JP2011018733A - Bonding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bonding device capable of shortening the time needed for workpiece replacement.SOLUTION: The bonding device is provided with a width-direction moving mechanism 31 which moves a bonding stage 13 in a Y direction 32, and the bonding stage 13 is provided with a longitudinal direction moving mechanism 34 which moves a workpiece 2 on the bonding stage 13 in an X direction 12. On the bonding stage 13, a supply-side buffer region 101 where the workpiece 2 supplied from an entrance feeder 11 is made to stand by, a process region 102 where the workpiece 2 being bonded is arranged, and an ejection-side buffer region 103 wherein the workpiece 2 having being bonded in the process region 102 is made to stand by are set. The length-directional moving mechanism 34 is configured to move the workpiece 2 standing by in the supply-side buffer region 101, to the process region 102.

Description

  The present invention relates to a bonding apparatus that performs bonding.

  Conventionally, when bonding a chip to a strip-shaped lead frame, a bonding apparatus has been used (see, for example, Patent Document 1).

  When performing bonding with this bonding apparatus, as shown in FIGS. 6 and 7, the lead frame on the inlet feeder 801 is supplied to the bond stage 803 by the inlet gripper 802 and set. In this state, the bond stage 803 is driven by the bond stage XYZ table 804, and the bonding position of the set lead frame 805 moves so as to coincide with the bonding position by the bond head 806 and is transferred by the bond head 806. The chip is bonded to the bonding location positioned at the bonding position.

  Then, the movement of the bond stage 803 and the bonding with the bond head 806 are repeated, and when the bonding to all bonding locations set on the lead frame 805 is completed, the bond stage 803 is moved to the inlet feeder. The lead frame 805 on the bond stage 803 is discharged to the outlet feeder 811 by the outlet gripper 812 and then the lead frame of the inlet feeder 801 by the inlet gripper 802. 805 is supplied to the bond stage 803.

JP 2008-198810 A

  However, in such a conventional bonding apparatus 821, the bond stage 803 is moved in the X and Y directions so that the bonding position set on the lead frame 805 matches the bonding position by the bond head 806. It is necessary to move 803 obliquely toward the home position between the inlet feeder 801 and the outlet feeder 811, the movement amount is large, and it takes time to move the bond stage 803.

  Further, for convenience of positioning the lead frame 805 with respect to the bond stage 803, the supplied lead frame 805 needs to be moved to the center position of the bond stage 803 at all times. For this reason, even if the lead frame 805 is short, the amount of movement of the lead frame 805 to be supplied becomes constant, and it takes time to supply the lead frame 805.

  The present invention has been made in view of such a conventional problem, and an object of the present invention is to provide a bonding apparatus that can reduce the time required for workpiece replacement.

  In order to solve the above-described problem, in the bonding apparatus according to claim 1 of the present invention, the inlet feeder, the bond stage to which the workpiece is supplied from the inlet feeder, and the workpiece bonded at the bond stage are discharged. In the bonding apparatus in which the bonding stage is moved and bonded so that the outlet feeder extends and the bonding position set on the workpiece coincides with the bonding position by the bond head, the bonding stage is set to the width of the bonding stage. A width direction moving mechanism that moves in the direction and a length direction moving mechanism that moves the workpiece on the bond stage in the length direction of the bond stage, while the workpiece supplied to the bond stage from the inlet feeder Supply side buffer area to wait for Set the process area where the work in the grayed are arranged and movable in the said process area in the longitudinal movement mechanism workpiece to wait in the supply side buffer area.

  That is, this bonding apparatus is provided with a width direction moving mechanism for moving the bond stage in the width direction and a length direction moving mechanism for moving the workpiece on the bond stage in the length direction. By moving the bond stage in the width direction with a moving mechanism and moving the work on the bond stage in the length direction with the length direction moving mechanism, the bonding location set on the work on the bond stage is It is possible to move to a position that coincides with the bonding position by the bond head.

  At this time, the bond stage is configured to be moved in the width direction by the width direction moving mechanism, and when returning the moved bond stage to the home position between the inlet feeder and the outlet feeder, Does not move in an oblique direction as in the prior art in which they are moved in the XY direction.

  For this reason, the return operation to the home position can be performed by linear movement, and the movement distance is shortened as compared with the conventional case that requires oblique movement.

  When the workpiece is supplied from the inlet feeder, the bond stage can be moved immediately after the supplied workpiece is placed in the supply-side buffer area set in the bond stage.

