JP2011010408A - Drive apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a drive that suppresses positional misalignment of semiconductor modules for controlling motors without using any tools, or the like, and can be readily manufactured.SOLUTION: In the semiconductor module 505, a special terminal 530 is buried in a sealed body 520. In a motor case 101, an engaging section 110 corresponding to the special terminal 530 is formed. The special terminal 530 is provided in the sealed body 520, to project from the sealed body 520 so that misalignment of the semiconductor module 505 with respect to the motor case 101 can be regulated by engaging with the engaging section 110. When the semiconductor module 505 is assembled to the motor case 101 of the motor 30, misalignment of the semiconductor module 505, after installation can be regulated, by installing the semiconductor module 505 in the motor case 101, such that the special terminal 530 is engaged with the engaging section 110.

Description

  The present invention relates to a driving device including an electronic circuit.

  In recent years, a drive device that generates torque with a motor has attracted attention as a mechanism that assists steering of a vehicle. As a power generation source of this drive device, for example, a brushless motor that is rotationally driven by applying a three-phase alternating current can be cited. When using such a brushless motor, in order to supply winding currents having different phases to a plurality of (for example, three-phase) windings, it is necessary to create an AC output that is out of phase with a DC output of a predetermined voltage (for example, 12V). There is. Therefore, an electronic circuit for switching the winding current is required. Here, the electronic circuit includes a semiconductor module having a semiconductor chip that realizes a switching function, and a control circuit such as a microcomputer that controls the operation thereof. Conventionally, a driving device in which the semiconductor module is disposed in the vicinity of a motor has been disclosed (for example, see Patent Documents 1, 2, and 3).

Japanese Patent Laid-Open No. 10-234158 Japanese Patent Laid-Open No. 10-322973 JP 2004-159454 A

  In the above drive device, for example, when the semiconductor module is disposed at a predetermined position with respect to the motor case that houses the motor, the semiconductor module may be displaced with respect to the motor case during or after manufacture. In particular, when considering a configuration in which a semiconductor module is placed vertically with respect to a motor case, the semiconductor module may fall during manufacture, which may hinder subsequent manufacturing processes. In order to prevent such misalignment of the semiconductor module, a jig or the like for supporting (positioning) the semiconductor module may be used. In this case, there is a concern that the manufacturing cost increases.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a drive device that can be easily manufactured by suppressing the displacement of a semiconductor module that controls a motor without using a jig or the like. There is.

  The drive device according to claim 1 includes a motor and a semiconductor module. The outer shell of the motor is formed by a cylindrical motor case. The motor case here also includes a bottomed cylindrical shape whose end is closed. A stator is disposed inside the motor case in the radial direction. The stator is formed by winding a winding so as to constitute a plurality of phases. Further, a rotor is disposed on the radially inner side of the stator, and the shaft rotates together with the rotor.

  The semiconductor module includes a semiconductor chip for switching winding currents flowing through a plurality of phase windings. For example, a semiconductor switch element is configured in the semiconductor chip, and the winding current is switched by turning on / off the semiconductor switch element. The semiconductor chip is covered with a sealing body. Here, “covering” includes not only the meaning of covering all of the semiconductor chip, but also the meaning of covering at least a part of the semiconductor chip.

  In addition, as a structure of this invention, the structure containing the electronic circuit which controls the drive of a motor by adjusting the winding current sent through the coil | windings of a several phase with a semiconductor module can be illustrated. Further, for example, a configuration for providing a cover for housing the semiconductor module and the electronic circuit and protecting the semiconductor module and the electronic circuit can be considered.

  In the present invention, in particular, a special terminal is embedded in the sealing body of the semiconductor module. Here, as a method for embedding the special terminal, when the sealing body is formed of, for example, a resin, a method of insert molding the special terminal into the sealing body is conceivable. An engagement portion corresponding to the special terminal is formed in the motor case. And the special terminal is provided in the sealing body in the state which protruded from the sealing body so that position shift of the semiconductor module with respect to a motor case can be controlled by being engaged with an engaging part. With this configuration, when the semiconductor module is installed in the motor (motor case), if the semiconductor module is installed in the motor case so that the special terminal is engaged with the engaging portion, the semiconductor module is displaced after installation. It is regulated. Therefore, for example, when connecting a substrate on which another electronic component is mounted to the semiconductor module after installation or when connecting a winding of a stator, the position including the collapse of the semiconductor module in the manufacturing process after the semiconductor module is installed, etc. The shift can be suppressed.

  Thus, in the present invention, it is possible to suppress the misalignment of the semiconductor module without using a jig or the like for supporting the semiconductor module. Accordingly, the drive device can be easily manufactured, and as a result, the manufacturing cost can be reduced.

  In the invention according to claim 2, the motor case has a heat radiating portion extending from the wall surface. The semiconductor module is provided in contact with the heat radiating portion of the motor case. Here, the term “contact” of the semiconductor module with the heat radiating part is not limited to the direct contact between the semiconductor module and the heat radiating part. It also includes the meaning that is in contact. With this configuration, even when the heat generation of the semiconductor chip is large, the heat generated by the semiconductor chip (semiconductor module) can be effectively radiated via the heat radiating section. As a result, malfunction and destruction due to overheating of the semiconductor chip can be suppressed.

  Furthermore, by providing the semiconductor module in contact with the heat radiating portion, a positional deviation of the semiconductor module toward the heat radiating portion with respect to the motor case is restricted. Therefore, according to the present invention, it is possible to further enhance the effect of suppressing the displacement of the semiconductor module during manufacturing or the like.

  In the invention according to claim 3, the sealing body of the semiconductor module is formed in a substantially rectangular parallelepiped shape. Of the six surfaces of the sealing body, the surface substantially parallel to the chip surface of the semiconductor chip is the back surface, the surface opposite to the back surface is the front surface, and one of the other four surfaces is the bottom surface. The semiconductor module is provided so that the back surface is in contact with the heat radiating portion when the surface opposite to the bottom surface is the top surface and the remaining two surfaces are the right side surface and the left side surface, respectively. Therefore, it is possible to position the chip surface of the semiconductor chip so as to face the contact surface between the heat dissipation portion and the semiconductor module. Thereby, the heat which a semiconductor chip emits can be radiated more effectively via a heat radiating part.

  In addition, as a sealing body which covers a semiconductor chip, what has the area of the back surface substantially parallel to the chip surface of the semiconductor chip larger than the areas of the other surfaces can be considered. In this case, since the contact area between the semiconductor module and the heat radiating portion is increased, the effect of suppressing the positional deviation of the semiconductor module during manufacturing or the like can be further enhanced while enhancing the heat radiating effect.

As a more concrete structure of the above-mentioned invention, the structure of the invention of Claims 4-10 can be illustrated.
In the invention described in claim 4, the engaging portion is formed on the wall surface of the motor case. The special terminal protrudes from the lower surface of the sealing body so as to be engaged with the engaging portion by being inserted into the groove formed in the wall surface. In the present invention, the engaging portion is engaged with the special terminal, thereby shifting the position of the semiconductor module with respect to the motor case in the “front” direction, “back” direction, “right side” direction, and “left side” direction. Can be regulated. Here, the “front surface” direction refers to a direction from the “back surface” to the “front surface” of the sealing body. Similarly, the “rear surface” direction refers to a direction from the “front surface” to the “rear surface” of the sealing body. This also applies to the “right side” direction and the “left side” direction.

  In the invention according to claim 5, the engaging portion is formed in the right terminal receiving portion extending from the wall surface of the motor case. The special terminal protrudes from the right side surface of the sealing body so as to be engaged with the engaging portion by being inserted into a groove formed in the right terminal receiving portion. In the present invention, the engaging portion can regulate the positional deviation of the semiconductor module with respect to the motor case in the “front” direction and the “back” direction by engaging with the special terminal. Moreover, in this invention, the right terminal receiving part is located in the right side surface side of a semiconductor module. For this reason, the right terminal receiving portion can also regulate the positional deviation in the “right side” direction of the semiconductor module.

  In the invention described in claim 6, the engaging portion is formed in the left terminal receiving portion extending from the wall surface of the motor case. The special terminal protrudes from the left side surface of the sealing body so as to be engaged with the engaging portion by being inserted into a groove formed in the left terminal receiving portion. In the present invention, the engaging portion can regulate the positional deviation of the semiconductor module with respect to the motor case in the “front” direction and the “back” direction by engaging with the special terminal. In the present invention, the left terminal receiving portion is located on the left side of the semiconductor module. For this reason, the left terminal receiving portion can also regulate the positional deviation in the “left side” direction of the semiconductor module.

  In the seventh aspect of the present invention, the engaging portion is formed in the front terminal receiving portion that extends from the wall surface of the motor case. The special terminal protrudes from the front surface of the sealing body so as to be engaged with the engaging portion by being inserted into a groove formed in the front terminal receiving portion. In the present invention, the engagement portion can regulate the positional deviation in the “right side” direction and the “left side” direction of the semiconductor module with respect to the motor case by engaging the special terminal. Moreover, in this invention, the front terminal receiving part is located in the front side of a semiconductor module. For this reason, the front terminal receiving portion can also regulate the positional deviation in the “front” direction of the semiconductor module.

  In the invention according to claim 8, the engaging portion is formed in the front terminal receiving portion extending from the wall surface of the motor case. The special terminal includes a first special terminal and a second special terminal. The first special terminal and the second special terminal protrude from the front surface of the sealing body so that the front terminal receiving portion is positioned between the first special terminal and the second special terminal so as to be engaged with the engaging portion. In the present invention, the engaging portion is positioned between the first special terminal and the second special terminal and engages with the first special terminal and the second special terminal, whereby the “right side surface of the semiconductor module with respect to the motor case”. The displacement in the “direction” and the “left side” direction can be regulated. In the present invention, as in the seventh aspect of the invention, the front terminal receiving portion is located on the front side of the semiconductor module. For this reason, the front terminal receiving portion can also regulate the positional deviation in the “front” direction of the semiconductor module.

  In the invention according to claim 9, the engaging portion is formed in the first front terminal receiving portion and the second front terminal receiving portion extending from the wall surface of the motor case. The special terminal includes a first special terminal and a second special terminal. The first special terminal and the second special terminal protrude from the front surface of the sealing body so as to be engaged with the engaging portion by being positioned between the first front terminal receiving portion and the second front terminal receiving portion. ing. In the present invention, the engaging portion engages with the first special terminal and the second special terminal sandwiched therebetween, thereby shifting the positional deviation of the semiconductor module with respect to the motor case in the “right side” direction and the “left side” direction. It can be regulated. In the present invention, the first front terminal receiving part and the second front terminal receiving part are located on the front side of the semiconductor module. For this reason, the first front terminal receiving portion and the second front terminal receiving portion can also be regulated with respect to the positional deviation in the “front surface” direction of the semiconductor module.

  In the invention described in claim 10, the engaging portion is formed in the heat radiating portion extending from the wall surface of the motor case. The special terminal protrudes from the back surface of the sealing body so as to be engaged with the engaging portion by being inserted into the groove formed in the heat radiating portion. In the present invention, the engagement portion can regulate the positional deviation in the “right side” direction and the “left side” direction of the semiconductor module with respect to the motor case by engaging the special terminal.

In the inventions according to claims 4 to 10 described above, since the semiconductor module is provided so that the back surface is in contact with the heat radiating portion, the positional deviation in the “back surface” direction is also regulated by the heat radiating portion. Also, if the length of the special terminal and the gap between the special terminal and the engaging portion are set to a predetermined size, not only the relative movement of the semiconductor module with respect to the motor case, but also, for example, the “front surface” of the semiconductor module It is possible to regulate misalignment including tilting or tilting of the direction.
As for invention of Claims 4-10, as long as there is no obstruction factor, it is possible to combine each structure. By combining the configurations of the inventions according to claims 4 to 10, it is possible to further enhance the effect of suppressing the displacement of the semiconductor module.

  In the invention described in claim 11, a plurality of special terminals are provided per one surface so as to protrude from a plurality of locations on at least one surface of the sealing body. And the engaging part corresponding to each of a some special terminal is formed in the motor case. By providing a plurality of special terminals in this way, the effect of suppressing the displacement of the semiconductor module can be further enhanced.

  In the invention described in claim 12, at least one special terminal is formed in an L shape. In the invention described in claim 13, at least one special terminal is formed in a T shape. In this way, if the special terminal is formed in an L shape or a T shape, and the special terminal is configured to be engaged by the engaging portion, for example, the position of the semiconductor module in the direction away from the engaging portion can be shifted. It can be regulated.

In the invention described in claim 14, the special terminal and the semiconductor chip are electrically insulated. In the case of this configuration, the special terminal can be used as “a terminal for suppressing the displacement of the semiconductor module”.
In the invention described in claim 15, the special terminal and the semiconductor chip are electrically connected. In the case of this configuration, the special terminal can be used not only as “a terminal for suppressing misalignment of the semiconductor module” but also as “a terminal for electrically connecting the semiconductor chip and another member”. . Thereby, the special terminal can be used as a ground terminal of the semiconductor chip, for example.
Alternatively, the ground terminal of the semiconductor chip protruding from the sealing body may be used as a special terminal for “suppressing misalignment of the semiconductor module”. In this case, if the engaging portion corresponding to the ground terminal is formed in the motor case, an effect of suppressing the displacement of the semiconductor module can be obtained.

