JP2010287258A - Optical electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the electrostatic breakdown of a plurality of semiconductor lasers using a common conductive clip in a flexible cable to which the plurality of semiconductor lasers are mounted. <P>SOLUTION: Short-circuiting lands 21 and 22, and a short-circuiting ground land 23 are formed in a cable body 10a of a flexible cable 10, and a short-circuiting land 24 and a short-circuiting ground land 25 are formed in a folding piece 10b. The short-circuiting lands 21, 22 and 24 are conducted to the short-circuiting ground lands 23 and 25 by folding a folding piece 10b at the backside of the cable body 10a, and putting a conductive clip into an opening 15 to hold the cable body 10a and the folding piece 10b. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an optical pickup device and other optical electronic devices on which a plurality of semiconductor lasers are mounted, and more particularly to an optical electronic device that can protect a semiconductor laser in a manufacturing process.

  A plurality of semiconductor lasers having different emission wavelengths are mounted on an optical pickup device provided in a disk device loaded with various optical disks. Also, a plurality of semiconductor lasers may be mounted on optical communication devices and various interfaces.

  These optoelectronic devices equipped with semiconductor lasers are provided with a flexible cable extending to the outside. The flexible cables are connected to lead conductors that conduct to the anode and cathode of each semiconductor laser, and various types other than the semiconductor laser. Lead conductors that are electrically connected to the electronic elements are formed, and relay land portions that are electrically connected to the respective lead conductors are provided at the tip of the flexible cable.

  When this type of optoelectronic device is stored, or during assembly work, when a statically charged human body touches the relay land that is connected to the semiconductor laser, or the relay land is charged. There is a concern that an excessive current flows through the semiconductor laser and damages the semiconductor laser, for example, when it is inserted into the connector.

  Therefore, in the optical pickup device described in Patent Document 1 below, a flexible cable is provided with a first land portion for supplying a drive signal to a CD semiconductor laser, and a second land for supplying a drive signal to a DVD semiconductor laser. A land portion and a ground land portion that conducts in common with the cathode portions of the two semiconductor lasers are formed side by side. Then, until the incorporation of the optical pickup device into the disk device is completed, the first land portion, the second land portion, and the ground land portion are sandwiched between the metal clips and short-circuited to each other, whereby the CD is Electrostatic breakdown of the semiconductor laser for DVD and the semiconductor laser for DVD can be prevented.

JP 2008-135118 A

  In the optical pickup device described in Patent Document 1, since the first land portion, the second land portion, and the ground land portion are arranged at the central portion of the flexible cable, the first land is formed with one clip. It is possible to short-circuit all of the part, the second land part, and the ground land part. That is, the semiconductor laser for CD and the semiconductor laser for DVD are housed in the same package and configured as one unit, and the cathode portions of the two semiconductor lasers are connected to a common grounding terminal. Therefore, it is possible to arrange the first land portion, the second land portion, and the ground land portion in the central portion of the flexible cable.

  However, in addition to the semiconductor laser for CD and the semiconductor laser for DVD, an optical pickup device in which a semiconductor laser for BD is further mounted, and a plurality of semiconductor lasers each mounted in separate packages are mounted. In the optical electronic device, it is difficult to arrange all the land portions to be short-circuited at the same place. For example, it is inevitable that the land portion for short circuit is disposed at a position sandwiching the lead conductor, or the land portion is disposed at a position separated from each other in the width direction of the flexible cable. In such a case, it becomes difficult to short-circuit the land using one clip, and problems such as the need for a plurality of clips are likely to occur.

  The present invention solves the above-described conventional problems, and even in a wiring structure in which all of the plurality of short-circuit land portions cannot be arranged side by side at the same place of the flexible cable, a large number of conductive clips are used. An object of the present invention is to provide an optoelectronic device capable of short-circuiting a land portion.

The optoelectronic apparatus of the present invention is an optoelectronic apparatus having a main body portion including a plurality of semiconductor lasers, and a flexible cable for supplying a drive signal to the semiconductor lasers extending from the main body portion.
A plurality of lead conductors that are electrically connected to the respective semiconductor lasers, a relay land portion that is electrically connected to each of the lead conductors and externally connected to the flexible cable, and a plurality of conductors that are individually electrically connected to anode portions of the plurality of semiconductor lasers. A short-circuit land portion and a short-circuit ground land portion conducting to the cathode portion of the semiconductor laser are provided,
A plurality of the short-circuit land portions are arranged separately on the front side and the back side of the flexible cable, and the conductive clip that conducts the short-circuit land portion and the short-circuit ground land portion provided on the front side and the back side is the flexible cable. It is characterized in that it can be attached to a cable.

