JP5373716B2 - Optical pickup - Google Patents

Optical pickup Download PDF

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JP5373716B2
JP5373716B2 JP2010181001A JP2010181001A JP5373716B2 JP 5373716 B2 JP5373716 B2 JP 5373716B2 JP 2010181001 A JP2010181001 A JP 2010181001A JP 2010181001 A JP2010181001 A JP 2010181001A JP 5373716 B2 JP5373716 B2 JP 5373716B2
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circuit board
external connection
optical pickup
land
fpc
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JP2012043483A (en
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正人 岩井
勉成 安次嶺
龍 内山
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Alpine Electronics Inc
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Description

本発明は、CDやDVD等のディスクに対して信号の再生や記録が可能な光学式ピックアップに係り、特に、光学式ピックアップの本体部から導出されてセット機器の回路基板と電気的かつ機械的に接続されるフレキシブルプリント基板に関するものである。   The present invention relates to an optical pickup capable of reproducing and recording a signal on a disk such as a CD or a DVD, and more particularly, an electrical and mechanical connection with a circuit board of a set device derived from a main body of the optical pickup. It is related with the flexible printed circuit board connected to.

光学式ピックアップは、受発光ユニットや対物レンズ等をシャーシに搭載してなる本体部と、この本体部から導出された信号伝送用のフレキシブルプリント基板(以下「FPC」と略称)とによって主に構成されている。受発光ユニットには光源となる半導体レーザと光検出器等の受光素子とが一体的に配設されている。信号伝送用のFPCは、可撓性を有するベースフィルムの片面に多数の導体パターンを高密度に配設してなる帯状体であり、各導体パターンは両端部を除いてほぼ絶縁被覆されている。このFPCの一端側は本体部に接続されており、FPCの他端側は外部接続用端部として光ディスクプレーヤ等のセット機器の回路基板に接続される。この回路基板には半導体レーザ等を制御する駆動制御回路や受光素子の出力信号を処理する信号処理回路が配設されており、通常、FPCの外部接続用端部に配設されている導体パターンの先端部(接続端子)がコネクタを用いて回路基板の対応する接続ランドと接続されるようになっている。   An optical pickup is mainly composed of a main body portion in which a light emitting / receiving unit and an objective lens are mounted on a chassis, and a flexible printed circuit board (hereinafter abbreviated as “FPC”) derived from the main body portion for signal transmission. Has been. The light receiving / emitting unit is integrally provided with a semiconductor laser as a light source and a light receiving element such as a photodetector. An FPC for signal transmission is a belt-like body in which a large number of conductor patterns are arranged on one side of a flexible base film, and each conductor pattern is almost insulated except for both ends. . One end of the FPC is connected to the main body, and the other end of the FPC is connected to a circuit board of a set device such as an optical disc player as an external connection end. This circuit board is provided with a drive control circuit for controlling a semiconductor laser and the like, and a signal processing circuit for processing an output signal of the light receiving element, and is usually a conductor pattern disposed at an external connection end of the FPC. The front end portion (connection terminal) of the circuit board is connected to a corresponding connection land of the circuit board using a connector.

セット機器に組み込まれた光学式ピックアップの基本的な動作について説明すると、この光学式ピックアップは、セット機器に装填されたディスクの半径方向へ本体部を移送しながら、半導体レーザから出射された光ビームを対物レンズによってディスクの記録面上に集光し、ディスクからの戻り光ビームを対物レンズを経由して受光素子にて受光する。本体部はFPCを介してセット機器側の駆動制御回路や信号処理回路と電気的に接続されているので、かかる光学式ピックアップの動作によって、ディスクに記録されている信号の再生や消去あるいはディスクに対する信号の記録等が可能になる。   The basic operation of the optical pickup incorporated in the set device will be described. This optical pickup is a light beam emitted from the semiconductor laser while moving the main body in the radial direction of the disk loaded in the set device. Is focused on the recording surface of the disc by the objective lens, and the return light beam from the disc is received by the light receiving element via the objective lens. Since the main body is electrically connected to the drive control circuit and signal processing circuit on the set device side via the FPC, the operation of the optical pickup causes the signal recorded on the disk to be reproduced or erased or to the disk. Signal recording or the like becomes possible.

