JP2010270277A - Highly insulating polyphenylene ether resin molding - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a highly insulating polyphenylene ether resin molding with remarkably high dielectric breakdown strength unprecedented before. <P>SOLUTION: This highly insulating polyphenylene ether resin molding is a resin molding comprising a resin composition containing at least a polyphenylene ether resin as the resin component, and the dielectric breakdown strength of which is ≥85 kV/mm measured by the following test conditions according to IEC 60243. The test conditions are: the electrodes of ϕ25 mm cylindrical column/ϕ25 mm cylindrical column; the sample thickness of 0.5 mm; the test method of short time process; and the test temperature of 23°C. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a highly insulating polyphenylene ether-based resin molded article. More specifically, the present invention relates to a highly insulating polyphenylene ether-based resin molded article that has extremely high dielectric breakdown strength and is useful for applications that require high insulation such as an ignition coil.

  Polyphenylene ether resins are excellent in heat resistance, electrical properties, acid resistance, alkali resistance, etc., and have excellent properties such as low specific gravity and low water absorption. It has the disadvantages that it is inferior in impact and impact resistance. Therefore, polyphenylene ether resins are usually used as resin compositions containing various resins for the purpose of improving molding processability and impact resistance, and styrene resins are used as compounded resins. Is provided.

Such a polyphenylene ether resin / styrene resin composition is used as a molding material for the core material of a coil bobbin of an electrical component such as an ignition coil by taking advantage of the electrical characteristics and high heat resistance characteristics of the polyphenylene ether resin. Has been.
The present applicant, as such a polyphenylene ether-based resin composition for an ignition coil, previously has a total of 100 parts by weight of (A) 40-90% by weight of a polyphenylene ether-based resin and (B) 60-10% by weight of a styrene-based resin. In contrast, (C) 5-50 parts by weight of reinforcing filler and (D) 0.1-2 parts by weight of fluororesin compounded for an invention related to a reinforced polyphenylene ether-based resin composition for ignition coil parts have been applied for a patent. (Patent Document 1).

Electrical parts, especially ignition coil parts, are required to have high heat resistance and high mechanical strength, as well as excellent dielectric breakdown characteristics. In particular, further improvement in dielectric breakdown strength is desired. It is rare.
However, the dielectric breakdown strength (based on IEC60243) of the polyphenylene ether-based resin composition conventionally provided including the polyphenylene ether-based resin composition of Patent Document 1 is 40 kV / mm at the highest, and further insulation Improvement in fracture strength is desired.

JP 2008-24889 A

  The present invention has been made in view of the above-described conventional situation, and an object of the present invention is to provide a highly insulating polyphenylene ether-based resin molded article having extremely high dielectric breakdown strength.

  As a result of intensive studies to solve the above-mentioned problems, the present inventors usually improved the mechanical strength and heat resistance, and further, for the purpose of coloring, glass fibers and oxidation compounds that are usually blended in polyphenylene ether-based resin compositions. It has been found that a polyphenylene ether-based resin molded article with significantly high dielectric breakdown strength can be realized by reducing the blending amount of inorganic components such as titanium or by not blending these inorganic components at all. It was.

  The present invention has been achieved based on such findings, and the gist thereof is as follows.

[1] A resin molded article comprising a resin composition containing at least a polyphenylene ether resin as a resin component, and having a dielectric breakdown strength of 85 kV / mm or more measured under the following test conditions in accordance with IEC60243 Highly insulative polyphenylene ether resin molded product.
<Test conditions>
Electrode: φ25 mm cylinder / φ25 mm cylinder Sample thickness: 0.5 mm
Test method: Short-time method Test temperature: 23 ° C

[2] In [1], the component other than the resin component includes one or more inorganic fillers selected from the group consisting of glass fiber, mica, talc, and wollastonite, A highly insulating polyphenylene ether-based resin molded article, wherein the content of the inorganic filler is 30% by weight or less.

[3] In [1] or [2], an inorganic pigment is included as a component other than the resin component, and the content of the inorganic pigment in the resin composition is 2.5% by weight or less. Highly insulating polyphenylene ether resin molded product.

[4] In any one of [1] to [3], the resin component includes a polyphenylene ether resin and a styrene resin, and the content of the polyphenylene ether resin in the resin component is 40 to 90% by weight. A highly insulative polyphenylene ether resin molded product characterized in that the content of the resin is 60 to 10% by weight.