  For this reason, the workpiece delivery time is shortened as compared with the prior art in which the workpiece supplied from the inlet feeder had to be set at the center position of the bond stage.

  Further, in the bonding apparatus according to claim 2, a discharge side buffer area for waiting a work that has been bonded in the process area is set in the bond stage, and the supply side is moved by moving the work in the length direction during the bonding. When the buffer area is released, the bonding process is temporarily interrupted, and the bonding stage is disposed between the inlet feeder and the outlet feeder to move the workpiece supplied from the inlet feeder to the supply-side buffer area. The work waiting in the discharge-side buffer area can be discharged to the outlet feeder.

  That is, when the workpiece being bonded is moved in the length direction and the supply-side buffer area is released, the bonding process is temporarily interrupted, and the bond stage is moved to the home position between the inlet feeder and the outlet feeder. Moved.

  At this time, since the supply side buffer area is open, the work supplied from the inlet feeder is moved to the supply side buffer area. In addition, when a workpiece for which bonding has been completed is waiting in the discharge-side buffer area, the workpiece is discharged to the outlet feeder.

  As described above, in the bonding apparatus according to the first aspect of the present invention, since the bond stage is linearly moved in the width direction by the width direction moving mechanism, bonding is performed by moving the bond stage in the XY directions. As in the prior art, the bond stage can be returned to the home position between the inlet feeder and the outlet feeder without moving in an oblique direction.

  Therefore, the amount of movement of the bond stage can be reduced and the movement time of the bond stage can be shortened compared to the conventional case that requires an oblique movement when returning the bond stage to the home position.

  When the workpiece is supplied from the inlet feeder, the bond stage can be moved immediately after the supplied workpiece is placed in the supply-side buffer area set in the bond stage.

  For this reason, the workpiece supplied from the inlet feeder, regardless of its length dimension, can only be moved to the center position of the bond stage and then moved before the bond stage can be moved. In comparison, the time required for workpiece supply can be shortened.

  Therefore, the time required for workpiece replacement can be shortened.

  Further, in the bonding apparatus according to claim 2, the bonding process is temporarily interrupted when the workpiece being bonded is moved in the length direction and the supply-side buffer area is opened, and the bonding stage includes the inlet feeder and the bonding feeder. Moved to home position between exit feeders.

  At this time, the supply-side buffer area is open. For this reason, the workpiece | work from the said inlet feeder can be moved to the said supply side buffer area | region. In addition, when a work for which bonding has been completed is waiting in the discharge-side buffer area, the work can be discharged to the outlet feeder.

  Thereby, when the bond stage is moved to the home position between the inlet feeder and the outlet feeder, a work supply work to the bond stage and a work discharge work after bonding can be performed. Can be replaced in a short time.

It is explanatory drawing which shows one embodiment of this invention. It is explanatory drawing which shows operation | movement of the embodiment. It is a timing chart which shows the operation | movement of the embodiment. It is a flowchart which shows the operation | movement of the embodiment. It is a flowchart which shows the operation | movement following FIG. It is explanatory drawing which shows the conventional bonding apparatus. It is explanatory drawing which shows operation | movement of the conventional example.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a view showing a bonding apparatus 1 according to the present embodiment. The bonding apparatus 1 is attached to a bonding portion of a work 2 to which a bonding agent is applied in an upstream dispensing process, for example, from a wafer by a bond head 3. It is an apparatus for bonding transferred chips.

  In this bonding apparatus 1, as shown in FIGS. 1 and 2, an inlet feeder 11 that transports a workpiece 2 coated with a bonding agent at a bonding location in the dispensing process extends in the X direction 12 of the bonding apparatus 1. The bond stage 13 to which the workpiece 2 from the inlet feeder 11 is supplied is extended on the downstream side of the inlet feeder 11 so as to be movable. On the downstream side of the bond stage 13, an outlet feeder 14 for discharging the work 2 bonded by the bond stage 13 is extended, and the bond stage 13 is connected to the inlet feeder 11 and the outlet feeder. The inlet feeder 11, the bond stage 13, and the outlet feeder 14 are arranged in a straight line from the upstream in a state where they are arranged at the home position between 14.

  The inlet feeder 11 is provided with a first gripper 21 that holds the workpiece 2 to which the bonding agent has been applied in the dispensing process so as to be driven in the X direction 12. The gripper 21 is driven by a first gripper moving mechanism for moving the gripper 21 in the X direction 12 which is the length direction of the inlet feeder 11 (not shown).

