JP2010287728A - Cooling device and computer device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooling device and a computer device, capable of improving maintainability and replaceability, by miniaturizing a module mounted with a heating element. <P>SOLUTION: The cooling device includes a heat sink 50, a heat sink mounting rod 54 of which the front end is mounted with the heat sink, and of which the base end is mounted to a chassis 58, a heat sink kit 56 having a spring 57 arranged between the heat sink and the chassis, guides 60, 61 arranged in the both sides of the heat sink kit, and guide rails 91, 92 which guide the heat sink. According to the mounting operation and removal operation of the module in which the heating element (LSI) is mounted, the heat sink is made so as to contact closely to the heating element by the guide of the guide rails, or to depart from the heating element by the guide of the guide rails. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a cooling device for cooling a heat-generating component such as an LSI and a computer device using the same.

  FIG. 9 is a diagram illustrating an example of a rack mount server as a computer apparatus. Conventionally, a heat sink is attached to a heating element such as an LSI. 9A is a top view of the rack mount server, FIG. 9B is a rear view thereof, FIG. 9C is a front view thereof, FIG. 9D is a side view thereof, and FIG. A front view of plane 2 is shown.

  As shown in FIG. 9, the rack mount server 1 includes a server chassis 49, a midplane 2, a module 10, a module 20, a module 30, a module 40, a fan 13, a fan 23, and the like. The server chassis 49 is mounted with the midplane 2 at the center and the fans 13 and 23 on the front surface.

  The midplane 2 has a hole 3 and a hole 4 as shown in FIG. 9 (e) so that the airflow 5 and the airflow 6 can be removed from the front surface of the rack mount server 1 to the rear surface. The fan 13 sucks the airflow 5 from the front surface and discharges it from the rear surface. The heat sink 12 and the heat sink 32 are cooled by the air flow 5. Similarly, the heat sink 22 and the heat sink 42 are cooled by the airflow 6 of the fan 23.

  The module 10 includes an LSI 11, a connector 14 for connecting to the midplane 2, and a heat sink 12 for radiating heat from the LSI 11. The modules 20, 30 and 40 have the same configuration as the module 10.

  The module 10 is mounted on the rack mount server 1 from the front side and is connected to the midplane 2 by a connector 14. Similarly, the module 20 is mounted on the rack mount server 1 from the front side and is connected to the midplane 2 by a connector 24. The module 30 is mounted on the rack mount server 1 from the rear side, and is connected to the midplane 2 by a connector 34. Similarly, the module 40 is mounted on the rack mount server 1 from the rear side and is connected to the midplane 2 by a connector 44.

  Usually, other rack mount devices are mounted adjacent to the lower surface of the upper surface of the rack mount server 1, so that the module is attached / removed from the front surface or the rear surface. In such a rack mount server 1, for example, when the module 10 is pulled out in the front direction, the heat sink 12 mounted on the module 10 collides with the fan 13 as shown in FIG. Therefore, when pulling out the module 10, it is necessary to pull out the fan 13 as shown in FIG. If it does so, since the airflow 5 by the fan 13 will be lose | eliminated, the heat sink 32 will no longer be cooled.

  In the example of FIG. 9, a heat sink is attached to a heat-generating component such as an LSI. At that time, for example, as described in Patent Document 1, by pressing the IC portion of the heat-generating component against the heat sink using a spring, There is a structure that improves the adhesion between the IC portion and the heat sink. Patent Documents 2 and 3 describe that the electronic component is brought into close contact by pressing the electronic component against the radiator using a spring in this way.

Japanese Utility Model Publication No.59-107149 Japanese Utility Model Publication No. 04-065450 JP 2004-281974 A

  As described above, conventionally, a heat sink is attached to a heating element such as an LSI, and a module on which the LSI is mounted is increased in size by the amount of the heat sink. Therefore, when trying to pull out the module, it collides with other parts. For example, when it collides with the fan, it is necessary to remove the fan. In that case, there was a problem in maintenance and exchangeability such that other heat sinks were not cooled.

  An object of the present invention is to provide a cooling device capable of reducing the size of a module on which a heating element is mounted and improving maintenance and exchangeability, and a computer device using the same.

