易に効率よく且つ明瞭に観察でき、簡単な構造であるので安価である。   Further, according to the printed circuit board observation method of the present invention, when the printed circuit board is observed from the back side, the irradiated light is transmitted through the base material at the base material portion, and the transmitted irradiated light is transmitted to the background portion of the stage. Reflected by the background color, this reflected light is transmitted again through the base material and detected white by the observation means, and the irradiation light does not pass through the back surface of the base material where the conductive material is present and is detected black by the observation means. The portion of the conductive material can be easily and efficiently observed clearly even from the back side of the printed board, and is inexpensive because it has a simple structure.

また、この発明のプリント基板の観察方法によれば、プリント基板の外形を観察するときは、照射光が前記基材を透過しない波長であるので、基材の裏面では観察手段により黒く検出し、基材の外側は照射光がステージの背景部の背景色で反射して観察手段により白く検出するので、基材の外形、すなわちプリント基板の外形を容易に効率よく且つ明瞭に観察でき、簡単な構造であるので安価である。   Further, according to the printed circuit board observation method of the present invention, when observing the outer shape of the printed circuit board, since the irradiation light has a wavelength that does not pass through the base material, the back surface of the base material is detected black by the observation means, The outside of the substrate is reflected white by the background color of the background part of the stage and is detected white by the observation means, so that the outer shape of the substrate, that is, the outer shape of the printed circuit board can be easily and efficiently observed clearly. Since it is a structure, it is inexpensive.

この発明の実施の形態に係るプリント基板の観察手段の概略説明図である。It is a schematic explanatory drawing of the observation means of the printed circuit board which concerns on embodiment of this invention. プリント基板を表面側から観察するときの概略説明図である。It is a schematic explanatory drawing when observing a printed circuit board from the surface side. プリント基板を裏面側から観察するときの概略説明図である。It is a schematic explanatory drawing when observing a printed circuit board from the back side. プリント基板の接続端子部付近を示す概略的な平面図である。It is a schematic top view which shows the connection terminal part vicinity of a printed circuit board. 図４の拡大縦断面図である。FIG. 5 is an enlarged longitudinal sectional view of FIG. 4. 図４の矢視ＶＩ−ＶＩ線の拡大断面図である。It is an expanded sectional view of the arrow VI-VI line of FIG.

以下、この発明の実施の形態について図面を参照して説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図４乃至は図６を参照するに、この実施の形態に係るプリント基板としては、フレキシブルプリント回路基板（以下、単に「ＦＰＣ」という）があり、図４ではＦＰＣ１が図示されており、図５ではＦＰＣ１の長手方向に沿った拡大縦断面図が図示されており、図６ではＦＰＣ１の幅方向に沿った拡大縦断面図が図示されている。このＦＰＣ１は、例えばポリイミドあるいはポリエチレンテレフタレート（ＰＥＴ）などの樹脂からなる絶縁フィルム３の上に、例えば銅からなる箔状の導電材５を印刷などして配線パターンを形成し、さらに回路保護部材としての例えばオーバレジスト７が配線パターンの上に積層されて構成している。また、接続端子部９にはオーバレジスト７が形成されておらず、複数の導電材５が剥き出しとなっている。   4 to 6, there is a flexible printed circuit board (hereinafter simply referred to as “FPC”) as a printed board according to this embodiment, and FIG. 4 shows the FPC 1. In FIG. 6, an enlarged longitudinal sectional view along the longitudinal direction of the FPC 1 is shown, and in FIG. 6, an enlarged longitudinal sectional view along the width direction of the FPC 1 is shown. This FPC 1 forms a wiring pattern by printing a foil-like conductive material 5 made of copper, for example, on an insulating film 3 made of resin such as polyimide or polyethylene terephthalate (PET), and further as a circuit protection member For example, an over resist 7 is laminated on the wiring pattern. Further, the over resist 7 is not formed on the connection terminal portion 9, and a plurality of conductive materials 5 are exposed.

