JP2011009405A - Thermoelectric conversion module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermoelectric conversion module high in the heat dissipation of a supporting substrate.SOLUTION: The thermoelectric conversion module 9 includes the supporting substrate 1 formed of ceramic, a plurality of thermoelectric conversion elements 2 arranged on the supporting substrate 1 and a plurality of wiring conductors 3 formed on the supporting substrate 1 for electrically connecting the thermoelectric conversion elements 2 where metallic particles 10 dispersively exist in the supporting substrate 1. Thus, heat diffusion in the supporting substrate 1 is improved. Heat accumulated on an interface between the supporting substrate 1 and the wiring conductors 3 can be reduced. The softening of solder 6 for joining the thermoelectric conversion elements 2 with the wiring conductors 3 is inhibited, and the displacement of a position of the thermoelectric conversion elements 2 can be prevented.

Description

  The present invention relates to a thermoelectric conversion module, and more particularly to a thermoelectric conversion module having a support substrate made of ceramics.

  The thermoelectric conversion element utilizes the Peltier effect that when a current is passed through a pn junction pair consisting of a p-type semiconductor and an n-type semiconductor, one end of each semiconductor generates heat and the other end absorbs heat. The thermoelectric conversion module can be precisely controlled, small in size and simple in structure. It can be used for CFC-free cooling devices, photodetection elements, cooling devices for semiconductor manufacturing devices, laser diode temperature control devices, etc. Wide use is expected.

  Moreover, since the thermoelectric conversion element has a characteristic that current flows when there is a temperature difference between both ends, the thermoelectric conversion element is expected to be used for a power generation apparatus such as exhaust heat recovery power generation.

  For example, as shown in FIG. 4, the thermoelectric conversion module has wiring conductors 3 a and 3 b formed on the surfaces of support substrates 1 a and 1 b (hereinafter also referred to as support substrate 1), respectively, and p-type thermoelectric conversion. An element 2a and an n-type thermoelectric conversion element 2b (hereinafter also referred to as thermoelectric conversion element 2) are sandwiched between support substrates 1a and 1b, and both ends of the thermoelectric conversion element 2 are joined to wiring conductors 3a and 3b with solder 6, respectively. ing.

  These thermoelectric conversion elements 2 are connected by wiring conductors 3a and 3b so as to be electrically in series, and both ends thereof are connected to the external connection terminals 4, respectively. These external connection terminals 4 are connected to lead wires 5 by solder 6 so that electric power is supplied from the outside.

The thermoelectric conversion module for cooling used near room temperature is a thermoelectric conversion element made of an A ₂ B ₃ type crystal (A is Bi and / or Sb, B is Te and / or Se) from the viewpoint of excellent cooling characteristics. 2 is generally used.

The p-type thermoelectric conversion element 2a has a particularly excellent performance of a solid solution of Bi ₂ Te ₃ and Sb ₂ Te ₃ and the n-type thermoelectric conversion element 2b has a particularly excellent performance of a solid solution of Bi ₂ Te ₃ and Bi ₂ Se _3. Therefore, this A ₂ B ₃ type crystal (A is Bi and / or Sb, B is Te and / or Se) is widely used for the thermoelectric conversion element 2.

  In addition, copper is used for the wiring conductors 3a and 3b, and the solder joints with the thermoelectric conversion elements 2a and 2b are strengthened, so that the wettability between the thermoelectric conversion elements 2a and 2b and the solder 6 is improved. In order to prevent diffusion of components to the thermoelectric conversion element 2, electrodes 8 are formed by Ni plating or the like on the wiring conductors 3a, 3b side of the thermoelectric conversion elements 2a, 2b. Furthermore, a coating layer 7 is formed of Au or the like on the surface for the purpose of improving wettability with the solder 6.

