JP2010258176A - Structure and method for mounting electronic component, and circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit board on which a circuit for mounting electronic components is formed, capable of preventing the positional deviation of each of the electronic components without deteriorating the mounting reliability of the electronic components and without increasing manufacturing cost. <P>SOLUTION: The length in a width direction of a lead 11a matches the length of a side of a pad 31a in a direction corresponding to the width diredtion of the lead 11a, and a convex portion 32a protruding in the width direction of the lead is provided on only a part of the side surface of the side of the pad 31a which corresponds to the leading-out direction of the lead 11a. Thereby, the electronic component 10 can be prevented from being deviated in the width direction of the lead 11a on the pad 31a, and a fillet is formed between the convex portion 32 and the lead 11. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic component mounting structure, an electronic component mounting method, and a circuit board, and more particularly, a circuit board on which a circuit for mounting an electronic component is formed, and an electronic component mounting structure and mounting on the circuit board. Regarding the method.

  In recent years, with the reduction in size and weight of electronic devices, circuit boards mounted on electronic devices and electronic components mounted on circuit boards have been reduced in size and weight, and when electronic components are mounted on circuit boards. The mounting accuracy required for this is also increasing.

  Accordingly, when mounting electronic components with solder or the like, it has become a big problem that the electronic components are displaced by sliding on the pads before the solder is cured.

  FIG. 7 is a diagram illustrating a state in which an 8-pin electronic component is mounted on a conventional circuit board, and FIG. 7A is a diagram illustrating an 8-pin electronic component mounted on the circuit board. (B) is a figure which shows the pad corresponding to the electronic component of 8 pins formed in the conventional circuit board, FIG.7 (c) is an electronic component of 8 pins in the pad formed in the conventional circuit board. It is a figure which shows the state which mounted.

  In FIG. 7, as an example, the lead 11 connected to the electronic arithmetic circuit formed in the electronic component 10 is an 8-pin IC (Integrated Circuit) derived from the main body 12 of the electronic component 10 as a circuit board 20. The example mounted in the pad 30 formed in FIG.

  Here, the pad 30 is an end point of a circuit formed on the circuit board 20 and is a connection point for being electrically connected to the lead 11 of the electronic component 10.

  By placing the electronic component 10 at a predetermined position on the circuit board 20 so that the leads 11 corresponding to the pads 30 are connected to each other, the respective leads 11 and the pads 30 are secured in order to ensure mounting reliability. In general, the pad 30 is formed larger than the corresponding lead 11 so that a fillet is formed between them.

  However, since the pad 30 is formed larger than the corresponding lead 11 as described above, when the solder becomes fluid by heating, the lead 11 slides on the pad 30 and causes the electronic component 10 to be displaced. There was a thing.

  Specifically, when the pad 30 is larger in the lead-out direction of the lead 11 than the lead 11, the pad 30 may slide in the lead-out direction.

  On the other hand, when the pad 30 is larger than the lead 11 in the width direction of the lead 11, the pad 30 may slide in the width direction.

  Such slipping may cause a displacement from the place where the electronic component 10 is first placed.

  FIG. 8 is a diagram showing a state in which an electronic component having connection portions at both ends is mounted on a conventional circuit board, and FIG. 8A is an electronic component having connection portions at both ends mounted on the circuit board. FIG. 8B is a diagram showing pads corresponding to electronic components formed on the conventional circuit board and having connecting portions at both ends, and FIG. 8C is a diagram showing a conventional circuit. It is a figure which shows the state which mounted the electronic component which has a connection part in both ends on the pad formed in the board | substrate.

  In FIG. 8, as an example, the connection parts 41 respectively connected to the electronic arithmetic circuits formed in the electronic component 40 are the pads 50 formed on the circuit board 20 with the electronic parts 40 provided at both ends of the main body 42. Shows an example of implementation.

  Also at this time, as in the case of FIG. 7 described above, the pad 50 is formed larger than the connection portion 41. Therefore, when the solder becomes fluid by heating, the connection portion 41 slides on the pad 50. The electronic component 40 sometimes caused a position shift.

  Therefore, in order to improve the mounting accuracy of electronic components, silk printing is performed around the contact points (pads) with the leads derived from the electronic components on the circuit board, and the leads derived from the electronic components are held by the silk. A method for preventing misalignment has been proposed (see, for example, Patent Document 1).