一般的に、この種の光学式ピックアップの製造行程においては、セット機器に組み込む前に、検査装置のコンタクトピンをFPCの導体パターンに圧接させることによって光学式ピックアップを実際に動作させ、光ビームの調整作業を行うと共に、該ピックアップが導通不良や動作不良を起こさない良品であることを確認するための検査が行われる。そのため、光学式ピックアップのFPCの外部接続用端部には、検査用に導体パターンを露出させた窓部が設けられている(例えば、特許文献1参照)。また、前述したように、FPCの外部接続用端部がコネクタを介してセット機器の回路基板と接続されるため、FPCの外部接続用端部にはベースフィルムを背面側から補強する補材が固着されており、この補材によって外部接続用端部をコネクタに差し込む際に必要となるFPCの機械的強度が確保されている。なお、この補材は、導体パターンに検査装置のコンタクトピンを圧接させる検査時に懸念されるFPCの不所望な変形を防止するという役割も果たしている。   In general, in the manufacturing process of this type of optical pickup, the optical pickup is actually operated by pressing the contact pins of the inspection device against the conductor pattern of the FPC before being incorporated in the set equipment, While performing the adjustment work, an inspection is performed to confirm that the pickup is a non-defective product that does not cause poor conduction or malfunction. For this reason, the external connection end portion of the FPC of the optical pickup is provided with a window portion in which the conductor pattern is exposed for inspection (see, for example, Patent Document 1). Further, as described above, since the end portion for external connection of the FPC is connected to the circuit board of the set device via the connector, a supplementary material for reinforcing the base film from the back side is provided on the end portion for external connection of the FPC. The mechanical strength of the FPC that is necessary when the external connection end is inserted into the connector is secured by this auxiliary material. This auxiliary material also plays a role of preventing undesired deformation of the FPC, which is a concern during inspection in which the contact pins of the inspection apparatus are pressed against the conductor pattern.

特開2010−108543号公報JP 2010-108543 A

ところで、光学式ピックアップのFPCとセット機器の回路基板とをコネクタを介して接続するという構造は、FPCを回路基板に対して容易に着脱できるという利点はあるものの、コスト面で割高になってしまうため、セット機器のコストダウンを促進するという観点からは好ましいものではなかった。すなわち、FPC用のコネクタは比較的高価で部品コストを押し上げる要因となりやすく、かつ、FPCとコネクタとの接続箇所に金メッキ処理等を施して導通の信頼性を確保しなければならないため、メッキ処理に要する加工コストが嵩みやすくなる。   Incidentally, the structure in which the FPC of the optical pickup and the circuit board of the set device are connected via a connector has an advantage that the FPC can be easily attached to and detached from the circuit board, but is expensive in terms of cost. Therefore, it was not preferable from the viewpoint of promoting cost reduction of the set equipment. In other words, FPC connectors are relatively expensive and are likely to increase the cost of components, and it is necessary to perform gold plating on the connection portion between the FPC and the connector to ensure the reliability of conduction. The required processing cost is likely to increase.

本発明は、このような従来技術の実情に鑑みてなされたもので、その目的は、セット機器の回路基板にFPCを安価に接続できて導通の信頼性も確保しやすい光学式ピックアップを提供することにある。   The present invention has been made in view of the actual situation of the prior art, and an object of the present invention is to provide an optical pickup capable of connecting an FPC to a circuit board of a set device at a low cost and easily ensuring reliability of conduction. There is.

上記の目的を達成するために、本発明は、少なくとも受発光ユニットおよび対物レンズが搭載された本体部と、この本体部から導出された信号伝送用のフレキシブルプリント基板とを備え、前記フレキシブルプリント基板が導体パターン群を担持するベースフィルムを有すると共に、このフレキシブルプリント基板の外部接続用端部がセット機器の回路基板と電気的かつ機械的に接続される光学式ピックアップにおいて、前記フレキシブルプリント基板の前記外部接続用端部に配設されている各導体パターンの一部を検査用に露出させると共に、各導体パターンの先端部を前記回路基板に設けられた接続ランドに半田付けされる接続端子となし、かつ、前記外部接続用端部のうち前記接続端子の存する先端領域を外した領域に、前記ベースフィルムを背面側から補強する補材を固着するという構成にした。   In order to achieve the above object, the present invention comprises at least a main body portion on which a light emitting / receiving unit and an objective lens are mounted, and a flexible printed circuit board for signal transmission derived from the main body section, and the flexible printed circuit board. In the optical pickup in which the external connection end portion of the flexible printed circuit board is electrically and mechanically connected to the circuit board of the set device. A part of each conductor pattern provided at the end for external connection is exposed for inspection, and the tip of each conductor pattern is not a connection terminal soldered to a connection land provided on the circuit board. In addition, the base frame is formed in a region where the tip region where the connection terminal exists is removed from the external connection end. And the configuration of fixing a stiffener for reinforcing the Lum from the back side.

このように構成された光学式ピックアップでは、FPCの外部接続用端部に存する導体パターン群の各先端部がセット機器の回路基板に直接半田付けされる接続端子として形成されているため、比較的高価なFPC用のコネクタを省略できると共に、高価なメッキ処理を施さなくても導通の信頼性を確保しやすくなる。また、FPCの外部接続用端部に検査用として露出させた導体パターン群が背面側から補材によって補強されているため、検査装置のコンタクトピンを圧接させる検査時に、外部接続用端部が不所望に変形して損傷する虞がない。また、この補材は接続端子群の存する外部接続用端部の先端領域には設けられていないので、各接続端子と回路基板の対応する接続ランドとの間に補材に起因する大きな段差が生じる虞がなく、接続端子と接続ランドとの半田付けを容易かつ確実に行うことができる。   In the optical pickup configured in this way, each end portion of the conductor pattern group existing at the external connection end portion of the FPC is formed as a connection terminal that is directly soldered to the circuit board of the set device. An expensive FPC connector can be omitted, and it becomes easy to ensure the reliability of conduction without expensive plating. In addition, since the conductor pattern group exposed for inspection at the external connection end of the FPC is reinforced by the auxiliary material from the back side, the external connection end is not present during the inspection in which the contact pin of the inspection apparatus is pressed. There is no risk of deformation and damage as desired. In addition, since this auxiliary material is not provided in the tip region of the external connection end portion where the connection terminal group exists, there is a large step caused by the auxiliary material between each connection terminal and the corresponding connection land of the circuit board. There is no possibility of occurrence, and soldering between the connection terminal and the connection land can be easily and reliably performed.

