JP2010539476A - Branch probe for semiconductor device test - Google Patents

Abstract

A novel bifurcated probe design for use with a novel probe card is provided that includes a bifurcated bending element that more efficiently elastically stores displacement energy. Specifically, such a new probe card includes a substrate and a branching probe connected to the substrate. The branch probe has at least a base connected to the substrate, a first branch connected to the base and connected to the second branch via the branch connection structure, and a handle having a handle connected to the branch connection structure. A mold bending element. A probe top is connected to the first branch, and this probe top is used to contact the DUT. As an improvement with respect to the probe card, the first branch part and the second branch part are bent so that each branch part elastically stores a part of the displacement energy when the probe top part contacts the DUT. Can be mentioned. Branched bending elements can also be manufactured using photolithography and layered photolithography. Each branch may be made of a different material. The branched bending element may be made of a nickel alloy. Moreover, a contact length can be shortened by manufacturing a 1st branch part so that it may become harder than a 2nd branch part. The stiffness of the bifurcations can be manipulated by changing their shape and / or material.
[Selection] Figure 1

Description

  The present invention relates to an apparatus for testing a semiconductor device, and more particularly to a design of a probe contact for performing such a test.

  By patterning and processing the semiconductor wafer, the integrated circuit is manufactured by batch parallel processing. Each wafer includes what is referred to as a “die”, which is a large number of copies of the same integrated circuit. Preferably, the semiconductor wafer is tested before the die is cut into individual integrated circuits and packaged for sale. If a defect is detected, a defective die can be selected before packaging the defective part and wasting resources. Individual dies may be tested either after cutting the dies into individual integrated circuits and before or after packaging ("packaging" here refers to protecting the dies and wiring The process of connecting to an electrical interconnect package that can be incorporated into a board).

  In order to test a wafer or individual die (commonly referred to as a device under test or DUT), a probe card that typically contacts the surface of the DUT is used. In general, a probe card has three unique features: (1) an individual probe in an XY array that moves in the Z direction and contacts the die pad; (2) an electrical interface that connects the card to the circuit test equipment; ) A fixed reference plane defined to accurately attach the probe card in place. When the probe card is brought into contact with the die pad, it can be reliably brought into contact with the probe top by moving in the Z direction. The probe card ultimately provides an electrical interface that allows the circuit test apparatus to be temporarily connected to the DUT. This die test method is extremely efficient because many dies can be tested simultaneously. In order to increase this efficiency, probe card manufacturers are making larger probe cards with a greater number of probes.

  Currently, two main types of probe designs are used to test semiconductor dies using cantilever and twist types. 6A and 6B show a conventional cantilever type probe. Probe (605) includes a probe top (610), a bending element (615), and a probe base (620) attached to a substrate (625). Here, this entire structure is referred to as a probe card. In general, the bending element (615) bends by moving the DUT in the Z direction (indicated by arrow 630) relative to the probe card, which causes the probe top (610) to contact the die pad under test. FIG. 6B shows how the probe bending element (635) bends while in contact with the die. As each probe moves to contact the DUT contact pad (referred to as touchdown), the probe top contacts the contact pad to make full electrical contact with the die and the test begins. Die contact pads, typically aluminum (although gold and solder, and increasing use of copper), are often thin layers of aluminum oxide or other undesirable passivation coatings The top of the probe needs to penetrate the coating layer to make a complete electrical connection. When the test is complete, the probe (605) moves away from the die pad and the probe is bounced back to its original position.

  However, the cantilever design has several drawbacks. A typical cantilever probe is designed with a long bending element, and the contact angle of the probe top during the dutch down is smaller (compared to the same size top in a typical torsional probe design) Become. This results in a larger top contact area and a greater force is required to break through the aluminum oxide layer. If hundreds or thousands of probes on a single probe card exert such a force, the probe card must be manufactured to accept a large force, which usually enhances the probe card configuration. This means that the cost of the probe card increases and the test system becomes complicated.

