JP2010273240A - Condenser headphone unit - Google Patents

Condenser headphone unit Download PDF

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JP2010273240A
JP2010273240A JP2009125038A JP2009125038A JP2010273240A JP 2010273240 A JP2010273240 A JP 2010273240A JP 2009125038 A JP2009125038 A JP 2009125038A JP 2009125038 A JP2009125038 A JP 2009125038A JP 2010273240 A JP2010273240 A JP 2010273240A
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diaphragm
headphone unit
conductive
fixed electrode
pile material
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JP5377077B2 (en
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Yutaka Akino
裕 秋野
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Audio Technica KK
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a condenser headphone unit having a diaphragm with a conductive coating and an insulation coating formed thereon in which an electrode is surely led out from the diaphragm. <P>SOLUTION: The condenser headphone unit includes: a diaphragm 12 provided in tension on a support ring 11; and fixed pole plates 20 disposed oppositely on at least one surface of the diaphragm 12 via a spacer member 240, wherein a conductive coating and an insulation coating are formed like a laminate on the diaphragm 12. In this unit, a circuit board is used as each of the fixed pole plates 20, a fixed electrode part 210 is formed on a surface of the fixed pole plate 20 which opposes an effective vibration part of the diaphragm 12, peripheral electrode parts 220 are circularly formed around the fixed electrode parts 210 via an electric insulating region 230, pile materials 241 having conductivity are hair-transplanted on the peripheral electrode parts 220 via a conductive adhesive, the diaphragm 12 and the fixed pole plates 20 are oppositely disposed while using the pile materials 241 as a spacer member 240, and the conductive coating of the diaphragm 12 is electrically connected to the peripheral electrode parts 220 via the pile materials 241. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、コンデンサヘッドホンユニットに関し、さらに詳しく言えば、導電皮膜と絶縁皮膜とが形成されている振動板の電極引き出し技術に関するものである。   The present invention relates to a capacitor headphone unit, and more particularly, to an electrode drawing technique for a diaphragm on which a conductive film and an insulating film are formed.

コンデンサヘッドホンユニットに用いられる振動板には、通常、合成樹脂の薄膜フィルムが用いられるため、固定極とコンデンサを形成するうえで振動板に導電性を付与する必要がある。   Since the diaphragm used in the capacitor headphone unit is usually a synthetic resin thin film, it is necessary to impart conductivity to the diaphragm when forming the fixed electrode and the capacitor.

振動板に導電性を付与する方法のひとつとして、樹脂フィルムに金属蒸着膜を形成する方法が知られているが、振動板が大きく変位して固定極と機械的に接触した場合、その接触部分に電流が集中して流れて発熱し、最悪、振動板が破壊されることがある。   As a method of imparting conductivity to the diaphragm, a method of forming a metal vapor deposition film on a resin film is known, but when the diaphragm is displaced greatly and makes mechanical contact with the fixed electrode, the contact portion In the worst case, the diaphragm may be destroyed.

振動板に導電性を付与する別の方法として、通常帯電防止剤として用いられる界面活性剤を電荷保持剤として振動板に塗布する方法がある。界面活性剤によれば、きわめて薄い例えば０．１μｍ以下の導電皮膜を形成できるため、振動板の薄膜基材の機械的強度に殆ど影響を与えることがない。   As another method for imparting conductivity to the diaphragm, there is a method of applying a surfactant, which is usually used as an antistatic agent, to the diaphragm as a charge retention agent. According to the surfactant, a very thin conductive film of, for example, 0.1 μm or less can be formed, so that the mechanical strength of the thin film substrate of the diaphragm is hardly affected.

そのため、振動板の薄膜基材により薄くて機械的強度に優れた高分子フィルムである、例えば１．２μｍ厚のポリエチレンテレフタレート（ＰＥＴ），ポリフェニレンサルファイド（ＰＰＳ），ポリエチレンナフタレート（ＰＥＮ）などを選択でき、高音質のコンデンサヘッドホンユニットを作製することができる。   Therefore, a polymer film that is thinner and superior in mechanical strength due to the thin film base material of the diaphragm, for example, 1.2 μm thick polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyethylene naphthalate (PEN), etc. is selected. It is possible to produce a high-quality condenser headphone unit.

しかしながら、界面活性剤により導電皮膜を形成する方法では、その導電皮膜表面で水分を吸着する性質をもつため、吸着した水分によって電気抵抗値が低下すると言った別の問題が生ずる。   However, since the method of forming a conductive film with a surfactant has the property of adsorbing moisture on the surface of the conductive film, another problem arises that the electrical resistance value is reduced by the adsorbed moisture.

