JP2010276478A - Acceleration sensor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an acceleration sensor device wherein position deviation of an acceleration sensor is suppressed. <P>SOLUTION: The acceleration sensor device 100 includes the acceleration sensor 20, including a fixed part 13, a weight part 11 displaceable with respect to the fixed part 13, and beam parts 12 bending following displacement of the weight part 11, whose one end is connected to the fixed part 13, and whose other end is connected to the weight part 11 respectively; a substrate 1, having a main surface 1A arranged oppositely to a bottom surface of the fixed part 13, and having a recessed part 2 storing the acceleration sensor 20; and an adhesive 4 for bonding the acceleration sensor 20 to the substrate 1. The fixed part 13 has a chamfering part 5, at least on a part of the outer periphery of the bottom surface, and the adhesive 4 is formed so as to be interposed between the chamfering part 5 and the main surface 1A. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an acceleration sensor device with improved impact resistance.

  FIG. 6 shows a cross-sectional view of a conventional acceleration sensor device. The acceleration sensor device shown in the figure has a configuration including an acceleration sensor 200 mainly manufactured by processing a silicon substrate, and a mounting substrate 250 on which the acceleration sensor 200 is mounted.

  The acceleration sensor element 200 includes a weight part 201, a frame-shaped fixing part 202 surrounding the weight part 201, a beam part 203 connected to the weight part 201 and the fixing part 202, and a piezo formed on the beam part 203. And a resistance element (not shown).

  When an external force corresponding to acceleration is applied to the acceleration sensor device having such an acceleration sensor 200, the weight portion 201 moves, and the beam portion 203 is deformed accordingly, and the piezoresistive element is also deformed. The acceleration is detected based on the change in resistance value due to the deformation of the piezoresistive element.

  Such an acceleration sensor 200 is fixed to the mounting substrate 250 by an adhesive 300 interposed between the lower surface of the fixing portion 202 and the mounting surface of the mounting substrate 250 (see, for example, Patent Document 1).

JP 2004-212246 A

  In the conventional acceleration sensor device as shown in FIG. 6, the acceleration sensor 200 is bonded to the mounting substrate 250 with the adhesive 300 interposed between the bottom surface of the fixed portion 202 and the mounting substrate 250. Therefore, when the acceleration in the horizontal direction is applied to the mounting surface of the mounting substrate 250, the acceleration sensor 200 may be displaced in the horizontal direction and contact the inner surface of the mounting substrate 250.

  When the mounting substrate 250 and the acceleration sensor 200 are in contact with each other, there is a risk of causing a problem in acceleration detection.

  The present invention has been devised in view of the various circumstances as described above, and an object thereof is to provide an acceleration sensor device that is less likely to cause displacement of the acceleration sensor when acceleration is applied. .

  The acceleration sensor device according to the present invention includes a fixed portion, a weight portion that is displaceable with respect to the fixed portion, one end connected to the fixed portion, and the other end connected to the weight portion, along with the displacement of the weight portion. An acceleration sensor including a beam portion that bends, a base body having a concave portion having a main surface in which the acceleration sensor is accommodated, and an adhesive that joins the acceleration sensor and the base body, The fixing portion has a chamfered portion at least at a part of the outer periphery of the bottom surface, and the adhesive is provided so as to be interposed between the chamfered portion and the main surface.

  According to the acceleration sensor device of the present invention, the chamfered portion is provided on at least a part of the outer periphery of the bottom surface of the fixed portion, and the adhesive member interposed between the chamfered portion and the main surface of the base body is provided. It can also be bonded in the lateral direction. Since the acceleration sensor can be fixed in this way, even when an acceleration in the horizontal direction is applied to the mounting surface, the acceleration sensor can be hardly displaced in the horizontal direction with respect to the mounting surface.

1 is a schematic perspective view of an acceleration sensor device according to an embodiment of the present invention. It is a typical top view in the state where the lid of the acceleration sensor device shown in Drawing 1 was removed. FIG. 3 is a schematic cross-sectional view of the acceleration sensor device shown in FIG. 1, where (a) is a cross-sectional view taken along line AA ′ of FIG. 2 and (b) is a cross-sectional view taken along line BB ′ of FIG. It corresponds to the cross section when It is a typical perspective view of the acceleration sensor mounted in the acceleration sensor apparatus shown in FIG. It is a typical perspective view of the acceleration sensor concerning the modification of this invention. It is typical sectional drawing which shows the conventional acceleration sensor roughly.