  Another drawback is that the stress is distributed inefficiently. When the cantilever probe is bent during the touchdown, the stress generated in the probe is concentrated on the top and bottom surfaces of the bending element near the probe base end of the probe. FIG. 7A is a cross-sectional view in the length direction of the stress generated by the bending element of the cantilever probe, and FIG. 7B is a cross-sectional view in the width direction of the stress at each end of the bending element (AA cross section and BB cross section). Indicates. The left side of the drawing, the vicinity of the AA cross section is a portion (indicated by a portion 705) near the probe base of the bending element, and the vicinity of the BB cross section on the right side of the drawing is a portion near the probe top (portion 710). The area of the bending element that receives a stress greater than 50% of the maximum stress is indicated by diagonal lines (815). The amount of bent bar that receives a stress greater than 50% of the maximum stress is about 25% of the total amount of the cantilever bar, but this amount is concentrated near the probe base (705). The stress applied to the opposite side (710) of the bending bar is very small. Since only a small part of the bending element absorbs the stress, it is apparent from FIGS. 7A and 7B that the stress is distributed inefficiently. It is only in these small parts that the manufacturer cannot strengthen the bending element (often by widening the probe end) to reduce stress and prevent failure.

  FIG. 8 shows a cantilever probe (805) having a constant contact width at the bending element (810). As shown in the dark area (815), the cantilever probe (805) experiences the most stress at the probe base. The cantilever probe (820) in FIG. 8 has a bending element (825) that is wider at the probe base and tapers toward the probe top. As shown by the darker region (830), the bending element (825) receives much less stress than the non-wide design. But this design is expensive. If the bending element is made wider near the probe base, the recording density of the probe card is adversely affected as shown in FIG. If the recording density is not efficient, it will be difficult to adjust the probe layout and design to test the DUT at a finer pitch (where the pads are closer together).

  The second type of probe is based on a torsional design developed to overcome some of these drawbacks. For example, Patent Document 1 discloses a torsion spring design. FIG. 6C shows a twisted probe design. When the probe top (81) contacts the DUT contact pad, the top moves flexibly according to the force applied in the direction perpendicular to the top (81). The vertical movement of the top (81) pushes down the arm (82), and the torsion element (83) is twisted and bent in the direction indicated by the arrow (90). As the torsion element (83) acts as a torsion spring, a restoring force is exerted on the top (81).

  The twisted design has several advantages over the cantilevered design. The typical torsional probe arm is designed to be short, so that the top of the probe exhibits a larger top contact angle (as compared to the same size top in a typical cantilever probe design) during the dutch down Become. This results in a smaller contact area at the top and a smaller force for the probe to break through the aluminum oxide layer, reducing the overall force exerted by the probe card. If the overall force is reduced, there is no need to reinforce the probe card as much as an equivalent cantilever design, thereby reducing the manufacturing cost or making many probes with a single card.

  Finally, the torsional design distributes stress more efficiently throughout the torsional element. FIG. 10A shows a cross-sectional view in the length direction of the stress exerted by the torsion element, and FIG. 10B shows cross-sectional views in the width direction of the stress (CC cross section and DD cross section) at each end of the torsion element. The area of the torsion element that receives a stress greater than 50% of the maximum stress is indicated by the hatched area (1005), but the stress that the center (1010) of the torsion element receives is the minimum stress. The corresponding amount of torsional elements subjected to stresses greater than 50% of the maximum stress is about 60% of the total amount of torsional elements. Unlike the cantilever design, this stress is applied over the entire length of the torsion element and is not concentrated on the probe base. Therefore, it is more efficient to increase the recording density by making the torsion bar uniform in width.

  However, twisted probes also have drawbacks. First, for a typical twisted design with shorter arms, the contact length is generally longer, limiting the size of the contact pad for the DUT. Second, since the arm is typically short in shape, a large torsional force is required to move the probe top to a larger Z shape during the test. Such a large twist may cause the torsion element to slightly deform into a Z shape due to material fatigue, which may lead to a Z-shaped shift. Third, the recording density of the torsional probe is limited depending on the DUT layout shape. FIG. 11A shows a torsional probe shape (1105) having a probe base (1110) and a probe top (1115). In this configuration, the probe card can effectively test a DUT having a contact pad configuration that matches the configuration of the probe top. FIG. 11B shows a new probe configuration (1120) with a different probe top configuration (1125). However, this configuration does not work because the probes interfere with each other in at least two regions (1130 and 1135) and the probe card cannot operate efficiently.

US Pat. No. 6,426,638 US Patent Application No. 11/019912 US Patent Application No. 11/102982 US patent application Ser. No. 11 / 194,801

  Accordingly, there is a need for a probe that takes advantage of both the twisted probe design and the cantilever probe design while reducing the disadvantages associated therewith.

