JP5485591B2 - Drive device and semiconductor module - Google Patents

Description

  The present invention relates to a driving device in which a motor and an electronic circuit are integrated.

  In recent years, in order to achieve low fuel consumption, an electric assist device that generates electric torque has attracted attention as a mechanism for assisting the steering operation of the vehicle, instead of the hydraulic assist device that generates torque by hydraulic pressure.

A motor that is a power generation source of the electric assist device is driven by a plurality of phases of AC voltage generated from the DC voltage. An electronic circuit that converts direct current into alternating current includes a semiconductor module having a semiconductor chip for switching the timing of supplying current to a plurality of phases of winding, a microcomputer, and the like.
Conventionally, a device in which such an electronic circuit is arranged in the vicinity of a motor has been disclosed (for example, see Patent Document 1).

JP 2004-159454 A

  However, in the configuration disclosed in Patent Document 1 described above, the semiconductor module main body is arranged around the stator in advance, and then the lead of the semiconductor module is connected to the printed wiring board on which the stator coil or other electronic components are arranged. There is a need to. Therefore, when a semiconductor module is disposed in a component other than a printed wiring board, such as a motor case, the semiconductor module is positioned in advance so that the position of the semiconductor module does not deviate from the component. You have to do the work. For this reason, there exists a possibility that an assembly process may become complicated. Further, if a jig or the like is used to position the semiconductor module so that the position of the semiconductor module does not shift, there is a concern about an increase in manufacturing cost.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a drive device that can position a semiconductor module without using a jig or the like and can save labor in an assembly process. It is in.

  The drive device according to claim 1, which has been made in order to solve the above-described problem, includes a motor that is rotationally driven by passing a current, and an electronic circuit that includes a semiconductor module for controlling the current that flows through the motor. Yes.

  The outer shell of the motor is formed by a motor case having a cylindrical portion and a partition wall provided extending radially inward from the end of the cylindrical portion. A stator is disposed on the radially inner side of the cylindrical portion. The stator is formed by winding a winding so as to constitute a plurality of phases. Further, a rotor is disposed on the radially inner side of the stator, and the shaft rotates together with the rotor.

  The electronic circuit has a semiconductor module including a semiconductor chip for switching winding currents flowing through a plurality of phases of windings. For example, a semiconductor switch element is configured in the semiconductor chip, and the winding current is switched by turning on / off the semiconductor switch element.

  The semiconductor module is formed by covering a semiconductor chip with a sealing body. The term “covering” as used herein is not limited to covering all of the semiconductor chip but also includes covering at least a part of the semiconductor chip. A resin is generally used as a material for the sealing body. The sealing body constitutes the outline of the semiconductor module.

Here, particularly in the present invention, the motor case is integrally formed with the same material as that of the motor case, and the semiconductor module sealing body is made of the same material as that of the sealing body so as to correspond to the engaging portion. The joint is formed integrally . The engaging portion and the engaged portion are formed so that the semiconductor module can be positioned relative to the motor case by mutual engagement.

  The engaged portion formed in the semiconductor module can be formed, for example, as a concave portion or a convex portion by resin molding when performing resin sealing of the semiconductor chip. Alternatively, the outline of the semiconductor module itself can be used as the engaged portion, instead of forming the concave portion or the convex portion.

  Thus, when the semiconductor module is assembled to the motor case, the semiconductor module is positioned at a predetermined position if the semiconductor module is arranged in the motor case so that the engaging portion and the engaged portion are engaged. “Positioning” as used herein refers to regulating positional deviation in a specific direction with respect to the motor case of the semiconductor module.

  Thus, in the present invention, the semiconductor module can be positioned without using a jig or the like for supporting the semiconductor module. As a result, the drive assembly process can be saved and the manufacturing cost can be reduced.

  By the way, in the above-described electronic circuit, it is important to arrange components so that the semiconductor module does not affect other electronic components even if heat is generated. Therefore, the motor case itself may serve as heat dissipation. For example, it is conceivable that the motor case main body has a certain heat capacity without providing a heat dissipation structure in the motor case. The motor case may have a heat dissipation configuration. For example, it is good also as what has a thermal radiation part as shown to the next structure.

Specifically, as in the first aspect of the invention, the motor case is exemplified to have a heat radiating portion provided extending from the partition wall in the direction of the center line of the shaft. The semiconductor module has a heat radiating surface facing the chip surface of the semiconductor chip in the sealing body. And a semiconductor module is arrange | positioned so that a thermal radiation surface can contact | abut to a thermal radiation part, when an engaging part and an engaged part engage. Here, the term “contact” of the semiconductor module with the heat radiating portion is not limited to the direct contact between the semiconductor module and the heat radiating portion, but the semiconductor module and the heat radiating portion may contact each other with, for example, a heat radiating sheet interposed therebetween. It also includes the meaning of touching.

According to this, since the semiconductor module is disposed so as to come into contact with the heat radiating portion, the displacement of the semiconductor module toward the heat radiating portion with respect to the motor case is restricted.
Further, according to the present invention, even when the heat generated by the semiconductor chip is large, the heat generated by the semiconductor module is released via the heat radiating portion, so that it is possible to suppress the temperature of the semiconductor chip from rising above the allowable temperature.
In the first aspect of the present invention, the engaging portion is formed so as to protrude from the wall surface extending perpendicularly to the heat radiating portion or to be recessed.

In the invention according to claim 2 , the semiconductor module is formed so that the area of the heat radiating surface is the largest compared to the other surfaces. According to this, for example, when the semiconductor module and the heat radiating portion are in contact with each other as described above, a large contact area can be ensured, so that the heat dissipation effect of the semiconductor module can be promoted.

Further, as described in claim 3 , the semiconductor module is exemplified to be formed in a substantially rectangular parallelepiped shape. In this case, the semiconductor module includes a front surface that is substantially parallel to the chip surface and opposed to the heat dissipation surface in the sealing body, a lower surface that is one of the heat dissipation surface and a surface substantially perpendicular to the front surface, and the lower surface. And an upper surface which is an opposing surface. In addition, the semiconductor module has a right side that is one of the surfaces substantially perpendicular to any of the heat dissipation surface, the front surface, the lower surface, and the upper surface, and a left side that faces the right side.

As used herein, “substantially rectangular parallelepiped” refers to a generally rectangular parallelepiped, and includes, for example, all adjacent surfaces that do not intersect each other exactly vertically, or chamfered corners or sides of the rectangular parallelepiped. . The following claims 4 to 11 illustrate more specific configurations of the above-described invention.

In the invention described in claim 4 , the sealing body itself formed in a substantially rectangular parallelepiped shape of the semiconductor module may function as the engaged portion. Thereby, there exists an effect similar to the above-mentioned Claim 1.

In the invention according to claim 5 , the engaged portion is provided on the lower surface of the semiconductor module, and is formed as a groove-like recess extending from the front surface of the semiconductor module toward the heat dissipation surface. Here, the case where the groove-shaped recessed part has reached from the front surface to the heat radiating surface may be considered. For example, when the groove-shaped recess reaches from the front surface to the heat radiating surface, the engaging portion and the engaged portion are engaged, so that the semiconductor module is in the “right side” and “left side” directions with respect to the motor case. Is displaced.

