JP2011012319A - Method for manufacturing structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a structure by which an efficient film is formed by suppressing the occurrence of etching on a base body.SOLUTION: In the method for manufacturing a film-like structure 10 by blowing aerosol 4 in which particles 3 and gas 1 are mixed with each other on the base body 9 from an exit of a nozzle 8 at high speed, the aerosol 4 suppresses etching of the film-like structure 10 by changing the speed of at least etching particles with higher etching effect out of the particles 3 by a speed changing means 11 provided on at least a projection area of the exit of the nozzle 8 between the nozzle 8 and the base body 9.

Description

  The present invention relates to a structure manufacturing method for manufacturing a film-like structure made of a fine particle material by spraying an aerosol in which fine particles and a gas are mixed on a substrate at a high speed.

  A gas deposition method is known as a method for producing a structure by spraying a material made of fine particles onto a substrate. In this method, fine particles of metal or ceramics are aerosolized, and the fine particles are accelerated through a minute nozzle to form a film on the surface of the substrate. As a technique improved from the gas deposition method, a production method such as a fine particle beam deposition method or an aerosol deposition method is known. This is a method in which an aerosol containing fine particles is sprayed from a nozzle toward a substrate at high speed, the fine particles collide with the substrate, and a structure is formed on the substrate by a mechanical impact force generated at the time of the collision. In the case of producing a film-like structure by spraying fine particles on the substrate in this way, it is important that the fine particles efficiently form the structure on the substrate when the fine particles are sprayed. For this reason, in the aerosol deposition method or the like, it is important to use useful fine particles that can efficiently form a structure. In Patent Document 1, a shielding plate is provided so as to face the aerosol flow. It is proposed to classify the particles by depositing and removing fine particles having a specific particle size or more and use them for the production of a structure.

  That is, in (Patent Document 1), fine particles that are etched by being sprayed onto the substrate are classified by the shielding plate in the nozzle.

Japanese Patent Laid-Open No. 11-21677

  However, in the above-described conventional technology, the aerosol is configured such that fine particles having a specific particle size or more are classified and then sprayed onto the substrate. Therefore, when the classified aerosol is conveyed in the conveyance tube and the nozzle, the fine particles are separated from each other. There is a risk of recombination to produce fine particles having a large particle size. Therefore, when the classified aerosol is sprayed onto the substrate, fine particles having a specific particle size or more that cause etching may be sprayed, which may make it impossible to produce an efficient structure.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a structure manufacturing method capable of suppressing the occurrence of etching on a substrate and forming an efficient film.

  The present invention relates to a structure manufacturing method for manufacturing a film-like structure by spraying an aerosol, which is a mixture of fine particles and gas, onto a substrate at a high speed from an emission port of the nozzle. The aerosol is a nozzle between the nozzle and the substrate. A speed conversion means for closing the projection area of the exit is provided.

  According to the present invention, the velocity conversion means provided between the nozzle and the substrate can suppress the inhibition of the structure production due to the etching of the fine particles constituting the aerosol without performing a special treatment for the fine particles and the aerosol. Therefore, a uniform and stable film-like structure can be produced efficiently.

Schematic diagram of a structure manufacturing apparatus based on the structure manufacturing method of Embodiment 1 of the present invention Schematic diagram of the nozzle of the structure manufacturing apparatus based on the structure manufacturing method of Embodiment 1 of the present invention Schematic diagram showing the emission state of fine particles in the structure manufacturing apparatus based on the structure manufacturing method of Embodiment 1 of the present invention Schematic diagram showing the state of structure fabrication based on conventional structure fabrication methods Schematic diagram of classifier in conventional structure manufacturing method Schematic diagram showing the particle size distribution of fine particles in the state of manufacturing a structure using a conventional classifier Schematic diagram of a structure manufacturing device that verifies the structure manufacturing status using conventional nozzles Schematic diagram showing the film thickness distribution of the structure manufactured in the configuration shown in FIG. The schematic diagram showing the emission condition of the fine particle in the structure preparation apparatus based on the structure preparation method of Embodiment 2 of this invention The schematic diagram showing the emission condition of the fine particle in the structure preparation apparatus based on the structure preparation method of Embodiment 3 of this invention The schematic diagram showing the emission condition of the fine particle in the structure preparation apparatus based on the structure preparation method of Embodiment 4 of this invention Schematic diagram showing the emission state of fine particles in a structure manufacturing apparatus based on the structure manufacturing method of Embodiment 5 of the present invention The schematic diagram showing the emission condition of the fine particle in the structure preparation apparatus based on the structure preparation method of Embodiment 6 of this invention Schematic diagram showing the emission state of fine particles in the structure manufacturing apparatus based on the structure manufacturing method of Embodiment 7 of the present invention

  The present invention relates to a structure manufacturing method for manufacturing a film-like structure by spraying an aerosol, which is a mixture of fine particles and gas, onto a substrate at a high speed from an emission port of the nozzle. The aerosol is a nozzle between the nozzle and the substrate. Etching is suppressed by converting the speed of at least the etching particles having a high etching effect among the fine particles by the speed converting means for closing the projection area of the emission port. As a result, it is possible to suppress the structure production inhibition due to the etching of the fine particles constituting the aerosol without performing a special treatment for the fine particles or the aerosol, and thus, an efficient, uniform and stable film-like structure is produced. be able to.

  Desirably, in the structure manufacturing method, the speed conversion means is scanned so as to maintain a relative position with respect to the nozzle and change a relative position with respect to the substrate. As a result, it is possible to suppress the structure production inhibition due to the etching of the fine particles constituting the aerosol without performing a special treatment for the fine particles or the aerosol, and thus, an efficient, uniform and stable film-like structure is produced. be able to.

  Desirably, in the structure manufacturing method, the distance between the speed converting means and the nozzle is greater than the length of the longest side of the nozzle outlet. As a result, it is possible to suppress the structure production inhibition due to the etching of the fine particles constituting the aerosol without performing a special treatment for the fine particles or the aerosol, and thus, an efficient, uniform and stable film-like structure is produced. be able to.

  Desirably, in the structure manufacturing method, the size of the speed converting means is larger than the size of the outlet of the nozzle. As a result, it is possible to suppress the structure production inhibition due to the etching of the fine particles constituting the aerosol without performing a special treatment for the fine particles or the aerosol, and thus, an efficient, uniform and stable film-like structure is produced. be able to.

  Desirably, in the structure manufacturing method, the speed converting means deposits and removes at least etching particles. As a result, it is possible to suppress the structure production inhibition due to the etching of the fine particles constituting the aerosol without performing a special treatment for the fine particles or the aerosol, and thus, an efficient, uniform and stable film-like structure is produced. be able to.

  Desirably, in the structure manufacturing method, the speed converting means reduces at least the speed of the etching particles with respect to the substrate. As a result, it is possible to suppress the structure production inhibition due to the etching of the fine particles constituting the aerosol without performing a special treatment for the fine particles or the aerosol, and thus, an efficient, uniform and stable film-like structure is produced. be able to.

  Desirably, in the structure manufacturing method, the etching particles are fine particles having a mass larger than the average value of the masses of the fine particles constituting the aerosol. As a result, it is possible to suppress the structure production inhibition due to the etching of the fine particles constituting the aerosol without performing a special treatment for the fine particles or the aerosol, and thus, an efficient, uniform and stable film-like structure is produced. be able to.

  Desirably, in the structure manufacturing method, the speed converting means is configured to relieve an impact force when the fine particles collide. As a result, it is possible to suppress the structure production inhibition due to the etching of the fine particles constituting the aerosol without performing a special treatment for the fine particles or the aerosol, and thus, an efficient, uniform and stable film-like structure is produced. be able to.

  Desirably, in the structure manufacturing method, the speed converting means is composed of at least a suction tube for sucking etching particles. As a result, it is possible to suppress the structure production inhibition due to the etching of the fine particles constituting the aerosol without performing a special treatment for the fine particles or the aerosol, and thus, an efficient, uniform and stable film-like structure is produced. be able to.

  Desirably, in the structure manufacturing method, the fine particles sucked by the suction tube are emitted again from the nozzle as an aerosol. As a result, it is possible to suppress the structure production inhibition due to the etching of the fine particles constituting the aerosol without performing a special treatment for the fine particles or the aerosol, and thus, an efficient, uniform and stable film-like structure is produced. be able to.

  Desirably, in the above structure manufacturing method, the structure is manufactured from fine particles useful for forming a structure other than the etching particles. As a result, it is possible to suppress the structure production inhibition due to the etching of the fine particles constituting the aerosol without performing a special treatment for the fine particles or the aerosol, and thus, an efficient, uniform and stable film-like structure is produced. be able to.

  Desirably, in the structure manufacturing method, the speed conversion unit is bonded to the nozzle by one bonding surface, and the speed conversion unit is scanned in a direction perpendicular to the bonding surface. As a result, it is possible to suppress the structure production inhibition due to the etching of the fine particles constituting the aerosol without performing a special treatment for the fine particles or the aerosol, and thus, an efficient, uniform and stable film-like structure is produced. be able to.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
First, the first embodiment will be described. FIG. 1 is a schematic view of a structure manufacturing apparatus based on the structure manufacturing method of the present invention. In FIG. 1, reference numeral 1 denotes a gas constituting the aerosol, and an aerosol 4 is generated by mixing the gas 1 and the fine particles 3 in the aerosol generation chamber 2. In addition, the aerosol generation chamber 2 and the structure preparation chamber 5 are connected via a transfer pipe 6, and the structure preparation chamber 5 is a vacuum pump connected to the other end of the transfer pipe 6 in the structure preparation chamber 5. 7 is exhausted. As a result, a differential pressure is generated between the aerosol generation chamber 2 and the structure production chamber 5, and the aerosol 4 generated in the aerosol generation chamber 2 is transported through the transport pipe 6 due to the differential pressure, and the transport pipe 6 The light is emitted from the emission port of the nozzle 8 provided at the tip of the nozzle. At this time, the fine particles 3 emitted from the nozzle 8 are sprayed onto the base 9 through the speed conversion means 11 between the nozzle 8 and the base 9 to form a film-like structure 10.