In the invention described in claim 16, a plurality of semiconductor modules are provided. Since each semiconductor module has a special terminal, the position shift is suppressed for each semiconductor module.
In the invention according to claim 17, the semiconductor module is vertically arranged on the side opposite to the rotor in the direction of the center line of the shaft of the motor case so that the perpendicular of the chip surface of the semiconductor chip is not parallel to the center line of the shaft. . In the following description, the “shaft center line” is simply referred to as “motor axis” and the “shaft center line direction” is simply referred to as “motor axis direction” as appropriate. In the present invention, for example, a motor case formed in a bottomed cylindrical shape can be considered. In this case, the semiconductor module is disposed on the side opposite to the rotor of the motor case in the motor axial direction, that is, on the side opposite to the rotor of the motor case. As described above, in the present invention, since the semiconductor module is arranged in the motor axial direction of the motor case, the physique in the radial direction is smaller than the configuration in which the semiconductor module is arranged around the stator (for example, see Patent Document 3). can do.

  Here, in particular, the present invention is characterized in that the semiconductor module is vertically arranged so that the perpendicular of the chip surface of the semiconductor chip is not parallel to the motor axis. That is, the semiconductor module is arranged in a state of rising in the motor axis direction. By arranging semiconductor modules vertically, many semiconductor modules can be arranged in a limited space. It is also possible to arrange other members or the like in a space secured by arranging the semiconductor modules vertically.

  When the semiconductor modules are arranged vertically as described above, there is a concern that the semiconductor modules may fall down particularly during manufacturing. However, in the present invention, the semiconductor module has a special terminal, and the motor case has an engaging portion that engages with the special terminal. Therefore, even if it is the structure which arranges a semiconductor module vertically, position shift including the fall of a semiconductor module can be controlled.

  The invention described in claim 17 is characterized by the vertical arrangement of the semiconductor module. As an example, as shown in claim 18, the semiconductor module is arranged so that the perpendicular of the semiconductor chip surface is perpendicular to the center line of the shaft. It is possible to arrange. The semiconductor module is generally plate-shaped wide in the direction of the semiconductor chip surface. This further contributes to securing the radial space as compared with the case where the semiconductor module is disposed while being inclined in the motor axial direction. Note that the perpendicular of the semiconductor chip surface to the motor axis is not necessarily perpendicular to the motor axis, and includes that which is slightly inclined.

  According to the nineteenth aspect of the present invention, a cylindrical motor case, a stator that is disposed radially inside the motor case and wound with windings so as to form a plurality of phases, and is disposed radially inside the stator. It is an invention of a semiconductor module that is assembled to a rotor and a motor having a shaft that rotates together with the rotor. The present invention relates to a motor case by being engaged with a semiconductor chip for switching winding currents flowing through a plurality of phase windings, a sealing body covering the semiconductor chip, and an engaging portion formed on the motor case. And a special terminal provided on the sealing body in a state of protruding from the sealing body so that the positional deviation of the semiconductor module can be regulated. That is, this invention is an invention corresponding to the semiconductor module which comprises the drive device of Claim 1. Therefore, in the present invention, similarly to the effect of the invention described in claim 1, it is possible to suppress misalignment of the semiconductor module without using a jig for supporting (positioning) the semiconductor module.

As the shape of the semiconductor module, as described in claim 20, an example in which the sealing body is formed in a substantially rectangular parallelepiped shape can be exemplified.
In the invention described in claim 21, a plurality of special terminals are provided per one surface so as to protrude from a plurality of locations on at least one surface of the sealing body. Therefore, in the present invention, as in the effect of the invention according to claim 11, the effect of suppressing the displacement of the semiconductor module can be further enhanced.

  In the invention described in claim 22, at least one special terminal is formed in an L shape. In the invention described in claim 23, at least one special terminal is formed in a T-shape. If the special terminal is formed in an L shape or T shape in this way, the positional deviation of the semiconductor module in the direction away from the engaging portion can be regulated, for example, as in the effect of the invention according to claim 12 or 13. It is.

In the invention of claim 24, the special terminal and the semiconductor chip are electrically insulated. In the case of this configuration, the special terminal can be used as “a terminal for suppressing the displacement of the semiconductor module”, as in the invention described in claim 14.
In the invention described in claim 25, the special terminal and the semiconductor chip are electrically connected. In the case of this configuration, as in the invention of the fifteenth aspect, the special terminal is not only used as a “terminal for suppressing the displacement of the semiconductor module” but also electrically connected between the semiconductor chip and another member. It can also be used as a “terminal for connection”.

1 is a cross-sectional view of a drive device according to a first embodiment of the present invention. Explanatory drawing which shows schematic structure of an electric power steering. The top view of the drive device by 1st Embodiment of this invention. The side view of the drive device by 1st Embodiment of this invention. The perspective view of the drive device by 1st Embodiment of this invention. The disassembled perspective view of the drive device by 1st Embodiment of this invention. The schematic diagram which shows schematic structure of the semiconductor module and motor case of the drive device by 1st Embodiment of this invention. The schematic diagram which shows schematic structure of the semiconductor module and motor case of the drive device by 2nd Embodiment of this invention. The schematic diagram which shows schematic structure of the semiconductor module and motor case of the drive device by 3rd Embodiment of this invention. The schematic diagram which shows schematic structure of the semiconductor module and motor case of the drive device by 4th Embodiment of this invention. The schematic diagram which shows schematic structure of the semiconductor module and motor case of the drive device by 5th Embodiment of this invention. The schematic diagram which shows schematic structure of the semiconductor module and motor case of the drive device by 6th Embodiment of this invention. The schematic diagram which shows schematic structure of the semiconductor module and motor case of the drive device by 7th Embodiment of this invention. The schematic diagram which shows schematic structure of the semiconductor module and motor case of the drive device by 8th Embodiment of this invention. The schematic diagram which shows schematic structure of the semiconductor module and motor case of the drive device by 9th Embodiment of this invention. The schematic diagram which shows schematic structure of the semiconductor module and motor case of the drive device by 10th Embodiment of this invention. The schematic diagram which shows schematic structure of the semiconductor module and motor case of the drive device by 11th Embodiment of this invention. The schematic diagram which shows schematic structure of the semiconductor module and motor case of the drive device by 12th Embodiment of this invention. The schematic diagram which shows schematic structure of the semiconductor module and motor case of the drive device by 13th Embodiment of this invention. The schematic diagram which shows schematic structure of the semiconductor module and motor case of the drive device by 14th Embodiment of this invention.

Hereinafter, a plurality of embodiments according to the present invention will be described with reference to the drawings. Note that, in a plurality of embodiments, substantially the same components are denoted by the same reference numerals, and description thereof is omitted.
(First embodiment)
The drive device according to the first embodiment of the present invention is applied as a drive device for electric power steering (hereinafter referred to as “EPS”).

First, the electrical configuration of the EPS will be described with reference to FIG.
The driving device 1 includes a motor 30, a power unit 50, and a control unit 70. The driving device 1 assists steering by the steering 91 by generating rotational torque in the column shaft 92 via a gear 93 attached to the column shaft 92 that is a rotational shaft of the steering 91 of the vehicle. Specifically, when the steering wheel 91 is operated by the driver, a steering torque generated in the column shaft 92 by the operation is detected by the torque sensor 94, and vehicle speed information is acquired from a CAN (Controller Area Network) ( (Not shown), assisting the driver with the steering wheel 91. Of course, if such a mechanism is used, depending on the control method, it is possible not only to assist the steering, but also to automatically control the operation of the steering wheel 91 such as keeping the lane on the highway and guiding to the parking space on the parking lot. It is.

  The motor 30 is a brushless motor that rotates the gear 93 forward and backward. The power unit 50 supplies power to the motor 30. The power unit 50 includes a choke coil 52, a shunt resistor 53, and an inverter 60 that are interposed in a power supply line from the power supply 51.

  The inverter 60 includes seven MOSFETs (metal-oxide-semiconductor field-effect transistors) 61, 62, 63, 64, 65, 66, and 67 which are a kind of field effect transistors. These MOSFETs 61 to 67 are switching elements. Specifically, the source and drain are turned on (conducted) or turned off (cut off) depending on the potential of the gate.

  Hereinafter, the MOSFETs 61 to 67 are simply referred to as FETs 61 to 67. The FET 67 closest to the shunt resistor 53 is for protection against reverse connection. That is, the FET 67 prevents a reverse current from flowing when the power supply is erroneously connected.

Here, the connection of the remaining six FETs 61 to 66 will be described.
The drains of the three FETs 61 to 63 are connected to the power supply line side. Further, the sources of the FETs 61 to 63 are connected to the drains of the remaining three FETs 64 to 66, respectively. Furthermore, the sources of these FETs 64 to 66 are grounded. The gates of the six FETs 61 to 66 are connected to six output terminals of a pre-driver 71 described later. 2 are connected to the U-phase coil, the V-phase coil, and the W-phase coil of the motor 30, respectively.

  When it is necessary to distinguish the FETs 61 to 66, the symbols in FIG. 2 are used, and the FET (Su +) 61, the FET (Sv +) 62, the FET (Sw +) 63, the FET (Su−) 64, and the FET (Sv−) are used. 65 and FET (Sw−) 66.

  An aluminum electrolytic capacitor 54 is connected in parallel between the power supply line of the FET (Su +) 61 and the ground of the FET (Su−) 64. Similarly, an aluminum electrolytic capacitor 55 is connected in parallel between the power supply line of the FET (Sv +) 62 and the ground of the FET (Sv−) 65, and the power supply line of the FET (Sw +) 63 and the FET (Sw−) are connected. The aluminum electrolytic capacitor 56 is connected in parallel with the ground 66). Hereinafter, the aluminum electrolytic capacitor is simply referred to as “capacitor”.

  The control unit 70 includes the pre-driver 71, custom IC 72, position sensor 73, and microcomputer 74. The custom IC 72 includes a regulator unit 75, a position sensor signal amplification unit 76, and a detection voltage amplification unit 77 as functional blocks.

  The regulator unit 75 is a stabilization circuit that stabilizes the power supply. The regulator unit 75 stabilizes the power supplied to each unit. For example, the microcomputer 74 is operated with a stable predetermined power supply voltage (for example, 5 V) by the regulator unit 75.

A signal from the position sensor 73 is input to the position sensor signal amplifier 76. As will be described later, the position sensor 73 is provided in the motor 30 and outputs a rotation position signal of the motor 30. The position sensor signal amplifying unit 75 amplifies this rotational position signal and outputs it to the microcomputer 74.
The detection voltage amplifier 77 detects the voltage across the shunt resistor 53 provided in the power unit 50, amplifies the voltage across the both ends, and outputs the amplified voltage to the microcomputer 74.

  Therefore, the rotational position signal of the motor 30 and the voltage across the shunt resistor 53 are input to the microcomputer 74. A steering torque signal is input to the microcomputer 74 from a torque sensor 94 attached to the column shaft 92. Furthermore, vehicle speed information is input to the microcomputer 74 via the CAN.

  Thereby, the microcomputer 74 controls the inverter 60 via the pre-driver 71 in accordance with the rotational position signal so as to assist the steering by the steering 91 according to the vehicle speed when the steering torque signal and the vehicle speed information are input. Specifically, the inverter 60 is controlled by turning on / off the FETs 61 to 66 via the pre-driver 71. That is, since the gates of the six FETs 61 to 66 are connected to the six output terminals of the pre-driver 71, these gate potentials are changed by the pre-driver 71.

  Further, the microcomputer 74 controls the inverter 60 so that the current supplied to the motor 30 approaches a sine wave based on the voltage across the shunt resistor 53 input from the detection voltage amplifier 77.

  When the inverter 60 is controlled, the choke coil 52 reduces noise caused by the power source 51. Further, the capacitors 54 to 56 accumulate electric charges, thereby assisting power supply to the FETs 61 to 66 and suppressing noise components such as a surge voltage. Since the reverse connection protection FET 67 is provided, the capacitors 54 to 56 are not damaged even if the power supply is erroneously connected.

  By the way, the power unit 50 and the control unit 70 are necessary for the drive control of the motor 30 as described above. In the present embodiment, the power unit 50 and the control unit 70 are configured as a so-called control unit (ECU).

  In addition, the output of the motor 30 used for EPS is about 200W-500W, and the physical area | region of the power part 50 and the control part 70 which occupies for the whole drive device 1 will be about 20-40%. Moreover, since the output of the motor 30 is large, the power unit 50 tends to increase in size, and 70% or more of the region occupied by the power unit 50 and the control unit 70 is the region occupied by the power unit 50.

The major components constituting the power unit 50 are a semiconductor module constituting the choke coil 52, capacitors 54 to 56, and FETs 61 to 67.
In this embodiment, the reverse connection protection FET 67, FET (Su +) 61, and FET (Su−) 64 are configured as semiconductor chips, and the semiconductor chip is resin-molded to form one semiconductor module. .

  Further, the FET (Sv +) 62 and the FET (Sv−) 65 are configured as a semiconductor chip, and the semiconductor chip is resin-molded to form one semiconductor module.

  Furthermore, the FET (Sw +) 63 and the FET (Sw−) 66 are configured as semiconductor chips, and the semiconductor chip is resin-molded to form one semiconductor module.