  The support substrate 1 holds the structure of the thermoelectric conversion module and has a function of transferring heat. When the heat conduction is poor, not only the performance of the thermoelectric conversion module is deteriorated, but also the heat radiation side becomes high temperature, the solder 6 joining the thermoelectric conversion element 2 is softened, and the position of the thermoelectric conversion element 2 is shifted. There was a thing. Therefore, it has been proposed that the solder 6 that joins the heat conversion element 2 is made of a high melting point solder such as Au—Sn (for example, see Patent Document 1).

2004-31697

  In the conventional thermoelectric conversion module, Au—Sn solder is used as the solder 6 to which the heat conversion element 2 is joined. Therefore, the melting point of the solder 6 itself is high, and the shift of the thermoelectric conversion element 3 due to the melting of the solder 6 occurs. However, if the heat dissipation from the support substrate 1 is low, the Au-Sn solder may be softened and the position of the thermoelectric conversion element 3 may be displaced.

  An object of this invention is to provide the thermoelectric conversion module with high heat dissipation of a support substrate.

  The thermoelectric conversion module of the present invention includes a support substrate made of ceramics, a plurality of thermoelectric conversion elements arranged on the support substrate, and a plurality of wirings formed on the support substrate and electrically connecting the thermoelectric conversion elements. A thermoelectric conversion module including a conductor, wherein metal particles are dispersed in the support substrate.

  In the thermoelectric conversion module of the present invention, the presence of metal particles dispersed in the support substrate can improve the heat diffusibility in the support substrate and reduce heat accumulation at the interface between the support substrate and the wiring conductor. Thereby, softening of the solder which joins the thermoelectric conversion element and the wiring conductor can be suppressed, and the displacement of the thermoelectric conversion element can be suppressed.

  The thermoelectric conversion module of the present invention includes a support substrate made of ceramics, a plurality of thermoelectric conversion elements arranged on the support substrate, and a plurality of thermoelectric conversion elements formed on the support substrate and electrically connected between the thermoelectric conversion elements. A metal conductor dispersed in the surface layer on the thermoelectric conversion element side of the support substrate. In such a thermoelectric conversion module, the presence of metal particles on the surface layer of the support substrate on the thermoelectric conversion element side can efficiently diffuse the heat at the interface between the support substrate and the wiring conductor into the support substrate. In addition, it is possible to suppress a decrease in withstand voltage due to the metal particles being dispersed inside the support substrate.

  The thermoelectric conversion module of the present invention includes a support substrate made of ceramics, a plurality of thermoelectric conversion elements arranged on the support substrate, and a plurality of thermoelectric conversion elements formed on the support substrate and electrically connected between the thermoelectric conversion elements. The metal conductor is dispersed and present in a portion of the surface layer of the support substrate on the thermoelectric conversion element side where the wiring conductor is located.

  In such a thermoelectric conversion module, since the portion where the metal particles are dispersed is present on the surface layer of the support substrate in the portion where the wiring conductor is located, the heat once diffused to the support substrate is further transferred from the support substrate to the thermoelectric conversion element. Return to the side can be reduced, which can further reduce solder softening.

  The cooling device, temperature control device or power generation device of the present invention is characterized in that the thermoelectric conversion module is a cooling means, power generation means or temperature control means. In such a cooling device, a temperature control device, or a power generation device, heat is efficiently diffused to the support substrate, so that the displacement of the thermoelectric conversion element hardly occurs, and thus long-term reliability and durability can be improved.

  In the thermoelectric conversion module of the present invention, the presence of metal particles dispersed in the support substrate can improve the heat diffusibility in the support substrate and reduce heat accumulation at the interface between the support substrate and the wiring conductor. Thereby, softening of the solder which joins the thermoelectric conversion element and the wiring conductor can be suppressed, and the displacement of the thermoelectric conversion element can be suppressed. Therefore, a thermoelectric conversion module having excellent long-term reliability and durability can be provided.