  The speed conversion means 11 has a structure that suppresses etching by converting the speed of etching particles having a high etching effect with respect to the substrate 9 among the fine particles 3 constituting the aerosol 4. It consists of a structure that changes the speed of etching particles with high straightness provided in the projection area of the exit port. As a result, the speed conversion means 11 can deposit or decelerate the etching particles by attaching or repelling the fine particles 3 in the projection area of the exit of the nozzle 8 and suppress the spraying of the etching particles directly to the substrate 9. can do. The speed conversion means 11 is configured by a structure capable of converting the speed of etching particles, and can be appropriately selected from glass, metal, resin, and the like. Alternatively, the speed conversion unit 11 may have a structure that sucks etching particles provided in the projection region of the emission port of the nozzle 8. In this case, the speed conversion means 11 has a cylindrical structure provided in the projection area of the emission port of the nozzle 8, and can be appropriately selected from glass, metal, resin, and the like. The fine particles 3 whose etching is suppressed by the speed converting means 11 are sprayed on the base 9, and an efficient structure production can be realized.

  The gas 1 is adjusted, for example, to a suitable pressure such as 1 MPa, for example, by a regulator or the like, if necessary, for example 5 LPM via a flow meter such as a mass flow controller. The flow rate is adjusted to such that it is introduced into the aerosol generation chamber 2. As the gas 1, an inert gas such as helium, argon, krypton or nitrogen, or a reactive gas such as oxygen or dry air can be appropriately selected and used. For example, by selecting a reactive gas, the structure In the product preparation chamber 5, the film-like structure 10 can be formed while reacting the gas 1 and the fine particles 3.

  In the structure production chamber 5, the velocity of the aerosol 4 sprayed onto the substrate 9 is the pressure in the aerosol production chamber 2, the pressure in the structure production chamber 5, the inner diameter and length of the transfer tube 6 or nozzle 8, the type of gas 1, etc. It depends on. For this reason, it is important that the type of the gas 1 is appropriately selected and used based on the particle size of the fine particles 3 forming the film-like structure 10 or the particle size, strength, quantity, etc. of the fine particles 3 contained in the aerosol 4. It is. By using appropriate fine particles 3 in a well-designed system, the velocity of the aerosol 4 becomes almost equal to the sound velocity of the gas 1 constituting the aerosol, and by using, for example, argon as the gas 1, a velocity of 300 m / s. Can be obtained.

  The fine particles 3 are sprayed with gas 1 in the aerosol generation chamber 2 to form an aerosol 4 mixed with the gas 1. The fine particles 3 may be any particles that can form the structure 10 by being sprayed onto the substrate 9 as the aerosol 4. For example, zinc oxide (ZnO) having an average particle size of 0.2 micrometers is sufficiently dried and used. Can do. Since the average particle size of the fine particles 3 is sufficiently small, for example, 0.2 micrometers, it is not easy to prepare the fine particles 3 having a uniform particle size, and the fine particles useful for forming the structure 10 In addition, fine particles having a large particle diameter of, for example, 1 micrometer are included. Among the fine particles constituting such an aerosol, the fine particles having a large particle size have a large mass, so that the impact force upon collision with the substrate 9 is large, and the structure formation is inhibited as etching particles that easily etch the structure 10. To do. The etching particles emitted from the nozzle 8 collide with the substrate 9 as etching particles having a high degree of straightness because of the large momentum when emitted, and the impact force at the time of collision increases due to the large momentum. In general, in the aerosol deposition method, the etching particles are composed of fine particles having a mass larger than the average value of the masses of the fine particles constituting the aerosol, and it is not easy to completely remove the etching particles. As the etching particles, for example, zinc oxide having an average particle diameter of 0.2 micrometers, fine particles having a particle diameter of approximately 0.8 micrometers or more cause etching as etching particles. For example, the average particle diameter is 0.3 micrometers. In the case of zirconium oxide, fine particles having a particle diameter of approximately 0.5 micrometers or more are etched as etching particles. In addition, the particle size of the etching particles varies depending on the state of the fine particles. For example, if zinc oxide having an average particle size of 0.5 μm without any treatment such as milling is used, 0.5 μm fine particles are also etched as etching particles. It comes to occur.

The material that can be used as the fine particles 3 is not limited to zinc oxide (ZnO), and may be any particles that can form the structure 10 by being sprayed onto the substrate 9 as the aerosol 4, such as aluminum oxide (Al ₂ O ₃ ), oxidized Titanium (TiO ₂ ), zinc oxide (ZnO), tungsten oxide (WO ₃ ), tin oxide (SnO ₂ ), indium oxide (In ₂ O ₃ ), molybdenum oxide (MoO ₃ ) iron oxide (Fe ₂ O ₃ ), Zirconium oxide (ZrO ₂ ), yttrium oxide (Y ₂ O ₃ ), chromium oxide (Cr ₂ O ₃ ), hafnium oxide (HfO ₂ ), beryllium oxide (BeO), magnesium oxide (MgO), silicon oxide (SiO ₂ ) gadolinium oxide (Gd ₂ O _3), yttrium vanadate (YVO _4), metal oxides such as lanthanum oxide (La ₂ O _2), diamond , Boron carbide (B ₄ C), silicon carbide (SiC), titanium carbide (TiC), zirconium carbide (ZrC), vanadium carbide (VC), niobium carbide (NbC), chromium carbide (Cr ₃ C _2), tungsten carbide (WC), molybdenum carbide (Mo ₂ C), carbide such as tantalum carbide (TaC), aluminum nitride (AlN), silicon nitride (Si ₃ N ₄ ), niobium nitride (NbN), tantalum nitride (TaN), titanium nitride (TiN), boron nitride (BN), gadolinium nitride (GaN), nitrides such as Sr ₂ Si ₅ N ₈ , zinc sulfide (ZnS), strontium sulfide (SrS), cadmium sulfide (CdS), calcium sulfide (CaS) , SrGa sulfides such as ₂ S _4, boron (B), boride aluminum (AlB _2), boride silicon (SiB _4), titanium boride (TiB _2), boride Rukoniumu (ZrB _2), boride vanadium (VB _2), boride niobium (NbB), boride tantalum (TaB _2), chromium boride (CrB), molybdenum boride (MoB), tungsten boride (WB) and the like Borate, aluminates such as yttrium aluminate (Y ₃ Al ₅ O ₁₂ ), strontium aluminate (Sr ₄ Al ₄ O ₂₅ ), zinc silicate (Zn ₂ SiO ₄ ), yttrium silicate (Y ₂ SiO ₁₀ ) Silicates such as strontium silicate (Sr ₂ SiO ₄ ), oxysulfides such as yttrium oxysulfide (Y ₂ O ₂ S), gadolinium oxysulfide (Gd ₂ O ₂ S), and lanthanum oxysulfide (La ₂ O ₂ S) , Halophosphates such as chloroapatite (Ca ₅ (PO ₄ ) ₃ Cl), phosphates such as Sr ₂ P ₂ O ₇ , or mixtures thereof, barium titanate (BaTiO 3) _3), bismuth sodium titanate (BiNaTiO _3), bismuth titanate _{(Bi 4 Ti 3 O 12)} , potassium niobate (KNbO _3), sodium niobate (NaNbO _3), lithium niobate (LiNbO _3), tantalate lithium (LiTaO _3), lead titanate (PbTiO _3), lithium titanate (LiTiO _2), strontium titanate (SrTiO _3), aluminum titanate (AlTiO _3), lead zirconate titanate (PZT), lead zirconate titanate Piezoelectric ceramics such as lead lanthanum acid (PLZT), solid solutions based on these, high toughness ceramics such as sialon and cermet, and so-called brittle materials such as biocompatible ceramics such as hydroxyapatite and calcium phosphate are used. Can also these materials It may be a composite material or a mixed material obtained by combining a plurality of materials from a material. In addition, these brittle materials include ions of rare earth metals such as Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, and Yb, Ag, Al, Mn, Au, In, and Cu. A fluorescent material in which ions of a metal such as Sb are combined as an activator element or a coactivator element can be used, or a metal such as Ag, Al, Cr, Au, Fe, Cu, or an alloy thereof is used. Fine particles can also be used.

  The fine particles 3 preferably have a structure in which an active new surface is generated by crushing and the film-like structure 10 is easily formed, and the particle size is preferably several micrometers or less. Moreover, it is preferable that the fine particles 3 are not crushed and adhere to the substrate 9 and do not form a green compact that obstructs the formation of the film-like structure 10, and the particle size thereof is several tens of nanometers or more. preferable. If the fine particles 3 are not in this particle size range, it is preferable to adjust the particle size of the fine particles 3 by granulation, crushing, or crushing. It is not easy to control. Alternatively, in order to efficiently produce the film-like structure 10, it is preferable that the fine particles 3 are efficiently crushed. The fine particles 3 are subjected to internal strain or It is preferable to form minute cracks or to crush the aggregated fine particles 3. Such mechanical impact force can be applied, for example, by a process such as ball milling or bead milling, but the fine particles 3 are applied, for example, 100 before being stored in the aerosol generation chamber 2 after the mechanical impact force is applied. It is preferable to dry by heating at a high temperature of ˜300 ° C. Alternatively, the fine particles 3 are preferably dried in a vacuum atmosphere reduced to a pressure lower than the atmospheric pressure before being accommodated in the aerosol generation chamber 2.