  That is, the inverter 60 in FIG. 2 is configured by three semiconductor modules. In the present embodiment, a total of two sets of inverters 60 shown in FIG. 2 are provided, and the current flowing through the inverter 60 is reduced to half. Thus, since two sets of inverters 60 are provided, in this embodiment, it has six semiconductor modules and six capacitors.

Next, the physical configuration of the drive device 1 of the present embodiment will be described based on FIG. 1 and FIGS. 1 is a cross-sectional view taken along the line II of FIG. 3, and FIG. 4 is a side view of FIG. 3 viewed from the IV direction.
First, the configuration of the drive device 1 will be described with reference to FIG.
The drive device 1 includes a cylindrical motor case 101, a frame end 102, and a cover 103 as an outer shell. One end of the motor case 101 is closed with a partition wall 107. The frame end 102 closes the end of the motor case 101 on the side opposite to the partition wall 107. In the present embodiment, an electronic circuit (the power unit 50 and the control unit 70) is provided on the side of the partition wall 107 opposite to the frame end 102. The cover 103 is attached to the motor case 101 so as to cover the electronic circuit.

  The motor 30 includes a motor case 101, a stator 201 disposed radially inward of the motor case 101, a rotor 301 disposed radially inward of the stator 201, and a shaft 401 that rotates together with the rotor 301. Yes. Here, the partition wall 107 separates an “operating area” in which operating members such as the rotor 301 are arranged and a “control area” in which motor control components such as an electronic circuit are arranged in the driving device 1. Yes.

  The stator 201 has twelve salient poles 202 that protrude in the radial inner direction of the motor case 101. The salient poles 202 are provided at predetermined intervals in the circumferential direction of the motor case 101. The salient pole 202 has a laminated iron core 203 formed by laminating thin plates of magnetic material, and an insulator 204 fitted to the outside of the laminated iron core 203 in the axial direction. A coil wire 205 as a winding is wound around the insulator 204. The coil wire 205 constitutes a U-phase, V-phase, and W-phase three-phase winding. Further, lead wires 206 for supplying current to the coil wire 205 are drawn out from six locations of the coil wire 205, and are drawn out to the electronic circuit side from six holes provided at the axial ends of the motor case 101. It is.

  The rotor 301 is formed in a cylindrical shape from a magnetic material such as iron. The rotor 301 includes a rotor core 302 and a permanent magnet 303 provided on the outer side in the radial direction of the rotor core 302. The permanent magnet 303 has N poles and S poles alternately in the circumferential direction.

  The shaft 401 is fixed to a shaft hole 304 formed at the center of the rotor core 302. The shaft 401 is rotatably supported by a bearing 104 provided in the partition wall 107 of the motor case 101 and a bearing 105 provided in the frame end 102. Thereby, the shaft 401 can rotate with the rotor 301 with respect to the stator 201. Furthermore, the shaft 401 extends to the electronic circuit side (“control region” side), and a magnet 402 for detecting the rotational position is provided at the tip of the electronic circuit side. A resin printed board 80 is disposed near the tip of the shaft 401 on the electronic circuit side. The printed circuit board 80 has a position sensor 73 (not shown in FIG. 1) at the center thereof. Thereby, the rotational position of the magnet 402, that is, the rotational position of the shaft 401 is detected by the position sensor 73.

Next, the physical configuration of the electronic circuit will be described with reference to FIGS. 3 to 6, the cover 103 and the printed board 80 shown in FIG. 1 are omitted.
Here, the configuration of the power unit 50 will be described first, and then the configuration of the control unit 70 will be described.

  As described above, the seven FETs 61 to 67 configuring the inverter 60 of the power unit 50 are configured as three semiconductor modules. And since the drive device 1 of this embodiment is provided with 2 sets of inverters 60, it is as having already mentioned that it is provided with six semiconductor modules.

  That is, as shown in FIG. 3, the driving device 1 includes six semiconductor modules 501, 502, 503, 504, 505, and 506. When these semiconductor modules 501 to 506 are distinguished, the symbols in FIG. 3 are used to describe the U1 semiconductor module 501, the V1 semiconductor module 502, the W1 semiconductor module 503, the U2 semiconductor module 504, the V2 semiconductor module 505, and the W2 semiconductor module 506. I decided to.

  Referring to the correspondence relationship with FIG. 2, the U1 semiconductor module 501 includes FETs 61 and 64 corresponding to the U phase and a reverse connection protection FET 67. Further, the V1 semiconductor module 502 includes FETs 62 and 65 corresponding to the V phase. Furthermore, the W1 semiconductor module has FETs 63 and 66 corresponding to the W phase. Similarly, the U2 semiconductor module 504 has FETs 61 and 64 corresponding to the U phase and the FET 67 for reverse connection protection, the V2 semiconductor module 505 has FETs 62 and 65 corresponding to the V phase, and the W2 semiconductor module 506 has the W phase. FETs 63 and 66 corresponding to. That is, one set of inverters 60 is configured by the three semiconductor modules 501-503 of U1, V1, and W1, and another set of inverters 60 is configured by the three semiconductor modules 504-506 of U2, V2, and W2. ing.

  The three semiconductor modules 501 to 503 U1 to W1 and the three semiconductor modules 504 to 506 U2 to W2 constituting the inverter 60 are connected by a bus bar 507 to form a module unit. The bus bar 507 serves as a power supply line as well as a connection function. That is, electric power is supplied to the semiconductor modules 501 to 506 via the bus bar 507.

  3 to 6 show the assembly structure of the semiconductor modules 501 to 506 and the like, and the power supply structure is not shown. In this respect, a connector is actually attached to the cover 103, and power is supplied to the bus bar 507 via the connector.

Next, the arrangement of the semiconductor modules 501 to 506 will be described.
The semiconductor modules 501 to 506 are attached to a heat sink 601 that extends from the partition wall 107 of the motor case 101 toward the center line of the shaft 401.

Here, the heat sink 601 as a heat radiating portion will be described.
As shown in FIGS. 3 and 6, the heat sink 601 has a cylindrical space at the center. Further, the shaft 401 is located at substantially the center of the cylindrical space. The heat sink 601 can be said to be a thick cylindrical shape, and has a side wall 602 around the center line of the shaft 401. The side wall 602 is provided with two notches 603 and 604 that constitute a discontinuous portion.

  Further, the side wall 602 of the heat sink 601 has a side wall surface 605 that faces in a radially outward direction. A total of six side wall surfaces 605 are formed in the circumferential direction.

  With respect to the heat sink 601 formed as described above, the semiconductor modules 501 to 506 are arranged one by one on the side wall surface 605 facing the radially outward direction. The semiconductor modules 501 to 506 have a plate shape that spreads in the direction of the chip surface of the molded semiconductor chip, and one of the relatively large surfaces is a heat radiating surface. The semiconductor modules 501 to 506 are arranged so that their heat radiation surfaces are in contact with the side wall surface 605. At this time, the side wall surface 605 is a flat surface, and the heat radiation surfaces of the semiconductor modules 501 to 506 are also flat according to this.

  The semiconductor modules 501 to 506 are arranged on the side wall surface 605 of the heat sink 601 as described above, so that the perpendicular of the chip surface of the semiconductor chip is just perpendicular to the center line of the shaft 401. That is, in the present embodiment, the semiconductor modules 501 to 506 are arranged vertically.

  The semiconductor modules 501 to 506 have a winding terminal 508 at the end on the motor case 101 side (see FIG. 3 and the like). As described above, the lead-out line 206 for supplying current to the coil wire 205 is led out from the six holes provided in the axial end of the motor case 101 to the electronic circuit side. The modules 501 to 506 are electrically connected so as to be sandwiched between the winding terminals 508.

  In addition, the semiconductor modules 501 to 506 have a plurality of control terminals 509 and two capacitor terminals 510 at the end on the side opposite to the motor case 101. The control terminal 509 is soldered to a predetermined location on the printed circuit board 80 (see FIG. 1) as will be described later. As a result, the semiconductor modules 501 to 506 are electrically connected to the control unit 70 (see FIG. 2). On the other hand, the capacitor terminal 510 is connected to the power supply line and the ground inside the semiconductor modules 501 to 506, respectively. Each capacitor terminal 510 is bent inwardly of the motor case 101.

  Further, the semiconductor modules 501 to 506 have a special terminal 530 at the end on the motor case 101 side (see FIGS. 1 and 4 to 6). The semiconductor modules 501 to 506 are installed in the motor case 101 so as to be inserted into the grooves 109 formed in the wall surface 108 of the motor case 101. The special terminal 530 and the groove 109 will be described in detail later.

  As shown in FIG. 3 and the like, six capacitors 701, 702, 703, 704, 705 and 706 are arranged on the same side as the heat sink 601 with respect to the semiconductor modules 501 to 506. In order to distinguish these capacitors 701 to 706, they are described as U1 capacitor 701, V1 capacitor 702, W1 capacitor 703, U2 capacitor 704, V2 capacitor 705, and W2 capacitor 706 using the symbols in FIG.

  Referring to the correspondence relationship with FIG. 2, the U1 capacitor 701 corresponds to the capacitor 54. A V1 capacitor 702 corresponds to the capacitor 55. Furthermore, the W1 capacitor 703 corresponds to the capacitor 56. Similarly, the U2 capacitor 704 corresponds to the capacitor 54, the V2 capacitor 705 corresponds to the capacitor 55, and the W2 capacitor 706 corresponds to the capacitor 56.

  A holder 606 is disposed inside the heat sink 601 in the radial direction. The holder 606 is formed in a substantially cylindrical shape and has a flange 607 at one end (see FIG. 6). The outer diameter of the holder 606 is slightly smaller than the inner diameter of the heat sink 601. The holder 606 is disposed in a space on the radially inner side of the heat sink 601 so that the flange portion 607 contacts the wall surface of the heat sink 601 on the side opposite to the frame end 102 (see FIG. 5). Six accommodating portions 608 are formed inside the holder 606 in the radial direction.

  The capacitors 701 to 706 are housed in the housing portion 608 of the holder 606 and are disposed one by one with respect to the semiconductor modules 501 to 506 on the shaft 401 side of the semiconductor modules 501 to 506 (see FIG. 3). The capacitors 701 to 706 have a columnar shape, and are arranged so that the axis thereof is substantially parallel to the center line of the shaft 401. In addition, since the capacitor terminals 510 included in the semiconductor modules 501 to 506 are bent inwardly, the terminals of the capacitors 701 to 706 are directly connected to the bent capacitor terminals 510. Yes.

  As shown in FIGS. 1 and 6, the choke coil 52 is accommodated on the inner side of the holder 606 in the radial direction on the side of the flange 607 of the capacitors 701 to 706. The choke coil 52 is formed by winding a coil wire around a donut-shaped iron core, and the coil end passes through one notch portion 603 of the heat sink 601 and is drawn out in the radially outward direction. In addition, as described above, the shaft 401 extends toward the electronic circuit, but the choke coil 52 is accommodated in the holder 606 with the shaft 401 penetrating.

  In addition, although the coil end of the choke coil 52 is connected so as to be interposed in the power supply line (see FIG. 2), the power supply structure is not shown in FIGS.

  Next, the control unit 70 will be described. The control unit 70 is provided in the “control region” described above. The control unit 70 is formed on the printed circuit board 80 shown in FIG. That is, a wiring pattern is formed on the printed circuit board 80 by an etching process or the like, and an electronic component such as an IC constituting the control unit 70 is mounted thereon (not shown in FIG. 1). The printed circuit board 80 on which electronic components are mounted is attached to a plurality of columns 106 extending from the motor case 101 so that the control terminals 509 of the semiconductor modules 501 to 506 are inserted into terminal holes formed at predetermined positions. It is screwed. The control terminals 509 of the semiconductor modules 501 to 506 are soldered to the wiring pattern of the printed board 80.

  In the drive device 1 of this embodiment, the semiconductor modules 501 to 506 are arranged in the direction of the center line of the shaft 401. Thereby, the physique of radial direction can be made small. In addition, the choke coil 52 and the six capacitors 701 to 706 are arranged side by side in the radial direction by making the semiconductor modules 501 to 506 vertically arranged and using the space secured by this. That is, the capacitors 701 to 706 are arranged in the radial direction of the six semiconductor modules 501 to 506. Thereby, especially the physique of the radial direction of the drive device 1 can be made as small as possible.

Next, the special terminals 530 of the semiconductor modules 501 to 506 and their vicinity will be described in detail.
FIG. 7 is a schematic diagram schematically showing a part of the semiconductor module 501 and the partition wall 107 of the motor case 101 before being installed in the motor case 101. Since all of the semiconductor modules 501 to 506 have the same configuration, only the semiconductor module 501 of the six semiconductor modules (501 to 506) is illustrated in FIG. In FIG. 7, the winding terminal 508, the control terminal 509, and the capacitor terminal 510 are not shown.

The semiconductor module 501 includes a semiconductor chip 511, a sealing body 520, and a special terminal 530.
As described above, the semiconductor chip (511) of the semiconductor module 501 forms the reverse connection protection FET 67, FET (Su +) 61, and FET (Su−) 64 (see FIG. 2). In other words, the semiconductor chip 511 is for switching the winding current flowing through the coil wires 205 constituting a plurality of phases.