[5] A highly insulating polyphenylene ether-based resin molded product according to any one of [1] to [4], which is a part for an ignition coil.

  The highly insulative polyphenylene ether resin molded product of the present invention has an extremely high dielectric breakdown strength (based on IEC60243) of 85 kV / mm, and is excellent in insulation under high voltage. The resin composition used for the highly insulating polyphenylene ether-based resin molded article of the present invention realizes such a high dielectric breakdown strength by adjusting the blending component of the resin composition and the blending amount thereof. It does not require special compounding materials, special means, or special equipment for improving fracture strength, and is extremely advantageous industrially.

  Such a highly insulating polyphenylene ether-based resin molded article of the present invention is useful as an electrical component such as an ignition coil component that requires high insulation under a high voltage.

  Hereinafter, embodiments of the present invention will be described in detail.

[Polyphenylene ether resin composition]
The polyphenylene ether resin composition used for the resin molded product of the present invention (hereinafter sometimes referred to as “polyphenylene ether resin composition of the present invention”) is at least a polyphenylene ether resin, preferably polyphenylene ether, as a resin component. The dielectric breakdown strength (based on IEC60243) of a resin molded product comprising the resin resin and the styrene resin is 85 kV / mm or more.

{Polyphenylene ether resin}
The polyphenylene ether resin used in the present invention is a polymer having a phenylene ether unit represented by the following general formula (1) in the main chain, and may be a homopolymer or a copolymer.

(In the formula, two R ^{1 s} each independently represent a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and two R ^{2 s} each independently represent a hydrogen atom or an alkyl group having 1 to 3 carbon atoms. Represents a group, but two R ^{1 s} are not hydrogen atoms.)

Examples of the homopolymer include poly (2,6-dimethyl-1,4-phenylene) ether, poly (2,6-diethyl-1,4-phenylene) ether, and poly (2,6-dipropyl-1,4). -Phenylene) ether, poly (2-methyl-6-ethyl-1,4-phenylene) ether, poly (2-methyl-6-propyl-1,4-phenylene) ether and the like of 2,6-dialkylphenylene ether Examples of the copolymer include various 2,6-dialkylphenol / 2,3,6-trialkylphenol copolymers.
Examples of the polyphenylene ether resin used in the present invention include poly (2,6-dimethyl-1,4-phenylene) ether and 2,6-dimethylphenol / 2,3,6-trimethylphenol copolymer. preferable.

  The polyphenylene ether resin used in the present invention preferably has an intrinsic viscosity of 0.2 to 0.8 dl / g measured in chloroform at a temperature of 30 ° C., and preferably 0.2 to 0.7 dl / g. Are more preferable, and those of 0.25 to 0.6 dl / g are particularly preferable. By setting the intrinsic viscosity to 0.2 dl / g or more, the mechanical strength of the resin composition can be prevented from being lowered. By setting the intrinsic viscosity to 0.8 dl / g or less, the resin fluidity is improved and the molding process is improved. It becomes easy. In addition, it is good also as a range of this intrinsic viscosity by mixing 2 or more types of polyphenylene ether-type resin from which intrinsic viscosity differs.

  The method for producing the polyphenylene ether-based resin used in the present invention is not particularly limited. For example, a monomer such as 2,6-dimethylphenol is oxidatively polymerized in the presence of an amine copper catalyst according to a known method. In this case, the intrinsic viscosity can be controlled within a desired range by selecting reaction conditions. Control of intrinsic viscosity can be achieved by selecting conditions such as polymerization temperature, polymerization time, and catalyst amount.

  In the present invention, the polyphenylene ether resins may be used alone or in combination of two or more.

{Styrene resin}
Examples of the styrene resin used in the present invention include a styrene monomer polymer, a copolymer of a styrene monomer and another copolymerizable monomer, and a styrene graft copolymer. It is done.

Examples of the styrene monomer include styrene, α-methylstyrene, p-methylstyrene, and the like. Among these, styrene is preferable.
Examples of the monomer copolymerizable with the styrenic monomer include vinyl cyanide monomers such as acrylonitrile and methacrylonitrile, methyl acrylate, ethyl acrylate, propyl acrylate, methyl methacrylate, and methacrylic acid. Examples include (meth) acrylic acid alkyl esters such as ethyl, maleimide, N-phenylmaleimide, and the like. Among these, vinyl cyanide monomers and (meth) acrylic acid alkyl esters are preferable.