特に、結露が発生する高湿度環境下においては、結露を媒介として振動板から固定極へ成極電圧（約４００Ｖ）の漏洩電流が生じ、これが原因で雑音が発生することがある。   In particular, in a high-humidity environment where condensation occurs, leakage current of polarization voltage (about 400 V) is generated from the diaphragm to the fixed pole through condensation, which may cause noise.

そこで、特許文献１に記載の発明では、高分子フィルムであるＰＥＴ，ＰＰＳ，ＰＥＮ等からなる薄膜基材に界面活性剤からなる導電皮膜を形成して、さらにこの導電皮膜を覆うように、例えば０．１μｍ厚以下の絶縁皮膜（オーバーコート）を形成することが提案されている。   Therefore, in the invention described in Patent Document 1, a conductive film made of a surfactant is formed on a thin film substrate made of a polymer film such as PET, PPS, or PEN, and the conductive film is further covered, for example, It has been proposed to form an insulating film (overcoat) having a thickness of 0.1 μm or less.

これによれば、界面活性剤からなる導電皮膜の上に絶縁皮膜が形成されているため、導電皮膜の表面に水分が吸着されることがない。したがって、導電皮膜の導電抵抗を安定なものとすることができ、長時間にわたって導電皮膜にほぼ一定量の電荷を保持できる。また、結露が発生するような高湿度環境下においても絶縁皮膜があるため、振動板と固定極との間に漏洩電流が流れず、雑音の発生が防止される。   According to this, since the insulating film is formed on the conductive film made of the surfactant, moisture is not adsorbed on the surface of the conductive film. Therefore, the conductive resistance of the conductive film can be stabilized, and a substantially constant amount of charge can be held in the conductive film for a long time. In addition, since there is an insulating film even in a high humidity environment where condensation occurs, no leakage current flows between the diaphragm and the fixed electrode, thereby preventing noise.

特開２００６−４１５６７号公報JP 2006-41567 A

しかしながら、特許文献１のように、導電皮膜上に絶縁皮膜を形成する振動板には、次のような問題がある。   However, as in Patent Document 1, a diaphragm that forms an insulating film on a conductive film has the following problems.

導電皮膜は、支持リング（金属製）に張設されている振動板に対して、好ましくはスピンコート法により形成される。振動板の電極は、支持リングを介して取り出されるが、スピンコート法による場合、導電皮膜は支持リングの内周面に電気的に接触する。   The conductive film is preferably formed on the diaphragm stretched on the support ring (made of metal) by a spin coat method. The electrode of the diaphragm is taken out through the support ring, but in the case of spin coating, the conductive film is in electrical contact with the inner peripheral surface of the support ring.

そのため、振動板が大きく変位した場合、導電皮膜の端縁が部分的にしろ支持リングの内周面から剥がれることがあり、これが原因で支持リングと導電皮膜との電気的接続が不安定となり、感度にばらつきが発生する。なお、界面活性剤からなる導電皮膜は電気抵抗がきわめて高いため、テスター等で導通の良否を確認することは困難である。   Therefore, when the diaphragm is greatly displaced, the edge of the conductive film may be partially separated from the inner peripheral surface of the support ring, which causes the electrical connection between the support ring and the conductive film to become unstable, Variation in sensitivity occurs. In addition, since the electrically conductive film made of a surfactant has an extremely high electric resistance, it is difficult to check the continuity with a tester or the like.

したがって、本発明の課題は、導電皮膜と絶縁皮膜が形成されている振動板を備えるヘッドホンユニットにおいて、振動板から確実に電極を引き出すことにある。   Accordingly, an object of the present invention is to reliably pull out an electrode from a diaphragm in a headphone unit including a diaphragm on which a conductive film and an insulating film are formed.