  The semiconductor chip 511 is covered with a sealing body 520. In the present embodiment, the sealing body 520 is formed of resin and covers the entire semiconductor chip 511 so as to be wrapped. As other materials of the sealing body 520, for example, ceramic or metal can be considered. The sealing body 520 constitutes the outer shape of the semiconductor module 501 and plays a role of protecting the internal semiconductor chip 511 from external impact, heat, moisture, and the like.

  The sealing body 520 is formed in a substantially rectangular parallelepiped shape. The “substantially rectangular parallelepiped” here refers to a substantially rectangular parallelepiped, and includes, for example, all adjacent surfaces that do not intersect each other at right angles, or those in which corners and sides of the rectangular parallelepiped are chamfered. In the present embodiment, as shown in FIG. 7, the sealing body 520 is formed in a flat rectangular parallelepiped shape. The sealing body 520 has six surfaces including a rear surface 521, a front surface 522, a lower surface 523, an upper surface 524, a right side surface 525, and a left side surface 526. The back surface 521 is one of the surfaces having the largest area among the six surfaces of the sealing body 520. The sealing body 520 covers the semiconductor chip 511 so that the chip surface of the semiconductor chip 511 is substantially parallel to the back surface 521.

The special terminal 530 is embedded in the sealing body 520 by insert molding, for example. In the present embodiment, the special terminal 530 is formed in a prismatic shape. The special terminal 530 is provided on the sealing body 520 such that an end portion of the special terminal 530 protrudes from the lower surface 523. Further, the special terminal 530 and the semiconductor chip 511 are electrically insulated.
In the present embodiment, the semiconductor modules 502 to 506 have the same configuration as the semiconductor module 501 described above.

  As described above, the heat sink 601 extends from the partition wall 107 of the motor case 101 in the direction of the center line of the shaft 401. Further, a wall surface 108 adjacent to the side wall surface 605 of the heat sink 601 is formed in the motor case 101 (partition wall 107) (see FIGS. 1 and 6 and the like). The heat sink 601 is formed such that the side wall surface 605 intersects the wall surface 108 at a substantially right angle. That is, as shown in FIG. 7, when the wall surface 108 is a wall surface on the xy plane in the xyz coordinate space, the side wall surface 605 is formed so as to rise from the wall surface 108 in the z-axis direction. Here, the z-axis direction coincides with the center line direction (motor shaft direction) of the shaft 401. That is, the side wall surface 605 is a wall surface on the yz plane, and is formed so as to be substantially parallel to the center line of the shaft 401 (the perpendicular of the side wall surface 605 is substantially perpendicular to the center line of the shaft 401). In FIG. 7, the x-axis corresponds to the radial direction of the shaft 401, and the y-axis corresponds to the direction of a straight line that touches the circumference of the shaft 401.

  The semiconductor modules 501 to 506 are arranged such that the back surface 521 contacts the side wall surface 605 (see FIGS. 1 and 3). Thereby, the semiconductor modules 501 to 506 are vertically arranged in the motor case 101 so that the perpendicular of the chip surface of the semiconductor chip 511 is substantially perpendicular to the center line of the shaft 401. Note that the back surface 521 constitutes a heat radiation surface of the semiconductor modules 501 to 506.

A groove 109 is formed in the wall surface 108 of the motor case 101. The groove 109 is formed to correspond to the position of the special terminal 530 when the semiconductor module 501 is installed in the motor case 101 and the shape of the protruding side end of the special terminal 530.
The groove 109 is formed such that a cross section by a virtual plane (xy plane) parallel to the wall surface 108 is slightly larger than or substantially equal to the cross section of the end portion of the special terminal 530. Therefore, the special terminal 530 is engaged with the groove 109 when inserted into the groove 109. That is, the portion of the motor case 101 where the groove 109 is formed forms an “engagement portion” in the claims. The “engagement portion” is a portion indicated by an engagement portion 110 in FIG.

Next, manufacture of the drive device 1 will be described.
The manufacturing process of the driving device 1 includes, for example, the following processes as processes related to the semiconductor module. (1) semiconductor module installation step, (2) winding connection step, (3) capacitor connection step, and (4) printed circuit board connection step.

(1) In the semiconductor module installation step, the special terminal 530 is inserted into the groove 109 while the back surface 521 is in contact with the side wall surface 605 of the heat sink 601, and the semiconductor modules 501 to 506 are installed in the motor case 101 (see FIG. 7). . At this time, the special terminal 530 is engaged with the groove 109 by being inserted into the groove 109.
(2) In the winding connection step, the lead wire 206 of the coil wire 205 is sandwiched between the winding terminals 508 of the semiconductor modules 501 to 506 installed in the motor case 101, or the lead wire 206 is used as the winding terminal 508. By bringing them into contact, the winding terminal 508 and the lead wire 206 are connected.
(3) In the capacitor connection step, the capacitor terminals 510 of the semiconductor modules 501 to 506 and the terminals of the capacitors 701 to 706 are connected.
(4) In the printed circuit board connection step, a plurality of printed circuit boards 80 on which electronic components are mounted are extended from the motor case 101 so that the control terminals 509 of the semiconductor modules 501 to 506 are inserted through the terminal holes. Screwed onto the support post 106. Then, the control terminals 509 of the semiconductor modules 501 to 506 are soldered to the wiring pattern of the printed board 80.

  As described above, in the manufacturing process of the driving device 1, after the semiconductor module installation process of (1), there are a plurality of processes of connecting the semiconductor module and other members as in (2) to (4). Therefore, (1) after the semiconductor module installation step, when another member comes into contact with the semiconductor module, there is a concern that the semiconductor module may be displaced with respect to the motor case 101. However, in this embodiment, (1) in the semiconductor module installation step, the special terminals 530 of the semiconductor modules 501 to 506 are engaged with the groove 109 (engagement portion 110). As a result, the semiconductor modules 501 to 506 are restricted from being displaced with respect to the motor case 101 in the processes (2) to (4).

Next, the regulation of the position shift of the semiconductor module by the special terminal 530 and the groove 109 will be described.
Here, for ease of explanation, the direction from the back surface 521 to the front surface 522 of the sealing body 520 is referred to as the “front surface” direction, and the direction from the front surface 522 to the back surface 521 of the sealing body 520 is referred to as the “back surface” direction. The direction from the left side 526 to the right side 525 of the sealing body 520 is the “right side” direction, and the direction from the right side 525 of the sealing body 520 to the left side 526 is the “left side” direction. In the following description, when referring to the “upper surface” direction or the “lower surface” direction, the “upper surface” direction means a direction from the lower surface 523 of the sealing body 520 toward the upper surface 524, and the “lower surface” direction means the upper surface 524 of the sealing body 520. The direction from the bottom to the bottom surface 523 is meant.

  In the present embodiment, the “front” direction and the “rear” direction of the semiconductor module 501 with respect to the motor case 101 by the engagement between the special terminal 530 protruding from the lower surface 523 of the sealing body 520 and the groove 109 (engaging portion 110). (X-axis direction) and positional deviations in the “right side” direction and the “left side” direction (y-axis direction) are restricted (see FIG. 7). Further, the semiconductor module 501 is provided so that the back surface 521 of the sealing body 520 is in contact with the side wall surface 605 of the heat sink 601, so that the positional deviation in the “back surface” direction is also restricted by the heat sink 601.

  In the semiconductor module installation step (1), for example, when the semiconductor module is installed upright (vertically arranged) on the motor case 101 in which the frame end 102 is the bottom surface and the direction of gravity and the center axis of the shaft 401 are combined, the subsequent steps are performed. There is a concern that the semiconductor module may fall or tilt in ((2) to (4), etc.). However, in the present embodiment, as described above, the groove 109 is formed to be slightly larger than or substantially equal to the end portion of the special terminal 530, so that the motor case 101 (engaging portion 110) that forms the groove 109 is specially formed. A gap with the terminal 530 is set to a predetermined size. According to such a configuration, it is possible to regulate positional deviation including tilting or tilting of the semiconductor module 501 in the “front” direction.

  As described above, in this embodiment, the special terminal 530 is embedded in the sealing body 520 of the semiconductor modules 501 to 506. The motor case 101 is formed with an engaging portion 110 corresponding to the special terminal 530. The special terminal 530 projects from the sealing body 520 to the sealing body 520 so that the positional displacement of the semiconductor modules 501 to 506 with respect to the motor case 101 can be regulated by being engaged with the engaging portion 110. Is provided. With this configuration, for example, when the semiconductor module 501 is assembled to the motor 30 (motor case 101), the semiconductor module 501 is installed in the motor case 101 so that the special terminal 530 is engaged with the engaging portion 110. In 501, positional deviation after installation is regulated. Therefore, in the manufacturing process after installing the semiconductor module 501, such as when connecting the printed circuit board 80 on which other electronic components are mounted to the semiconductor module 501 after installation, or when connecting the lead-out line 206 of the coil wire 205, etc. It is possible to suppress misalignment including the fall of the semiconductor module 501. Thus, in this embodiment, the position shift of the semiconductor module 501 can be suppressed without using a jig or the like for supporting the semiconductor module 501. Therefore, the manufacturing of the driving device 1 can be facilitated, and as a result, the manufacturing cost can be reduced.

  In the present embodiment, the motor case 101 includes a heat sink 601 formed so as to extend from the wall surface 108. The semiconductor module 501 is provided in contact with the side wall surface 605 of the heat sink 601. With this configuration, even when the semiconductor chip 511 generates a large amount of heat, the heat generated by the semiconductor chip 511 (semiconductor module 501) can be effectively dissipated through the heat sink 601. Thereby, the malfunction or destruction by the overheating of the semiconductor chip 511 can be suppressed. Furthermore, the semiconductor module 501 is provided so as to contact the heat sink 601, so that the positional deviation of the semiconductor module 501 with respect to the motor case 101 in the “rear” direction is restricted. Accordingly, it is possible to further enhance the effect of suppressing the displacement of the semiconductor module during manufacturing.

  In the present embodiment, the sealing body 520 of the semiconductor module 501 is formed in a substantially rectangular parallelepiped shape. The semiconductor module 501 is provided so that the back surface 521 contacts the heat sink 601. Therefore, the chip surface of the semiconductor chip 511 can be positioned so as to face the contact surface (side wall surface 605) between the heat sink 601 and the semiconductor module 501. Thereby, the heat generated by the semiconductor chip 511 can be radiated more effectively via the heat sink 601. In the present embodiment, the back surface 521 is formed as a surface having the largest area among the six surfaces of the sealing body 520. Thereby, since the contact area of the semiconductor module 501 and the heat sink 601 is increased, the effect of suppressing the positional deviation of the semiconductor module 501 during manufacturing or the like can be further enhanced while enhancing the effect of heat dissipation.

  In the present embodiment, the engaging portion 110 is formed on the wall surface 108 of the motor case 101. The special terminal 530 protrudes from the lower surface 523 of the sealing body 520 so as to be engaged with the engaging portion 110 by being inserted into the groove 109 formed in the wall surface 108. In the present embodiment, the engaging portion 110 is engaged with the special terminal 530 to thereby position the semiconductor module 501 in the “front surface” direction, “back surface” direction, “right side surface” direction, and “left side surface” direction. The deviation can be regulated.

In the present embodiment, the gap between the motor case 101 (engaging portion 110) that forms the groove 109 and the special terminal 530 is set to a predetermined size. Thereby, it is possible to regulate the positional deviation including the tilt or inclination of the semiconductor module 501 in the “front” direction.
Furthermore, in this embodiment, the special terminal 530 and the semiconductor chip 511 are electrically insulated. For this reason, the special terminal 530 can be used purely as “a terminal for regulating the displacement of the semiconductor module”, and even when electromagnetic noise, an unintended voltage, or the like is applied to the special terminal 530, the semiconductor chip 511 can be used. Can be reduced.

(Second Embodiment)
A driving apparatus according to a second embodiment of the present invention will be described with reference to FIG. In the second embodiment, the number of special terminals embedded in the semiconductor module and the number of engaging portions formed in the motor case are different from those in the first embodiment.
FIG. 8 is a schematic diagram schematically showing a part of the semiconductor module 810 and the motor case 101 in a state before being installed in the motor case 101. In the second embodiment, as in the first embodiment, a total of six semiconductor modules 810 having the same form are installed in the motor case 101 (not shown).

  The semiconductor module 810 has two special terminals (a special terminal 811 and a special terminal 812) embedded in the sealing body 520. The special terminal 811 and the special terminal 812 are formed in a prismatic shape like the special terminal 530 of the first embodiment. The special terminal 811 and the special terminal 812 are provided on the sealing body 520 so that respective end portions protrude from the lower surface 523. The special terminal 811 and the special terminal 812 are provided on the straight line in the “right side” (y-axis) direction on the lower surface 523 at a predetermined interval. The special terminals 811 and 812 and the semiconductor chip 511 are electrically insulated.

  A groove 111 and a groove 112 are formed on the wall surface 108 of the motor case 101 (partition wall 107). The groove 111 and the groove 112 correspond to the positions of the special terminal 811 and the special terminal 812 when the semiconductor module 810 is installed in the motor case 101, and the shape of the protruding end of the special terminal 811 and the special terminal 812, respectively. It is formed to do.