  Exemplary embodiments of an acceleration sensor and an acceleration sensor device according to the present invention will be described below in detail with reference to the drawings. Note that the drawings used in the following embodiments are schematic, and the dimensional ratios in the drawings do not necessarily match the actual ones. Further, the present invention is not limited to the following embodiments, and various changes and improvements can be made without departing from the gist of the present invention. In this embodiment, a three-dimensional acceleration sensor device using the piezoresistance effect will be described as an example.

<Acceleration sensor device>
FIG. 1 is a perspective view of the acceleration sensor device 100 according to the present embodiment, and FIG. 2 is a plan view of the acceleration sensor device 100 of FIG. 3 is a cross-sectional view of the acceleration sensor device 100 shown in FIG. 2. FIG. 3 (a) corresponds to a cross section taken along the line AA 'of FIG. 2, and FIG. It corresponds to a cross section when cut along line BB ′. As shown in these drawings, the acceleration sensor device 100 according to the present embodiment is mainly composed of an acceleration sensor 20 and a base 1.

  First, the acceleration sensor 20 will be described. FIG. 4 is a perspective view of the acceleration sensor 20. As shown in FIG. 4, the acceleration sensor 20 includes a frame-shaped fixed portion 13, a weight portion 11 that can be displaced with respect to the fixed portion 13, one end connected to the fixed portion 13, and the other end connected to the weight portion 11. And a beam portion 12.

  When acceleration is applied to the acceleration sensor 20, a force corresponding to the acceleration acts on the weight part 11, and the beam part 12 is bent as the weight part 11 moves. The weight part 11 in the present embodiment is provided with four attached weight parts 11 ′ connected to the four corners thereof. The attached weight portion 11 ′ is formed integrally with the weight portion 11. By providing the attached weight portion 11 ′, the deflection of the beam portion 12 with respect to acceleration increases, and the detection sensitivity of acceleration can be improved. In addition, since the structure, function, and formation method of the weight part 11 and attachment weight part 11 'are the same or similar, below, description of attachment weight part 11' may be abbreviate | omitted.

  The weight portion 11 has a substantially square planar shape, and the length of one side thereof is set to, for example, 0.25 mm to 0.5 mm. Moreover, the thickness of the weight part 11 is set to 0.2 mm-0.625 mm, for example. The attached weight portion 11 ′ has a substantially square shape in the same manner as the weight portion 11, and the length of one side thereof is set to 0.1 mm to 0.4 mm, for example. Further, the thickness of the attached weight portion 11 ′ is set to 0.2 mm to 0.625 mm, for example, so as to have the same thickness as the weight portion 11. In addition, the planar shape of the weight part 11 and the attached weight part 11 'is not limited to a square, and can be any shape such as a circle or a rectangle. Moreover, the weight part 11 and the attached weight part 11 'are integrally formed by processing an SOI (Silicon on Insulator) substrate, for example.

  A frame-shaped fixing portion 13 is formed so as to surround the weight portion 11 and the attached weight portion 11 ′. The fixed portion 13 has a substantially square opening, and has a substantially square opening slightly larger than the weight portion 11 and the attached weight portion 11 ′ at the center. One side of the fixed portion 13 is set to, for example, 1.0 mm to 3.0 mm, and the width of the arm constituting the fixed portion 13 (the width in the direction perpendicular to the longitudinal direction of the arm) is, for example, 0.3 mm to 1.8 mm. Set to Moreover, the thickness of the fixing | fixed part 13 is set to 0.2 mm-0.625 mm, for example.

  Further, the fixing portion 13 is formed with a chamfered portion 5 on at least a part of the outer periphery of the bottom surface. An adhesive 4 is interposed between the chamfered portion 5 and the base body 1 described later, and the acceleration sensor and the base body 1 are joined.

  A beam portion 12 is provided between the fixing portion 13 and the weight portion 11 as shown in FIG. The beam portion 12 has one end connected to the central portion on the upper surface side of each side of the weight portion 11 and the other end connected to the central portion on the upper surface side of each side on the inner periphery of the side surface of the fixed portion 13. Further, as shown in FIG. 2, the acceleration sensor 20 in the present embodiment is provided with four beam portions 12. The beam portions 12 may be provided at the four corners on the upper surface side of each side in the inner periphery of the side surface of the fixed portion 13.