上記の構成において、FPCの外部接続用端部の先端領域に比べて、補材は接続端子群の配列方向に沿う長さ寸法が大きく設定されていると、外部接続用端部を検査装置に装着する際に、機械的強度に富む補材の先端側の隅部を検査装置のストッパ部に当接させて容易かつ正確な位置決めが行える。   In the above configuration, when the length of the auxiliary material along the arrangement direction of the connection terminal group is set larger than the tip region of the FPC external connection end, the external connection end is used as an inspection device. At the time of mounting, easy and accurate positioning can be performed by bringing the corner portion on the distal end side of the auxiliary material rich in mechanical strength into contact with the stopper portion of the inspection apparatus.

また、上記の構成において、回路基板に複数の基準孔を設けると共に、FPCの外部接続用端部のうち補材の存する領域に複数の位置決め孔を設けておき、これらの基準孔と位置決め孔とを合致させた状態で外部接続用端部を回路基板上に配置することによって、各接続端子が対応する接続ランド上に配置されるようにしてあると、外部接続用端部を回路基板に接続する際に、機械的強度に富む補材を利用して容易かつ正確な位置決めが行える。この場合において、FPCの外部接続用端部の根元側の領域に透孔を有する補強ランドを設けておき、この透孔を回路基板に設けられたダミーランド上に配置した状態で、該ダミーランドと補強ランドとが半田付けされるようにしてあると、回路基板に対するFPC(外部接続用端部)の取付強度を大幅に高めることができる。   In the above configuration, a plurality of reference holes are provided in the circuit board, and a plurality of positioning holes are provided in a region where the auxiliary material is present in the external connection end portion of the FPC. When the external connection ends are arranged on the circuit board in a state where they are matched, the external connection ends are connected to the circuit board when each connection terminal is arranged on the corresponding connection land. In this case, easy and accurate positioning can be performed by using an auxiliary material having a high mechanical strength. In this case, a reinforcing land having a through hole is provided in a region on the base side of the FPC external connection end, and the dummy land is disposed in a state where the through hole is disposed on the dummy land provided on the circuit board. When the lands and the reinforcing lands are soldered, the mounting strength of the FPC (external connection end) to the circuit board can be significantly increased.

本発明の光学式ピックアップによれば、FPCの外部接続用端部に存する導体パターン群の各先端部がセット機器の回路基板に直接半田付けされる接続端子として形成されているため、FPC用のコネクタが不要になって外部接続用端部を回路基板に安価に接続できると共に、高価なメッキ処理を施さなくても導通の信頼性を高めることができる。また、FPCの外部接続用端部に検査用として露出させた導体パターン群が背面側から補材によって補強されているため、検査装置のコンタクトピンを圧接させる検査時に、外部接続用端部が不所望に変形して損傷することを防止できる。しかも、この補材は接続端子群の存する外部接続用端部の先端領域には設けられていないので、各接続端子と回路基板の対応する接続ランドとの間に補材に起因する大きな段差が生じる虞がなく、それゆえ接続端子と接続ランドとの半田付けを容易かつ確実に行うことができる。   According to the optical pickup of the present invention, each end portion of the conductor pattern group existing on the external connection end portion of the FPC is formed as a connection terminal that is directly soldered to the circuit board of the set device. The connector is not necessary, and the external connection end can be connected to the circuit board at a low cost, and the reliability of conduction can be improved without performing an expensive plating process. In addition, since the conductor pattern group exposed for inspection at the external connection end of the FPC is reinforced by the auxiliary material from the back side, the external connection end is not present during the inspection in which the contact pin of the inspection apparatus is pressed. It can be prevented from being deformed and damaged as desired. In addition, since this auxiliary material is not provided in the tip region of the external connection end where the connection terminal group exists, there is a large step caused by the auxiliary material between each connection terminal and the corresponding connection land of the circuit board. There is no risk of this occurring, and therefore, the soldering between the connection terminal and the connection land can be performed easily and reliably.