  The present disclosure provides a novel branched probe design that addresses the shortcomings of the prior art by storing displacement energy in the probe more efficiently. Specifically, such a new probe card includes a substrate and a branching probe connected to the substrate. The branch type probe includes a base connected to the substrate, and a branch type bending element having at least a first branch part connected to the base and connected to the second branch part via the branch part connection structure. Connect to. A probe top is connected to the first branch, and this probe top is used to contact the DUT. As an improvement with respect to the probe card, the first branch part and the second branch part and the handle are bent so that when the probe top part comes into contact with the DUT, they store elastically the displacement energy. Similarly, a branched bending element can be manufactured using photolithography and layered photolithography. Each branch may be made of a different material. The branched bending element may be made of a nickel alloy. Moreover, a contact length can be shortened by manufacturing a 1st branch part so that it may become harder than a 2nd branch part. The stiffness of the bifurcations can be manipulated by changing their shape and / or material composition.

  In one embodiment, the substrate includes a pivot, and the second bifurcation contacts the pivot while the probe top is in contact with the DUT.

  In another embodiment, the bifurcated bending element is connected to the base via the second bifurcation. This embodiment further includes a pivot connected to the substrate, and the bifurcated bending element contacts the pivot via the handle while the probe top is in contact with the DUT.

  In another embodiment, the bifurcated bending element connects to the base via a handle. This embodiment further includes a pivot connected to the substrate, and the second bifurcation contacts the pivot while the probe top is in contact with the DUT.

  In yet another embodiment, the pivot connects to the second bifurcation and the pivot contacts the substrate while the probe top is in contact with the DUT.

  Also disclosed herein is a novel bifurcated probe design that includes a base used to connect to a substrate and a bifurcated bending element connected to the base. The branch-type bending element includes at least a first branch portion, and the first branch portion is connected to the second branch portion via the branch portion connection structure, and the branch portion connection structure is connected to the handle. The probe top is connected to the first branch. As an improvement over the branched probe, the first and second branches and the handle bend so that when the top of the probe contacts the DUT, they store displacement energy elastically. . Further, the branch-type bending element can be manufactured using photolithography and layered photolithography. Each branch may be made of a different material. The branched bending element may be made of a nickel alloy.

  In one embodiment, the bifurcated bending element connects to the base via the second bifurcation. In another embodiment, the bifurcated bending element connects to the base via a handle. In yet another embodiment, the pivot connects to the second bifurcation or handle.

It is a figure which shows embodiment of a novel branched probe design. FIG. 2 shows the embodiment of FIG. 1 in both configurations, an unengaged configuration and an engaged configuration (ie, the probe top is in contact with the DUT). FIG. 2 shows the embodiment of FIG. 1 in both configurations, an unengaged configuration and an engaged configuration (ie, the probe top is in contact with the DUT). FIGS. 3C and 3D show another novel bifurcated probe design for both an unengaged configuration and an engaged configuration (ie, the probe top is in contact with the DUT). It is the figure which compared sufficient recording density and the recording density of a branched probe structure. FIGS. 3C and 3D show another novel bifurcated probe design for both an unengaged configuration and an engaged configuration (ie, the probe top is in contact with the DUT). It is the figure which compared sufficient recording density and the recording density of a branched probe structure. FIG. 6 shows another novel bifurcated probe design for both an unengaged configuration and an engaged configuration (ie, the probe top is in contact with the DUT). FIG. 6 shows another novel bifurcated probe design for both an unengaged configuration and an engaged configuration (ie, the probe top is in contact with the DUT). FIG. 10 shows yet another novel bifurcated probe design for both a non-engaged configuration and an engaged configuration (ie, the probe top is in contact with the DUT). FIG. 10 shows yet another novel bifurcated probe design for both a non-engaged configuration and an engaged configuration (ie, the probe top is in contact with the DUT). A cantilever type probe is shown, and 6C is a diagram showing a torsion type probe. A cantilever type probe is shown, and 6C is a diagram showing a torsion type probe. It is a figure which shows the cross section of a length direction, and the cross section of the width direction regarding the stress which the bending element of a cantilever type probe receives. It is a figure which shows the cross section of a length direction, and the cross section of the width direction regarding the stress which the bending element of a cantilever type probe receives. It is a figure which shows the force which the cantilever type probe which has the bending element of a fixed width | variety and the bending element made wide has received. It is a figure which shows the recording density of the cantilever type probe which has the bending element made wide. It is a figure which shows the cross section of a length direction, and the cross section of the width direction regarding the stress which the torsion element of a torsion type probe receives. It is a figure which shows the cross section of a length direction, and the cross section of the width direction regarding the stress which the torsion element of a torsion type probe receives. It is a figure which shows the recording density of a twist type | mold probe structure, and the fault accompanying it. It is a figure which shows the recording density of a twist type | mold probe structure, and the fault accompanying it.

