JP2010278244A - Light emitting diode and reflection type light emitting diode - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a long life light emitting diode that emits mixed color light with high luminance. <P>SOLUTION: In a light emitting diode structure, the light emitting diode 1 includes a plurality of light emitting elements 91, 92, and 93 with different luminescent colors and a transparent resin 96 which covers the circumference of a plurality of light emitting elements with dispersed light-dispersing granules 95 having a mean grain size of 0.050 to 0.5 μm. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a light emitting diode and a reflective light emitting diode that emit light having excellent color mixing properties with high luminance.

  As a light emitting diode emitting white light, as described in Japanese Patent No. 2927279 (Patent Document 1), a blue light emitting element having a light emitting diode structure is covered with a resin in which a YAG phosphor is dispersed, and the blue light emitting element There is known a light emitting diode in which a YAG phosphor emits yellow light by light and pseudo white light is emitted by mixing the original blue light and yellow light.

  Further, as described in Japanese Patent No. 3541709 (Patent Document 2), a YAG phosphor is dispersed in a mold resin, a blue light emitting element is molded, and YAG fluorescence is emitted by light emitted from the blue light emitting element. A light emitting diode that emits pseudo white light by emitting light from the body is also known.

  Furthermore, as described in Japanese Patent Application Laid-Open No. 11-87784 (Patent Document 3), a blue light emitting element is molded with a mold resin, and the surface of the mold resin contains a YAG phosphor. A light emitting diode is also known which emits white light by emitting YAG phosphor with light emitted from a blue light emitting element.

  In any of these white light emitting diodes, YAG phosphors are used and light is emitted by the light emitted from the blue light emitting element, so that white light is obtained. There is a problem that complete white light cannot be obtained by mixing RGB three-color light, such as mixing phosphors of the above colors or color correction by further dispersing a colorant.

  Light emitting diodes that emit white light and emit white light by irradiating three-color phosphors are also known, but the problem is that strong ultraviolet light is generated and the surrounding members deteriorate, shortening the device life. There was a point.

Japanese Patent No. 2927279 Japanese Patent No. 3541709 Japanese Patent Application Laid-Open No. 11-87784

  The present invention has been made in view of the above-described conventional technical problems. A long-life light emitting diode and a reflective light emitting diode capable of emitting phosphor-free, aligned light emission directions, and emitting mixed color light with high luminance are provided. The purpose is to provide.

  The present invention has a light-emitting diode structure in which a plurality of light-emitting elements having different emission colors and a light-dispersible powder having an average particle size of 0.050 μm to 0.5 μm covering the periphery of the plurality of light-emitting elements are dispersed. And a light-emitting diode including the transparent resin.

  Further, the present invention provides an element mount-side lead installed on the element mount portion so that the element mount portion is located in the center of the reflection surface on the opening side with respect to the main body having a concave reflection surface inside. A plurality of wire connection side leads are installed so that the wire connection part is located adjacent to each other, and a plurality of light emitting elements having different emission colors are mounted on the element mount part of the element mount side lead in a light emitting diode structure, A wire is connected between each of the plurality of light emitting elements and each of the wire connecting portions of the plurality of wire connection side leads, and an average particle size of 0.050 μm to 0.5 μm is disposed around the plurality of light emitting elements. The light-dispersible powder particles are coated with a first transparent resin, the plurality of light emitting elements, wires, the first transparent resin covering these, the element mount side lead, and the above A reflection type light emitting diode in which a plurality of wire connection side leads are fixed on a reflection surface of the main body with a second transparent resin.

  According to the light-emitting diode of the present invention, the periphery of a plurality of light-emitting elements having different emission colors is coated with a transparent resin in which light-dispersible powder particles having an average particle size of 0.050 μm to 0.5 μm are dispersed. Light of different colors from each light-emitting element is scattered by light-dispersible powder particles, and the light of three colors of RGB that has been scattered without light wavelength dependency at the boundary between Rayleigh scattering and Mie scattering, and light dispersibility White light as uniformly mixed color light can be emitted without being blocked by powder particles. In addition, according to the light-dispersed powder particles having the particle size of the present invention, there is no region where the light intensity of each RGB color is reversed at a wide scattering angle. Therefore, according to the light-emitting diode of the present invention, the light-emitting element emits light of three colors of RGB. When the element is employed, white light close to natural light at a wide viewing angle by mixing three colors can be emitted.