  The beam portion 12 has flexibility. When acceleration is applied to the acceleration sensor 20, the weight portion 11 moves, and the beam portion 12 bends as the weight portion 11 moves. For example, the beam portion 12 has a length in the longitudinal direction set to 0.15 mm to 0.8 mm, and a width (a length in a direction orthogonal to the longitudinal direction) set to 0.04 mm to 0.2 mm. Thus, flexibility is expressed by forming the beam portion 12 to be elongated and thin.

  On the upper surface of the beam portion 12, a plurality of resistance elements 9 are formed as shown in FIG. The resistive element 9 is a piezoresistive element formed by, for example, implanting boron into a silicon substrate. In the present embodiment, these resistors are placed at predetermined positions on the beam portion 12 so that acceleration in the three axis directions (X-axis direction, Y-axis direction, and Z-axis direction in the three-dimensional orthogonal coordinate system shown in FIG. 2) can be detected. Element 9 is formed. For example, the two beam portions 12 extending in the X-axis direction are provided with four resistance elements 9 for detecting the acceleration in the X-axis direction, and two are arranged on each beam portion 12. . Among these four resistance elements 9, the resistance elements arranged on the fixed portion 13 side are connected in series, the resistance elements arranged on the weight portion 11 side are connected in series, and these are connected in parallel. This constitutes a bridge circuit.

  The two beam portions 12 extending in the Y-axis direction are provided with four resistance elements 9 for detecting acceleration in the Y-axis direction. These resistance elements 9 are used for detecting acceleration in the X-axis direction. The resistor circuit 9 is arranged in the same manner, and a bridge circuit is configured by connecting the resistor elements.

  In addition, the four resistance elements 9 for detecting the acceleration in the Z-axis direction are respectively connected to the four resistance elements 9 for detecting the acceleration in the X-axis direction on the two beam portions 12 extending in the X-axis direction. It is formed to line up. The resistance element 9 for acceleration detection in the Z-axis direction differs from the resistance element 9 for acceleration detection in the X-axis direction in the way of connecting the resistance elements, and in this embodiment, extends in the X-axis direction. The resistance element 9 on the fixed part 13 side provided in one of the two beam parts 12 and the resistance element 9 on the weight part 11 side provided in the other beam part 12 are connected in series. A bridge circuit is configured. The resistance element 9 for acceleration detection in the Z-axis direction may be provided in the two beam portions 12 extending in the Y-axis direction in the same manner as the beam element 12 extending in the X-axis direction.

  When acceleration is applied to the acceleration sensor 20 in which such a bridge circuit is assembled, the beam portion 12 is bent as described above, and the resistance element 9 is deformed along with this bending, so that the output voltage detected by the bridge circuit changes. To do. The change in the output voltage based on the change in the resistance value is taken out as an electrical signal and is processed by the IC chip 23, whereby the direction and magnitude of the applied acceleration can be detected. An element-side electrode pad 15 electrically connected to the resistance element 9 is provided on the upper surface of the fixing portion 13, and the resistance elements 9 are connected to each other through the element-side electrode pad 15. The signal is taken out.

  The acceleration sensor 20 is mounted on the base 1 as shown in FIG. The base body 1 has a function of protecting the acceleration sensor 20, and a recess 2 for accommodating the acceleration sensor 20 is provided inside. The base body 1 is configured, for example, by laminating four insulating layers 1a to 1d made of a ceramic material or the like. The insulating layer 1a is made of a flat member, and the acceleration sensor 20 is placed on the main surface 1A. The insulating layer 1b is a frame-like member having a through hole slightly larger than the acceleration sensor 20 so as to accommodate the acceleration sensor 20 placed on the main surface 1A, and is joined to the insulating layer 1a. Here, the recess 2 of the substrate 1 is formed by the main surface 1A of the insulating layer 1a and the through hole of the insulating layer 1b. The insulating layer 1c is a frame-like member having an opening wider than the through hole of the insulating layer 1b, and is joined to the insulating layer 1b so that a part of the main surface of the insulating layer 1b is exposed. Furthermore, an insulating layer 1d is joined to the other main surface of the insulating layer 1a opposite to the main surface 1A, and the insulating layer 1d is made of a frame-like member having a hole like the insulating layer 1b. The IC chip 23 is accommodated in the hole of the insulating layer 1d formed in this way.