  A novel bifurcated probe design including a bifurcated bending element is described below. This bifurcated bending element allows the bifurcated probe to store displacement energy more efficiently over more of the probe structure. The branched probe has advantages such as higher recording density, reduced probe failure due to material fatigue, less probe card force, and shorter contact length. The bifurcated probe design can also be manipulated to optimize a specific application, further increasing the efficiency and cost effectiveness of the probe card.

  FIG. 1 shows an embodiment of a novel bifurcated probe (105). The bifurcated probe (105) includes a probe base (110) that connects to a substrate (not shown) and a bifurcated bending element (115) (shown in dark color for illustration). The bifurcated bending element (115) is best reminiscent of something like a table fork, the element comprising at least two bifurcations (120) and (125) and a bifurcation between these bifurcations A connection structure (127) and a handle (129) are included, and the handle connects the probe base (110) and the branch connection structure (127). The probe top (130) is connected to the first branch (120) via the probe pillar (135). A pivot (140) (also known as a stop point) is connected to the substrate, and the pivot is arranged at a certain distance from the second branch (125). Since FIG. 1 is a perspective view, the small gap between the pivot (140) and the second branch (135) is not visible.

  2A and 2B show the same embodiment as that of FIG. FIG. 2A is a side view of a bifurcated probe (105) in an unengaged configuration, ie, a configuration in which the probe top is not in contact with the DUT. From this point of view, the gap between the pivot (140) and the second branch (135) is visible. In FIG. 2B, the bifurcated probe (105) is in an engaged configuration (ie, in contact with the DUT) and a force (205) is applied to the top of the probe. The force (205) causes the bifurcated bending element to bend, so that the displacement energy is stored elastically. Due to the shape of the bifurcated bending element, energy is distributed more evenly than a simple cantilever design. In detail, the probe (105) has a bifurcated bending element (colored position) such as a position 215 of the first branch (120), a position 225 of the second branch (135), a position 220 and a position 210 of the handle (129). Distribute energy over dark areas). The advantage that the stress is more evenly distributed is that the probe does not need to be reinforced with a special material to operate efficiently as in the case of a simple cantilever design, and the bifurcated probe (105) An even more efficient and suitable recording density is possible.

  Another advantage of the bifurcated probe design is a shorter contact length compared to the twisted probe. Referring to FIG. 2A, even if the probe (105) is engaged, if the second branch (135) is not in contact with the pivot (140), the probe (105) is the same as the cantilever with respect to the contact length. work. When the second branch (135) contacts the pivot (140), the second branch (135) begins to slide on the pivot (140), which causes a slight translational movement at the probe top. However, the movement of the probe top (and thus the contact length) is much smaller than that of the torsional probe design. Thus, a branched probe provides a higher recording density than a twisted probe design.

  By manipulating both the composition of the material and / or the shape of the bifurcation, the contact length can be further finely adjusted. For example, in FIG. 2A, a contact length can be shortened by producing the 2nd branch part (135) so that it may become harder than a 1st branch part (120). The advantage of a shorter contact length is that it is possible to test the die using smaller contact pads. Conversely, if the second branch part (135) is made not to be harder than the first branch part (120), the contact length can be increased. By selecting an appropriate material, the rigidity of each branch can be manipulated. A material with a low Young's modulus is more flexible and less rigid. The rigidity increases as the Young's modulus increases. Rigidity can be adjusted by decreasing the rigidity by increasing the length and / or thickness of the branch, and conversely by increasing the rigidity by shortening, increasing the thickness and / or increasing the width of the branch. . A similar operation can be performed on the handle of the branched bending element.

