JP2010500606A5 - - Google Patents

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Publication number
JP2010500606A5
JP2010500606A5 JP2009523184A JP2009523184A JP2010500606A5 JP 2010500606 A5 JP2010500606 A5 JP 2010500606A5 JP 2009523184 A JP2009523184 A JP 2009523184A JP 2009523184 A JP2009523184 A JP 2009523184A JP 2010500606 A5 JP2010500606 A5 JP 2010500606A5
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JP
Japan
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region
carrier substrate
layer
positional relationship
multilayer body
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JP2009523184A
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English (en)
Japanese (ja)
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JP4944200B2 (ja
JP2010500606A (ja
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Priority claimed from DE102006037433A external-priority patent/DE102006037433B4/de
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Publication of JP2010500606A5 publication Critical patent/JP2010500606A5/ja
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Publication of JP4944200B2 publication Critical patent/JP4944200B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009523184A 2006-08-09 2007-08-03 少なくとも一つの多層体の製造プロセスと多層体 Expired - Fee Related JP4944200B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102006037433A DE102006037433B4 (de) 2006-08-09 2006-08-09 Verfahren zur Herstellung eines Mehrschichtkörpers sowie Mehrschichtkörper
DE102006037433.9 2006-08-09
PCT/EP2007/006884 WO2008017426A1 (de) 2006-08-09 2007-08-03 Verfahren zur herstellung mindestens eines mehrschichtkörpers sowie mehrschichtkörper

Publications (3)

Publication Number Publication Date
JP2010500606A JP2010500606A (ja) 2010-01-07
JP2010500606A5 true JP2010500606A5 (cg-RX-API-DMAC7.html) 2010-09-09
JP4944200B2 JP4944200B2 (ja) 2012-05-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009523184A Expired - Fee Related JP4944200B2 (ja) 2006-08-09 2007-08-03 少なくとも一つの多層体の製造プロセスと多層体

Country Status (6)

Country Link
US (2) US8129217B2 (cg-RX-API-DMAC7.html)
EP (1) EP2050150B1 (cg-RX-API-DMAC7.html)
JP (1) JP4944200B2 (cg-RX-API-DMAC7.html)
DE (1) DE102006037433B4 (cg-RX-API-DMAC7.html)
DK (1) DK2050150T3 (cg-RX-API-DMAC7.html)
WO (1) WO2008017426A1 (cg-RX-API-DMAC7.html)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1759422B1 (en) 2004-06-04 2022-01-26 The Board Of Trustees Of The University Of Illinois Electrical device comprising printable semiconductor elements
US7799699B2 (en) 2004-06-04 2010-09-21 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
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CN102176486B (zh) 2007-01-17 2015-06-24 伊利诺伊大学评议会 通过基于印刷的组装制造的光学系统
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
JP5646492B2 (ja) 2008-10-07 2014-12-24 エムシー10 インコーポレイテッドMc10,Inc. 伸縮可能な集積回路およびセンサアレイを有する装置
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US8372726B2 (en) 2008-10-07 2013-02-12 Mc10, Inc. Methods and applications of non-planar imaging arrays
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
CA2756840C (en) 2009-03-30 2018-10-23 Boegli-Gravures S.A. Method and device for structuring the surface of a hard material coated solid body by means of a laser
WO2010111799A1 (en) * 2009-03-30 2010-10-07 Boegli-Gravures S.A. Method and device for structuring a solid body surface with a hard coating with a laser using mask and diaphragm
US8865489B2 (en) 2009-05-12 2014-10-21 The Board Of Trustees Of The University Of Illinois Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
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WO2011115643A1 (en) 2010-03-17 2011-09-22 The Board Of Trustees Of The University Of Illinois Implantable biomedical devices on bioresorbable substrates
US10441185B2 (en) 2009-12-16 2019-10-15 The Board Of Trustees Of The University Of Illinois Flexible and stretchable electronic systems for epidermal electronics
US10918298B2 (en) 2009-12-16 2021-02-16 The Board Of Trustees Of The University Of Illinois High-speed, high-resolution electrophysiology in-vivo using conformal electronics
US9936574B2 (en) 2009-12-16 2018-04-03 The Board Of Trustees Of The University Of Illinois Waterproof stretchable optoelectronics
US9442285B2 (en) 2011-01-14 2016-09-13 The Board Of Trustees Of The University Of Illinois Optical component array having adjustable curvature
WO2012118713A2 (en) * 2011-03-03 2012-09-07 Orthogonal, Inc. Process for patterning materials in thin-film devices
WO2012158709A1 (en) 2011-05-16 2012-11-22 The Board Of Trustees Of The University Of Illinois Thermally managed led arrays assembled by printing
EP2712491B1 (en) 2011-05-27 2019-12-04 Mc10, Inc. Flexible electronic structure
EP2713863B1 (en) 2011-06-03 2020-01-15 The Board of Trustees of the University of Illionis Conformable actively multiplexed high-density surface electrode array for brain interfacing
CN108389893A (zh) 2011-12-01 2018-08-10 伊利诺伊大学评议会 经设计以经历可编程转变的瞬态器件
KR20150004819A (ko) 2012-03-30 2015-01-13 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 표면에 상응하는 부속체 장착가능한 전자 장치
DE102012108170B4 (de) * 2012-09-03 2015-01-22 Bundesdruckerei Gmbh Sicherheitselement und Verfahren zur Herstellung eines Sicherheitselements
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
CN107923988A (zh) 2015-06-01 2018-04-17 伊利诺伊大学评议会 Uv感测的替代方法
AU2016270807A1 (en) 2015-06-01 2017-12-14 The Board Of Trustees Of The University Of Illinois Miniaturized electronic systems with wireless power and near-field communication capabilities
US10925543B2 (en) 2015-11-11 2021-02-23 The Board Of Trustees Of The University Of Illinois Bioresorbable silicon electronics for transient implants
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