  There has also been proposed a misregistration prevention method in which an electronic component is pre-applied on a circuit board, the electronic component is mounted on the circuit board, and the electronic component is momentarily attached to the circuit board to prevent misalignment of the electronic component. Yes.

JP 2002-111184 A

  However, in the misalignment prevention method in which the silk printing is performed around the pad on the circuit board so that the lead derived from the electronic component does not deviate from the pad, the silk printing applied on the circuit board itself is misaligned. There is a problem that the effect of preventing the displacement of the lead of the electronic component is reduced.

  Further, the silk is applied to a position very close to the pad on the circuit board because of the property of preventing the displacement of the electronic component by the silk applied to the circuit board.

  Therefore, when the applied silk bleeds, the silk may be applied to the pad, and there is a problem that the mounting reliability of the electronic component may be reduced by the applied silk.

  In addition, in the method of preventing the electronic components from being displaced by instantly attaching the electronic components to the circuit board with the adhesive, if the electronic components are mounted in the state of being displaced in the first place, the electronic components will be instantly attached and the positional displacement will be caused. There is a problem that the electronic component is mounted on the circuit board as it is.

  Further, there has been a problem that the mounting cost increases due to an increase in the process of applying the adhesive and the material cost of the adhesive.

  The present invention has been made in view of such points, and an electronic component that can prevent misalignment of the electronic component without lowering the mounting reliability of the electronic component and without increasing the manufacturing cost. It is an object of the present invention to provide a mounting structure, a method for mounting an electronic component, and a circuit board.

  In the present invention, in order to solve the above problem, in the electronic component mounting structure on the circuit board on which the electronic component is mounted on the circuit board, a pad to which an electrode derived from the electronic component is connected to the circuit board is provided. A plurality of the pads are formed, and at least one of the pads is formed as a position adjustment pad of the electronic component, and the edge of the position adjustment pad and the edge of the electrode overlap with the position adjustment pad. The positioning part formed on the electrode and the conductive reliability part formed wider than the width of the electrode are formed, and the electrode of the electronic component is placed on each pad and soldered. The electronic component is positioned by overlapping the end side of the electrode with the end side of the mating part, and the fillet is formed at the connection part between the conductive reliability part and the electrode, position Mounting structure of an electronic component to a circuit board, characterized in that securing the electrical connection reliability between oilseed pad and the electrode is provided.

  In the present invention, in the method of mounting an electronic component on a circuit board for mounting the electronic component on the circuit board, a plurality of pads to which electrodes derived from the electronic component are connected are formed on the circuit board, At least one of the pads is formed as a position adjustment pad for the electronic component, and the position adjustment pad is formed so that an end side of the position adjustment pad and an end side of the electrode overlap each other. An alignment portion and a conductive reliability portion formed wider than the width of the electrode are formed, and the electrodes of the electronic component are placed on the pads and soldered. The position adjustment pad is formed by positioning the electronic component by overlapping the edge of the electrode on a side, positioning the electronic component, and forming a fillet at a connection portion between the conductive reliability portion and the electrode. And the electrode Mounting method of electronic components onto a circuit board, characterized in that to ensure the gas connection reliability can be provided.

  According to the present invention, there is provided a circuit board on which a circuit for mounting the electronic component from which the electrode is derived is formed, and the circuit board includes a plurality of pads to which the electrode derived from the electronic component is connected. And at least one of the pads is formed as a position adjustment pad of the electronic component, and the position adjustment pad has an end side of the position adjustment pad and an end side of the electrode overlapping each other. A formed alignment portion for positioning the electronic component and a width greater than the width of the electrode, and a fillet is formed at the connection portion with the electrode, thereby ensuring reliable electrical connection between the position adjustment pad and the electrode. Provided is a circuit board characterized in that a conductive reliability part that secures electrical properties is formed.

  According to the electronic component mounting structure, the electronic component mounting method, and the circuit board of the present invention, at least one of the plurality of pads formed on the circuit board to which the electrode derived from the electronic component is connected is an electronic component. It is formed as a component position adjustment pad. Since the alignment portion formed on the position adjustment pad is formed so that the end side of the position adjustment pad and the end side of the electrode overlap, the electronic component is mounted when mounting the electronic component on the circuit board. It is possible to prevent the mounting of the positional adjustment pad that is displaced in the direction in which the end side of the position adjustment pad and the end side of the electrode overlap.