  A branched probe can be produced by several methods including those disclosed in Patent Document 2 and Patent Document 3. The rights of both of these patent applications are owned by the applicant of this application, and in this specification, the contents of both of these patent applications are referred to as part of the description of the text. These two applications show that general photolithographic pattern plating techniques can be used in combination with the use of sacrificial metals to further produce microstructures such as probes. Probes can be made using several types of materials. Among them, the most common is a nickel alloy that has high performance and can be suitably plated. Such alloys include nickel cobalt alloys and nickel manganese alloys, but nickel manganese alloys are more flexible-that is, have the lowest Young's modulus.

  U.S. Pat. No. 6,099,056 teaches forming various portions of a probe while performing photolithography on various layers. This feature is described in U.S. Pat. Made possible by using a process. Using this technique, various parts of the branched probe can be made of different materials, which allows for finer tuning of the hybrid probe characteristics. For example, to make the contact length shorter, the second branch part (135) is made of nickel manganese (high flexibility), and the first branch part (120) is made of nickel cobalt (low flexibility). Can do. When it is desired to make the contact length longer, the selection opposite to the selection of the material is possible.

  3A and 3B show another novel bifurcated probe (305) embodiment. FIG. 3A is a side view of the bifurcated probe (305) in an unengaged configuration, i.e., a configuration in which the probe top is not in contact with the DUT. The branched probe (305) includes a probe base (310) connected to the substrate (312) and a branched bending element (315). The branched bending element (315) includes at least two branches (320) and (325), a branch connection structure (327) between the branches, and a handle (329) connected to the branch connection structure (327). ). The probe top portion (330) is connected to the first branch portion (320) via the probe column portion (335). A pivot (340) arranged at a fixed distance (345) from the handle (329) is connected to the substrate. Alternatively, pivot (340) may be attached to handle (329). In FIG. 3B, the bifurcated probe (305) is in an engaged configuration (ie, in contact with the DUT) and a force (350) is applied to the top of the probe. The bifurcated bending element is bent by the force (350), so that the displacement energy is elastically stored. As described above, the shape of the branched bending element allows energy to be distributed more evenly than a simple cantilever design. That is, the branched probe (305) has at least four regions (355, 360, 365, and 370) that receive high stress, and these regions include the first branch portion (320), the second branch portion (325), And scattered in the handle (329). The bifurcated probe (305) has a more evenly distributed stress profile, allowing it to operate more effectively and efficiently without the need for reinforcement or extra design like a simple cantilever design can do. Of course, the bifurcated probe (305) can be constructed of various materials and / or shapes to achieve the desired performance specifications.

  The advantage of the bifurcated probe (305) is that it has a shorter contact length than that described with respect to FIGS. 1 and 2 because the contact direction actually changes with the configuration of the bifurcated probe. Referring to FIG. 3A, if the probe (305) is engaged but before the bifurcated bending element (315) abuts the pivot, the probe (305) operates in the same manner as the cantilever with respect to the contact length. The direction of the contact length in this first mode is indicated by an arrow 375. When the bifurcated bending element (315) abuts the pivot (340) via the handle (329), the handle (329) begins to slide the pivot (340), which causes the probe top to slightly move in the direction of the arrow 380. Due to the translational movement, in the second mode, the contact direction changes so as to return along the path followed by itself. Finally, the contact length is shorter than conventional cantilevers and much shorter than the twisted probe design. Therefore, the branched probe (305) can be used at a very high recording density.

  In addition, the branched probe has advantages over the torsional probe. 3C and 3D, the recording density of the torsional probe is compared with that of the branched probe. FIG. 3C is the same view as FIG. 11B, but is also presented here for ease of comparison. Recall that this probe configuration (1120) does not work because the probes interfere with each other in at least two regions (1130 and 1135) and prevent efficient operation of the probe card. However, the same probe top configuration can be achieved by using a branched probe as shown in FIG. 3D. The probe top configuration (385) is the same as the torsional probe top configuration (1125), but the probes do not interfere with each other as in the torsional design. Thus, a branched probe can include more probe top configurations than a torsional probe.

