JP2010258113A - Method for controlling printed board production line - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain line configuration information, relating to each electronic component mounting apparatus, in a production line of a printed board. <P>SOLUTION: When a mode related to obtainment of the configuration information of the production line is started, a management computer 31 firstly informs all electronic component mounting apparatuses 1, which is connected to network through a LAN line 32, that the line configuration information is transmitted, when inheriting a printed board P and dummy substrate (hereinafter, to be referred to as "substrate") from an upper device. Then, when a substrate carry-in detection sensor 36 of an electronic component mounting apparatus 1 detects the substrate, one after the other, since each electronic component mounting apparatus 1 transmits the line configuration information to the management computer 31; and the management computer 31 receives the line configuration information related to the electronic component mounting apparatus 1. The line configuration information is additionally stored in a RAM of a microcomputer built in the management computer 31, as well as, is displayed on a monitor 34. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for managing a printed circuit board production line, and more specifically, a plurality of electronic component mounting apparatuses for connecting electronic components supplied from a component supply apparatus by suction with a suction nozzle and mounting them on the printed circuit board are connected. The present invention relates to a method for managing a printed circuit board production line, comprising: a printed circuit board production line; and a management computer connected via a communication line to each electronic component mounting device constituting the printed circuit board production line. .

  An electronic component mounting apparatus is disclosed in, for example, Patent Document 1. In order to improve the productivity of the printed circuit board, it is necessary to create optimized data with line balance that is optimized mounting order data for each electronic component mounting apparatus in the printed circuit board production line. In this case, the line configuration information of each electronic component mounting apparatus in the printed circuit board production line is grasped and created.

Japanese Unexamined Patent Publication No. 7-94896

  However, the operator operates the management computer to acquire the type of electronic component mounting device, the type and number of mounting heads, the type of component supply device, the type of component recognition camera, etc. stored from each electronic component mounting device Therefore, it is easy to make a mistake and workability is also poor.

  SUMMARY An advantage of some aspects of the invention is that it acquires line configuration information related to each electronic component mounting apparatus in a printed circuit board production line.

For this reason, the first invention is a printed circuit board production line in which a plurality of electronic component mounting devices for picking up electronic components supplied from a component supply device by suction nozzles and mounting them on the printed circuit board are connected, and the printed circuit board. A printed circuit board production line management method for managing an electronic component mounting apparatus, comprising a management computer connected via a communication line to each electronic component mounting apparatus constituting the production line,
When each of the electronic component mounting devices constituting the printed circuit board production line sequentially receives signals sent from the upstream electronic component mounting device, the line configuration information relating to its own characteristics when mounting the electronic components on the printed circuit board To the management computer,
When the management computer receives the line configuration information related to the electronic component mounting apparatus, the management computer stores the line configuration information.

According to a second aspect of the present invention, there is provided a printed circuit board production line in which a plurality of electronic component mounting devices for picking up electronic components supplied from a component supply device by suction nozzles and mounting them on the printed circuit board are connected, and the printed circuit board production line. A printed circuit board production line management method for managing an electronic component mounting device, comprising a management computer connected via a communication line to each electronic component mounting device constituting
When each electronic component mounting device constituting the printed circuit board production line inherits the detection board from the upstream electronic component mounting device, line configuration information relating to its own characteristics in mounting the electronic component on the printed circuit board is obtained. Sent to the management computer,
When the management computer receives the line configuration information related to the electronic component mounting apparatus, the management computer stores the line configuration information.

According to a third aspect of the present invention, there is provided a printed circuit board production line in which a plurality of electronic component mounting apparatuses for picking up electronic components supplied from a component supply apparatus by suction nozzles and mounting the electronic parts on the printed circuit board are connected, and the printed circuit board production line. A printed circuit board production line management method for managing an electronic component mounting device, comprising a management computer connected via a communication line to each electronic component mounting device constituting
When the management computer inherits a detection board from an upstream electronic component mounting device to each electronic component mounting device constituting the printed circuit board production line, the management computer relates to its own characteristics in mounting the electronic component on the printed circuit board. Notify you to communicate line configuration information,
When each electronic component mounting device inherits the detection board from the upstream device, it transmits its own line configuration information to a management computer,
When the management computer receives the line configuration information related to the electronic component mounting apparatus, the management computer stores the line configuration information.