  The groove 111 and the groove 112 are each formed such that a cross section by a virtual plane (xy plane) parallel to the wall surface 108 is slightly larger than or substantially equal to the cross section of the end portion of the special terminal 811 and the end portion of the special terminal 812. Yes. With this configuration, when the semiconductor module 810 is installed in the motor case 101 so that the special terminal 811 and the special terminal 812 are inserted into the groove 111 and the groove 112, the special terminal 811 and the special terminal 812 are respectively The grooves 111 and 112 are engaged. That is, the portion of the motor case 101 where the groove 111 and the groove 112 are formed forms an “engagement portion” in the claims. The “engagement portion” is a portion indicated by an engagement portion 113 and an engagement portion 114 in FIG.

In the present embodiment, the special terminal 811 and the special terminal 812 projecting from the lower surface 523 of the sealing body 520 are engaged with the groove 111 (engagement portion 113) and the groove 112 (engagement portion 114). In the same manner as described above, displacement of the semiconductor module 810 with respect to the motor case 101 in the “front surface” direction and the “rear surface” direction (x-axis direction), and the “right-side surface” direction and the “left-side surface” direction (y-axis direction) are restricted. The
As described above, in this embodiment, the semiconductor module 810 has two special terminals (the special terminal 811 and the special terminal 812), and the positional deviation with respect to the motor case 101 is regulated by these two special terminals. Therefore, in this embodiment, compared with the first embodiment, the effect of regulating the positional deviation of the semiconductor module with respect to the motor case 101 is high.

(Third embodiment)
A driving apparatus according to a third embodiment of the present invention will be described with reference to FIG. In 3rd Embodiment, the position of the special terminal embed | buried under a semiconductor module and the position of the engaging part formed in a motor case differ from 2nd Embodiment.
FIG. 9 is a schematic diagram schematically showing a part of the semiconductor module 820 and the motor case 101 in a state before being installed in the motor case 101. In the third embodiment, similar to the above-described embodiment, a total of six semiconductor modules 820 having the same form are installed in the motor case 101 (not shown).

In the third embodiment, unlike the second embodiment, the special terminal 811 and the special terminal 812 are provided on the diagonal line of the lower surface 523.
On the wall surface 108 of the motor case 101 (partition wall 107), the positions of the special terminals 811 and the special terminals 812 when the semiconductor module 820 is installed in the motor case 101, and the protruding side end portions of the special terminals 811 and the special terminals 812 are provided. A groove 111 and a groove 112 are formed so as to correspond to each of the shapes.

In the present embodiment, the semiconductor module 820 with respect to the motor case 101 is engaged by the engagement of the special terminal 811 and the special terminal 812 with the groove 111 (engagement portion 113) and the groove 112 (engagement portion 114) as in the second embodiment. Are displaced in the “front” direction and “back” direction (x-axis direction), and “right-side” direction and “left-side” direction (y-axis direction).
In this embodiment, since the special terminal 811 and the special terminal 812 are provided on the diagonal line of the lower surface 523, the semiconductor module 820 is installed in the motor case 101 in a more stable state compared to the second embodiment ( Can stand up).

(Fourth embodiment)
A driving apparatus according to a fourth embodiment of the present invention will be described with reference to FIG. In the fourth embodiment, the protruding direction (surface) of the special terminal from the sealing body, the position and shape of the engaging portion formed in the motor case, and the like are different from those of the above-described embodiment.
FIG. 10 is a schematic diagram schematically showing a part of the semiconductor module 830 and the motor case 101 in a state before being installed in the motor case 101. In the fourth embodiment, a total of six semiconductor modules 830 having the same form as that of the above-described embodiment are installed in the motor case 101 (not shown).

  The semiconductor module 830 has two special terminals (a special terminal 831 and a special terminal 832) embedded in the sealing body 520. The special terminal 831 and the special terminal 832 are each formed in a prismatic shape. The special terminal 831 is provided on the sealing body 520 such that an end thereof protrudes from the right side surface 525. The special terminal 832 is provided on the sealing body 520 such that an end thereof protrudes from the left side surface 526. The special terminals 831 and 832 and the semiconductor chip 511 are electrically insulated.

  The motor case 101 includes a right terminal receiving part 131 and a left terminal receiving part 132 that extend from the wall surface 108 of the partition wall 107 in the z-axis direction. A groove 133 is formed in the right terminal receiving portion 131. A groove 134 is formed in the left terminal receiving portion 132. The groove 133 and the groove 134 respectively correspond to the positions of the special terminals 831 and the special terminals 832 when the semiconductor module 830 is installed in the motor case 101 and the shapes of the protruding end portions of the special terminals 831 and 832. It is formed to do.

  The groove 133 and the groove 134 are respectively formed in the right terminal receiving part 131 and the left terminal receiving part 132 so as to extend in the z-axis direction. Further, the groove 133 and the groove 134 are arranged such that the back surface 521 contacts the side wall surface 605 of the heat sink 601 when the semiconductor module 830 is installed in the motor case 101 so that the special terminal 831 and the special terminal 832 are respectively inserted. Is formed. Further, the groove 133 and the groove 134 are each formed such that the width in the x-axis direction is slightly larger than or substantially equal to the width of the projecting side end of the special terminal 831 and the special terminal 832.

  With this configuration, when the semiconductor module 830 is installed in the motor case 101 so that the special terminal 831 and the special terminal 832 are inserted into the groove 133 and the groove 134, the back surface 521 of the semiconductor module 830 has the side wall surface 605. Abut. Further, when the special terminal 831 and the special terminal 832 are inserted into the groove 133 and the groove 134, respectively, the special terminal 831 and the special terminal 832 are engaged with the groove 133 and the groove 134, respectively. That is, the portion of the motor case 101 where the groove 133 and the groove 134 are formed forms an “engagement portion” in the claims. The “engagement portion” is a portion indicated by an engagement portion 135 and an engagement portion 136 in FIG.

  In the present embodiment, the special terminals 831 and the special terminals 832 projecting from the right side surface 525 and the left side surface 526 of the sealing body 520, the groove 133 (engagement portion 135), and the groove 134 (engagement portion 136), respectively. Accordingly, displacement of the semiconductor module 830 in the “front” direction and the “rear” direction (x-axis direction) with respect to the motor case 101 is restricted.

In the present embodiment, the right terminal receiving portion 131 is provided so as to contact the right side surface 525 of the semiconductor module 830 or form a slight gap with the right side surface 525. On the other hand, the left terminal receiving portion 132 is provided so as to abut against the left side surface 526 of the semiconductor module 830 or to form a slight gap with the left side surface 526. That is, the distance between the right terminal receiving portion 131 and the left terminal receiving portion 132 is equal to or slightly larger than the width of the sealing body 520 of the semiconductor module 830 (distance from the right side surface 525 to the left side surface 526). It is set large. Therefore, the semiconductor module 830 is positioned between the right terminal receiving portion 131 and the left terminal receiving portion 132, so that the “right side” direction and the “left side” direction (y-axis direction) of the semiconductor module 830 with respect to the motor case 101 are obtained. ) Is regulated.
Furthermore, in this embodiment, the semiconductor module 830 is provided so that the back surface 521 of the sealing body 520 contacts the side wall surface 605 of the heat sink 601 as in the above-described embodiment. Misalignment is regulated.

  As described above, in this embodiment, the semiconductor module 830 has two special terminals (the special terminal 831 and the special terminal 832), and the positional deviation with respect to the motor case 101 is regulated by these two special terminals. Furthermore, the positional displacement of the semiconductor module 830 is also restricted by the right terminal receiving portion 131, the left terminal receiving portion 132, and the heat sink 601. Therefore, in this embodiment, the effect of restricting the displacement of the semiconductor module with respect to the motor case 101 is high.

  In the present embodiment, as shown in FIG. 10, the special terminals 831 and the special terminals 832 are provided so as to be positioned on a straight line in the “right side” direction (y-axis direction). As a modification of the present embodiment, a configuration in which the special terminal 831 and the special terminal 832 are not on a straight line in the “right side” direction (y-axis direction) can be considered. That is, the special terminal 831 and the special terminal 832 may be arranged so as to be shifted from each other in the “front surface” direction (x-axis direction) or the “upper surface” direction (z-axis direction) with respect to the sealing body 20. As yet another modification of the present embodiment, a configuration in which only one of the right terminal receiving part 131 and the left terminal receiving part 132 is provided in the motor case 101 can be considered. Even with such a configuration (modified example), it is possible to regulate the positional deviation of the semiconductor module 830 in a predetermined direction.

(Fifth embodiment)
A driving apparatus according to a fifth embodiment of the present invention will be described with reference to FIG. In the fifth embodiment, the protruding direction (surface) of the special terminal from the sealing body, the position and shape of the engaging portion formed in the motor case, and the like are different from those of the above-described embodiment.
FIG. 11 is a schematic diagram schematically showing a part of the semiconductor module 840 and the motor case 101 in a state before being installed in the motor case 101. In the fifth embodiment, a total of six semiconductor modules 840 having the same form as those of the above-described embodiment are installed in the motor case 101 (not shown).

  The semiconductor module 840 has a special terminal 841 embedded in the sealing body 520. The special terminal 841 is formed in a prismatic shape. The special terminal 841 is provided on the sealing body 520 such that an end thereof protrudes from the front surface 522. The special terminal 841 and the semiconductor chip 511 are electrically insulated.

  The motor case 101 has a front terminal receiving portion 141 extending from the wall surface 108 of the partition wall 107 in the z-axis direction. A groove 142 is formed in the front terminal receiving portion 141. The groove 142 is formed to correspond to the position of the special terminal 841 when the semiconductor module 840 is installed in the motor case 101 and the shape of the protruding side end of the special terminal 841.

  The groove 142 is formed in the front terminal receiving portion 141 so as to extend in the z-axis direction. Further, the groove 142 has a width in the y-axis direction that is slightly larger than or substantially equal to the width of the projecting side end of the special terminal 841. With this configuration, when the semiconductor module 840 is installed in the motor case 101 so that the special terminal 841 is inserted into the groove 142, the special terminal 841 is engaged with the groove 142. That is, the portion of the motor case 101 where the groove 142 is formed forms an “engagement portion” in the claims. The “engagement portion” is a portion indicated by an engagement portion 143 in FIG.

In the present embodiment, the engagement between the special terminal 841 protruding from the front surface 522 of the sealing body 520 and the groove 142 (engagement portion 143) causes the “right side” direction and the “left side” of the semiconductor module 840 to the motor case 101. The displacement in the “direction” (y-axis direction) is restricted.
In the present embodiment, the front terminal receiving portion 141 is provided so as to contact the front surface 522 of the semiconductor module 840 or to form a slight gap with the front surface 522. On the other hand, the heat sink 601 is provided such that the side wall surface 605 contacts the back surface 521 of the semiconductor module 840. That is, the distance between the front terminal receiving portion 141 and the heat sink 601 is set to be equal to or slightly larger than the thickness of the sealing body 520 of the semiconductor module 840 (distance from the front surface 522 to the back surface 521). . Therefore, the semiconductor module 840 is positioned between the front terminal receiving portion 141 and the heat sink 601, so that the positional deviation in the “front” direction and the “back” direction (x-axis direction) with respect to the motor case 101 is restricted.

  As described above, in this embodiment, the semiconductor module 840 has the special terminal 841, and the position shift with respect to the motor case 101 is regulated by the special terminal 841. Further, the positional displacement of the semiconductor module 840 is also restricted by the front terminal receiving portion 141 and the heat sink 601. Therefore, in this embodiment, the effect of restricting the displacement of the semiconductor module with respect to the motor case 101 is high.

(Sixth embodiment)
A driving apparatus according to a sixth embodiment of the present invention will be described with reference to FIG.
FIG. 12 is a schematic diagram schematically showing a part of the semiconductor module 840 and the motor case 101 in a state before being installed in the motor case 101. In the sixth embodiment, similar to the above-described embodiment, a total of six semiconductor modules 840 having the same form are installed in the motor case 101 (not shown).

In the sixth embodiment, the shape of the front terminal receiving portion 141 of the motor case 101 is only different from that of the fifth embodiment. In the sixth embodiment, as shown in FIG. 12, a groove 142 is formed in the front terminal receiving part 141 so as to connect the side wall surface of the heat sink 601 and the side wall surface of the anti-heat sink 601. Since other parts are the same as those of the fifth embodiment, description thereof is omitted.
Even with such a configuration, as in the fifth embodiment, it is possible to achieve an effect of restricting the displacement of the semiconductor module.

(Seventh embodiment)
A driving apparatus according to a seventh embodiment of the present invention will be described with reference to FIG. In the seventh embodiment, the number of special terminals embedded in the sealing body, the number of front terminal receiving portions formed in the motor case, and the like are different from those in the fifth embodiment.
FIG. 13 is a schematic view schematically showing a part of the semiconductor module 860 and the motor case 101 in a state before being installed in the motor case 101. In the seventh embodiment, as in the above-described embodiment, a total of six semiconductor modules 860 having the same form are installed in the motor case 101 (not shown).