  4A and 4B show yet another embodiment of the novel bifurcated probe (405). FIG. 4A is a side view of a bifurcated probe (405) in an unengaged configuration, i.e., a configuration in which the probe top does not contact the DUT. The branched probe (405) includes a probe base (410) connected to a substrate (412) and a branched bending element (415) (shown in dark color for illustration). The branch-type bending element (415) includes at least two branch portions (420) and (425), a branch portion connection structure (427) between the branch portions, a probe base (410), and a branch portion connection structure (427). And a handle (429) connected to. The probe top portion (430) is connected to the first branch portion (420) via the probe column portion (435). A pivot (440) disposed at a certain distance (445) from the substrate (412) is connected to the second branch (425). Although not shown in FIG. 4, it is also possible to provide a second pivot on the substrate so that the pivot (440) can contact the second pivot. In FIG. 4B, the bifurcated probe (405) is in an engaged configuration (ie, in contact with the DUT) and a force (450) is applied to the probe top. Because the force (450) bends the bifurcated bending element, the displacement energy is stored elastically. As described above, the shape of the branch-type bending element allows energy to be distributed more evenly than a simple cantilever design. Specifically, the bifurcated probe (405) has five regions that are subject to high stress across the bifurcated probe bending element (415)-i.e., the first bifurcation (420) is at position 455 and the second bifurcation (425). ) At positions 460 and 465 and the handle (427) is highly stressed at positions 470 and 475, respectively. By having a more evenly distributed stress profile, the bifurcated probe (405) operates more effectively and more efficiently without the need for reinforcement or extra design like a simple cantilever design. Is possible.

  5A and 5B show yet another embodiment of the novel bifurcated probe (505), which is similar to the above embodiment. FIG. 5A is a side view of a bifurcated probe (505) in an unengaged configuration, i.e., a configuration where the probe top is not in contact with the DUT. The branched probe (505) includes a probe base (510) connected to a substrate (512) and a branched bending element (515) (shown in dark color for illustration). The bifurcated bending element (515) further includes at least two branches (520) and (525), a branch connection structure (527) between the branches, and a handle (529), the handle being a probe It is connected to both the base (510) and the branch connection structure (527). The probe top portion (530) is connected to the first branch portion (520) via the probe column portion (535). A pivot (540) arranged at a certain distance (545) from the substrate (512) is connected to the second branch (525). Although not shown in FIG. 5, a second pivot may be provided on the substrate so that the pivot (540) can contact the second pivot. In FIG. 5B, the bifurcated probe (505) is in an engaged configuration (ie, in contact with the DUT) and a force (550) is applied to the top of the probe. The bifurcated bending element is bent by the force (550), and the displacement energy is efficiently and elastically stored across the bifurcated probe (505). Specifically, the bifurcated probe (505) has five regions subject to high stress: 555, 560, 565, 570, and 575. Each of these highly stressed areas includes a first branch (520) (position 555), a second branch (525) (positions 565 and 575), and a handle (529) (positions 560 and 570). High stress is stored across the structure of the bifurcated bending element. As with all embodiments described herein, the bifurcated probe (505) can be constructed with a variety of shapes and materials to achieve the desired performance specifications.

  By using the embodiments described herein, the advantages of the torsional design, i.e. the benefits of more uniform stress distribution and recording density, and the advantages of a simple cantilever design, i.e. contact length A branched probe can be manufactured that also takes advantage of the shorter length. An advantage of a bifurcated probe is that the need to reinforce the probe is reduced because the probe efficiently absorbs displacement energy over a larger amount. Similarly, the contact length can be shortened by manipulating the rigidity of the branch portion including the branch-type bending element. The direction of contact can also be changed by manipulating the structure of the branched probe. This makes the probe card more efficient and cost-effective, with higher recording density, lower failure rate, and fewer probe failures due to material fatigue resulting from excessive stress. Become. The efficiency and cost effectiveness of the probe card can be further enhanced by finely adjusting the branch probe through the shape of the branch and the composition of the material and customizing it for a specific application.

  Although the foregoing has been described with reference to specific embodiments of the invention, it will be readily apparent to those skilled in the art that many modifications can be made without departing from the spirit of the invention. The appended claims are intended to cover such modifications within the spirit and scope of the invention. Accordingly, the embodiments shown herein are illustrative in all respects and are not intended to impose any limitation, and the scope of the invention is indicated by the appended claims rather than the foregoing description. All changes that come within the meaning and range of equivalency of the claims are to be embraced within their scope. Furthermore, Applicants do not specifically intend that the following claims and "the embodiments in the specification have exactly the same scope". See the case of Phillips v. AHW Corp., 415 F. 3d 1303, 1323 (US Federal Court of Appeals, 2005) (large court).