On the other hand, when the groove-shaped recess does not reach from the front surface to the heat radiating surface, the semiconductor module is restricted from being displaced in the “right side” direction and the “left side” direction as described above with respect to the motor case. Further, the positional deviation in the “front surface” direction and the “heat radiation surface” direction is further restricted.
Here, the “right side” direction refers to a direction from the “left side” to the “right side” of the sealing body. Similarly, the “left side” direction refers to a direction from the “right side” to the “left side” of the sealing body. Further, the “front surface” direction refers to a direction from the “heat radiation surface” of the sealing body toward the “front surface”. Similarly, the “heat radiating surface” direction refers to a direction from the “front surface” of the sealing body toward the “heat radiating surface”.

In the invention described in claim 6 , the engaged portion is provided on the front surface of the semiconductor module, and is formed as a groove-shaped recess extending from the lower surface to the upper surface of the semiconductor module. In the present invention, the engagement of the engaging part and the engaged part restricts the displacement of the semiconductor module in the “right side” direction and the “left side” direction with respect to the motor case. Furthermore, the positional deviation in the “front surface” direction and the “heat radiation surface” direction is restricted.

In the seventh aspect of the present invention, the engaged portion is provided as a groove-like recess provided on the front surface of the semiconductor module and extending from the left side surface to the right side surface of the semiconductor module. In the present invention, when the engaging portion and the engaged portion are engaged, the semiconductor module is moved in the “front surface” direction, the “heat radiation surface” direction, the “upper surface” direction, and the “lower surface” direction with respect to the motor case. Misalignment is regulated.

In the invention according to claim 8 , a plurality of engaged portions are provided on at least one surface of the sealing body. A plurality of engaging portions are provided in the motor case corresponding to the engaged portions, respectively. By providing a plurality of sets of engaging portions and engaged portions in this manner, the semiconductor module can be positioned more reliably.

In the invention according to claim 9 , the semiconductor module is vertically arranged on the side opposite to the rotor in the direction of the center line of the shaft of the motor case so that the perpendicular of the chip surface of the semiconductor chip is not parallel to the center line of the shaft. . In the following description, the “shaft center line” is simply referred to as “axis”, and the “shaft center line direction” is simply referred to as “axial direction” as appropriate.

  In the present invention, the semiconductor module is disposed on the opposite rotor side of the partition of the motor case. Thus, in this invention, since the semiconductor module is arrange | positioned in the motor axial direction of a motor case, the physique of radial direction can be made small compared with the structure which arrange | positions a semiconductor module around a stator.

  Here, in particular, the present invention is characterized in that the semiconductor module is vertically arranged so that the perpendicular of the chip surface of the semiconductor chip is not parallel to the motor axis. That is, the semiconductor module is arranged in a state of rising in the motor axis direction. By arranging semiconductor modules vertically, many semiconductor modules can be arranged in a limited space. It is also possible to arrange other members or the like in a space secured by arranging the semiconductor modules vertically.

  When the semiconductor modules are arranged vertically as described above, there is a concern that the semiconductor modules may fall down particularly during manufacturing. However, in the present invention, the motor case has an engaging portion, and the semiconductor module has an engaged portion that engages with the engaging portion. For this reason, even in the configuration in which the semiconductor modules are vertically arranged, it is possible to regulate the positional deviation including the collapse of the semiconductor modules.

The invention described in claim 9 is characterized by the vertical arrangement of the semiconductor modules.
In the invention of claim 10 , as an example, the semiconductor module is arranged so that the perpendicular of the chip surface is perpendicular to the center line of the shaft. Generally, a semiconductor module has a plate shape that is wide in the direction of the chip surface. For this reason, this configuration further contributes to securing the radial space as compared with the case where the semiconductor module is inclined and arranged in the motor axial direction. Note that the normal of the chip surface perpendicular to the motor axis does not have to be perpendicular in a strict sense, and includes that which is slightly inclined.

The invention according to claim 11 further includes a pressing member that presses the heat dissipation surface of the semiconductor module against the heat dissipation portion. For example, the pressing member is an urging means using a leaf spring. According to this, since the heat radiating surface of the semiconductor module can be brought into contact with the heat radiating portion reliably, the heat radiating property of the semiconductor module can be promoted.

In addition, although it demonstrated as invention of the drive device above, it can also be implement | achieved as invention of the semiconductor module provided in the electronic circuit for rotationally driving the drive device concerned. That is, as shown in claim 12 . Further, as shown in claims 13 to 21 may be employed the same configuration as the driving device. Even if these configurations are employed, the same effects as those of the driving device can be obtained.

1 is a cross-sectional view of a drive device according to a first embodiment of the present invention. Explanatory drawing which shows schematic structure of an electric power steering. The top view of the drive device by 1st Embodiment of this invention. The side view of the drive device by 1st Embodiment of this invention. FIG. 3 is a partially enlarged perspective view of the drive device according to the first embodiment of the present invention. The disassembled perspective view of the drive device by 1st Embodiment of this invention. The schematic diagram which shows schematic structure of the semiconductor module and motor case of the drive device by 1st Embodiment of this invention. The schematic diagram which shows schematic structure of the semiconductor module and motor case of the drive device by 2nd Embodiment of this invention. The schematic diagram which shows schematic structure of the semiconductor module and motor case of the drive device by 3rd Embodiment of this invention. The schematic diagram which shows schematic structure of the semiconductor module and motor case of the drive device by 4th Embodiment of this invention. The schematic diagram which shows schematic structure of the semiconductor module and motor case of the drive device by 5th Embodiment of this invention. The schematic diagram which shows schematic structure of the semiconductor module and motor case of the drive device by 6th Embodiment of this invention. The schematic diagram which shows schematic structure of the semiconductor module and motor case of the drive device by the 1st reference example of this invention. The schematic diagram which shows schematic structure of the semiconductor module and motor case of the drive device by the 2nd reference example of this invention. The schematic diagram which shows schematic structure of the semiconductor module and motor case of the drive device by the 3rd reference example of this invention. The schematic diagram which shows schematic structure of the semiconductor module and motor case of the drive device by 7th Embodiment of this invention. The schematic diagram which shows schematic structure of the semiconductor module and motor case of the drive device by 8th Embodiment of this invention.

Hereinafter, a plurality of embodiments of the present invention will be described with reference to the drawings. Note that, in a plurality of embodiments, substantially the same components are denoted by the same reference numerals, and description thereof is omitted.
(First embodiment)
The drive device according to the first embodiment of the present invention is applied as a drive device for electric power steering (hereinafter referred to as “EPS”).

First, the electrical configuration of the EPS will be described with reference to FIG.
The driving device 1 includes a motor 30, a power unit 50, and a control unit 70. The driving device 1 assists steering by the steering 91 by generating rotational torque in the column shaft 92 via a gear 93 attached to the column shaft 92 that is a rotational shaft of the steering 91 of the vehicle. Specifically, when the steering wheel 91 is operated by the driver, a steering torque generated in the column shaft 92 by the operation is detected by the torque sensor 94, and vehicle speed information is acquired from a CAN (Controller Area Network) ( (Not shown), assisting the driver with the steering wheel 91. Of course, if such a mechanism is used, depending on the control method, it is possible not only to assist the steering, but also to automatically control the operation of the steering wheel 91 such as keeping the lane on the highway and guiding to the parking space on the parking lot. It is.

  The motor 30 is a brushless motor that rotates the gear 93 forward and backward. The power unit 50 supplies power to the motor 30. The power unit 50 includes a choke coil 52, a shunt resistor 53, and an inverter 60 that are interposed in a power supply line from the power supply 51.