  The semiconductor module 860 has two special terminals (a special terminal 861 and a special terminal 862) embedded in the sealing body 520. The special terminal 861 and the special terminal 862 are formed in a prismatic shape. The special terminal 861 and the special terminal 862 are provided on the sealing body 520 so that respective end portions protrude from the front surface 522. In the present embodiment, the special terminal 861 is located at the lower right end of the front surface 522, that is, in the vicinity of the right side surface 525 and the lower surface 523. The special terminal 862 is located at the lower left end of the front surface 522, that is, in the vicinity of the left side surface 526 and the lower surface 523. The special terminals 861 and 862 and the semiconductor chip 511 are electrically insulated.

  The motor case 101 has two front terminal receiving portions (a front terminal receiving portion 161 and a front terminal receiving portion 162) that extend in the z-axis direction from the wall surface 108 of the partition wall 107. A groove 163 and a groove 164 are formed in the front terminal receiving portion 161 and the front terminal receiving portion 162, respectively. The groove 163 is formed to correspond to the position of the special terminal 861 when the semiconductor module 860 is installed in the motor case 101 and the shape of the protruding end portion of the special terminal 861. The groove 164 is formed so as to correspond to the position of the special terminal 862 when the semiconductor module 860 is installed in the motor case 101 and the shape of the protruding end portion of the special terminal 862.

  The front terminal receiving portion 161 and the groove 163 and the front terminal receiving portion 162 and the groove 164 have the same form as the front terminal receiving portion 141 and the groove 142 of the fifth embodiment, respectively. That is, in this embodiment, it can be said that it has two front terminal receiving parts similar to the front terminal receiving part 162 of the fifth embodiment. That is, the portion of the front terminal receiving portion 161 where the groove 163 is formed and the portion of the front terminal receiving portion 162 where the groove 164 is formed form an “engagement portion” in the claims. The “engagement portion” is a portion indicated by an engagement portion 165 and an engagement portion 166 in FIG. 13.

  In the present embodiment, the motor case 101 is similar to the fifth embodiment by engaging the special terminal 861 and the groove 163 (engagement portion 165) and engaging the special terminal 862 and the groove 164 (engagement portion 166). The displacement of the semiconductor module 860 in the “right side” direction and the “left side” direction (y-axis direction) is restricted. Further, the front terminal receiving portion 163, the front terminal receiving portion 164, and the heat sink 601 restrict displacement of the semiconductor module 860 in the “front” direction and the “rear” direction (x-axis direction) with respect to the motor case 101.

Thus, in this embodiment, since it has two front terminal receiving parts, compared with 5th Embodiment, the effect which regulates the position shift of the semiconductor module with respect to the motor case 101 is high.
In the present embodiment, as shown in FIG. 13, the special terminal 861 and the special terminal 862 are arranged near the lower surface 523 of the front surface 522. As a modified example of the present embodiment, a configuration in which the special terminal 861 or the special terminal 862 is disposed in the vicinity of the upper surface 524 of the front surface 522 or approximately in the middle between the upper surface 524 and the lower surface 523 can be considered. That is, the special terminal 861 and the special terminal 862 may be disposed at any position in the “upper surface” direction (z-axis direction) on the front surface 522.
Of course, at least one of the front terminal receiving portion 163 and the front terminal receiving portion 164 can be formed in the same shape as the front terminal receiving portion 141 of the sixth embodiment.

(Eighth embodiment)
A driving apparatus according to an eighth embodiment of the present invention will be described with reference to FIG. In the eighth embodiment, the number of special terminals embedded in the sealing body, the shape of the front terminal receiving portion formed in the motor case, and the like are different from those in the fifth embodiment.
FIG. 14 is a schematic diagram schematically showing a part of the semiconductor module 870 and the motor case 101 in a state before being installed in the motor case 101. In the eighth embodiment, a total of six semiconductor modules 870 having the same form as that of the above-described embodiment are installed in the motor case 101 (not shown).

  The semiconductor module 870 has a first special terminal 871 and a second special terminal 872 embedded in the sealing body 520. In other words, in this embodiment, the special terminals include the first special terminal 871 and the second special terminal 872. The first special terminal 871 and the second special terminal 872 are each formed in a prismatic shape. The 1st special terminal 871 and the 2nd special terminal 872 are provided in the sealing body 520 so that each edge part may protrude from the front surface 522. FIG. In the present embodiment, the first special terminal 871 and the second special terminal 872 are located at the lower end of the front surface 525, that is, in the vicinity of the lower surface 523. The first special terminal 871 and the second special terminal 872 and the semiconductor chip 511 are electrically insulated.

  The motor case 101 has a front terminal receiving portion 171 that extends in the z-axis direction from the wall surface 108 of the partition wall 107. The front terminal receiving portion 171 has a wall surface 172 and a wall surface 173 substantially parallel to the x axis. The first special terminal 871 and the second special terminal 872 are sealed so that the distance between them is equal to or slightly larger than the width of the front terminal receiving portion 171 (distance from the wall surface 172 to the wall surface 173). The body 520 is provided. Therefore, when the semiconductor module 870 is installed at a predetermined position of the motor case 101, the front terminal receiving portion 171 is located between the first special terminal 871 and the second special terminal 872. At this time, the wall surface 172 can be engaged with the first special terminal 871, and the wall surface 173 can be engaged with the second special terminal 872. That is, the portions of the front terminal receiving portion 171 where the wall surface 172 and the wall surface 173 are formed respectively form “engagement portions” in the claims. The “engagement portion” is a portion indicated by an engagement portion 174 and an engagement portion 175 in FIG.

In the present embodiment, the first special terminal 871 and the second special terminal 872 protruding from the front surface 522 of the sealing body 520, the wall surface 172 (engagement portion 174) and the wall surface 173 (engagement portion 175) of the front terminal receiving portion 171. The displacement of the semiconductor module 870 with respect to the motor case 101 in the “right side” direction and the “left side” direction (y-axis direction) is restricted.
In the present embodiment, as in the fifth embodiment, the distance between the front terminal receiving portion 171 and the heat sink 601 is the thickness of the sealing body 520 of the semiconductor module 870 (the distance from the front surface 522 to the back surface 521). It is set to be equal or slightly larger than the thickness. Therefore, the semiconductor module 870 is positioned between the front terminal receiving portion 171 and the heat sink 601, thereby restricting the positional deviation in the “front” direction and the “back” direction (x-axis direction) with respect to the motor case 101.

  As described above, in the present embodiment, the semiconductor module 870 includes the first special terminal 871 and the second special terminal 872, and positional deviation with respect to the motor case 101 is regulated by the two special terminals. Further, the positional displacement of the semiconductor module 870 is also restricted by the front terminal receiving portion 171 and the heat sink 601. Therefore, in this embodiment, the effect of restricting the displacement of the semiconductor module with respect to the motor case 101 is high.

  In the present embodiment, as shown in FIG. 14, the first special terminal 871 and the second special terminal 872 are arranged near the lower surface 523 of the front surface 522. As a modified example of the present embodiment, a configuration in which the first special terminal 871 or the second special terminal 872 is disposed in the vicinity of the upper surface 524 of the front surface 522 or approximately in the middle between the upper surface 524 and the lower surface 523 can be considered. . That is, the first special terminal 871 and the second special terminal 872 may be disposed at any position in the “upper surface” direction (z-axis direction) on the front surface 522.

(Ninth embodiment)
A driving apparatus according to a ninth embodiment of the present invention will be described with reference to FIG. In the ninth embodiment, the number of front terminal receiving portions formed in the motor case is different from that in the eighth embodiment.
FIG. 15 is a schematic diagram schematically showing a part of the semiconductor module 880 and the motor case 101 in a state before being installed in the motor case 101. In the ninth embodiment, similar to the above-described embodiment, a total of six semiconductor modules 880 having the same form are installed in the motor case 101 (not shown).

  The semiconductor module 880 has a first special terminal 881 and a second special terminal 882 embedded in the sealing body 520. That is, in the present embodiment, the special terminals include the first special terminal 881 and the second special terminal 882. The first special terminal 881 and the second special terminal 882 are each formed in a prismatic shape. The 1st special terminal 881 and the 2nd special terminal 882 are provided in the sealing body 520 so that each edge part may protrude from the front surface 522. FIG. In the present embodiment, the first special terminal 881 and the second special terminal 882 are located at the lower end of the front surface 525, that is, in the vicinity of the lower surface 523. The first special terminal 881 and the second special terminal 882 and the semiconductor chip 511 are electrically insulated.

  The motor case 101 includes a first front terminal receiving portion 181 and a second front terminal receiving portion 182 that extend in the z-axis direction from the wall surface 108 of the partition wall 107. The first front terminal receiving portion 181 has a wall surface 183 substantially parallel to the x axis. On the other hand, the second front terminal receiving portion 182 has a wall surface 184 substantially parallel to the x-axis. In the first special terminal 881 and the second special terminal 882, the distance between the right side 525 side wall of the first special terminal 881 and the left side 526 side wall of the second special terminal 882 is the same as that of the first front terminal receiving portion 181 and the second special terminal 882. The sealing body 520 is provided so as to be equal to or slightly larger than the distance between the front terminal receiving portion 182 (distance from the wall surface 183 to the wall surface 184). Therefore, when the semiconductor module 880 is installed at a predetermined position of the motor case 101, the first special terminal 881 and the second special terminal 882 are located between the first front terminal receiving portion 181 and the second front terminal receiving portion 182. Located in. At this time, the wall surface 183 can be engaged with the first special terminal 881, and the wall surface 184 can be engaged with the second special terminal 882. That is, the portion where the wall surface 183 of the first front terminal receiving portion 181 is formed and the portion where the wall surface 184 of the second front terminal receiving portion 182 is formed are each an “engagement portion” in the claims. Eggplant. The “engagement portion” is a portion indicated by an engagement portion 185 and an engagement portion 186 in FIG.

In the present embodiment, the first special terminal 881 and the second special terminal 882 projecting from the front surface 522 of the sealing body 520, the wall surface 183 (engagement portion 185) of the first front terminal receiving portion 181 and the second front terminal receiving portion. The displacement of the semiconductor module 880 in the “right side” direction and the “left side” direction (y-axis direction) with respect to the motor case 101 is regulated by the engagement of the 182 with the wall surface 184 (engaging portion 186).
Further, in the present embodiment, as in the eighth embodiment, the distance between the front terminal receiving portions (the first front terminal receiving portion 181 and the second front terminal receiving portion 182) and the heat sink 601 is such that the semiconductor module 880 is sealed. It is set to be equal to or slightly larger than the thickness of the stationary body 520 (distance from the front surface 522 to the back surface 521). Therefore, the semiconductor module 880 is positioned between the first front terminal receiving portion 181 and the second front terminal receiving portion 182 and the heat sink 601, whereby the “front” direction and the “rear” direction (x-axis) with respect to the motor case 101 are set. Misalignment in the direction) is regulated.

  As described above, in the present embodiment, the semiconductor module 880 has the first special terminal 881 and the second special terminal 882, and positional deviation with respect to the motor case 101 is regulated by the two special terminals. Further, the positional displacement of the semiconductor module 880 is also restricted by the first front terminal receiving portion 181, the second front terminal receiving portion 182 and the heat sink 601. Therefore, in this embodiment, the effect of restricting the displacement of the semiconductor module with respect to the motor case 101 is high.

  In the present embodiment, as shown in FIG. 15, the first special terminal 881 and the second special terminal 882 are arranged near the lower surface 523 of the front surface 522. As a modification of the present embodiment, a configuration in which the first special terminal 881 or the second special terminal 882 is disposed in the vicinity of the upper surface 524 of the front surface 522 or approximately in the middle between the upper surface 524 and the lower surface 523 can be considered. That is, the first special terminal 881 and the second special terminal 882 may be arranged at any position in the “upper surface” direction (z-axis direction) on the front surface 522.

(10th Embodiment)
A driving apparatus according to a tenth embodiment of the present invention will be described with reference to FIG. In the tenth embodiment, the protruding direction (surface) of the special terminal from the sealing body, the position of the engaging portion formed in the motor case, and the like are different from those in the second embodiment.
FIG. 16 is a schematic diagram schematically showing a semiconductor module 910 in a state before being installed in the motor case 101 and a part of the motor case 101. In the tenth embodiment, a total of six semiconductor modules 910 having the same form as that of the above-described embodiment are installed in the motor case 101 (not shown).

  The semiconductor module 910 has two special terminals (a special terminal 911 and a special terminal 912) embedded in the sealing body 520. The special terminal 911 and the special terminal 912 are each formed in a prismatic shape. The special terminal 911 and the special terminal 912 are provided on the sealing body 520 so that respective end portions protrude from the back surface 521. The special terminal 911 and the special terminal 912 are provided on the straight line in the “right side” direction (y-axis direction) on the back surface 521 at a predetermined interval. The special terminals 911 and 912 and the semiconductor chip 511 are electrically insulated.

A groove 611 and a groove 612 are formed on the side wall surface 605 of the heat sink 601. The groove 611 and the groove 612 correspond to the positions of the special terminal 911 and the special terminal 912 when the semiconductor module 910 is installed in the motor case 101 and the shape of the protruding end of the special terminal 911 and the special terminal 912, respectively. It is formed to do.
Each of the groove 611 and the groove 612 has a virtual plane (yz plane) parallel to the side wall surface 605, and the cross section of the end portion of the special terminal 911 and the end portion of the special terminal 912 is slightly larger or substantially equal. ing. With this configuration, when the semiconductor module 910 is installed in the motor case 101 such that the special terminal 911 and the special terminal 912 are inserted into the groove 611 and the groove 612, the special terminal 911 and the special terminal 912 are respectively The groove 611 and the groove 612 are engaged. That is, the portion of the heat sink 601 in which the groove 611 and the groove 612 are formed forms an “engagement portion” in the claims. The “engagement portion” is a portion indicated by an engagement portion 613 and an engagement portion 614 in FIG.