  The present invention provides a heat sink kit in which a heat sink is fixed to a distal end portion and a base end portion is rotatably attached to a chassis, and the heat sink is in close contact with or separated from the heating element to be cooled. And a guide mechanism for guiding the heat sink kit.

  In addition, the present invention provides a heat sink kit in which a heat sink for cooling a heating element is fixed to a distal end portion and a base end portion is rotatably attached to a chassis, and an installation operation of a module in which the heating element is mounted And a guide mechanism that guides the heat sink kit so that the heat sink is in close contact with or separated from the heat generating element in accordance with a removal operation.

  The present invention also includes a heat sink that cools the heating element, a heat sink mounting rod that has the heat sink fixed to a distal end portion, and a base end portion that is rotatably attached to the chassis, the heat sink and the chassis. A heat sink kit having a spring member that presses the heat sink, a guide member that is disposed on both sides of the heat sink kit and restricts movement of the heat sink kit in both directions, and the guide member A guide rail for guiding the heat sink, the heat sink being guided by the guide rail in accordance with an attachment operation and a removal operation of the module on which the heat generation element is mounted. Or the heat sink is guided by the guide rail. Wherein the guide so as to separate from the heating element Te.

  According to another aspect of the present invention, there is provided a computer apparatus comprising: a module on which a heating element is mounted; a midplane that connects the module; and a server chassis that mounts the module and the midplane. The cooling device according to claim 1, wherein the cooling device is attached to the server chassis side, and the heat sink is in close contact with the heating element in accordance with an attachment operation and a removal operation of the module to the midplane. Or separated from the heating element.

  The present invention also includes a module on which a heating element is mounted, a midplane that connects the modules, a fan that cools the heating element, and a server chassis that mounts the module, the midplane, and the fan. A computer apparatus comprising the cooling device according to claim 1, wherein the cooling device is attached to the server chassis side, and the fan is a side surface of the module. It is arranged on the side of the server chassis where the module is attached to or removed from the cooling device, and the heat sink is brought into close contact with the heating element according to the mounting and removing operations of the module with the fan mounted. Or apart from the heating element.

  According to the present invention, by attaching a heat sink attached to a heating element such as an LSI to the computer device, the module on which the heating element such as an LSI is mounted can be downsized, and the maintenance and exchangeability of the module can be improved.

  Further, the module heating element is automatically separated from the heat sink by simply pulling out or pushing the module, or the module heating element is automatically brought into close contact with the heat sink.

It is a figure which shows one Embodiment of the heat sink kit which concerns on this invention. It is a figure which shows the state which attached the heat sink kit which concerns on this invention to the server chassis. It is a figure explaining a motion of the heat sink kit concerning the present invention. It is a figure which shows the structure which has arrange | positioned the guide on both sides of the heat sink kit which concerns on this invention. It is a figure which shows the guide of FIG. 4 in detail. It is a figure explaining a motion of a cooling device which has arranged a guide on both sides of a heat sink kit according to the present invention. It is a figure which shows the example which used the cooling device concerning this invention for the rack mount server. It is a figure explaining the operation | movement which removes / attaches a module from the rack mount server using the cooling device which concerns on this invention. It is a figure which shows the rack mount server of a prior art example. It is a figure explaining the module exchange operation | work of the rack mount server of FIG.

  Next, embodiments for carrying out the invention will be described in detail with reference to the drawings. FIG. 1 is a diagram showing components constituting a cooling device according to the present invention. 1A shows the heat sink 50, FIG. 1B shows the heat sink mounting base 53, and FIG. 1C shows the heat sink mounting rod 54. 1A to 1C are a top view, a front view, and a side view, respectively. FIG. 1D is a front view of the heat sink kit 56 in which the heat sink 50, the heat sink mounting base 53, and the heat sink mounting rod 54 are assembled.

  FIG. 2 is a view showing a state where the heat sink kit according to the present invention is attached to the server chassis. FIG. 2A shows a top view, a front view, and a side view. FIG. 2B shows an enlarged view of the heat sink kit.