According to a fourth aspect of the present invention, there is provided a printed circuit board production line in which a plurality of electronic component mounting apparatuses for picking up an electronic component supplied from a component supply apparatus by a suction nozzle and mounting it on the printed circuit board are connected, and the printed circuit board production line. A printed circuit board production line management method for managing an electronic component mounting device, comprising a management computer connected via a communication line to each electronic component mounting device constituting
When the management computer inherits a detection board from an upstream device to each electronic component mounting device constituting the printed circuit board production line, line configuration information relating to its own characteristics in mounting the electronic component on the printed circuit board is provided. Notify you to communicate,
When each electronic component mounting device inherits the detection board from the upstream device, it transmits its own line configuration information to a management computer,
When the management computer receives the line configuration information related to the electronic component mounting apparatus, the management computer stores the line configuration information and displays it on the display device.

  Since the present invention can acquire line configuration information related to each electronic component mounting device in a printed circuit board production line, it is mounting order data optimized for improving productivity in each electronic component mounting device. Optimization data with balanced lines can be created.

1 is a schematic diagram of a management system for an electronic component mounting apparatus. The top view of an electronic component mounting apparatus is shown. It is a control block diagram. It is a figure which shows a flowchart. It is a figure which shows line structure information.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram of a management system for an electronic component mounting apparatus in a printed circuit board production line. The hardware configuration of this management system includes a plurality of electronic component mounting apparatuses 1 for mounting electronic components on a printed circuit board P in series. These electronic component mounting apparatuses 1 are connected to each other and a management computer 31 having a microcomputer or the like via a LAN (local area network) line 32.

  FIG. 2 is a plan view of the electronic component mounting apparatus 1, and component supply devices 3A, 3B, 3C, and 3D are divided into four blocks on the front and rear portions on the main body 2 of the electronic component mounting apparatus 1. It is installed. The component supply device 3A has a lane number (component supply unit arrangement number) in the 100s, the component supply device 3B has a lane number in the 200s, and the component supply device 3C has a lane number in the 300s. 3D has lane numbers in the 400s.

  Each of the component supply devices 3A, 3B, 3C, and 3D has a large number of component supply units 5 arranged in parallel on a feeder base of a cart base that is a mounting base. When the cart base is properly attached to the apparatus main body 2, power is supplied to the component supply unit 5 mounted on the cart base so as to face the road. Further, when the connector is released and the handle is pulled, it can be moved by a caster provided on the lower surface. When the sensor detects that the cart base is properly attached to the apparatus main body 2, the feeder base is provided so as to be lifted and lowered by the drive source.

  Each of the component supply devices 3A, 3B, 3C, and 3D is disposed so that the tip of the component supply side faces the pickup area of the mounting head 6, and each component supply unit 5 is freely rotatable on the cart table. Rotate a feed sprocket whose teeth are fitted into feed holes opened at predetermined intervals to a storage tape that is sequentially wound in a state of being wound around a supply reel placed on the supply reel, and the storage tape is picked up and picked up by electronic components. A tape feeding mechanism that intermittently feeds to a position by a feed motor 17 and a cover tape peeling mechanism for peeling the cover tape from the carrier tape in front of the suction take-out position by driving the peeling motor 18. The electronic parts loaded in the carrier tape storage part after peeling off the tape are sequentially supplied to the part picking and taking out position and will be described later from the tip part. It can be taken out by the suction nozzle. Each component supply unit 5 includes a memory for storing its own serial number.

