JP2010287312A - Light-emitting device and lighting system - Google Patents

Light-emitting device and lighting system Download PDF

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JP2010287312A
JP2010287312A JP2009115286A JP2009115286A JP2010287312A JP 2010287312 A JP2010287312 A JP 2010287312A JP 2009115286 A JP2009115286 A JP 2009115286A JP 2009115286 A JP2009115286 A JP 2009115286A JP 2010287312 A JP2010287312 A JP 2010287312A
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substrate
light
sealing material
light flux
flux controlling
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JP5279133B2 (en
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Yuo Fujii
悠生 藤井
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Enplas Corp
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Enplas Corp
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  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device and a lighting system equipped with the same, positioning an optical axis of an LED as a point-like light-emitting element and an optical axis of a lens part to enable to emit uniform illumination light to have an excellent waterproof property. <P>SOLUTION: A pair of positioning protrusions 15, 18 formed in a sealing material housing groove 40 of a light flux control member 5 are engaged with a first positioning hole 16 and a second positioning hole 20 of a substrate 3, respectively. With this, an optical axis of a lens part 26 of the light flux control member 5 can be matched to an optical axis of an LED 4 mounted on the substrate 3. Moreover, by injecting a sealing material into the sealing material housing groove 40, a gap between the light flux control member 5 and the substrate 3 can be sealed with the sealing material, and also, a gap between the light flux control member 5 as well as the substrate 3 and a harness 7 can be sealed with the sealing material, thus, intrusion of rainwater, dust or the like into the light-emitting device 1 can be surely prevented. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

この発明は、防水性に優れ、屋内外での使用が可能な発光装置、及びこの発光装置を複数組み合わせて構成される照明装置に関するものである。   The present invention relates to a light-emitting device that is excellent in waterproofness and can be used indoors and outdoors, and a lighting device configured by combining a plurality of the light-emitting devices.

従来から、風雨に晒される屋外の広告パネルや案内パネル等を照明するための照明装置ユニットとして、ＬＥＤ（点状に発光する発光素子）を用いたものが知られている。   2. Description of the Related Art Conventionally, an illumination device unit for illuminating an outdoor advertising panel or guide panel exposed to wind and rain has been known that uses LEDs (light emitting elements that emit light in the form of dots).

図２１は、このような照明装置ユニット１００を示すものである。この図２１に示す従来の照明装置ユニット１００は、複数のＬＥＤ１０１を実装した基板１０２及び防水目的のＯリング１０３をケース１０４内に収容すると共に、基板１０２と図外の外部電源等に接続されるワイヤ１０５の固定部材１０６をケース１０４の係合部１０７に固定した後、ケース１０４の上部開口端１０８を塞ぐように、集光拡散カバー１１０をケース１０４にねじ１１１で締め付け固定していた。集光拡散カバー１１０は、基板１０２上のＬＥＤ１０１の位置に対応するようにレンズ形状部１１２が形成され、ＬＥＤ１０１からの光を集光し且つ拡散出射させるようになっている。   FIG. 21 shows such an illumination device unit 100. The conventional lighting device unit 100 shown in FIG. 21 houses a substrate 102 on which a plurality of LEDs 101 are mounted and a waterproof O-ring 103 in a case 104, and is connected to the substrate 102 and an external power source not shown. After fixing the fixing member 106 of the wire 105 to the engaging portion 107 of the case 104, the condensing diffusion cover 110 is fastened and fixed to the case 104 with the screw 111 so as to close the upper opening end 108 of the case 104. The condensing / diffusion cover 110 has a lens-shaped portion 112 formed so as to correspond to the position of the LED 101 on the substrate 102, and condenses and emits the light from the LED 101.

また、この図２１に示す従来の照明装置ユニット１００は、防水機能を発揮させるＯリング１０３及び固定部材１０６に代え、シリコーン樹脂等のシーリング材でケース１０４を密封する技術も開示している（特許文献１参照）。   21 also discloses a technique for sealing the case 104 with a sealing material such as silicone resin in place of the O-ring 103 and the fixing member 106 that exhibit a waterproof function (patent). Reference 1).

特開２００７−２１３８８１号公報JP 2007-213881 A

しかしながら、図２１に示した照明装置ユニット１００は、ＬＥＤ１０１が実装された基板１０２と集光拡散カバー１１０とが直接位置決めされるようになっていないため、ＬＥＤ１０１の光軸と集光拡散カバー１１０のレンズ形状部１１２の光軸とにズレを生じやすく、集光拡散カバー１１０から出射される光が光軸の周りに均等に拡散されずに、照明光の明るさにバラツキが生じるという問題があった。   However, in the illumination device unit 100 shown in FIG. 21, the substrate 102 on which the LED 101 is mounted and the light condensing / diffusing cover 110 are not directly positioned. There is a problem that the optical axis of the lens-shaped portion 112 is likely to be misaligned, and the light emitted from the condensing diffusion cover 110 is not uniformly diffused around the optical axis, resulting in variations in the brightness of the illumination light. It was.

また、照明装置ユニット１００の防水性を確保するためには、集光拡散カバー１１０とケース１０４とを組み合わせて形成される空間に基板１０２を収容し、Ｏリング１０３等で密封する必要があり、部品点数が多いという問題があった。   Further, in order to ensure the waterproof property of the lighting device unit 100, it is necessary to accommodate the substrate 102 in a space formed by combining the condensing diffusion cover 110 and the case 104, and to seal it with an O-ring 103 or the like. There was a problem that the number of parts was large.

そこで、本発明は、少ない部品点数でＬＥＤの光軸とレンズ部の光軸とを位置合わせし、レンズで制御された照明光を設計通りに出射できるようにした防水性に優れた発光装置及びこれを備えた照明装置の提供を目的とする。   Therefore, the present invention relates to a light emitting device excellent in waterproofness, in which the optical axis of the LED and the optical axis of the lens unit are aligned with a small number of components, and illumination light controlled by the lens can be emitted as designed. An object of the present invention is to provide a lighting device including the above.

請求項１の発明は、点状に発光する発光素子が取り付けられた基板と、前記発光素子からの光を前記発光素子の光軸の周りに拡げて出射させるレンズ部が形成されて、前記基板に固定される光束制御部材と、を有する発光装置に関するものである。この発明において、前記光束制御部材は、前記基板に対向する側の外縁部分が前記基板の外縁を所定の隙間をもって取り囲むように形成され、前記外縁部分の内側に沿ってシーリング材収容溝が形成され、前記基板と外部電源とを接続するハーネスの引き出し溝が前記シーリング材収容溝に連通するように前記外縁部分に形成されると共に、前記シーリング材収容溝内で且つ前記基板に対向する面側に一対の位置決め突起が離れた状態で突設されている。また、前記基板は、前記一対の位置決め突起の一方に係合する第１の位置決め穴が形成されると共に、前記一対の位置決め突起の他方に係合する第２の位置決め穴が形成されている。また、前記一対の位置決め突起は、その一方が前記第１の位置決め穴に係合され、その他方が前記第２の位置決め穴に係合されると、前記発光素子の光軸に前記レンズ部の光軸を合致させるように、前記基板に対して前記光束制御部材を位置決めする。また、前記第２の位置決め穴は、前記一対の位置決め突起を結んだ線に沿った方向への前記光束制御部材と前記基板の相対移動を可能にする長穴である。そして、本発明の発光装置は、前記光束制御部材の前記一対の位置決め突起の一方を前記基板の第１の位置決め穴に係合し、前記光束制御部材の前記一対の位置決め突起の他方を前記基板の第２の位置決め穴に係合して、前記光束制御部材を前記基板に対して位置決めした状態で組付け、前記光束制御部材の前記外縁部分と前記基板の前記外縁との隙間から前記シーリング材収容溝内にシーリング材を注入することにより、前記光束制御部材の外縁部分と前記基板の外縁との隙間が前記シーリング材でシールされ、前記ハーネスと前記引き出し溝との隙間が前記シーリング材でシールされると共に、前記一対の位置決め突起の一方と前記第１の位置決め穴との隙間及び前記一対の位置決め突起の他方と前記第２の位置決め穴との隙間が前記シーリング材でシールされるようになっている。   According to a first aspect of the present invention, there is provided a substrate on which a light emitting element that emits light in a spot shape is attached, and a lens portion that spreads light from the light emitting element around an optical axis of the light emitting element and emits the light. The light-emitting device which has the light beam control member fixed to the. In this invention, the light flux controlling member is formed such that an outer edge portion facing the substrate surrounds the outer edge of the substrate with a predetermined gap, and a sealing material accommodation groove is formed along the inner side of the outer edge portion. A harness lead-out groove connecting the substrate and an external power source is formed in the outer edge portion so as to communicate with the sealing material accommodation groove, and on the side of the surface facing the substrate in the sealing material accommodation groove. The pair of positioning protrusions are protruded in a separated state. The substrate has a first positioning hole that engages with one of the pair of positioning protrusions and a second positioning hole that engages with the other of the pair of positioning protrusions. Further, when one of the pair of positioning protrusions is engaged with the first positioning hole and the other is engaged with the second positioning hole, the lens portion is placed on the optical axis of the light emitting element. The light flux controlling member is positioned with respect to the substrate so as to match the optical axes. The second positioning hole is a long hole that enables relative movement of the light flux controlling member and the substrate in a direction along a line connecting the pair of positioning protrusions. In the light emitting device of the present invention, one of the pair of positioning protrusions of the light flux controlling member is engaged with the first positioning hole of the substrate, and the other of the pair of positioning protrusions of the light flux controlling member is the substrate. The light flux controlling member is assembled in a state where the light flux controlling member is positioned with respect to the substrate by engaging with the second positioning hole, and the sealing material is formed from a gap between the outer edge portion of the light flux controlling member and the outer edge of the substrate. By injecting a sealing material into the housing groove, the gap between the outer edge portion of the light flux controlling member and the outer edge of the substrate is sealed with the sealing material, and the gap between the harness and the extraction groove is sealed with the sealing material. In addition, a gap between one of the pair of positioning protrusions and the first positioning hole and a gap between the other of the pair of positioning protrusions and the second positioning hole are the gaps. It is adapted to be sealed by the ring material.