1 shows an embodiment of a thermoelectric conversion module of the present invention, (a) is a perspective view in which a part of a support substrate is omitted, and (b) is a longitudinal sectional view showing a part of (a) in an enlarged manner. It is. The other form of the thermoelectric conversion module of this invention is shown, (a) is a longitudinal cross-sectional view which shows the state in which the metal particle is disperse | distributing only to the surface layer of a support substrate, (b) is the surface layer of a support substrate, It is a longitudinal cross-sectional view which shows the state by which the metal particle is disperse | distributing only to the part in which a wiring conductor is located. FIG. 4 shows still another embodiment of the thermoelectric conversion module according to the present invention, in which metal particles are dispersed only in a portion where the wiring conductor on the surface layer on the thermoelectric conversion element side of the support substrate is located and opposite to the thermoelectric conversion element of the support substrate. It is a longitudinal cross-sectional view which shows the state in which the metal particle is disperse | distributing to the surface layer of the side. The conventional thermoelectric conversion module is shown, (a) is the perspective view which abbreviate | omitted description of the one part of the support substrate, (b) is a longitudinal cross-sectional view which expands and shows a part of (a).

  An embodiment of the present invention will be described with reference to FIG. In addition, the same code | symbol as FIG. 4 was attached | subjected about the same member as the conventional thermoelectric conversion module shown in FIG.

  As shown in FIG. 1, the thermoelectric conversion module of the present invention has first and second wiring conductors 3a and 3b formed on the surfaces of a lower support substrate 1a and an upper support substrate 1b, respectively, and p-type thermoelectric conversion. An element 2a and an n-type thermoelectric conversion element 2b (hereinafter also referred to as thermoelectric conversion element 2 or thermoelectric conversion elements 2a and 2b) are disposed between support substrates 1a and 1b (hereinafter also referred to as support substrate 1). The thermoelectric conversion element 2 is sandwiched between the support substrates 1a and 1b. Both end surfaces of the thermoelectric conversion elements 2a and 2b are joined to the lower and upper first and second wiring conductors 3a and 3b (hereinafter also referred to as the wiring conductor 3) with solder 6.

  The support substrates 1a and 1b are made of one or more ceramics selected from alumina, aluminum nitride, silicon nitride, silicon carbide, and beryllia, and are composed of ceramic particles and grain boundaries between the ceramic particles. . Thereby, module intensity | strength and heat conduction which are required as a thermoelectric conversion module are securable.

  The wiring conductors 3a and 3b are for supplying electric power to the thermoelectric conversion element 2, and for example, at least one selected from Zn, Al, Au, Ag, W, Ti, Fe, Cu, Ni, Pt and Pd. A metal containing a seed element is preferable because it has low electrical resistance and high thermal conductivity, so that heat generation is suppressed and heat dissipation is excellent. In particular, at least one element selected from Cu, Ag, Al, Ni, Pt, and Pd is preferably used for the wiring conductors 3a and 3b from the viewpoint of electrical resistance, thermal conductivity, and cost.

  For the wiring conductors 3a and 3b, by appropriately adopting one or more methods selected from a plating method, a metallizing method, a DBC (Direct-bonding Copper) method, a chip bonding method, and a baking method, wiring pattern accuracy, current value and The optimal wiring conductor 3 can be manufactured according to the cost.

  In FIG. 1, the example in which the thermoelectric conversion elements 2 a and 2 b are individually joined to the wiring conductors 3 a and 3 b by the solder 6 has been described. However, in the present invention, a pair of thermoelectric conversion elements 2 a and 2 b are combined into one. Two solders 6 may be joined.

  The thermoelectric conversion element 2 includes two types, a p-type thermoelectric conversion element 2a and an n-type thermoelectric conversion element 2b, and is arranged vertically and horizontally on one main surface of the lower support substrate 1a. The p-type thermoelectric conversion element 2a and the n-type thermoelectric conversion element 2b are formed by the first and second wiring conductors 3a and 3b so as to be alternately and electrically in series with the p-type, n-type, p-type, and n-type. Connected to form one electric circuit.