  Further, a conductive reliability portion wider than the width of the electrode is formed on the position adjustment pad. Therefore, since a fillet is formed between the conductive reliability portion and the electrode, it is possible to prevent a decrease in electrical connection reliability due to the reduced size of the pad in order to prevent displacement of the electronic component.

  Further, since a special process such as applying silk is not required, it is possible to prevent displacement of the electronic component at a low cost.

It is a figure which shows a mode that an 8-pin electronic component is mounted in the circuit board of this Embodiment. It is sectional drawing which shows a process until solder is arrange | positioned to a pad. It is sectional drawing which shows a mode that an electronic component is mounted on a circuit board and a pad. It is a figure which shows a mode that an electronic component of 8 pins is mounted in the circuit board with which the length of the lead-out direction side edge part corresponds. It is a figure which shows a mode that the electronic component which provided the connection part in the both ends on the circuit board is mounted. It is a figure which shows a mode that the electronic component which provided the connection part in the both ends on the circuit board is mounted. It is a figure which shows a mode that an 8-pin electronic component is mounted in the conventional circuit board. It is a figure which shows a mode that the electronic component which has a connection part in both ends on the conventional circuit board is mounted.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a diagram illustrating a state in which an 8-pin electronic component is mounted on the circuit board according to the present embodiment, and FIG. 1A is a diagram illustrating an 8-pin electronic component mounted on the circuit board. FIG. 1B is a diagram showing pads corresponding to 8-pin electronic components formed on the circuit board of the present embodiment, and FIG. 1C is formed on the circuit board of the present embodiment. It is a figure which shows the state which mounted the electronic component of 8 pins on the done pad.

  In FIG. 1, as an example, the lead 11 connected to the electronic arithmetic circuit formed in the electronic component 10 is formed on the circuit board 20 as an 8-pin IC that is led out from the main body 12 of the electronic component 10. An example of mounting on the pad 31 is shown.

As shown in FIG. 1, the pads 31a, 31d, 31e, and 31h are specially shaped pads.
Specifically, the lengths of the pads 31a, 31d, 31e, and 31h in the width direction coincide with the lengths of the corresponding leads 11a, 11d, 11e, and 11h in the width direction.
More specifically, the length in the width direction of the contact portion that contacts the pad 31 in the lead 11 is the same. The contact portion will be described later.

  Further, the pads 31a, 31d, 31e, and 31h are so formed as to protrude in a direction opposite to the pads adjacent to the respective pads on a part of the side extending in the lead-out direction of the lead 11 corresponding to each pad 31. Protrusions 32a, 32d, 32e, and 32h are provided.

  For example, the pad 31a is provided with a protrusion 32a so as to protrude in the opposite direction to the adjacent pad 31b. In order to improve the reliability of the connection between the lead 11 and the pad 31 by soldering, the convex portion 32a is provided. However, the gap between the pad 31a and the pad 31b due to the solder protruding during the soldering is provided. In order to prevent a short circuit, a protrusion 32a is provided so as to protrude in the opposite direction to the pad 31b.

When the lead 11 corresponding to the pad 31 is connected by placing the electronic component 10 at a predetermined position on the circuit board 20, the length in the width direction of each lead 11 and the length in the width direction of the pad 31. Therefore, even if the lead 11 is placed at a position deviated from the corresponding pad 31, the lead-out direction of the lead 11 depends on the surface tension of the solder between the lead 11 and the corresponding pad 31. The force acts to match.
Further, since the convex portion 32 is provided, a fillet is formed between the lead 11 and the convex portion 32.

  Next, the soldering process, how the electronic component 10 is mounted, and how the misalignment of the electronic component 10 is corrected will be specifically described with reference to cross-sectional views.

  FIG. 2 is a cross-sectional view showing a process until solder is arranged on the pad, and FIG. 2A is a cross-sectional view of the circuit board and the pad before the solder is arranged, and FIG. FIG. 2C is a cross-sectional view showing a state where a metal mask is placed on the circuit board and the pad, and FIG. 2C is a cross-sectional view showing a state where the solder is placed on the pad, and FIG. ) Is a cross-sectional view showing a state where the solder is transferred to a hole formed in the metal mask, and FIG. 2E is a cross-sectional view showing a state where the solder is disposed on the pad.

  As shown in FIG. 2, first, a metal mask 50 is placed on the circuit board 20 and the pad 31. Holes are formed in the metal mask 50 at locations where solder on the pads 31 is to be disposed.