請求項２の発明に係る発光装置は、上記請求項１の発明における前記基板に特徴を有するものである。すなわち、前記基板は、金属板の表面に前記発光素子と前記ハーネスとを電気的に接続する回路が形成されており、前記金属板の裏面が前記光束制御部材から出っ張るように位置している。   A light emitting device according to a second aspect of the present invention is characterized in that the substrate according to the first aspect of the present invention is characterized. That is, the circuit board is formed on the surface of the metal plate to electrically connect the light emitting element and the harness, and the back surface of the metal plate is positioned so as to protrude from the light flux controlling member.

請求項３の発明に係る発光装置は、上記請求項１又は２の発明において、前記基板と前記光束制御部材が前記シーリング材によって固定されることを特徴としている。   A light emitting device according to a third aspect of the invention is characterized in that, in the first or second aspect of the invention, the substrate and the light flux controlling member are fixed by the sealing material.

請求項４の発明に係る照明装置は、上記請求項１乃至３のいずれかの発明に係る発光装置を平面上に所定の間隔で複数配置し、これら複数の発光装置によって被照明部材を照明するようになっている。   According to a fourth aspect of the present invention, a plurality of light emitting devices according to any one of the first to third aspects of the present invention are arranged on a plane at a predetermined interval, and a member to be illuminated is illuminated by the plurality of light emitting devices. It is like that.

以上のように、本発明は、光束制御部材の一対の位置決め突起を基板の第１の位置決め穴と第２の位置決め穴のそれぞれに係合することにより、基板に取り付けた発光素子の光軸に光束制御部材のレンズ部の光軸を合致させることができるため、発光素子の光軸とレンズ部の光軸のずれに起因する照明光の設計値からのずれを生じることがなく、レンズによる設計通りに制御された照明光の出射が可能になる。   As described above, according to the present invention, the pair of positioning protrusions of the light flux controlling member are engaged with the first positioning hole and the second positioning hole of the substrate, respectively, so that the optical axis of the light emitting element attached to the substrate is aligned. Since the optical axis of the lens part of the light flux controlling member can be matched, there is no deviation from the design value of the illumination light due to the deviation of the optical axis of the light emitting element and the optical axis of the lens part. The illumination light controlled in the street can be emitted.

また、本発明は、光束制御部材と基板との隙間をシーリング材でシールすることができると共に、光束制御部材及び基板とハーネスとの隙間をシーリング材でシールし、内部に雨水や塵等が侵入するのを確実に防止することができるため、風雨や埃に晒される屋内外において、長期間に亘り、均一な照明光を出射することができる。   In addition, the present invention can seal the gap between the light flux controlling member and the substrate with a sealing material, and also seal the gap between the light flux controlling member and the substrate with the harness with a sealing material, so that rainwater, dust, or the like enters inside. Therefore, uniform illumination light can be emitted for a long period of time indoors and outdoors exposed to wind and rain and dust.

図１（ａ）が発光装置の平面図、図１（ｂ）が発光装置の正面図、図１（ｃ）が発光装置の右側面図、図１（ｄ）が発光装置の裏面図である。1A is a plan view of the light emitting device, FIG. 1B is a front view of the light emitting device, FIG. 1C is a right side view of the light emitting device, and FIG. 1D is a back view of the light emitting device. . 図１（ａ）のＡ１−Ａ１線に沿って切断して示す発光装置の断面図であり、取付板に固定した状態を示す発光装置の断面図である。It is sectional drawing of the light-emitting device cut | disconnected and shown along the A1-A1 line | wire of Fig.1 (a), and is sectional drawing of the light-emitting device which shows the state fixed to the attachment plate. 図１（ａ）のＡ２−Ａ２線に沿って切断して示す発光装置の断面図である。It is sectional drawing of the light-emitting device cut | disconnected and shown along the A2-A2 line | wire of Fig.1 (a). 基板を取り除いて示す発光装置の裏面図である。It is a reverse view of the light-emitting device shown by removing the substrate. 発光装置の使用状態を模式的に示す図である。It is a figure which shows the use condition of a light-emitting device typically. 図１（ａ）の発光装置の一部を破断して示す平面図である。It is a top view which fractures | ruptures and shows a part of light-emitting device of Fig.1 (a). ハーネスを半田付けした後の基板の平面図である。It is a top view of the board | substrate after soldering a harness. 図８（ａ）がハーネスを半田付けする前の基板の平面図、図８（ｂ）がハーネスを半田付けする前の基板の正面図である。FIG. 8A is a plan view of the substrate before the harness is soldered, and FIG. 8B is a front view of the substrate before the harness is soldered. 図９（ａ）が光束制御部材の平面図、図９（ｂ）が光束制御部材の正面図、図９（ｃ）が図９（ａ）の光束制御部材を右側から見て示す側面図、図９（ｄ）が図９（ａ）の光束制御部材を左側から見て示す側面図である。9A is a plan view of the light flux controlling member, FIG. 9B is a front view of the light flux controlling member, and FIG. 9C is a side view of the light flux controlling member of FIG. FIG. 9D is a side view showing the light flux controlling member of FIG. 9A as viewed from the left side. 図９（ａ）に示す光束制御部材の裏面図である。It is a reverse view of the light beam control member shown to Fig.9 (a). 図９（ａ）のＡ３−Ａ３線に沿って切断して示す光束制御部材の断面図である。It is sectional drawing of the light beam control member shown cut along the A3-A3 line of Fig.9 (a). 図９（ａ）のＡ４−Ａ４線に沿って切断して示す光束制御部材の断面図である。It is sectional drawing of the light beam control member shown cut along the A4-A4 line of Fig.9 (a). 図９（ａ）のＡ５−Ａ５線に沿って切断して示す光束制御部材の断面図である。It is sectional drawing of the light beam control member shown cut along the A5-A5 line of Fig.9 (a). 図９（ａ）のＡ６−Ａ６線に沿って切断して示す光束制御部材の部分断面図である。FIG. 10 is a partial cross-sectional view of the light flux controlling member shown cut along line A6-A6 in FIG. 図９（ａ）のＡ７−Ａ７線に沿って切断して示す光束制御部材の断面図である。It is sectional drawing of the light beam control member shown cut | disconnected along the A7-A7 line | wire of Fig.9 (a). 図１（ａ）のＢ１−Ｂ１線に沿って切断して示す発光装置の断面図である。It is sectional drawing of the light-emitting device cut | disconnected and shown along the B1-B1 line | wire of Fig.1 (a). 被照明部材を取り除いて示す照明装置の平面図を示すものである。The top view of the illuminating device shown by removing the to-be-illuminated member is shown. 照明装置の正面図を示すものである。The front view of an illuminating device is shown. （ａ）は、発光装置の裏面図である。（ｂ）は、基板を取り除いて示す発光装置の裏面図である。(A) is a back view of a light-emitting device. (B) is a back view of the light emitting device shown with the substrate removed. 、基板の裏面図である。It is a reverse view of a board | substrate. 従来の照明ユニットの分解斜視図である。It is a disassembled perspective view of the conventional illumination unit.

以下、本発明の実施の形態を図面に基づき詳述する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

図１乃至図５は、本発明の実施の形態に係る発光装置１を示すものである。このうち、図１（ａ）が発光装置１の平面図、図１（ｂ）が発光装置１の正面図、図１（ｃ）が発光装置１の右側面図、図１（ｄ）が発光装置１の裏面図である。また、図２は、図１（ａ）のＡ１−Ａ１線に沿って切断して示す発光装置１の断面図であり、取付板２に固定した状態を示す発光装置１の断面図である。また、図３は、図１（ａ）のＡ２−Ａ２線に沿って切断して示す発光装置１の断面図である。また、図４は、基板３を取り除いて示す発光装置１の裏面図である。また、図５は、発光装置１の使用状態を模式的に示す図である。   1 to 5 show a light emitting device 1 according to an embodiment of the present invention. 1A is a plan view of the light emitting device 1, FIG. 1B is a front view of the light emitting device 1, FIG. 1C is a right side view of the light emitting device 1, and FIG. 2 is a rear view of the device 1. FIG. 2 is a cross-sectional view of the light-emitting device 1 cut along the line A1-A1 in FIG. 1A and is a cross-sectional view of the light-emitting device 1 that is fixed to the mounting plate 2. FIG. 3 is a cross-sectional view of the light emitting device 1 cut along the line A2-A2 of FIG. FIG. 4 is a back view of the light emitting device 1 with the substrate 3 removed. FIG. 5 is a diagram schematically showing the usage state of the light emitting device 1.

（発光装置の概略構成）
これらの図に示すように、発光装置１は、点状発光素子としてのＬＥＤ４が取り付けられた薄板状の基板３と、この基板３に固定される光束制御部材５と、を有している。そして、この発光装置１は、基板３に半田６で固定（半田付け）されたハーネス７が光束制御部材５の外縁部分（側壁）８の引き出し溝１０から光束制御部材５の外部に引き出されるようになっている。 (Schematic configuration of light emitting device)
As shown in these drawings, the light emitting device 1 includes a thin plate-like substrate 3 to which an LED 4 as a point light emitting element is attached, and a light flux controlling member 5 fixed to the substrate 3. In the light emitting device 1, the harness 7 fixed (soldered) to the substrate 3 with the solder 6 is drawn out of the light flux controlling member 5 from the drawing groove 10 of the outer edge portion (side wall) 8 of the light flux controlling member 5. It has become.