  Between the front-side component supply devices 3B and 3D and the rear-side component supply devices 3A and 3C, there are two supply conveyors, positioning units 8 and 8 (having a conveyor) that constitute the substrate transport mechanism, and discharge. A conveyor is provided. Each supply conveyor transports each printed circuit board P received from upstream to each positioning unit 8, and after each electronic component is mounted on each substrate P positioned by a positioning mechanism (not shown) in each positioning unit 8, It is transported to each discharge conveyor and then transported to the downstream device.

  Each beam 10 that moves along the guide rail 9 by the Y-axis drive motor 11 in the Y direction is provided with a mounting head 6 that is moved by the X-axis drive motor 13 in the longitudinal direction, that is, in the X direction. Are provided with a plurality of suction nozzles. The mounting head 6 is equipped with a vertical axis drive motor 14 for moving the suction nozzle up and down, and a θ-axis drive motor 15 for rotating around the vertical axis. Therefore, the suction nozzle of the mounting head 6 can move in the X direction and the Y direction, can rotate about the vertical axis, and can move up and down.

  Reference numeral 12 denotes a component recognition camera that captures an image of the electronic component in order to recognize the position of the electronic component in the XY direction and the rotation angle by how much the electronic component is displaced and held with respect to the suction nozzle.

  Next, the control block diagram of FIG. 3 will be described. The electronic component mounting apparatus 1 includes a CPU (Central Processing Unit) 20 as a control apparatus that performs overall control of the mounting apparatus 1, and a bus line connected to the CPU 20. RAM (Random Access Memory) 21 and ROM (Read Only Memory) 22 are provided. The CPU 20 controls the operation related to the component mounting operation of the electronic component mounting apparatus 1 according to the program stored in the ROM 22 based on the data stored in the RAM 21. That is, the CPU 20 controls the drive of the Y-axis drive motor 11, the X-axis drive motor 13, the vertical axis drive motor 14, the θ-axis drive motor 15 and the like via the interface 24 and the drive circuit 27 and each component supply unit. The feed motor 17 and the peeling motor 18 are controlled via the drive circuit 16.

  In FIG. 3, for convenience of explanation, even though there are a plurality of them, for example, the mounting head 6 and the component supply unit 5 are omitted as one. 3 is a block diagram showing only the first electronic component mounting apparatus 1 and the management computer 31. Therefore, the first electronic component mounting apparatus 1 is connected to the next electronic component mounting apparatus 1 via the signal line 4. The description of the following electronic component mounting apparatus 1 is omitted.

  The RAM 21 stores mounting data for each type of printed circuit board P related to component mounting. For each mounting order (step number), the X direction (indicated by X) in the printed circuit board P, Y Information on the direction (indicated by Y) and angle (indicated by Z), the arrangement number information of each component supply unit 5, and the like are stored.

  The RAM 21 stores information on the types (component IDs) of electronic components corresponding to the component supply unit arrangement numbers (lane numbers) of the component supply units 5 for each type of the printed circuit boards P, that is, component arrangement information. This component arrangement information is data relating to which component supply unit 5 is mounted at which position on the cart table. Furthermore, component library data relating to the characteristics of the electronic component is stored for each component ID.

  A recognition processing device 23 is connected to the CPU 20 via the interface 24. The recognition processing device 23 performs recognition processing of an image captured by the component recognition camera 12, and the processing result is sent to the CPU 20. Is sent out. That is, the CPU 20 outputs an instruction to the recognition processing device 23 so as to perform recognition processing (calculation of misalignment amount) on the image captured by the component recognition camera 12 and receives the recognition processing result from the recognition processing device 23. It is.

  Reference numeral 25 denotes a monitor for displaying a part image and a screen for setting various data. The monitor 25 is provided with various touch panel switches 26 as input means. Can be set.

  Reference numeral 31 denotes a management computer connected to each electronic component mounting apparatus 1 in the printed circuit board production line via the LAN line 32. The management computer 31 has a monitor 34 as a display device and an input means 35 such as a keyboard. It is connected.

