JP2010279933A - Apparatus for treating cmp slurry waste liquid and method of treating cmp slurry waste liquid - Google Patents

Apparatus for treating cmp slurry waste liquid and method of treating cmp slurry waste liquid Download PDF

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JP2010279933A
JP2010279933A JP2009137372A JP2009137372A JP2010279933A JP 2010279933 A JP2010279933 A JP 2010279933A JP 2009137372 A JP2009137372 A JP 2009137372A JP 2009137372 A JP2009137372 A JP 2009137372A JP 2010279933 A JP2010279933 A JP 2010279933A
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waste liquid
slurry waste
cmp slurry
exchange resin
liquid treatment
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Hideki Himi
英樹 氷見
Srinivasule Reddy Pucharapari
スリニワスル レッディ プチャラパリ
Kenji Nakayama
健司 中山
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EcoCycle Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for treating CMP slurry waste liquid and a method of treating CMP slurry waste liquid which can be compactly configured and can clear the wastewater standard at a low cost. <P>SOLUTION: By using the apparatus 1 for treating CMP slurry waste liquid, a solid material-removing process for removing solid material with a special filter 2, a COD adsorption process for adsorbing and removing a surfactant and organic material which raises COD with activated carbon, by using a COD adsorption tower 3 and a Cu ion-removing process for removing Cu ions by using a Cu-removing ion exchange resin tower 4 are continuously performed by means of a slurry waste liquid flow path 5. Therein, on the upper stream side than the Cu ion-removing process, the solid material-removing process and the COD adsorption process are performed and, thereby, only CMP slurry waste liquid is continuously and individually treated by the slurry waste liquid flow path 5. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、化学機械研磨（ＣＭＰ）スラリー廃液の個別処理装置及び処理方法に関し、特には現状のＣＭＰスラリー廃液の産業廃棄物処理に代わる、ＣＭＰスラリー廃液処理装置及び処理方法に関する。   The present invention relates to an individual processing apparatus and processing method for chemical mechanical polishing (CMP) slurry waste liquid, and more particularly, to a CMP slurry waste liquid processing apparatus and processing method that replaces the existing industrial waste processing of CMP slurry waste liquid.

ＣＭＰスラリーは液晶や半導体製造の平坦化処理に用いられ、研磨剤、有機化合物（界面活性剤、防色剤）、酸化剤、ｐＨ調整剤（無機酸またはアルカリ）を主成分とする。ＣＭＰスラリー廃液は、工業排水基準が規定された銅やＣＯＤ、窒素成分を含む。
このＣＭＰスラリー廃液に関しては、従来から、例えばろ過などによって処理することによってろ液が排出路に放出される前に固形物（研磨凝集体）の分離を行なう処理が行われている。また固形物分離から得られたろ液をイオン交換処理することによって廃棄物排出路への放出前に溶解金属の除去を行なう処理も行われている。 The CMP slurry is used for flattening treatment in liquid crystal and semiconductor manufacturing, and contains an abrasive, an organic compound (surfactant, color-preventing agent), an oxidizing agent, and a pH adjuster (inorganic acid or alkali) as main components. The CMP slurry waste liquid contains copper, COD, and nitrogen components for which industrial wastewater standards are defined.
Conventionally, the CMP slurry waste liquid is subjected to a process of separating solids (abrasive aggregate) before the filtrate is discharged to the discharge path by, for example, filtration. Moreover, the process which removes a dissolved metal before discharge | release to a waste discharge path is also performed by ion-exchange-treating the filtrate obtained from solid substance separation.

このＣＭＰスラリー廃液処理装置及び処理方法に関し、特許文献１には大量の未処理の処理廃液の廃棄物排出路への放出、毒性またはそうでない場合には環境に有害な金属の廃棄物流への放出、有害な固形廃棄物スラッジの発生及びその廃棄に伴う問題、ならびに半導体ウェハの「バックエンド」メタライゼーション処理中に用いられる高価な金属の損失を免れる処理方法及びＣＭＰスラリー廃液処理装置が開示された。   With respect to this CMP slurry waste liquid treatment apparatus and treatment method, Patent Document 1 discloses the release of a large amount of untreated waste liquid into a waste discharge path, or the release of toxic or otherwise harmful metals into waste streams. Disclosed is a processing method and CMP slurry waste treatment apparatus that avoids the loss of expensive solid metals used during the "back-end" metallization process of semiconductor wafers, and the problems associated with the generation and disposal of hazardous solid waste sludge .