上記課題を解決するため、本発明は、支持リングに所定の張力をもって張設されている振動板と、上記振動板の少なくとも片面側にスペーサ部材を介して対向的に配置される固定極板とを含み、上記振動板の少なくとも片面に導電皮膜が形成され、上記導電皮膜の上にさらに絶縁皮膜が形成されているコンデンサヘッドホンユニットにおいて、上記固定極板に回路基板が用いられ、上記回路基板には、上記振動板内の上記スペーサ部材にて囲まれる有効振動部分と対向する面に固定電極部が形成されているとともに、上記固定電極部の周りに電気的絶縁領域を介して周辺電極部が環状に形成されており、上記周辺電極部には、導電性接着剤を介して導電性を有するパイル材が植毛され、上記パイル材を上記スペーサ部材として上記振動板と上記固定極板とが対向的に配置され、上記振動板の上記導電皮膜が上記パイル材を介して上記周辺電極部に電気的に接続されていることを特徴としている。   In order to solve the above-described problems, the present invention provides a diaphragm that is stretched on a support ring with a predetermined tension, and a fixed electrode plate that is disposed to face at least one side of the diaphragm via a spacer member. A capacitor headphone unit in which a conductive film is formed on at least one surface of the diaphragm, and an insulating film is further formed on the conductive film, a circuit board is used for the fixed electrode plate, and the circuit board The fixed electrode portion is formed on the surface of the diaphragm facing the effective vibration portion surrounded by the spacer member, and the peripheral electrode portion is formed around the fixed electrode portion via an electrically insulating region. An annular pile is formed, and a conductive pile material is planted on the peripheral electrode portion via a conductive adhesive, and the pile material is used as the spacer member and the diaphragm and the upper plate. The fixed electrode plate is opposite arranged, the conductive film of the diaphragm is characterized in that it is electrically connected to the peripheral electrode portions through the pile material.

本発明において、好ましくは、上記パイル材は上記絶縁皮膜を破壊し得る剛性を備えている。また、上記パイル材が上記周辺電極部の全面に植毛されていることが好ましい。   In the present invention, preferably, the pile material has rigidity capable of breaking the insulating film. The pile material is preferably planted on the entire surface of the peripheral electrode portion.

本発明には、上記振動板の両面に上記導電皮膜と上記絶縁皮膜とが形成され、上記回路基板からなり上記周辺電極部に上記パイル材が植毛されている上記固定極板が上記振動板の両面に配置されている態様も含まれる。   In the present invention, the fixed electrode plate, in which the conductive film and the insulating film are formed on both surfaces of the diaphragm, and the pile electrode is formed on the peripheral electrode portion, is formed of the circuit board, is the diaphragm. The aspect arrange | positioned on both surfaces is also contained.

本発明によれば、支持リングに所定の張力をもって張設されている振動板と、振動板の少なくとも片面側にスペーサ部材を介して対向的に配置される固定極板とを含み、振動板の少なくとも片面に導電皮膜が形成され、導電皮膜の上にさらに絶縁皮膜が形成されているコンデンサヘッドホンユニットにおいて、固定極板に回路基板を用い、回路基板に振動板内のスペーサ部材にて囲まれる有効振動部分と対向する面に固定電極部を形成するとともに、固定電極部の周りに電気的絶縁領域を介して周辺電極部を環状に形成し、周辺電極部に、導電性接着剤を介して導電性を有するパイル材を植毛し、パイル材をスペーサ部材として振動板と固定極板とを対向的に配置し、振動板の導電皮膜をパイル材を介して周辺電極部に電気的に接続するようにしたことにより、回路基板の周辺電極部より振動板の電極を確実に引き出すことができる。   According to the present invention, the diaphragm includes a diaphragm that is stretched on the support ring with a predetermined tension, and a fixed electrode that is disposed to face at least one side of the diaphragm via the spacer member. In a condenser headphone unit in which a conductive film is formed on at least one side and an insulating film is further formed on the conductive film, a circuit board is used as the fixed plate, and the circuit board is surrounded by a spacer member in the diaphragm. A fixed electrode part is formed on the surface facing the vibration part, a peripheral electrode part is formed in an annular shape around the fixed electrode part via an electrically insulating region, and the peripheral electrode part is electrically conductive via a conductive adhesive. The pile material is implanted, the diaphragm is used as a spacer member, the diaphragm and the fixed electrode plate are arranged oppositely, and the conductive film of the diaphragm is electrically connected to the peripheral electrode portion via the pile material. By the may be withdrawn reliably electrode of the diaphragm from the peripheral electrode portions of the circuit board.

本発明の実施形態に係るヘッドホンユニットを示す概略的な断面図。1 is a schematic cross-sectional view showing a headphone unit according to an embodiment of the present invention. 上記ヘッドホンユニットの分解断面図。The exploded sectional view of the above-mentioned headphone unit. 上記ヘッドホンユニットにおける振動板の一部拡大断面図。FIG. 4 is a partially enlarged cross-sectional view of a diaphragm in the headphone unit. 上記ヘッドホンユニットにおける固定極板の振動板との対向面を示す正面図。The front view which shows the opposing surface with the diaphragm of the fixed pole plate in the said headphone unit.