  The present invention provides a plurality of semiconductors by arranging a plurality of short-circuiting land portions on the front and back sides of the flexible cable, and conducting a short-circuiting land portion and a short-circuiting ground land portion on both sides of the front and back with a common conductive clip. The laser is protected from electrostatic breakdown. Since it is not necessary to concentrate a plurality of short-circuit lands on one surface of the flexible cable, the wiring structure of the flexible cable can be simplified.

  In the present invention, the plurality of short-circuit land portions and the short-circuit ground land portions are formed only on the front surface of the flexible cable, and a part of the flexible cable is folded so that the back surfaces face each other, The short-circuit land portion can be configured to be arranged separately on the front side and the back side of the flexible cable.

  For example, according to the present invention, the flexible cable includes a cable body portion in which any one of the short-circuit land portions is formed, and a bending portion in which any one of the short-circuit land portions is formed by projecting to the side of the cable body portion. A piece is integrally formed, and the bent piece is bent toward the back surface of the cable main body.

  As described above, the structure of the flexible cable can be simplified by providing the lead conductor and the short-circuit land on only one surface of the flexible cable.

  Alternatively, in the present invention, any of a plurality of short-circuit land portions may be formed on the surface of the flexible cable, and another short-circuit land portion may be formed on the back surface of the flexible cable.

  According to the present invention, on the front side of the flexible cable, two short-circuiting land portions individually conducting to the anode portions of the two semiconductor lasers and one short-circuit grounding land portion conducting commonly to the cathode portions of the two semiconductor lasers And a short-circuit land portion that is electrically connected to the anode portion of another semiconductor laser is disposed on the back side of the flexible cable.

  In the above configuration, even when two semiconductor lasers are housed in a common package and when a semiconductor laser of a different package is used, each of the short-circuit lands is connected with a common conductive clip. The part can be short-circuited.

  The present invention relates to an optoelectronic device in which a plurality of semiconductor lasers are mounted, wherein short-circuiting land portions are disposed on the front and back sides of the flexible cable, and a conductive clip is attached to the flexible cable. By making the short-circuit ground land portion conductive, each semiconductor laser can be protected from electrostatic breakdown.

The perspective view which shows the optical pick-up apparatus of 1st Embodiment of the optical electronic apparatus of this invention, A partially enlarged plan view of a flexible cable extending from the optical pickup device, The perspective view which shows the flexible cable and conductive clip which extend from an optical pick-up apparatus, Sectional drawing which shows the state by which the conductive clip was mounted | worn with the flexible cable, (A) is a partial plan view of a flexible cable extending from the optical pickup device of the second embodiment, (B) is a partial rear view, (A) is a diagram showing a package on which a semiconductor laser for CD and a semiconductor laser for DVD are mounted, and (B) is a diagram showing a package on which a semiconductor laser for BD is mounted.

  FIG. 1 shows an optical pickup device 1 which is an embodiment of an optoelectronic device of the present invention. The optical pickup device 1 has a moving base 2. The moving base 2 is mounted on the disk device, and is supported so as to be reciprocally movable in the radial direction of the disk along the recording surface of the disk loaded in the rotation drive unit. The disk device is provided with a sled mechanism for moving the moving base 2.

  A support 3 is fixed to the moving base 2. The base 3 of the four wire-shaped elastic support members 9 is supported on the support 3, and the lens holder 4 is supported on the tip of the elastic support member 9. Two objective lenses 5 and 6 are mounted on the lens holder 4. The moving base 2 is provided with a focusing correction driving device for correcting and driving the lens holder 4 in the optical axis direction of the objective lenses 5 and 6 and a tracking correction driving device for correcting and driving the lens holder 4 in the radial direction of the disc. Yes. The focusing correction driving device includes a focusing coil wound around the lens holder 4 and a magnet that is fixed to the moving base 2 and applies a magnetic field to the focusing coil. The tracking correction drive device includes a tracking coil fixed to the side surface of the lens holder 4 and a magnet that is fixed to the moving base 2 and applies a magnetic field to the tracking coil.