特表２００２−５３４２５２号公報Special Table 2002-534252

以上の特許文献１に開示されたＣＭＰスラリー廃液処理装置及び処理方法をはじめとして、現状は、ＣＭＰスラリー廃液を他の廃液と混合して処理しているので多くの調合処理が必要となり、また、沈殿槽、ポンプなどは大型の設備及び広大なスペースを必要としている。さらに、抜気攪拌を行うための動力費が負担となっている。
加えて運転管理、薬液の管理、ケーキ汚泥産業廃棄物処理の手続きなど資格を要する作業者の採用による人件費が負担となる場合もある。
さらに加えて、Ｎａ、Ｋ、など排水基準に要求されていないＣｕやＺｎ以外の金属も凝集沈殿するため不要な凝集剤が消費される。
本発明は以上の従来技術における問題に鑑み、コンパクトに構成でき低コストに排水基準をクリアーすることができるＣＭＰスラリー廃液処理装置及びＣＭＰスラリー廃液処理方法を提供することを目的とする。 Including the CMP slurry waste liquid treatment apparatus and treatment method disclosed in the above-mentioned Patent Document 1, the present state requires a lot of blending processing because the CMP slurry waste liquid is mixed and processed with other waste liquids. Precipitation tanks, pumps, etc. require large facilities and a large space. Furthermore, the power cost for performing degassing and stirring is a burden.
In addition, labor costs may be borne by hiring qualified workers, such as operation management, chemical management, and cake sludge industrial waste disposal procedures.
In addition, unnecessary coagulants are consumed because metals other than Cu and Zn, such as Na and K, which are not required in the drainage standards, coagulate and settle.
The present invention has been made in view of the above problems in the prior art, and an object of the present invention is to provide a CMP slurry waste liquid treatment apparatus and a CMP slurry waste liquid treatment method that can be compactly configured and can clear waste water standards at low cost.

本発明のＣＭＰスラリー廃液処理装置は、ＣＭＰスラリー廃液のみを単独処理することを特徴とする。係るＣＭＰスラリー廃液処理装置は、固形物を除去する特殊フィルタとＣＯＤを上昇させる界面活性剤及び有機物（以下、ＣＯＤと記述する）を活性炭にて吸着除去する吸着塔（以下、ＣＯＤ吸着塔と記述する）と金属イオンを除去するイオン交換樹脂塔とをスラリー廃液流路によって接続してなり、特殊フィルタ及びＣＯＤ吸着塔を金属イオンを除去するイオン交換樹脂塔の上流側に接続してなるようにしてもよい。   The CMP slurry waste liquid treatment apparatus of the present invention is characterized in that only the CMP slurry waste liquid is treated alone. The CMP slurry waste liquid treatment apparatus includes a special filter that removes solid matter, an adsorption tower that removes the surfactant and organic substances (hereinafter referred to as COD) that raise COD by activated carbon (hereinafter referred to as a COD adsorption tower). And an ion exchange resin tower for removing metal ions are connected by a slurry waste liquid flow path, and a special filter and a COD adsorption tower are connected to the upstream side of the ion exchange resin tower for removing metal ions. May be.

イオン交換樹脂塔で除去する金属イオンは、例えば半導体製造技術においては、能動および受動素子領域または半導体基板内もしくは上に形成される構成要素への導電性を有するコンタクトを形成するため、ならびにビア孔、階層間メタライゼーションおよび相互接続経路付けパターンを充填してそれら構成要素および／または領域を配線してつなぐために用いられる金属膜を形成する目的で用いられる、チタニウム、タンタル、アルミニウム、ニッケル、コバルト、銀、金、銅、、タングステンのイオンである。   The metal ions removed by the ion exchange resin tower, for example, in semiconductor manufacturing technology, form conductive contacts to active and passive device regions or components formed in or on the semiconductor substrate and via holes. Titanium, Tantalum, Aluminum, Nickel, Cobalt, used to fill metallization and interconnect routing patterns to form metal films that are used to interconnect and connect these components and / or regions , Silver, gold, copper, and tungsten ions.