  A plurality of substrate-side electrode pads 16 are formed on the main surface of the insulating layer 1b exposed from the opening of the insulating layer 1c. The substrate-side electrode pad 16 is electrically connected to the element-side electrode pad 15 provided on the upper surface of the fixed portion 13 of the acceleration sensor 20 by a thin metal wire 17. A plurality of external terminals 18 are provided on the lower surface of the base 1, and the external terminals 18 are connected to the substrate-side electrode pad 16 via via-hole conductors 19 provided inside the base 1. That is, the electric signal of the acceleration sensor 20 is taken out to the outside through the element side electrode pad 15, the fine metal wire 17, the substrate side electrode pad 16, the via hole conductor 19, the IC chip 23, the external terminal 18 and the like. The IC chip 23 is electrically connected to the acceleration sensor 20 and the external terminal 18 via a via-hole conductor 19 and a wiring conductor (not shown) provided on the base 1. The IC chip 23 is, for example, integrated with an amplifier circuit that amplifies the output signal of the acceleration sensor 20, a temperature correction circuit that corrects the temperature characteristics of the acceleration sensor 20, a noise removal circuit that removes noise, and the like.

  In the present embodiment, the chamfered portion 5 is formed at the end of the side that forms the outer periphery of the bottom surface of the fixed portion 13. Specifically, the chamfered portion 5 is formed such that the corner portion of the fixed portion 13 corresponding to the position of the intersection of virtual lines passing through two adjacent sides on the outer periphery of the bottom surface of the fixed portion 13 is chamfered.

  In the acceleration sensor device 100 according to the present embodiment, the adhesive 4 is interposed between the chamfered portion 5 provided on the fixed portion 13 and the base body 1, and the acceleration sensor 20 and the base body 1 are joined. As described above, since the adhesive 4 is interposed between the chamfered portion 5 and the base 1, the displacement of the acceleration sensor 20 in the horizontal direction (hereinafter simply referred to as the horizontal direction) with respect to the main surface 1A. Can be suppressed. Since the displacement of the acceleration sensor 20 in the horizontal direction can be suppressed, the acceleration sensor 20 and the base body 1 are less likely to collide, and the impact resistance of the acceleration sensor device 100 can be improved.

  Furthermore, by providing the adhesive 4 on the chamfered portion 5 of the fixing portion 13, the adhesive 4 can be disposed between the chamfered portion 5 and the main surface 1A. For this reason, when the acceleration sensor 20 is viewed in plan, the adhesive 4 is less likely to protrude from the fixed portion 13, so that the acceleration sensor device 100 can be reduced in size. Further, since the adhesive 4 is disposed on the chamfered portion 5, the vertical bonding strength with respect to the main surface 1A is maintained without increasing the bonding area, and the displacement of the acceleration sensor 20 in the horizontal direction is suppressed. be able to.

  In the present embodiment, the chamfered portion 5 is also provided at the end of the side that forms the outer periphery of the upper surface of the fixed portion 13. As described above, since the corners of the fixing portion 13 are chamfered, the stress does not easily concentrate on one point even when the base 1 and the fixing portion 13 collide with each other. 20 impact resistance can be improved.

  Such a chamfered portion 5 is preferably formed to have a curved surface that protrudes toward the base 1 side. In this way, by forming the chamfered portion 5 with a curved surface, the adhesion area between the chamfered portion 5 and the adhesive 4 can be increased, so that the displacement of the acceleration sensor in the horizontal direction can be further reduced. it can. In addition, since the chamfered portion 5 is curved, stress concentrated depending on the shape can be relieved. Therefore, when the acceleration sensor 20 and the base body 1 collide with each other, the fixing portion 13 is less likely to be chipped. The impact property can be further improved.

  In the present embodiment, the case where the chamfered portion 5 is formed at the end of the side that forms the outer periphery of the bottom surface of the fixed portion 13 has been described. It may be provided. In this way, the adhesive 4 is interposed between the chamfered portion 5 formed on the outer periphery of the bottom surface of the fixed portion 13 and the main surface 1A of the base body 1, and the acceleration sensor 20 and the base body 1 are joined. Thus, the displacement of the acceleration sensor 20 in the horizontal direction can be suppressed.