The perspective view of the reflection type light emitting diode of the 1st Embodiment of this invention. Sectional drawing of the reflection type light emitting diode of the said embodiment. The top view which fractured | ruptured the lead frame used in manufacture of the reflection type light emitting diode of the said embodiment. The perspective view of the state which attached the light emitting element to the element mount side lead and the wire connection side lead which make a pair in the manufacturing process of the reflection type light emitting diode of the said embodiment, and bonded the wire. In the manufacturing process of the reflection type light emitting diode according to the above embodiment, the light emitting element is attached to the pair of element mount side lead and the set of three wire connection side leads which are paired. The perspective view of the state which coat | covered the light emitting element mount part with 1 transparent resin. The perspective view of the concave case used in manufacture of the reflection type light emitting diode of the said embodiment. From the process of assembling the element mount side lead and the set of three wire connection side leads, which form a pair in the manufacturing of the reflective light emitting diode of the above embodiment, into the concave case, from the filling and curing process of the transparent resin, and the bending process of the lead Manufacturing process diagram up to. FIG. 3 is an enlarged cross-sectional view in which the reflective light-emitting diode according to the embodiment is partially broken. The graph which shows the scattering angle dependence characteristic of each light intensity | strength of RGB three color LED of the reflection type light emitting diode of the said embodiment. The graph which shows the scattering angle dependence characteristic of the light intensity of each RGB3 color LED of the reflection type light emitting diode of the comparative example of this invention. The photograph of the light emission state of the experiment example of this invention. Sectional drawing of the SMD light emitting diode of the 2nd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  (First Embodiment) As shown in FIGS. 1 and 2, a reflective light emitting diode 1 according to a first embodiment of the present invention includes a concave case 6 as a main body, and a reflective surface 2 of the concave case 6. Mounted on the element mount portion at the tip of the case center side of the upper piece 7a of the element mount side lead 7 and the three parallel wire connection side leads 81, 82, 83, and the element mount side lead 7, which are placed so as to cross the upper side of the element The light emitting diode structure includes three light emitting elements 91, 92, and 93 having emission colors of R, G, and B, respectively. The element mount side lead 7, the three wire connection side leads 81, 82, 83 and the light emitting elements 91, 92, 93 are molded with the transparent resin 13 filled in the concave portion of the concave case 6.

  As shown in detail in FIG. 4, light emitting elements 91, 92, and 93 having a light emitting diode structure of three colors of RGB are mounted on the element mount portion 7f at the tip of the case mount side of the upper piece 7a of the element mount side lead 7. One end of each of the wires 101, 102, 103 is connected to each of the light emitting elements 91, 92, 93, and the other end of each of the wires 101, 102, 103 is the upper piece 8a of each of the wire connection side leads 81, 82, 83. Are connected to the wire connecting portions 81f, 82f, 83f at the tip of the wire. These light emitting elements 91, 92, and 93 are set at the focal position of the parabolic reflecting surface or at a position near the focal point that is slightly deviated from the focal point.

  Further, as shown in detail in FIG. 5, the light emitting elements 91, 92, and 93 of the three colors are in a state where the wires 101, 102, and 103 are connected to each other, and a light-dispersible powder particle of an electrically insulating resin described later. The first transparent resin 96 in which 95 is dispersed is dropped and cured to coat. The light dispersible powder particles 95 are fine resin particles having electrical insulation properties such as acrylic resin, nylon resin, and polycarbonate resin, and having an average particle size of 0.05 μm to 0.5 μm. The first transparent resin 96 is a transparent resin having electrical insulation properties such as an epoxy resin or a silicon resin, for example.