The thermoelectric conversion element 2 is preferably a Bi-Te system that has the most excellent thermoelectric conversion performance near room temperature. Thereby, a good cooling effect can be obtained. such as _{Bi 0.4 Sb 1.6 Te 3, Bi} 0.5 Sb 1.5 Te 3 as p-type, _Bi 2 _Te 2.85 _Se 0.15 as _n-type, Bi ₂ Te 2.9 _{Se 0.1} Etc. are preferably used.

  On the side of the wiring conductors 3a and 3b of the thermoelectric conversion elements 2a and 2b, an electrode 8 made of Ni or the like having good wettability with the solder 6 and a coating layer 7 made of Au or the like are provided.

  External connection terminals 4 are connected to both ends of one electric circuit, and are electrically connected. Lead wires 5 are connected to these external connection terminals 4 by solder 6 so that electric power is supplied from the outside. Instead of the lead wire 5, a block-like or columnar conductor may be connected. Further, it is possible to supply power by bonding a wire directly to the external connection terminal 4 without joining the lead wire 5 or the block-like or columnar conductor.

  And in this invention, as shown in FIG.1 (b), the metal particle 10 is disperse | distributing to the support substrates 1a and 1b which consist of ceramics.

  That is, the support substrates 1a and 1b are composed of ceramic particles and grain boundaries, and the metal particles 10 are present at the grain boundaries, and the metal particles 10 are dispersed in the support substrates 1a and 1b. The average particle diameter of the metal particles 10 is preferably 0.1 to 50 μm from the viewpoint of dispersibility, and the content in the support substrates 1a and 1b is 0.1 to 10 mass from the viewpoint of thermal conductivity and withstand voltage. % Is desirable.

  As the metal particles 10, one or more metal particles selected from Au, Ag, Cu, Pt, Pd, W, Mo, Mn, Ti, Cr, Ni, Pb, and Al can be used. Au, Ag, Cu, Pt, Pb, and Al are desirable in terms of heat conduction and dispersibility. The shape of the metal particle 10 is spherical or indefinite. Moreover, in this invention, the metal particle 10 is the meaning included also when the surface is oxidized.

  In the thermoelectric conversion module of the present invention, since the metal particles 10 are dispersed and exist at the grain boundaries of the support substrates 1a and 1b, the diffusion of heat to the support substrates 1a and 1b is improved, and the support substrates 1a and 1b are connected to the wiring. It is possible to reduce heat accumulation at the interface with the conductors 3a and 3b, thereby suppressing softening of the solder 6 joining the thermoelectric conversion elements 2a and 2b and the wiring conductors 3a and 3b. The positional shift of 2b can be prevented, and long-term reliability and durability can be improved.

  FIG. 2A shows another embodiment of the thermoelectric conversion module of the present invention. In this embodiment, the metal particles 10 are present only on the surface layer of the support substrates 1a and 1b on the thermoelectric conversion elements 2a and 2b side. The metal particles 10 are not present on the supporting substrates 1a and 1b other than the surface layer. In such a thermoelectric conversion module, since the metal particles 10 are dispersed only on the surface layer of the support substrates 1a and 1b on the thermoelectric conversion elements 2a and 2b side, the support substrates 1a and 1b and the wiring conductors 2a and 2b are efficiently The heat of the interface can be dispersed in the support substrates 1a and 1b, and the withstand voltage can be prevented from decreasing due to the dispersion of the metal particles 10.

  FIG.2 (b) shows the further another form of the thermoelectric conversion module of this invention, In this form, the metal particle 10 is the surface layer of the support substrate 1a, 1b located under the thermoelectric conversion element 2a, 2b. Only distributed. In other words, the metal particles 10 are dispersed in the surface layer of the support substrates 1a and 1b on the thermoelectric conversion elements 2a and 2b side where the wiring conductors 3a and 3b are located.