金属イオンを除去するイオン交換樹脂塔の下流側にＮＨ４イオンを除去するイオン交換樹脂塔を接続してもよい。 An ion exchange resin tower for removing NH 4 ions may be connected to the downstream side of the ion exchange resin tower for removing metal ions.

スラリー廃液流路によって接続した特殊フィルタとＣＯＤ吸着塔とイオン交換樹脂塔の各々が密閉容器とされ、各密閉容器をスラリー廃液流路によって連続して接続して単一のポンプによってスラリー廃液を流通することを可能にすることができる。   Each of the special filter, COD adsorption tower and ion exchange resin tower connected by the slurry waste liquid flow path is a sealed container, and each sealed container is connected continuously by the slurry waste liquid flow path and the slurry waste liquid is circulated by a single pump. Can be made possible.

特殊フィルタが逆洗機能付セラミックフィルタ及びマイクロフィルタ及び沈殿槽のうちの少なくともいずれか一であるようにすることができる。   The special filter may be at least one of a ceramic filter with a backwash function, a microfilter, and a settling tank.

また本発明のＣＭＰスラリー廃液処理方法は、ＣＭＰスラリー廃液のみをスラリー廃液流路によって連続して単独処理することを特徴とする。係るＣＭＰスラリー廃液処理方法は、特殊フィルタによって固形物を除去する固形物除去工程とＣＯＤ吸着塔によってＣＯＤを活性炭にて吸着除去するＣＯＤ吸着工程とイオン交換樹脂によって金属イオンを除去する金属イオン除去工程とをスラリー廃液流路によって連続して行い、金属イオン除去工程よりも上流側で固形物除去工程及びＣＯＤ吸着工程を行うようにすることができる。   Further, the CMP slurry waste liquid treatment method of the present invention is characterized in that only the CMP slurry waste liquid is continuously treated alone by the slurry waste liquid flow path. The CMP slurry waste liquid treatment method includes a solid matter removing step for removing solid matter by a special filter, a COD adsorption step for removing COD by activated carbon by a COD adsorption tower, and a metal ion removing step for removing metal ions by an ion exchange resin. And the solid waste removal step and the COD adsorption step can be performed upstream of the metal ion removal step.

金属イオン除去工程の後に、スラリー廃液流路の下流側でイオン交換樹脂によってＮＨ４イオンを除去するＮＨ４イオン除去工程を行うことができる。 After the metal ion removal step, an NH 4 ion removal step of removing NH 4 ions with an ion exchange resin can be performed on the downstream side of the slurry waste liquid channel.

金属イオンを除去するイオン交換樹脂塔が少なくともＣｕイオンを除去するイオン交換樹脂塔であり、金属イオン除去工程で少なくともＣｕイオンを除去する様にしてもよい。   The ion exchange resin tower that removes metal ions is an ion exchange resin tower that removes at least Cu ions, and at least Cu ions may be removed in the metal ion removal step.

［作用］
本発明のＣＭＰスラリー廃液処理装置及びＣＭＰスラリー廃液処理方法では、ＣＯＤを活性炭にて吸着除去するＣＯＤ吸着塔と少なくとも金属イオンを除去するＣｕ除去イオン交換樹脂塔と少なくともＮＨ４イオンを除去するＮＨ４除去イオン交換樹脂塔とを設け他の廃液と混合することなくＣＭＰスラリー廃液のみを個別処理とすることで、装置の小型化が可能となり、廃液に含まれる金属がプロセスの変更によって種類が変更されてもＣｕなど選択金属の除去が可能となった。 [Action]
The CMP slurry waste fluid processing apparatus and CMP slurry effluent treatment process of the present invention, NH 4 to remove at least a NH 4 ions and Cu removal ion exchange resin column to remove at least a metal ion and COD adsorption tower for adsorbing and removing COD in activated carbon By providing a removal ion exchange resin tower and individually processing only the CMP slurry waste liquid without mixing with other waste liquid, it becomes possible to reduce the size of the device, and the type of metal contained in the waste liquid is changed by changing the process However, selective metals such as Cu can be removed.