なお、上記の接続端子部９の複数の各導電材５は絶縁フィルム３の表面上に突出しており、前記各導電材５の突出部幅Ｗ（「端子幅」ともいう）はこの実施の形態では５０μｍである。   Each of the plurality of conductive materials 5 of the connection terminal portion 9 protrudes on the surface of the insulating film 3, and the protrusion width W (also referred to as “terminal width”) of each conductive material 5 is the embodiment. Then, it is 50 μm.

上記のようにＦＰＣ１の接続端子部９に剥き出している導電材５の位置や、ＦＰＣ１の外形を正確に観察するためには、この発明の実施の形態に係るプリント基板の観察手段１１が用いられる。   In order to accurately observe the position of the conductive material 5 exposed to the connection terminal portion 9 of the FPC 1 and the outer shape of the FPC 1 as described above, the printed circuit board observation means 11 according to the embodiment of the present invention is used. .

図１を参照するに、プリント基板の観察手段１１としては、ＦＰＣ１を載置するステージ１３が設けられている。さらに、ステージ１３の上方には、ＦＰＣ１の接続端子部９の複数の導電材５や回路部、あるいはＦＰＣ１の外形を観察するためのＣＣＤカメラあるいは顕微鏡などの観察部１５が設けられており、さらに、観察部１５の観察視野を照明するための照明装置としての例えばリング型のＬＥＤ照明１７が設けられている。また、上記のステージ１３の表面には、背景部としての例えば背景板１９が設けられており、種々の背景板１９に変更（交換）可能となっている。   Referring to FIG. 1, a stage 13 on which the FPC 1 is placed is provided as the printed circuit board observation means 11. Further, an observation unit 15 such as a CCD camera or a microscope for observing the outer shape of the FPC 1 is provided above the stage 13 with a plurality of conductive materials 5 and circuit units of the connection terminal unit 9 of the FPC 1. For example, a ring-shaped LED illumination 17 is provided as an illumination device for illuminating the observation field of the observation unit 15. Further, for example, a background plate 19 as a background portion is provided on the surface of the stage 13 and can be changed (replaced) to various background plates 19.

上記の観察手段１１を用いてＦＰＣ１を観察する方法について説明する。   A method for observing the FPC 1 using the observation means 11 will be described.

ＦＰＣ１の接続端子部９を表面側、つまり導電材５が露出している側から観察する場合について説明する。   A case where the connection terminal portion 9 of the FPC 1 is observed from the surface side, that is, the side where the conductive material 5 is exposed will be described.

この場合は、図２に示されているように、ステージ１３の背景板１９はＬＥＤ照明１７の光を反射しない黒色などのような背景色２１となっている。また、ＦＰＣ１は接続端子部９の導電材５を上に向けて前記背景板１９の上に載置される。   In this case, as shown in FIG. 2, the background plate 19 of the stage 13 has a background color 21 such as black that does not reflect the light of the LED illumination 17. The FPC 1 is placed on the background plate 19 with the conductive material 5 of the connection terminal portion 9 facing upward.

ステージ１３上のＦＰＣ１にＬＥＤ照明１７の光があてられると、図１及び図２に示されているように、ＬＥＤ照明１７の光はＦＰＣ１の導電材５及び絶縁フィルム３の表面で反射され、この反射光が観察部１５で観察される。このとき、導電材５と絶縁フィルム３では反射光の反射率が異なるゆえに、その反射光の明暗により導電材５の位置を観察することができる。白黒の明暗の差が大きいほど対象部材が明瞭となり、より一層正確に認識できる。   When the light of the LED illumination 17 is applied to the FPC 1 on the stage 13, the light of the LED illumination 17 is reflected on the surfaces of the conductive material 5 and the insulating film 3 of the FPC 1, as shown in FIGS. This reflected light is observed by the observation unit 15. At this time, since the reflectance of the reflected light is different between the conductive material 5 and the insulating film 3, the position of the conductive material 5 can be observed by the brightness of the reflected light. The larger the difference between black and white, the clearer the target member, and the more accurately it can be recognized.