  In such a thermoelectric conversion module, the layers in which the metal particles are dispersed are dispersed only in the surface layers of the support substrates 1a and 1b located below the thermoelectric conversion elements 2a and 2b. The heat diffused to the side can be reduced from returning from the support substrates 1a and 1b to the thermoelectric conversion elements 2a and 2b, and the softening of the solder 6 can be further reduced.

  FIG. 3 shows still another embodiment of the thermoelectric conversion module of the present invention. In this embodiment, the metal particles 10 are present on the surface layer of the support substrate 1a located below the thermoelectric conversion elements 2a and 2b. It exists in the surface layer on the opposite side to the thermoelectric conversion element 2a, 2b side of the support substrate 1a.

  For example, an optical transmission module is configured by soldering the high temperature side of a thermoelectric conversion module to a package and soldering a heat sink on which the laser device is mounted on the low temperature side. The thermoelectric conversion module is heated to the package or heat sink. Therefore, a bonding layer 15 made of Cu or the like is formed on the opposite side of the supporting substrate 1a, 1b from the surface where the thermoelectric conversion elements 2a, 2b are formed, and this bonding layer 15 is packaged via solder. Or bonded to a heat sink. Therefore, the heat generated in the thermoelectric conversion elements 2a and 2b is converted into the metal particles 10 on the surface layer of the support substrate 1a on the thermoelectric conversion elements 2a and 2b side, and the surface layer on the opposite side of the thermoelectric conversion elements 2a and 2b side of the support substrate 1a. It is possible to effectively escape from the bonding layer 15 through the metal particles 10. 2 and 3, the support substrate 1b, the wiring conductor 3b, and the solder 6, the coating layer 7 and the electrode 8 formed on the upper side of the thermoelectric conversion element 2 are omitted.

  In the thermoelectric conversion module of the present invention, since the metal particles 10 are dispersed at the interface of the ceramic particles, the density can be made higher than the portion where the metal particles 10 do not exist, and the support substrates 1a and 1b and the wiring conductors 3a and 3b The heat at the interface can be effectively diffused, and the softening of the solder 6 can be reduced. Further, since the metal particles 10 are dispersed at the interface of the ceramic particles, there are fewer voids than the portion where the metal particles 10 do not exist, thereby effectively providing an interface between the support substrates 1a and 1b and the wiring conductors 3a and 3b. Heat can be diffused, and softening of the solder 6 can be reduced.

  Next, an example of the manufacturing method of the thermoelectric conversion module 9 of this invention is demonstrated.

  First, the thermoelectric conversion element 2 is prepared. According to the present invention, the thermoelectric conversion element 2 can be obtained by a known method. That is, it is possible to use a material obtained by a sintering method, a single crystal method, a melting method, a hot extrusion method, a thin film method, or a combination thereof.

  The thermoelectric conversion element 2 is preferably a sintered body containing at least one of Bi and Sb and at least one of Te and Se. These metals and alloys can realize a thermoelectric conversion module with high performance near room temperature. Although the magnitude | size of the thermoelectric conversion element 2 is not specifically limited, As the small thermoelectric conversion module 9, as the thermoelectric conversion element 2, 0.1-2 mm in length, 0.1-2 mm in width, and the height of 0.1-3 mm Prepare what was processed into a column.

  In order to improve the wettability with the solder 6, the thermoelectric conversion element 2 has an electrode 8 made of Ni or the like and a coating layer 7 made of Au or the like in advance on the end face to be joined.

  Next, the support substrate 1 in which the metal particles 10 are dispersed is prepared. The support substrate 1 is prepared with ceramic powder mainly composed of alumina, aluminum nitride, silicon nitride, silicon carbide, etc., and Au, Ag, Cu, Pt, Pd, W, Mo, Mn, Ti, Cr, Ni One or more metal powders selected from Pb and Al are kneaded with a binder and the like, and a sheet-like molded body is produced by a conventional method such as tape molding, press molding, or extrusion molding. This is fired in a gas such as forming gas, argon, or nitrogen, and a sheet-like support substrate 1 in which metal particles are dispersed at grain boundaries can be obtained.