  In this embodiment, the special terminal 911 and the special terminal 912 protruding from the back surface 521 of the sealing body 520 are engaged with the motor case 101 by the engagement of the groove 611 (engagement portion 613) and the groove 612 (engagement portion 614). The displacement of the semiconductor module 910 in the “right side” direction and the “left side” direction (y-axis direction) is restricted. In the present embodiment, the positions of the semiconductor module 910 in the “lower surface” direction and the “upper surface” direction (z-axis direction) with respect to the motor case 101 by engagement of the special terminals 911 and 912 with the grooves 611 and 612. The deviation can also be regulated. Further, in the present embodiment, the semiconductor module 910 is provided so that the back surface 521 contacts the side wall surface 605 of the heat sink 601, so that the positional deviation of the semiconductor module 910 in the “back surface” direction with respect to the motor case 101 is also regulated by the heat sink 601. Is possible.

In the present embodiment, as shown in FIG. 16, the special terminal 911 and the special terminal 912 are located on a straight line in the “right side” direction (y-axis direction) on the back surface 521, and are arranged at a predetermined interval from each other. Yes. As a modification of the present embodiment, a configuration in which the special terminal 911 and the special terminal 912 are not on a straight line in the “right side” direction (y-axis direction) can be considered. That is, the special terminal 911 and the special terminal 912 may be arranged so as to be shifted from each other in the “upper surface” direction (z-axis direction) with respect to the back surface 521.
In this embodiment, the semiconductor module 910 has two special terminals (the special terminal 911 and the special terminal 912). However, the semiconductor module 910 has one of the two special terminals. Can also be considered.

(Eleventh embodiment)
A driving apparatus according to an eleventh embodiment of the present invention will be described with reference to FIG. In the eleventh embodiment, the shape of the special terminal, the shape of the groove formed in the heat sink, and the like are different from the tenth embodiment.
FIG. 17A is a schematic diagram schematically showing a part of the semiconductor module 920 and the motor case 101 in a state before being installed in the motor case 101. In the eleventh embodiment, a total of six semiconductor modules 920 having the same configuration as that of the above-described embodiment are installed in the motor case 101 (not shown).

  The semiconductor module 920 has two special terminals (a special terminal 921 and a special terminal 923) embedded in the sealing body 520. The special terminal 921 and the special terminal 923 are provided on the sealing body 520 so that respective end portions protrude from the back surface 521. The special terminal 921 has an extending portion 922 extending in the “left side” direction from the protruding end portion (see FIG. 17B). The special terminal 923 has an extending portion 924 extending in the “right side” direction from the end portion on the protruding side. That is, the special terminal 921 and the special terminal 923 are each formed in an approximately L shape when viewed from the “upper surface” direction (z-axis direction). The special terminal 921 and the special terminal 923 are provided on the straight line in the “right side” direction (y-axis direction) on the back surface 521 at a predetermined interval. The special terminals 921 and 923 and the semiconductor chip 511 are electrically insulated.

A groove 621 and a groove 622 are formed on the side wall surface 605 of the heat sink 601. The groove 621 and the groove 622 are positions of the special terminal 921 and the special terminal 923 when the semiconductor module 920 is installed in the motor case 101, and the protruding portions of the special terminal 921 and the special terminal 923 from the sealing body 520, respectively. It is formed so as to correspond to the shape.
Each of the groove 621 and the groove 622 is formed so as to extend in the z-axis direction on the side wall surface 605, and one end portion opens to the upper wall surface 609 of the heat sink 601. Here, the upper wall surface 609 is a wall surface adjacent to the end of the side wall surface 605 on the side opposite to the wall surface 108, and is formed substantially parallel to the wall surface 108. The groove 621 and the groove 622 are formed so that the cross section of a virtual plane (xy plane) parallel to the upper wall surface 609 is slightly larger than or substantially equal to the cross section of the protruding portion of the special terminal 921 and the special terminal 923 from the sealing body 520. Has been. That is, each of the groove 621 and the groove 622 is formed so that the cross-sectional shape of a virtual plane (xy plane) parallel to the upper wall surface 609 is substantially L-shaped.

  With this configuration, when the semiconductor module 920 is installed in the motor case 101 so that the special terminal 921 and the special terminal 923 are inserted into the groove 621 and the groove 622, the special terminal 921 and the special terminal 923 are respectively It is engaged with the groove 621 and the groove 622. That is, the portion of the heat sink 601 in which the groove 621 and the groove 622 are formed forms an “engagement portion” in the claims. The “engagement portion” is a portion indicated by an engagement portion 623 and an engagement portion 624 in FIG.

  In the present embodiment, the special terminal 921 and the special terminal 923 protruding from the back surface 521 of the sealing body 520 and the groove 621 (engagement portion 623) and groove 622 (engagement portion 624) are engaged with the motor case 101. The displacement of the semiconductor module 920 in the “right side” direction and the “left side” direction (y-axis direction) is restricted. In the present embodiment, since the special terminal 921 and the special terminal 923 are each formed in a substantially L shape, the “front” direction of the semiconductor module 920 with respect to the motor case 101 (the direction in which the semiconductor module 920 moves away from the heat sink 601). It is also possible to regulate the positional deviation. Further, in the present embodiment, the semiconductor module 920 is provided so that the back surface 521 contacts the side wall surface 605 of the heat sink 601, and thus the positional deviation of the semiconductor module 920 in the “back surface” direction with respect to the motor case 101 is also regulated by the heat sink 601. Is possible.

In the present embodiment, as shown in FIG. 17, the special terminal 921 and the special terminal 923 are located on a straight line in the “right side” direction (y-axis direction) on the back surface 521 and are arranged at a predetermined interval from each other. Yes. As a modification of the present embodiment, a configuration in which the special terminal 921 and the special terminal 923 are not on a straight line in the “right side” direction (y-axis direction) can be considered. That is, the special terminal 921 and the special terminal 923 may be arranged so as to be shifted from each other in the “upper surface” direction (z-axis direction) with respect to the back surface 521.
In this embodiment, the semiconductor module 920 has two special terminals (special terminal 921 and special terminal 923) having the same shape. However, as the configuration of the semiconductor module 920, one of the two special terminals is used. It is also possible to consider a configuration having

(Twelfth embodiment)
A driving apparatus according to a twelfth embodiment of the present invention will be described with reference to FIG. In the twelfth embodiment, the shape of the special terminal, the shape of the groove formed in the heat sink, and the like are different from those in the eleventh embodiment.
FIG. 18A is a schematic diagram schematically showing a part of the semiconductor module 930 and the motor case 101 in a state before being installed in the motor case 101. In the twelfth embodiment, a total of six semiconductor modules 930 having the same configuration as that of the above-described embodiment are installed in the motor case 101 (not shown).

  The semiconductor module 930 has two special terminals (a special terminal 931 and a special terminal 933) embedded in the sealing body 520. The special terminal 931 and the special terminal 933 are provided on the sealing body 520 so that respective end portions protrude from the back surface 521. The special terminal 931 and the special terminal 933 are located at the upper end of the back surface 521, that is, in the vicinity of the upper surface 524. The special terminal 931 has an extending portion 932 extending in the “lower surface” direction from the protruding end portion (see FIG. 18B). The special terminal 933 has an extending portion 934 extending in the “lower side” direction from the end portion on the protruding side. That is, the special terminal 931 and the special terminal 933 are each formed in a substantially L shape when viewed from the “right side” direction (y-axis direction). The special terminal 931 is located at the upper right end of the back surface 521, that is, in the vicinity of the right side surface 525 and the upper surface 524. On the other hand, the special terminal 933 is located at the upper left end of the rear surface 521, that is, in the vicinity of the left side surface 526 and the upper surface 524. The special terminals 931 and 933 and the semiconductor chip 511 are electrically insulated.

  A groove 631 and a groove 632 are formed on the upper wall surface 609 of the heat sink 601. The groove 631 and the groove 632 respectively correspond to the positions of the extension part 932 and the extension part 934 when the semiconductor module 930 is installed in the motor case 101, and the shapes of the extension part 932 and the extension part 934. It is formed as follows. Each of the groove 631 and the groove 632 has a virtual plane (xy plane) parallel to the upper wall surface 609 and a cross section of the extension portion 932 and the extension portion 934 that is slightly larger or substantially equal.

  With this configuration, when the semiconductor module 930 is installed in the motor case 101 so that the extending portion 932 and the extending portion 934 are inserted into the groove 631 and the groove 632, the special terminal 931 and the special terminal 933 are The grooves 631 and 632 are engaged with each other. That is, the portion of the heat sink 601 where the groove 631 and the groove 632 are formed forms an “engagement portion” in the claims. The “engagement portion” is a portion indicated by an engagement portion 633 and an engagement portion 634 in FIG.

  In this embodiment, the extension portion 932 and the extension portion 934 extending from each of the special terminal 931 and the special terminal 933 are engaged with the groove 631 (engagement portion 633) and the groove 632 (engagement portion 634). The displacement of the semiconductor module 930 in the “right side” direction and the “left side” direction (y-axis direction) with respect to the motor case 101 is restricted. In the present embodiment, since the special terminal 931 and the special terminal 933 are each formed in a substantially L shape, the “front” direction of the semiconductor module 930 relative to the motor case 101 (the direction in which the semiconductor module 930 moves away from the heat sink 601). It is also possible to regulate the positional deviation. Furthermore, in the present embodiment, the semiconductor module 930 is provided so that the back surface 521 contacts the side wall surface 605 of the heat sink 601, and thus the positional deviation of the semiconductor module 930 in the “back surface” direction with respect to the motor case 101 is also regulated by the heat sink 601. Is possible.

  In the present embodiment, the semiconductor module 930 has two special terminals (special terminal 931 and special terminal 933) having the same shape. However, as a configuration of the semiconductor module 930, one of the two special terminals is used. It is also possible to consider a configuration having

(13th Embodiment)
A driving apparatus according to a thirteenth embodiment of the present invention will be described with reference to FIG. The thirteenth embodiment differs from the eleventh embodiment in the number and shape of special terminals and the shape and number of grooves formed in the heat sink.
FIG. 19 is a schematic diagram schematically showing a part of the semiconductor module 940 and the motor case 101 in a state before being installed in the motor case 101. In the thirteenth embodiment, a total of six semiconductor modules 940 having the same form as that of the above-described embodiment are installed in the motor case 101 (not shown).

  The semiconductor module 940 has a special terminal 941 embedded in the sealing body 520. The special terminal 941 is provided on the sealing body 520 such that an end thereof protrudes from the back surface 521. The special terminal 941 has an extending portion 942 extending in the “left side” direction from the protruding end portion. Further, the special terminal 941 has an extending portion 943 extending from the protruding end portion in the “right side” direction, that is, in the direction opposite to the extending portion 942. That is, the special terminal 941 is formed in a substantially T shape when viewed from the “upper surface” direction (z-axis direction). The special terminal 941 and the semiconductor chip 511 are electrically insulated.

A groove 641 is formed on the side wall surface 605 of the heat sink 601. The groove 641 is formed to correspond to the position of the special terminal 941 when the semiconductor module 940 is installed in the motor case 101 and the shape of the protruding portion of the special terminal 941 from the sealing body 520.
The groove 641 is formed on the side wall surface 605 so as to extend in the z-axis direction, and one end thereof opens to the upper wall surface 609 of the heat sink 601. The groove 641 is formed such that the cross section of a virtual plane (xy plane) parallel to the upper wall surface 609 is slightly larger than or substantially equal to the cross section of the protruding portion of the special terminal 941 from the sealing body 520. That is, the groove 641 is formed so that the cross-sectional shape of a virtual plane (xy plane) parallel to the upper wall surface 609 is substantially T-shaped.

  With this configuration, when the semiconductor module 940 is installed in the motor case 101 so that the special terminal 941 is inserted into the groove 641, the special terminal 941 is engaged with the groove 641. That is, the portion of the heat sink 601 where the groove 641 is formed forms an “engagement portion” in the claims. The “engagement portion” is a portion indicated by an engagement portion 642 in FIG.

  In this embodiment, the engagement between the special terminal 941 protruding from the back surface 521 of the sealing body 520 and the groove 641 (engagement portion 642) causes the “right side” direction and “left side” of the semiconductor module 940 to the motor case 101. The displacement in the “direction” (y-axis direction) is restricted. Further, in this embodiment, since the special terminal 941 is formed in a substantially T shape, the positional deviation in the “front” direction of the semiconductor module 940 with respect to the motor case 101 (the direction in which the semiconductor module 940 moves away from the heat sink 601) It can be regulated. Furthermore, in this embodiment, since the semiconductor module 940 is provided so that the back surface 521 contacts the side wall surface 605 of the heat sink 601, the heat sink 601 also regulates the displacement of the semiconductor module 940 in the “back surface” direction with respect to the motor case 101. Is possible.