（基板）
基板３は、図１〜図８に示すように、平面形状が四角形の金属板１１（例えば、縦寸法が３４ｍｍ、横寸法が３８ｍｍ、板厚１．５ｍｍの熱伝導性に優れたアルミニウム板）の表面１１ａに絶縁層１２（層厚８０μｍ）が形成され、この絶縁層１２上に図示しない回路パターン（例えば、銅箔厚３５μｍ）が形成され、平面図で見た中央Ｃ（一対の対角線１３ａ，１３ｂの交点）にＬＥＤ４が取り付けられている。すなわち、本実施の形態において、ＬＥＤ４の光軸１７は、中央Ｃを通るように配置されている。そして、ＬＥＤ４が回路パターンに接続され、その回路パターンの端部にハーネス７の一端側の導線１４が半田付けされており、基板３のＬＥＤ４が回路パターン及びハーネス７を介して外部電源に接続される。ここでいう光軸１７とは、ＬＥＤ４からの立体的な出射光束の中心を意味する。 (substrate)
As shown in FIGS. 1 to 8, the substrate 3 is a metal plate 11 having a square planar shape (for example, an aluminum plate excellent in thermal conductivity having a vertical dimension of 34 mm, a horizontal dimension of 38 mm, and a plate thickness of 1.5 mm). An insulating layer 12 (with a layer thickness of 80 μm) is formed on the surface 11a, and a circuit pattern (not shown) (for example, a copper foil thickness of 35 μm) is formed on the insulating layer 12, and the center C (a pair of diagonal lines 13a) as viewed in plan view , 13b) at the intersection). That is, in the present embodiment, the optical axis 17 of the LED 4 is disposed so as to pass through the center C. And LED4 is connected to a circuit pattern, the conducting wire 14 of the one end side of the harness 7 is soldered to the edge part of the circuit pattern, and LED4 of the board | substrate 3 is connected to an external power supply via a circuit pattern and the harness 7. The The optical axis 17 here means the center of the three-dimensional outgoing light beam from the LED 4.

また、基板３には、光束制御部材５の第１の位置決め突起１５に微小な隙間で係合する第１の位置決め穴（丸穴）１６が形成されている。そして、基板３には第１の位置決め穴１６を基準としてＬＥＤ４が取り付けられており、ＬＥＤ４の光軸１７が基板３の平面図における中央Ｃに位置するように位置決めされている。また、基板３には、光束制御部材５の第２の位置決め突起１８に係合する第２の位置決め穴２０が形成されている。この第２の位置決め穴１８は、図８に詳細を示すように、基板３の中央Ｃを通りＹ軸に平行な線に対して、第１の位置決め穴１６とほぼ左右対称の位置に形成されており、第１の位置決め穴１６の中心からＸ方向へ延ばした延長線（第１の位置決め突起１５と第２の位置決め突起１８とを結んだ線）に沿って形成されており、基板３の端縁側に開口するようになっている。そして、この第２の位置決め穴２０は、第２の位置決め突起１８とのＹ方向に沿った隙間が僅かであり、第２の位置決め突起１８のＹ方向への位置決めを行い、第２の位置決め突起１８のＸ方向への相対移動を許容するようになっている。   Further, the substrate 3 is formed with a first positioning hole (round hole) 16 that engages with the first positioning protrusion 15 of the light flux controlling member 5 with a minute gap. The LED 4 is attached to the substrate 3 with the first positioning hole 16 as a reference, and the optical axis 17 of the LED 4 is positioned so as to be positioned at the center C in the plan view of the substrate 3. The substrate 3 is formed with a second positioning hole 20 that engages with the second positioning protrusion 18 of the light flux controlling member 5. As shown in detail in FIG. 8, the second positioning hole 18 is formed at a position substantially symmetrical to the first positioning hole 16 with respect to a line passing through the center C of the substrate 3 and parallel to the Y axis. Are formed along an extension line extending from the center of the first positioning hole 16 in the X direction (a line connecting the first positioning protrusion 15 and the second positioning protrusion 18). It opens to the edge side. The second positioning hole 20 has a small gap along the Y direction with the second positioning protrusion 18, and positions the second positioning protrusion 18 in the Y direction. The relative movement of 18 in the X direction is allowed.

また、基板３は、図１（ａ）、図２、図８に示すように、一つの対角線１３ａ上に位置する一対のコーナー部分に、ねじ２１に螺合する雌ねじ２２がそれぞれ形成され、他の対角線１３ｂ上に位置する一対のコーナー部分に、ねじ２３の軸部に隙間をもって係合するねじ穴２４がそれぞれ形成されている。   Further, as shown in FIGS. 1 (a), 2 and 8, the substrate 3 is formed with female screws 22 which are screwed into screws 21 at a pair of corner portions located on one diagonal line 13a. Screw holes 24 are formed in a pair of corner portions located on the diagonal line 13b of the screw 23 to engage with the shaft portion of the screw 23 with a gap.

このような本実施形態の基板３によれば、熱伝導性に優れた金属板１１の裏面１１ｂが露出する構成であるため、ＬＥＤ４の熱を効率的に外部に放熱することが可能である。なお、基板３は、ＬＥＤ４の放熱が必要な程度やコスト等を考慮して、金属板に代えて、樹脂板を使用してもよい。   According to the substrate 3 of this embodiment, since the back surface 11b of the metal plate 11 having excellent thermal conductivity is exposed, the heat of the LED 4 can be efficiently radiated to the outside. In addition, the board | substrate 3 may replace with a metal plate and may use a resin board in consideration of the grade and cost etc. which require the radiation | emission of LED4.

また、本実施形態の基板３は、第１及び第２の位置決め穴１６，２０を金属板１１の表面１１ａから裏面１１ｂに貫通させる態様であるため、第１及び第２の位置決め穴１６，２０を金属板１１の表面１１ａから裏面１１ｂに貫通させない態様に比較し、加工作業が容易化し、製造コストを低廉化することができる。   Moreover, since the board | substrate 3 of this embodiment is the aspect which penetrates the 1st and 2nd positioning holes 16 and 20 from the surface 11a of the metal plate 11 to the back surface 11b, it is the 1st and 2nd positioning holes 16 and 20. Compared with a mode in which the metal plate 11 is not penetrated from the front surface 11a to the back surface 11b, the processing operation is facilitated and the manufacturing cost can be reduced.

なお、基板３の線膨張係数が光束制御部材５と略等しい場合には、第２の位置決め穴２０の形状を長穴にする必要はなく、組立時の位置精度を考慮したクリアランスを有する丸穴として形成してもよい。   When the linear expansion coefficient of the substrate 3 is substantially equal to that of the light flux controlling member 5, the second positioning hole 20 does not need to be a long hole, and a round hole having a clearance in consideration of positional accuracy during assembly. You may form as.

（光束制御部材）
光束制御部材５は、光透過性に優れたＰＭＭＡ（ポリメタクリル酸メチル）、ＰＣ（ポリカーボネート）、ＣＯＰ（シクロオレフィン）、シリコーン等の樹脂材料で形成されている。また、これらの樹脂材料には、光束制御機能を損なわない程度の散乱子が含まれていてもよい。この光束制御部材５は、図９乃至図１５に示すように、平面形状がほぼ四角形の部品収容部２５と、この部品収容部２５の上部に一体に形成された平面形状が円形のレンズ部２６とを有している。 (Flux control member)
The light flux controlling member 5 is formed of a resin material such as PMMA (polymethyl methacrylate), PC (polycarbonate), COP (cycloolefin), or silicone having excellent light transmittance. These resin materials may contain scatterers to the extent that the light flux control function is not impaired. As shown in FIGS. 9 to 15, the light flux controlling member 5 includes a component housing portion 25 having a substantially square planar shape, and a lens portion 26 having a circular planar shape integrally formed on the upper portion of the component housing portion 25. And have.

部品収容部２５は、基板３を収容する凹み空間２７が形成されている。この部品収容部２５の凹み空間２７は、基板３の外縁３ａを所定の隙間をもって囲む外縁部分８によって形作られている。そして、この部品収容部２５内には、基板３の表面（１１ａ）を突き当てて、基板３とレンズ部２６との間隔が所定寸法になるように基板３を位置決めする基板突き当て部分２８が形成されている。   The component housing part 25 is formed with a recessed space 27 for housing the substrate 3. The recessed space 27 of the component housing portion 25 is formed by the outer edge portion 8 surrounding the outer edge 3a of the substrate 3 with a predetermined gap. And in this component accommodating part 25, the board | substrate abutting part 28 which abuts the surface (11a) of the board | substrate 3 and positions the board | substrate 3 so that the space | interval of the board | substrate 3 and the lens part 26 may become a predetermined dimension. Is formed.

基板突き当て部分２８は、部品収容部２６の外縁部分８の内側に位置しており、外縁部分８に対して所定の間隔をあけて且つ外縁部分８にほぼ沿うように、上部壁部分３０からリブ状に突出形成されている。また、この基板突き当て部分２８は、図９（ａ）、図１０及び図１５に示すように、部品収容部２５の４コーナー部分に形成された円筒状のねじ挿入筒部分３１を隙間をもって取り囲むように内側に張り出している。   The board abutting portion 28 is located on the inner side of the outer edge portion 8 of the component accommodating portion 26, and is spaced from the upper edge portion 30 so as to be spaced apart from the outer edge portion 8 and substantially along the outer edge portion 8. It is formed to protrude in the shape of a rib. Further, as shown in FIGS. 9A, 10, and 15, the board abutting portion 28 surrounds the cylindrical screw insertion cylinder portion 31 formed at the four corner portions of the component housing portion 25 with a gap. So that it overhangs inside.

また、部品収容部２５は、基板３の第１の位置決め穴１６に係合する第１の位置決め突起１５が上部壁部分（基板３に対向する面）３０から突出するように形成されると共に、基板３の第２の位置決め穴２０に係合する第２の位置決め突起１８が上部壁部分３０から突出するように形成されている。そして、基板突き当て部分２８は、第１の位置決め突起１５を所定の隙間をもって取り囲むように内側に張り出すと共に、第２の位置決め突起１８を所定の隙間をもって取り囲むように内側に張り出すように形成されている。   The component housing portion 25 is formed such that the first positioning projection 15 that engages with the first positioning hole 16 of the substrate 3 protrudes from the upper wall portion (surface facing the substrate 3) 30. A second positioning protrusion 18 that engages with the second positioning hole 20 of the substrate 3 is formed so as to protrude from the upper wall portion 30. The substrate abutting portion 28 is formed so as to protrude inward so as to surround the first positioning protrusion 15 with a predetermined gap and to protrude inward so as to surround the second positioning protrusion 18 with a predetermined gap. Has been.

