JP2010281573A5 - - Google Patents
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- Publication number
- JP2010281573A5 JP2010281573A5 JP2009132695A JP2009132695A JP2010281573A5 JP 2010281573 A5 JP2010281573 A5 JP 2010281573A5 JP 2009132695 A JP2009132695 A JP 2009132695A JP 2009132695 A JP2009132695 A JP 2009132695A JP 2010281573 A5 JP2010281573 A5 JP 2010281573A5
- Authority
- JP
- Japan
- Prior art keywords
- pressure sensor
- pressure
- sensor according
- base
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 238000004382 potting Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009132695A JP2010281573A (ja) | 2009-06-02 | 2009-06-02 | 圧力センサー |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009132695A JP2010281573A (ja) | 2009-06-02 | 2009-06-02 | 圧力センサー |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010281573A JP2010281573A (ja) | 2010-12-16 |
| JP2010281573A5 true JP2010281573A5 (enExample) | 2012-05-31 |
Family
ID=43538456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009132695A Withdrawn JP2010281573A (ja) | 2009-06-02 | 2009-06-02 | 圧力センサー |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010281573A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5656070B2 (ja) * | 2010-12-22 | 2015-01-21 | 横河電機株式会社 | 振動式絶対圧トランスデューサ |
| CN114858326B (zh) * | 2021-02-04 | 2024-11-26 | 中国航发商用航空发动机有限责任公司 | 航空发动机机匣轴向力测量装置及航空发动机 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004011203B4 (de) * | 2004-03-04 | 2010-09-16 | Robert Bosch Gmbh | Verfahren zum Montieren von Halbleiterchips und entsprechende Halbleiterchipanordnung |
| JP2007333452A (ja) * | 2006-06-13 | 2007-12-27 | Epson Toyocom Corp | 圧力センサ用感圧素子、及び圧力センサ |
| JP4888715B2 (ja) * | 2007-03-26 | 2012-02-29 | セイコーエプソン株式会社 | 圧力センサ用の感圧素子、及びその製造方法 |
| JP4984068B2 (ja) * | 2007-10-04 | 2012-07-25 | セイコーエプソン株式会社 | 圧力センサ |
-
2009
- 2009-06-02 JP JP2009132695A patent/JP2010281573A/ja not_active Withdrawn
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