  As shown in FIG. 6, the concave case 6 is formed with a parabolic concave curved concave portion on the upper surface side, and the reflective surface 2 is formed by depositing aluminum or silver on the concave bottom surface. A groove 4 is formed on one upper edge of the wall 3 around the concave case 6, and grooves 51, 52, 53 are formed on the other upper edge facing each other.

  As shown in FIGS. 1 and 2, the element mount side lead 7 crosses the upper surface of the reflective surface 2 of the concave case 6, and has a narrow upper piece 7 a and a wide width along the wall side surface and bottom surface of the concave case 6. The vertical piece 7 b and the wide lower piece 7 c are bent and attached to one side of the concave case 6. The three wire connection side leads 81, 82, 83 are opposed to the element mount side lead 7. Similarly, the narrow upper pieces 81 a, 82 a, 83 a, the slightly wider vertical pieces 81 b, 82 b, 83 b, the slightly wider width Vertical pieces 81b, 82b, 83b and equal-width lower pieces 81c, 82c, 83c are bent and attached to the concave case 6.

  The element mount side lead 7 and the bent base portions 7a ', 81a', 82a ', 83a' of the narrow upper pieces 7a, 81a, 82a, 83a of the three wire connection side leads 81, 82, 83 are concave case 6 Are respectively fitted to the grooves 4, 51, 52, 53 of the concave case 6, and outside the grooves 4, 51, 52, 53 of the concave case 6, the wide vertical pieces 7b, 81b, 82b of the leads 7, 81, 82, 83, respectively. 83 b is along the side surface of the concave case 6, and the lower wide pieces 7 c, 81 c, 82 c, 83 c of the leads 7, 81, 82, 83 are in contact with the bottom surface of the concave case 6.

  In each of the grooves 4, 51, 52, 53 of the concave case 6, the concave case 6 is formed from the upper surface side of the fitting portion of the bent base portions 7 a ′, 81 a ′, 82 a ′, 83 a ′ of the leads 7, 81, 82, 83. The step portion is filled with a small UV curable resin so as to block the step up to the upper edge surface and cured to form the weirs 11, 121, 122, 123, and at the same time, the upper pieces 7a of the leads 7, 81, 82, 83, respectively. , 81a, 82a, 83a are fixed to the bent bases 7a ′, 81a ′, 82a ′, 83a ′. Then, for example, a transparent epoxy resin such as a cationic polymerization type transparent epoxy resin or a second transparent resin 13 for molding such as a transparent silicon resin reaches the upper edge surface of the concave case 6 in the concave portion of the concave case 6. By filling and curing to the depth, the element mount side lead 7, the wire connection side leads 81, 82, 83 upper pieces 7 a, 81 a, 82 a, 83 a, the light emitting elements 91, 92, 93, all of which are covered The first transparent resin 96 for light color mixing and the wires 101, 102, and 103 are fixed in a state of being buried in the second transparent resin 13.

  As shown in FIG. 2, the reflection type light emitting diode 1 having the above-described configuration is such that the reflection type light emitting diode 1 is placed on a substrate (not shown) and the lower pieces 7c of the leads 7, 81, 82, 83 on both sides of the bottom. , 81c, 82c, 83c are connected and fixed to the positive terminal and the negative terminal with solder. In this mounted state, the positive terminals and the negative terminals are energized, whereby the light emitting elements 91, 92, 93 are energized through the respective leads 7, 81, 82, 83 on both sides to emit light. The light from the light emitting elements 91, 92, 93 is mostly emitted downward and reflected by the parabolic curved reflecting surface 2 as shown by the arrow line in FIG. It emits light from the top surface in the direction perpendicular to it. For this reason, in the reflection type light emitting diode 1, it is possible to obtain light having the same direction of light and strong directivity, and thus light having high luminance where the light strikes.

  In addition, in the case of the reflective light-emitting diode 1 of the present embodiment, the three-color light-emitting elements 91, 92, 93 are covered with the first transparent resin 96 for light color mixing, so that natural light is emitted by the following mechanism. Close and high brightness white light can be obtained.