また少なくとも特殊フィルタとＣＯＤ吸着塔とＣｕ除去イオン交換樹脂塔とＮＨ４除去イオン交換樹脂塔の各々が密閉容器とされ、ＣＭＰスラリー廃液を流通させるスラリー廃液流路によって各密閉容器を連続して接続したことで圧力損出を抑えることができ、１台のポンプによる運転が可能となり、併せてアンモニア除去を抜気攪拌によらずイオン交換樹脂吸着によって行うことで低い消費電力の低負荷運転が可能となった。
また、本発明のＣＭＰスラリー廃液処理装置及びＣＭＰスラリー廃液処理方法では密閉した容器による装置構成としたこと及び添加する薬液が無いため、特別な資格を要する作業者の必要が無く、管理費，人件費を低く設定することができる。 At least each of the special filter, the COD adsorption tower, the Cu removal ion exchange resin tower, and the NH 4 removal ion exchange resin tower is a sealed container, and each sealed container is continuously connected by a slurry waste liquid flow path for circulating the CMP slurry waste liquid. As a result, pressure loss can be suppressed, and operation with a single pump is possible. At the same time, ammonia removal is performed by ion-exchange resin adsorption without evacuation and agitation, enabling low-load operation with low power consumption. It became.
Further, in the CMP slurry waste liquid treatment apparatus and the CMP slurry waste liquid treatment method of the present invention, there is no chemical solution to be added and there is no need for an operator requiring special qualification because there is no chemical solution to be added, management cost, personnel Costs can be set low.

本発明のＣＭＰスラリー廃液処理装置及びＣＭＰスラリー廃液処理方法はコンパクトに構成でき、消費電力を節減可能とし低コストで排水基準をクリアーするＣＭＰスラリー廃液処理を行うことができる。   The CMP slurry waste liquid treatment apparatus and the CMP slurry waste liquid treatment method of the present invention can be configured compactly, and can perform CMP slurry waste liquid treatment that can reduce power consumption and meet drainage standards at low cost.

本発明の一実施の形態のＣＭＰスラリー廃液処理装置の模式図である。It is a schematic diagram of the CMP slurry waste liquid processing apparatus of one embodiment of this invention.

以下に本発明の一実施の形態を説明する。
図１は本発明の一実施の形態のＣＭＰスラリー廃液処理装置１を示す。
ＣＭＰスラリー廃液処理装置１は、固形物を除去する特殊フィルタ２とＣＯＤを活性炭にて吸着除去するＣＯＤ吸着塔３と金属イオンとしてＣｕイオンを除去するイオン交換樹脂塔４とをスラリー廃液流路５によって接続してなり、特殊フィルタ２及びＣＯＤ吸着塔３をＣｕ除去イオン交換樹脂塔４の上流側に接続してなる。 An embodiment of the present invention will be described below.
FIG. 1 shows a CMP slurry waste liquid treatment apparatus 1 according to an embodiment of the present invention.
The CMP slurry waste liquid treatment apparatus 1 includes a special filter 2 for removing solids, a COD adsorption tower 3 for adsorbing and removing COD with activated carbon, and an ion exchange resin tower 4 for removing Cu ions as metal ions. The special filter 2 and the COD adsorption tower 3 are connected to the upstream side of the Cu removal ion exchange resin tower 4.

スラリー廃液流路５の一部であり、廃液スラリーが流入する入口管６に接続される特殊フィルタ２は逆洗機能付セラミックフィルタ及び／又はマイクロフィルタ及び／又は沈殿槽である。特殊フィルタ２を通過することによって、廃液スラリーの固形物は除去される。   The special filter 2 that is a part of the slurry waste liquid flow path 5 and is connected to the inlet pipe 6 into which the waste liquid slurry flows is a ceramic filter with a backwash function and / or a microfilter and / or a sedimentation tank. By passing through the special filter 2, the solid matter of the waste liquid slurry is removed.