  The inverter 60 includes seven MOSFETs (metal-oxide-semiconductor field-effect transistors) 61, 62, 63, 64, 65, 66, and 67 which are a kind of field effect transistors. These MOSFETs 61 to 67 are switching elements. Specifically, the source and drain are turned on (conducted) or turned off (cut off) depending on the potential of the gate.

  Hereinafter, the MOSFETs 61 to 67 are simply referred to as FETs 61 to 67. The FET 67 closest to the shunt resistor 53 is for protection against reverse connection. That is, the FET 67 prevents a reverse current from flowing when the power supply is erroneously connected.

Here, the connection of the remaining six FETs 61 to 66 will be described.
The drains of the three FETs 61 to 63 are connected to the power supply line side. Further, the sources of the FETs 61 to 63 are connected to the drains of the remaining three FETs 64 to 66, respectively. Furthermore, the sources of these FETs 64 to 66 are grounded. The gates of the six FETs 61 to 66 are connected to six output terminals of a pre-driver 71 described later. 2 are connected to the U-phase coil, the V-phase coil, and the W-phase coil of the motor 30, respectively.

  When it is necessary to distinguish the FETs 61 to 66, the symbols in FIG. 2 are used, and the FET (Su +) 61, the FET (Sv +) 62, the FET (Sw +) 63, the FET (Su−) 64, and the FET (Sv−) are used. 65 and FET (Sw−) 66.

  An aluminum electrolytic capacitor 54 is connected in parallel between the power supply line of the FET (Su +) 61 and the ground of the FET (Su−) 64. Similarly, an aluminum electrolytic capacitor 55 is connected in parallel between the power supply line of the FET (Sv +) 62 and the ground of the FET (Sv−) 65, and the power supply line of the FET (Sw +) 63 and the FET (Sw−) are connected. The aluminum electrolytic capacitor 56 is connected in parallel with the ground 66). Hereinafter, the aluminum electrolytic capacitor is simply referred to as “capacitor”.

  The control unit 70 includes the pre-driver 71, custom IC 72, position sensor 73, and microcomputer 74. The custom IC 72 includes a regulator unit 75, a position sensor signal amplification unit 76, and a detection voltage amplification unit 77 as functional blocks.

  The regulator unit 75 is a stabilization circuit that stabilizes the power supply. The regulator unit 75 stabilizes the power supplied to each unit. For example, the microcomputer 74 is operated with a stable predetermined power supply voltage (for example, 5 V) by the regulator unit 75.

A signal from the position sensor 73 is input to the position sensor signal amplifier 76. As will be described later, the position sensor 73 is provided in the motor 30 and outputs a rotation position signal of the motor 30. The position sensor signal amplifying unit 75 amplifies this rotational position signal and outputs it to the microcomputer 74.
The detection voltage amplifier 77 detects the voltage across the shunt resistor 53 provided in the power unit 50, amplifies the voltage across the both ends, and outputs the amplified voltage to the microcomputer 74.

  Therefore, the rotational position signal of the motor 30 and the voltage across the shunt resistor 53 are input to the microcomputer 74. A steering torque signal is input to the microcomputer 74 from a torque sensor 94 attached to the column shaft 92. Furthermore, vehicle speed information is input to the microcomputer 74 via the CAN.

  Thereby, the microcomputer 74 controls the inverter 60 via the pre-driver 71 in accordance with the rotational position signal so as to assist the steering by the steering 91 according to the vehicle speed when the steering torque signal and the vehicle speed information are input. Specifically, the inverter 60 is controlled by turning on / off the FETs 61 to 66 via the pre-driver 71. That is, since the gates of the six FETs 61 to 66 are connected to the six output terminals of the pre-driver 71, these gate potentials are changed by the pre-driver 71.

  Further, the microcomputer 74 controls the inverter 60 so that the current supplied to the motor 30 approaches a sine wave based on the voltage across the shunt resistor 53 input from the detection voltage amplifier 77.

  At this time, the choke coil 52 reduces power supply noise. Further, the capacitors 54 to 56 accumulate electric charges, thereby assisting power supply to the FETs 61 to 66 and suppressing noise components such as a surge voltage. Since the reverse connection protection FET 67 is provided, the capacitors 54 to 56 are not damaged even if the power supply is erroneously connected.

  By the way, the power unit 50 and the control unit 70 are necessary for the drive control of the motor 30 as described above. The power unit 50 and the control unit 70 are configured as a so-called control unit (ECU).

  The motor 30 used in the EPS has an output of about 200 W to 500 W, and the physical area of the power unit 50 and the control unit 70 occupying the entire driving device 1 is about 20 to 40%. Moreover, since the output of the motor 30 is large, the power unit 50 tends to increase in size, and 70% or more of the region occupied by the power unit 50 and the control unit 70 is the region occupied by the power unit 50.

The components constituting the power unit 50 occupy a large area are the choke coil 52, the capacitors 54 to 56, and the semiconductor module constituting the FETs 61 to 67.
In this embodiment, the reverse connection protection FET 67, FET (Su +) 61, and FET (Su−) 64 are configured as semiconductor chips, and the semiconductor chip is resin-molded to form one semiconductor module.

  Further, the FET (Sv +) 62 and the FET (Sv−) 65 are configured as a semiconductor chip, and the semiconductor chip is resin-molded to form one semiconductor module.

  Furthermore, the FET (Sw +) 63 and the FET (Sw−) 66 are configured as semiconductor chips, and the semiconductor chip is resin-molded to form one semiconductor module.

  That is, the inverter 60 in FIG. 2 is configured by three semiconductor modules. In this embodiment, a total of two sets of inverters 60 shown in FIG. 2 are provided, and the current flowing through the inverter 60 is reduced to half. Thus, since two sets of inverters 60 are provided, in this embodiment, six semiconductor modules and six capacitors are provided.

Next, the physical configuration of the drive device 1 according to the present embodiment will be described with reference to FIG. 1 and FIGS.
First, the configuration of the drive device 1 will be described with reference to FIG.
The drive device 1 includes a cylindrical motor case 101, a frame end 102 screwed to the output side of the motor case 101, and a bottomed cylindrical cover 103 that covers an electronic circuit portion. Yes.

  Here, the motor 30 includes a motor case 101, a stator 201 disposed radially inward of the motor case 101, a rotor 301 disposed radially inward of the stator 201, and a shaft 401 that rotates together with the rotor 301. doing.

The motor case 101 forms an outline of the motor 30 and includes a cylindrical portion 109, a partition wall 107, and a heat sink 601. The cylindrical portion 109 is formed in a cylindrical shape that extends in the center line direction of the shaft 401. The partition wall 107 is provided so as to extend radially inward from the end portion of the cylindrical portion 109. The heat sink 601 is provided so as to extend from the partition wall 107 in the center line direction of the shaft 401. Here, the heat sink 601 constitutes a “heat dissipating part”.
In the drive device 1, an “operating area” where operating members such as the rotor 301 are arranged and a “control area” where motor control parts such as electronic circuits are arranged are separated by a partition wall 107. Yes.