  With the above configuration, the printed circuit board production of the electronic component mounting apparatus 1 in the printed circuit board production line will be described below. First, when a production operation is performed, the printed circuit board P is conveyed from the upstream device to the positioning unit 8 via the supply conveyor, and is positioned and fixed by the positioning mechanism.

  Next, the mounting head 6 moves according to the mounting data stored in the RAM 21, and the electronic component to be mounted by the suction nozzle corresponding to the component type of the electronic component is sucked out from the predetermined component supply unit 5. More specifically, the suction nozzle of the mounting head 6 moves so as to be positioned above the component supply unit 5 that stores electronic components to be mounted in accordance with the mounting order. However, in the Y direction, the Y-axis drive motor 11 is driven and the beam 10 is moved. In the X direction, the X-axis drive motor 13 is driven and the mounting head 6 is moved, and the predetermined component supply unit 5 has already been driven by the feed motor 17 and the peeling motor 18 so that the component is taken out at the component suction and takeout position. Since it is in a possible state, the vertical axis drive motor 14 lowers the suction nozzle to pick up and take out the electronic component, and then the mounting head 6 moves up.

  The suction nozzle moves so as to mount the electronic component at a predetermined position on the printed circuit board P positioned by the positioning unit 8. During the movement of the mounting head 6, the suction nozzle 29 is suctioned by the line sensor 28. The presence / absence and suction posture of the held electronic component D is detected, and the electronic component sucked and held by the suction nozzle 29 when the mounting head 6 moves and passes the upper position of the component recognition camera 12 is detected by the component recognition camera. 12 (fly recognition).

  Then, based on the imaging result of the component recognition camera 12, the recognition processing device 23 recognizes how much the electronic component is displaced and held with respect to the suction nozzle by the recognition processing device 23, and the suction and mounting. The CPU 20 corrects and controls the Y-axis drive motor 11, the X-axis drive motor 13, and the θ-axis drive motor 15 by adding the position recognition processing result of the electronic component to the mounting coordinates of the forward data, and the suction nozzles of the mounting heads 6 are controlled. Each electronic component is mounted at a predetermined position on the printed circuit board P while correcting the displacement.

  When the mounting of all electronic components to be mounted on the positioned printed circuit board P is completed according to the mounting data, the printed circuit board P is discharged from the positioning unit 8 to the downstream device via the discharge conveyor.

  The above is the operation of the printed circuit board production operation. Next, based on FIG. 4, acquisition of configuration information of the production line, that is, various information relating to the characteristics of the electronic component mounting apparatus 1 constituting the production line will be described. . The flowchart on the left in FIG. 4 relates to the management computer 31, and the flowchart on the right relates to each electronic component mounting apparatus. First, the operator operates the management computer 31 to display the configuration information of the production line. Launch the acquisition mode.

  When the mode for acquiring the production line configuration information is started, first, the management computer 31 connects the printed circuit board P and the dummy to all the electronic component mounting apparatuses 1 connected to the network via the LAN line 32. When a detection board such as a board is inherited from the upstream apparatus, a notification is made to transmit the line configuration information. In this case, whether or not each electronic component mounting apparatus 1 has inherited the detection substrate can be detected by a board carry-in detection sensor 36 provided in each electronic component mounting apparatus 1.

  Then, the management computer 31 waits until receiving the line configuration information from the leading electronic component mounting apparatus 1, but when the board carry-in detection sensor 36 of the leading electronic component mounting apparatus 1 detects the detection board, Since the electronic component mounting apparatus 1 transmits the line configuration information to the management computer 31, when the management computer 31 receives the line configuration information related to the electronic component mounting apparatus 1, the line configuration information is stored in the micro computer incorporated in the management computer 31. It is additionally stored in the RAM of the computer and displayed on the monitor 34. When the electronic component mounting apparatus 1 is changed or when the mounting head of the electronic component mounting apparatus 1 is changed, new line configuration information may be stored in the RAM or overwritten by the operation of the input means 35. Good.