  As shown in FIG. 1, the heat sink kit 56 includes a heat sink 50 in which a heat transfer material 52 having flexibility and thermal conductivity is attached to a heat sink metal portion 51, a heat sink mounting base 53, and a heat sink mounting rod 54. The heat sink mounting base 53 and the heat sink mounting bar 54 are structured to be freely attachable / detachable.

  Next, a method for attaching the heat sink kit 56 to the server chassis 58 of the computer apparatus will be described. As shown in FIG. 2, a hole 59 is formed in the side surface of the server chassis 58, and the heat sink mounting rod 54 is passed through the hole 59 on the side surface of the server chassis 58. A spring (coil spring) 57 is attached to the chassis 58. At this time, the heat sink mounting rod 54 is inserted into the center of the spring 57 and the spring 57 is only disposed between the heat sink mounting base 53 and the server chassis 58, but one end of the spring 57 is connected to the heat sink mounting base 53. A structure in which the other end of the spring 57 is fixed to the server chassis 58 may be used.

  The base end portion of the heat sink mounting rod 54 is T-shaped and does not come out of the server chassis 58. With this structure, the heat sink kit 56 can freely rotate with respect to the server chassis 58. Of course, the mounting structure of the base end portion of the heat sink mounting rod 54 to the server chassis 58 is not limited to this. In other words, the heat sink mounting rod 54 may be attached to the server chassis 58 using a mechanism that smoothly rotates the heat sink mounting rod 54 with respect to the server chassis 58.

  Thereafter, the heat sink mounting base 53 is attached to the tip of the heat sink mounting rod 54, and the heat sink 50 is attached to the heat sink mounting base 53, whereby the heat sink kit 56 is attached to the server chassis 58 of the computer apparatus. At that time, as shown in FIG. 2B, the inner diameter of the hole 59 formed in the side surface of the server chassis 58 is larger than the outer diameter of the heat sink mounting rod 54 and has a degree of freedom. As will be described later, guides and guide rails are arranged on both sides of the heat sink kit 56.

  Next, the movement of the heat sink kit 56 attached to the server chassis 58 will be described with reference to FIG. FIG. 3A shows a state when a force is applied to the heat sink kit 56 in the B direction (upward in the drawing). At this time, since the spring 57 tends to extend in the E direction (left direction in the drawing), the heat sink kit 56 tries to return in the A direction (downward direction in the drawing). FIG. 3B shows a state when a force is applied to the heat sink kit 56 in the A direction. At this time, since the spring 57 tends to extend in the E direction, the heat sink kit 56 tries to return in the B direction.

  Since the spring 57 tends to extend in the E direction, the state shown in FIG. Since the outer diameter of the heat sink mounting rod 54 is smaller than the inner diameter of the hole 59, the heat sink kit 56 can be applied in the A direction, B direction, C direction, D direction, F direction, G direction, H direction, I direction, J by applying force. It can move freely in the direction (FIG. 3B).

  FIG. 4 is a view showing a structure in which guides 60 and guides 61 are arranged on both sides of the heat sink kit 56. 4A is a top view, a front view and a side view thereof, and FIG. 4B is an enlarged view of a portion of the heat sink kit 56, showing a top view and a side view.

  As shown in FIG. 4A, a guide 60 is disposed on one side surface of the heat sink kit 56, and a guide 61 is disposed on the other side surface of the heat sink kit 56. The hole 59 surface side of the guide 60 and the guide 61 is fixed to the server chassis 58. Further, as shown in FIG. 4B, the guide 60 and the guide 61 have a gap 62 and a gap 63, and the airflow 64 passes through the gap 62 and the gap 63.

  Fig.5 (a) shows the top view and side view which looked at the guide 60 from both sides. FIG. 5B shows a plan view and a side view of the guide 61 viewed from both sides. As shown in FIG. 5A, the guide 61 has an end 67 and an end 68 bent inward, and a guide rail 91 is fixed to the inner central portion of the guide 61. Further, as shown in FIG. 5B, the end 60 and end 68 of the guide 60 are bent inward, and a guide rail 92 is fixed to the inner central portion of the guide 60. The guide 61 and the guide 60 have a target structure.