すなわち、導電材５の部分では照射光が反射するので観察部１５で白く検出される。また、絶縁フィルム３の部分ではＬＥＤ照明１７の光が絶縁フィルム３を透過し、背景板１９がＬＥＤ照明１７の光を反射しない背景色２１となっているので、前記絶縁フィルム３を透過した光は背景板１９で反射されないために観察部１５で黒く検出される。その結果、観察部１５では導電材５の位置を容易に且つ明瞭に観察することができる。   That is, the irradiated light is reflected at the portion of the conductive material 5 and is detected white by the observation unit 15. Further, in the portion of the insulating film 3, the light from the LED illumination 17 is transmitted through the insulating film 3, and the background plate 19 has a background color 21 that does not reflect the light from the LED illumination 17. Is not reflected by the background plate 19 and is detected black by the observation unit 15. As a result, the observation unit 15 can easily and clearly observe the position of the conductive material 5.

ちなみに、例えばＦＰＣ１の絶縁フィルム３がポリイミドである場合、ポリイミドは７００ｎｍ以上の波長を有する光に対して透過率が上昇するので、ＬＥＤ照明１７の光が７００ｎｍ以上であって絶縁フィルム３を透過して、上記のことから導電材５の位置を明瞭に観察できる。   Incidentally, for example, when the insulating film 3 of the FPC 1 is polyimide, the transmittance of the polyimide increases with respect to light having a wavelength of 700 nm or more, so that the light of the LED illumination 17 is 700 nm or more and passes through the insulating film 3. From the above, the position of the conductive material 5 can be clearly observed.

なお、上記とは逆に、ステージ１３の背景板１９がＬＥＤ照明１７の光を反射するアルミ色又は白色などのような背景色２３となっている場合は、絶縁フィルム３を透過した光が前記背景板１９で反射して背景が明るくなってしまうために、この反射光が再び絶縁フィルム３を透過して観察部１５で白く検出されるので、導電材５の位置が不明瞭となってしまう。   Contrary to the above, when the background plate 19 of the stage 13 has a background color 23 such as an aluminum color or white color that reflects the light of the LED illumination 17, the light transmitted through the insulating film 3 is Since the reflected light is reflected on the background plate 19 and the background becomes bright, the reflected light is transmitted again through the insulating film 3 and detected in white by the observation unit 15, so that the position of the conductive material 5 becomes unclear. .

次に、ＦＰＣ１の接続端子部９を裏面側、つまり導電材５が露出している表面側とは反対側から観察する場合について説明する。   Next, the case where the connection terminal portion 9 of the FPC 1 is observed from the back side, that is, the side opposite to the front side where the conductive material 5 is exposed will be described.

この場合は、図３に示されているように、ステージ１３の背景板１９はＬＥＤ照明１７の光を反射するアルミ色又は白色などのような背景色２３となっている。例えば、背景板１９としてはアルミ板を用いることができるが、その他の材質であっても構わない。また、ＦＰＣ１は接続端子部９の導電材５を下に向けて、つまりＦＰＣ１の裏面側が上になって前記背景板１９の上に載置される。   In this case, as illustrated in FIG. 3, the background plate 19 of the stage 13 has a background color 23 such as an aluminum color or white color that reflects the light of the LED illumination 17. For example, an aluminum plate can be used as the background plate 19, but other materials may be used. The FPC 1 is placed on the background plate 19 with the conductive material 5 of the connection terminal portion 9 facing down, that is, the back side of the FPC 1 is up.

また、ＬＥＤ照明１７の光は絶縁フィルム３を透過する波長となっている。例えば絶縁フィルム３がポリイミドである場合は、ＬＥＤ照明１７の光は７００ｎｍ以上の波長を有するものである。   Further, the light of the LED illumination 17 has a wavelength that passes through the insulating film 3. For example, when the insulating film 3 is polyimide, the light from the LED illumination 17 has a wavelength of 700 nm or more.