  The stator 201 has twelve salient poles 202 that protrude in the radial inner direction of the motor case 101. The salient poles 202 are provided at predetermined intervals in the circumferential direction of the motor case 101. The salient pole 202 has a laminated iron core 203 formed by laminating thin plates of magnetic material, and an insulator 204 fitted to the outside of the laminated iron core 203 in the axial direction. A coil wire 205 as a winding is wound around the insulator 204. The coil wire 205 constitutes a U-phase, V-phase, and W-phase three-phase winding. Further, lead wires 206 for supplying current to the coil wire 205 are drawn out from six locations of the coil wire 205, and are drawn out to the electronic circuit side from six holes provided at the axial ends of the motor case 101. It is.

  The rotor 301 is formed in a cylindrical shape from a magnetic material such as iron. The rotor 301 includes a rotor core 302 and a permanent magnet 303 provided on the outer side in the radial direction of the rotor core 302. The permanent magnet 303 has N poles and S poles alternately in the circumferential direction.

  The shaft 401 is fixed to a shaft hole 304 formed at the center of the rotor core 302. The shaft 401 is rotatably supported by a bearing 104 provided in the partition wall 107 of the motor case 101 and a bearing 105 provided in the frame end 102. Thereby, the shaft 401 can rotate with the rotor 301 with respect to the stator 201.

  Furthermore, the shaft 401 extends to the electronic circuit side, and a magnet 402 for detecting the rotational position is provided at the tip of the electronic circuit side. A resin printed board 801 is disposed near the tip of the shaft 401 on the electronic circuit side. The printed circuit board 801 has a position sensor 73 (not shown in FIG. 1) at the center thereof. Thereby, the rotational position of the magnet 402, that is, the rotational position of the shaft 401 is detected by the position sensor 73.

Next, the physical configuration of the electronic circuit will be described with reference to FIGS. 3 to 6, the cover 103 and the printed board 801 shown in FIG. 1 are omitted.
Here, the configuration of the power unit 50 will be described first, and then the configuration of the control unit 70 will be described.

  As described above, the seven FETs 61 to 67 configuring the inverter 60 of the power unit 50 are configured as three semiconductor modules. And since the drive device 1 of this form is provided with two sets of inverters 60, it is as having already mentioned that it is provided with six semiconductor modules.

  That is, as shown in FIG. 3, the driving device 1 includes six semiconductor modules 501, 502, 503, 504, 505, and 506. When these semiconductor modules 501 to 506 are distinguished, the symbols in FIG. 3 are used to describe the U1 semiconductor module 501, the V1 semiconductor module 502, the W1 semiconductor module 503, the U2 semiconductor module 504, the V2 semiconductor module 505, and the W2 semiconductor module 506. I decided to.

  Referring to the correspondence relationship with FIG. 2, the U1 semiconductor module 501 includes FETs 61 and 64 corresponding to the U phase and a reverse connection protection FET 67. Further, the V1 semiconductor module 502 includes FETs 62 and 65 corresponding to the V phase. Furthermore, the W1 semiconductor module has FETs 63 and 66 corresponding to the W phase. Similarly, the U2 semiconductor module 504 has FETs 61 and 64 corresponding to the U phase and the FET 67 for reverse connection protection, the V2 semiconductor module 505 has FETs 62 and 65 corresponding to the V phase, and the W2 semiconductor module 506 has the W phase. FETs 63 and 66 corresponding to. That is, one set of inverters 60 is configured by the three semiconductor modules 501-503 of U1, V1, and W1, and another set of inverters 60 is configured by the three semiconductor modules 504-506 of U2, V2, and W2. ing.

  The three semiconductor modules 501 to 503 U1 to W1 and the three semiconductor modules 504 to 506 U2 to W2 constituting the inverter 60 are connected by a bus bar 507 to form a module unit. The bus bar 507 serves as a power supply line as well as a connection function. That is, electric power is supplied to the semiconductor modules 501 to 506 via the bus bar 507.

  3 to 6 show the assembly structure of the semiconductor modules 501 to 506 and the like, and the power supply structure is not shown. In this respect, a connector is actually attached to the cover 103, and power is supplied to the bus bar 507 via the connector.

Next, the arrangement of the semiconductor modules 501 to 506 will be described.
The semiconductor modules 501 to 506 are attached to the heat sink 601.

  As shown in FIGS. 3 and 6, the heat sink 601 has a substantially cylindrical space formed inside. The substantially cylindrical space communicates with the internal space of the motor case 101. The shaft 401 is located at the approximate center of the substantially cylindrical space. That is, the heat sink 601 can be said to be a thick cylindrical shape, and has a side wall portion 602 around the center line of the shaft 401. The side wall portion 602 is provided with two notches 603 and 604 that constitute a discontinuous portion.

  Further, the side wall portion 602 of the heat sink 601 has a side wall surface 605 that faces in a radially outward direction. A total of six side wall surfaces 605 are formed in the circumferential direction.

  With respect to the heat sink 601 formed as described above, the semiconductor modules 501 to 506 are arranged one by one on the side wall surface 605 facing the radially outward direction. The semiconductor modules 501 to 506 have a plate-like rectangular parallelepiped shape extending in the direction of the chip surface of the molded semiconductor chip 511, and are arranged so that a surface having a relatively large area contacts the side wall surface 605.

  The semiconductor modules 501 to 506 are arranged on the side wall surface 605 of the heat sink 601 as described above, so that the perpendicular of the chip surface of the semiconductor chip 511 is just perpendicular to the center line of the shaft 401. That is, in this embodiment, the semiconductor modules 501 to 506 are arranged vertically.

  The semiconductor modules 501 to 506 have a winding terminal 508 at the end on the partition wall 107 side (see FIG. 3 and the like). As described above, the lead-out line 206 for supplying current to the coil wire 205 is led out from the six holes provided in the axial end of the motor case 101 to the electronic circuit side. The modules 501 to 506 are electrically connected so as to be sandwiched between the winding terminals 508.

  In addition, the semiconductor modules 501 to 506 have a plurality of control terminals 509 and two capacitor terminals 510 at the end on the side opposite to the partition wall 107. The control terminal 509 is soldered to a predetermined location on the printed circuit board 801 (see FIG. 1) as will be described later. As a result, the semiconductor modules 501 to 506 are electrically connected to the control unit 70 (see FIG. 2). On the other hand, the capacitor terminal 510 is connected to the power supply line and the ground inside the semiconductor modules 501 to 506, respectively. Each capacitor terminal 510 is bent inwardly of the motor case 101.

  As shown in FIG. 3 and the like, six capacitors 701, 702, 703, 704, 705 and 706 are arranged on the same side as the heat sink 601 with respect to the semiconductor modules 501 to 506. In order to distinguish these capacitors 701 to 706, they are described as U1 capacitor 701, V1 capacitor 702, W1 capacitor 703, U2 capacitor 704, V2 capacitor 705, and W2 capacitor 706 using the symbols in FIG.

  Referring to the correspondence relationship with FIG. 2, the U1 capacitor 701 corresponds to the capacitor 54. A V1 capacitor 702 corresponds to the capacitor 55. Furthermore, the W1 capacitor 703 corresponds to the capacitor 56. Similarly, the U2 capacitor 704 corresponds to the capacitor 54, the V2 capacitor 705 corresponds to the capacitor 55, and the W2 capacitor 706 corresponds to the capacitor 56.