Examples of the styrene monomer polymer include polystyrene resins, and examples of the copolymer of the styrene monomer and other copolymerizable monomers include styrene / butadiene / styrene copolymer. Polymer (SBS resin), hydrogenated styrene / butadiene / styrene copolymer (SEBS), hydrogenated styrene / isoprene / styrene copolymer (SEPS), high impact polystyrene (HIPS), acrylonitrile / styrene copolymer (AS) Resin), acrylonitrile / butadiene / styrene copolymer (ABS resin), methyl methacrylate / butadiene / styrene copolymer (MBS resin), methyl methacrylate / acrylonitrile / butadiene / styrene copolymer (MABS resin), acrylonitrile / acrylic rubber・ Styrene copolymer (AAS resin), acrylic Nitrile-ethylene propylene rubber-styrene copolymer (AES resin), styrene · IPN type rubber copolymer, and the like. Further, it may have stereoregularity such as syndiotactic polystyrene.
Among these, polystyrene (PS) and impact-resistant polystyrene (HIPS) are preferable.

  Examples of the method for producing such a styrene resin include known methods such as an emulsion polymerization method, a solution polymerization method, a suspension polymerization method, and a bulk polymerization method.

  In the present invention, the styrene resin may be used alone or in combination of two or more.

{Resin component}
The resin component of the polyphenylene ether resin composition of the present invention is preferably 40 to 90% by weight, more preferably 45 to 80% by weight, particularly preferably 50 to 80% by weight, and preferably a styrene resin. 60 to 10% by weight, more preferably 55 to 20% by weight, particularly preferably 50 to 20% by weight. By making the polyphenylene ether resin in the resin component 40% by weight or more, the load deflection temperature and mechanical strength can be made excellent. By making the polyphenylene ether resin 90% by weight or less, the resin Since the fluidity of the composition is kept good and the molding process becomes easy, the performance of the obtained molded product can be made excellent without causing resin retention deterioration during molding.

  In addition, in the polyphenylene ether-type resin composition of this invention, in addition to the range which does not impair the effect of this invention, other resins other than a polyphenylene ether-type resin and a styrene resin can be mix | blended. Examples of other resins include fluorine resin, polyamide resin, polyester resin, polyphenylene sulfide resin, liquid crystal polyester resin, polycarbonate resin, polyacetal resin, polyacrylonitrile resin, acrylic resin, polyethylene resin, polypropylene resin, and ethylene-propylene copolymer. And thermoplastic resins such as olefin-based resins, and thermosetting resins such as epoxy resins, melamine resins, and silicone resins. These thermoplastic resins and thermosetting resins can be used in combination of two or more. The blending amount of these other resins is preferably 50% by weight or less, more preferably 45% by weight or less in the resin component.

In the present invention, if there is a possibility that eyes may occur during melt-kneading of the resin composition, among other resins other than the above polyphenylene ether resins and styrene resins, a fluorine-based resin may be used for the purpose of reducing the eyes and eyes. It is effective to blend a resin.
Examples of the fluororesin include polytetrafluoroethylene, tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer, tetrafluoroethylene / hexafluoropropylene copolymer, fluorinated polyolefin such as vinylidene fluoride, and the like. Polytetrafluoroethylene, tetrafluoroethylene / hexafluoropropylene copolymer.

The fluororesin preferably has a melt viscosity at a temperature of 350 ° C. of 1.0 × 10 ^{2 to} 1.0 × 10 ¹⁵ Pa · s, 1.0 × 10 ^{3 to} 1.0 × 10 ¹⁴ Pa · s. It is more preferred, particularly preferably from ^{1.0 × 10 10 ~1.0 × 10 12} Pa · s. By setting the melt viscosity to 1.0 × 10 ² Pa · s or more, a sufficient prevention effect can be exhibited, and by setting the melt viscosity to 1.0 × 10 ¹⁵ Pa · s or less, the fluidity of the resin composition. Can be kept good.