Next, the solder 60 is moved on the metal mask 50 by the squeegee 70. At this time, a viscous solder such as cream solder is used for the solder 60.
When the solder 60 is moved on the metal mask 50 by the squeegee 70, the solder 60 enters the hole formed in the metal mask 50, whereby the solder 60 is transferred.
And the process of arrange | positioning the solder 60 on the pad 31 is complete | finished by removing the metal mask 50 from the circuit board 20 and the pad 31. FIG.

  Next, when the electronic component 10 is placed on the circuit board 20 so that the lead 11 is placed on the pad 31 on which the solder 60 is disposed, the position of the electronic component 10 is shifted and the position is caused by the surface tension of the solder 60. Will be described in detail with reference to a cross-sectional view.

  FIG. 3 is a cross-sectional view showing a state in which the electronic component is placed on the circuit board and the pad, and FIG. 3A shows a state in which the electronic component is placed on the circuit board and the pad in a shifted state. FIG. 3B is a cross-sectional view showing a state in which the entire circuit board is heated in a state where the electronic component is placed with being displaced, and FIG. 3C is a view in which the electronic component is displaced. FIG. 3D is a cross-sectional view showing a state where a fillet is formed between a lead and a pad.

As shown in FIG. 3, when the electronic component 10 is placed on the circuit board 20 deviating from a predetermined position (in FIG. 3A, the electronic component 10 is shown displaced from the left side. In this state, the entire circuit board 20 is heated in the reflow furnace.
When the entire circuit board 20 is heated, the solder 60 is melted. At this time, surface tension acts on each lead 11 from the melted solder 61.

As a result, force continues to act on the electronic component 10 until the position of the electronic component 10 moves to a position where the surface tension of the molten solder 61 can be balanced.
That is, when the solder 60 is arranged at the center portion on the pad 31, even if the electronic component 10 is placed in a shifted state, a difference occurs in the surface tension acting from the molten solder 61. The force continues to act until the positional deviation of the electronic component 10 is corrected. Therefore, the position shift of the electronic component 10 is eliminated.

When the heating operation of the entire circuit board 20 by the reflow furnace is completed, the molten solder 61 is hardened again, and the solder 60 forms a fillet 62 between the lead 11 and the pad 31.
By forming the fillet 62, the electrical connection between the contact portion 13 which is a contact portion with the pad 31 in the lead 11 and the pad 31 is ensured, and mounting reliability is ensured.
As described above, since the fillet 62 is formed between the contact portion 13 of the lead 11 and the pad 31, the protrusion 31 is provided on the pad 31.

  As described above, even when the electronic component 10 is placed out of the predetermined position, the positional deviation of the electronic component 10 is corrected, and the fillet 62 is formed between the lead 11 and the convex portion 32. Sex can be secured.

  Although the circuit board having a specially shaped pad in which the length in the width direction of the pad and the length in the width direction of the lead coincide with each other has been described so far, it is further provided on the opposite side with the main body 12 of the electronic component 10 interposed therebetween. The length between the leading ends in the lead direction of the pair of specially shaped pads may be equal to the length between the leading ends in the lead leading direction. In the following description, it is assumed that the length in the width direction of the contact portion 13 matches the length in the width direction of the card 11 and the contact portion 13 is provided at the leading end portion in the lead-out direction of the lead 11.

  Next, the state of mounting electronic components on a circuit board having a pad in which the length between the lead sides in the lead direction is the same as the length in the lead direction in the lead is specifically described with reference to the drawings. explain.

  FIG. 4 is a diagram showing a state in which an 8-pin electronic component is mounted on a circuit board in which the length between the leading edges of the lead of the pad and the length between the leading edges of the lead are the same. 4A is a diagram showing pads corresponding to 8-pin electronic components formed on the circuit board, and FIG. 4B is an 8-pin electronic component mounted on the pads formed on the circuit board. It is a figure which shows a state.

As shown in FIG. 4, the pads 33a, 33d, 33e, and 33h are specially shaped pads.
Specifically, the lengths in the width direction of the pads 33a, 33d, 33e, and 33h are equal to the lengths in the width direction of the corresponding leads 11a, 11d, 11e, and 11h.

  Further, the length between the leading end sides of the leads in the pads 33a, 33d, 33e, and 33h also matches the length between leading end sides of the corresponding leads 11a, 11d, 11e, and 11h.