  On the other hand, in the electronic component mounting apparatus 1, after transmitting the line configuration information to the management computer 31, the inherited detection substrate is sequentially transferred to a subsequent process.

  As shown in FIG. 5, the line configuration information includes a device name (for example, “M / C-A”, “M / C-B”) indicating the type of the electronic component mounting device 1, and the type of the mounting head 6. The head name (for example, “head a”, “head b”), the number of mounting heads 6 (for example, “4”, “2”), and the device name (for example, “supply a”) indicating the type of component supply device , “Supply b”), a camera name indicating the type of the component recognition camera 12 (for example, “camera a”, “camera b”), and a type of nozzle stocker (not shown) that stocks suction nozzles (not shown) (for example, "Stocker a", "stocker b"). The device name can be used to determine whether the electronic component mounting device is a high-speed type or a multi-function type. However, the device name may be a high-speed type or a multi-function type.

  Note that the number of suction nozzles provided by the head name of the mounting head 6 is known, the form of electronic component supply is specified by the device name of the component supply device, the number of types of electronic components and the number of stored electronic components, etc. It can be seen from the camera name of the recognition camera 12 whether it is pause recognition for imaging the electronic component held by the suction nozzle in a paused state or fly recognition for imaging the electronic component held by the suction nozzle while moving. The number of suction nozzles can be determined by the type.

  Then, the line configuration information from the first electronic component mounting apparatus 1 is stored, and if there is no end operation for receiving the line configuration information by the operator, in other words, the mode relating to the acquisition of the configuration information of the production line must end. For example, the management computer 31 waits for transmission of line configuration information from the next electronic component mounting apparatus 1. The substrate carrying-in detection sensor 36 detects that the detection board is transferred from the first electronic component mounting apparatus 1 to the second electronic component mounting apparatus 1 and the second electronic component mounting apparatus 1 has inherited the detection board. Then, the second electronic component mounting apparatus 1 transmits its own line configuration information to the management computer 31. When the management computer 31 receives the line configuration information from the second electronic component mounting apparatus 1, the line configuration information related to the second electronic component mounting apparatus 1 is added to the RAM of the microcomputer built in the management computer 31. It is stored and displayed on the monitor 34 in an added state.

  Similarly, if the mode relating to the acquisition of the production line configuration information does not end, the management computer 31 stores the line configuration information received from the third and subsequent electronic component mounting apparatuses 1. When the operator finishes receiving the line configuration information, the management computer 31 notifies each electronic component mounting apparatus 1 of the end of line configuration information acquisition.

  Specifically, the end of the line configuration information reception is performed by the operator using the input means 35 of the management computer 31 by an operation for the end of the line configuration information reception.

  However, the operation is not limited to such an operation by the operator, and the management computer 31 inputs the number of printed circuit board production lines into the management computer 31 in advance by the operator, so that the management computer 31 is based on the number of line configuration information received. When the line configuration information is received from the last electronic component mounting apparatus 1 in the printed circuit board production line, the electronic component mounting apparatus 1 is the last electronic component mounting apparatus 1 in the production line. The line configuration information related to the last electronic component mounting apparatus 1 is received and stored, and additionally displayed on the monitor 34, and the management computer 31 automatically displays the line configuration information on each electronic component mounting apparatus 1. You may make it notify the completion | finish of information acquisition.

  Further, without flowing the detection board to the production line, the operator operates the management computer 31, and in response to an instruction from the management computer 31, the signals are sequentially sent from the leading electronic component mounting device 1 to the downstream electronic component mounting device. 1 and the management computer 31 may receive the line configuration information. Specifically, each electronic component mounting apparatus 1 is connected by a signal line (signal line) 4. Each time the electronic component mounting apparatus 1 sends its own line configuration information to the management computer 31, a signal is transmitted through the signal line 4. Is sent to the downstream electronic component mounting apparatus 1, and the electronic component mounting apparatus 1 that receives and receives this signal sends its own line configuration information to the management computer 31 and transmits the signal through the signal line 4 to the downstream electronic component mounting apparatus 1. You may make it send to the component mounting apparatus 1. FIG. However, the last electronic component mounting apparatus 1 sends its own line configuration information with information indicating that it is the last, so that the management computer 31 sends the line configuration information from the last electronic component mounting apparatus 1. I can understand that it is.