  The ceramic particles are sintered by firing, and metal particles are present at the grain boundaries. However, the surface of the metal particles may be partially oxidized by firing.

  Next, using at least one conductive material selected from Zn, Al, Au, Ag, W, Ti, Fe, Cu, Ni, Pt and Pd, the wiring conductor 3 and the external connection are formed on the surface of the support substrate 1. The terminal 4 is formed by a plating method, metallization method, DBC (Direct-bonding Copper) method, baking method, chip bonding method, or the like, and then cut and processed into a predetermined substrate shape to form the wiring conductor 3 and the external connection terminal. A support substrate 1 having 4 formed thereon is obtained.

  As shown in FIG. 2A, when the metal particles 10 are dispersed only in the surface layer of the support substrate 1, for example, a sheet-like molded body containing the metal powder and ceramic powder produced as described above is used as a metal. The support substrate 1 in which the metal particles 10 are dispersed only on the surface layer is obtained by laminating on a sheet-like molded body of ceramic powder not containing powder, press-bonding, and firing.

  Further, as shown in FIG. 2 (b), in order to disperse the metal particles 10 only on the surface layer of the support substrates 1a and 1b where the wiring conductor 3 is located, an opening is formed in the sheet-like molded body of ceramic powder not containing the metal powder. Forming a portion, filling the opening with a slurry containing metal powder and ceramic powder, and drying, then laminating a sheet-like formed body of ceramic powder not containing metal particles on the sheet-like formed body, The support substrate 1 in which the metal particles 10 are dispersed only in the surface layer of the support substrate on which the wiring conductor 3 is positioned can be obtained by firing after the pressure bonding.

  Furthermore, the thermoelectric conversion module as shown in FIG. 3 is formed with an opening in a ceramic powder sheet-like compact that does not contain metal powder, and the opening is filled with a slurry containing metal powder and ceramic powder, and dried. After that, a sheet-like molded body of ceramic powder not containing metal particles is laminated on this sheet-like molded body, and further, a sheet-like molded body containing metal powder and ceramic powder is laminated, pressed, and fired. Can be obtained.

  The thermoelectric conversion module 9 is manufactured by locally heating and joining the lead wire 5 having a diameter of, for example, 0.3 mm to the external connection terminal 4 of the thermoelectric conversion module 9 thus obtained with a soft beam or the like. . In addition, the thermoelectric conversion module 9 may be manufactured by spot welding with a YAG laser or the like. In order to cope with wire bonding, a block-like or columnar conductor may be joined instead of the lead wire 5. Alternatively, wire bonding can be directly performed on the external connection terminal 4.

  The thermoelectric conversion module of this invention can be used as cooling means, such as a laser and a semiconductor manufacturing apparatus, for example. Specifically, the thermoelectric conversion module is configured by placing the low temperature side of the thermoelectric conversion module on the laser or semiconductor manufacturing apparatus side. Thereby, the cooling device excellent in long-term stability can be provided. Further, the thermoelectric conversion module can be used, for example, as a temperature adjusting means for a laser diode. Thereby, the temperature control apparatus excellent in long-term stability can be provided. Furthermore, the thermoelectric conversion module can be used as a power generation means that uses exhaust heat such as an automobile or a cogeneration. Thereby, the power generator excellent in long-term stability can be provided.