本発明の実施形態例に係る光学式ピックアップの上面図である。1 is a top view of an optical pickup according to an embodiment of the present invention. 図1の要部拡大図である。It is a principal part enlarged view of FIG. 図1に示す光学式ピックアップの底面図である。It is a bottom view of the optical pickup shown in FIG. 図3の要部拡大図である。It is a principal part enlarged view of FIG. 該光学式ピックアップのFPCを検査装置に装着した状態を示す斜視図である。It is a perspective view which shows the state which mounted | wore the test | inspection apparatus with FPC of this optical pick-up. 図5に対応する上面図である。FIG. 6 is a top view corresponding to FIG. 5. 図5に対応する側面図である。FIG. 6 is a side view corresponding to FIG. 5. 該光学式ピックアップが組み込まれるセット機器の回路基板の要部斜視図である。It is a principal part perspective view of the circuit board of the set apparatus in which this optical pick-up is integrated. 図8に対応する要部上面図である。It is a principal part top view corresponding to FIG. 該光学式ピックアップのFPCをセット機器の回路基板に半田付けした状態を示す要部斜視図である。It is a principal part perspective view which shows the state which soldered FPC of this optical pick-up to the circuit board of a set apparatus. 図10に対応する要部上面図である。It is a principal part top view corresponding to FIG.

以下、本発明の実施形態例を図1〜図11を参照しながら説明する。図1〜図4に示す光学式ピックアップ1は、受発光ユニット4や対物レンズ5等をシャーシ6に搭載してなる本体部2と、本体部2から帯状に導出された信号伝送用のFPC(フレキシブルプリント基板)3とによって主に構成されている。この光学式ピックアップ1は、セット機器である光ディスクプレーヤ(CDプレーヤやDVDプレーヤなど)に組み込まれて使用されるものであり、図10と図11に示すように、FPC3の先端の外部接続用端部9がセット機器の回路基板20に接続される。この回路基板20には、光学式ピックアップ1用の駆動制御回路や信号処理回路が配設されている。   Embodiments of the present invention will be described below with reference to FIGS. The optical pickup 1 shown in FIGS. 1 to 4 includes a main body portion 2 in which a light emitting / receiving unit 4 and an objective lens 5 are mounted on a chassis 6, and an FPC for signal transmission derived from the main body portion 2 in a band shape ( Flexible printed circuit board) 3. This optical pickup 1 is used by being incorporated in an optical disc player (such as a CD player or a DVD player) that is a set device. As shown in FIGS. 10 and 11, an external connection end at the tip of the FPC 3 is used. The unit 9 is connected to the circuit board 20 of the set device. The circuit board 20 is provided with a drive control circuit and a signal processing circuit for the optical pickup 1.

本体部2の外殻をなすシャーシ6は、ディスクの半径方向に沿って往復動できるようにセット機器に組み込まれる。受発光ユニット4には、光源となる半導体レーザと光検出器等の受光素子とが一体的に配設されている。対物レンズ5は、磁気回路やコイルを含む電磁駆動手段によってフォーカス方向およびトラッキング方向へ位置制御されるようになっている。そして、光学式ピックアップ1をセット機器に組み込むことにより、これらの電磁駆動手段や半導体レーザがFPC3を介して前記駆動制御回路にて制御され、受光素子の出力信号が前記信号処理回路にて処理されることになる。   The chassis 6 that forms the outer shell of the main body 2 is incorporated in a set device so as to reciprocate along the radial direction of the disk. The light receiving / emitting unit 4 is integrally provided with a semiconductor laser serving as a light source and a light receiving element such as a photodetector. The position of the objective lens 5 is controlled in the focus direction and the tracking direction by electromagnetic driving means including a magnetic circuit and a coil. Then, by incorporating the optical pickup 1 into the set device, these electromagnetic drive means and semiconductor laser are controlled by the drive control circuit via the FPC 3, and the output signal of the light receiving element is processed by the signal processing circuit. Will be.

信号伝送用のFPC3は、可撓性を有するベースフィルム8の片面に多数の導体パターン7を高密度に配設してなる帯状体であり、各導体パターン7は両端部を除いてほぼ絶縁被覆されている。FPC3の一端側は本体部2に接続されており、FPC3の他端側はセット機器の回路基板20に接続される外部接続用端部9となっている。図2に示すように、外部接続用端部9の先端領域9aには導体パターン7群の各先端部に相当する接続端子7aが列設されており、これら各接続端子7aがセット機器の回路基板20に設けられた接続ランド21(図8参照)に直接半田付けされるようになっているため、FPC3と回路基板20との接続にコネクタは不要である。また、外部接続用端部9の先端領域9aから若干離れた位置に接続端子7a群と略平行に延びる長方形状の窓部9dが設けてあり、この窓部9dから導体パターン7群が露出させてある。この窓部9dは導体パターン7群を被覆する絶縁層の存しない場所として形成されており、図5〜図7に示すように、窓部9d内に露出する導体パターン7群に検査用クリップ30のコンタクトピン31群を圧接させることができる。   The FPC 3 for signal transmission is a belt-like body in which a large number of conductor patterns 7 are arranged on one side of a flexible base film 8, and each conductor pattern 7 is substantially insulatively coated except for both ends. Has been. One end side of the FPC 3 is connected to the main body 2, and the other end side of the FPC 3 is an external connection end portion 9 connected to the circuit board 20 of the set device. As shown in FIG. 2, connection terminals 7 a corresponding to the respective tip portions of the conductor pattern 7 group are arranged in the tip region 9 a of the external connection end portion 9. Since the connection land 21 (see FIG. 8) provided on the substrate 20 is directly soldered, a connector is not necessary for connection between the FPC 3 and the circuit substrate 20. Further, a rectangular window portion 9d extending substantially parallel to the connection terminal 7a group is provided at a position slightly away from the tip region 9a of the external connection end portion 9, and the conductor pattern 7 group is exposed from the window portion 9d. It is. This window portion 9d is formed as a place where an insulating layer covering the conductor pattern 7 group does not exist. As shown in FIGS. 5 to 7, the inspection clip 30 is formed on the conductor pattern 7 group exposed in the window portion 9d. The contact pin 31 group can be pressed.