また特殊フィルタ２をスラリー廃液流路５によってポンプ７及び流量計８に接続し、さらにＣＯＤ吸着塔３に連続して接続する。そのＣＯＤ吸着塔３には少なくともＣｕイオンを除去するイオン交換樹脂塔４と少なくともＮＨ４イオンを除去するイオン交換樹脂塔９とをスラリー廃液流路５によって順次連続して接続する。したがってＣＭＰスラリー廃液処理装置１では、特殊フィルタ２を通過した廃液スラリーは連続して順次、ＣＯＤ吸着塔３及びＣｕ除去イオン交換樹脂塔４及びＮＨ４除去イオン交換樹脂塔９に供給される。 Further, the special filter 2 is connected to the pump 7 and the flow meter 8 by the slurry waste liquid flow path 5 and further connected to the COD adsorption tower 3 continuously. An ion exchange resin tower 4 for removing at least Cu ions and an ion exchange resin tower 9 for removing at least NH 4 ions are successively connected to the COD adsorption tower 3 by a slurry waste liquid flow path 5. Therefore, in the CMP slurry waste liquid treatment apparatus 1, the waste liquid slurry that has passed through the special filter 2 is successively and sequentially supplied to the COD adsorption tower 3, the Cu removal ion exchange resin tower 4, and the NH 4 removal ion exchange resin tower 9.

係るＣＭＰスラリー廃液処理装置１を用い、特殊フィルタ２にて固形物を除去する固形物除去工程と、ＣＯＤ吸着塔３によってＣＯＤを活性炭にて吸着除去するＣＯＤ吸着工程と、Ｃｕ除去イオン交換樹脂塔４によって金属イオンとしてＣｕイオンを除去するＣｕイオン除去工程とをスラリー廃液流路５によって連続して行い、Ｃｕイオン除去工程よりも上流側で固形物除去工程及びＣＯＤ吸着工程を行うことによってＣＭＰスラリー廃液のみをスラリー廃液流路５によって連続して単独処理する。   Using the CMP slurry waste liquid treatment apparatus 1, a solid matter removing step for removing solid matter with a special filter 2, a COD adsorption step for adsorbing and removing COD with activated carbon by a COD adsorption tower 3, and a Cu removal ion exchange resin tower 4 to remove the Cu ions as metal ions by the slurry waste liquid flow path 5 continuously, and perform the solids removal step and the COD adsorption step upstream of the Cu ion removal step. Only the waste liquid is continuously treated alone by the slurry waste liquid flow path 5.

またＣｕイオン除去工程の後に、スラリー廃液流路５の下流側でＮＨ４除去イオン交換樹脂塔９によってＮＨ４イオンを除去するＮＨ４イオン除去工程を行う。
このＮＨ４除去イオン交換樹脂塔９からの排出液のｐＨを計測するｐＨ計１０を経て、処理後の廃液スラリーはスラリー廃液流路５の一部である出口管１１を介して排出される。 Also after the Cu ion removal step, the NH 4 ions removal step of removing the NH 4 ions by NH 4 removal ion exchange resin column 9 at a downstream side of the slurry disposal passage 5.
Through a pH meter 10 that measures the pH of the discharged liquid from the NH 4 -removed ion exchange resin tower 9, the processed waste liquid slurry is discharged through an outlet pipe 11 that is a part of the slurry waste liquid flow path 5.

図１に示す実施の形態のＣＭＰスラリー廃液処理装置１はスラリー廃液流路５によって接続した特殊フィルタ２とＣＯＤ吸着塔３とＣｕ除去イオン交換樹脂塔４とＮＨ４除去イオン交換樹脂塔９の各々が密閉容器とされ、各密閉容器を接続するスラリー廃液流路５によって各密閉容器が連続して接続されて単一のポンプ７によってスラリー廃液を流通することを可能にしてなる。各密閉容器は合金若しくはＦＲＰ製の密閉容器とされ、その様に密閉容器とすることによって、誰でも容易に取り扱いができる様に構成されている。 The CMP slurry waste liquid treatment apparatus 1 of the embodiment shown in FIG. 1 includes a special filter 2, a COD adsorption tower 3, a Cu removal ion exchange resin tower 4, and an NH 4 removal ion exchange resin tower 9 connected by a slurry waste liquid flow path 5. Are sealed containers, and each sealed container is continuously connected by the slurry waste liquid flow path 5 that connects each sealed container, so that the slurry waste liquid can be circulated by a single pump 7. Each airtight container is an airtight container made of an alloy or FRP. By using such an airtight container, anyone can easily handle it.