次に、図１ないし図４を用いて本発明の実施形態について説明するが、本発明はこれに限定されるものではない。   Next, an embodiment of the present invention will be described with reference to FIGS. 1 to 4, but the present invention is not limited to this.

図１，図２を参照して、本発明の実施形態に係るコンデンサヘッドホンユニット１は、基本的な構成として、振動板組立体１０と、振動板組立体１０の左右両側に配置される固定極板２０Ｒ，２０Ｌとを備える。固定極板２０Ｒ，２０Ｌは同一構成であるため、左右を区別する必要がないときには、単に固定極板２０とする。   1 and 2, a capacitor headphone unit 1 according to an embodiment of the present invention basically includes a diaphragm assembly 10 and fixed poles disposed on both left and right sides of the diaphragm assembly 10. Plates 20R and 20L are provided. Since the fixed electrode plates 20R and 20L have the same configuration, the fixed electrode plate 20 is simply used when it is not necessary to distinguish between left and right.

振動板組立体１０は、金属製の支持リング（ダイアフラムリング）１１と、支持リング１１に所定の張力をもって張設された振動板１２とからなる。   The diaphragm assembly 10 includes a metal support ring (diaphragm ring) 11 and a diaphragm 12 stretched on the support ring 11 with a predetermined tension.

図３を併せて参照して、振動板１２は高分子フィルム１２０からなり、その両面には導電被膜１３０が形成され、さらに各導電皮膜１３０の上には絶縁皮膜１４０が形成されている。   Referring also to FIG. 3, diaphragm 12 is made of polymer film 120, conductive film 130 is formed on both surfaces thereof, and insulating film 140 is formed on each conductive film 130.

高分子フィルム１２０には、例えば厚さ１．２μｍ程度のポリエチレンテレフタレート（ＰＥＴ），ポリフェニレンサルファイド（ＰＰＳ），ポリエチレンナフタレート（ＰＥＮ）などが好ましく採用される。   For the polymer film 120, for example, polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyethylene naphthalate (PEN) having a thickness of about 1.2 μm is preferably employed.

導電皮膜１３０は界面活性剤よりなり、また、絶縁皮膜１４０は所定の絶縁剤溶液（例えば、アイ・エヌ・ジー社製の溶媒がフッ素系である商品名「フロロバリアーＦＰ１０５４」）により形成される。導電皮膜１３０，絶縁皮膜１４０ともに、好ましくはスピンコート法にて０．１μｍ厚以下に形成されるとよい。   The conductive film 130 is made of a surfactant, and the insulating film 140 is formed of a predetermined insulating agent solution (for example, a product name “Fluorobarrier FP1054” in which the solvent manufactured by ING Corp. is fluorine-based). . Both the conductive film 130 and the insulating film 140 are preferably formed to a thickness of 0.1 μm or less by spin coating.

図４を参照して、本発明では、固定極板２０（２０Ｒ，２０Ｌ）には、回路基板２０１が用いられる。回路基板２０１は片面銅張り積層板であってよく、その中央部分で振動板１２の有効振動部分と対向する面に、銅箔よりなる固定電極部２１０が形成される。この固定電極部２１０と、振動板１２の導電皮膜１３０との間で、１種のコンデンサが形成される。   Referring to FIG. 4, in the present invention, a circuit board 201 is used for the fixed plate 20 (20R, 20L). The circuit board 201 may be a single-sided copper-clad laminate, and a fixed electrode portion 210 made of copper foil is formed on the surface of the circuit board 201 that faces the effective vibration portion of the diaphragm 12. One type of capacitor is formed between the fixed electrode portion 210 and the conductive film 130 of the diaphragm 12.

なお、振動板１２の有効振動部分とは、振動板１２と固定極板２０との間に配置されるパレータ（間隔保持部材）によって囲まれる振動板１２の内側部分である。また、固定電極部２１０には多数の通気孔２１１が穿設される。   The effective vibration part of the diaphragm 12 is an inner part of the diaphragm 12 surrounded by a palator (a spacing member) disposed between the diaphragm 12 and the fixed electrode plate 20. In addition, a large number of air holes 211 are formed in the fixed electrode portion 210.