図2に示すように、FPC3の外部接続用端部9には導体パターン7の存しない領域に位置決め孔9b,9cが穿設されている。これらの位置決め孔9b,9cは、回路基板20に設けられている一対の基準孔23,24(図8参照)と同じ位置関係で穿設されており、位置決め孔9b,9cを基準孔23,24と合致させた状態で外部接続用端部9を回路基板20上に配置することにより、各接続端子7aが対応する接続ランド21上に配置されるようになっている。なお、公差の範囲内での寸法誤差を吸収できるようにするため、一方の位置決め孔9bが丸孔であるのに対し、他方の位置決め孔9cは長孔として形成されている。また、外部接続用端部9の根元側の領域には、回路基板20のダミーランド22(図8参照)上に配置される透孔9eと、この透孔9eを包囲する補強ランド9fとが設けられている。外部接続用端部9を回路基板20と接続する際には、取付強度を高めるために、この補強ランド9fをダミーランド22に半田付けする。   As shown in FIG. 2, positioning holes 9 b and 9 c are formed in a region where the conductor pattern 7 does not exist in the external connection end 9 of the FPC 3. These positioning holes 9b and 9c are formed in the same positional relationship as a pair of reference holes 23 and 24 (see FIG. 8) provided in the circuit board 20, and the positioning holes 9b and 9c are inserted into the reference holes 23 and 9c. By arranging the external connection end portion 9 on the circuit board 20 in a state of being matched with 24, each connection terminal 7a is arranged on the corresponding connection land 21. In order to absorb a dimensional error within a tolerance range, one positioning hole 9b is a round hole, whereas the other positioning hole 9c is formed as a long hole. Further, in a region on the base side of the external connection end portion 9, there are a through hole 9e disposed on the dummy land 22 (see FIG. 8) of the circuit board 20, and a reinforcing land 9f surrounding the through hole 9e. Is provided. When connecting the external connection end 9 to the circuit board 20, the reinforcing land 9 f is soldered to the dummy land 22 in order to increase the attachment strength.

さらに、FPC3の外部接続用端部9には、先端領域9aを除いてベースフィルム8の背面側に補強用の補材10が固着(貼着)されている。この補材10は、先端領域9aに比べて接続端子7a群の配列方向に沿う長さ寸法が若干大きく設定されており、補材10の先端側の一対の隅部10aによって先端領域9aの両横に切り欠き形状の段部が形成されている。これら両隅部10aは、外部接続用端部9を検査用クリップ30に装着する検査時に位置決め部として機能する。なお、外部接続用端部9の位置決め孔9b,9cや透孔9eは、この補材10とベースフィルム8とを貫通して形成されている。   Further, a reinforcing auxiliary material 10 is fixed (adhered) to the external connection end 9 of the FPC 3 on the back side of the base film 8 except for the front end region 9a. The auxiliary material 10 is set to have a slightly larger length dimension along the arrangement direction of the connection terminals 7a than the distal end region 9a. The pair of corners 10a on the distal end side of the auxiliary material 10 has both ends of the distal end region 9a. A notch-shaped step is formed on the side. Both corners 10 a function as positioning portions during inspection when the external connection end 9 is attached to the inspection clip 30. The positioning holes 9 b and 9 c and the through hole 9 e of the external connection end 9 are formed through the auxiliary material 10 and the base film 8.