  A holder 606 is disposed inside the heat sink 601 in the radial direction. The holder 606 is formed in a substantially cylindrical shape and has a flange 607 at one end (see FIG. 6). The outer diameter of the holder 606 is slightly smaller than the inner diameter of the heat sink 601. The holder 606 is disposed in a space on the radially inner side of the heat sink 601 so that the flange portion 607 contacts the wall surface of the heat sink 601 on the side opposite to the frame end 102 (see FIG. 5). Six accommodating portions 608 are formed inside the holder 606 in the radial direction.

  The capacitors 701 to 706 are accommodated in the accommodating portion 608 of the holder 606, and are disposed one by one with respect to the semiconductor modules 501 to 506 on the shaft 401 side of the semiconductor modules 501 to 506. The capacitors 701 to 706 have a columnar shape, and are arranged so that the axis thereof is substantially parallel to the center line of the shaft 401. In addition, since the capacitor terminals 510 included in the semiconductor modules 501 to 506 are bent inwardly, the terminals of the capacitors 701 to 706 are directly connected to the bent capacitor terminals 510. Yes.

  As shown in FIG. 6, the choke coil 52 is accommodated on the inner side of the holder 606 in the radial direction on the side of the ridge portion 607 of the capacitors 701 to 706. The choke coil 52 is formed by winding a coil wire around a donut-shaped iron core, and the coil end passes through one notch portion 603 of the heat sink 601 and is drawn out in the radially outward direction. In addition, as described above, the shaft 401 extends toward the electronic circuit, but the choke coil 52 is accommodated in the holder 606 with the shaft 401 penetrating.

  In addition, although the coil end of the choke coil 52 is connected so as to be interposed in the power supply line (see FIG. 2), the power supply structure is not shown in FIGS.

  Next, the control unit 70 will be described. The control unit 70 is formed on the printed circuit board 801 shown in FIG. That is, a wiring pattern is formed on the printed circuit board 801 by etching or the like, and an electronic component such as an IC constituting the control unit 70 is mounted thereon (not shown in FIG. 1). A printed circuit board 801 on which electronic components are mounted has a plurality of columns 106 extending from the motor case 101 so that the control terminals 509 of the semiconductor modules 501 to 506 are inserted into terminal holes formed at predetermined positions. It is screwed. The control terminals 509 of the semiconductor modules 501 to 506 are soldered to the wiring pattern of the printed board 801.

  In the drive device 1 of this embodiment, the semiconductor modules 501 to 506 are arranged in the center line direction of the shaft 401. Thereby, the physique of radial direction can be made small. In addition, the choke coil 52 and the six capacitors 701 to 706 are arranged side by side in the radial direction by making the semiconductor modules 501 to 506 vertically arranged and using the space secured by this. That is, the capacitors 701 to 706 are arranged in the radial direction of the six semiconductor modules 501 to 506. Thereby, especially the physique of the radial direction of the drive device 1 can be made as small as possible.

  By the way, in the above-described drive device 1, for each of the semiconductor modules 501 to 506, the step of connecting the winding terminal 508 and the lead wire 206 of the coil wire 205, the capacitor terminal 510 and the terminals of the capacitors 701 to 706 are provided. A complicated assembly operation including a connecting step, a step of inserting the control terminal 509 through the terminal hole of the printed circuit board 801 and soldering to the wiring pattern is performed. Therefore, it is preferable that the semiconductor modules 501 to 506 are arranged after “positioning” with respect to the motor case 101 in advance.

Therefore, in the following, a configuration for arranging the semiconductor modules 501 to 506 in the motor case 101, which is a characteristic part of the present embodiment, and its effect will be described in detail based on FIG.
Since the semiconductor modules 501 to 506 have the same configuration, only the semiconductor module 501 will be described. In FIG. 7, only the semiconductor module 501 is shown, and the winding terminal 508, the control terminal 509, and the capacitor terminal 510 are not shown.

  First, the motor case 101 will be described. As described above, the motor case 101 is provided with the heat sink 601 extending from the partition wall 107 in the direction of the center line of the shaft 401 (not shown in FIG. 7). The wall surface 108 adjacent to the side wall surface 605 of the heat sink 601 is formed to extend in the radial direction of the motor case 101 (see FIG. 6 and the like). The side wall surface 605 is formed to intersect the wall surface 108 at a substantially right angle. The side wall surface 605 is a flat surface.

  That is, as shown in FIG. 7, when the wall surface 108 is a wall surface on the xy plane in the xyz coordinate space, the side wall surface 605 is formed so as to rise from the wall surface 108 in the z-axis direction. That is, the side wall surface 605 is a wall surface on the yz plane. In this embodiment, the shaft 401 of the motor 30 is provided so that the center line thereof is substantially parallel to the z axis. That is, the side wall surface 605 is formed to be substantially parallel to the center line of the shaft 401.

  An engaging portion 110 is formed on the wall surface 108 of the motor case 101. In this embodiment, the engaging part 110 has a first engaging part 111 and a second engaging part 112, and is formed as a convex part that covers the outline of the semiconductor module 501.

  Next, the semiconductor module 501 will be described. The semiconductor module 501 is covered with a resin sealing body 512 so that a part of the semiconductor chip 511 (not shown in FIG. 7, refer to FIG. 1) is exposed. The sealing body 512 is formed in a flat rectangular parallelepiped shape. The sealing body 512 has six surfaces including a heat radiation surface 513, a front surface 514, a lower surface 516, an upper surface 515, a right side surface 517, and a left side surface 518. Here, the heat radiation surface 513 is one of the surfaces having the largest area among the six surfaces of the sealing body 512. The heat radiation surface 513 is formed to be substantially parallel to the chip surface of the semiconductor chip 511.

  The semiconductor module 501 has an engaged portion 519 having a shape corresponding to the engaging portion 110 formed in the motor case 101. In this embodiment, the outer shell itself of the semiconductor module 501 is the engaged portion 519.

  According to such a configuration, when the semiconductor module 501 is disposed in the motor case 101, the engaging portion 110 and the engaged portion 519 are engaged, so that the semiconductor module 501 is positioned at a predetermined position of the motor case 101. The

  Since a part of the semiconductor chip 511 is exposed from the sealing body 512, the semiconductor module 501 is formed on the side wall surface 605 via an insulating heat radiation sheet 520 between the heat radiation surface 513 and the side wall surface 605. They are in contact (see FIG. 6).

  Hereinafter, in the driving device 1 according to the present embodiment, effects obtained by providing the engaging portion 110 in the motor case 101 and providing the engaged portions 519 in the semiconductor modules 501 to 506 will be described. For ease of explanation, the direction from the heat radiation surface 513 of the sealing body 512 to the front surface 514 will be referred to as the “front surface” direction, and the direction from the front surface 514 of the sealing body 512 to the heat radiation surface 513 will be referred to as “heat radiation surface”. The direction from the left side 518 to the right side 517 of the sealing body 512 is the “right side” direction, and the direction from the right side 517 to the left side 518 of the sealing body 512 is the “left side” direction. .

(1) In the driving device 1 of this embodiment, the engaging portion 110 is formed in the motor case 101, and the engaged portion 519 corresponding to the engaging portion 110 is formed in the semiconductor modules 501 to 506. Here, the engaging portion 110 and the engaged portion 519 are formed so that the semiconductor modules 501 to 506 can be positioned with respect to the motor case 101 when the engaging portion 110 and the engaged portion 519 are engaged. .