  It is preferable that content of a fluororesin is 0.1 to 2 weight% in a resin component, and it is more preferable that it is 0.1 to 1.5 weight part. By making the content of the fluororesin 0.1% by weight or more, the protective ability can be sufficiently exhibited, and by making it 2% by weight or less, the extrusion stability during the production of the resin composition is improved. It is possible to maintain and suppress a significant decrease in mechanical strength.

{Resin component content}
In the polyphenylene ether resin composition of the present invention, the content of the above-mentioned resin component is preferably 70% by weight or more, particularly preferably 75% by weight or more. Although depending on the type of other compounding components in the resin composition, if the resin component content in the resin composition is less than 70% by weight, high dielectric breakdown strength may not be achieved.

  That is, the present invention does not dare to blend inorganic components such as glass fiber and titanium oxide, which were conventionally blended as essential components for improving the mechanical strength, or the blending amount thereof is a conventional general blending amount. By finding that the resin component content in the composition is 70% by weight or more, particularly 75% by weight or more, and by adding a large amount unprecedented, the dielectric breakdown strength is significantly improved. As one means for realizing the highly insulating polyphenylene ether-based resin molded product of the present invention having a dielectric breakdown strength of 85 kV / mm or more, the resin component content in the composition is 70% by weight or more. In particular, it is important to set it to 75% by weight or more.

{Composition ingredients other than resin ingredients}
<Unfavorable ingredients>
In the polyphenylene ether-based resin composition of the present invention, in order to satisfy the dielectric breakdown strength of 85 kV / mm or more of the obtained molded product, even if it is a component that is usually blended in the polyphenylene ether-based resin composition, There are unfavorable compounding components that should limit the compounding amount. For example, the following compounding components are preferably kept low or not contained.

(Inorganic filler)
Usually, polyphenylene ether-based resin compositions have glass fibers, mica, talc, wollastonite, glass flakes, glass beads, milled fibers, alumina fibers, carbon fibers in order to improve their mechanical strength and dimensional stability. Inorganic fillers such as aramid fiber, titanium oxide, magnesium oxide, calcium carbonate, barium sulfate, boron nitride, and potassium titanate are blended. In the present invention, in order to achieve a dielectric breakdown strength of 85 kV / mm or more. The content of these inorganic fillers in the resin composition (when two or more types are included, the total content thereof) is preferably 30% by weight or less, particularly preferably 20% by weight or less. Among these inorganic fillers, the resin composition has a total of 20 layers especially for glass fiber, mica, talc, and wollastonite. % Or less or is preferably free. When content of an inorganic filler exceeds 30 weight% in a resin composition, desired dielectric breakdown strength may not be obtained.

(Inorganic pigment)
The polyphenylene ether-based resin composition may be mixed with an oxide such as titanium oxide, a sulfide such as zinc sulfide, a sulfate such as barium sulfate, or an inorganic pigment such as carbon black for coloring. In the present invention, in order to achieve a dielectric breakdown strength of 85 kV / mm or more, the content of these inorganic pigments in the resin composition (when two or more types are included, the total content thereof) is 2.5 weights. % Or less, particularly 2.2% by weight or less, and the resin composition of the present invention has a total of 2.5% by weight or less of these inorganic pigments, particularly titanium oxide, zinc sulfide, and carbon black. It is preferable to do.

<Preferred ingredients>
In the polyphenylene ether-based resin composition of the present invention, among the components usually blended in the polyphenylene ether-based resin composition, components other than the above, particularly organic components, can be used in usual blending amounts. In particular, the following components can be contained in the composition as long as the object of the present invention is not impaired.

(Heat stabilizer)
In the present invention, a heat stabilizer such as a hindered phenol compound or a phosphorus compound is blended for the purpose of improving the heat stability during melt kneading in the production and molding process of the resin composition or when used in a high temperature atmosphere. It is preferable.