このように構成された光学式ピックアップ1は、セット機器に組み込む前に、通電状態で光ビームの調整作業を行うと共に、該光学式ピックアップ1が導通不良や動作不良を起こさない良品であるか否かを確認するための検査が行われる。かかる検査時には、図5〜図7に示す検査用クリップ30にFPC3の外部接続用端部9を正しく装着したうえで、検査用クリップ30のコンタクトピン31群を窓部9d内に露出する導体パターン7群に圧接させて所要の導通検査を行う。検査用クリップ30は、コンタクトピン31群が配設された可動部30aと、一対のクランプスイッチ32が配設された載置部30bとをヒンジ結合した構造のもので、図示せぬ検査装置本体と電気的に接続されている。そして、検査時に可動部30aを開いて載置部30b上の所定位置にFPC3の外部接続用端部9を配置させるが、その際、載置部30bの左右の立壁部33によって補材10を左右方向に位置決めできるので、補材10の一対の隅部10aを一対のクランプスイッチ32の壁面に押し当てれば、該壁面がストッパ部となって補材10を前後方向にも位置決めすることができる。したがって、外部接続用端部9を載置部30b上の所定位置に容易かつ正確に配置させることができ、この状態で可動部30aを閉じれば、窓部9d内に露出する各導体パターン7に対応するコンタクトピン31を確実に圧接させることができる。   The optical pickup 1 configured as described above is a non-defective product that performs a light beam adjustment operation in an energized state before being incorporated into a set device and that the optical pickup 1 does not cause poor conduction or malfunction. An inspection is performed to confirm whether or not. At the time of such inspection, a conductor pattern that exposes the contact pin 31 group of the inspection clip 30 in the window portion 9d after the external connection end 9 of the FPC 3 is correctly attached to the inspection clip 30 shown in FIGS. The required continuity test is performed by contacting the 7 groups. The inspection clip 30 has a structure in which a movable portion 30a provided with a group of contact pins 31 and a placement portion 30b provided with a pair of clamp switches 32 are hinge-coupled. And are electrically connected. Then, at the time of inspection, the movable portion 30a is opened and the external connection end portion 9 of the FPC 3 is arranged at a predetermined position on the placement portion 30b. Since it can position in the left-right direction, if a pair of corner part 10a of the auxiliary material 10 is pressed on the wall surface of a pair of clamp switch 32, this wall surface becomes a stopper part and can also position the auxiliary material 10 also in the front-back direction. . Therefore, the external connection end portion 9 can be easily and accurately arranged at a predetermined position on the mounting portion 30b. If the movable portion 30a is closed in this state, each conductor pattern 7 exposed in the window portion 9d is exposed. The corresponding contact pin 31 can be reliably pressed.

なお、外部接続用端部9の窓部9d内に露出している導体パターン7群は、補材10によって補強されたベースフィルム8上に担持されているため、これらの導体パターン7にコンタクトピン31を圧接させる上記の検査時に、外部接続用端部9が不所望に変形して損傷する虞はない。   Since the conductor pattern 7 group exposed in the window portion 9d of the external connection end portion 9 is carried on the base film 8 reinforced by the auxiliary material 10, contact pins are connected to these conductor patterns 7. There is no possibility that the external connection end portion 9 is undesirably deformed and damaged during the above-described inspection in which the pressure contact 31 is pressed.

上述した検査で良品であることが確認された光学式ピックアップ1は、セット機器に組み込まれて、FPC3の外部接続用端部9が回路基板20と接続される。前述したように外部接続用端部9の接続端子7aは回路基板20の対応する接続ランド21に直接半田付けされるため、図10と図11に示すように、FPC3と回路基板20との接続にコネクタは不要である。また、外部接続用端部9に付設されている補材10は、接続端子7a群の存する先端領域9aには設けられていないので、接続端子7aと接続ランド21との間に補材10に起因する大きな段差が生じることはない。   The optical pickup 1 that is confirmed to be a non-defective product by the above-described inspection is incorporated into a set device, and the external connection end 9 of the FPC 3 is connected to the circuit board 20. As described above, the connection terminal 7a of the external connection end 9 is directly soldered to the corresponding connection land 21 of the circuit board 20, so that the FPC 3 and the circuit board 20 are connected as shown in FIGS. No connector is required. Further, since the auxiliary material 10 attached to the external connection end portion 9 is not provided in the distal end region 9a where the connection terminal 7a group exists, the auxiliary material 10 is provided between the connection terminal 7a and the connection land 21. The resulting large step does not occur.

セット機器に組み込まれた光学式ピックアップ1は、このセット機器に装填されたディスクの半径方向へ本体部2を移送しながら、受発光ユニット4の半導体レーザから出射された光ビームを対物レンズ5によってディスクの記録面上に集光し、該ディスクからの戻り光ビームを対物レンズ5を経由して受発光ユニット4の受光素子にて受光する。本体部2はFPC3を介して回路基板20の駆動制御回路や信号処理回路と電気的に接続されているので、かかる光学式ピックアップ1の動作によって、ディスクに記録されている信号の再生や消去あるいはディスクに対する信号の記録等が可能となる。   The optical pickup 1 incorporated in the set device uses the objective lens 5 to transmit the light beam emitted from the semiconductor laser of the light emitting / receiving unit 4 while moving the main body 2 in the radial direction of the disk loaded in the set device. The light is condensed on the recording surface of the disk, and the return light beam from the disk is received by the light receiving element of the light receiving and emitting unit 4 via the objective lens 5. Since the main body 2 is electrically connected to the drive control circuit and signal processing circuit of the circuit board 20 via the FPC 3, the operation of the optical pickup 1 can reproduce or erase the signal recorded on the disc. It is possible to record signals on the disc.