  Specifically, for example, the length between the leading end side of the lead in the pad 33a and the leading end side of the lead in the pad 33h is the leading end side of the lead 11a and the leading end of the lead 11h in the leading direction. It matches the length between the sides.

  Further, the pads 33a, 33d, 33e, and 33h have a protruding portion 34a that protrudes in a direction opposite to the pad adjacent to each pad on a part of the side edge extending in the lead-out direction of the corresponding lead 11. , 34d, 34e, and 34h.

  When the lead 11 corresponding to the pad 33 is connected by placing the electronic component 10 at a predetermined position on the circuit board 20, the length in the width direction of each lead 11 and the length in the width direction of the pad 33. Therefore, even if the lead 11 is placed at a position shifted from the pad 33 corresponding to the lead 11, the lead 11 is led out in the direction of the lead 11 in the pad 33 by the surface tension of the solder between the lead 11 and the corresponding pad 33. A force acts so as to align with the direction of derivation. Thereby, the position shift of the lead 11 in the width direction when the electronic component 10 is placed on the circuit board 20 can be prevented.

  Furthermore, the length between the leading end sides of the leads in the pads 33a, 33d, 33e, and 33h also matches the length between leading end sides of the corresponding leads 11a, 11d, 11e, and 11h. Even if it is placed at a position displaced from the pad 33 corresponding to the lead 11, the leading end side of the lead 11 and the lead leading direction in the pad 33 due to the surface tension of the solder between the lead 11 and the corresponding pad 33. A force acts so that the tip side is aligned. Thereby, it is possible to prevent the positional deviation in the lead-out direction of the lead 11 when the electronic component 10 is placed on the circuit board 20.

  As described above, even when the electronic component 10 is placed out of the predetermined position, the positional deviation of the electronic component 10 is corrected, and a fillet is formed between the lead 11 and the convex portion 32. Can be secured.

  Although the 8-pin electronic component 10 has been described so far, the same effect can be obtained by providing a pad with the same special shape when mounting an electronic component having connection portions at both ends.

  Next, the manner in which the electronic component having the connection portions at both ends is mounted on a specially shaped pad will be described in detail with reference to the drawings.

  FIG. 5 is a diagram illustrating a state in which an electronic component having connection portions provided at both ends is mounted on the circuit board. FIG. 5A illustrates an electronic component having connection portions provided at both ends formed on the circuit board. FIG. 5B is a diagram illustrating a state in which electronic components having connection portions at both ends are mounted on the pads formed on the circuit board.

  In FIG. 5, as an example, the connection parts 41 respectively connected to the electronic arithmetic circuits formed in the electronic component 40 are the pads 35 formed on the circuit board 20 with the electronic parts 40 provided at both ends of the main body 42. Shows an example of implementation.

As shown in FIG. 5, the pads 35a and 35b are specially shaped pads.
Specifically, the lengths of the pads 35a and 35b in the width direction are the same as the lengths of the corresponding connecting portions 41a and 41b in the width direction.

  In addition, the pads 35a and 35b are provided with a convex portion 36 so as to protrude in the width direction at a part of the end side on the side extending in the separating direction of the connecting portions.

  When the connection part 41 corresponding to the pad 35 is connected by placing the electronic component 40 at a predetermined position on the circuit board 20, the length in the width direction of each connection part 41 and the width direction of the pad 35. Therefore, even if the connecting part 41 is placed at a position displaced from the corresponding pad 35, the separation direction of the connecting part 41 is changed by the surface tension of the solder between the connecting part 41 and the corresponding pad 35. A force is applied so that the connecting portions in the pad 35 are aligned with each other.

  Further, since the convex portion 36 is provided, a fillet is formed between the connecting portion 41 and the convex portion 36.

  As described above, even when the electronic component 40 is placed out of the predetermined position, the positional deviation of the electronic component 40 is corrected, and a fillet is formed between the connecting portion 41 and the convex portion 36. Sex can be secured.

  In addition, when the length in the width direction of the lead or the connection portion matches the length in the width direction of the pad so far, the example in which the electronic component is placed on the circuit board having the pad has been shown. Only the length between the leading edges in the separating direction of the lead or the connecting portion may be the same as the length between the leading edges in the separating direction of the lead or the connecting portion in the pad.

  Next, using a drawing, a state in which an electronic component having connection portions at both ends is mounted on a specially shaped pad having the same length between the front end sides in the separation direction as the length between the front end sides in the separation direction of the connection portion is used. Will be described in detail.