ＣＭＰスラリー廃液処理装置１では特殊フィルタ２で固形物除去を行う工程とＣＯＤ吸着塔３において活性炭にてＣＯＤを吸着除去する工程と、Ｃｕ除去イオン交換樹脂塔４によってＣｕ除去処理を行う工程とＮＨ４除去イオン交換樹脂塔９でＮＨ４除去を行う各工程を各密閉容器内で単一のポンプ７によってＣＭＰスラリー廃液をスラリー廃液流路５を流通させて連続的に行う。その際、ポンプ７以外の駆動源は特には不要であり単一のポンプ７による運転が可能となり、併せてアンモニア除去を抜気攪拌によらずイオン交換樹脂吸着によって行うことで、ＣＭＰスラリー廃液処理装置１がコンパクトに構成できるのみならず、消費電力を節減可能とし低コストでＣＭＰスラリー廃液処理を行うことができる。
しかも特別な資格を要する作業者によって以上の各工程を実施する必要はない。 In the CMP slurry waste liquid treatment apparatus 1, a step of removing solids with the special filter 2, a step of removing COD with activated carbon in the COD adsorption tower 3, a step of performing Cu removal treatment with the Cu removal ion exchange resin tower 4, and NH Each process of removing NH 4 in the 4- removed ion exchange resin tower 9 is continuously performed by circulating the CMP slurry waste liquid through the slurry waste liquid flow path 5 by a single pump 7 in each sealed container. At that time, a drive source other than the pump 7 is not particularly required, and the operation by the single pump 7 is possible. At the same time, the ammonia removal is performed by the ion exchange resin adsorption without evacuation and stirring, so that the CMP slurry waste liquid treatment is performed. Not only can the apparatus 1 be configured compactly, but also power consumption can be reduced, and CMP slurry waste liquid treatment can be performed at low cost.
Moreover, it is not necessary to carry out each of the above steps by an operator who requires special qualifications.

１・・・ＣＭＰスラリー廃液処理装置、２・・・特殊フィルタ、７・・・ポンプ、３・・・ＣＯＤ吸着塔、３ａ，４ａ，９ａ・・・流入口、３ｂ，４ｂ，９ｂ・・・流出口、４・・・Ｃｕ除去イオン交換樹脂塔、９・・・ＮＨ４除去イオン交換樹脂塔。
DESCRIPTION OF SYMBOLS 1 ... CMP slurry waste liquid processing apparatus, 2 ... Special filter, 7 ... Pump, 3 ... COD adsorption tower, 3a, 4a, 9a ... Inlet, 3b, 4b, 9b ... Outflow port, 4... Cu removal ion exchange resin tower, 9... NH 4 removal ion exchange resin tower.

Claims (10)