  Specific examples of the hindered phenol compound as the heat stabilizer include n-octadecyl-3- (3 ′, 5′-di-t-butyl-4′-hydroxyphenyl) propionate, 1,6-hexanediol- Bis [3- (3 ′, 5′-di-t-butyl-4′-hydroxyphenyl) propionate], pentaerythritol-tetrakis [3- (3 ′, 5′-di-t-butyl-4′-hydroxy Phenyl) propionate], 2,6-di-t-butyl-4-methylphenol, 3,9-bis [1,1-dimethyl-2- {β- (3-t-butyl-4-hydroxy-5- Methylphenyl) propionyloxy} ethyl] -2,4,8,10-tetraoxaspiro [5,5] undecane, triethylene glycol-bis [3- (3-tert-butyl-5-methyl) 4-hydroxyphenyl) propionate], 3,5-di-t-butyl-4-hydroxybenzylphosphonate-diethyl ester, 1,3,5-trimethyl-2,4,6-tris (3 ′, 5 ′ -Di-t-butyl-4'-hydroxybenzyl) benzene, 2,2-thio-diethylenebis [3- (3 ', 5'-di-t-butyl-4'-hydroxyphenyl) propionate], tris- (3,5-di-t-butyl-4-hydroxybenzyl) -isocyanurate, N, N′-hexamethylenebis (3,5-di-t-butyl-4-hydroxy-hydrocinnamide) and the like. It is done. Among these, n-octadecyl-3- (3 ′, 5′-di-t-butyl-4′-hydroxyphenyl) propionate, 1,6-hexanediol-bis [3- (3 ′, 5′- t-butyl-4′-hydroxyphenyl) propionate], 2,6-di-t-butyl-4-methylphenol, 3,9-bis [1,1-dimethyl-2- {β- (3-t- Butyl-4-hydroxy-5-methylphenyl) propionyloxy} ethyl] -2,4,8,10-tetraoxaspiro [5,5] undecane is preferred.

  As the phosphorus compound as the heat stabilizer, for example, phosphonite compounds and phosphite compounds are preferably used.

  Examples of the phosphonite compound include tetrakis (2,4-di-t-butylphenyl) -4,4′-biphenylenediphosphonite, tetrakis (2,5-di-t-butylphenyl) -4,4′-. Biphenylene diphosphonite, tetrakis (2,3,4-trimethylphenyl) -4,4'-biphenylene diphosphonite, tetrakis (2,3-dimethyl-5-ethylphenyl) -4,4'-biphenylene diphosphonite Tetrakis (2,6-di-t-butyl-5-ethylphenyl) -4,4'-biphenylenediphosphonite, tetrakis (2,3,4-tributylphenyl) -4,4'-biphenylenediphosphonite , Tetrakis (2,4,6-tri-t-butylphenyl) -4,4′-biphenylenediphosphonite, among others Tetrakis (2,4-di -t- butyl-phenyl) -4,4'-biphenylene phosphonite are preferred.

  Examples of the phosphite compound include tris (2,4-di-t-butylphenyl) phosphite, bis (2,4-di-t-butylphenyl) pentaerythritol-di-phosphite, and bis (2,6 -Di-t-butyl-4-methylphenyl) pentaerythritol-di-phosphite, 2,2-methylenebis (4,6-di-t-butylphenyl) octyl phosphite, 4,4'-butylidene-bis- (3-methyl-6-tert-butylphenyl-di-tridecyl) phosphite, 1,1,3-tris (2-methyl-4-ditridecyl phosphite-5-tert-butyl-phenyl) butane, tris ( Nonylphenyl) phosphite, 4,4′-isopropylidenebis (phenyl-dialkyl phosphite), etc., among which tris (2,4 Di-t-butylphenyl) phosphite, 2,2-methylenebis (4,6-di-t-butylphenyl) octylphosphite, bis (2,6-di-t-butyl-4-methylphenyl) pentaerythritol -Di-phosphite and the like are preferred.

  These heat stabilizers may be used alone or in a combination of two or more.

  The blending amount of the heat stabilizer is preferably 0.01 to 5 parts by weight, more preferably 0.05 to 3 parts by weight, still more preferably 0.05 to 2 parts by weight with respect to 100 parts by weight of the resin component. The content in the resin composition is preferably 2% by weight or less, particularly preferably 1.5% by weight or less. By making the blending amount of the heat stabilizer more than the above lower limit, the effect as a heat stabilizer can be sufficiently exerted, and by making the amount less than the above upper limit, the mechanical strength is reduced and the mold devoid occurs at the time of molding. Can be deterred. In addition, by setting the blending amount of the heat stabilizer in the composition to the above lower limit or more, it becomes easy to achieve a dielectric breakdown strength of 85 kV / mm or more.