また、部品収容部２５は、図１０に示すように、第１の位置決め突起１５を挟むように、一対のハーネス先端側保持部分３２が形成されると共に、第２の位置決め突起１８を挟むように、一対のハーネス先端側保持部分３２が形成されている。このハーネス先端側保持部分３２は、基板突き当て部分２８から内側へ向かって張り出すように形成されており、その先端部分にハーネス７の導線１４に隙間をもって係合する導線係合溝３３が形成されている（図３及び図４参照）。なお、基板突き当て部分２８には、ハーネス７の外周に僅かな隙間をもって係合するハーネス係合溝３４が形成されている（図３及び図４参照）。また、ハーネス先端側保持部分３２は、導線係合溝３３とハーネス係合溝３４との間において、ハーネス７との間に空間３５が生じるようになっている（図３及び図４参照）。   Further, as shown in FIG. 10, the component housing portion 25 is formed with a pair of harness tip side holding portions 32 so as to sandwich the first positioning protrusion 15 and sandwiching the second positioning protrusion 18. A pair of harness tip side holding portions 32 is formed. The harness tip side holding portion 32 is formed so as to protrude inward from the board abutting portion 28, and a lead wire engaging groove 33 that engages with the lead wire 14 of the harness 7 with a gap is formed at the tip portion. (See FIG. 3 and FIG. 4). The board abutting portion 28 is formed with a harness engaging groove 34 that engages with the outer periphery of the harness 7 with a slight gap (see FIGS. 3 and 4). In addition, a space 35 is formed between the harness distal end holding portion 32 and the harness 7 between the conductor engaging groove 33 and the harness engaging groove 34 (see FIGS. 3 and 4).

また、部品収容部２５の外縁部分８には、基板３に半田付けされたハーネス７をＸ方向に沿って引き出すことができる引き出し溝１０が光束制御部材５の裏面側に開口するように形成されている。そして、このハーネス７の引き出し溝１０が形成された外縁部分８には、引き出し溝１０に対応するように、ハーネス保持部分３６が形成されている。このハーネス保持部分３６には、ハーネス７と部品収容部２５の外縁部分８との隙間をシールするシーリング材３７を保持するための空間３８が形成されている。また、ハーネス保持部分３６は、光束制御部材５の裏面側に開口するハーネス挿入溝３６ａが形成されると共に、ハーネス支持突起３６ｂが形成されている。ハーネス保持部分３６のハーネス挿入溝３６ａは、引き出し溝１０に湾曲した状態で接続され、湾曲させたハーネス７を空間３８内に挿入することができる溝幅寸法に形成されている。また、ハーネス保持部分３６のハーネス支持突起３６ｂは、湾曲させた状態で空間３８内に係合させたハーネス７を真っ直ぐに（ハーネス係合溝３４及び引き出し溝１０に係合されたハーネス７を一直線状に）伸ばすと、その真っ直ぐに伸ばしたハーネス７を光束制御部材５の裏面側から支持することができるようになっている。ここで、シーリング材３７は、シーリング材収容溝４０内に注入される際には流動性を有し、シーリング材収容溝４０内へ注入した後に常温で所定時間放置すると固化する材料であり、例えば、ＥＶＡ（エチレン酢酸ビニル共重合体），ＰＡ（ポリアミド），ＳＲ（合成ゴム）等のホットメルト接着剤やシリコーン等が使用される。   In addition, the outer edge portion 8 of the component housing portion 25 is formed with a lead groove 10 through which the harness 7 soldered to the substrate 3 can be pulled out along the X direction so as to open to the back surface side of the light flux controlling member 5. ing. And the harness holding part 36 is formed in the outer edge part 8 in which the drawer groove 10 of this harness 7 was formed so as to correspond to the drawer groove 10. The harness holding portion 36 is formed with a space 38 for holding a sealing material 37 that seals a gap between the harness 7 and the outer edge portion 8 of the component housing portion 25. In addition, the harness holding portion 36 is formed with a harness insertion groove 36 a that opens on the back side of the light flux controlling member 5 and a harness support protrusion 36 b. The harness insertion groove 36 a of the harness holding portion 36 is connected to the lead-out groove 10 in a curved state, and is formed in a groove width dimension that allows the curved harness 7 to be inserted into the space 38. In addition, the harness support protrusion 36b of the harness holding portion 36 straightens the harness 7 engaged in the space 38 in a curved state (the harness 7 engaged with the harness engagement groove 34 and the extraction groove 10 is straight). When it is extended, the straightened harness 7 can be supported from the back side of the light flux controlling member 5. Here, the sealing material 37 is a material that has fluidity when injected into the sealing material accommodation groove 40 and solidifies when left in the room temperature for a predetermined time after being injected into the sealing material accommodation groove 40. Hot melt adhesives such as EVA (ethylene vinyl acetate copolymer), PA (polyamide), SR (synthetic rubber), silicone, and the like are used.

このように形成された部品収容部２５は、外縁部分８と基板突き当て部分２８との間の溝（シーリング材収容溝）４０にシーリング材３７が注入されると、シーリング材が溝４０内を満たすと共に、ハーネス７とハーネス係合溝３４との隙間に浸入し、また、引き出し溝１０とハーネス７との隙間からハーネス保持部分３６の空間３８内に浸入する。その結果、基板３と光束制御部材５との隙間、ハーネス７とハーネス係合溝３４との隙間、及びハーネス７と引き出し溝１０との隙間がシーリング材によってシールされ、雨水，雨滴，塵等が発光装置１の内部に入り込むのを防止できる（図１（ｄ）、図２〜図４、図１０、及び図１６参照）。なお、ハーネス先端側保持部分３２の空間３５は、シーリング材３７が導線係合溝３３を越えて内部空間へ漏出するのを阻止する容積を有している。   When the sealing material 37 is injected into the groove (sealing material accommodation groove) 40 between the outer edge portion 8 and the board abutting portion 28, the component housing portion 25 formed in this way is sealed in the groove 40. It fills and enters the gap between the harness 7 and the harness engaging groove 34 and enters the space 38 of the harness holding portion 36 through the gap between the pull-out groove 10 and the harness 7. As a result, the gap between the substrate 3 and the light flux controlling member 5, the gap between the harness 7 and the harness engaging groove 34, and the gap between the harness 7 and the drawing groove 10 are sealed by the sealing material, so that rainwater, raindrops, dust, etc. It can prevent entering the inside of the light-emitting device 1 (refer FIG.1 (d), FIGS. 2-4, FIG. 10, and FIG. 16). In addition, the space 35 of the harness distal end side holding portion 32 has a volume that prevents the sealing material 37 from leaking into the internal space beyond the conductor engaging groove 33.

また、このように形成された部品収容部２５は、全体が同一の肉厚となるように、外縁部分８、基板突き当て部分２８、上部壁部分３０、ハーネス先端側保持部分３２、ハーネス保持部分３６がほぼ同一の肉厚となるように形成されている。これにより、光束制御部材５が射出成形で形成された場合に、成形後の収縮に伴う歪みを生じにくく、光束制御部材５の形状精度を高精度化することが可能になる。   Moreover, the component accommodating part 25 formed in this way has the outer edge part 8, the board | substrate abutting part 28, the upper wall part 30, the harness front end side holding part 32, and the harness holding part so that the whole becomes the same thickness. 36 is formed to have substantially the same thickness. Thereby, when the light beam control member 5 is formed by injection molding, it is difficult to cause distortion due to shrinkage after molding, and the shape accuracy of the light beam control member 5 can be increased.

レンズ部２６は、その出射面（表面）４１の平面形状が円形に形成されている。このレンズ部２６の出射面４１は、基板３の表面（１１ａ）と平行となるように形成された平坦な面である（図５参照）。また、レンズ部２６は、その裏面４２（部品収容部２５に収容された基板３に対向する面）側に、基板３上のＬＥＤ４に対向する凹み４３が形成されている（図５参照）。この凹み４３は、ＬＥＤ４の光軸１７を中心とするように球面状に形成されており、その中心軸がＬＥＤ４の光軸１７の延長線に合致するレンズ部２６の光軸４４である（図５参照）。そして、この凹み４３は、その光軸４４を中心とする球面状の第１の入光面４５と、この第１の入光面４５の周縁を滑らかにレンズ部２６の平坦な裏面４２側に接続する第２の入光面４６とからなっている（図５参照）。このうち、第１の入光面４５は、ＬＥＤ４から遠ざかる方向に凸の凹曲面形状であり、光軸４４に沿った断面形状が光軸４４を中心とする対称形状である。また、第２の入光面４６は、第１の入光面４５とほぼ逆方向に凸の曲面形状に形成されている。その結果、凹み４３は、第１の入光面４５と第２の入光面４６との接続部分が変曲点になる。ここで、ＬＥＤ４の光軸１７上において、ＬＥＤ４の出射光の強度が最大強度になるように構成されている。また、凹み４３は、ＬＥＤ４から出射される光のうちで、少なくとも最大強度の光が出射される方向（光軸１７に沿った方向であって、光束制御部材５の出射面４１の法線方向に沿った方向）から最大強度の半分の値となる光が出射される方向までの角度範囲の光が入射できるように形成されている。   The lens part 26 has a light emitting surface (front surface) 41 having a circular planar shape. The exit surface 41 of the lens portion 26 is a flat surface formed so as to be parallel to the surface (11a) of the substrate 3 (see FIG. 5). Further, the lens portion 26 has a recess 43 facing the LED 4 on the substrate 3 on the back surface 42 (surface facing the substrate 3 housed in the component housing portion 25) (see FIG. 5). The recess 43 is formed in a spherical shape so as to be centered on the optical axis 17 of the LED 4, and the central axis is the optical axis 44 of the lens portion 26 that coincides with an extension line of the optical axis 17 of the LED 4 (see FIG. 5). The recess 43 has a spherical first light incident surface 45 centered on the optical axis 44 and the periphery of the first light incident surface 45 smoothly on the flat rear surface 42 side of the lens portion 26. It consists of a second light incident surface 46 to be connected (see FIG. 5). Among these, the first light incident surface 45 is a concave curved surface shape convex in a direction away from the LED 4, and a cross-sectional shape along the optical axis 44 is a symmetric shape centering on the optical axis 44. Further, the second light incident surface 46 is formed in a curved surface shape that is convex in a direction almost opposite to the first light incident surface 45. As a result, the recess 43 has an inflection point at the connection portion between the first light incident surface 45 and the second light incident surface 46. Here, on the optical axis 17 of LED4, it is comprised so that the intensity | strength of the emitted light of LED4 may become the maximum intensity | strength. Further, the recess 43 is a direction in which at least the light having the maximum intensity is emitted among the light emitted from the LED 4 (the direction along the optical axis 17 and the normal direction of the emission surface 41 of the light flux controlling member 5). In the angle range from the direction along the direction to the direction in which the light having a value half the maximum intensity is emitted.