  The aerosol generation chamber 2 only needs to be able to generate the aerosol 4 by mixing the gas 1 and the fine particles 3. As a simple structure, the fine particle 3 is accommodated in a container and the gas 1 is sprayed as shown in FIG. Thus, the structure in which the fine particles 3 are caused to rise in the gas 1 to generate the aerosol 4 is generally used, and a container such as glass or metal can be used. In order to stably generate and hold the aerosol 4, it is preferable that the inner surface of the aerosol generation chamber 2 has a structure in which the fine particles 3 do not easily adhere. For example, a material having high water repellency such as a fluororesin may be used. It is also possible to use high-quality materials. In addition, by heating the aerosol generation chamber 2, it is possible to suppress the fine particles 3 from adhering to the aerosol generation chamber 2 or to remove water adhering to the fine particles 3. The aerosol generation chamber 2 is connected to the structure preparation chamber 5 via the transfer pipe 6, and the structure preparation chamber 5 is evacuated by the vacuum pump 7 connected to the structure preparation chamber 5. The vacuum pump 7 evacuates through the transfer pipe 6. Therefore, the aerosol generation chamber 2 is preferably strong enough to withstand the degree of vacuum achieved by the vacuum pump 7.

  When the gas 1 is sprayed onto the fine particles 3 in the aerosol generation chamber 2, the aerosol generation chamber 2 is stably generated by means of applying a mechanical force such as a motor or a vibrator. Alternatively, a mechanical force may be applied to the fine particles 3 accommodated in the aerosol generation chamber 2. For example, since the fine particles 3 accommodated in the aerosol generation chamber 2 are agitated by applying mechanical vibration using the rotational force of the motor, the aerosol 4 can be generated stably.

  The structure manufacturing chamber 5 may have any structure as long as the structure 10 can be formed by spraying the aerosol 4 on the base body 9. In the structure manufacturing chamber 5, the aerosol 4 is sprayed onto the substrate 9 through the nozzle 8. At this time, the fine particles 3 constituting the aerosol 4 collide with the substrate 9 and are crushed by the mechanical impact force, and the active new surface formed thereby is bonded to the substrate 9 or the active new surfaces are bonded to each other. Thereby, the film-like structure 10 is formed. Since the structure manufacturing chamber 5 is evacuated by the vacuum pump 7 connected to the structure manufacturing chamber 5, the structure manufacturing chamber 5 should be strong enough to withstand the degree of vacuum achieved by the vacuum pump 7. preferable.

  The transport pipe 6 and the nozzle 8 may be of any strength as long as they can transport the aerosol 4 and can withstand vacuum, and can be appropriately selected from glass, metal, resin, and the like. Further, in order to stably generate and hold the aerosol 4 in the transport pipe 6 and the nozzle 8, it is preferable that the inner surfaces of the transport pipe 6 and the nozzle 8 have a structure in which the fine particles 3 do not easily adhere. A material having high water repellency or a material having high conductivity can also be used. In addition, by heating the transport pipe 6 and the nozzle 8, it is possible to suppress the fine particles 3 from adhering to the transport pipe 6 and the nozzle 8, or to remove the water attached to the fine particles 3. In the transport path such as the transport pipe 6 and the nozzle 8 for transporting the aerosol 4, a rapid change in the transport path, such as a sharp bend or narrowing of the transport path, tends to cause the fine particles 3 to easily adhere to the clogged fine particles 3. For this reason, the conveyance pipe 6 and the nozzle 8 use the conveyance pipe 6 and the nozzle 8 having a shape that is close to a straight line without a sudden change in the path, and perform the adhesion prevention treatment of the fine particles 3 on the portion where the path changes. Is preferred. Or about the conveyance pipe | tube 6, even if the microparticles | fine-particles 3 adhere by using the conveyance pipe | tube 6 with a sufficiently large diameter, clogging of the microparticles | fine-particles 3 can be suppressed.

  When the film-like structure 10 is formed by spraying the aerosol 4 on the substrate 9, the fine particles 3 are crushed by the mechanical impact force when colliding with the substrate 9, and the active new surface formed thereby is bonded. Thus, the structure 10 is formed. For this reason, the mechanical impact force when the fine particles 3 collide with the substrate 9 is important. This mechanical impact force depends on the mass of the fine particles 3 and the speed of the fine particles 3 with respect to the substrate 9 when it collides with the substrate 9 as the aerosol 4. The particle size of the fine particles 3 and the speed at which the aerosol 4 is sprayed are determined. It becomes important. Further, the speed of the fine particles 3 with respect to the base 9 when it collides with the base 9 depends on the pressure in the structure production chamber 5 and the aerosol generation chamber 2, the type of the gas 1, the shape of the nozzle 8, the speed blown from the nozzle 8, and the like. is doing. Therefore, it is important to appropriately design and use the shape of the nozzle 8 in accordance with the structure manufacturing conditions. For example, the width of the short side of the emission port of the nozzle 8 is set to a length of 0.5 mm for sufficient acceleration. The fine particles 3 thus obtained can be obtained. Further, the width of the long side of the emission port of the nozzle 8 is preferably selected as appropriate according to the shape of the structure to be produced. For example, by using a nozzle having a long long side such as 100 mm, a structure with a large area is used. An object can also be produced uniformly. When using such a long nozzle with a long side, in order to stably emit fine particles 3 uniformly from the nozzle, a plurality of transfer pipes 6 from the aerosol generation chamber 2 to the nozzle 8 may be used, It is necessary to devise such as using a conveyance pipe 6 having a large diameter. Alternatively, for example, by using a nozzle having a long side such as 10 mm, it is possible to stably produce a structure having a small area and good uniformity.

  Further, it is important that the distance between the nozzle 8 and the base 9 is set so that the fine particles 3 collide with the base 9 at a sufficient speed, and the space in which the speed of the fine particles 3 is not disturbed by the flow of the aerosol 4. Is preferably provided. For example, when the distance between the nozzle 8 and the substrate 9 is set to 10 mm and the aerosol 4 is sprayed onto the substrate 9, the flow of the aerosol 4 is less likely to be disturbed, and the structure 10 is formed in the projection area of the emission port of the nozzle 8 on the substrate 9. Is formed. Alternatively, by setting the distance between the nozzle 8 and the substrate 9 to be close to each other, for example, 2 mm, the influence of the atmosphere in the structure manufacturing chamber 5 is suppressed, and the velocity accelerated in the nozzle 8 of the aerosol 4 is sufficiently high. The fine particles 3 can be sprayed in a state of being held in the water. Alternatively, for example, by separating the nozzle 8 and the substrate 9 by 50 mm, the fine particles 3 can be sprayed without being affected by the disturbance of the aerosol flow caused by spraying the aerosol 4 onto the substrate 9. Of the fine particles 3 emitted from the emission port of the nozzle 8, the fine particles 3 having a large particle size and a large mass are sprayed on the substrate 9 with good straightness due to the large inertial force accelerated in the nozzle 8, and the particle size is small and the mass is small. The small fine particles 3 are affected by the aerosol flow of the aerosol 4 and are sprayed onto the substrate 9 while spreading.

  In the configuration in which the aerosol 4 is accelerated at the nozzle 8 so as to obtain an appropriate impact force and sprayed onto the substrate 9, the fine particles 3 are easily clogged in a narrow region of the nozzle 8. For this reason, in the nozzle 8, for example, a fluororesin coating, a conductive coating, a nozzle heating structure, a vibration structure, or the like is used to prevent the adhesion of the fine particles 3. It is important to make the shape difficult to adhere by.

  The vacuum pump 7 exhausts the gas 1 in the structure manufacturing chamber 5 and exhausts the aerosol generation chamber 2 through the transport pipe 6. The vacuum pump 7 does not need a high degree of vacuum required in a semiconductor process such as ultra-high vacuum. For example, an ultimate degree of vacuum of about several Pa may be obtained, and is appropriately selected from vacuum pumps such as a rotary pump and a mechanical booster pump. can do. Since the vacuum pump 7 generates a vacuum in the structure manufacturing chamber 5 and also determines the velocity of the aerosol 4 sprayed from the nozzle 8, the vacuum pump 7 is appropriately selected according to the manufacturing conditions of the film-like structure 10. Is important.

The substrate 9 only needs to be able to form a structure composed of the fine particles 3 on the surface thereof by spraying the aerosol 4 through the nozzle 8 in the structure production chamber 5. As the substrate 9 having low cost and smoothness, for example, soda lime glass Such glass can be used. Alternatively, for example, semiconductors such as silicon (Si), silicon dioxide (SiO ₂ ), silicon nitride (SiN), aluminum oxide (Al ₂ O ₃ ), gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC). Highly smooth substrates such as substrates, glass substrates such as alkali glass and quartz, polyethylene terephthalate, polycarbonate, polymethyl methacrylate, polyether sulfone, polyvinyl fluoride, polypropylene, polyethylene, polyacrylate, amorphous polyolefin, fluorine resin Resin materials such as polysiloxane and polysilane, metal oxides such as zinc oxide (ZnO), niobium oxide (Nb ₂ O), tantalum oxide (Ta ₂ O ₅ ), hafnium oxide (HfO ₂ ), and titanium oxide (TiO ₂ ) Etc. Can, a multilayer substrate formed by laminating a plurality of substrate materials can be used as the substrate 9. The substrate 9 is not limited to a planar substrate. For example, a substrate having a cylindrical shape, a spherical shape, a rectangular parallelepiped shape, or a substrate on which a concavo-convex structure necessary for forming a structure is formed. Even if it is a structure, it may have any shape as long as a film-like structure can be formed. A resistor, a capacitor, an inductor, You may form the circuit which consists of a diode transistor and wiring.