  In addition, although zinc oxide may be conventionally used as the heat stabilizer, in the present invention, zinc oxide is contained in the resin composition in an amount of 0.00 to achieve a dielectric breakdown strength of 85 kV / mm or more. The content is preferably 3% by weight or less, and particularly preferably zinc oxide is not contained.

(Other organic additives)
In the resin composition of the present invention, a known organic resin additive or the like can be blended as necessary in addition to the above components within the range not departing from the gist of the present invention. Examples of such additives include dyes, antioxidants, mold release agents, ultraviolet absorbers, catalyst deactivators, lubricants, antistatic agents, color tone improvers, foaming agents, plasticizers, flame retardants, and flame retardants. Organic additives such as auxiliaries and impact resistance improvers can be mentioned. These other organic additives can be used alone or in combination of two or more. The total of these other organic additives is preferably 20% by weight or less in the resin composition in terms of increasing the dielectric breakdown strength.

{Production method}
The production method of the polyphenylene ether-based resin composition of the present invention is not limited to a specific method, but is preferably by melt-kneading, and a kneading method generally put to practical use for thermoplastic resins can be applied. . For example, polyphenylene ether resins, styrene resins, heat stabilizers, and other components used as necessary are uniformly mixed with a Henschel mixer, ribbon blender, V-type blender, etc., and then uniaxial or multiaxial kneading It can be kneaded with an extruder, a roll, a Banbury mixer, a lab plast mill (Brabender) or the like. Each component may be fed all at once to the kneader, or may be fed sequentially, or a mixture of two or more components selected from each component may be used.

  The kneading temperature and kneading time can be arbitrarily selected depending on the conditions such as the desired resin composition and the type of kneading machine. Usually, the kneading temperature is 200 to 350 ° C., preferably 220 to 320 ° C., and the kneading time is 20 minutes or less is preferable. When this temperature is too high, thermal deterioration of the polyphenylene ether resin or styrene resin becomes a problem, and the physical properties of the molded product may be deteriorated or the appearance may be deteriorated. Further, by kneading at a temperature of 200 ° C. or higher, the resin composition can be sufficiently kneaded. When an inorganic component such as an inorganic filler or an inorganic pigment is blended, the physical properties due to poor dispersion of these components can be obtained. Reduction and uneven coloring can be suppressed.

{Molding method}
The polyphenylene ether-based resin composition of the present invention is a molding method generally used for thermoplastic resins, that is, injection molding, injection compression molding, hollow molding, extrusion molding, sheet molding, thermoforming, rotational molding, laminate molding, press It can be molded by various molding methods such as molding. A particularly preferable molding method is an injection molding method from the viewpoint of fluidity. In the injection molding, the resin temperature is preferably controlled to 270 to 320 ° C., for example.

[Highly insulating polyphenylene ether resin molded product]
The highly insulating polyphenylene ether-based resin molded article of the present invention is a molded article made of the resin composition detailed above, and has a dielectric breakdown strength (based on IEC60243) of 85 kV / mm or more. .

{Dielectric breakdown strength}
The dielectric breakdown strength of the resin molded article made of the polyphenylene ether-based resin composition of the present invention is a dielectric breakdown strength measured under the following test conditions in accordance with IEC60243.

<Test conditions>
Electrode: φ25 mm cylinder / φ25 mm cylinder Sample thickness: 0.5 mm
Test method: Short-time method Test temperature: 23 ° C

  For the test, for example, a dielectric breakdown test device “YST-243-100RHO” manufactured by Yamayo Tester Co., Ltd. can be used. The dielectric breakdown strength is preferably 90 kV / mm or higher, and is preferably as high as possible. However, the upper limit of the dielectric breakdown strength is usually 110 kV / mm as the limit of insulation as the polyphenylene ether-based resin composition.

  Since the polyphenylene ether-based resin molded product of the present invention has a remarkably high dielectric breakdown strength and excellent heat resistance, it is useful as a material for electrical parts that require high insulation properties such as ignition coil parts. is there.

  EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to a following example, unless the summary is exceeded.

  The raw materials used for the preparation of the resin compositions of the following examples and comparative examples are as follows.