  Thus, in this embodiment, the semiconductor module 501 is engaged with the engaging portion 110 and the engaged portion 519 so that the “front” direction and the “heat radiating surface” direction (x-axis direction) with respect to the motor case 101 The positional deviation in the “plane” direction and the “left side” direction (y-axis direction) is restricted (see FIG. 7). Since the semiconductor modules 501 to 506 can be positioned without using a jig or the like for supporting the semiconductor modules 501 to 506, the assembly process of the drive device 1 can be saved and the manufacturing cost can be reduced as a result. Is done.

  (2) Further, in the driving device 1 of this embodiment, the semiconductor module 501 is provided by providing the motor case 101 with the side wall surface 605 extending from the motor case 101 and engaging the engaging portion 110 and the engaged portion 519. It arrange | positioned so that the thermal radiation surface 513 of -506 may contact | abut to the side wall surface 605. FIG. Thereby, the position shift to the side wall surface 605 side of the semiconductor modules 501 to 506 with respect to the motor case is restricted.

  (3) Furthermore, in the driving device 1 of the present embodiment, the heat radiation surface 513 of the semiconductor module 501 is formed in a plane in accordance with the side wall surface 605 constituted by a plane, and the heat radiation surface 513 is in contact with the side wall surface 605. Semiconductor modules 501 to 506 were arranged. Thereby, the heat generated by the semiconductor modules 501 to 506 is released via the side wall surface 605. As a result, it is possible to suppress the temperature of the semiconductor chip 511 from rising above the allowable temperature.

  (4) Moreover, in the drive device 1 of the present embodiment, the area of the heat radiation surface 513 of the semiconductor modules 501 to 506 is formed to be the largest as compared with other surfaces. Accordingly, since a large contact area between the semiconductor modules 501 to 506 and the side wall surface 605 can be ensured, the heat radiation effect of the semiconductor modules 501 to 506 can be promoted.

(Second Embodiment)
A driving apparatus according to a second embodiment of the present invention will be described with reference to FIG. In this embodiment, the shapes of the engaging portion formed in the motor case and the engaged portion formed in the semiconductor module are different from those in the first embodiment.

In this embodiment, the engaged portion 523 is provided on the lower surface of the semiconductor module 521 and is formed as a groove-like recess extending from the front surface of the semiconductor module toward the heat dissipation surface. Although the groove-like recess may or may not reach the heat dissipation surface from the front surface of the semiconductor module, in this embodiment, the engaged portion 523 as the groove-like recess reaches the heat dissipation surface from the front surface. An engaging portion 121 is provided on the wall surface 108 of the motor case 101 as a convex portion extending from the side wall surface 605 in the front direction. The engaging part 121 is formed to correspond to the engaged part 523.
Thereby, in this embodiment, the engagement of the engaging portion 121 and the engaged portion 523 causes the semiconductor module 521 to be prevented from being displaced in the “right side” and “left side” directions with respect to the motor case 101. Is done.

(Third embodiment)
A driving apparatus according to a third embodiment of the present invention will be described with reference to FIG. This embodiment is different from the second embodiment in that a plurality of engaging portions formed in the motor case and engaged portions formed in the semiconductor module are provided.

In this embodiment, two engaged portions 533 and 534 are provided on the lower surface of the semiconductor module 531. The engaged portion 533 is provided on the “left side” side from the center of the semiconductor module 531, and the engaged portion 534 is provided on the “right side” side from the center of the semiconductor module 531. Engagement portions 131 and 132 are provided on the wall surface 108 of the motor case 101 as convex portions extending from the side wall surface 605 in the front surface direction. The engaging portions 131 and 132 are formed so as to correspond to the engaged portions 533 and 534.
Thereby, in this form, when the engaging parts 131 and 132 and the to-be-engaged parts 533 and 534 engage, the position shift to the direction similar to 2nd Embodiment is controlled effectively.

(Fourth embodiment)
A driving apparatus according to a third embodiment of the present invention will be described with reference to FIG. In this embodiment, the shapes of the engaging portion formed in the motor case and the engaged portion formed in the semiconductor module are different from those in the third embodiment.

In this embodiment, two engaged portions 543 and 544 are provided on the lower surface of the semiconductor module 541. The engaged portion 543 is formed in a shape in which an angle formed by the lower surface and the left side surface of the semiconductor module 541 is cut out. Similarly, the engaged portion 544 is formed in a shape in which an angle formed by the lower surface and the right side surface of the semiconductor module 541 is cut out. Engaging portions 141 and 142 are provided on the wall surface 108 of the motor case 101 as convex portions extending from the side wall surface 605 in the front surface direction. The engaging portions 141 and 142 are formed so as to correspond to the engaged portions 543 and 544.
As a result, in this embodiment, the engaging portions 141 and 142 and the engaged portions 543 and 544 engage with each other, so that the same effect as in the third embodiment can be obtained.

(Fifth embodiment)
A driving apparatus according to a fifth embodiment of the present invention will be described with reference to FIG. In this embodiment, the shapes of the engaging portion formed on the motor case and the engaged portion formed on the semiconductor module are different from those of the second embodiment.

  In this embodiment, the engaged portion 553 is provided as a groove-like recess provided on the lower surface of the semiconductor module 551 and extending from the front surface of the semiconductor module toward the heat dissipation surface. In this embodiment, the engaged portion 553 as the groove-like recess does not reach the heat radiating surface from the front surface. The wall surface 108 of the motor case 101 is provided with an engaging portion 151 as a convex portion that is separated from the side wall surface 605 and extends in the front direction. That is, a gap is formed between the engaging portion 151 and the side wall surface 605. The engaging portion 151 is formed in a shape corresponding to the engaged portion 553.

  Thereby, in this embodiment, the semiconductor module 551 is disposed so as to fit into the gap between the engaging portion 151 and the side wall surface 605 when the engaging portion 151 and the engaged portion 553 are engaged. For this reason, the semiconductor module 551 is further restrained from being displaced in the “right side” and “left side” directions with respect to the motor case 101 in the same manner as in the second embodiment, and further in the “front” direction and “ The positional deviation in the “radiating surface” direction is restricted.

(Sixth embodiment)
A driving apparatus according to a sixth embodiment of the present invention will be described with reference to FIG. This embodiment is different from the fifth embodiment in that a plurality of engaging portions formed on the motor case and engaged portions formed on the semiconductor module are provided.

In this embodiment, two engaged portions 563 and 564 are provided on the lower surface of the semiconductor module 561. The engaged portion 563 is provided on the “left side surface” of the semiconductor module 561, and the engaged portion 534 is provided on the “right side surface” of the semiconductor module 561. The motor case 101 is provided with engaging portions 161 and 162 corresponding to the engaged portions 563 and 564.
Thereby, in this form, when the engaging parts 161 and 162 and the to-be-engaged parts 563 and 564 engage, the position shift to the direction similar to the said 5th Embodiment is controlled effectively.

( First Reference Example )
A driving apparatus according to a first reference example of the present invention will be described with reference to FIG. In this reference example , the shapes of the engaging portion formed on the motor case and the engaged portion formed on the semiconductor module are different from those of the second embodiment.
In this reference example , the engaged portion 573 is formed as a communication hole that reaches the heat radiation surface from the front surface of the semiconductor module 571. In this reference example , the communication hole has an oblong cross section. The motor case 101 is formed with an engaging portion 171 as a convex portion extending from the side wall surface 605 in the front surface direction. The engaging portion 171 is formed to correspond to the engaged portion 573.