  A disc device on which the optical pickup device 1 is mounted is loaded with a CD (compact disc), a DVD (digital versatile disc), and a BD (Blu-ray “Blu-ray” disc) (“Blu-ray” is a registered trademark). . Since each disk records information and the wavelength of light for reproducing information is different, three types of semiconductor lasers corresponding to each disk are mounted on the moving base 2.

  As shown in FIG. 6A, the CD semiconductor laser Sc and the DVD semiconductor laser Sd are mounted in a common package 7. The package 7 includes a CD anode terminal 7a connected to the anode portion of the CD semiconductor laser Sc, a DVD anode terminal 7b connected to the anode portion of the DVD semiconductor laser Sd, and a CD semiconductor laser Sc. And a common cathode terminal 7c connected in common to the cathode portion of the semiconductor laser Sd for DVD. The BD semiconductor laser Sb shown in FIG. 6B is mounted in a package 8 different from the package 7 for CD and DVD. The package 8 is provided with a BD anode terminal 8a connected to the anode part of the BD semiconductor laser Sb and a cathode terminal 8b connected to the cathode part of the semiconductor laser Sb.

  One objective lens 6 shown in FIG. 1 is commonly used for both CD and DVD. Mounted on the moving base 2 is an optical component that guides the light emitted from the semiconductor laser Sc for CD or the semiconductor laser Sd for DVD to the objective lens 6. In addition, a light receiving element that receives the return light reflected from the disk and passing through the objective lens 6 is provided. The other objective lens 5 is used for BD. On the moving base 2, an optical component that guides light emitted from the BD semiconductor laser Sb to the objective lens 6 is mounted. A light receiving element is provided for receiving the return light reflected by the disk.

  As shown in FIG. 1, the flexible cable 10 extends from the moving base 2. The flexible cable 10 includes a cable main body 10a and a bent piece 10b extending integrally from a side portion of the cable main body 10a.

  As shown in FIG. 2, the flexible cable 10 has an insulating and flexible substrate 11 formed of a flexible resin film or resin sheet. In FIG. 2, the surface 11 a of the substrate 11 is directed to the front of the page. A plurality of lead conductors 12 are formed on the surface 11 a of the substrate 11. The lead conductor 12 is formed of a conductive thin film such as copper and extends linearly along the longitudinal direction of the substrate 11.

  A large number of lead conductors 12 are provided, one of which is individually connected to the CD anode terminal 7a, the DVD anode terminal 7b, and the common cathode terminal 7c shown in FIG. Any one of the lead conductors 12 is individually connected to the BD anode terminal 8a and the cathode terminal 8b shown in FIG. 6B. The remaining lead conductors 12 are connected to the focusing coil and tracking coil mounted on the lens holder 4 via the elastic support member 9 shown in FIG. 1, and the other lead conductors 12 are connected to the terminal portions of the respective light receiving elements. It is connected.

  As shown in FIG. 2, the connection part 13 is provided in the front part of the cable main-body part 10a. A connector is provided in the fixed portion of the disk device, and the connecting portion 13 is fitted into the connector. In the connection portion 13, a plurality of relay land portions 14 are formed side by side on the surface 11 a of the substrate 11. Each relay land portion 14 is individually connected to the plurality of lead conductors 12. The relay land portion 14 is formed of a laminate of a nickel layer and a gold layer.

  As shown in FIG. 2, in the cable main body 10a, a first short-circuit land portion 21 and a second short-circuit land portion 22 are formed in the central portion on the base side of the connection portion 13, and the first short-circuit land is formed. A first short-circuit ground land portion 23 is formed between the land portion 21 and the second short-circuit land portion. The first short-circuit land portion 21, the second short-circuit land portion 22, and the first short-circuit ground land portion 23 are formed by laminating a nickel layer and a gold layer on the surface 11 a of the substrate 11, similarly to the relay land portion 14. It is formed by the body. The first short-circuit land portion 21, the second short-circuit land portion 22, and the first short-circuit ground land portion 23 have fitting holes 21a, 22a, and 23a penetrating the substrate 11, respectively. .