  The bond stage 13 is supported by a width direction moving mechanism 31, and the width direction moving mechanism 31 is configured to drive the bond stage 13 in the Y direction 32 that is the width direction. A support plate 33 is provided on the side of the bond stage 13, and the workpiece 2 on the bond stage 13 is placed on the support plate 33 in the X direction 12 that is the length direction of the bond stage 13. A moving mechanism 34 for moving in the length direction is provided.

  Accordingly, the bond stage 13 is moved in the Y direction 32 by the width direction moving mechanism 31 and the work 2 on the bond stage 13 is moved in the X direction 12 by the length direction moving mechanism 34. The bonding stage 13 and the workpiece 2 on the bonding stage 13 can be moved so that the bonding location set on the workpiece 2 coincides with the bonding position by the bond head 3, and the bond head 3 Is configured so that the chip transferred to the bonding position can be bonded to the bonding location of the workpiece 2 arranged at the bonding position.

  The length direction moving mechanism 34 includes a second gripper 41, a third gripper 42, and a fourth gripper 43 that hold the workpiece 2 on the bond stage 13 and move in the X direction 23.

  The second gripper 41 is movably supported by a second ball screw 51 disposed along the support plate 33, and the second ball screw 51 is provided on the downstream side of the support plate 33. The second motor 52 is rotationally driven. The second ball screw 51 extends to the upstream side of the support plate 33. As shown in FIG. 3, the second gripper 41 includes a dispense stage LF delivery position 53 and an LF supply standby position 54. It is configured to be able to move between.

  As shown in FIG. 1, the third gripper 42 is movably supported by a third ball screw 61 disposed along the support plate 33, and the third ball screw 61 is supported by the support plate 33. It is configured to be rotationally driven by a third motor 62 provided on the downstream side of the plate 33. The third ball screw 61 is extended to a position upstream of the center in the length direction of the support plate 33, and the third gripper 42 is moved to the LF supply standby position 54 as shown in FIG. And the bond portion delivery position 63.

  The fourth gripper 43 is movably supported by a fourth ball screw 71 disposed along the support plate 33, and the fourth ball screw 71 is provided on the downstream side of the support plate 33. The fourth motor 72 is rotationally driven. The fourth ball screw 71 is extended to the vicinity of the center in the length direction of the support plate 33, and the fourth gripper 43 is connected to the bond portion delivery position 63 and the LF discharge position as shown in FIG. 73 so that it can be moved between.

  As shown in FIGS. 1 to 3, the outlet feeder 14 is provided with a fifth gripper 81 that holds the workpiece 2 discharged from the bond stage 13 at the LF discharge position 73. The fifth gripper 81 is configured to be driven by a fifth gripper moving mechanism for moving the fifth gripper 81 in the X direction 12 which is the length direction of the output feeder 14 (not shown).

  The bond stage 13 has a length dimension capable of arranging at least three workpieces 2 formed in a strip shape in the length direction, and the workpiece 2 supplied from the inlet feeder 11 on the upstream side thereof. A supply-side buffer area 101 for waiting is stored. On the downstream side of the supply side buffer area 101, a process area 102 in which the work 2 being bonded is arranged is set, and on the downstream side of the process area 102, a work for which bonding has been completed in the process area 102 is set. 2 is set as a discharge-side buffer area 103.

  Thus, the work 2 supplied from the inlet feeder 11 by the first gripper 21 can be received by the second gripper 41 at the dispensing stage LF delivery position 53 and arranged in the supply-side buffer area 101. The workpiece 2 waiting in the supply-side buffer area 101 is moved to the process area 102 while being held by the third gripper 42 at the LF supply standby position 54, and the bonding set in the workpiece 2 is performed. The workpiece 2 can be moved so that the position coincides with the bonding position.

  In addition, the work 2 that has been bonded in the process area 102 can be moved to the discharge-side buffer area 103 while being held by the fourth gripper 43 at the bond portion transfer position 63. The workpiece 2 waiting in the side buffer area 103 can be held by the fifth gripper 81 at the LF discharge position 73 and discharged to the outlet feeder 14.

  The bonding apparatus 1 includes a control device (not shown), and the control device is configured to perform bonding by controlling each of the drive parts when a microcomputer operates according to a program.

  The operation of the present embodiment according to the above configuration will be described with reference to the flowcharts shown in FIGS.