  Further, in order to efficiently form the film-like structure 10 on the substrate 9, it is important that the fine particles 3 are efficiently crushed on the substrate 9, and for this purpose, the hardness of the substrate 9 is the structure. It is preferable to select and use as appropriate according to manufacturing conditions. Or when using the base | substrate 9 which does not produce efficient crushing, formation of an efficient structure is possible by using the base | substrate 9 which previously formed the film | membrane which consists of the material which produces crushing efficiently on the surface of the base | substrate 9. . For example, the film-like structure 10 may be formed after forming a thin film by a semiconductor process such as vapor deposition or sputtering, or fine particles may be formed by an aerosol deposition method using materials or conditions different from the target structure 10. After spraying 3, the film-like structure 10 may be produced. Alternatively, for example, by using a material different from the base material 9 such as a resist resin used in semiconductor photolithography, an area where the crushing is efficiently generated on the surface of the base body 9 and an area where it does not occur are selected on the base body 9. Alternatively, the structure 10 can be formed.

  The aerosol deposition method does not include a step of applying heat to the substrate 9 at the time of manufacturing the structure, and therefore can be easily used even with a resin having a low glass transition point. In the case where a film-like resin is used as the substrate 9, the structure can be easily produced on the film by being attached to a member such as glass in order to facilitate handling at the time of producing the structure.

  By spraying the aerosol 4 through the speed conversion means 11, the structure 10 formed on the substrate 9 is efficiently manufactured because it does not hinder the structure preparation due to etching. Further, since etching by etching particles does not occur, the structure 10 is manufactured without being damaged by the etching, and a good structure in which local distortion or defect does not occur in the structure 10 is formed. become. Moreover, since the surface of the structure 10 is not damaged by etching, a flat structure having an arithmetic average roughness Ra of 0.1 μm or less can be formed, for example. Furthermore, since fine particles having a specific particle size or more are not sprayed at high speed, there is no region composed of fine particles having a specific particle size or more inside the structure 10, and the uniformity due to the crushed fine particles is good. A structure is formed.

  The nozzle 8 of the first embodiment in the schematic diagram shown in FIG. 1 will be described in detail with reference to FIG. FIG. 2 is a schematic diagram of the nozzle 8 of the structure manufacturing apparatus based on the structure manufacturing method of Embodiment 1 of the present invention. In FIG. 2, a nozzle 8 is connected to an aerosol generation chamber by a transport pipe 6 and has a structure having an aerosol outlet on the side opposite to the transport pipe 6. Moreover, the speed conversion means 11 is provided in the projection area | region of the exit port of the nozzle 8 at the front-end | tip of the exit port of the nozzle 8, and etching can be suppressed by converting the speed with respect to the base | substrate of an etching particle.

  The method of changing the speed of the etching particles is not limited as long as the speed of the etching particles with respect to the substrate can be changed. The method of changing the speed by depositing and removing the etching particles on the speed converting means 11 or the speed of etching particles. The method can be appropriately selected according to the characteristics of the fine particles used for manufacturing the structure from the method of reducing the speed with respect to the substrate 9 by colliding with the conversion means 11. As a result, the speed converting means 11 can convert the speed of the fine particles having a high degree of straightness emitted from the outlet of the nozzle 8, and the speed of the etching particles having a high degree of straightness and a high etching effect among the fine particles constituting the aerosol. Can be converted.

  As a method of changing the speed by depositing and removing the etching particles, it is preferable that the etching particles be sufficiently deposited. For example, in a region larger than the emission port of the nozzle 8, It is formed by a structure formed at a parallel angle. As a result, the etching particles emitted from the emission port of the nozzle 8 can be sufficiently deposited and removed, and the speed can be converted. When the speed converting means 11 is configured to deposit and remove etching particles, the etching particles are deposited on the speed converting means 11 and removed as unnecessary fine particles. Therefore, the etching particles are not sprayed on the substrate 9, so that it is possible to suppress the structure fabrication hindrance due to the etching. However, when a structure is produced for a long time, there may be a problem that the deposited etching particles are peeled off and sprayed onto the substrate 9, so that maintenance such as removing the deposited etching particles is necessary.

  As a method of causing the etching particles to collide with the speed converting means 11 and reducing the speed with respect to the base 9, it is sufficient that the etching particles can be decelerated to a speed smaller than the speed at which etching occurs. The region is formed by a structure formed at an angle of, for example, 30 degrees with respect to an angle parallel to the emission port of the nozzle 8. As a result, the etching particles that have traveled straight at a speed of sound perpendicular to the base 9 are speed-converted by the speed conversion means 11 to, for example, an angle of 60 degrees with respect to the base 9 to a speed less than half the speed of sound. Become. As a method of reducing the speed with respect to the substrate 9, it may be formed by a structure parallel to the emission port of the nozzle 8, and the etching particles sprayed on the speed conversion means 11 are adhered or repelled by the speed conversion means 11. And is sprayed onto the substrate 9 along the aerosol flow.

  Since the etching particles are emitted from the emission port of the nozzle 8 with good straightness, it is important to provide the speed conversion means 11 at least in the projection region of the emission port of the nozzle 8. In particular, in order to completely suppress the etching by the etching particles, it is important to block all the projection areas of the emission port of the nozzle 8. The projection area of the exit port of the nozzle 8 is a space or an area on the substrate 9 having the same shape and the same size as the exit port of the nozzle 8. Further, depending on the structure fabrication conditions such as the pressure in the structure fabrication chamber and the concentration of the aerosol, the etching particles may be sprayed from the nozzle 8 while spreading from the outlet of the nozzle 8. It is necessary to block the entire projection area of the exit port and to provide the speed conversion means 11 in an area larger than the projection area of the exit port. In other words, the speed conversion means 11 only needs to be speed-converted, that is, to reduce the speed of the etching particles so that the etching particles are not sprayed at the same speed after the nozzles 8 are emitted from the nozzles 8. In order to suppress the influence of the etching particles sprayed while spreading, a structure larger than the exit of the nozzle 8 may be used. However, since the speed conversion means also converts the fine particles useful for structure formation, the speed conversion means 11 must at least contain fine particles that are not speed-converted by the speed conversion means 11 in order to produce an efficient structure. The shape that is sprayed on the nozzle 8 is preferable, and the shape that is not disposed in at least one region on the long side of the projection region of the emission port of the nozzle 8 is preferable.

  When the speed converting means 11 is configured to decelerate the speed of the etching particles with respect to the substrate 9, the etching particles are not removed but are decelerated to the extent that etching does not occur and sprayed onto the substrate 9. As a result, the etching particles are not deposited on the speed conversion means 11, so that maintenance such as removal of the etching particles deposited on the speed conversion means 11 is unnecessary. However, since the etching particles are sprayed on the substrate 9 after being decelerated by the speed converting means 11, it is necessary to verify in advance the effect of the structure fabrication inhibition by etching.

  In FIG. 2, the velocity converting means 11 has a structure for changing the velocity of etching particles by colliding with aerosol. At least the fine particles in the projection region of the outlet of the nozzle 8 are emitted to the side of the nozzle 8 where the aerosol is emitted. It has a structure that prevents adhesion or repulsion and direct spraying onto the substrate 9, and can be appropriately selected from glass, metal, resin, and the like. In order to suppress the etching by the etching particles, it is important to change the speed of the etching particles with respect to the base 9, and a configuration for reducing the speed of the etching particles in the direction perpendicular to the surface of the base 9 is easy. Such a structure may be a structure provided at least in the projection region of the exit port of the nozzle 8. In the case of a structure that slows down by depositing etching particles, in order to deposit etching particles sufficiently, The speed converting means 11 is preferably composed of a structure larger than the outlet of the nozzle 8.

  In addition, since the aerosol emitted from the nozzle 8 is likely to be disturbed by the velocity conversion means 11, for example, an aerosol rectifying means that adjusts the aerosol flow, including a plurality of groove-like structures along the aerosol flow, is provided. It may be provided. Alternatively, by making a hole for rectifying the flow of the aerosol in a portion other than the region where the speed conversion unit 11 converts the speed, or by making the shape of the speed conversion unit 11 a shape having a good symmetry or a streamline shape, The flow of aerosol can also be rectified. In FIG. 2, the speed conversion means is configured to speed-convert the fine particles in the projection area of the exit of the nozzle 8, but may be configured to speed-convert the fine particles in a larger area depending on how the etching particles spread. However, since the fine particles useful for structure formation are also converted by the speed conversion means, it is preferable to select appropriately so as to minimize the speed-converted fine particles for efficient structure production. .

  The state of manufacturing the structure of the first embodiment will be described in detail with reference to FIG. FIG. 3 is a schematic diagram showing a state of emission of fine particles in the structure manufacturing apparatus based on the structure manufacturing method of Embodiment 1 of the present invention. In FIG. 3, the nozzle 8 is connected to the aerosol generation chamber by a transport pipe 6 and has a structure including an emission port for the aerosol 4 on the side opposite to the transport pipe 6. Further, the nozzle 8 and the substrate 9 are scanned so as to change their relative positions, whereby a highly uniform structure can be produced on the substrate in a range wider than the emission port of the nozzle 8.