  In the present embodiment, the semiconductor module 940 has one special terminal 941 having a substantially T-shape. However, as the configuration of the semiconductor module 940, a configuration having a plurality of special terminals 941 can be considered.

(14th Embodiment)
A driving apparatus according to a fourteenth embodiment of the present invention will be described with reference to FIG. The fourteenth embodiment shows an example of a combination of the above-described embodiments.
FIG. 20 is a schematic diagram schematically showing the semiconductor module 890 in a state before being installed in the motor case 101 and a part of the motor case 101. In the fourteenth embodiment, a total of six semiconductor modules 890 having the same form as the above-described embodiment are installed in the motor case 101 (not shown).

  The semiconductor module 890 has two special terminals (a special terminal 891 and a special terminal 892) embedded in the sealing body 520. The special terminal 891 and the special terminal 892 are formed in a prismatic shape. The special terminal 891 is provided on the sealing body 520 such that an end thereof protrudes from the right side surface 525. On the other hand, the special terminal 892 is provided on the sealing body 520 so that an end portion thereof protrudes from the front surface 522. In the present embodiment, the special terminal 891 is located at the lower end of the right side surface 525, that is, in the vicinity of the lower surface 523. The special terminal 892 is located at the lower left end of the front surface 522, that is, in the vicinity of the left side surface 526 and the lower surface 523. The special terminals 891 and 892 and the semiconductor chip 511 are electrically insulated.

  The motor case 101 has a right terminal receiving portion 191 and a front terminal receiving portion 192 that extend in the z-axis direction from the wall surface 108 of the partition wall 107. A groove 193 and a groove 194 are formed in the right terminal receiving portion 191 and the front terminal receiving portion 192, respectively. The groove 193 is formed to correspond to the position of the special terminal 891 when the semiconductor module 890 is installed in the motor case 101 and the shape of the protruding side end of the special terminal 891. The groove 194 is formed so as to correspond to the position of the special terminal 892 when the semiconductor module 890 is installed in the motor case 101 and the shape of the protruding end of the special terminal 892.

  The right terminal receiving part 191 and the groove 193 have the same form as the right terminal receiving part 131 and the groove 133 of the fourth embodiment. The front terminal receiving part 192 and the groove 194 have the same form as the front terminal receiving part 141 and the groove 142 of the fifth embodiment. That is, this embodiment shows the form which combined the principal part of 4th Embodiment and 5th Embodiment. The portion of the right terminal receiving portion 191 in which the groove 193 is formed and the portion of the front terminal receiving portion 192 in which the groove 194 is formed form an “engaging portion” in the claims. The “engagement portion” is a portion indicated by an engagement portion 195 and an engagement portion 196 in FIG.

  In the present embodiment, the engagement between the special terminal 891 and the groove 193 (engagement portion 195) restricts the positional deviation of the semiconductor module 890 in the “front” direction and the “rear” direction (x-axis direction) with respect to the motor case 101. Is done. Further, due to the engagement between the special terminal 892 and the groove 194 (engagement portion 196), the displacement of the semiconductor module 890 in the “right side” direction and the “left side” direction (y-axis direction) with respect to the motor case 101 is restricted. The Further, the front terminal receiving portion 192 and the heat sink 601 also restrict displacement of the semiconductor module 890 in the “front” direction and the “back” direction (x-axis direction) with respect to the motor case 101.

  Thus, in this embodiment, it has the right terminal receiving part 191 (engaging part 195) and the front terminal receiving part 192 (engaging part 196). Therefore, each of the right terminal receiving part 191 and the front terminal receiving part 192 exhibits an effect of restricting the positional deviation of the semiconductor module 890 in a predetermined direction. Therefore, in this embodiment, both the effect by 4th Embodiment and the effect by 5th Embodiment can be enjoyed.

(Other embodiments)
In the above-mentioned 14th Embodiment, the form which combined the principal part of 4th Embodiment and 5th Embodiment was shown. In the other embodiments of the present invention, as in the fourteenth embodiment, any configuration of the above-described embodiments can be combined as long as there are no structural obstruction factors. In addition, the configuration in which one or two special terminals are provided per one surface of the sealing body as in each of the above-described embodiments, and three or more special terminals are provided per one surface of the sealing body. Can also be considered.

  In another embodiment of the present invention, the special terminal is not limited to a prismatic shape, and may be formed in any three-dimensional shape such as a cylindrical shape, a polygonal column shape, and a hemispherical shape. However, in this case, the shape of the engaging portion corresponding to the special terminal needs to be formed so as to correspond to the shape of the special terminal.

  Further, in another embodiment of the present invention, the number of lead wires of the coil wire wound around the stator of the motor is not limited to six and may be any number. A number of semiconductor modules corresponding to the number of extraction lines are mounted on the driving device.

In another embodiment of the present invention, the semiconductor chip and the special terminal may be electrically connected. In the case of this configuration, the special terminal can be used not only as “a terminal for suppressing misalignment of the semiconductor module” but also as “a terminal for electrically connecting the semiconductor chip and another member”. . Thereby, the special terminal can be used as a ground terminal of the semiconductor chip, for example.
Alternatively, the ground terminal of the semiconductor chip protruding from the sealing body may be used as a special terminal for “suppressing misalignment of the semiconductor module”. In this case, if the engaging portion corresponding to the position and shape of the ground terminal is formed in the motor case, the effect of suppressing the displacement of the semiconductor module can be obtained.

  In another embodiment of the present invention, a part of the semiconductor chip of the semiconductor module may be exposed from the sealing body. That is, the semiconductor chip is exposed on the back surface of the sealing body. In this case, if the back surface of the semiconductor module (a part of the semiconductor chip) and the side wall surface of the heat sink are brought into contact with each other, for example, with an insulating heat radiation sheet interposed therebetween, the heat of the semiconductor chip can be effectively radiated. it can. At this time, the insulating heat-radiating sheet can be regarded as a member constituting a part of the sealing body.

  In another embodiment of the present invention, the heat sink may not extend in the motor axial direction. That is, the side wall surface of the heat sink may be formed so as to be inclined with respect to the motor shaft or perpendicular to the motor shaft. Further, the angle formed by the side wall surface of the heat sink and the wall surface of the motor case (the wall surface facing the lower surface of the semiconductor module) may not be a right angle. Moreover, it is good also as a structure provided with the leaf | plate spring etc. as a biasing member so that the back surface of a semiconductor module may fully contact the side wall surface of a heat sink.

  Further, as another embodiment of the present invention, a configuration without a heat sink can be considered. In the case of the present invention, even if the heat sink is not provided, the position shift of the semiconductor module can be regulated by the special terminal and the engaging part of the motor case.

  In the above-described embodiment, the example in which the semiconductor modules are vertically arranged so that the perpendicular to the chip surface of the semiconductor chip is perpendicular to the motor axis has been described. In another embodiment of the present invention, the semiconductor module is not arranged vertically, but may be arranged obliquely such that the perpendicular is inclined with respect to the motor axis, or laterally arranged such that the perpendicular is parallel to the motor axis. Good. Further, the semiconductor module is not limited to the configuration in which the semiconductor module is arranged in the motor axial direction of the motor case as in each of the above-described embodiments.

Although the above embodiment has been described as an example employed in EPS, it can of course be applied to other fields.
Thus, the present invention is not limited to the above-described embodiment, and can be implemented in various forms without departing from the gist thereof.

  1: driving device, 30: motor, 101: motor case, 110, 113, 114, 135, 136, 143, 165, 166, 174, 175, 185, 186, 195, 196, 613, 614, 623, 624, 633, 634, 642: engaging portion, 201: stator, 301: rotor, 401: shaft, 501, 502, 503, 504, 505, 506, 810, 820, 830, 840, 860, 870, 880, 890, 910, 920, 930, 940: semiconductor module, 511: semiconductor chip, 520: sealing body, 530, 811, 812, 831, 832, 841, 861, 862, 871, 872, 881, 882, 911, 912, 921, 923, 931, 933, 941, 891, 892: Special terminals

Claims (25)

A cylindrical motor case, a stator on which windings are wound so as to form a plurality of phases arranged inside the motor case in the radial direction, a rotor arranged inside the stator in the radial direction, and rotating together with the rotor A motor having a shaft;
A semiconductor chip for switching a winding current flowing through the plurality of phase windings, a sealing body covering the semiconductor chip, and a semiconductor module having a special terminal embedded in the sealing body,
The motor case has an engaging portion corresponding to the special terminal,
The drive device according to claim 1, wherein the special terminal protrudes from the sealing body so as to be able to regulate a displacement of the semiconductor module with respect to the motor case by being engaged with the engagement portion. The motor case has a heat radiating portion extending from the wall surface,
The drive device according to claim 1, wherein the semiconductor module is provided in contact with the heat radiating portion. The sealing body is formed in a substantially rectangular parallelepiped shape,
Of the six surfaces of the sealing body, the surface substantially parallel to the chip surface of the semiconductor chip is the back surface, the surface opposite to the back surface is the front surface, and one of the other four surfaces is the bottom surface. The surface opposite to the lower surface is the upper surface, and the remaining two surfaces are the right side surface and the left side surface, respectively.
The drive device according to claim 2, wherein the semiconductor module is provided such that the back surface is in contact with the heat radiating portion. The engaging portion is formed on the wall surface,
The drive device according to claim 3, wherein the special terminal protrudes from the lower surface so as to be engaged with the engaging portion by being inserted into a groove formed in the wall surface. The engaging portion is formed in a right terminal receiving portion extending from the wall surface,
The said special terminal protrudes from the said right side surface so that it may be engaged with the said engaging part by being inserted in the groove | channel formed in the said right terminal receiving part. The drive device described. The engaging portion is formed in a left terminal receiving portion that extends from the wall surface,
The said special terminal protrudes from the said left side surface so that it may engage with the said engaging part by being inserted in the groove | channel formed in the said left terminal receiving part. The drive device as described in any one. The engaging portion is formed in a front terminal receiving portion extending from the wall surface,
The said special terminal protrudes from the said front surface so that it may be engaged with the said engaging part by being inserted in the groove | channel formed in the said front terminal receiving part. The driving device according to claim 1. The engaging portion is formed in a front terminal receiving portion extending from the wall surface,
The special terminal includes a first special terminal and a second special terminal,
The said 1st special terminal and the said 2nd special terminal protrude from the said front surface so that it may engage with the said engaging part when the said front terminal receiving part is located in between. The drive apparatus as described in any one of -6. The engaging portion is formed in a first front terminal receiving portion and a second front terminal receiving portion extending from the wall surface,
The special terminal includes a first special terminal and a second special terminal,
The first special terminal and the second special terminal are positioned between the first front terminal receiving part and the second front terminal receiving part so as to be engaged with the engaging part from the front surface. The drive device according to claim 3, wherein the drive device protrudes. The engaging portion is formed in the heat radiating portion,
The drive according to claim 3, wherein the special terminal protrudes from the back surface so as to be engaged with the engaging portion by being inserted into a groove formed in the heat radiating portion. apparatus. A plurality of the special terminals are provided per one surface so as to protrude from a plurality of locations on at least one surface of the sealing body,
The drive unit according to any one of claims 3 to 10, wherein an engagement portion corresponding to each of the plurality of special terminals is formed in the motor case.   The drive device according to claim 1, wherein at least one of the special terminals is formed in an L shape.   The drive device according to any one of claims 1 to 12, wherein at least one of the special terminals is formed in a T shape.   The drive device according to any one of claims 1 to 13, wherein the special terminal and the semiconductor chip are electrically insulated.   The drive device according to claim 1, wherein the special terminal and the semiconductor chip are electrically connected.   The drive device according to claim 1, wherein a plurality of the semiconductor modules are provided.   The semiconductor module is vertically arranged on the side opposite to the rotor of the motor case in the direction of the center line of the shaft so that the perpendicular of the chip surface of the semiconductor chip is not parallel to the center line of the shaft. The drive device according to any one of claims 1 to 16.   The drive device according to claim 17, wherein the semiconductor module is arranged such that the perpendicular is perpendicular to a center line of the shaft. A cylindrical motor case, a stator on which windings are wound so as to form a plurality of phases arranged inside the motor case in the radial direction, a rotor arranged inside the stator in the radial direction, and rotating together with the rotor A semiconductor module assembled to a motor having a shaft,
A semiconductor chip for switching the winding current flowing in the windings of the plurality of phases;
A sealing body covering the semiconductor chip;
The sealing body protrudes from the sealing body so that the displacement of the semiconductor module relative to the motor case can be regulated by being engaged with an engaging portion formed on the motor case. And a special terminal provided on the semiconductor module.   The semiconductor module according to claim 19, wherein the sealing body is formed in a substantially rectangular parallelepiped shape.   21. The semiconductor module according to claim 20, wherein a plurality of the special terminals are provided per one surface so as to protrude from a plurality of locations on at least one surface of the sealing body.   The semiconductor module according to any one of claims 19 to 21, wherein at least one of the special terminals is formed in an L shape.   The semiconductor module according to any one of claims 19 to 22, wherein at least one of the special terminals is formed in a T shape.   The semiconductor module according to any one of claims 19 to 23, wherein the special terminal and the semiconductor chip are electrically insulated.   The semiconductor module according to any one of claims 19 to 23, wherein the special terminal and the semiconductor chip are electrically connected.

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