  For example, a silicone resin or an epoxy resin can be used as the adhesive 4. The adhesive 4 is mixed with a spherical spacer member 3 having a predetermined diameter so that a gap of a predetermined size is formed between the lower surface of the weight portion 11 and the main surface 1A of the base body 1. ing. That is, the size of the gap between the lower surface of the weight portion 11 and the main surface 1 </ b> A of the base body 1 can be controlled by the spacer member 3. The spacer member 3 is a spherical member having a predetermined hardness such as silica, silicon, divinylbenzene, and the diameter thereof is, for example, 2 to 30 μm.

  When the beam portion 12 is connected to the center of the four upper sides of the weight portion 7 as in the acceleration sensor 20 of the present embodiment, the acceleration sensor 20 and the base 1 are joined at the four corners of the fixing portion 13. Is preferred. As a result, the distance between the joint portion of the acceleration sensor 20 to the base 1 and the beam portion 12 is increased, so that the influence exerted on the beam portion 12 by the residual stress that can be generated due to the bonding by the adhesive 4 is reduced. It is possible to suppress deterioration of the electrical characteristics of the acceleration sensor device 100.

  The lid 10 is fixed to the main surface 1A of the base 1 so as to close the opening of the base 1 to which the acceleration sensor 20 as described above is bonded. As a result, the acceleration sensor 20 is hermetically sealed. The lid 10 is made of, for example, a metal plate such as 42 alloy or stainless steel, and is bonded to the substrate 1 with a bonding agent such as silver solder or epoxy resin.

  In addition, a substrate side chamfered portion that is formed along the shape of the chamfered portion 5 may be formed in the recess 2 of the substrate 1. By bonding the acceleration sensor 20 and the substrate 1 so that the adhesive 4 is interposed between the chamfered portion 5 and the substrate side surface chamfered portion, the substrate 1 can be bonded at a position facing the chamfered portion 5. Therefore, the displacement of the acceleration sensor in the horizontal direction can be further reduced.

As described above, in the present embodiment, the acceleration sensor using the piezoresistive effect for acceleration detection has been described. However, the present invention can be appropriately applied to an acceleration sensor that performs acceleration detection using the capacitance effect.
(Modification)
FIG. 5 is a perspective view showing a modification of the acceleration sensor according to the above-described embodiment. The acceleration sensor 20 according to this modification includes a second chamfered portion 6 that is further chamfered along the side that forms the outer periphery from the end of the chamfered portion 5 that is formed at the end of the side that forms the outer periphery of the fixed portion 13. Have.

  Since the second chamfered portion 6 is thus provided, the impact resistance of the acceleration sensor 20 can be further improved on the side that forms the outer periphery of the fixed portion 13.

<Method for manufacturing acceleration sensor device>
Next, the manufacturing process of the acceleration sensor device according to this embodiment of the present invention will be described.

(Substrate manufacturing process)
First, the base body 1 is prepared. The substrate 1 is formed by laminating a plurality of insulating layers 1a to 1d made of a ceramic material such as alumina. Specifically, a flat insulating layer 1a having a main surface 1A, a frame-like insulating layer 1b having a through hole, and an insulating layer 1c having an opening larger than the through hole of the insulating layer 1b are sequentially stacked. The base body 1 is manufactured by bonding the insulating layer 1d to the other main surface facing the main surface 1A of 1a. The main surface 1A of the insulating layer 1a and the through hole of the insulating layer 1b serve as the recess 2 of the substrate 1.

(Sensor manufacturing process)
While the base body 1 is manufactured, first, the weight portion 11, the frame-shaped fixing portion 13 surrounding the weight portion 11, one end is connected to the side surface of the fixing portion 13, and the other end is connected to the side surface of the weight portion 11. An acceleration sensor 20 having a beam portion 12 to be connected, a resistance element 9 provided on the beam portion 12, and a chamfered portion 5 on at least a part of the outer periphery of the bottom surface of the fixed portion 13 is prepared. On the other hand, a substrate 1 made of a silicon layer and on which the acceleration sensor 20 is placed is prepared.

The acceleration sensor 20 is manufactured using, for example, an SOI substrate having a SiO ₂ layer between silicon layers. First, a resistance element 9 made of a piezoresistor is formed by implanting boron into the silicon layer on the surface of the SOI substrate by ion implantation. After the resistor element 9 is formed, a wiring connected to the piezoresistive element is produced using a metal sputtering and dry etching apparatus. Next, the fixing part 13 and the weight part 11 are formed by providing a perforated part on the back side of the SOI substrate by a well-known semiconductor microfabrication technique, for example, photolithography or deep dry etching, and then the perforated part from the front side. The beam part 12 is formed by performing the process which penetrates to the end.