このような光束制御部材５は、凹み４３から内部に入射したＬＥＤ４からの光を、出射面４１から外部（空気中）に向けてスネルの法則に従って出射することになるが、凹み４３を形成しない場合に比較して、光束を十分に拡げて出射することが可能になる（図５参照）。   Such a light flux controlling member 5 emits light from the LED 4 that has entered the interior from the recess 43 toward the outside (in the air) from the exit surface 41 according to Snell's law, but does not form the recess 43. Compared to the case, the light beam can be emitted after being sufficiently expanded (see FIG. 5).

レンズ部２６の形状は、本実施の形態に限られず、ＬＥＤ４からの光を制御して出射するものであればよく、凹み４３が出射面４１と裏面４２の両側、或いは出射面４１側のみに形成されていてもよい。また、レンズ部２６のレンズとしては、拡散レンズに限られず、凸面が形成された集光レンズでもよい。   The shape of the lens portion 26 is not limited to the present embodiment, and any shape may be used as long as the light from the LED 4 is controlled and emitted, and the dent 43 is formed on both sides of the emission surface 41 and the back surface 42 or only on the emission surface 41 side. It may be formed. Further, the lens of the lens unit 26 is not limited to the diffusion lens, and may be a condensing lens having a convex surface.

（発光装置の組立方法）
まず、基板３の中央Ｃには、ＬＥＤ４の光軸１７が位置するように、基板３の第１の位置決め穴１６を基準としてＬＥＤ４を取り付ける（図８参照）。 (Assembly method of light emitting device)
First, the LED 4 is attached to the center C of the substrate 3 on the basis of the first positioning hole 16 of the substrate 3 so that the optical axis 17 of the LED 4 is positioned (see FIG. 8).

次に、基板３の表面（１１ａ）に形成した回路パターンのハーネス取付部４７には、ハーネス７の導線１４の先端部を半田付けする（図６乃至図８参照）。なお、本実施形態においては、ＬＥＤ４を中心にして、基板３の左右対称の位置に、合計４本のハーネス７が半田付けされる。   Next, the tip end portion of the conductor 14 of the harness 7 is soldered to the harness mounting portion 47 of the circuit pattern formed on the surface (11a) of the substrate 3 (see FIGS. 6 to 8). In the present embodiment, a total of four harnesses 7 are soldered to symmetrical positions of the substrate 3 with the LED 4 as the center.

次に、光束制御部材５の第１の位置決め突起１５を基板３の第１の位置決め穴１６に係合すると共に、光束制御部材５の第２の位置決め突起１８を基板３の第２の位置決め穴２０に係合しながら、基板３の表面（１１ａ）が光束制御部材５の基板突き当て部分２８に当接するまで、基板３が光束制御部材５の部品収容部２５内に収容される（図７、図１０、図１６参照）。この際、ハーネス７は、光束制御部材５の導線係合溝３３，ハーネス係合溝３４、引き出し溝１０、及びハーネス保持部分３６のハーネス挿入溝３６ａに、光束制御部材５の裏面側（下方側）から係合される（図３、図４、図７、図１０、図１６参照）。これにより、基板３と光束制御部材５とが位置決めされ、基板３のＬＥＤ４の光軸１７と光束制御部材５のレンズ部２６の光軸４４が合致するように位置合わせされる。また、基板３と光束制御部材５とがＬＥＤ４の光軸１７が延びる方向に沿って位置決めされ、光束制御部材５のレンズ部２６がＬＥＤ４に対して光軸１７が延びる方向に沿って位置決めされることになる。ここで、基板３と光束制御部材５の製造誤差は、第２の位置決め穴２０を長穴とすることにより吸収することができるようになっている。   Next, the first positioning protrusion 15 of the light beam control member 5 is engaged with the first positioning hole 16 of the substrate 3, and the second positioning protrusion 18 of the light beam control member 5 is engaged with the second positioning hole of the substrate 3. The substrate 3 is accommodated in the component accommodating portion 25 of the light flux controlling member 5 until the surface (11a) of the substrate 3 abuts against the substrate abutting portion 28 of the light flux controlling member 5 while engaging with 20 (FIG. 7). FIG. 10 and FIG. 16). At this time, the harness 7 is inserted into the conductor engaging groove 33, the harness engaging groove 34, the drawing groove 10 of the light flux controlling member 5, and the harness insertion groove 36 a of the harness holding portion 36. (See FIGS. 3, 4, 7, 10, and 16). Thereby, the board | substrate 3 and the light beam control member 5 are positioned, and it aligns so that the optical axis 17 of LED4 of the board | substrate 3 and the optical axis 44 of the lens part 26 of the light beam control member 5 may correspond. Further, the substrate 3 and the light flux controlling member 5 are positioned along the direction in which the optical axis 17 of the LED 4 extends, and the lens portion 26 of the light flux controlling member 5 is positioned with respect to the LED 4 along the direction in which the optical axis 17 extends. It will be. Here, a manufacturing error between the substrate 3 and the light flux controlling member 5 can be absorbed by making the second positioning hole 20 a long hole.

次に、ねじ２１を光束制御部材５の対角線上に位置する一対のねじ挿入筒部分３１に挿入し、そのねじ２１の雄ねじを基板３の雌ねじ２２に螺合し、光束制御部材５と基板３を２本のねじ２１で締め付け固定する（図１（ａ）、図２、図７、図９（ａ）、図１５、図１６参照）。次に、基板３の外縁３ａと光束制御部材５の外縁部分８との間に隙間４８が形成されるので、その隙間４８からシーリング材３７を注入する（図１（ｄ）参照）。シーリング材３７は、シーリング材収容溝４０内に注入され、光束制御部材５と基板３との隙間をシールすると共に、光束制御部材５のハーネス係合溝３４及び引き出し溝１０におけるハーネス７との隙間をシールする（図２乃至図４、図１６参照）。また、シーリング材収容溝４０内に注入されたシーリング材３７は、第１の位置決め突起１５と第１の位置決め穴１６との隙間をシールすると共に、第２の位置決め突起１８と第２の位置決め穴２０との隙間をシールする（図１（ｄ）、図４、図１６参照）。また、シーリング材収容溝４０内に注入されたシーリング材３７は、引き出し溝１０からハーネス保持部分３６に流出して、ハーネス７をハーネス保持部分３６に固定する（図１（ｄ）、図３及び図４参照）。さらに、シーリング材収容溝４０内に注入されたシーリング材３７は、ねじ挿入筒部分３１を囲繞するようにシールし、ねじ挿入筒部分３１を介して雨水、雨滴、塵等が基板３と光束制御部材５との間の空間内に侵入するのを阻止する。   Next, the screw 21 is inserted into a pair of screw insertion cylinder portions 31 positioned on the diagonal line of the light flux control member 5, and the male screw of the screw 21 is screwed into the female screw 22 of the substrate 3. Is tightened and fixed with two screws 21 (see FIG. 1A, FIG. 2, FIG. 7, FIG. 9A, FIG. 15 and FIG. 16). Next, since a gap 48 is formed between the outer edge 3a of the substrate 3 and the outer edge portion 8 of the light flux controlling member 5, the sealing material 37 is injected from the gap 48 (see FIG. 1D). The sealing material 37 is injected into the sealing material accommodation groove 40 to seal the gap between the light flux controlling member 5 and the substrate 3, and between the harness engaging groove 34 of the light flux controlling member 5 and the harness 7 in the drawing groove 10. Is sealed (see FIGS. 2 to 4 and 16). Further, the sealing material 37 injected into the sealing material accommodation groove 40 seals the gap between the first positioning projection 15 and the first positioning hole 16, and also the second positioning projection 18 and the second positioning hole. 20 is sealed (see FIG. 1D, FIG. 4 and FIG. 16). Further, the sealing material 37 injected into the sealing material accommodation groove 40 flows out from the drawing groove 10 to the harness holding portion 36, and fixes the harness 7 to the harness holding portion 36 (FIGS. 1D, 3 and (See FIG. 4). Further, the sealing material 37 injected into the sealing material receiving groove 40 is sealed so as to surround the screw insertion tube portion 31, and rainwater, raindrops, dust, etc. are controlled by the screw insertion tube portion 31 through the light flux control with the substrate 3. Intrusion into the space between the members 5 is prevented.

このようにして、シーリング材３７は、基板３と光束制御部材５との間の空間内に雨水等が侵入しないようにシールし、基板３上の回路パターンやＬＥＤ４等が雨水等に晒されるのを防止することができる。   In this way, the sealing material 37 seals the rainwater and the like so as not to enter the space between the substrate 3 and the light flux controlling member 5, and the circuit pattern, the LED 4 and the like on the substrate 3 are exposed to the rainwater and the like. Can be prevented.