  By attaching guides 60 and 61 to both sides of the heat sink kit 56, the heat sink kit 56 has a structure that can move only in a certain direction. Furthermore, the heat sink kit 56 is applied with a force in a certain direction by the force of the spring 57 extending. At that time, as will be described later, the heat sink kit 56 moves in the A direction because the spring 57 tends to extend in the E direction, and is locked at the end of the guide. Since there is a gap in the guide, an airflow for cooling the heat sink is secured.

  Next, the movement of the heat sink kit 56 when the guide 60, the guide 61, and the heat sink kit 56 are attached to the server chassis 58 will be described with reference to FIG. 6A shows a state in which no force is applied, and FIG. 6B shows a state in which a force is applied in the B direction. 6 (a) and 6 (b) show a top view and a side view, respectively. Since the heat sink kit 56 is located between the guide 60 and the guide 61, the heat sink kit 56 cannot be seen in the side view, but the heat sink kit 56 is indicated by a broken line for explanation of the operation.

  First, since the spring 57 tends to extend in the E direction, the state shown in FIG. In this state, since the outer diameter of the heat sink mounting rod 54 is smaller than the inner diameter of the hole 59 and has a degree of freedom, the heat sink kit 56 moves freely in the B direction by applying a force. At that time, since there are ends (stoppers) 66 and 68 in the A direction, they cannot move downward. Since there are guides 60 and 61 in the C and D directions, they cannot move. Since there are guide rails 91 and 92 in the F direction, they cannot move.

  When a force is applied to the heat sink kit 56 in the B direction from the state of FIG. 6A, the heat sink kit 56 moves in the B direction along the guide rails 91 and 92, and the state shown in FIG. 6B is obtained. In this state, since the heat sink kit 56 is regulated by the ends (stoppers) 65 and 67, the heat sink kit 56 cannot move further in the B direction. Since there are guide rails 91 and 92 in the F direction, they do not move. At this time, since the spring 57 tends to extend in the E direction, the heat sink kit 56 tries to return to the A direction. When the force in the B direction applied to the heat sink kit 56 is removed, the heat sink kit 56 moves along the guide rails 91 and 92 and returns to the state of FIG. At that time, it does not move in the A direction from the ends (stoppers) 66 and 68.

  Next, an example in which a cooling device having a heat sink kit or a guide according to the present invention is used in a rack mount server will be described with reference to FIG. The rack mount server shown in FIG. 7 has the same configuration as the rack mount server shown in FIG. 7 (a) is a top view of the rack mount server, FIG. 7 (b) is a rear view thereof, FIG. 7 (c) is a front view thereof, FIG. 7 (d) is a side view thereof, and FIG. A front view of plane 2 is shown.

  As shown in FIG. 7, the rack mount server 69 includes a server chassis 58, a midplane 2, a module 70, a module 80, a module 30, a module 40, a fan 73, a fan 83, and the like. A cooling device including heat sink kits 72 and 82, guides 75 and 76, guide rails 78 and 79, and the like is attached to the server chassis 58 of the rack mount server 69. The heat sink kits 72 and 82 are the same as the heat sink kit 56 of FIGS. The same applies to other guides and guide rails.

  Since the heat sink kit 72 is located between the guides 75 and 76, the heat sink kit 72 is not visible, but the heat sink kit 72 is indicated by a broken line for explanation of the operation. Similarly, the heat sink kit 82 is also indicated by a broken line. The server chassis 58 of the rack mount server 69 has a midplane 2 at the center, fans 73 and 83 at the front, a heat sink kit 72 and guides 75 and 76 on one side, and a heat sink kit 82 and guides 85 and 86 on the other side. Has been implemented. As shown in FIG. 7 (e), the midplane 2 has holes 3 and 4, so that the airflows 5 and 6 can be removed from the front surface of the rack mount server 69 to the rear surface.

  The fan 73 sucks the airflow 5 from the front and discharges it from the rear. The heat sink kit 72 and the heat sink 32 are cooled by the air flow 5. Similarly, the heat sink kit 82 and the heat sink 42 are cooled by the air flow 6 of the fan 83. The fan 73 is disposed on the side of the module 70 on the side where the module 70 of the server chassis 58 is attached to and removed from the cooling device having the heat sink kit 72 and the like. The positional relationship of the cooling device having the fan 83, the module 80, and the heat sink kit 82 is the same.