  As shown in FIG. 8, light-dispersible powder particles 95 are dispersed and mixed in the first transparent resin 96. The first transparent resin 96 is an epoxy resin, but a silicon-based resin can be used instead. The light dispersible particles 95 are electrically insulating resin particles such as acrylic, polycarbonate, or nylon, and the average particle size of the powder is 0.05 μm to 0.5 μm.

  For light scattering, Rayleigh scattering by microparticles of 0.1 μm or less, Mie scattering by microparticles of 0.1 to 1.0 μm, which is larger than the particles to be Rayleigh scattered, and by particles having a larger particle diameter of 1 μm or more There is diffraction scattering. Rayleigh scattering is caused by particles smaller than the wavelength of light and fine particles having an average particle size of 0.05 μm or less. The blue sky during the daytime in fine weather is the result of sunlight being Rayleigh scattered by air particles in the atmosphere and a lot of blue light with a short wavelength being scattered toward the observer. On the other hand, scattering caused by particles having a particle diameter close to the wavelength of light and particles having a diameter of 0.1 μm to 1.0 μm is Mie scattering, and red light is strongly observed. Scattering by particles having a particle diameter larger than the wavelength of light and particles having a diameter of 1.0 μm or more is diffraction scattering and does not depend on the wavelength of light. Fog is the result of diffraction scattering that is independent of the wavelength of light by water vapor with a large particle size in the air.

  Considering such light scattering characteristics, not only the case of diffraction scattering by particles having a particle diameter larger than the wavelength of light, but also the boundary region between Rayleigh scattering where blue is strong and Mie scattering where red is strong. Scattering that does not depend on the wavelength of light occurs even with particles of a particle size. That is, according to the particles having an average particle size of 0.05 μm to 0.5 μm, scattering independent of the wavelength of the light can be caused, and light of each color of RGB is almost the same as shown in FIG. Scattering of light with intensity can be obtained over a wide range of scattering angle ± 90 °. Accordingly, the observer sees white light as a result of the uniform mixing of the three RGB colors from any direction.

  FIG. 10 shows the result of diffraction scattering as a comparative example. That is, as is clear from the results of FIG. 10, the light intensity of the RGB three colors is reversed in the region where the scattering angle exceeds ± 15 °. From this result, white light can be observed when the RGB three colors are viewed from the front in the diffraction scattering region, but when the range of ± 15 ° is exceeded, strong red light is observed due to inversion of the light intensity. I understand that.

  (Experimental example) In the embodiment shown in the photograph of FIG. 11, the experiment was performed by changing the type of the first transparent resin 96, the average particle size of the light-dispersible resin 95, and the mixing ratio, and RGB three-color light emitting elements 91, 92, 93. A portion of the first transparent resin 96 covering the same was observed from the outside.

  (1) A silicon resin is used for the first transparent resin 96, and 20 wt% of methacrylic resin powder (average particle size of 0.1 μm) is mixed in as a light-dispersible powder particle 95. The first transparent resin is manufactured by Shin-Etsu Chemical Co., Ltd., Shin-Etsu Silicone KJR-9022 / C-9022 = 10: 1, and the methacrylic resin powder is manufactured by Sekisui Plastics.

  (2) A silicon resin is used for the first transparent resin 96, and 30 wt% of methacrylic resin powder (average particle size 0.1 μm) is mixed in as a light-dispersible powder particle 95. The resin product is the same as that of (1).

  (3) A silicon resin is used for the first transparent resin 96, and 40 wt% of a silicon resin powder (average particle size 0.5 μm) is mixed as the light-dispersible powder particles 95. The first transparent resin is manufactured by Shin-Etsu Chemical Co., Ltd., Shin-Etsu Silicone KJR-9022 / C-9022 = 10: 1, and the silicon resin powder is manufactured by Ube Nitto Kasei.

  (4) A silicon resin is used for the first transparent resin 96, and 50 wt% of silicon resin powder (average particle size 0.5 μm) is mixed as the light-dispersible powder particles 95 therein. The resin product is the same as that of (3).