ＣＭＰスラリー廃液のみを単独処理することを特徴とするＣＭＰスラリー廃液処理装置。 A CMP slurry waste liquid treatment apparatus characterized by processing only a CMP slurry waste liquid alone. 固形物を除去する特殊フィルタとＣＯＤを上昇させる界面活性剤及び有機物を活性炭にて吸着除去する吸着塔（以下、ＣＯＤ吸着塔と記述する）と金属イオンを除去するイオン交換樹脂塔とをスラリー廃液流路によって接続してなり、特殊フィルタ及びＣＯＤ吸着塔をイオン交換樹脂塔の上流側に接続してなる請求項１に記載のＣＭＰスラリー廃液処理装置。 Slurry waste liquid consists of a special filter that removes solids, an adsorption tower (hereinafter referred to as COD adsorption tower) that adsorbs and removes surfactants and organic substances that raise COD with activated carbon, and an ion exchange resin tower that removes metal ions. The CMP slurry waste liquid treatment apparatus according to claim 1, wherein the CMP slurry waste liquid treatment apparatus is connected by a flow path, and a special filter and a COD adsorption tower are connected upstream of the ion exchange resin tower. 金属イオンを除去するイオン交換樹脂塔の下流側にＮＨ４イオンを除去するイオン交換樹脂塔を接続してなる請求項２に記載のＣＭＰスラリー廃液処理装置。 The CMP slurry waste liquid treatment apparatus according to claim 2, wherein an ion exchange resin tower for removing NH 4 ions is connected to a downstream side of the ion exchange resin tower for removing metal ions. スラリー廃液流路によって接続した特殊フィルタとＣＯＤ吸着塔とイオン交換樹脂塔の各々が密閉容器とされ、各密閉容器を接続するスラリー廃液流路によって各密閉容器が連続して接続されて単一のポンプによってスラリー廃液を流通することを可能にした請求項１〜請求項３のいずれか一に記載のＣＭＰスラリー廃液処理装置。 Each of the special filter, the COD adsorption tower, and the ion exchange resin tower connected by the slurry waste liquid flow path is a sealed container, and each sealed container is continuously connected by the slurry waste liquid flow path connecting each sealed container to form a single container. The CMP slurry waste liquid treatment apparatus according to any one of claims 1 to 3, wherein the slurry waste liquid can be circulated by a pump. 特殊フィルタが逆洗機能付セラミックフィルタ及びマイクロフィルタ及び沈殿槽のうちの少なくともいずれか一であることを特徴とする請求項２〜請求項４のいずれか一に記載のＣＭＰスラリー廃液処理装置。 The CMP slurry waste liquid treatment apparatus according to any one of claims 2 to 4, wherein the special filter is at least one of a ceramic filter with a backwash function, a microfilter, and a settling tank. 金属イオンを除去するイオン交換樹脂塔が少なくともＣｕイオンを除去するイオン交換樹脂塔である請求項２〜請求項５のいずれか一に記載のＣＭＰスラリー廃液処理装置。 The CMP slurry waste liquid treatment apparatus according to any one of claims 2 to 5, wherein the ion exchange resin tower for removing metal ions is an ion exchange resin tower for removing at least Cu ions. ＣＭＰスラリー廃液のみをスラリー廃液流路によって連続して単独処理することを特徴とするＣＭＰスラリー廃液処理方法。 A CMP slurry waste liquid treatment method, wherein only a CMP slurry waste liquid is continuously treated continuously by a slurry waste liquid flow path. 特殊フィルタによって固形物を除去する固形物除去工程とＣＯＤ吸着塔によってＣＯＤを上昇させる界面活性剤及び有機物を活性炭にて吸着除去するＣＯＤ吸着工程と金属イオンを除去する金属イオン除去工程とをスラリー廃液流路によって連続して行い、金属イオン除去工程よりも上流側で固形物除去工程及びＣＯＤ吸着工程を行う請求項７に記載のＣＭＰスラリー廃液処理方法。 Slurry waste liquid: Solids removal process that removes solids by special filter, COD adsorption process that adsorbs and removes surfactant and organic substances that raise COD by COD adsorption tower, and metal ion removal process that removes metal ions The CMP slurry waste liquid treatment method according to claim 7, wherein the CMP slurry waste liquid treatment method is performed continuously by a flow path, and the solid substance removal step and the COD adsorption step are performed upstream of the metal ion removal step. 金属イオン除去工程の後に、スラリー廃液流路の下流側でＮＨ４イオンを除去するＮＨ４イオン除去工程を行う請求項７又は請求項８に記載のＣＭＰスラリー廃液処理方法。 9. The CMP slurry waste liquid treatment method according to claim 7, wherein an NH 4 ion removal step of removing NH 4 ions downstream of the slurry waste liquid flow path is performed after the metal ion removal step. 金属イオン除去工程で少なくともＣｕイオンを除去する請求項７〜請求項９のいずれか一に記載のＣＭＰスラリー廃液処理方法。
The CMP slurry waste liquid treatment method according to any one of claims 7 to 9, wherein at least Cu ions are removed in the metal ion removal step.
JP2009137372A 2009-06-08 2009-06-08 Apparatus for treating cmp slurry waste liquid and method of treating cmp slurry waste liquid Pending JP2010279933A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101288822B1 (en) * 2011-08-25 2013-07-23 주식회사 전영 On-site recycling method for the high efficient recovery of waste generating from glass etching process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101288822B1 (en) * 2011-08-25 2013-07-23 주식회사 전영 On-site recycling method for the high efficient recovery of waste generating from glass etching process

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