ステージ１３上のＦＰＣ１にＬＥＤ照明１７の光があてられると、背景板１９がＬＥＤ照明１７の光を反射する背景色２３であるアルミ板となっているので、図１及び図３に示されているように、ＬＥＤ照明１７の光は絶縁フィルム３を透過し、この透過した光は背景板１９で反射して背景が明るくなり、この反射光は絶縁フィルム３を再び透過して観察部１５で白く検出される。しかし、上記のＬＥＤ照明１７の光は導電材５の部分では透過されないので、導電材５の部分は観察部１５で黒く検出される。その結果、白黒の明暗により観察部１５で導電材５の位置を明瞭に観察することができる。   When the light of the LED illumination 17 is applied to the FPC 1 on the stage 13, the background plate 19 is an aluminum plate that is a background color 23 that reflects the light of the LED illumination 17. As shown, the light from the LED illumination 17 is transmitted through the insulating film 3, and the transmitted light is reflected by the background plate 19 to brighten the background. This reflected light is transmitted again through the insulating film 3 and is transmitted through the observation unit 15. Detected white. However, since the light from the LED illumination 17 is not transmitted through the conductive material 5, the conductive material 5 is detected black by the observation unit 15. As a result, the position of the conductive material 5 can be clearly observed by the observation unit 15 with black and white brightness.

なお、上記の逆に、ステージ１３の背景板１９がＬＥＤ照明１７の光を反射しない黒色などのような背景色２１となっている場合は、絶縁フィルム３を透過した光が前記背景板１９で反射せずに背景が暗くなってしまうために、導電材５の部分も絶縁フィルム３の部分も黒くなるので明暗がつかないので導電材５の位置が観察できない。   On the contrary, when the background plate 19 of the stage 13 has a background color 21 such as black that does not reflect the light of the LED illumination 17, the light transmitted through the insulating film 3 is transmitted through the background plate 19. Since the background becomes dark without reflection, the portion of the conductive material 5 and the portion of the insulating film 3 become black.

次に、ＦＰＣ１の外形を観察する場合について説明する。   Next, a case where the outer shape of the FPC 1 is observed will be described.

この場合は、ステージ１３の背景板１９はＬＥＤ照明１７の光を反射するアルミ色又は白色などのような背景色２３となっている。例えば、背景板１９としてはアルミ板を用いることができるが、その他の材質であっても構わない。   In this case, the background plate 19 of the stage 13 has a background color 23 such as aluminum or white that reflects the light of the LED illumination 17. For example, an aluminum plate can be used as the background plate 19, but other materials may be used.

また、ＬＥＤ照明１７の光は絶縁フィルム３を透過しない波長となっている。例えば絶縁フィルム３がポリイミドである場合は、ＬＥＤ照明１７の光は青系などのように短い波長を有するものである。   The light from the LED illumination 17 has a wavelength that does not pass through the insulating film 3. For example, when the insulating film 3 is polyimide, the light from the LED illumination 17 has a short wavelength such as blue.

また、ＦＰＣ１は、図２に示されているように接続端子部９の導電材５を上に向けて背景板１９の上に載置しても、あるいは図３に示されているように接続端子部９の導電材５を下に向けて前記背景板１９の上に載置しても構わない。   Further, the FPC 1 is mounted on the background plate 19 with the conductive material 5 of the connection terminal portion 9 facing upward as shown in FIG. 2 or connected as shown in FIG. It may be placed on the background plate 19 with the conductive material 5 of the terminal portion 9 facing downward.

ステージ１３上のＦＰＣ１にＬＥＤ照明１７の波長の短い青系の光があてられると、図１に示されているように、ＬＥＤ照明１７の光はＦＰＣ１の絶縁フィルム３を透過しないので、背景板１９がＬＥＤ照明１７の光を反射する背景色２３となっていても、背景板１９による反射光が発生しないので、絶縁フィルム３は観察部１５で黒く検出される。一方、ＦＰＣ１を外れたＬＥＤ照明１７の光はステージの背景板の背景色２３で反射して白くなる。この明暗を観察部１５で検出してＦＰＣ１の外形を容易に効率よく且つ明瞭に観察することができる。   When blue light having a short wavelength of the LED illumination 17 is applied to the FPC 1 on the stage 13, the light from the LED illumination 17 does not pass through the insulating film 3 of the FPC 1, as shown in FIG. Even if 19 is the background color 23 that reflects the light of the LED illumination 17, no reflected light is generated by the background plate 19, so the insulating film 3 is detected black by the observation unit 15. On the other hand, the light from the LED illumination 17 outside the FPC 1 is reflected by the background color 23 of the background plate of the stage and becomes white. The light and darkness can be detected by the observation unit 15 so that the outer shape of the FPC 1 can be easily and efficiently observed clearly.