  That is, when the control device starts operating according to the program, the second gripper 41 is moved to the dispensing stage LF section delivery position 53, the third gripper 42 is moved to the right side of the LF supply standby position 54, and the fourth gripper 43 is delivered to the bond section. After the fifth gripper 81 moves to the LF discharge position 73 and waits to the right side of the position 63 (S1), when the first gripper 21 moves to the receiving position from the loader (S2), the pusher pushes the loader from the loader. Since the workpiece 2 is pushed out (S3), the workpiece 2 is chucked by the first gripper 21 and moved to the downstream side of the inlet feeder 11 (S4) and positioned to the dispensing stage FL delivery position 53 (S5). After the start (S6), the first gripper 21 releases the chuck and returns to step S2 (S7). To end the Nsu (S8).

  In this state, the presence or absence of the workpiece 2 in the middle of bonding is confirmed (S9). If there is no workpiece 2 in the middle of bonding, the feeder X-axis is moved to the origin and simultaneously the feeder Y-axis is moved to the origin. The stage 13 is moved to the home position between the inlet feeder 11 and the outlet feeder 14 (S10), and the process proceeds to step S21.

  If there is a workpiece 2 in the middle of bonding in step S9, the bonding process is continued until the bonding of the workpiece 2 held by the third gripper 42 is completed up to the middle of the workpiece 2. When the bonding is completed up to the position, the bonding is interrupted (S11), and the feeder X axis is moved to the origin and simultaneously the feeder Y axis is moved to the origin, whereby the bond stage 13 is moved between the inlet feeder 11 and the outlet feeder 14. Move to the home position, the fifth gripper opens the chuck, moves to the right side of the LF supply standby position 54 and waits, and the fourth gripper 43 synchronizes with the movement of the third gripper 42 to bond. It moves to the section delivery position 63 (S12). Then, the workpiece 2 whose bonding is suspended is chucked by the fourth gripper 43, and the process proceeds to the step S21.

  In this step S21, it is determined whether or not the work 2 is present in the discharge side buffer area 103 (S21). If there is no work 2, the work 2 on the inlet feeder 11 is chucked by the second gripper 41 to perform LF. The movement to the supply standby position 54, that is, the supply side buffer area 101 is started (S22). When the workpiece 2 passes through the joint between the inlet feeder 11 and the bond stage 13, for example, a bond operation resumption permission flag is set. After resuming the bonding operation (S23), the process proceeds to step S28.

  If it is determined in step S21 that the workpiece 2 is present in the discharge-side buffer area 103, the workpiece 2 on the inlet feeder 11 is chucked by the second gripper 41 and the LF supply standby position 54, that is, the supply. The fifth gripper 81 chucks the workpiece at the LF discharge position 73 and starts moving to the outlet feeder 14 (S24), and the workpiece 2 is connected to the inlet feeder 11 After passing the joint between the bond stage 13 and the workpiece 2 passing through the joint between the bond stage 13 and the output feeder 14, after allowing the bonding operation to resume, for example, by setting a bond operation resuming permission flag. (S25), the fifth gripper 81 moves the work 2 of the outlet feeder 14 to the unloader magazine. The starting (S26), the process proceeds to step S28. At this time, when the fifth gripper 81 finishes storing the work 2 in the magazine, the fifth gripper 81 moves to the LF discharge position 73 and stands by (S27).

  In step S28, when the second gripper 41 waits until the workpiece 2 moves to the LF supply standby position 54, that is, the supply side buffer area 101, and ends the movement (S28), The workpiece 2 is clamped by the LF displacement prevention clamp (S29), the second gripper 41 releases the chuck and moves to the dispensing stage LF delivery position 53, and at the same time, the third gripper 42 moves to the LF supply standby position 54. The workpiece 2 is moved and chucked (S30).

  Then, the presence or absence of the workpiece 2 in the middle of bonding is confirmed (S31). If there is no workpiece 2 in the middle of bonding, the third gripper 42 moves the workpiece 2 to the process area 102 and starts bonding ( S32), the process returns to step S8.

  If there is a workpiece 2 in the middle of bonding in step S31 (S31), the second gripper 43 performs bonding in the latter half of the workpiece 2 being bonded (S33), and the third gripper 42 The preceding work 2 being bonded is followed at a minimum interval (S34).