以上説明したように、本実施形態例に係る光学式ピックアップ1は、FPC3の外部接続用端部9に存する導体パターン7群の各先端部がセット機器の回路基板20に直接半田付けされる接続端子7aとして形成されているため、比較的高価なFPC用のコネクタを省略できると共に、特別なメッキ処理を施さなくても導通の信頼性が確保されることになる。また、外部接続用端部9の窓部9d内に検査用として露出させた導体パターン7群が背面側から補材10によって補強されているため、検査用クリップ30(検査装置)のコンタクトピン31を圧接させる検査時に、外部接続用端部9が不所望に変形して損傷する虞がない。また、この補材10は接続端子7a群の存する外部接続用端部9の先端領域9aには設けられていないので、各接続端子7aと回路基板20の対応する接続ランド21との間に補材10に起因する大きな段差は発生せず、それゆえ接続端子7aと接続ランド21との半田付けを容易かつ確実に行うことができる。   As described above, in the optical pickup 1 according to the present embodiment example, the connection in which each tip portion of the conductor pattern 7 group existing on the external connection end portion 9 of the FPC 3 is directly soldered to the circuit board 20 of the set device. Since it is formed as the terminal 7a, a relatively expensive FPC connector can be omitted, and the reliability of conduction can be ensured without performing a special plating process. Further, since the conductor pattern 7 group exposed for inspection in the window portion 9d of the external connection end portion 9 is reinforced by the auxiliary material 10 from the back side, the contact pin 31 of the inspection clip 30 (inspection apparatus). There is no possibility that the external connection end portion 9 is undesirably deformed and damaged at the time of inspection for press-contacting. Further, since the auxiliary material 10 is not provided in the tip region 9a of the external connection end portion 9 where the group of connection terminals 7a exists, the auxiliary material 10 is provided between each connection terminal 7a and the corresponding connection land 21 of the circuit board 20. A large step due to the material 10 does not occur, and therefore, the soldering between the connection terminal 7a and the connection land 21 can be performed easily and reliably.

また、本実施形態例に係る光学式ピックアップ1では、FPC3の外部接続用端部9の先端領域9aに比べると、補材10の方が接続端子7a群の配列方向に沿う長さ寸法が大きく設定されており、この補材10の先端側の一対の隅部10aによって先端領域9aの両横に切り欠き形状の段部が形成されている。そして、製造した光学式ピックアップ1が良品であることを確認するための検査時に、これら両隅部10aを位置決め部として外部接続用端部9を検査用クリップ30の所定位置に配置させることができるため、機械的強度に富む補材10を利用して検査用クリップ30に対する外部接続用端部9の位置決め作業を容易かつ正確に行うことができる。   Further, in the optical pickup 1 according to this embodiment, the length of the auxiliary material 10 along the arrangement direction of the group of connection terminals 7a is larger than that of the distal end region 9a of the external connection end 9 of the FPC 3. A pair of corners 10a on the distal end side of the auxiliary material 10 is formed with notched step portions on both sides of the distal end region 9a. Then, at the time of inspection for confirming that the manufactured optical pickup 1 is a non-defective product, the external connection end portion 9 can be disposed at a predetermined position of the inspection clip 30 with the both corner portions 10a serving as positioning portions. Therefore, it is possible to easily and accurately position the external connection end 9 with respect to the inspection clip 30 by using the auxiliary material 10 having a high mechanical strength.

また、本実施形態例に係る光学式ピックアップ1では、FPC3の外部接続用端部9のうち補材10の存する領域にセット機器の回路基板20に設けられた基準孔23,24と同じ位置関係で位置決め孔9b,9cが設けてあり、これらの基準孔23,24と位置決め孔9b,9cとを合致させた状態で外部接続用端部9を回路基板20上に配置させることによって、各接続端子7aが対応する接続ランド21上に配置されるようにしてある。それゆえ、FPC3の外部接続用端部9を回路基板20に接続する際に、機械的強度に富む補材10を利用して、回路基板20に対する外部接続用端部9の位置決め作業を容易かつ正確に行うことができる。   In the optical pickup 1 according to this embodiment, the same positional relationship as the reference holes 23 and 24 provided in the circuit board 20 of the set device in the region where the auxiliary material 10 exists in the external connection end 9 of the FPC 3. Positioning holes 9b and 9c are provided, and the external connection end 9 is arranged on the circuit board 20 in a state in which the reference holes 23 and 24 and the positioning holes 9b and 9c are aligned with each other. The terminals 7a are arranged on the corresponding connection lands 21. Therefore, when connecting the external connection end 9 of the FPC 3 to the circuit board 20, it is easy to position the external connection end 9 with respect to the circuit board 20 by using the auxiliary material 10 having high mechanical strength. Can be done accurately.