（本実施形態に係る発光装置の効果）
以上のように、本実施形態の発光装置１は、光束制御部材５の第１の位置決め突起１５を基板３の第１の位置決め穴１６に係合し、光束制御部材５の第２の位置決め突起１８を基板３の第２の位置決め穴２０に係合することにより、基板３に取り付けたＬＥＤ４の光軸１７に光束制御部材５のレンズ部２６の光軸４４を合致させることができるため、ＬＥＤ４の光軸１７とレンズ部２６の光軸４４のずれに起因する照明光の明るさのバラツキを生じることがなく、均一な照明光の出射が可能になる。 (Effect of the light emitting device according to this embodiment)
As described above, in the light emitting device 1 of this embodiment, the first positioning protrusion 15 of the light flux controlling member 5 is engaged with the first positioning hole 16 of the substrate 3, and the second positioning protrusion of the light flux controlling member 5 is engaged. By engaging 18 with the second positioning hole 20 of the substrate 3, the optical axis 44 of the lens portion 26 of the light flux controlling member 5 can be aligned with the optical axis 17 of the LED 4 attached to the substrate 3. The illumination light does not vary due to the deviation between the optical axis 17 and the optical axis 44 of the lens unit 26, and uniform illumination light can be emitted.

また、本実施形態の発光装置１は、光束制御部材５と基板３との隙間をシーリング材３７でシールすることができると共に、光束制御部材５及び基板３とハーネス７との隙間をシーリング材３７でシールし、光束制御部材５と基板３との間の内部空間内に雨水や塵等が侵入するのを少ない部品点数で確実に防止することができる。   In the light emitting device 1 of the present embodiment, the gap between the light flux controlling member 5 and the substrate 3 can be sealed with the sealing material 37, and the gap between the light flux controlling member 5 and the substrate 3 and the harness 7 is sealed with the sealing material 37. Thus, it is possible to reliably prevent rainwater, dust and the like from entering the internal space between the light flux controlling member 5 and the substrate 3 with a small number of parts.

したがって、本実施形態の発光装置１は、風雨や埃に晒される屋内外において、長期間に亘り、均一な照明光を出射することができる。   Therefore, the light emitting device 1 of the present embodiment can emit uniform illumination light for a long period of time indoors and outdoors exposed to wind and rain and dust.

なお、上記実施形態によれば、基板３の外縁３ａがシーリング材収容溝４０内に出っ張るようになっており、シーリング材収容溝４０内にシーリング材３７を注入すると、シーリング材３７が基板３の外縁３ａに沿った表面（１１ａ）に密着し、光束制御部材５と基板３とをシーリング材３７で固定することが可能になる。したがって、発光装置１を組み立てる際に、基板３を光束制御部材５の基板突き当て部分３８に押し付けた状態で、シーリング材３７をシーリング材収容溝４０内に注入すれば、基板３と光束制御部材５をねじ２１で固定しなくてもよい。   According to the above embodiment, the outer edge 3 a of the substrate 3 protrudes into the sealing material accommodation groove 40, and when the sealing material 37 is injected into the sealing material accommodation groove 40, the sealing material 37 is attached to the substrate 3. It is possible to fix the light flux controlling member 5 and the substrate 3 with the sealing material 37 in close contact with the surface (11a) along the outer edge 3a. Accordingly, when the light emitting device 1 is assembled, if the sealing material 37 is injected into the sealing material receiving groove 40 in a state where the substrate 3 is pressed against the substrate abutting portion 38 of the light flux controlling member 5, the substrate 3 and the light flux controlling member 5 may not be fixed with the screw 21.

また、上記実施形態において例示した各材料名や各数値は、発明内容の理解を助けるためのものであり、これらに限定されるものではない。   Moreover, each material name illustrated in the said embodiment and each numerical value are for helping an understanding of the content of an invention, and are not limited to these.

（照明装置）
図１７乃至図１８は、本発明に係る照明装置５０を示すものである。このうち、図１７は、被照明部材を取り除いて示す照明装置５０の平面図を示すものである。また、図１８は、照明装置５０の正面図を示すものである。 (Lighting device)
17 to 18 show an illumination device 50 according to the present invention. Among these, FIG. 17 shows a plan view of the illuminating device 50 shown with the member to be illuminated removed. FIG. 18 is a front view of the lighting device 50.

これらの図に示すように、照明装置５０は、取付板２等の平面２ａ上に複数の発光装置１を所定の間隔で並べ、これら隣り合う発光装置１をハーネス７で接続し、複数の発光装置１から同時に照明光を出射し、広告パネルや液晶表示パネル等の被照明部材５１を面状に照明することができる。   As shown in these drawings, the lighting device 50 has a plurality of light emitting devices 1 arranged on a plane 2a such as the mounting plate 2 at a predetermined interval, and these adjacent light emitting devices 1 are connected by a harness 7 to emit a plurality of light emission. Illumination light can be emitted simultaneously from the device 1 to illuminate the illuminated member 51 such as an advertising panel or a liquid crystal display panel in a planar shape.

この照明装置５０を構成する発光装置１は、上述したように、シール性にすぐれた防水構造・防塵構造であるため、屋内外で使用でき、且つ、基板３のＬＥＤ４の光軸１７と光束制御部材５のレンズ部２６の光軸４４とを位置決めできるため、均一な照明光を出射することができる。その結果、本実施形態に係る照明装置５０は、屋内外において、長期間に亘り、均一な面状照明が可能である。   As described above, the light-emitting device 1 constituting the lighting device 50 has a waterproof structure and a dust-proof structure with excellent sealing properties. Since the optical axis 44 of the lens portion 26 of the member 5 can be positioned, uniform illumination light can be emitted. As a result, the illumination device 50 according to the present embodiment can perform uniform surface illumination over a long period of time indoors and outdoors.

また、本実施形態において、発光装置１の基板３を構成する金属板１１を光束制御部材５の部品収容部２５から出っ張らせ、その発光装置１を金属製の取付板２にねじ２３で固定し、基板３と取付板２とを密接させることにより、ＬＥＤ４の熱を基板３から取付板２へ伝熱し、取付板２を介して外部へ放熱することができる（図２参照）。その結果、本実施形態によれば、発光装置１の温度上昇を抑えることができ、発光装置１の耐久性を向上させることができる。   In the present embodiment, the metal plate 11 constituting the substrate 3 of the light emitting device 1 protrudes from the component housing portion 25 of the light flux controlling member 5, and the light emitting device 1 is fixed to the metal mounting plate 2 with screws 23. By bringing the substrate 3 and the mounting plate 2 into close contact, the heat of the LED 4 can be transferred from the substrate 3 to the mounting plate 2 and radiated to the outside through the mounting plate 2 (see FIG. 2). As a result, according to this embodiment, the temperature rise of the light emitting device 1 can be suppressed, and the durability of the light emitting device 1 can be improved.

なお、取付板２は、熱伝導性に優れた金属で形成され、熱伝達を促進することができるように、外気との接触面積を大きくし得る形状（例えば、凹凸形状）に形成されることが好ましい。   The mounting plate 2 is formed of a metal having excellent thermal conductivity, and is formed in a shape (for example, an uneven shape) that can increase the contact area with the outside air so that heat transfer can be promoted. Is preferred.

また、発光装置１の取付板２への固定は、ねじ２３を用いず、両面テープを使用してもよい。   Further, the light emitting device 1 may be fixed to the mounting plate 2 without using the screw 23 and using a double-sided tape.

（位置決め突起と位置決め穴の変形例）
図１９（ａ）及び図１９（ｂ）と図２０を参照して、本発明の発光装置１に係る位置決め突起１５，１８とこれに係合する位置決め穴１６，２０の形成位置の変形例について説明する。 (Modification of positioning protrusion and positioning hole)
19 (a) and 19 (b) and FIG. 20, a modification of the formation positions of the positioning protrusions 15 and 18 and the positioning holes 16 and 20 engaged therewith according to the light emitting device 1 of the present invention. explain.

なお、以下では、上記実施形態の発光装置１と同様の構成には同一符号を付し、上記実施形態の説明と重複することになる説明を省略する。図１９（ａ）は、発光装置１の裏面図である。図１９（ｂ）は、基板３を取り除いて示す発光装置１の裏面図である。図２０は、基板３の裏面図である。   In the following description, the same components as those of the light emitting device 1 of the above embodiment are denoted by the same reference numerals, and the description that overlaps the description of the above embodiment is omitted. FIG. 19A is a rear view of the light emitting device 1. FIG. 19B is a back view of the light-emitting device 1 shown with the substrate 3 removed. FIG. 20 is a rear view of the substrate 3.

図１９（ａ）及び図１９（ｂ）を参照して、第１の位置決め突起１５と第２の位置決め突起１８を説明する。図１９（ａ）及び図１９（ｂ）に示す通り、光束制御部材５の部品収容部２５には、基板３の第１の位置決め穴１６に係合する第１の位置決め突起１５が、上部壁部分３０（図１０参照）から突出するように形成される。また、光束制御部材５の部品収容部２５には、基板３の第２の位置決め穴２０に係合する第２の位置決め突起１８が、上部壁部分３０から突出するように形成されている。   The first positioning protrusion 15 and the second positioning protrusion 18 will be described with reference to FIGS. 19 (a) and 19 (b). As shown in FIG. 19A and FIG. 19B, the component positioning portion 25 of the light flux controlling member 5 has a first positioning protrusion 15 that engages with the first positioning hole 16 of the board 3. It forms so that it may protrude from the part 30 (refer FIG. 10). Further, a second positioning protrusion 18 that engages with the second positioning hole 20 of the substrate 3 is formed in the component housing portion 25 of the light flux controlling member 5 so as to protrude from the upper wall portion 30.

第１の位置決め突起１５と第２の位置決め突起１８とは、それぞれの位置決め突起１５，１８の中心を結ぶ直線が、光束制御部材５の対角線の交点Ｃ２（対角線の交点Ｃ２は、レンズ部２６の光軸４４と合致する）で交わり、且つ、交点Ｃ２から第１の位置決め突起１５までの距離と交点Ｃ２から第２の位置決め突起１８までの距離とが等しくなっている。   The first positioning projection 15 and the second positioning projection 18 are such that the straight line connecting the centers of the positioning projections 15 and 18 is the intersection C2 of the diagonal line of the light beam control member 5 (the intersection C2 of the diagonal line is the And the distance from the intersection C2 to the first positioning projection 15 is equal to the distance from the intersection C2 to the second positioning projection 18.