  Polyphenylene ether resin (PPE): Poly (2,6-dimethyl-1,4-phenylene) ether, “trade name: PX100L” manufactured by Mitsubishi Engineering Plastics Co., Ltd., intrinsic viscosity at 30 ° C. measured in chloroform 0 .47 dl / g

  Styrene resin 1: high impact polystyrene (HIPS), “trade name: HT478” manufactured by PS Japan, molecular weight Mw 200,000, MFR 3.0 g / 10 min

  Styrene resin 2: Polystyrene (GPPS), “trade name: HF77” manufactured by PS Japan, molecular weight Mw 222,000, MFR 8.0 g / 10 min

  Glass fiber: “Asahi Fiber Glass” “Product name: CS03JA404”

  Mica: “Product name: A-21B” manufactured by Yamaguchi Mica Industry Co., Ltd.

Thermal stabilizer 1: Phosphorus antioxidant (tetrakis (2,4-di-t-butylphenyl) -4,4′-biphenylenediphosphonite) “Clear name: Sandstub P-EPQ” manufactured by Clariant Japan
Heat stabilizer 2: Hindered phenol-based anti-aging agent (2,6-di-t-butyl-4-methylphenol) “Product name: Sumilyzer BHT” manufactured by Sumitomo Chemical Co., Ltd.

Carbon black: “Product name: BLACK-SBF M8800” manufactured by Resino Color Industry Co., Ltd.
Titanium oxide: “Product name: TiONA RCL-69” manufactured by Millennium Inorganic Chemicals
Zinc sulfide: “Product name: Sacritus HD” manufactured by SACHTLEBEN

[Examples 1 to 9 and Comparative Examples 1 to 11]
The raw materials are weighed at the ratios shown in Tables 1 and 2, and the raw materials excluding glass fibers (when glass fibers are used) are uniformly mixed with a tumbler mixer, and then glass fibers (glass fibers are added to the obtained raw material mixture). (When used) and added uniformly with a tumbler. The obtained raw material mixture was melt-kneaded using a twin-screw extruder (“PCM30” manufactured by Ikegai Co., Ltd., screw diameter 30 mm, L / D = 42) under conditions of a cylinder set temperature of 280 ° C. and a screw rotation speed of 400 rpm. Pelletized. During the kneading, the mixed raw materials were put into a hopper all at once.

The obtained pellets of the resin composition were dried at 120 ° C. for 4 hours, and then the mold setting temperature was 90 ° C., the cylinder setting temperature was 300 ° C., the injection pressure was 98 MPa, and the molding cycle was 40 with a SG125 injection molding machine manufactured by Sumitomo Heavy Industries The following test specimens for evaluation were molded in seconds, and the following tests (1) and (2) were performed.
The evaluation results are shown in Tables 1 and 2.

[Evaluation methods]
(1) Dielectric breakdown strength: It was performed under the following test conditions in accordance with IEC60243.
<Test conditions>
Electrode: φ25 mm cylinder / φ25 mm cylinder Sample thickness: 0.5 mm
Test method: Short-time method Test temperature: 23 ° C

(2) Load deflection temperature: It was performed according to ISO75 with a load of 1.80 MPa.

Claims (5)

A resin molded article comprising a resin composition containing at least a polyphenylene ether-based resin as a resin component, wherein the dielectric breakdown strength measured under the following test conditions is 85 kV / mm or more in accordance with IEC60243 Highly insulating polyphenylene ether resin molded product.
<Test conditions>
Electrode: φ25 mm cylinder / φ25 mm cylinder Sample thickness: 0.5 mm
Test method: Short-time method Test temperature: 23 ° C   2. The inorganic filler in the resin composition according to claim 1, comprising at least one inorganic filler selected from the group consisting of glass fiber, mica, talc, and wollastonite as a component other than the resin component. A highly insulating polyphenylene ether-based resin molded product characterized in that the content of is 30% by weight or less.   3. A highly insulating polyphenylene ether according to claim 1 or 2, wherein an inorganic pigment is contained as a component other than the resin component, and the content of the inorganic pigment in the resin composition is 2.5% by weight or less. Resin molded products.   4. The resin component according to claim 1, wherein the resin component includes a polyphenylene ether resin and a styrene resin, and the content of the polyphenylene ether resin in the resin component is 40 to 90% by weight. A highly insulating polyphenylene ether-based resin molded product having a content of 60 to 10% by weight.   5. The highly insulating polyphenylene ether-based resin molded article according to claim 1, wherein the molded article is a part for an ignition coil.