回路基板２０１において、固定電極部２１０の周りには、電気的絶縁領域２３０を介して周辺電極部２２０が環状に形成される。電気的絶縁領域２３０は、例えばエッチングにより銅箔を除去することにより形成されてよい。   In the circuit board 201, a peripheral electrode part 220 is formed in an annular shape around the fixed electrode part 210 via an electrically insulating region 230. The electrically insulating region 230 may be formed by removing the copper foil by etching, for example.

図１，図２に示すように、周辺電極部２２０にはセパレータ２４０が設けられ、本発明において、セパレータ２４０は導電性を有するパイル材２４１からなる。   As shown in FIGS. 1 and 2, a separator 240 is provided in the peripheral electrode portion 220. In the present invention, the separator 240 is made of a pile material 241 having conductivity.

具体的には、周辺電極部２２０に導電性接着剤を塗布し、導電性を有するパイル材２４１を周辺電極部２２０に静電植毛することにより、セパレータ２４０が形成される。   Specifically, the separator 240 is formed by applying a conductive adhesive to the peripheral electrode portion 220 and electrostatically flocking the peripheral pile portion 241 with the conductive pile material 241.

例えば、パイル材２４１として、ナイロンパイル２．２デシックス（長さ０．５ｍｍ）を静電植毛したのち、春日電機社製のイオライザー＃３０００（商品名）で導電化処理してもよいし、ニッセン社製の商品名を「ドリーマロン」とする導電繊維を静電植毛してもよい。   For example, as a pile material 241, nylon pile 2.2 decix (length: 0.5 mm) may be electrostatically implanted, and then conductive treatment may be performed with Iolizer # 3000 (trade name) manufactured by Kasuga Electric Co., Ltd. You may electrostatically plant the conductive fiber which makes a brand name "Dolly Maron" by a company.

図１に示すように、パイル材２４１が植毛された固定極板２０Ｒ，２０Ｌを振動板１２の両側に配置し、好ましくは所定の押圧力を加えた状態で固定極板２０Ｒ，２０Ｌを図示しないホルダーにて保持することにより、ヘッドホンユニット１が組立られる。   As shown in FIG. 1, fixed electrode plates 20R and 20L in which pile material 241 is implanted are arranged on both sides of the diaphragm 12, and the fixed electrode plates 20R and 20L are preferably not shown in a state where a predetermined pressing force is applied. The headphone unit 1 is assembled by holding the holder.

これによれば、パイル材２４１がセパレータ２４０となって振動板１２と固定極板２０Ｒ，２０Ｌとが所定の間隔をもって対向的に配置される。   According to this, the pile material 241 becomes the separator 240, and the diaphragm 12 and the fixed electrode plates 20R and 20L are arranged to face each other with a predetermined interval.

また、絶縁皮膜１４０は０．１μｍ以下の厚さであるため、パイル材２４１の先端は絶縁皮膜１４０を容易に破壊して導電皮膜１３０と導通する。これにより、導電皮膜１３０がパイル材２４１を介して周辺電極部２２０と電気的に接続されるため、振動板１２の導電皮膜１３０よりなる電極を周辺電極部２２０から容易に引き出すことができる。   Further, since the insulating film 140 has a thickness of 0.1 μm or less, the tip of the pile material 241 easily breaks the insulating film 140 and is electrically connected to the conductive film 130. Thereby, since the conductive film 130 is electrically connected to the peripheral electrode part 220 via the pile material 241, the electrode made of the conductive film 130 of the diaphragm 12 can be easily pulled out from the peripheral electrode part 220.

なお、絶縁皮膜１４０を形成する際、パイル材２４１と接触する部分にマスクをかけて、その部分のみ導電皮膜１３０を露出させてもよい。また、パイル材２４１は、周辺電極部２２０の全周にわたって植毛されることが好ましいが、周辺電極部２２０に部分的に植毛されてもよい。   When forming the insulating film 140, a mask may be applied to a portion that contacts the pile material 241 so that the conductive film 130 is exposed only in that portion. In addition, the pile material 241 is preferably planted over the entire circumference of the peripheral electrode unit 220, but may be partially planted in the peripheral electrode unit 220.