以上に説明した位置に形成される第１の位置決め突起１５と第２の位置決め突起１８は、対角線の交点Ｃ２を対称の中心として、点対称の位置に形成されている。   The first positioning protrusions 15 and the second positioning protrusions 18 formed at the positions described above are formed at point-symmetric positions with the intersection C2 of the diagonal line as the center of symmetry.

図２０を参照して、第１の位置決め穴１６と第２の位置決め穴２０を説明する。図２０に示す通り、基板３には、光束制御部材５の第１の位置決め突起１５に微小な隙間で係合する第１の位置決め穴１６が形成されている。第１の位置決め穴１６は、丸穴となっている。   The first positioning hole 16 and the second positioning hole 20 will be described with reference to FIG. As shown in FIG. 20, the substrate 3 has a first positioning hole 16 that engages with the first positioning protrusion 15 of the light flux controlling member 5 with a minute gap. The first positioning hole 16 is a round hole.

そして、第１の位置決め穴１６の中心Ｐ１と基板３の中央Ｃとを結ぶ線（以下、Ｌ１線という）の延長上には、第２の位置決め穴２０が、基板３の中央Ｃから離れる方向に開口するように略Ｕ字状に切り欠きされて形成されている。この第２の位置決め穴２０は、円弧状部と直線部とを有し、直線部分はＬ１線に対して平行となっている。   A direction in which the second positioning hole 20 is separated from the center C of the substrate 3 on an extension of a line connecting the center P1 of the first positioning hole 16 and the center C of the substrate 3 (hereinafter referred to as L1 line). It is formed by being cut out in a substantially U shape so as to open. The second positioning hole 20 has an arcuate portion and a straight portion, and the straight portion is parallel to the L1 line.

そして、この第２の位置決め穴２０は、第２の位置決め穴２０の円弧状部と同心の円の中心Ｐ２から基板３の中央Ｃまでの距離と、第１の位置決め穴１６の中心Ｐ１から基板３の中央Ｃまでの距離と、が等しくなるように形成されている。   The second positioning hole 20 includes a distance from the center P2 of the circle concentric with the arc-shaped portion of the second positioning hole 20 to the center C of the substrate 3, and the center P1 of the first positioning hole 16 to the substrate. The distance to the center C of 3 is formed to be equal.

この第２の位置決め穴２０は、第２の位置決め突起１８とのＬ１線の垂直方向に沿った間隔が僅かであり、第２の位置決め突起１８のＬ１線の垂直方向への位置決めを行う。また、第２の位置決め穴２０は、第２の位置決め突起１８のＬ１線に沿った方向への相対移動を許容するようになっている。   The second positioning hole 20 has a small distance along the vertical direction of the L1 line with the second positioning protrusion 18, and performs positioning of the second positioning protrusion 18 in the vertical direction of the L1 line. The second positioning hole 20 allows relative movement of the second positioning protrusion 18 in the direction along the line L1.

以上に説明した位置に形成される第１の位置決め穴１６の中心Ｐ１と第２の位置決め穴２０のＰ２とは、基板３の中央Ｃを対称の中心として、点対称の位置に形成される。すなわち、図２０に示される状態で１８０度回転させると、第１の位置決め穴１６の中心Ｐ１が第２の位置決め穴２０のＰ２の位置に、第２の位置決め穴２０のＰ２が第１の位置決め穴１６の中心Ｐ１に位置するようになっている。   The center P1 of the first positioning hole 16 and P2 of the second positioning hole 20 formed at the positions described above are formed at point-symmetric positions with the center C of the substrate 3 as the center of symmetry. That is, when rotated 180 degrees in the state shown in FIG. 20, the center P1 of the first positioning hole 16 is at the position P2 of the second positioning hole 20, and P2 of the second positioning hole 20 is the first positioning hole. It is located at the center P1 of the hole 16.

なお、第２の位置決め穴２０の形状は、基板３の中央Ｃから離れる方向に開口するように略Ｕ字状に切り欠きされて形成されているが、閉じた長穴形状でも良い。
また、第２の位置決め穴２０の形状は、基板３の線膨張係数と光束制御部材５の線膨張係数とが略等しい場合、組み立て時の位置精度を考慮したクリアランスを有する丸穴としてもよい。
（本変形例の効果）
本変形例に係る光束制御部材５と基板３によれば、第１の位置決め突起１５と第２の位置決め突起１８とが、レンズ部２６の光軸４４（本変形例においては対角線の交点Ｃ２）を対称の中心として、対称の位置に形成されており、そして、これらに係合される第１の位置決め穴１６の中心Ｐ１と第２の位置決め穴２０のＰ２とが、点状発光素子としてのＬＥＤ４の光軸１７（本変形例においては基板３の中央Ｃ）を対称の中心として、対称の位置に形成されている。 The shape of the second positioning hole 20 is notched in a substantially U shape so as to open in a direction away from the center C of the substrate 3, but may be a closed long hole shape.
Further, the shape of the second positioning hole 20 may be a round hole having a clearance in consideration of positional accuracy at the time of assembly when the linear expansion coefficient of the substrate 3 and the linear expansion coefficient of the light flux controlling member 5 are substantially equal.
(Effect of this modification)
According to the light flux controlling member 5 and the substrate 3 according to this modification, the first positioning protrusion 15 and the second positioning protrusion 18 are connected to the optical axis 44 of the lens portion 26 (in the present modification, the intersection C2 of diagonal lines). , And the center P1 of the first positioning hole 16 and the P2 of the second positioning hole 20 engaged therewith are used as point light emitting elements. The LED 4 is formed at a symmetrical position with the optical axis 17 (in the present modification, the center C of the substrate 3) as the center of symmetry.

これにより、光束制御部材５に対する基板３の取付位置は、図１９（ａ）で示す、光束制御部材５に基板３の第１の位置決め穴１６が右側に配置される取り付け位置の他、第１の位置決め穴１６が左側に配置される取り付け位置をもとることができる。   Thereby, the mounting position of the substrate 3 with respect to the light flux controlling member 5 is not limited to the first mounting position where the first positioning hole 16 of the substrate 3 is disposed on the right side of the light flux controlling member 5 as shown in FIG. The mounting position where the positioning hole 16 is arranged on the left side can be obtained.

これに対し、図１（ｄ）で示す、先に述べた実施形態は、光束制御部材５に対する基板３の取付位置が一意的に決定される。   On the other hand, in the above-described embodiment shown in FIG. 1D, the mounting position of the substrate 3 with respect to the light flux controlling member 5 is uniquely determined.

以上により、本変形例と先の実施形態とを比較すると、本変形例の方が組み立て効率が良くなる効果を有している。   As described above, when this modification is compared with the previous embodiment, this modification has an effect of improving the assembly efficiency.

なお、第１の位置決め突起１５、第２の位置決め突起１８とこれに係合する第１の位置決め穴１６、第２の位置決め穴２０の形成位置は、基板３に取り付けられたＬＥＤ４の光軸１７にレンズ部２６の光軸４４を合致させることができ、第１の位置決め突起１５と第２の位置決め突起１８とがレンズ部２６の光軸４４を対称の中心として、点対称の位置に形成され、且つ、これに係合する第１の位置決め穴１６と第２の位置決め穴２０とが対応する位置に形成されていれば良く、本変形例の図１９及び図２０で説明した位置に限定されるものではない。   The first positioning protrusion 15, the second positioning protrusion 18, the first positioning hole 16 that engages with the first positioning protrusion 18, and the second positioning hole 20 are formed at the optical axis 17 of the LED 4 attached to the substrate 3. The first positioning protrusion 15 and the second positioning protrusion 18 are formed at point-symmetrical positions with the optical axis 44 of the lens part 26 as the center of symmetry. In addition, the first positioning hole 16 and the second positioning hole 20 that engage with the first positioning hole 16 need only be formed at corresponding positions, and are limited to the positions described in FIGS. 19 and 20 of the present modification. It is not something.

本発明の発光装置１は、屋内における案内パネル等の照明や液晶表示パネルのバックライトの構成部品として使用できることはもちろんのこと、防水及び防塵対策が必要となる屋外における広告パネル等の照明や液晶表示パネルのバックライトの構成部品として使用することが可能である。なお、本発明の発光装置１を液晶表示パネルのバックライトとして使用する場合には、発光装置１が規則的な配置で複数並べられて使用される。   The light-emitting device 1 of the present invention can be used as a component of indoor guide panel lighting or liquid crystal display panel backlighting, as well as outdoor advertising panel lighting or liquid crystal that requires waterproof and dust-proof measures. It can be used as a component of a backlight of a display panel. In addition, when using the light-emitting device 1 of this invention as a backlight of a liquid crystal display panel, a plurality of light-emitting devices 1 are arranged in a regular arrangement and used.