  The lead conductor 12 that is electrically connected to the CD anode terminal 7 a shown in FIG. 6A is connected to the first short-circuit land portion 21 and further connected to one of the plurality of relay land portions 14. The lead conductor 12 that is electrically connected to the DVD anode terminal 7 b shown in FIG. 6A is connected to the second short-circuit land portion 22 and is connected to one of the relay land portions 14. 6A is connected to both the first short-circuit ground land portion 23 and one of the relay land portions 14, and is further made of metal. It is conducted to a movable base 2 made of metal and set to the ground potential.

  As shown in FIG. 6, the semiconductor laser Sc for CD and the semiconductor laser Sd for DVD are mounted in the same package 7, and the package 7 is provided with three terminals 7a, 7b, 7c. Therefore, the lead conductor 12 that is electrically connected to each of the terminals 7a, 7b, and 7c can be pulled out adjacent to the flexible cable 10, and as a result, as shown in FIG. The one short-circuit land 21, the second short-circuit land 22, and the first short-circuit ground land 23 can be collectively arranged.

  As shown in FIG. 2, a third short-circuit land portion 24 and a second short-circuit ground land portion 25 are formed on the surface 11 a of the substrate 11 at the tip of the bent piece 10 b of the flexible cable 10. . The third short-circuit land 24 and the second short-circuit ground land 25 are also formed of a laminate of a nickel layer and a gold layer. Further, the board 11 is formed with a fitting hole 24a penetrating front and back in the third short-circuit land portion 24 and a fitting hole 25a penetrating front and back in the second short-circuit ground land portion 25.

  The lead conductor 12 connected to the BD anode terminal 8a shown in FIG. 6B extends to the surface of the bent piece 10b and is connected to the third short-circuit land portion 24. Further, the third short-circuit land portion 24 and one of the relay land portions 14 are electrically connected via the lead conductor 12. The lead conductor 12 connected to the cathode terminal 8b shown in FIG. 6B also extends to the surface of the bent piece 10b and is connected to the second short-circuit ground land portion 25. Further, the second short-circuit ground land portion 25 is electrically connected to any one of the relay land portions 14, and is further electrically connected to the metal moving base 2 or the like and set to the ground potential.

  As shown in FIG. 6, the semiconductor laser Sc for CD and the semiconductor laser Sd for DVD and the semiconductor laser Sb for BD and the semiconductor laser Sb for BD are housed in separate packages. It is necessary to divide the lead path of the lead conductor 12 conducting to the semiconductor laser Sd and the lead path of the lead conductor 12 conducting to the BD semiconductor laser Sb. As shown in FIG. 2, the BD anode terminal 8a and the second short-circuit ground land portion 25 are arranged on the bent piece 10b, whereby the CD or DVD short-circuit land portions 21, 22, and 23 are disposed. And the other lead conductors 12 can be routed between the BD short-circuiting land portions 24 and 25, and the degree of freedom in designing the wiring of the flexible cable 10 can be increased.

  Further, since it is not necessary to form a space for providing the third short-circuit land portion 24 and the second short-circuit ground land portion 25 in the cable body portion 10a, the width of the cable body portion 10a is excessively large. Can be prevented.

  As shown in FIG. 2, the cable main body 10 a includes a relay land portion 14 in front of the first short-circuit land portion 21, the second short-circuit land portion 22, and the first short-circuit ground land portion 23. A rectangular opening 15 penetrating the substrate 11 from the front and back is formed behind.

  In the flexible cable 10, the relay land portion 14, the first short-circuit land portion 21, the second short-circuit land portion 22, the first short-circuit ground land portion 23, and the third short-circuit land portion 24. The second short-circuit ground land portion 25 is exposed, but in other regions, the lead conductor 12 is covered with a resist layer and insulated from the outside.

  The conductive clip 30 shown in FIGS. 3 and 4 is formed of a conductive leaf spring material such as stainless steel or phosphor bronze. In the conductive clip 30, upper side contact pieces 31 and 32 are formed on both upper sides, and an upper center contact piece 33 is formed in the middle. The upper center contact piece 33 is integrally formed with a downward fitting protrusion 33a that protrudes downward.