As a result, in this reference example , the engagement portion 171 and the engaged portion 573 are engaged with each other, whereby the positions in the “right side” direction, the “left side” direction, the “upper surface” direction, and the “lower surface” direction. Deviation can be regulated. Further, in this reference example , the engaged portion formed as the communication hole is formed in an oval shape. Therefore, in addition to the restriction of the positional deviation in the above direction, the semiconductor module around the axis of the engaging portion 171 It can control that 571 rotates.

( Second reference example )
A driving apparatus according to a second reference example of the present invention will be described with reference to FIG. In this reference example , the shape and number of the engaging portions formed in the motor case and the engaged portions formed in the semiconductor module are different from those in the first reference example .
In this reference example , the engaged portions 583 and 584 are formed as communication holes that reach the heat radiation surface from the front surface of the semiconductor module 571. The engaged portion 583 is provided on the “left side” side from the center of the semiconductor module 581, and the engaged portion 584 is provided on the “right side” side from the center of the semiconductor module 581. In this reference example , the communication hole has a substantially circular cross section. The motor case 101 is formed with engaging portions 181 and 182 as convex portions extending from the side wall surface 605 in the front direction. The engaging portions 181 and 182 are formed to correspond to the engaged portions 583 and 584.

By the way, when the semiconductor module has only one communication hole having a substantially circular cross section, there is a concern that the semiconductor module rotates around the axis of the engaging portion.
However, in this reference example , the semiconductor module 581 has a plurality of engaged portions which are communication holes having a substantially circular cross section as described above. Accordingly, in this reference example , the engagement of the engaging portions 181 and 182 and the engaged portions 583 and 584 prevents the semiconductor module 581 from rotating around the axis of the engaging portions 181 and 182. The same effect as the first reference example is achieved.

( Third reference example )
A driving apparatus according to a third reference example of the present invention will be described with reference to FIG. In this reference example , the shape of the engaging portion formed on the motor case is different from that of the first reference example .
In this reference example , the engaged portion 593 is formed as a communication hole that reaches the heat radiation surface from the front surface of the semiconductor module 591. The engaging portion 191 includes a screw hole 193 provided in the side wall surface 605 and a screw 192 that fits into the hole portion 193.

According to this, since the screw 192 can be inserted into the communication hole which is the engaged portion 593 of the semiconductor module 591 and the screw 192 can be fitted into the screw hole 193 provided in the side wall surface 605, the semiconductor module 591 can be connected to the motor. It can be fixed to the case 101. Therefore, in this reference example , the positional deviation is reliably regulated.

( Seventh embodiment)
The drive device by 7th Embodiment of this invention is demonstrated based on FIG. In this embodiment, the shapes of the engaging portion formed in the motor case and the engaged portion formed in the semiconductor module are different from those in the fifth embodiment.

In this embodiment, the engaged portion 903 includes a groove-shaped recess 904 provided on the front surface of the semiconductor module 901 and extending from the left side surface of the semiconductor module 901 to the right side surface, and a pressing member 905. The pressing member 905 is a leaf spring, and has a first bending portion 907 and a second bending portion 906.
On the other hand, on the wall surface 108 of the motor case 101, an engaging portion 1001 is provided as a convex portion that is separated from the side wall surface 605 and extends in the front direction. That is, there is a gap between the engaging portion 1001 and the side wall surface 605. The engaging portion 1001 has a concave portion 1002 corresponding to the second curved portion 906 of the pressing member 905.

According to this, when the semiconductor module 901 is disposed in the motor case 101, the semiconductor module 901 is first disposed in the gap between the engaging portion 1001 and the side wall surface 605. Next, the pressing member 905 is fitted between the semiconductor module 901 and the engaging portion 1001. At this time, the pressing member 905 abuts the second curved portion 906 on the concave portion 1002 and presses the groove-shaped concave portion 904 in the “heat radiating surface” direction by the first curved portion 907.
Therefore, in this embodiment, the engagement portion 1001 and the engaged portion 903 are engaged, whereby the semiconductor module 901 is in the “front surface” direction, the “heat radiation surface” direction, and the “upper surface” direction with respect to the motor case 101. , Positional deviations in the “lower surface” direction, the “left side surface” direction, and the “right side surface” direction are restricted.

( Eighth embodiment)
A driving apparatus according to an eighth embodiment of the present invention will be described with reference to FIG. In the present embodiment, the engaging portion formed on the motor case and the engaged portion formed on the semiconductor module are formed in a shape opposite to that of the second embodiment.
That is, in this embodiment, the engaged portion 913 is provided as a convex portion on the lower surface of the semiconductor module 911, and the engaging portion 1011 is provided as a groove-like concave portion on the wall surface 108 of the motor case 101.
Thereby, also in this form, the same effect as a 2nd embodiment is produced.

(Other embodiments)
In the second to seventh embodiments described above, the engaging portion formed in the motor case is formed as a convex portion, and the engaged portion formed in the semiconductor module is formed as a concave portion. On the other hand, in the above-described eighth embodiment, the convex portion and the concave portion of the second embodiment are formed in reverse, the engaging portion formed in the motor case is the concave portion, and the engaged portion formed in the semiconductor module is the convex portion. Formed as. Thus, in other embodiment of this invention, the relationship between a convex part and a recessed part can be reversely comprised also about 2nd- 7th embodiment. Also by this, the same effect as each above-mentioned embodiment is produced.

Moreover, in other embodiment of this invention, the pressing member which presses the thermal radiation surface of a semiconductor module against the side wall surface of a motor can be further provided.
Furthermore, in the other embodiments of the present invention, any configuration of each of the above-described embodiments can be combined as long as there are no structural obstruction factors.

  Furthermore, in the above-described embodiment, the semiconductor chip in the semiconductor module is exposed on the heat radiating surface of the sealing body, and the heat radiating surface of the semiconductor module contacts the side wall surface of the heat sink with an insulating heat radiating sheet interposed therebetween. It was. In another embodiment of the present invention, in the semiconductor module, for example, a metal plate for heat dissipation of the semiconductor chip may be exposed on the heat dissipation surface of the sealing body. Alternatively, the semiconductor module may cover the entire semiconductor chip so as to be wrapped with a sealing body. In any case, the heat dissipation surface of the semiconductor module is brought into contact with the side wall surface of the heat sink, thereby promoting the release of heat from the semiconductor chip.

  In another embodiment of the present invention, the heat sink may not be provided extending in the motor axial direction. That is, the side wall surface of the heat sink may be formed so as to be inclined with respect to the motor shaft or perpendicular to the motor shaft. Further, the angle formed between the side wall surface of the heat sink and the wall surface of the motor case which is the wall surface facing the lower surface of the semiconductor module may not be a right angle.

  Furthermore, as another embodiment of the present invention, a configuration without a heat sink can be considered. In the present invention, the semiconductor module can be “positioned” with respect to the motor case by engaging the engaging portion of the motor case and the engaged portion of the semiconductor module without providing a heat sink.

  Further, in the above-described embodiment, the example in which the semiconductor module is vertically arranged so that the perpendicular of the chip surface of the semiconductor chip is perpendicular to the motor axis is shown. In another embodiment of the present invention, the semiconductor module is not arranged vertically, but may be arranged obliquely such that the perpendicular is inclined with respect to the motor axis, or laterally arranged such that the perpendicular is parallel to the motor axis. Good. The semiconductor module is not limited to the configuration in which the semiconductor module is disposed in the motor axial direction of the motor case as in each of the above-described embodiments, and a configuration in which the semiconductor module is disposed on the radially outer side of the motor case may be considered. Also, a single semiconductor module may be provided for the motor instead of a plurality.