105 Branch type probe 110 Probe base 120, 125 Branch part 127 Branch part connection structure 129 Handle 130 Probe top part 135 Probe column part 140 Pivot

Claims (32)

A probe card for testing a semiconductor device,
A substrate,
A branched probe connected to the substrate,
The branched probe is
A base connected to the substrate;
A branch-type bending element having at least a first branch portion connected to the base and connected to a second branch portion via a branch portion connection structure, and having a handle connected to the branch portion connection structure;
A probe top connected to the first branch;
A probe card comprising: When the top of the probe comes into contact with the semiconductor device, the first branch portion, the second branch portion, and the handle are bent to elastically store displacement energy,
The probe card according to claim 1.   The probe card according to claim 1, further comprising a pivot connected to the substrate, wherein the second branch portion contacts the pivot while the probe top portion is in contact with the semiconductor device.   The probe card according to claim 1, further comprising a pivot connected to the substrate, wherein the handle contacts the pivot while the probe top is in contact with the semiconductor device.   The probe card according to claim 1, wherein the branch-type bending element is connected to the base via the second branch portion.   The probe card according to claim 5, further comprising a pivot connected to the substrate, wherein the handle contacts the pivot while the probe top is in contact with the semiconductor device.   6. The probe card of claim 5, further comprising a pivot connected to the handle, wherein the pivot contacts the substrate while the probe top is in contact with the semiconductor device.   The probe card according to claim 1, wherein the branched bending element is connected to the base via the handle.   The probe card according to claim 8, further comprising a pivot connected to the substrate, wherein the second branch portion contacts the pivot while the probe top portion is in contact with the semiconductor device.   9. The probe card according to claim 8, further comprising a pivot connected to the second branch portion, wherein the pivot contacts the substrate while the probe top is in contact with the semiconductor device.   The probe card according to claim 1, wherein the branched bending element is manufactured using photolithography.   The probe card according to claim 1, wherein the first branch portion is manufactured using a first photolithography layer, and the second branch portion is manufactured using a second photolithography layer.   The probe card according to claim 1, wherein the first branch portion is made of a first material, and the second branch portion is made of a second material.   The probe card according to claim 1, wherein the branched bending element is made of a nickel alloy.   The probe card according to claim 1, wherein a relative rigidity of the first branch portion with respect to the second branch portion is selected to achieve a short contact length.   The probe card according to claim 1, wherein a relative length of the first branch portion with respect to a length of the second branch portion is selected in order to achieve a short contact length.   The probe card according to claim 1, wherein the first branch portion is harder than the second branch portion.   The rigidity of the first branch portion is achieved by selecting the feature of the first branch portion from a group including a shape, a material, and a combination thereof, and changing the feature. Probe card. A branched probe for testing a semiconductor device,
A base used to connect to the board, and
A branch-type bending element having at least a first branch portion connected to the base and connected to a second branch portion via a branch portion connection structure, and having a handle connected to the branch portion connection structure;
A probe top connected to the first branch;
A branched probe comprising:   The displacement energy is elastically stored by bending the first branch portion, the second branch portion, and the handle when the top of the probe contacts the semiconductor device. 20. The branched probe according to 19.   The branched probe according to claim 19, wherein the branched bending element is connected to the base via the second branched portion.   The branch probe according to claim 19, further comprising a pivot connected to the second branch.   The branched probe according to claim 19, wherein the branched bending element is connected to the base via the handle.   The branched probe according to claim 23, further comprising a pivot connected to the second branch.   20. The branched probe according to claim 19, wherein the branched bending element is manufactured using photolithography.   The branched probe according to claim 19, wherein the first branch is manufactured using a first photolithography layer, and the second branch is manufactured using a second photolithography layer. .   The branched probe according to claim 19, wherein the first branch portion is made of a first material, and the second branch portion is made of a second material.   The branched probe according to claim 19, wherein the branched bending element is made of a nickel alloy.   20. The branched probe according to claim 19, wherein a relative rigidity of the first branch with respect to the second branch is selected to achieve a short contact length.   The branched probe according to claim 19, wherein a relative length of the first branch portion with respect to a length of the second branch portion is selected to achieve a short contact length.   The branched probe according to claim 19, wherein the first branch portion is harder than the second branch portion.   32. The rigidity of the first branch portion is achieved by selecting a feature of the first branch portion from a group including a shape, a material, and a combination thereof, and changing the first-stage feature. Branch type probe.

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