  A structure for reducing the speed of the etching particles with respect to the base 9 is provided as speed conversion means 11 at least in the projection region of the exit of the nozzle 8 between the nozzle 8 at the tip of the exit of the nozzle 8 and the base 9. It has been. When the fine particles 3 emitted from the nozzle 8 are sprayed onto the base 9, the speed conversion means 11 is provided between the nozzle 8 and the base 9, so that the speed of the fine particles 3 traveling straight by the speed conversion means 11 is converted. The Rukoto. Among the fine particles 3 constituting the aerosol 4, the fine particles 3 having a high etching effect have high straightness, so that the velocity conversion means 11 is provided in the projection area of the exit of the nozzle 8, whereby the velocity of the fine particles 3 having a high etching effect is increased. It can be converted.

  In addition, the distance between the nozzle 8 and the speed converting means 11 can sufficiently convert the speed with respect to the etching particles, and for the fine particles contributing to the production of the structure emitted while spreading from the outlet of the nozzle 8, It is important to arrange so that speed conversion does not occur. For example, the nozzles 8 are arranged with the same interval as the long side of the nozzle 8. Alternatively, the fine particles 3 are sprayed without being affected by the disturbance of the aerosol flow caused by spraying the aerosol 4 on the velocity converting means 11 by disposing the nozzle 8 at a position such as twice the length of the long side. Can do.

  For comparison, the state of manufacturing a structure using a conventional nozzle will be described with reference to FIGS. FIG. 4 is a schematic view showing a structure production state based on a conventional structure production method. In FIG. 4, the nozzle 8 is connected to the aerosol generation chamber by the transport pipe 6, and has a structure having an emission port for the aerosol 4 on the side opposite to the transport pipe 6. The aerosol 4 is emitted from the emission port of the nozzle 8 and sprayed onto the substrate 9 to form a structure. In the conventional structure manufacturing method, the fine particles 3 constituting the aerosol 4 are sprayed from the emission port of the nozzle 8 to the substrate 9 and are crushed by a mechanical impact force when colliding with the substrate 9 to form a structure. At this time, among the fine particles 3 constituting the aerosol 4 emitted from the nozzle 8, the fine particles 3 having a large mass have a greater inertial force due to acceleration in the nozzle 8 than the force by which the gas of the aerosol 4 spreads. Sprayed from 8 with good straightness. Further, among the fine particles 3 constituting the aerosol 4 emitted from the nozzle 8, the fine particles 3 having a small mass cannot ignore the force of spreading the gas of the aerosol 4 with respect to the inertial force caused by acceleration in the nozzle 8. , Sprayed from the nozzle 8 while spreading. Therefore, in the structure formed on the substrate 9, the formation of the structure by the fine particles 3 having a large mass is dominant in the projection area of the exit port of the nozzle 8. Structure formation by the fine particles 3 having a small mass becomes dominant. In order to suppress the fine particles 3 having a large mass, a configuration in which a classifier is provided between the nozzle 8 and the aerosol generation chamber and a configuration in which fine particles having a specific particle diameter or more are deposited and removed has been proposed. Yes.

  FIG. 5 is a schematic diagram of a classifier in a conventional structure manufacturing method. In FIG. 5, 14 is a classifier and 12 is a shielding plate. In the classifier 14, the aerosol 4 entering from the lower side of the classifier 14 is sprayed onto the shielding plate 12, so that the fine particles 3 having a specific particle size or more are removed by being deposited on the shielding plate 12, and the specific particle size is reduced. Fine particles 3 below are taken out from above the classifier 14. The aerosol 4 composed of the microparticles 3 having a specific particle size less than the specific particle size thus obtained is transported and sprayed to the nozzle 8 through the transport tube, and thus has a large mass composed of particles having a specific particle size or more. Attempts have been made to suppress 3 and produce a structure.

  However, it is not easy to generate an aerosol composed only of fine particles having a particle size suitable for structure production by pretreatment such as classification and crushing used in the prior art. This is because the aerosol used in the aerosol deposition method is composed of very small particles of several micrometers or less. Fine particles of several micrometers or less have a sufficiently small particle size, so that it is difficult to apply a large impact force and it is difficult to crush by collision. Further, classified fine particles having a sufficiently small mass are easily affected by electrostatic force and liquid crosslinking force, and the classified or crushed fine particles are likely to adhere to each other. For this reason, it is difficult to form fine particles having a single particle size with high accuracy by pretreatment such as classification or crushing. Therefore, the aerosol used in the usual aerosol deposition method is composed of fine particles with a particle size distribution of about several micrometers, except when using specially treated fine particles or fine particles made of a specific material. The

  The particle size distribution of such fine particles will be described with reference to FIG. FIG. 6 is a schematic diagram showing the particle size distribution of fine particles in the state of manufacturing a structure using a conventional classifier. In FIG. 6, the horizontal axis indicates the particle size of the fine particles, and the vertical axis indicates the number of particles. The solid line a in FIG. 6 shows the particle size distribution of the fine particles constituting the aerosol before classification. For example, the average particle size is 0.2 μm, and the particle size distribution is several micrometers wide. Yes.

  In FIG. 6, the fine particles constituting the aerosol can be divided into three regions according to the particle size. Region II in FIG. 6 shows a particle size suitable for structure production, and region I in FIG. A fine particle having a smaller particle diameter, region III indicates a fine particle region having a larger particle diameter.

  The fine particles in the region I are fine particles smaller than the particle size suitable for manufacturing the structure, and the mass thereof is small, so that the force due to the atmosphere after being emitted from the nozzle against the inertial force caused by acceleration in the nozzle. Cannot be ignored. Accordingly, the fine particles in the region I move along the atmosphere around the substrate when colliding with the substrate, and the mechanical impact force necessary for crushing cannot be obtained. For this reason, the fine particles in the region I adhere to the substrate as a green compact and obstruct the production of the structure.

  The fine particles in region III are fine particles larger than the particle size suitable for the construction of the structure, and since their mass is large, the inertial force due to acceleration in the nozzle is sufficiently large, so that the particles are sprayed straight from the nozzle onto the substrate with good straightness. It is done. Accordingly, the fine particles in the region III are sprayed onto the projection region of the emission port of the nozzle of the substrate when colliding with the substrate. The fine particles in region III are not sufficiently accelerated when sprayed onto the substrate as an aerosol because of their large mass. Fine particles with a specific particle size that are not sufficiently accelerated not only are not crushed when colliding with the substrate and do not form a structure, but also because the mass is large, the effect of etching the substrate and structure becomes stronger, and the structure Inhibits product production. At this time, since the fine particles in the region III have a large particle size and a sufficiently large mass, a large mechanical impact force is generated when they collide with the substrate. As a result, the fine particles in the region III will etch the structure and inhibit the production of the structure. In the aerosol deposition method, such etching particles are composed of fine particles having a mass larger than the average value of the mass of the fine particles constituting the aerosol, and it is not easy to completely remove the etching particles. .

  In the prior art, attempts have been made to improve the particle size distribution of aerosols containing fine particles having a specific particle size or larger indicated by the solid line a by pretreatment such as classification and crushing. However, fine particles used in the aerosol deposition method have a particle size as small as several micrometers or less, so it is not easy to actually control the particle size distribution with high accuracy.

  In the prior art, for example, classification is attempted by using the classifier shown in FIG. 5, but the fine particles having the particle size distribution shown by the solid line a in FIG. 6 are classified into the fine particles having the particle size distribution shown by the broken line b in FIG. Is done. In the prior art, the aerosol is sprayed onto the shielding plate to deposit and remove the fine particles having a specific particle size or more, so it is difficult to remove only the fine particles having the specific particle size or more. Therefore, when trying to completely deposit and remove fine particles having a specific particle size or larger in the region III by spraying the shielding plate, not only fine particles having a specific particle size or larger but also the region when the aerosol is sprayed on the shielding plate. Part of the fine particles that contribute to the formation of the II structure is also deposited and removed. Therefore, when the fine particles in the region III are sufficiently removed, the fine particles contributing to the formation of the structure in the region II are also reduced in the generation efficiency, thereby reducing the amount of fine particles in the region II. It becomes impossible to make things.

  Alternatively, when an attempt is made to increase the amount of the fine particles in the region II, the fine particles having a specific particle size or more in the region III cannot be completely removed, and the effect of removing the fine particles having a specific particle size or more by classification is reduced. For this reason, when the aerosol generated by classification is accelerated and sprayed onto the substrate, the manufactured structure is etched by the fine particles having a specific particle diameter or larger, so that an efficient structure cannot be manufactured.

  Alternatively, among the fine particles shown by the solid line a, there is an attempt to increase the amount of fine particles that contribute to the structure production by crushing the fine particles in the region III into fine particles in the region II. However, since the particle size of the microparticles is as small as several micrometers or less, it is not easy to crush the microparticles in the region III into the region II with high accuracy, and when special processing is performed or the microparticles are a specific material. Except for this, it is difficult to efficiently produce only the fine particles in the region II.

  In any case, when producing a structure by removing fine particles having high etching strength, as shown by a solid line a, and controlling the particle size distribution of pretreatment and the like. It is necessary to add a separate process for this purpose.