  At this time, when the bonding of the work 2 of the fourth gripper 43 is completed, the fourth gripper 43 moves to the LF discharge position 73 (S35), and the work 2 is clamped by the LF displacement prevention clamp at the LF discharge position 73. Then, the fourth gripper 43 releases the chuck (S36). Then, the bonding of the next workpiece 2 is started by the third gripper 42 (S37), and the fourth gripper 43 moves to the right side of the bond portion delivery position 63 and waits (S38), and then the step S8. Return to.

  Thus, in the bonding apparatus 1 according to the present embodiment, the width direction moving mechanism 31 that moves the bond stage 13 in the Y direction 32 that is the width direction, and the workpiece 2 on the bond stage 13 in the length direction. And a length direction moving mechanism 34 that moves in the X direction 12. The bond stage 13 is moved in the Y direction 32 by the width direction moving mechanism 31, and the length direction moving mechanism 34 moves the bond stage 13. By moving the workpiece 2 on the bond stage 13 in the X direction 12, the bonding location set on the workpiece 2 on the bond stage 13 can be moved to a position coinciding with the bonding position by the bond head 3.

  At this time, since the bond stage 13 is linearly moved in the Y direction 32 by the width direction moving mechanism 31, the bond stage 13 is obliquely moved as in the prior art in which bonding is performed by moving the bond stage in the XY direction. Without moving to the home position between the inlet feeder 11 and the outlet feeder 14.

  Therefore, the amount of movement of the bond stage 13 can be reduced and the movement time of the bond stage 13 can be shortened compared to the conventional case that requires an oblique movement when returning the bond stage 13 to the home position. .

  When the workpiece 2 is supplied from the inlet feeder 11, the bond stage 13 can be moved immediately after the supplied workpiece 2 is placed in the supply-side buffer area 101 set in the bond stage 13. It becomes.

  For this reason, the bond stage 13 can be moved only after the workpiece 2 supplied from the inlet feeder 11 is always moved to the center position of the bond stage 13 regardless of its length. Compared to the conventional case in which there is no work, the time required to supply the workpiece can be shortened.

  Therefore, the time required for workpiece replacement can be shortened.

  When the workpiece 2 being bonded is moved in the X direction 12 and the supply-side buffer area 101 is released, the bonding process is temporarily interrupted, and the bond stage 13 is connected to the inlet feeder 11 and the outlet feeder 14. Moved to the home position between.

  At this time, the supply side buffer area 101 is opened. For this reason, the workpiece 2 from the inlet feeder 11 can be moved to the supply-side buffer area 101. Further, when the workpiece 2 that has been bonded is waiting in the discharge-side buffer area 103, the workpiece 2 can be discharged to the outlet feeder 14.

  As a result, when the bond stage 13 is moved to the home position between the inlet feeder 11 and the outlet feeder 14, the work for supplying the work 2 to the bond stage 13 and the work for discharging the work 2 after bonding are performed. The workpiece 2 can be replaced in a short time.

DESCRIPTION OF SYMBOLS 1 Bonding apparatus 2 Work 3 Bond head 11 Inlet feeder 12 X direction 13 Bond stage 14 Outlet feeder 31 Width direction moving mechanism 32 Y direction 34 Length direction moving mechanism 101 Supply side buffer area 102 Process area 103 Ejection side buffer area

Claims (2)

An inlet feeder, a bond stage to which a workpiece is supplied from the inlet feeder, and an outlet feeder to which a workpiece bonded by the bond stage is discharged are extended, and a bonding portion set on the workpiece is bonded by a bond head. In the bonding apparatus in which the bond stage is moved so as to match the position and bonding is performed,
While providing a width direction moving mechanism for moving the bond stage in the width direction of the bond stage, and a length direction moving mechanism for moving a workpiece on the bond stage in the length direction of the bond stage,
In the bond stage, a supply-side buffer area that waits for a work supplied from the inlet feeder, and a process area in which a work being bonded is placed are set,
A bonding apparatus characterized in that a workpiece waiting in the supply-side buffer area can be moved to the process area by the longitudinal movement mechanism. A discharge buffer area for waiting for a workpiece that has been bonded in the process area is set in the bond stage,
When the supply-side buffer area is opened due to the movement of the workpiece in the length direction during bonding, the bonding process is temporarily interrupted, and the bond stage is arranged between the inlet feeder and the outlet feeder, and the inlet feeder is disposed. 2. The bonding according to claim 1, wherein the process of moving the supplied workpiece to the supply-side buffer area and the discharge process of the workpiece waiting in the discharge-side buffer area to the outlet feeder can be executed. apparatus.

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