  In the conductive clip 30, lower side contact pieces 34 and 35 are formed on both lower sides, and a lower central part contact piece 36 is integrally formed in the middle thereof. As shown in FIGS. 3 and 4, an upward fitting protrusion 35 a that protrudes upward is integrally formed at the base of the lower contact piece 35. Although not appearing in FIGS. 3 and 4, an upward fitting protrusion is integrally formed at the base of the other lower side contact piece 34.

  As shown in FIG. 3, connecting portions 38 and 39 that connect the upper and lower contact pieces are formed on the back of the conductive clip 30 so as to be separated from each other left and right, and an operation piece 41 extending upward is integrally formed therebetween. Is formed. In the free state shown in FIG. 3, the conductive clip 30 has the upper contact pieces 31, 32 and the lower contact pieces 34, 35 pressed against each other by its own elastic force, and the upper center contact piece 33. And the lower center contact piece 36 are in pressure contact with each other. When the folding part 37 and the operation piece 41 in the upper front are grasped with a finger and the operation piece 41 is brought close to the folding part 37, the upper side contact pieces 31 and 32 and the lower side contact piece 34 are deformed by the deformation force at that time. , 35 and the pressure contact force between the upper center contact piece 33 and the lower center contact piece 36 can be weakened, or the upper contact piece and the lower contact piece can be separated vertically. It is.

  When the assembly of the optical pickup device 1 is completed, as shown in FIGS. 3 and 4, the bent piece 10b is folded back to the back side of the cable main body 10a so that the back surfaces 11b of the substrate 11 face each other. At this time, the third short-circuit land portion 24 is overlapped on the back side of the second short-circuit land portion 22, and the fitting hole 22a and the fitting hole 24a are overlapped. Further, the second short-circuit ground land portion 25 is overlapped on the back side of the first short-circuit land portion 21, and the fitting hole 21a and the fitting hole 25a are overlapped.

  As shown in FIG. 4, the conductive clip 30 is inserted into the opening 15 formed in the flexible cable 10, and the cable body 10 a and the bent piece 10 b are sandwiched from above and below by the conductive clip 30.

  At this time, the upper contact pieces 31 and 32 are in contact with the first short-circuit land portion 21 and the second short-circuit land portion 22, and the upper center contact piece 33 is the first short-circuit ground land portion 23. To touch. Then, the downward fitting projection 33 a formed on the upper center contact piece 33 is fitted into the fitting hole 23 a that opens to the first short-circuit ground land portion 23. The lower side contact pieces 34 and 35 are in contact with the third short-circuit land portion 24 and the second short-circuit ground land portion 25 located on the back side. As shown in FIG. 4, at this time, the upward fitting protrusion 35 a formed on the lower contact piece 35 has the fitting hole 24 a formed on the third short-circuiting land portion 24 and the second short-circuiting contact portion 35. It fits in both of the fitting holes 22a formed in the land portion 22. Similarly, the upward fitting protrusion formed on the lower contact piece 34 has a fitting hole 25a formed in the second short-circuit ground land portion 25 and a fitting formed in the first short-circuit land portion 21. It fits in both the joint holes 21a.

  The conductive clip 30 is not easily detached from the sandwiched state shown in FIG. 4 by being fitted into each fitting hole. Since the first short-circuit land portion 21, the second short-circuit land portion 22, and the third short-circuit land portion 24 are all set to the ground potential by the conductive clip 30, the storage process of the optical pickup device 1 In the subsequent assembly process to the disk device, the semiconductor lasers Sc, Sd, and Sb shown in FIG. 6 are protected from electrostatic breakdown even when a human body or an insulator charged with static electricity comes close to a discharge state. Can do.

  The conductive clip 30 is removed after the optical pickup device 1 is incorporated in the disk device and the connecting portion 13 at the front end of the flexible cable 10 is inserted into the connector on the disk device body side, and immediately before the subsequent inspection process. To do. When the conductive clip 30 is attached or removed, the attaching or removing operation can be simplified by sandwiching the folding portion 37 and the operation piece 41 with fingers and bringing the operation piece 41 close to the folding portion 37.

  5A and 5B show a flexible cable 101 according to another embodiment. FIG. 5A shows the front surface 11 a of the substrate 11, and FIG. 5B shows the back surface 11 b of the substrate 11.