  In addition, since the fine particles obtained by classification have a sufficiently small particle size, they are strongly influenced by electrostatic force and liquid cross-linking force, so that the fine particles adhere easily. The fine particles having a small particle diameter in the region II or the region I produced by the fine particles in the region III being sprayed on the shielding plate and crushed by the impact force at that time have a very active new surface generated during the crushing. The fine particles adhere more easily than the fine particles in the region II. As described above, the aerosol obtained by classification includes not only fine particles having a specific particle size but also large fine particles formed by adhering a plurality of fine particles. If the distance to which the fine particles are transported increases from the classification step to the spraying step, the proportion of the fine particles adhering to each other also increases, so that a larger number of fine particles having a larger particle size is generated. Therefore, when the aerosol obtained by the classifier indicated by the broken line b in FIG. 6 is also conveyed to the nozzle and emitted from the outlet of the nozzle, the region as indicated by the one-dot chain line c in FIG. The particles of III are emitted as an increased aerosol.

  Further, in the prior art, a shielding plate is provided so as to face the aerosol flow, and aerosol is sprayed on the shielding plate to deposit and remove fine particles having a specific particle size or more constituting the aerosol on the shielding plate. Only fine particles having a specific particle diameter are classified. For this reason, when the aerosol is classified, all the fine particles that make up the aerosol are once sprayed on the shielding plate, so that not only fine particles with a specific particle size or larger to be deposited and removed but also fine particles useful for structure formation are shielded. It comes to be sprayed on the board. As a result, the speed of fine particles useful for structure formation also decreases at the shielding plate. Therefore, in order to produce a structure efficiently, an aerosol composed of fine particles obtained by classification is again used as an acceleration means. It is necessary to adjust to the speed required for the structure production using the above.

  When the speed of fine particles useful for structure formation is adjusted again using an accelerating means or the like, the particle diameter is larger than a specific particle diameter that has not been deposited and removed by increasing the amount of fine particles in the region II described above. Fine particles and large fine particles formed by adhering a plurality of fine particles are also accelerated by the acceleration means. For this reason, the accelerated large fine particles are sprayed on the substrate, and etching occurs.

  Furthermore, since fine particles useful for structure formation are also sprayed on the shielding plate in classification, the fine particles useful for structure formation may be crushed. Fine particles that are smaller than the fine particles useful for forming the structure thus formed have a very small mass, and thus move along the gas flow when sprayed onto the substrate. For this reason, when colliding with the base, the speed in the direction of the base decreases, and the mechanical impact force necessary for crushing cannot be obtained. Accordingly, fine particles that are smaller than the fine particles useful for forming the structure are deposited as a green compact on the substrate, thereby inhibiting the production of a dense structure. This makes it impossible to produce an efficient structure.

  In addition, in order to classify fine particles of several micrometers or less with high accuracy, kinetic energy by spraying aerosol may not be sufficient in some cases. In order to classify with high accuracy, classification using electrostatic force is required. In this case, more complicated devices and energy are required.

  As described above, in the conventional technology, the structure in which fine particles having a specific particle diameter or more are classified and then sprayed onto the substrate cannot efficiently produce a structure. Therefore, the present invention pays attention to the speed at which the fine particles constituting the aerosol are sprayed, and suppresses etching by changing the speed of etching particles that cause etching rather than aligning the particle diameter to fine particles having a specific particle diameter. . Further, according to the present invention, since the velocity conversion means is provided between the nozzle and the substrate, the aerosol whose etching is suppressed is sprayed on the substrate without being conveyed, so that the countermeasure against the generation of etching particles by the conveyance is generated. Is also unnecessary. By adopting such a configuration, it is possible to realize efficient production of structures without aligning the particle diameters of the fine particles with high precision or taking measures against particles having a specific particle diameter or more generated by recombination. become.

  Details of etching with fine particles having a specific particle diameter or more will be described with reference to FIGS. FIG. 7 is a schematic diagram of a structure manufacturing apparatus for verifying a structure manufacturing status using a conventional nozzle. In FIG. 7, in order to clarify the etching effect, it is a schematic diagram showing a structure production situation in which a conventional nozzle is used and a shielding plate is provided between the nozzle and the substrate. In FIG. 7, the nozzle 8 is connected to the aerosol generation chamber by the transport pipe 6, and has a structure having an emission port for the aerosol 4 on the side opposite to the transport pipe 6. Further, a shielding plate 12 is provided between the nozzle 8 and the base body 9 so as to block a part of the aerosol 4 emitted from the outlet of the nozzle 8 from reaching the base body 9. . In FIG. 7, in order to clarify the structure production state of the fine particles emitted from the nozzle, the relative position between the nozzle 8 and the substrate 9 is fixed to produce the structure. In addition, the fine particles 3 used for the production are zinc oxide fine particles having an average particle diameter of 0.2 micrometers as a material that is not easy to form a structure.

  The shielding plate 12 shields the fine particles 3 spreading on one side among the fine particles 3 spreading from the emission port of the nozzle 8 in the aerosol 4 emitted from the nozzle 8, so that the emission port of the nozzle 8 is not covered. It is arranged. As a result, in the substrate 9, a structure production result is obtained by the fine particles 3 sprayed from the nozzle 8 with good straightness on the projection area of the emission port of the nozzle 8. Similarly, on the side where the shielding plate 12 is not provided in the projection region of the exit port of the nozzle 8 of the base body 9, the result of the structure production by the fine particles 3 sprayed while spreading from the nozzle 8 is obtained, and on the side where the shielding plate 12 is provided. As a result, the structure can be obtained when the fine particles 3 emitted from the nozzle 8 are not directly sprayed.

  FIG. 8 is a schematic diagram showing the film thickness distribution of the structure manufactured in the configuration shown in FIG. In FIG. 8, the upper side is the film thickness distribution on the side where the shielding plate is not provided, and the lower side is the thickness distribution on the side where the shielding plate is provided. The structures 10 are distributed in an elliptical region centered on the emission port of the nozzle 8 shown by the dotted line in FIG. 8, and a cross section showing the film thickness distribution on the line AA ′ in the structure 10 in FIG. In A, the structure 10 is not formed in the projection area of the exit port of the nozzle 8. Similarly, in the cross section B showing the film thickness distribution on the B-B ′ line, the structure 10 is not formed in the projection region of the emission port of the nozzle 8. In this case, the projection area at the exit of the nozzle 8 is an area where etching particles having a large mass are sprayed, and the structure is not formed because the structure is etched by the etching particles. That is, in the projection area of the exit port of the nozzle 8, the structure 10 is formed by the fine particles, but the structure 10 is not formed as a result because the etching with the etching particles having a mass larger than that is strong.

  Moreover, in FIG. 8, the structure 10 is not formed in the lower side which provided the shielding board. In FIG. 8, the structure 10 is not formed in the projection region of the nozzle outlet, because the effect of etching fine particles sprayed on the substrate 9 is strong. On the other hand, in the region corresponding to the upper side of the nozzle outlet, fine particles are sprayed onto the substrate 9 while spreading from the nozzle outlet, and the structure 10 is formed because the etching effect of the fine particles is not strong. In the region corresponding to the lower side of the nozzle outlet, the structure 10 is not formed because the fine particles sprayed while spreading from the nozzle outlet are shielded by the shielding plate. In this way, the etching particles having a strong etching effect have good straightness from the nozzle and are sprayed in a concentrated manner on the projection area of the nozzle outlet, thereby obstructing the formation of the structure. Further, in the vicinity of the projection area of the nozzle outlet, the structure 10 is made of fine particles sprayed while spreading from the nozzle outlet.

  Also, no film is formed on the side of the nozzle where the shielding plate is provided. This is because fine particles having a strong etching effect are not crushed when sprayed onto the substrate 9 and the structure 10 is not formed. Similarly, the structure 10 formed in the region corresponding to the upper side of the nozzle outlet is not formed by the fine particles having a strong etching effect sprayed on the base 9, but is sprayed while spreading from the nozzle outlet. It is formed by. For this reason, when manufacturing a structure by suppressing etching of fine particles, it is important to efficiently use fine particles that are sprayed while spreading from the outlet of the nozzle.

  From the above, in order to produce an efficient structure, the etching by the etching particles sprayed onto the projection area of the nozzle outlet is suppressed, and the speed conversion means 11 does not convert the speed in the vicinity of the nozzle outlet. It is preferable to form the structure 10 with fine particles sprayed while spreading. Therefore, the speed conversion means 11 only needs to be able to change the speed so that the etching particles are not sprayed on the substrate 9, and may have a structure at least as large as the exit of the nozzle 8, and the influence of the etching particles sprayed while spreading. In order to suppress this, a structure larger than the emission port of the nozzle 8 may be used. However, since the speed conversion means also converts the fine particles useful for structure formation, the speed conversion means 11 must at least contain fine particles that are not speed-converted by the speed conversion means 11 in order to produce an efficient structure. The shape that is sprayed on the nozzle 8 is preferable, and the shape that is not disposed in at least one region on the long side of the projection region of the emission port of the nozzle 8 is preferable.

  The fine particles sprayed from the nozzle outlet are sprayed on the etching particles having good straightness as shown in the film thickness distribution of FIG. 8 and the fine particles sprayed while spreading from the nozzle outlet. The range of the fine particles sprayed while spreading from the nozzle outlet varies depending on the pressure in the structure manufacturing chamber 5, the velocity of the aerosol emitted from the nozzle, the mass of the fine particles, and the like. In order to produce an efficient structure, it is important to efficiently use the fine particles sprayed while spreading from the nozzle outlet without being converted by the speed converting means 11. However, since the fine particles sprayed while spreading from the nozzle outlet decrease as the distance from the nozzle outlet decreases, the speed conversion means 11 is as small as possible while maintaining a size capable of suppressing the influence of the etching particles. Is preferred. The fine particles sprayed while spreading from the nozzle outlet without being speed-converted by the speed converting means are sprayed while spreading through a space provided between the speed converting means and the nozzle. Therefore, in order to increase the fine particles sprayed while spreading, it is preferable to increase the distance between the speed converting means and the nozzle, and the distance is preferably larger than the length of the longest side of the nozzle outlet. By setting the distance between the speed converting means and the nozzle in this way, fine particles that are emitted from the long side end of the nozzle and spread through the long side end on the opposite side of the speed converting means, that is, at an angle of 45 degrees from the nozzle. The spreading fine particles are also sprayed on the substrate to form a structure, and the structure is efficiently produced. For example, in the case where the nozzle is configured with an emission port having a short side of 0.5 mm and a long side of 10 mm, the size of the speed conversion means is 0.6 mm and the long side is 10.1 mm, and the distance between the nozzle and the speed conversion means Is set to 10 mm or more, fine particles to be sprayed can be sprayed while spreading a sufficient amount. When the speed conversion means is provided at such a position, a sufficient amount of fine particles are sprayed on the substrate while spreading, so that an efficient structure can be realized.