  As described above, the management computer 31 can acquire line configuration information related to each electronic component mounting apparatus 1 in the printed circuit board production line. In each electronic component mounting apparatus 1, optimized data with line balance that is mounting order data optimized for improving productivity can be created. Further, by acquiring the line configuration information, it is possible to grasp what electronic component mounting apparatuses are arranged in what order on the production line of the printed circuit board.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 5 Component supply unit 20 CPU
21 RAM
31 Management computer 34 Monitor 35 Input means 36 Substrate carry-in detection sensor

Claims (4)

A printed circuit board production line in which a plurality of electronic component mounting apparatuses for picking up electronic parts supplied from a component supply apparatus by suction nozzles and mounting them on the printed circuit board are connected, and each electronic part constituting this printed circuit board production line A printed circuit board production line management method for managing an electronic component mounting apparatus, comprising a management computer connected to the mounting apparatus via a communication line,
When each of the electronic component mounting devices constituting the printed circuit board production line sequentially receives signals sent from the upstream electronic component mounting device, the line configuration information relating to its own characteristics when mounting the electronic components on the printed circuit board To the management computer,
When the management computer receives the line configuration information related to the electronic component mounting apparatus, the management computer stores the line configuration information. A printed circuit board production line in which a plurality of electronic component mounting apparatuses for picking up electronic parts supplied from a component supply apparatus by suction nozzles and mounting them on the printed circuit board are connected, and each electronic part constituting this printed circuit board production line A printed circuit board production line management method for managing an electronic component mounting apparatus, comprising a management computer connected to the mounting apparatus via a communication line,
When each electronic component mounting device constituting the printed circuit board production line inherits the detection board from the upstream electronic component mounting device, line configuration information relating to its own characteristics in mounting the electronic component on the printed circuit board is obtained. Sent to the management computer,
When the management computer receives the line configuration information related to the electronic component mounting apparatus, the management computer stores the line configuration information. A printed circuit board production line in which a plurality of electronic component mounting apparatuses for picking up electronic parts supplied from a component supply apparatus by suction nozzles and mounting them on the printed circuit board are connected, and each electronic part constituting this printed circuit board production line A printed circuit board production line management method for managing an electronic component mounting apparatus, comprising a management computer connected to the mounting apparatus via a communication line,
When the management computer inherits a detection board from an upstream electronic component mounting device to each electronic component mounting device constituting the printed circuit board production line, the management computer relates to its own characteristics in mounting the electronic component on the printed circuit board. Notify you to communicate line configuration information,
When each electronic component mounting device inherits the detection board from the upstream device, it transmits its own line configuration information to a management computer,
When the management computer receives the line configuration information related to the electronic component mounting apparatus, the management computer stores the line configuration information. A printed circuit board production line in which a plurality of electronic component mounting apparatuses for picking up electronic parts supplied from a component supply apparatus by suction nozzles and mounting them on the printed circuit board are connected, and each electronic part constituting this printed circuit board production line A printed circuit board production line management method for managing an electronic component mounting apparatus, comprising a management computer connected to the mounting apparatus via a communication line,
When the management computer inherits a detection board from an upstream device to each electronic component mounting device constituting the printed circuit board production line, line configuration information relating to its own characteristics in mounting the electronic component on the printed circuit board is provided. Notify you to communicate,
When each electronic component mounting device inherits the detection board from the upstream device, it transmits its own line configuration information to a management computer,
When the management computer receives line configuration information relating to the electronic component mounting apparatus, the management computer stores the line configuration information and displays the line configuration information on a display device.

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