  First, an n-type or p-type thermoelectric conversion element 2 made of a Bi—Te based sintered body was prepared. The shape of the thermoelectric conversion element 2 was a quadrangular prism, and the dimensions were 0.6 mm in length, 0.6 mm in width, and 1 mm in height. Further, a green sheet having a thickness of 500 μm containing 96% by mass of alumina powder having an average particle diameter of 1 μm and 4% by mass of a sintering aid component, and 95% by mass of alumina powder having an average particle diameter of 1 μm are sintered. A green sheet having a thickness of 100 μm containing 4% by mass of the auxiliary component and 1% by mass of Cu powder having an average particle diameter of 1 μm was prepared, and these were laminated and thermocompression bonded. The pressure-bonded body was fired at 1600 ° C. in a forming gas to obtain a support substrate 1 as shown in FIG.

  When the particles present at the grain boundaries of the alumina particles of the support substrate 1 were analyzed by wavelength dispersion X-ray microanalyzer analysis (EPMA), Cu was detected and confirmed to be Cu particles.

  A Cu wiring conductor 3 is formed on the support substrate 1 by a plating method, the thermoelectric conversion elements 2 are arranged so as to be alternately connected to p-type and n-type, and joined by Au—Sn solder 6. A conversion module was obtained.

  Furthermore, a support substrate was prepared by firing a green sheet having a thickness of 600 μm containing 96% by mass of alumina powder having an average particle diameter of 1 μm and 4% by mass of a sintering aid component at 1600 ° C. in a forming gas, The thermoelectric conversion module of the comparative example was obtained in the same manner as described above.

  When these thermoelectric conversion modules were subjected to a thermal diffusion test in which the thermoelectric conversion elements were held at 100 ° C. for 3000 hours, in the thermoelectric conversion module of the comparative example, the solder was softened and the thermoelectric conversion elements were misaligned. In the thermoelectric conversion module, there was no displacement of the thermoelectric conversion element.

  Furthermore, the present inventor obtained a green sheet obtained by mixing 95% by mass of alumina powder having an average particle size of 1 μm, 4% by mass of a sintering aid component, and 1% by mass of Cu powder having an average particle size of 1 μm, As a result of firing at 1600 ° C. in forming gas to produce a support substrate 1 as shown in FIG. 1B and conducting a thermal diffusion test similar to the above, there was no displacement of the thermoelectric conversion element.

DESCRIPTION OF SYMBOLS 1 ... Support substrate 1a ... Lower support substrate 1b ... Upper support substrate 2 ... Thermoelectric conversion element 2a ... P-type thermoelectric conversion element 2b ... N-type thermoelectric conversion element 3. -Wiring conductor 3a ... 1st wiring conductor 3b ... 2nd wiring conductor 6 ... Solder 7 ... Coating layer 8 ... Electrode 9 ... Thermoelectric conversion module 10 ... Metal particle

Claims (6)

  A thermoelectric conversion module comprising a support substrate made of ceramics, a plurality of thermoelectric conversion elements arranged on the support substrate, and a plurality of wiring conductors formed on the support substrate and electrically connecting the thermoelectric conversion elements. A thermoelectric conversion module, wherein metal particles are dispersed in the support substrate.   A thermoelectric conversion module comprising a support substrate made of ceramics, a plurality of thermoelectric conversion elements arranged on the support substrate, and a plurality of wiring conductors formed on the support substrate and electrically connecting the thermoelectric conversion elements. The thermoelectric conversion module is characterized in that the metal particles are dispersed in the surface layer on the thermoelectric conversion element side of the support substrate.   A thermoelectric conversion module comprising a support substrate made of ceramics, a plurality of thermoelectric conversion elements arranged on the support substrate, and a plurality of wiring conductors formed on the support substrate and electrically connecting the thermoelectric conversion elements. The thermoelectric conversion module is characterized in that the metal particles are dispersed and present in a portion of the surface layer of the support substrate on the thermoelectric conversion element side where the wiring conductor is located.   A cooling device comprising the thermoelectric conversion module according to claim 1 as a cooling means.   A temperature control device comprising the thermoelectric conversion module according to claim 1 as a temperature control means.   A power generation device comprising the thermoelectric conversion module according to claim 1 as a power generation means.

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