  As shown in the film thickness distribution of FIG. 8, the closer the particles are to the nozzle outlet, the more fine particles are sprayed while spreading from the nozzle outlet. Therefore, an efficient structure can be produced when the speed conversion means is as small as possible. However, since etching with etching particles occurs abruptly in the projection area of the nozzle outlet, it is preferable to provide the speed conversion means at least in the projection area of the nozzle outlet.

  In addition, it is not as large as the fine particles useful for the construction of the structure, but depending on the material used as the fine particles, the etching particles can be sprayed while spreading slightly from the nozzle outlet, so the speed conversion means is the same size as the nozzle outlet Etching particles sprayed on the substrate without speed conversion are generated. In this case, since the structure formed by the fine particles sprayed while spreading becomes etched by the etching particles, it becomes impossible to realize an efficient structure production. The size of the conversion means is preferably larger than the size of the outlet of the nozzle. Although different depending on the material used as the fine particles, the etching particles sprayed while spreading spread within a range of 1 mm or less from the projection area of the nozzle outlet. For example, when the etching particles are sprayed while spreading 0.1 mm, the nozzle has a short side of 0.5 mm and a long side of 10 mm, and the speed conversion means has a short side of 0.7 mm and a long side of 0.1 mm larger than the nozzle outlet. It is good that it is 10.2 mm.

  As described above, in FIG. 7 and FIG. 8, the etching particles having a strong etching effect are concentrated and sprayed on the projection area of the nozzle outlet, and the structure is formed by the fine particles sprayed while spreading around the nozzle outlet. It was found that it was formed. As a result, the present invention suppresses the inhibition of the structure production due to etching of the etching particles and reduces the speed of the inner etching particles of the aerosol emitted from the nozzle, while spreading from the nozzle outlet. A structure is produced with fine particles useful for forming the structure to be sprayed. With such a configuration, the etching by the etching particles can be suppressed with a simple configuration, and an efficient structure production can be realized. Further, according to the present invention, since the velocity conversion means is provided between the nozzle and the substrate, the aerosol whose etching is suppressed is sprayed on the substrate without being conveyed, so that the countermeasure against the generation of etching particles by the conveyance is generated. Is also unnecessary. By adopting such a configuration, it is possible to realize efficient production of structures without aligning the particle diameters of the fine particles with high precision or taking measures against particles having a specific particle diameter or more generated by recombination. become.

(Embodiment 2)
In the first embodiment of the present invention, the configuration in which the emission port of the nozzle 8 and the speed conversion means 11 provided in the projection region of the emission port of the nozzle 8 are linearly arranged has been described. 2, a description will be given of a configuration in which the speed conversion unit 11 has a curved shape and is provided in a region larger than the emission port of the nozzle 8. FIG. 9 is a schematic diagram showing the emission state of fine particles in the structure manufacturing apparatus based on the structure manufacturing method of Embodiment 2 of the present invention, except that the speed conversion means 11 has a curved shape. The configuration is the same as that of the first embodiment.

  In the schematic diagram shown in FIG. 9, the speed converting means 11 has a curved shape, and when the fine particles 3 emitted from the nozzle 8 collide, the impact force is easily relaxed by the curved portion of the speed converting means 11. The speed of the fine particles 3 can be converted efficiently. This is an effect due to the curved shape provided in the speed converting means 11. In addition to the illustrated shape, for example, by providing a spring-like structure, the impact force when the fine particles 3 collide can be easily reduced. If it is a structure, the same effect is acquired.

  Further, since the speed conversion means 11 has a curved shape, the periphery of the emission port of the nozzle 8 is wide open, and a space through which the aerosol can pass can be secured in the vicinity of the speed conversion means 11. 11 can suppress the disturbance of the aerosol. Thereby, it is easy to form an aerosol having a uniform concentration around the speed converting means 11, and a structure with good uniformity can be manufactured.

  Further, in the schematic diagram shown in FIG. 9, since the speed conversion means 11 is provided in a larger area than the exit port of the nozzle 8, the speed of etching particles emitted while spreading from the exit port of the nozzle 8 is also increased. Can be converted. In the film thickness distribution of the structure shown in FIG. 5, the etching particles are sprayed only on the projection area of the nozzle outlet, but depending on the specific physical properties of the particulate material and the structure preparation conditions, the nozzle emission It is emitted while spreading from the mouth. Therefore, by providing the speed conversion means 11 in a region larger than the emission port of the nozzle 8, the speed of the fine particles 3 with strong etching can be sufficiently converted. However, since the fine particles that contribute to the formation of the structure are also converted by increasing the speed conversion means, it is preferable to select appropriately according to the physical properties specific to the material of the fine particle material and the structure preparation conditions, which is efficient. For the production of the structure, it is preferable to select appropriately so that the fine particles subjected to speed conversion are minimized.

(Embodiment 3)
In the first embodiment or the second embodiment of the present invention, the configuration in which the speed converting means 11 is joined to the short side of the emission port of the nozzle 8 has been described. In the third embodiment, the speed conversion is performed. A configuration in which the means 11 is provided on the long side of the emission port of the nozzle 8 will be described. FIG. 10 is a schematic diagram showing a state of emission of fine particles in the structure manufacturing apparatus based on the structure manufacturing method of Embodiment 3 of the present invention, in which the speed conversion means 11 is on the long side of the outlet of the nozzle 8. The configuration is the same as that of the first or second embodiment except that the first and second embodiments are joined to each other.

  In the schematic diagram shown in FIG. 9, the speed conversion means 11 is configured to be joined to the long side of the emission port of the nozzle 8 and is compared with the case where it is provided on the short side of the emission port of the nozzle 8. Since the speed conversion means can be held with a large area, it is possible to adopt a configuration in which the speed conversion means is held only on one side of the long side. Therefore, the speed conversion means 11 does not need to be accurately arranged in the projection area of the exit port of the nozzle 8, so that the etching particles can be speed-converted by an easy method.

  In addition, since the speed conversion means 11 is held only on one side of the long side, the nozzle 8 and the base 9 are scanned in a direction perpendicular to the long side direction of the speed conversion means 11 at the time of manufacturing the structure, so that the speed conversion means 11 can be easily uniform. A structure with good properties can be stably produced. However, when the nozzle 8 and the substrate 9 are scanned perpendicularly to the short side direction of the nozzle 8, a non-uniform distribution of the aerosol 4 due to the presence or absence of the speed converting means 11 may occur.

(Embodiment 4)
In the third embodiment of the present invention, the configuration in which the speed converting means 11 is fixed by joining the outlet of the nozzle 8 to one of the long sides has been described. However, in the fourth embodiment, the speed converting means 11 has A configuration in which the nozzle 8 is bonded and fixed to both of the long sides of the emission port will be described. FIG. 11 is a schematic diagram showing the emission state of the fine particles in the structure manufacturing apparatus based on the structure manufacturing method according to the fourth embodiment of the present invention. The speed conversion unit 11 outputs the nozzle 8 from the speed conversion unit 11. The configuration is the same as that of the third embodiment except for a configuration in which both are fixed to both the long sides of the mouth.

  In the schematic diagram shown in FIG. 11, the speed conversion means 11 is configured to be joined to both of the long side of the exit port of the nozzle 8 and joined to one of the long side of the exit port of the nozzle 8. Thus, it is easier to hold the speed conversion means than the fixed configuration. Therefore, the etching particles can be speed-converted by an easy method.

  In addition, since the speed conversion means 11 is held only on one side of the long side, the nozzle 8 and the base 9 are scanned in a direction perpendicular to the long side direction of the speed conversion means 11 at the time of manufacturing the structure, so that the speed conversion means 11 can be easily uniform. A structure with good properties can be stably produced. However, when the nozzle 8 and the substrate 9 are scanned perpendicularly to the short side direction of the nozzle 8, a non-uniform distribution of the aerosol 4 due to the presence or absence of the speed converting means 11 may occur.

(Embodiment 5)
In the first to fourth embodiments of the present invention, the case where the speed conversion unit 11 and the emission port of the nozzle 8 are configured in parallel has been described. However, in the fifth embodiment, the speed conversion unit 11 and the nozzle 8 are configured. Next, a configuration in which the outlet is arranged with an angle will be described. FIG. 12 is a schematic diagram showing the emission state of the fine particles in the structure manufacturing apparatus based on the structure manufacturing method according to the fifth embodiment of the present invention, in which the speed conversion unit 11 is at an angle with respect to the outlet of the nozzle 8. The configuration is the same as that of the third embodiment except for the configuration arranged with the.