  The module 70 includes an LSI 71 as a heating element and a connector 74 for connecting to the midplane 2. The module 80 has the same configuration as the module 70. The module 30 includes an LSI 31 that is a heating element, a connector 34 that is connected to the midplane 2, and a heat sink 32 that dissipates heat from the LSI 31. The module 40 has the same configuration as the module 30.

  The module 70 is mounted on the rack mount server 69 from the front side, and is connected to the midplane 2 by a connector 74. Similarly, the module 80 is mounted on the rack mount server 69 from the front side, and is connected to the midplane 2 by a connector 84. The module 30 is mounted on the rack mount server 69 from the rear side, and is connected to the midplane 2 by a connector 34. Similarly, the module 40 is mounted on the rack mount server 69 from the rear side, and is connected to the midplane 2 by a connector 44.

  Usually, other rack mount devices are mounted adjacent to the lower surface of the upper surface of the rack mount server 69, so that the module is attached / removed from the front surface or the rear surface. The heat sink kit 72 and the heat sink kit 82 have the same structure as the heat sink kit 56 described above as described above. The guides 75 and 76 and the guides 85 and 86 have the same structure as the guides 60 and 61 described above.

  FIG. 8 shows an enlarged view of the server area 90. With reference to FIG. 8, the operation | movement which removes a module from the rack mount server 69 using the cooling device based on this invention, and the operation | movement which mounts a module are demonstrated. In addition, although the operation | movement which removes the module 70 and the operation | movement of mounting are demonstrated, the case of the module 80 is also the same.

  A method for removing the module 70 from the rack mount server 69 will be described with reference to FIGS. 8A and 8B. FIG. 8A shows a state in which the module 70 is mounted on the midplane 2 of the rack mount server 69. In this state, the LSI 71 and the heat sink kit 72 are in contact with each other without a gap due to the force of the spring 77 extending in the E direction.

  When the module 70 is pulled out from this state in the A direction, the LSI 71 and the heat sink kit 72 are separated as shown in FIG. 8B, and only the module 70 can be removed from the rack mount server 69. Further, the heat sink kit 72 remains in the server chassis 58 of the rack mount server 69 as it is. In that case, the heat sink kit 72 moves in the A direction along the guide rail 78 by the force of the spring 77 extending in the E direction. However, since it is regulated by the end of the guide 75 as described above, it does not go out of the guide 75. .

  Next, a method for attaching the module 70 to the rack mount server 69 will be described with reference to FIGS. 8C and 8D. As shown in FIG. 8C, when the module 70 is to be mounted on the midplane 2 of the rack mount server 69 from the B direction, the LSI 71 and the heat sink kit 72 first come into contact with each other. If the module 70 is continuously pushed in the B direction as it is, it is pushed by the LSI 71 and the heat sink kit 72 moves along the guide rail 78 in the B direction.

  When the connector 74 of the module 70 is mounted on the midplane 2, the heat sink kit 72 is aligned by the guide rail 78, and the LSI 71 and the heat sink kit 72 are in contact with each other as shown in FIG. At this time, the heat transfer material 76 of the heat sink kit 72 and the LSI 71 are in contact with each other without a gap due to the force of the spring 77 to extend in the E direction.

  When mounting a module with an LSI mounted on a computer device in this way, the LSI and the heat sink kit are first brought into contact with each other, and the module is continuously pressed and pushed by the LSI, so that the heat sink kit moves in the direction in which the spring contracts. . When the module is mounted on the computer device, the heat sink is guided by the guide and comes into contact with the LSI. At this time, the heat sink kit and the LSI are in contact with each other without a gap due to the force of the spring extending in the LSI direction.

  On the other hand, when the module mounted with the LSI is removed from the computer apparatus, the LSI is separated from the heat sink, only the module mounted with the LSI is removed from the computer apparatus, and the heat sink remains in the computer apparatus. At this time, the heat sink moves by the force that the spring extends, but does not come out of the guide because it contacts the end of the guide.

  By attaching a heat sink attached to a heating element such as an LSI to the computer device in this way, the module on which the LSI is mounted can be reduced in size, and the adjacent module (fan or the like) is not affected. Therefore, the module can be mounted / removed with other components mounted, airflow is not lost, and cooling of the heat sink beyond that is not affected.