  From this experimental result, the mixture of white color (2) was the best. In the case of (1), white light was widely observed in the central portion, but at the same time, blue light was observed on one side of the periphery and red light was observed on the opposite side. In the case of (3), blue light and red light were seen in the surroundings together with white light as in (1). In the case of (4), although the light emission was blurred as a whole, blue light and red light were recognized together with white light.

  In the reflective light emitting diode 1 of the present embodiment, white light on the entire surface of the first transparent resin 96 is emitted to the reflective surface 2 that is a paraboloid as indicated by arrows in FIG. The light is reflected at 2 and aligned in a state close to parallel light, and is emitted from the opening of the concave case 6 to the front as white light with high light distribution. Therefore, based on the above experimental results, when the light source portion is the one of (2), in the reflection type light emitting diode 1 of the present embodiment, the white light having a uniform direction and strong directivity, and therefore the light hits. Was able to obtain white light with high luminance, and even when this light was observed obliquely, white light in which the RGB three colors were mixed neatly could be observed.

  Next, a manufacturing method of the reflective light emitting diode 1 having the above structure will be described with reference to FIGS. In mass production, a highly conductive material as shown in FIG. 3, for example, containing 98% to 99% of copper (Cu) as a main component, including some iron (Fe) and sulfur (S), and 2 The element mount side lead 7 is extended from one side by etching or stamping, and three wire connection side leads 81, one from the opposite side. A lead frame 20 is used in which 82 and 83 extend so that a large number of them are arranged side by side on both sides.

  The element mount side lead 7 has a narrow upper piece 7a, a wide vertical piece 7b, and a wide lower piece 7c. Each of the three wire connection side leads 81, 82, 83 becomes narrow upper pieces 81a, 82a, 83, wide vertical pieces 81b, 82b, 83b, and similarly wide lower pieces 81c, 82c, 83c, respectively. A part is formed. In FIG. 3, a flat oval shape is formed at a position corresponding to the end portion of each of the element mount side lead 7 and the wire connection side leads 81, 82, and 33 and the lower pieces 7 c, 81 c, 82 c, and 83 c. The holes 21 and 22 are for reducing the cutting resistance when cutting along the break lines 23 and 24.

  In such a lead frame 20, the element mount side lead is compared with each pair of leads 7, 81 to 83 which are paired with the element mount side lead 7 and a set of three wire connection side leads 81, 82, 83. Three light emitting elements 91, 92, 93 are mounted on the element mounting portion 7 f at the top end of the upper piece 7, and wire connection at the tip of each of the light emitting elements 91, 92, 93 and the wire connection side leads 81, 82, 83 is performed. Wire bonding is performed between the portions 81f, 82f, and 83f. That is, as shown in FIG. 4, three light emitting elements 91, 92, 93 are fixed with silver paste on the lower surface side of the element mount portion 7f at the tip of the upper piece 7a of the element mount side lead 7, and subsequently this Wire bonding is performed between each of the fixed light emitting elements 91, 92, 93 and the wire connection portions 81f, 82f, 83f at the tips of the upper pieces 81a, 82a, 83a of the wire connection side leads 81, 82, 83. For example, wires 101, 102, 103 such as gold wires are connected.

  Thereafter, as shown in FIG. 5, the light emitting elements 91, 92, 93 of three colors mounted on the element mounting portion 7f at the top end of each element mounting side lead 7 and connected to the wires 101, 102, 103, respectively. The whole is covered with the first transparent resin 96 mixed with the above-described light-dispersible powder particles 95 after being dropped.