  In the schematic diagram shown in FIG. 12, since the speed converting means 11 has an angle with respect to the outlet of the nozzle 8, the etching particles sprayed on the speed converting means 11 are reduced in speed with respect to the substrate 9 and easily. The base 9 is sprayed. As a result, the etching particles are less likely to be deposited on the speed conversion means 11 and the etching particles are not deposited on the speed conversion means 11, so that maintenance such as removal of the etching particles deposited on the speed conversion means 11 is not required.

  Further, among the fine particles 3 sprayed on the speed conversion means 11, fine particles useful for structure formation are arranged at an angle with respect to the emission port of the nozzle 8 because the speed conversion means 11 is arranged at an angle. Compared with the case where the speed converting means 11 and the emission port of the nozzle 8 are arranged in parallel after colliding with 11, the base 9 is more easily collided. Alternatively, depending on the aerosol flow formed in the speed conversion means 11, it collides with the substrate 9 without colliding with the etching speed conversion means 11. As a result, more fine particles useful for forming the structure collide with the base 9, so that the structure can be manufactured more efficiently.

(Embodiment 6)
In the first to fifth embodiments of the present invention, the configuration has been described in which etching is caused to collide with the speed converting means 11 to deposit or decelerate, and the etching is suppressed by changing the speed of the etching particles. In the sixth embodiment, a configuration in which the etching particles are sucked by the suction tube 13 that sucks the etching particles and the speed is converted will be described. FIG. 13 is a schematic diagram showing the emission state of fine particles in the structure manufacturing apparatus based on the structure manufacturing method according to the sixth embodiment of the present invention, and a speed conversion means provided between the nozzle 8 and the base 9. The configuration is the same as that of the third embodiment except that is constituted by the suction tube 13.

  In the schematic diagram shown in FIG. 13, the etching particles are sucked by a suction tube 13 as a speed converting means. As a result, the etching particles having high straightness and high etching effect can be sucked and changed in speed without colliding with the base 9, and the structure production hindrance due to etching can be suppressed. Will be able to. The etching particles sucked by the suction tube 13 are converted in speed in the suction tube 13. For example, in the curved suction tube 13 shown in FIG. 13, the etching fine particles are decelerated or deposited mainly in the curved portion of the suction tube 13. The speed is converted by

  The suction tube 13 only needs to have a structure capable of sucking etching particles. For example, the suction tube 13 has a cylindrical structure provided in the projection region of the emission port of the nozzle 8, and has a lower pressure than the structure manufacturing chamber by a vacuum pump or the like. As a result, the etching particles are attracted. Or the piping of the vacuum pump for maintaining the pressure in the structure manufacturing chamber can be used as the suction pipe 13, and such a configuration makes it easy and efficient without adding an extra structure. A structure can be manufactured. Alternatively, when the suction force by the suction tube 13 is sufficiently increased, the suction tube 13 can also suck the fine particles 3 around the suction tube 13. In such a case, the suction tube 13 is used as the outlet of the nozzle 8. It can also be made smaller. However, if the suction force of the suction tube 13 is not sufficient, the etching particles will be sprayed onto the substrate 9. Therefore, the suction tube 13 should be provided at least in the projection region of the exit port of the nozzle 8 unless there are special circumstances. preferable.

  Further, since the suction tube 13 sucks not only etching particles but also fine particles useful for structure formation, the fine particles 3 are used as the fine particles 3 constituting the aerosol 4 again in order to effectively use the fine particles 3. You can also For example, by connecting the opposite side of the suction pipe 13 to the suction pipe to the transport pipe, the sucked fine particles 3 can be transported again as the aerosol 4 to the transport pipe. As a result, the sucked fine particles 3 are transported to the nozzle 8 via the transport pipe 6 and can be emitted from the nozzle 8 as the aerosol 4 again, and the utilization efficiency of the fine particles 3 can be improved. At this time, since the path connecting the suction pipe 13 and the transport pipe is curved with an appropriate diameter, etching particles with high straightness are deposited on the curved path. It can be transported as a small amount of aerosol, and a more efficient structure can be produced.

(Embodiment 7)
In the first to fourth embodiments of the present invention, etching is caused to collide with the speed converting means 11 provided in the projection region of the exit of the nozzle 8 to deposit or decelerate, and etching is performed by changing the speed of the etching particles. In the seventh embodiment, in the velocity conversion means 11 provided in the projection area of the outlet of the nozzle 8, the gas is supplied in a direction different from the flow of the aerosol 4 emitted from the nozzle 8. The case where the velocity of etching particles is changed by spraying will be described. FIG. 14 is a schematic diagram showing the emission state of fine particles in the structure manufacturing apparatus based on the structure manufacturing method according to the seventh embodiment of the present invention, and the speed conversion means 11 is a pressure higher than the pressure in the structure manufacturing chamber. Connected to the gas. As a result, the gas is blown from the velocity converting means 11 in the direction opposite to the flow of the aerosol 4 emitted from the nozzle 8, whereby the etching particles are velocity-converted.

  The etching particles are speed-converted by the gas sprayed by the speed converting means 11 and are sprayed to the base 9 while spreading from the nozzle 8, and etching by the etching particles can be suppressed. Further, the etching particles having a sufficiently large mass are speed-converted by the gas sprayed by the speed converting means 11 and the mass is sufficiently large, so that the etching particles are sprayed to the speed converting means 11 provided in the projection region of the emission port of the nozzle 8. The substrate 9 cannot be sprayed. In this way, etching particles having a sufficiently large etching mass cannot be sprayed onto the substrate 9, so that a more efficient structure can be manufactured.

  Since the fine particles useful for structure formation have a small mass, the velocity is converted along the flow of the aerosol formed by the gas blown by the velocity converting means 11 and the aerosol emitted from the nozzle 8, and The base 9 is sprayed while spreading. Accordingly, by adjusting the flow rate of the gas blown from the speed conversion means 11 to an appropriate pressure, for example, 2 LPM, compared with the case where the speed conversion is performed by spraying aerosol on the speed conversion means 11 shown in the first embodiment. The amount of fine particles useful for forming the structure sprayed on the substrate 9 can be increased, and a more efficient structure can be manufactured. For this reason, it is preferable that the flow rate of the gas sprayed by the speed converting means 11 is smaller than the flow rate of the aerosol 4 sprayed by the nozzle 8.

  The gas blown from the velocity converting means 11 can be appropriately selected and used from an inert gas such as helium, argon, krypton and nitrogen, or a reactive gas such as oxygen and dry air, and constitutes the aerosol 4 By using the same type of gas, an efficient structure can be produced with a simple configuration without preparing a plurality of gases. Alternatively, for example, by selecting a reactive gas as the gas blown from the speed converting means 11, a film-like structure can be formed in the structure manufacturing chamber 5 while reacting the gas and the fine particles.

  The speed converting means 11 may be of any structure as long as gas can be sprayed onto the etching particles. For example, the speed converting means 11 has a cylindrical structure provided in the projection region of the exit of the nozzle 8 and is accommodated in a high-pressure container such as a gas cylinder. The etching gas is adjusted to an appropriate pressure by a regulator or the like as necessary, and adjusted to an appropriate flow rate through a flow meter such as a mass flow controller as necessary, so that the etching particle speed can be converted. become. Alternatively, a pressure adjusting pipe connected to a gas for adjusting the pressure in the structure manufacturing chamber 5 can be used as the speed conversion means 11, and an extra structure is added by adopting such a configuration. Thus, an efficient structure can be easily manufactured.

  The structure manufacturing method of the present invention is a structure manufacturing method in which an aerosol in which fine particles and a gas are mixed is sprayed onto a substrate at a high speed to prepare a film-like structure made of a fine particle material. Therefore, it can be used as a stable structure manufacturing method, a structure manufacturing apparatus, and a stable structure.

DESCRIPTION OF SYMBOLS 1 Gas 2 Aerosol production | generation chamber 3 Fine particle 4 Aerosol 5 Structure preparation room 6 Conveyance pipe 7 Vacuum pump 8 Nozzle 9 Base 10 Structure 11 Speed conversion means 12 Shielding plate 13 Suction pipe 14 Classifier

Claims (10)

In a structure manufacturing method for manufacturing a film-like structure by spraying an aerosol in which fine particles and gas are mixed at a high speed from an outlet of a nozzle, the aerosol is provided between the nozzle and the substrate. A method for producing a structure, characterized in that a speed conversion means for closing a projection area of the exit of the projector is provided. 2. The structure manufacturing method according to claim 1, wherein the speed conversion unit is scanned so as to maintain a relative position with respect to the nozzle and to change a relative position with respect to the base body. 2. The structure manufacturing method according to claim 1, wherein a distance between the speed conversion unit and the nozzle is larger than a length of a longest side of an emission port of the nozzle. The structure manufacturing method according to claim 1, wherein the size of the speed conversion unit is larger than the size of the emission port of the nozzle. 2. The structure manufacturing method according to claim 1, wherein the speed conversion means deposits and removes at least the etching particles. 2. The structure manufacturing method according to claim 1, wherein the speed conversion unit reduces a speed of at least the etching particles with respect to the substrate. 2. The structure manufacturing method according to claim 1, wherein the etching particles are fine particles having a mass larger than an average value of the masses of the fine particles constituting the aerosol. 2. The structure manufacturing method according to claim 1, wherein the speed conversion means includes a suction tube that sucks at least the etching particles. 9. The structure manufacturing method according to claim 8, wherein the fine particles sucked by the suction pipe are emitted again from the nozzle as the aerosol. 2. The structure according to claim 1, wherein the speed conversion unit is bonded to the nozzle by a single bonding surface, and the speed conversion unit is scanned in a direction perpendicular to the bonding surface. Manufacturing method.

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