  FIG. 6 is a diagram illustrating a state in which an electronic component having connection portions at both ends is mounted on the circuit board. FIG. 6A illustrates an electronic component having connection portions at both ends formed on the circuit board. FIG. 6B is a diagram illustrating a state in which electronic components having connection portions provided at both ends are mounted on the pads formed on the circuit board.

  In FIG. 6, as an example, the pads 41 formed on the circuit board 20 include the connection parts 41 respectively connected to the electronic arithmetic circuits formed in the electronic parts 40 and the electronic parts 40 provided at both ends of the main body 42. Shows an example of implementation.

As shown in FIG. 6, the pads 37a and 37b are specially shaped pads.
Specifically, the length of the separation direction side edge of the connection portions in the pad 37a, the length of the separation direction side edge of the connection portions of the pad 37b, and the separation direction side edge of the connection portion 41a corresponding to each. The length of the connecting portion 41b with the side edge in the separation direction is the same.

  Further, the pads 37a and 37b are provided with convex portions 38 so as to protrude in the separation direction of the connection portions on a part of the side extending in the width direction at the side edge in the separation direction of the connection portions. Yes. The length of the convex portion 38 in the width direction is smaller than the length of the connecting portion 41 in the width direction.

  When the connection part 41 corresponding to the pad 37 is connected by mounting the electronic component 40 at a predetermined position on the circuit board 20, the side edge of the connection part in the pad 37a in the separation direction and the pad 37b. The lengths between the connecting portions 41a in the direction of the separation direction and the lengths of the connecting portions 41a in the direction of the separation direction and the lengths of the connecting portions 41b in the direction of the separation direction are the same. Therefore, even if the connection portion 41 is placed at a position shifted from the corresponding pad 37, the separation direction side edge of the connection portion 41 and the pad 37 due to the surface tension of the solder between the connection portion 41 and the corresponding pad 37. A force acts so that the side edges of the connecting portions in the separation direction are aligned.

  Further, since the convex portion 38 is provided, a fillet is formed between the connecting portion 41 and the convex portion 38.

  As described above, even when the electronic component 40 is placed out of the predetermined position, the positional deviation of the electronic component 40 is corrected, and a fillet is formed between the connecting portion 41 and the convex portion 38, so that the mounting reliability is improved. Sex can be secured.

10 Electronic Components 11 Lead 12 Body 20 Circuit Board 31 Pad 32 Protrusion

Claims (14)