  Next, the chamfered portion 5 is formed by chamfering the corner portion of the fixed portion 13 using polishing or etching. In addition, it can form easily by setting the chamfer 5 so that it may become a (111) cleavage surface of silicon. Since the fixing portion 13 is easily chipped along the (111) cleavage surface, the impact resistance of the acceleration sensor 20 can be improved by making the chamfered portion 5 a (111) cleavage surface.

(Mounting process)
Next, the adhesive 4 is applied to the main surface 1 </ b> A of the base 1. The adhesive 4 is a silicone resin or an epoxy resin before being cured, and is applied to the main surface 1A of the base 1 using a dispenser or the like. The adhesive 4 is mixed with a spherical spacer member 3 made of silica, silicon, divinylbenzene or the like and having a diameter of about 2 μm to 30 μm. The spacer member 3 serves as the lower surface of the fixing portion 13 and the main surface 1A of the base 1. Can be formed between the main surface 1 </ b> A of the base 1 and the lower surface of the weight portion 7.

  Next, the acceleration sensor 20 is placed at a predetermined position on the main surface 1A of the base 1 such that the adhesive 4 is interposed between the chamfered portion 5 and the main surface 1A. Thus, when the acceleration sensor 20 is mounted on the base body 1, even when the bottom surface of the fixing portion 13 is placed with an inclination with respect to the main surface 1 </ b> A of the base body 1, By chamfering, the stress concentrated on one portion of the bottom surface of the fixed portion 13 can be relaxed. As a result, it is possible to prevent the fixing portion 13 from being easily broken when the acceleration sensor 20 is mounted.

  After the acceleration sensor 20 is placed on the main surface 1A of the base body 1 in this way, the acceleration sensor 20 and the base body 1 are joined by curing the adhesive 4. After the acceleration sensor 20 is bonded to the base body 1, the element side electrode pad 15 provided on the acceleration sensor 20 and the substrate side electrode pad 16 provided on the base body 1 are connected by a thin metal wire 17 made of gold, copper, aluminum or the like. Finally, a metal lid 10 made of 42 alloy or the like is bonded to the upper surface of the substrate 1 (the upper surface of the insulating layer 1c) with a bonding agent such as silver solder or epoxy resin, thereby completing the acceleration sensor device 100 as a product.

  The present invention is not limited to the above embodiments, and various changes and improvements can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Board | substrate 1a-1d Insulating layer 2 Recessed part 3 Spacer member 4 Adhesive material 5 Chamfering part 6 2nd chamfering part 11 Weight part 11 'Attached weight part 9 Resistance element 10 Lid 11 Weight part 11' Attached weight part 12 Beam part 13 Fixed part DESCRIPTION OF SYMBOLS 15 Element side electrode pad 16 Substrate side electrode pad 17 Metal fine wire 18 External terminal 19 Via-hole conductor 20 Acceleration sensor 22 Spacer member 23 IC chip 100 Acceleration sensor device

Claims (5)

A fixed portion; a weight portion that is displaceable with respect to the fixed portion; and a beam portion having one end connected to the fixed portion and the other end connected to the weight portion, and being bent in accordance with the displacement of the weight portion. Acceleration sensor,
A base body having a recess having a main surface in which the acceleration sensor is housed;
An adhesive that joins the acceleration sensor and the substrate;
The fixing portion has a chamfered portion at least at a part of the outer periphery of the bottom surface,
The said adhesive material is an acceleration sensor apparatus interposed between the said chamfering part and the said main surface.   The acceleration sensor device according to claim 1, wherein the chamfered portion has a curved surface curved toward the base.   The acceleration sensor device according to claim 1, wherein the chamfered portion is formed at an end of the outer periphery of the fixed portion.   The acceleration sensor device according to claim 3, wherein the chamfered portion has a second chamfered portion further chamfered along the side from the end portion.   The said recessed part has the base | substrate side chamfering part which opposes the said fixing | fixed part, and follows the shape of the said chamfering part, The said adhesive material intervenes between the said chamfering part and the said base | substrate side chamfering part. The acceleration sensor device according to any one of the above.

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