  Subsequently, the element mount side lead 7 forming a pair of lead frames 20 and a set of three wire connection side leads 81, 82, 83 are attached to each of the concave cases 6. The procedure is shown in FIG. That is, as shown in FIG. 7 (a), three light emitting elements 91, 92, 93 are mounted, and the element mount side lead 7 and the wire forming a pair to which the wires 101, 102, 103 are connected by wire bonding. The connection-side leads 81, 82, 83 are turned upside down and the portions corresponding to the narrow upper pieces 7 a, 81 a, 82 a, 83 a are fitted into the grooves 4, 51, 52, 53 of the concave case 6. . Thereby, inside the concave case 6, the portions corresponding to the narrow upper pieces 7 a, 81 a, 82 a, 83 a are located above the reflecting surface 2, and the wide vertical pieces 7 b, 81 b, 82b and 83b and the parts corresponding to the lower pieces 7c, 81c, 82c and 83c are located. Further, the grooves 4, 51, 52, 53 of the concave case 6 have respective bent base portions 7a ′, 81a′82a ′ of the paired element mount side lead 7 and the three wire connection side leads 81, 82, 83. , 83a ′ are fitted.

  Next, as shown in FIG. 7B, in each of the grooves 4, 51, 52, 53 of the concave case 6, a pair of element mount side leads 7 and three wire connection side leads 81, 82, 83, respectively. The stepped portions 7a ′, 81a′82a ′, 83a ′ are filled with a small UV curable resin so as to block the step from the upper surface side of the fitting portion to the upper surface of the concave case 6 and cured. 11, 121, 122, 123 are formed.

  Subsequently, as shown in FIG. 7C, a transparent resin 13 such as a high-viscosity transparent epoxy resin or a transparent silicone resin containing a curing catalyst is filled in the concave portion of the concave case 6 up to its upper edge surface. Light color mixture covering the light emitting elements 91, 92, 93 and the entire light emitting elements 91, 92, 93 by curing in an atmosphere furnace at 130 ° C and corresponding to the narrow upper pieces 7a, 81a, 82a, 83a The first transparent resin 96 and the wires 101, 102, 103 are integrated with the concave case 6.

  In this way, the portion corresponding to the element mount side lead 7 and the upper pieces 7a, 81a, 82a, 83a of the three wire connection side leads 81, 82, 83 is fixed to the concave case 6 with the transparent resin 13. After that, the lead frame 20 is cut along the cutting lines 23 and 24, and the individual element mount side lead 7 and the three wire connection side leads 81, 82, and 83 are separated from the lead frame 20.

  Next, as shown in FIG. 7 (d), bending is performed on the portion of the element mount side lead 7 and the three wire connection side leads 81, 82, 83 that are paired and protruding outside the concave case 6 as shown in FIG. . In this bending process, the portions corresponding to the wide vertical pieces 7b, 81b, 82b, 83b are arranged so that the bent base portions 7a ′, 81a ′, 82a ′, 83a ′ connected to the vertical pieces 7b, 81b, 82b, 83b are along the side surfaces of the concave case 6 in the figure. It is bent to the side so that it is vertical, and further bent inward so that portions corresponding to the lower pieces 7c, 81c, 82c, 83c are in contact with the bottom surface of the concave case 6. Thus, the element mount side lead 7 and the three wire connection side leads 81, 82, 83 forming a pair are respectively formed as a narrow upper piece 7 a, 81 a, 82 a, 83 a and a wide vertical piece 7 b, 81 b, 82 b, 83 b. The wide lower pieces 7c, 81c, 82c, 83c are bent to complete the bending process. When this bending process is completed, the reflection type light emitting diode 1 shown in FIGS. 1 and 2 is completed.

  After that, if necessary, the lower pieces 7c, 81c, 82c, and 83c of the element mount side lead 7 and the wire connection side leads 81, 82, and 83 which form a pair are soldered to the bottom surface of the concave case 6. May be fixed.

  As described above, in the reflection type light emitting diode 1 of the present embodiment, as shown by the arrow line in FIG. Light exits from the upper surface of the case 6 in a direction perpendicular thereto. For this reason, in the reflective light emitting diode 1 of the present embodiment, light having a uniform direction and strong directivity, and therefore high brightness light can be obtained where the light hits. In addition, in the case of the reflective light emitting diode 1 of the present embodiment, the three-color light emitting elements 91, 92, and 93 are covered with the first transparent resin 96 mixed with the light dispersible resin 95, so Close and high brightness white light can be obtained.