Although the above embodiment has been described by way of example when applied to EPS, it can of course be applied to other fields.
Thus, the present invention is not limited to the above-described embodiment, and can be implemented in various forms without departing from the gist thereof.

  1: driving device, 30: motor, 101: motor case, 110, 121, 131, 132, 141, 142, 151, 161, 162, 171, 181, 182, 191, 1001, 1011: engaging portion, 201: Stator, 301: Rotor, 401: Shaft, 501, 502, 503, 504, 505, 506, 521, 531, 541, 551, 561, 571, 581, 591, 901, 911: Semiconductor module, 511: Semiconductor chip, 512, 522, 532, 542, 552, 562, 572, 582, 592, 902, 912: Sealing body 519, 523, 533, 534, 543, 544, 553, 563, 564, 573, 583, 584, 593, 903, 913: engaged portion

Claims (21)

A drive device comprising: a motor that is rotationally driven by passing a current; and an electronic circuit having a semiconductor module for controlling the current that flows to the motor,
The motor is
A motor case having a cylindrical portion and a partition wall provided extending radially inward from the end portion of the cylindrical portion;
A stator around which windings are wound so as to constitute a plurality of phases arranged radially inside the cylindrical portion;
A rotor disposed radially inward of the stator;
A shaft that rotates with the rotor;
An engagement portion formed integrally with the motor case from the same material as the motor case ,
The semiconductor module is
A semiconductor chip for switching the winding current flowing in the windings of the plurality of phases;
A sealing body covering the semiconductor chip;
The sealing body and integrally formed, have a, and engaged portions for positioning with respect to the motor case by engaging with the engaging portion of the same material as the sealing body,
The motor case has a heat radiating portion provided extending from the partition wall in the direction of the center line of the shaft,
The semiconductor module has a heat radiating surface facing the chip surface of the semiconductor chip in the sealing body, and the heat radiating surface becomes the heat radiating portion by engaging the engaging portion and the engaged portion. It is arranged so that it can contact,
The driving device according to claim 1, wherein the engaging portion is formed so as to protrude or dent from a wall surface extending perpendicularly to the heat radiating portion . The drive device according to claim 1 , wherein the semiconductor module is formed such that an area of the heat radiating surface is the largest as compared with other surfaces. The sealing body is formed in a substantially rectangular parallelepiped shape, and is one of a front surface that is substantially parallel to the chip surface and faces the heat dissipation surface, and a surface that is substantially perpendicular to the heat dissipation surface and the front surface. A lower surface, an upper surface which is a surface facing the lower surface, a right side which is one of the surfaces substantially perpendicular to the heat radiation surface, the front surface, the lower surface and the upper surface, and a left side which is opposed to the right side drive device according to claim 1 or 2, characterized in that it has a surface, a. The drive device according to any one of claims 1 to 3 , wherein the engaged portion is the sealing body itself formed in a substantially rectangular parallelepiped shape of the semiconductor module. The engaged portion, the provided on the lower surface of the semiconductor module, the driving device according to claim 3 or 4, characterized in that from the front of the semiconductor module is a groove-shaped recess extending in the radiating surfaces. The engaged portion, the provided on the front surface of the semiconductor module, according to any one of claims 3-5, characterized in that from said lower surface of said semiconductor module is a groove-like recess extending into said upper surface Drive device. The said engaged part is a groove-shaped recessed part provided in the said front surface of the said semiconductor module, and extended from the said left side surface of the said semiconductor module to the said right side surface, The any one of Claims 3-6 characterized by the above-mentioned. The drive device described in 1. A plurality of the engaged portions are provided on at least one surface of the sealing body,
The engaging portion is in the motor case, the driving device according to any one of claims 1 to 7, characterized in that it is provided with a plurality to correspond to the engaged portion. 2. The semiconductor module according to claim 1, wherein a vertical line of the chip surface of the semiconductor chip is vertically arranged on the side opposite to the rotor of the partition of the motor case so as not to be parallel to the center line of the shaft. drive device according to any one of 1-8. The drive device according to claim 9 , wherein the semiconductor module is arranged such that the perpendicular is perpendicular to a center line of the shaft. The drive device according to any one of claims 1 to 10 , further comprising a pressing member that presses the heat dissipation surface of the semiconductor module against the heat dissipation portion. A motor case having a cylindrical portion and a partition wall provided extending radially inward from an end portion of the cylindrical portion; a stator on which windings are wound so as to form a plurality of phases disposed radially inward of the motor case; A motor having a rotor disposed radially inside the stator, a shaft that rotates together with the rotor, and an engaging portion that is formed integrally with the motor case by the same material as the motor case. A semiconductor module for controlling a current supplied to the motor,
A semiconductor chip for switching the winding current flowing in the windings of the plurality of phases;
A sealing body covering the semiconductor chip;
The sealing body and integrally formed, have a, and engaged portions for positioning with respect to the motor case by engaging with the engaging portion of the same material as the sealing body,
The motor case has a heat radiating portion provided extending from the partition wall in the direction of the center line of the shaft,
The sealing body has a heat dissipating surface facing the chip surface of the semiconductor chip, and the heat dissipating surface is arranged to be able to contact the heat dissipating part by engaging the engaging part and the engaged part. And
The said engaging part is formed so that it may protrude from the wall surface extended perpendicularly | vertically with respect to the said thermal radiation part, or it may be dented . 13. The semiconductor module according to claim 12 , wherein the area of the heat radiating surface is formed to be the largest as compared with other surfaces. The sealing body is formed in a substantially rectangular parallelepiped shape, and is one of a front surface that is substantially parallel to the chip surface and faces the heat dissipation surface, and a surface that is substantially perpendicular to the heat dissipation surface and the front surface. A lower surface, an upper surface which is a surface facing the lower surface, a right side which is one of the surfaces substantially perpendicular to the heat radiation surface, the front surface, the lower surface and the upper surface, and a left side which is opposed to the right side The semiconductor module according to claim 12 , wherein the semiconductor module has a surface. The semiconductor module according to claim 14 , wherein the engaged portion is a groove-shaped recess provided on the lower surface and extending from the front surface to the heat radiating surface. The engaged portion, the provided on the front, the semiconductor module according to claim 14 or 15, characterized in that from said lower surface is a groove-like recess extending into the top surface. The said engaged part is a groove-shaped recessed part provided in the said front surface of the said semiconductor module, and extended from the said left side surface of the said semiconductor module to the said right side surface, The any one of Claims 14-16 characterized by the above-mentioned. The drive device described in 1. A plurality of the engaged portions are provided on at least one surface of the sealing body,
The semiconductor module according to any one of claims 12 to 17 , wherein a plurality of the engaging portions are provided in the motor case so as to correspond to the engaged portions, respectively. The counter-rotor side of the partition wall of the motor case, any one of claims 12 to 18, the normal to the chip surface of the semiconductor chip, characterized in that it is vertically disposed so that the center line not parallel to the shaft The semiconductor module according to one item. The semiconductor module according to claim 19 , wherein the perpendicular is arranged to be perpendicular to a center line of the shaft. The semiconductor module according to any one of claims 12 to 20, further comprising a pressing member for pressing the heat radiating surface to the heat radiating portion.

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