１……発光装置、３……基板、３ａ……表面、４……ＬＥＤ（発光素子）、５……光束制御部材、７……ハーネス、８……外縁部分、１０……引き出し溝、１１……金属板、１１ａ……表面、１１ｂ……裏面、１５……第１の位置決め突起（位置決め突起）、１６……第１の位置決め穴、１７，４４……光軸、１８……第２の位置決め突起（位置決め突起）、２０……第２の位置決め穴、２６……レンズ部、３０……上部壁部分（基板に対向する面）、３７……シーリング材、４０……シーリング溝、４８……隙間、５０……照明装置、５１……被照明部材

DESCRIPTION OF SYMBOLS 1 ... Light-emitting device, 3 ... Board | substrate, 3a ... Surface, 4 ... LED (light emitting element), 5 ... Light flux control member, 7 ... Harness, 8 ... Outer edge part, 10 ... Drawer groove, 11 ...... Metal plate, 11a ... Front surface, 11b .... Back surface, 15 ... First positioning projection (positioning projection), 16 ... First positioning hole, 17, 44 ... Optical axis, 18 ... Second Positioning projection (positioning projection), 20... Second positioning hole, 26... Lens portion, 30... Upper wall portion (surface facing the substrate), 37. …… Gap, 50 …… Lighting device, 51 …… Lighted member

Claims (4)

点状に発光する発光素子が取り付けられた基板と、
前記発光素子からの光を前記発光素子の光軸の周りに拡げて出射させるレンズ部が形成されて、前記基板に固定される光束制御部材と、を有し、
前記光束制御部材は、前記基板に対向する側の外縁部分が前記基板の外縁を所定の隙間をもって取り囲むように形成され、前記外縁部分の内側に沿ってシーリング材収容溝が形成され、前記基板と外部電源とを接続するハーネスの引き出し溝が前記シーリング材収容溝に連通するように前記外縁部分に形成されると共に、前記シーリング材収容溝内で且つ前記基板に対向する面側に一対の位置決め突起が離れた状態で突設され、
前記基板は、前記一対の位置決め突起の一方に係合する第１の位置決め穴が形成されると共に、前記一対の位置決め突起の他方に係合する第２の位置決め穴が形成され、
前記一対の位置決め突起は、その一方が前記第１の位置決め穴に係合され、その他方が前記第２の位置決め穴に係合されると、前記発光素子の光軸に前記レンズ部の光軸を合致させるように、前記基板に対して前記光束制御部材を位置決めし、
前記第２の位置決め穴は、前記一対の位置決め突起を結んだ線に沿った方向への前記光束制御部材と前記基板の相対移動を可能にする長穴であり、
前記光束制御部材の前記一対の位置決め突起の一方を前記基板の第１の位置決め穴に係合し、前記光束制御部材の前記一対の位置決め突起の他方を前記基板の第２の位置決め穴に係合して、前記光束制御部材を前記基板に対して位置決めした状態で組付け、前記光束制御部材の前記外縁部分と前記基板の前記外縁との隙間から前記シーリング材収容溝内にシーリング材を注入することにより、前記光束制御部材の外縁部分と前記基板の外縁との隙間が前記シーリング材でシールされ、前記ハーネスと前記引き出し溝との隙間が前記シーリング材でシールされると共に、前記一対の位置決め突起の一方と前記第１の位置決め穴との隙間及び前記一対の位置決め突起の他方と前記第２の位置決め穴との隙間が前記シーリング材でシールされる、
ことを特徴とする発光装置。 A substrate on which light emitting elements that emit dots are attached;
A light beam control member that is formed with a lens part that spreads and emits light from the light emitting element around the optical axis of the light emitting element, and is fixed to the substrate,
The light flux controlling member is formed such that an outer edge portion facing the substrate surrounds the outer edge of the substrate with a predetermined gap, and a sealing material receiving groove is formed along the inner side of the outer edge portion. A pull-out groove of a harness for connecting to an external power source is formed in the outer edge portion so as to communicate with the sealing material accommodation groove, and a pair of positioning protrusions on the surface side facing the substrate in the sealing material accommodation groove Projecting in a separated state,
The substrate is formed with a first positioning hole that engages one of the pair of positioning protrusions and a second positioning hole that engages the other of the pair of positioning protrusions,
When one of the pair of positioning protrusions is engaged with the first positioning hole and the other is engaged with the second positioning hole, the optical axis of the lens unit is aligned with the optical axis of the light emitting element. The light flux controlling member is positioned with respect to the substrate so as to match
The second positioning hole is a long hole that enables relative movement of the light flux controlling member and the substrate in a direction along a line connecting the pair of positioning protrusions.
One of the pair of positioning protrusions of the light flux controlling member is engaged with the first positioning hole of the substrate, and the other of the pair of positioning protrusions of the light flux controlling member is engaged with the second positioning hole of the substrate. Then, the light flux controlling member is assembled in a state of being positioned with respect to the substrate, and a sealing material is injected into the sealing material receiving groove from a gap between the outer edge portion of the light flux controlling member and the outer edge of the substrate. Accordingly, a gap between the outer edge portion of the light flux controlling member and the outer edge of the substrate is sealed with the sealing material, and a gap between the harness and the extraction groove is sealed with the sealing material, and the pair of positioning protrusions A gap between one of the first positioning holes and a gap between the other of the pair of positioning protrusions and the second positioning hole is sealed with the sealing material,
A light emitting device characterized by that. 前記基板は、金属板の表面に前記発光素子と前記ハーネスとを電気的に接続する回路が形成されており、前記金属板の裏面が前記光束制御部材から出っ張るように位置している、ことを特徴とする請求項１に記載の発光装置。   The substrate has a circuit for electrically connecting the light emitting element and the harness formed on a surface of a metal plate, and the back surface of the metal plate is positioned so as to protrude from the light flux controlling member. The light-emitting device according to claim 1. 前記基板と前記光束制御部材が前記シーリング材によって固定される、ことを特徴とする請求項１又は２に記載の発光装置。   The light emitting device according to claim 1, wherein the substrate and the light flux controlling member are fixed by the sealing material. 前記請求項１乃至３のいずれかに記載した発光装置を平面上に所定の間隔で複数配置し、被照明部材を照明することを特徴とする照明装置。

A lighting device comprising: a plurality of light emitting devices according to any one of claims 1 to 3 arranged at a predetermined interval on a plane to illuminate a member to be illuminated.

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101145418B1 (en) 2011-11-22 2012-05-15 주식회사 대한트랜스 A light emitting device module with waterproof function and a plane light source apparatus using the same
JP2013050520A (en) * 2011-08-30 2013-03-14 Okano Denki Kk Light emission device and illumination device
KR200468256Y1 (en) * 2012-03-06 2013-08-02 노명재 Waterproof ring for led lighting
JP2013179201A (en) * 2012-02-29 2013-09-09 Panasonic Corp Light emitting device and lighting apparatus
JP2015529944A (en) * 2012-04-13 2015-10-08 ヘラ コマンディートゲゼルシャフト アウフ アクチエン ヒュック ウント コンパニーＨｅｌｌａ ＫＧａＡ Ｈｕｅｃｋ ＆ Ｃｏ． Sealed LED light source module
CN104992638A (en) * 2015-07-30 2015-10-21 长沙信元电子科技有限公司 A display module of an LED display screen and a waterproof sealing strip thereof
JP2016015314A (en) * 2014-07-02 2016-01-28 アイリス ライト カンパニー，リミテッド Led module having waterproofing function
JP2017050345A (en) * 2015-08-31 2017-03-09 シチズン電子株式会社 Manufacturing method for light-emitting device
JP2017535018A (en) * 2015-10-23 2017-11-24 李峰 Deep-sea LED lighting sealing structure
JP2020053372A (en) * 2018-09-28 2020-04-02 日亜化学工業株式会社 Method for producing light-emitting device, method for producing light-emitting module, and light-emitting device
WO2021049291A1 (en) * 2019-09-13 2021-03-18 豊田合成株式会社 Ultraviolet light irradiation device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005302484A (en) * 2004-04-09 2005-10-27 Matsushita Electric Works Ltd Luminaire and lighting system using it
JP2006331817A (en) * 2005-05-25 2006-12-07 Matsushita Electric Works Ltd Light emitting device and luminaire using it
JP2007213881A (en) * 2006-02-08 2007-08-23 Aristo Engineering Pte Ltd Lighting system unit, lighting system and lighting system mechanism
JP2008010435A (en) * 2006-03-03 2008-01-17 Matsushita Electric Works Ltd Luminaire

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005302484A (en) * 2004-04-09 2005-10-27 Matsushita Electric Works Ltd Luminaire and lighting system using it
JP2006331817A (en) * 2005-05-25 2006-12-07 Matsushita Electric Works Ltd Light emitting device and luminaire using it
JP2007213881A (en) * 2006-02-08 2007-08-23 Aristo Engineering Pte Ltd Lighting system unit, lighting system and lighting system mechanism
JP2008010435A (en) * 2006-03-03 2008-01-17 Matsushita Electric Works Ltd Luminaire

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013050520A (en) * 2011-08-30 2013-03-14 Okano Denki Kk Light emission device and illumination device
JP2013110411A (en) * 2011-11-22 2013-06-06 Daehantrans Co Ltd Optical element module having waterproof function and surface light source device using the same
KR101145418B1 (en) 2011-11-22 2012-05-15 주식회사 대한트랜스 A light emitting device module with waterproof function and a plane light source apparatus using the same
JP2013179201A (en) * 2012-02-29 2013-09-09 Panasonic Corp Light emitting device and lighting apparatus
KR200468256Y1 (en) * 2012-03-06 2013-08-02 노명재 Waterproof ring for led lighting
US10139098B2 (en) 2012-04-13 2018-11-27 Lunux Gmbh Sealed LED light module
JP2015529944A (en) * 2012-04-13 2015-10-08 ヘラ コマンディートゲゼルシャフト アウフ アクチエン ヒュック ウント コンパニーＨｅｌｌａ ＫＧａＡ Ｈｕｅｃｋ ＆ Ｃｏ． Sealed LED light source module
JP2016015314A (en) * 2014-07-02 2016-01-28 アイリス ライト カンパニー，リミテッド Led module having waterproofing function
CN104992638A (en) * 2015-07-30 2015-10-21 长沙信元电子科技有限公司 A display module of an LED display screen and a waterproof sealing strip thereof
JP2017050345A (en) * 2015-08-31 2017-03-09 シチズン電子株式会社 Manufacturing method for light-emitting device
JP2017535018A (en) * 2015-10-23 2017-11-24 李峰 Deep-sea LED lighting sealing structure
JP2020053372A (en) * 2018-09-28 2020-04-02 日亜化学工業株式会社 Method for producing light-emitting device, method for producing light-emitting module, and light-emitting device
JP7288173B2 (en) 2018-09-28 2023-06-07 日亜化学工業株式会社 Method for manufacturing light-emitting device, method for manufacturing light-emitting module, and light-emitting device
WO2021049291A1 (en) * 2019-09-13 2021-03-18 豊田合成株式会社 Ultraviolet light irradiation device
JP2021044505A (en) * 2019-09-13 2021-03-18 豊田合成株式会社 Ultraviolet light irradiation device
JP7211311B2 (en) 2019-09-13 2023-01-24 豊田合成株式会社 UV light irradiation device

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