  In addition, the mechanism consisting of the heat sink mounting rod, spring, guide, guide rail, etc. of the cooling device guides the heat sink kit away from the module or aligned with the heating element of the module according to the pulling out or pushing operation of the module. Acts as a guide mechanism. Therefore, when installing / removing a module, simply pulling out the module or pushing in the module, the heating element of the module automatically leaves the heat sink kit, or the heating element of the module automatically heats from the heat sink kit. Operability is good because the material is aligned and in close contact.

  In addition, since a spring structure is used to attach the heat sink and the heat sink is pressed by the spring structure, when a module mounted with a heating element such as LSI is mounted on a computer device, the heat sink contacts the heating element without a gap. Therefore, a low thermal resistance can be realized.

2 Midplane 3, 4 hole 30, 40, 70, 80 Module 31, 41, 71, 81 LSI
56, 72, 82 Heat sink kit 50 Heat sink 51 Heat sink metal part 52 Heat transfer material 53 Heat sink mounting base 54 Heat sink mounting rod 57, 77 Spring 58 Server chassis 59 Hole 60, 61, 75, 76 Guide 69 Rack mount server 73, 83 Fan 78, 91, 92 Guide rail

Claims (9)

A heatsink kit in which a heatsink is fixed to the distal end, and a base end is rotatably attached to the chassis;
A guide mechanism for guiding the heat sink kit so that the heat sink is in close contact with or separated from the heating element to be cooled;
A cooling device comprising: A heat sink for fixing the heat generating element to the distal end, and a heat sink kit in which the heat sink is rotatably attached to the chassis at the base end;
A guide mechanism for guiding the heat sink kit so that the heat sink is in close contact with or separated from the heat generating body in accordance with the mounting operation and the detaching operation of the module on which the heat generating body is mounted;
A cooling device comprising: A heat sink that cools the heating element, the heat sink is fixed to the front end, and a base end is disposed between the heat sink and the chassis. A heat sink kit having a spring member for pressing the heat sink,
Guide members that are arranged on both sides of the heat sink kit and restrict movement of the heat sink kit in both directions,
A guide rail disposed inside each of the guide members for guiding the heat sink,
The heat sink is brought into close contact with the heating element by the guide rail guide or the heat sink is separated from the heating element by the guide rail guide according to the mounting operation and the detaching operation of the module on which the heating element is mounted. A cooling device characterized by being guided to.   The cooling according to any one of claims 1 to 3, wherein a heat transfer material having flexibility and thermal conductivity is fixed to the heat sink side of the heat sink so as to be in close contact with the heat generator. apparatus.   The guide member includes a stopper that restricts movement of the heat sink from a close contact position with the heating element, and a stopper that restricts the heat sink from coming out of a predetermined position when the heat sink is separated from the heating element. The cooling device according to claim 3, wherein: A module mounted with a heating element;
A midplane connecting the modules;
A server chassis for mounting the module and the midplane;
A computer device comprising:
The cooling apparatus according to claim 1, wherein the cooling apparatus is attached to the server chassis side,
The computer apparatus according to claim 1, wherein the heat sink is in close contact with or separated from the heating element in accordance with an operation of attaching and detaching the module to the midplane.   The computer apparatus according to claim 6, wherein, when the module is removed from the midplane, the cooling device remains in the server chassis in a state where the heat sink is separated from the heating element. A module mounted with a heating element;
A midplane connecting the modules;
A fan for cooling the heating element;
A server chassis for mounting the module, the midplane and the fan;
A computer device comprising:
6. The cooling device according to claim 1, wherein the cooling device is attached to the server chassis side, and the fan is a side surface of the module, and the cooling device is connected to the cooling device. It is located on the server chassis mounting and removal side,
The computer apparatus, wherein the heat sink is brought into close contact with or separated from the heating element in accordance with a mounting operation and a removing operation of the module in a state where the fan is mounted.   The computer apparatus according to claim 8, wherein the cooling device remains in the server chassis in a state where the heat sink is separated from the heating element when the module is removed from the midplane.