上記実施形態において、例えば、振動膜１２に所定の直流電圧を印加し、固定極板２０Ｒ，２０Ｌに音声信号を加えることにより、ヘッドホンユニット１はプッシュプル型として動作するが、場合によっては、いずれか一方の固定極板２０は省略されてもよい。また、これに伴って、片側の導電皮膜１３０および絶縁皮膜１４０も省略されてもよい。   In the above embodiment, for example, the headphone unit 1 operates as a push-pull type by applying a predetermined DC voltage to the diaphragm 12 and applying an audio signal to the fixed plates 20R and 20L. One of the fixed electrode plates 20 may be omitted. Accordingly, the conductive film 130 and the insulating film 140 on one side may be omitted.

１ コンデンサヘッドホンユニット
１０ 振動板組立体
１１ 支持リング
１２ 振動板
１２０ 高分子フィルム
１３０ 導電皮膜
１４０ 絶縁皮膜
２０（２０Ｒ，２０Ｌ） 固定極板
２０１ 回路基板
２１０ 固定電極部
２１１ 通気孔
２２０ 周辺電極部
２３０ 電気的絶縁領域
２４０ スペーサ
２４１ パイル材 DESCRIPTION OF SYMBOLS 1 Capacitor headphone unit 10 Diaphragm assembly 11 Support ring 12 Diaphragm 120 Polymer film 130 Conductive film 140 Insulating film 20 (20R, 20L) Fixed electrode plate 201 Circuit board 210 Fixed electrode part 211 Vent hole 220 Peripheral electrode part 230 Electricity Insulating region 240 spacer 241 pile material

Claims (4)

支持リングに所定の張力をもって張設されている振動板と、上記振動板の少なくとも片面側にスペーサ部材を介して対向的に配置される固定極板とを含み、上記振動板の少なくとも片面に導電皮膜が形成され、上記導電皮膜の上にさらに絶縁皮膜が形成されているコンデンサヘッドホンユニットにおいて、
上記固定極板に回路基板が用いられ、上記回路基板には、上記振動板内の上記スペーサ部材にて囲まれる有効振動部分と対向する面に固定電極部が形成されているとともに、上記固定電極部の周りに電気的絶縁領域を介して周辺電極部が環状に形成されており、上記周辺電極部には、導電性接着剤を介して導電性を有するパイル材が植毛され、上記パイル材を上記スペーサ部材として上記振動板と上記固定極板とが対向的に配置され、上記振動板の上記導電皮膜が上記パイル材を介して上記周辺電極部に電気的に接続されていることを特徴とするコンデンサヘッドホンユニット。 Including a diaphragm stretched on the support ring with a predetermined tension, and a fixed pole plate disposed opposite to at least one side of the diaphragm via a spacer member, and conductive on at least one side of the diaphragm. In the capacitor headphone unit in which a film is formed and an insulating film is further formed on the conductive film,
A circuit board is used for the fixed electrode plate, and a fixed electrode portion is formed on a surface of the circuit board facing an effective vibration portion surrounded by the spacer member in the diaphragm, and the fixed electrode A peripheral electrode portion is formed in an annular shape around the portion through an electrically insulating region, and a conductive pile material is implanted in the peripheral electrode portion via a conductive adhesive, and the pile material is The diaphragm and the fixed electrode plate are opposed to each other as the spacer member, and the conductive film of the diaphragm is electrically connected to the peripheral electrode portion through the pile material. Capacitor headphone unit. 上記パイル材は上記絶縁皮膜を破壊し得る剛性を備えていることを特徴とする請求項１に記載のコンデンサヘッドホンユニット。   The capacitor headphone unit according to claim 1, wherein the pile material has rigidity capable of breaking the insulating film. 上記パイル材が上記周辺電極部の全面に植毛されていることを特徴とする請求項１または２に記載のコンデンサヘッドホンユニット。   3. The condenser headphone unit according to claim 1, wherein the pile material is implanted on the entire surface of the peripheral electrode portion. 上記振動板の両面に上記導電皮膜と上記絶縁皮膜とが形成され、上記回路基板からなり上記周辺電極部に上記パイル材が植毛されている上記固定極板が上記振動板の両面に配置されていることを特徴とする請求項１ないし３のいずれか１項に記載のコンデンサヘッドホンユニット。   The fixed electrode plate, in which the conductive film and the insulating film are formed on both surfaces of the diaphragm, and which is made of the circuit board and in which the pile material is implanted in the peripheral electrode portion, is disposed on both surfaces of the diaphragm. The capacitor headphone unit according to claim 1, wherein the capacitor headphone unit is provided.
JP2009125038A 2009-05-25 2009-05-25 Condenser headphone unit Expired - Fee Related JP5377077B2 (en)

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