JP2010500606A5 - - Google Patents

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Publication number
JP2010500606A5
JP2010500606A5 JP2009523184A JP2009523184A JP2010500606A5 JP 2010500606 A5 JP2010500606 A5 JP 2010500606A5 JP 2009523184 A JP2009523184 A JP 2009523184A JP 2009523184 A JP2009523184 A JP 2009523184A JP 2010500606 A5 JP2010500606 A5 JP 2010500606A5
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JP
Japan
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region
carrier substrate
layer
positional relationship
multilayer body
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JP2009523184A
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English (en)
Japanese (ja)
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JP2010500606A (ja
JP4944200B2 (ja
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Priority claimed from DE102006037433A external-priority patent/DE102006037433B4/de
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Publication of JP2010500606A5 publication Critical patent/JP2010500606A5/ja
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Publication of JP4944200B2 publication Critical patent/JP4944200B2/ja
Expired - Fee Related legal-status Critical Current
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JP2009523184A 2006-08-09 2007-08-03 少なくとも一つの多層体の製造プロセスと多層体 Expired - Fee Related JP4944200B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102006037433.9 2006-08-09
DE102006037433A DE102006037433B4 (de) 2006-08-09 2006-08-09 Verfahren zur Herstellung eines Mehrschichtkörpers sowie Mehrschichtkörper
PCT/EP2007/006884 WO2008017426A1 (de) 2006-08-09 2007-08-03 Verfahren zur herstellung mindestens eines mehrschichtkörpers sowie mehrschichtkörper

Publications (3)

Publication Number Publication Date
JP2010500606A JP2010500606A (ja) 2010-01-07
JP2010500606A5 true JP2010500606A5 (https=) 2010-09-09
JP4944200B2 JP4944200B2 (ja) 2012-05-30

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JP2009523184A Expired - Fee Related JP4944200B2 (ja) 2006-08-09 2007-08-03 少なくとも一つの多層体の製造プロセスと多層体

Country Status (6)

Country Link
US (2) US8129217B2 (https=)
EP (1) EP2050150B1 (https=)
JP (1) JP4944200B2 (https=)
DE (1) DE102006037433B4 (https=)
DK (1) DK2050150T3 (https=)
WO (1) WO2008017426A1 (https=)

Families Citing this family (30)

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Publication number Priority date Publication date Assignee Title
CN102683391B (zh) 2004-06-04 2015-11-18 伊利诺伊大学评议会 用于制造并组装可印刷半导体元件的方法和设备
US7799699B2 (en) 2004-06-04 2010-09-21 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
KR101430587B1 (ko) 2006-09-20 2014-08-14 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 전사가능한 반도체 구조들, 디바이스들 및 디바이스 컴포넌트들을 만들기 위한 릴리스 방안들
KR101519038B1 (ko) 2007-01-17 2015-05-11 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 프린팅­기반 어셈블리에 의해 제조되는 광학 시스템
US9289132B2 (en) 2008-10-07 2016-03-22 Mc10, Inc. Catheter balloon having stretchable integrated circuitry and sensor array
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8372726B2 (en) 2008-10-07 2013-02-12 Mc10, Inc. Methods and applications of non-planar imaging arrays
BRPI1012733A2 (pt) * 2009-03-30 2016-04-05 Boegli Gravures Sa método e dispositivo para a estruturação da superfície de um corpo sólido revestido com material duro por meio de um laser
EP2414130B2 (en) 2009-03-30 2019-04-24 Boegli-Gravures S.A. Method and device for structuring a solid body surface with a hard coating with a first laser with pulses in the nanosecond field and a second laser with pulses in the pico- or femtosecond field ; packaging foil
TWI592996B (zh) 2009-05-12 2017-07-21 美國伊利諾大學理事會 用於可變形及半透明顯示器之超薄微刻度無機發光二極體之印刷總成
US9723122B2 (en) 2009-10-01 2017-08-01 Mc10, Inc. Protective cases with integrated electronics
US10441185B2 (en) 2009-12-16 2019-10-15 The Board Of Trustees Of The University Of Illinois Flexible and stretchable electronic systems for epidermal electronics
US9936574B2 (en) 2009-12-16 2018-04-03 The Board Of Trustees Of The University Of Illinois Waterproof stretchable optoelectronics
US10918298B2 (en) 2009-12-16 2021-02-16 The Board Of Trustees Of The University Of Illinois High-speed, high-resolution electrophysiology in-vivo using conformal electronics
US8666471B2 (en) 2010-03-17 2014-03-04 The Board Of Trustees Of The University Of Illinois Implantable biomedical devices on bioresorbable substrates
US9442285B2 (en) 2011-01-14 2016-09-13 The Board Of Trustees Of The University Of Illinois Optical component array having adjustable curvature
KR20140019341A (ko) * 2011-03-03 2014-02-14 올싸거널 인코포레이티드 박막 장치에서 재료를 패터닝하는 공정
WO2012158709A1 (en) 2011-05-16 2012-11-22 The Board Of Trustees Of The University Of Illinois Thermally managed led arrays assembled by printing
US9159635B2 (en) 2011-05-27 2015-10-13 Mc10, Inc. Flexible electronic structure
US8934965B2 (en) 2011-06-03 2015-01-13 The Board Of Trustees Of The University Of Illinois Conformable actively multiplexed high-density surface electrode array for brain interfacing
CN108389893A (zh) 2011-12-01 2018-08-10 伊利诺伊大学评议会 经设计以经历可编程转变的瞬态器件
EP2830492B1 (en) 2012-03-30 2021-05-19 The Board of Trustees of the University of Illinois Appendage mountable electronic devices conformable to surfaces and method of making the same
DE102012108170B4 (de) * 2012-09-03 2015-01-22 Bundesdruckerei Gmbh Sicherheitselement und Verfahren zur Herstellung eines Sicherheitselements
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
WO2016196673A1 (en) 2015-06-01 2016-12-08 The Board Of Trustees Of The University Of Illinois Alternative approach to uv sensing
CN107851208B (zh) 2015-06-01 2021-09-10 伊利诺伊大学评议会 具有无线供电和近场通信能力的小型化电子系统
US10925543B2 (en) 2015-11-11 2021-02-23 The Board Of Trustees Of The University Of Illinois Bioresorbable silicon electronics for transient implants
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