JP2010287700A5 - - Google Patents

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Publication number
JP2010287700A5
JP2010287700A5 JP2009139829A JP2009139829A JP2010287700A5 JP 2010287700 A5 JP2010287700 A5 JP 2010287700A5 JP 2009139829 A JP2009139829 A JP 2009139829A JP 2009139829 A JP2009139829 A JP 2009139829A JP 2010287700 A5 JP2010287700 A5 JP 2010287700A5
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JP
Japan
Prior art keywords
wafer
probe
wafer stage
preliminary
inspected
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JP2009139829A
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English (en)
Japanese (ja)
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JP5527794B2 (ja
JP2010287700A (ja
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Priority to JP2009139829A priority Critical patent/JP5527794B2/ja
Priority claimed from JP2009139829A external-priority patent/JP5527794B2/ja
Publication of JP2010287700A publication Critical patent/JP2010287700A/ja
Publication of JP2010287700A5 publication Critical patent/JP2010287700A5/ja
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Publication of JP5527794B2 publication Critical patent/JP5527794B2/ja
Expired - Fee Related legal-status Critical Current
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JP2009139829A 2009-06-11 2009-06-11 半導体装置の製造方法 Expired - Fee Related JP5527794B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009139829A JP5527794B2 (ja) 2009-06-11 2009-06-11 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009139829A JP5527794B2 (ja) 2009-06-11 2009-06-11 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2010287700A JP2010287700A (ja) 2010-12-24
JP2010287700A5 true JP2010287700A5 (cg-RX-API-DMAC10.html) 2012-04-05
JP5527794B2 JP5527794B2 (ja) 2014-06-25

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ID=43543193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009139829A Expired - Fee Related JP5527794B2 (ja) 2009-06-11 2009-06-11 半導体装置の製造方法

Country Status (1)

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JP (1) JP5527794B2 (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5529769B2 (ja) * 2011-01-13 2014-06-25 東京エレクトロン株式会社 プローブカードの熱的安定化方法及び検査装置
IL264768A (en) 2019-02-10 2020-08-31 Sagi Irit Anti-matrix metalloproteinase 7 (mmp-7) inhibitory antibody and uses thereof
WO2021095232A1 (ja) * 2019-11-15 2021-05-20 キオクシア株式会社 ストレージシステム及びウェハ
US11035898B1 (en) * 2020-05-11 2021-06-15 International Test Solutions, Inc. Device and method for thermal stabilization of probe elements using a heat conducting wafer

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05175289A (ja) * 1991-12-20 1993-07-13 Tokyo Electron Yamanashi Kk プロ−ビング方法及びプロ−ブ装置
JP2005019788A (ja) * 2003-06-27 2005-01-20 Renesas Technology Corp 半導体素子の試験装置および半導体素子の試験方法

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