また、本実施形態例に係る光学式ピックアップ1では、FPC3の外部接続用端部9の根元側の領域に、回路基板20のダミーランド22上に配置される透孔9eと補強ランド9fが設けてあり、この補強ランド9fがダミーランド22に半田付けされるようにしてあるため、回路基板20に対するFPC3(外部接続用端部9)の取付強度を大幅に高めることができる。なお、補強ランド9fおよびダミーランド22の半田付けと、接続端子7a群および接続ランド21群の半田付けとを、リフロー工程などによって一括して行うようにすれば半田付け工程が増加することを回避できる。   Further, in the optical pickup 1 according to the present embodiment, a through hole 9e and a reinforcing land 9f that are disposed on the dummy land 22 of the circuit board 20 are provided in a region on the base side of the external connection end 9 of the FPC 3. Since the reinforcing land 9f is soldered to the dummy land 22, the attachment strength of the FPC 3 (external connection end 9) to the circuit board 20 can be greatly increased. If the soldering of the reinforcing lands 9f and the dummy lands 22 and the soldering of the connecting terminals 7a and the connecting lands 21 are collectively performed by a reflow process or the like, an increase in the soldering process is avoided. it can.

1 光学式ピックアップ
2 本体部
3 FPC(フレキシブルプリント基板)
4 受発光ユニット
5 対物レンズ
7 導体パターン
7a 接続端子
8 ベースフィルム
9 外部接続用端部
9a 先端領域
9b,9c 位置決め孔
9d 窓部
9e 透孔
9f 補強ランド
10 補材
10a 隅部
20 回路基板
21 接続ランド
22 ダミーランド
23,24 基準孔
30 検査用クリップ(検査装置)
31 コンタクトピン
32 クランプスイッチ(ストッパ部)
1 Optical Pickup 2 Body 3 FPC (Flexible Printed Circuit Board)
DESCRIPTION OF SYMBOLS 4 Light emitting / receiving unit 5 Objective lens 7 Conductor pattern 7a Connection terminal 8 Base film 9 External connection end part 9a Tip area 9b, 9c Positioning hole 9d Window part 9e Through hole 9f Reinforcement land 10 Supplementary material 10a Corner part 20 Circuit board 21 Connection Land 22 Dummy land 23, 24 Reference hole 30 Inspection clip (Inspection device)
31 Contact pin 32 Clamp switch (stopper)

Claims (4)

少なくとも受発光ユニットおよび対物レンズが搭載された本体部と、この本体部から導出された信号伝送用のフレキシブルプリント基板とを備え、前記フレキシブルプリント基板が導体パターン群を担持するベースフィルムを有すると共に、このフレキシブルプリント基板の外部接続用端部がセット機器の回路基板と電気的かつ機械的に接続される光学式ピックアップにおいて、
前記フレキシブルプリント基板の前記外部接続用端部に配設されている各導体パターンの一部を検査用に露出させると共に、各導体パターンの先端部を前記回路基板に設けられた接続ランドに半田付けされる接続端子となし、かつ、前記外部接続用端部のうち前記接続端子の存する先端領域を外した領域に、前記ベースフィルムを背面側から補強する補材を固着したことを特徴とする光学式ピックアップ。
At least a main body portion on which a light emitting / receiving unit and an objective lens are mounted, and a flexible printed circuit board for signal transmission derived from the main body section, the flexible printed circuit board has a base film that carries a conductor pattern group, In the optical pickup in which the external connection end of the flexible printed circuit board is electrically and mechanically connected to the circuit board of the set device.
A portion of each conductor pattern disposed on the external connection end of the flexible printed circuit board is exposed for inspection, and the tip of each conductor pattern is soldered to a connection land provided on the circuit board. And an auxiliary material that reinforces the base film from the back side is fixed to a region of the external connection end portion from which the tip region where the connection terminal exists is removed. Expression pickup.
請求項1の記載において、前記外部接続用端部の先端領域に比べて、前記補材は前記接続端子群の配列方向に沿う長さ寸法が大きく設定されていることを特徴とする光学式ピックアップ。   2. The optical pickup according to claim 1, wherein the length of the auxiliary material along the arrangement direction of the connection terminal group is set larger than that of the distal end region of the external connection end portion. . 請求項1または2の記載において、前記回路基板に複数の基準孔を設けると共に、前記外部接続用端部の前記補材の存する領域に複数の位置決め孔を設け、これらの基準孔と位置決め孔とを合致させた状態で前記外部接続用端部を前記回路基板上に配置することによって、前記接続端子が対応する前記接続ランド上に配置されるようにしたことを特徴とする光学式ピックアップ。   3. The circuit board according to claim 1, wherein a plurality of reference holes are provided in the circuit board, and a plurality of positioning holes are provided in a region where the auxiliary material is present at the end portion for external connection. The optical pickup is characterized in that the connection terminals are arranged on the corresponding connection lands by arranging the end portions for external connection on the circuit board in a state where they are matched. 請求項3の記載において、前記外部接続用端部の根元側の領域に透孔を有する補強ランドを設け、前記透孔を前記回路基板に設けられたダミーランド上に配置した状態で、該ダミーランドと前記補強ランドとが半田付けされるようにしたことを特徴とする光学式ピックアップ。   4. The dummy land according to claim 3, wherein a reinforcing land having a through hole is provided in a region on a base side of the end portion for external connection, and the through hole is disposed on a dummy land provided on the circuit board. An optical pickup characterized in that a land and the reinforcing land are soldered.
JP2010181001A 2010-08-12 2010-08-12 Optical pickup Active JP5373716B2 (en)

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