以上のように、接続端子部９の導電材５や、これ以外の導電材５からなる回路部（配線パターン）や、ＦＰＣ１の外形は、表裏面側のいずれの側からでも観察部１５で容易に効率よく且つ明瞭に観察できる。しかも、簡単な方法であるので、簡単な構造で安価にできる。   As described above, the conductive material 5 of the connection terminal portion 9, the circuit portion (wiring pattern) made of the other conductive material 5, and the outer shape of the FPC 1 can be easily observed by the observation unit 15 from either side of the front and back sides. Can be observed efficiently and clearly. Moreover, since it is a simple method, it can be made inexpensive with a simple structure.

なお、背景板１９は、種々の材質を用いて光を反射しない背景色２１、あるいは光を反射する背景色２３とすることができる。上記の背景色２１と背景色２３とのいずれかに変更して、１つの観察部１５で前記ＦＰＣ１の表面側あるいは裏面側のいずれからも観察することができるので、ＦＰＣ１を反転する必要がないので、生産性を高めることができる。   The background plate 19 can be made of a background color 21 that does not reflect light or a background color 23 that reflects light using various materials. By changing to either the background color 21 or the background color 23 described above, it is possible to observe from either the front side or the back side of the FPC 1 with a single observation unit 15, so there is no need to invert the FPC 1. So productivity can be increased.

１ ＦＰＣ（フレキシブルプリント回路基板）
３ 絶縁フィルム（基材）
５ 導電材（配線パターン）
７ オーバレジスト
９ 接続端子部
１１ プリント基板の観察手段
１３ ステージ
１５ 観察部
１７ ＬＥＤ照明（照明装置）
１９ 背景板（背景部）
２１ 背景色（光を反射しない）
２３ 背景色（光を反射する） 1 FPC (Flexible Printed Circuit Board)
3 Insulation film (base material)
5 Conductive material (wiring pattern)
7 Over-resist 9 Connection terminal part 11 Printed circuit board observation means 13 Stage 15 Observation part 17 LED illumination
19 Background board (background part)
21 Background color (does not reflect light)
23 Background color (reflects light)

Claims (1)

背景色を有する背景部を備えたステージの前記背景部上に、基材に導電材の配線パターンを印刷したプリント基板を載置し、このプリント基板の表面に対して照射光を照射すると共に前記照射光を照射した側から前記プリント基板の外形を観察手段で観察する際に、
前記照射光が前記基材を透過しない波長であると共に前記ステージの背景部が前記照射光を反射する背景色であることを特徴とするプリント基板の観察方法。 On the background portion of the stage having a background portion having a background color, a printed board on which a wiring pattern of a conductive material is printed is placed on a base material, and the surface of the printed board is irradiated with irradiation light and When observing the outer shape of the printed circuit board from the side irradiated with the irradiation light with the observation means,
A method for observing a printed circuit board, wherein the irradiation light has a wavelength that does not pass through the base material and the background portion of the stage has a background color that reflects the irradiation light.
JP2010239758A 2010-10-26 2010-10-26 Observation method and apparatus for flexible printed circuit board Expired - Fee Related JP5033907B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021064730A (en) * 2019-10-16 2021-04-22 日東電工株式会社 Method for manufacturing wiring circuit board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0243607A (en) * 1988-04-28 1990-02-14 Joerg Schwarzbich Ball notching apparatus
JP2002015977A (en) * 2000-06-29 2002-01-18 Kyocera Corp Wafer holder

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0243607A (en) * 1988-04-28 1990-02-14 Joerg Schwarzbich Ball notching apparatus
JP2002015977A (en) * 2000-06-29 2002-01-18 Kyocera Corp Wafer holder

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021064730A (en) * 2019-10-16 2021-04-22 日東電工株式会社 Method for manufacturing wiring circuit board
WO2021075195A1 (en) * 2019-10-16 2021-04-22 日東電工株式会社 Method for manufacturing wiring circuit board

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