  In the above-described embodiment, three light emitting elements 91, 92, 93 are mounted on the element mount portion 7f of the element mount side lead 7, and a set of three wire connection side leads 81, 82 and 83 are provided, but the number of light emitting elements is not limited to three, and may be two light emitting elements having different light emission colors. Evenly mixed color light can be emitted with high brightness. In this case, the same number of wire connection side leads as the number of light emitting elements are provided.

  Furthermore, according to the embodiment of the present invention, the example in which the reflecting surface 2 is provided on the bottom surface of the concave portion of the concave case has been described. However, the transparent resin and the lead frame are integrally formed in advance using a technique such as molding, and the concave shape is obtained. The structure which forms the reflective surface 2 in the bottom face side of transparent resin used as the fitting surface with respect to the recessed part of a case may be sufficient. Further, the box-shaped concave case 6 is not necessarily required as long as the leads 7, 81, 82, 83 are fixed and white light can be emitted.

  (Second Embodiment) Although the first embodiment described above is for the reflective light emitting diode 1, the present invention is not limited to this example. It can also be used for light emitting diodes of the type. For example, as shown in FIG. 12, also in the SMD light emitting diode 200, RGB three-color light emitting elements 91, 92, 93 are mounted on the lead 7, and the light dispersible powder particles 95 similar to those in the above embodiment are mixed in the periphery. By covering with the first transparent resin 96 and using this as a light emitting diode light source, an SMD light emitting diode that emits white light close to natural light can be configured. 2 is a reflecting surface, 6 is a case, 81, 82, and 83 are wire connection side leads, and 101, 102, and 103 are wires.

  Even in the present embodiment, light of an emission color obtained by uniformly mixing a plurality of color lights can be emitted from the light emitting diode.

  The present invention can be applied not only to the reflection type light emitting diode and the SMD light emitting diode as described above but also to a general bullet type light emitting diode.

DESCRIPTION OF SYMBOLS 1 Reflection type light emitting diode 2 Reflecting surface 3 Wall part 4, 5 Groove 6 Concave case 7 Element mount side lead 81, 82, 83 Wire connection side lead 7a, 81a, 82a, 83a Upper piece 7b, 81b, 82b, 83b Vertical piece 7c, 81c, 82c, 83c Lower piece 7f Element mounting part 13 Mold resin 81f, 82f, 83f Wire connection part 91, 92, 93 Light emitting element 95 Light dispersible powder 96 First transparent resin 101, 102, 103 Wire 200 SMD light emitting diode

Claims (4)

With a light emitting diode structure, a plurality of light emitting elements with different emission colors,
A light-emitting diode, comprising: a transparent resin in which light-dispersible powder particles having an average particle size of 0.050 μm to 0.5 μm are coated to cover the plurality of light-emitting elements.   2. The light emitting diode according to claim 1, wherein the plurality of light emitting elements are three light emitting elements that emit color lights of R, G, and B colors, respectively. For the main body having a concave reflecting surface inside, the element mount side lead is installed so that the element mounting portion is located in the center of the opening side of the reflecting surface,
Installing a plurality of wire connection side leads so that the wire connection portion is located adjacent to the element mount portion,
In the light emitting diode structure, a plurality of light emitting elements having different emission colors are mounted on the element mount portion of the element mount side lead,
A wire is connected between each of the plurality of light emitting elements and each of the wire connection portions of the plurality of wire connection side leads,
The periphery of the plurality of light emitting elements is covered with a first transparent resin in which light-dispersible powder particles having an average particle size of 0.050 μm to 0.5 μm are dispersed,
The plurality of light emitting elements, wires, the first transparent resin covering them, the element mount side leads, and the plurality of wire connection side leads are fixed on the reflecting surface of the main body with a second transparent resin. A reflective light emitting diode characterized by the above.   4. The reflective light emitting diode according to claim 3, wherein three light emitting elements for emitting R, G, and B colors are mounted on the element mount portion of the element mount side lead.