In an electronic component mounting structure on a circuit board for mounting an electronic component on a circuit board, a plurality of pads to which electrodes derived from the electronic parts are connected are formed on the circuit board, and at least one of the pads is , Formed as a position adjustment pad of the electronic component,
In the position adjustment pad, an alignment portion formed so that an end side of the position adjustment pad and an end side of the electrode overlap,
A conductive reliability part formed wider than the width of the electrode is formed,
In placing and soldering the electrodes of the electronic component on the pads,
Positioning the electronic component by placing the electrode with the edge of the electrode overlaid on the edge of the alignment portion,
A mounting structure of an electronic component on a circuit board, wherein a fillet is formed at a connection portion between the conductive reliability portion and the electrode to ensure electrical connection reliability between the position adjusting pad and the electrode. The width of the alignment portion is formed to be equal to the width of the electrode,
In placing and soldering the electrodes of the electronic component on the pads,
2. The structure for mounting an electronic component on a circuit board according to claim 1, wherein the electronic component is positioned by aligning the electrode with the alignment portion and arranging the electrode.   The position adjusting pad is formed such that the leading end side in the lead-out direction of the electrode is shorter than the other pads, and when the electrode is placed on each pad and soldered, the leading end side of the position adjusting pad The electronic component mounting structure on a circuit board according to claim 1, wherein the electronic component is positioned by aligning the electrode and the tip end side of the electrode.   The electronic component includes an electrode that is led out in two or more directions, an electrode located at the end of the electrodes led out in one direction, and an electrode located at the end of the electrodes led out in the other direction. The position adjusting pad is formed with at least a pair of pads corresponding to at least a pair of electrodes located on a diagonal line across a main body which is a part other than the electrodes of the electronic component. The mounting structure of an electronic component on the circuit board according to any one of 1 to 3.   5. The electronic component according to claim 1, wherein the electronic component is installed such that a leading end side of the electrode in the lead-out direction of a pad other than the position adjustment pad is aligned with a leading end of the electrode. 2. A structure for mounting electronic components on a circuit board according to item 1.   The protrusion part which protruded from the width | variety of the said alignment part of the said conduction | electrical_connection reliability part protrudes on the opposite side to other adjacent pads, The any one of Claim 1 to 5 characterized by the above-mentioned. Mounting structure of electronic components on the described circuit board. In the electronic component, electrodes are led out in two or more directions, and at least a pair of pads corresponding to at least a pair of electrodes led out in opposite directions across a main body that is a part other than the electrodes of the electronic component Formed on the pad for adjustment,
The distance between the tip sides of the pair of electrodes and the distance between the tip sides of the alignment portion of the pair of position adjustment pads are provided to match,
In placing and soldering the electrodes of the electronic component on the pads,
The electronic component is positioned by arranging the electrodes by overlapping the tip ends of the pair of electrodes on the tip ends of the alignment portion of the pair of position adjustment pads, respectively. An electronic component mounting structure on a circuit board according to claim 1.   The pair of electrodes is an electrode located at the end of the electrodes led out in one direction and an electrode located at the end of the electrodes led out in the other direction, and the electrodes of the electronic component The structure for mounting an electronic component on a circuit board according to claim 7, wherein the structure is a pair of electrodes positioned on a diagonal line across a main body which is a part other than the above. In the method of mounting an electronic component on a circuit board for mounting the electronic component on the circuit board, a plurality of pads to which electrodes derived from the electronic component are connected are formed on the circuit board, and at least one of the pads Is formed as a position adjustment pad of the electronic component,
In the position adjustment pad, an alignment portion formed so that an end side of the position adjustment pad and an end side of the electrode overlap,
Forming a conductive reliability portion formed wider than the width of the electrode;
In placing and soldering the electrodes of the electronic component on the pads,
Positioning the electronic component by placing the electrode with the edge of the electrode overlaid on the edge of the alignment portion,
A method of mounting an electronic component on a circuit board, comprising: forming a fillet at a connection portion between the conductive reliability portion and the electrode to ensure electrical connection reliability between the position adjustment pad and the electrode. The width of the alignment portion is formed to be equal to the width of the electrode,
In placing and soldering the electrodes of the electronic component on the pads,
The method for mounting an electronic component on a circuit board according to claim 9, wherein the electronic component is positioned by aligning the electrode with the alignment portion and arranging the electrode. In the electronic component, electrodes are led out in two or more directions, and at least a pair of pads corresponding to at least a pair of electrodes led out in opposite directions across a main body that is a part other than the electrodes of the electronic component Formed on the pad for adjustment,
The distance between the tip sides of the pair of electrodes and the distance between the tip sides of the alignment portion of the pair of position adjustment pads are provided to match,
In placing and soldering the electrodes of the electronic component on the pads,
The electronic component is positioned by disposing the electrodes such that the tip ends of the pair of electrodes overlap the tip ends of the alignment portion of the pair of position adjustment pads, respectively. A method for mounting an electronic component on a circuit board according to claim 9. A circuit board on which a circuit for mounting an electronic component from which an electrode is derived is formed,
A plurality of pads to which electrodes derived from the electronic component are connected are formed on the circuit board, and at least one of the pads is formed as a position adjustment pad of the electronic component,
The position adjustment pad is formed so that an end side of the position adjustment pad and an end side of the electrode overlap with each other, and an alignment part for positioning the electronic component,
A conductive reliability part is formed which is formed wider than the width of the electrode and forms a fillet at a connection part with the electrode to ensure the electrical connection reliability between the position adjusting pad and the electrode. A circuit board.   The width of the alignment portion is formed to be equal to the width of the electrode, and the alignment portion aligns the electrode with the alignment portion to position the electronic component. 12. The circuit board according to 12.   A circuit board on which a circuit for mounting an electronic component in which electrodes are derived in two or more directions is formed, and is derived in opposite directions across a main body that is a portion other than the electrodes of the electronic component, At least a pair of pads corresponding to the pair of electrodes is formed on the position adjustment pad, and the distance between the front end sides of the alignment portion of the pair of position adjustment pads is the distance between the front end sides of the pair of electrodes. The alignment unit is configured to position the electronic component by disposing the electrodes by overlapping the two end sides of the pair of electrodes on both end sides of the alignment unit. The circuit board according to claim 12, characterized in that:

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