  As shown in FIG. 5A, in the cable body 101a, the first short-circuit land portion 21, the second short-circuit land portion 22, and the first short-circuit ground land portion 23 are formed on the surface 11a. ing. As shown in FIG. 5B, a third short-circuit land portion 24 and a second short-circuit ground land portion 25 are formed on the back surface 11b. And the fitting holes 21a, 22a, and 23a which penetrate the board | substrate 11 in the front and back are opened, and the opening part 15 is formed.

  The first short-circuit land 21, the second short-circuit land 22, and the first short-circuit ground land 23 are formed by the lead conductor 12 formed on the surface 11 a, as shown in FIG. The terminal 7a is electrically connected to the DVD anode terminal 7b and the common cathode terminal 7c, and is electrically connected to the relay land portion 14. The third shorting land portion 24 and the second shorting ground land portion 25 are electrically connected to the BD anode terminal 8a and the cathode terminal 8b shown in FIG. 6B by the lead conductor 12 formed on the back surface 11b. In addition, the relay land portion 14 is electrically connected.

  Also in the flexible cable 101 shown in FIG. 5, the conductive clip 30 is interposed in the opening 15 and the cable main body 101a is sandwiched in the same manner as in FIG. The land portion 22 and the third short-circuit land portion 24 can be set to the ground potential.

  In the embodiment, both the first short-circuit ground land portion 23 and the second short-circuit ground land portion 25 are in contact with the conductive clip 30, but one of the short-circuit ground land portions is the conductive clip. 30, and the other short-circuit ground land portion may be connected to the relay land portion 14 at a ground potential without contacting the conductive clip 30.

  The optoelectronic device of the present invention is not limited to an optical pickup device, and can be implemented as long as it is a device equipped with a plurality of semiconductor lasers, such as an optical communication device.

DESCRIPTION OF SYMBOLS 1 Optical pick-up apparatus 2 Moving base 4 Lens holder 5, 6 Objective lens 7, 8 Package 7a CD anode terminal 7b DVD anode terminal 7c Common cathode terminal 8a BD anode terminal 8b Cathode terminal 9 Elastic support member 10 Flexible cable 10a Cable Main body portion 10b Bending piece 11 Substrate 12 Lead conductor 14 Relay land portion 15 Opening portion 21 First short-circuit land portion 22 Second short-circuit land portion 23 First short-circuit ground land portion 24 Third short-circuit land Part 25 2nd shorting grounding land part 21a, 22a, 23a, 24a, 25a fitting hole 30 conductive clip

Claims (5)

In an optoelectronic device having a main body portion provided with a plurality of semiconductor lasers, and a flexible cable for supplying a drive signal to the semiconductor laser extends from the main body portion,
A plurality of lead conductors that are electrically connected to the respective semiconductor lasers, a relay land portion that is electrically connected to each of the lead conductors and externally connected to the flexible cable, and a plurality of conductors that are individually electrically connected to anode portions of the plurality of semiconductor lasers. A short-circuit land portion and a short-circuit ground land portion conducting to the cathode portion of the semiconductor laser are provided,
A plurality of the short-circuit land portions are arranged separately on the front side and the back side of the flexible cable, and the conductive clip that conducts the short-circuit land portion and the short-circuit ground land portion provided on the front side and the back side is the flexible cable. An optoelectronic device that can be attached to a cable.   A plurality of short-circuit land portions and the short-circuit ground land portion are formed only on the front surface of the flexible cable, and a part of the flexible cable is folded so that the back surfaces face each other. The optical electronic device according to claim 1, wherein the optical cable is divided into a front side and a back side of the flexible cable.   The flexible cable is integrally formed with a cable main body portion in which any one of the short-circuit land portions is formed and a bent piece protruding to the side of the cable main body portion to form any one of the short-circuit land portions. The optical electronic apparatus according to claim 2, wherein the bent piece is bent toward the back surface of the cable main body.   The optical electronic device according to claim 1, wherein any one of the plurality of short-circuiting land portions is formed on the surface of the flexible cable, and the other short-circuiting land portion is formed on the back surface of the flexible cable.   On the front side of the flexible cable, two short-circuit land portions that are individually connected to the anode portions of two semiconductor lasers and one short-circuit ground land portion that is commonly connected to the cathode portions of the two semiconductor lasers are disposed. 5. The optical electronic device according to claim 1, wherein a short-circuit land portion that is electrically connected to an anode portion of another semiconductor laser is disposed on the back side of the flexible cable.

Images