JP2010258038A - Substrate with built-in component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate 10 with a built-in component, which can properly maintain the function of a coil 21 or lead switch 3 that is mounted, and which enables high density mounting. <P>SOLUTION: The substrate includes a matrix 10A of insulating resin, and at least either a coil 21 which is a flexible component or a lead switch 3 which is a fragile component, being embedded in the matrix 10A. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a component-embedded substrate that incorporates components.

  As an in-vivo observation device that acquires in-vivo information in a subject's body, a capsule endoscope that acquires and observes the internal state as image information has been put into practical use. Capsule endoscopes have the function of moving through the internal organs of body cavities in accordance with peristaltic motion and sequentially capturing images until they are introduced into the body by being swallowed from the mouth of the subject and are naturally discharged. While moving inside the body cavity, the image data captured inside the body by the capsule endoscope is sequentially transmitted to the outside by wireless communication via the built-in antenna and stored in a memory provided in the external receiver. The By carrying the receiver, the patient can act freely after swallowing the capsule endoscope until it is discharged.

  The capsule endoscope obtains driving power from the battery built in the housing, but the operator operates the start / stop operation with a switch or the like on the outer surface of the housing because the internal circuit is sealed inside the housing. I can't. For this reason, a capsule endoscope having a reed switch in the housing has been proposed. In a capsule endoscope provided with a reed switch, by applying a magnetic field from the outside of the housing, the reed switch can be operated and an operator can start / stop the operation.

  Here, FIGS. 1A to 1C are explanatory views for explaining the configuration of the capsule endoscope 101 disclosed in Japanese Patent Application Laid-Open No. 2007-75162. As shown in FIG. 1A, the capsule endoscope 101 has a large number of components mounted in a narrow space in order to achieve miniaturization. FIG. 1 (A) shows a case where a dedicated board 102 on which a reed switch 3 is mounted, a coil 4 and a spring member 117 are energized inside a casing composed of a casing body 6 and a transparent hemispherical section 6A. 1 shows a capsule endoscope 101 on which a fixed battery 5, a CCD 7 and a lens unit 8 that form an imaging unit that captures an image inside a subject, and a number of components that are not described.

  Of the components used in the capsule endoscope 101, the reed switch 3 has a large volume. For this reason, as shown in FIGS. 1B and 1C, in the capsule endoscope 101, a hollow portion 102A having the shape of the reed switch 3 is formed in order to mount the reed switch 3 on the wiring board. The dedicated substrate 102 is used.

  However, in the capsule endoscope 101, the interval between parts is very narrow. For this reason, there is a risk of damage or deformation when adjacent parts come into contact with the capsule endoscope 101 during manufacture. Further, as already described, since the battery 5 is urged and fixed in order to ensure electrical contact, there is a risk that adjacent components may be damaged or deformed. In particular, a brittle part such as the reed switch 3 is highly likely to be damaged, and a flexible part such as the coil 4 is likely to be deformed.

  On the other hand, in order to improve the reliability of the capsule endoscope 101, measures for radiating heat generated from components are important, but no particularly effective measures have been taken.

JP 2007-75162 A

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a component-embedded substrate that can normally maintain the function of the mounted component and can be mounted at high density.

  In order to achieve the above object, a component-embedded substrate according to an embodiment of the present invention includes a base material made of an insulating resin and at least one of a flexible component and a brittle component embedded in the base material. It is characterized by that.

  The component-embedded substrate according to another aspect of the present invention includes a base material made of an insulating resin, a solid component embedded in the base material, and a fluid component embedded in the base material. It is characterized by having.

  ADVANTAGE OF THE INVENTION According to this invention, the component built-in board which can maintain the function of the mounted components normally and can be mounted in high density can be provided.

It is a block diagram for demonstrating the structure of a well-known capsule type | mold endoscope, FIG. 1 (A) is a cross-sectional schematic diagram, FIG.1 (B) is a top view of an exclusive board | substrate, FIG.1 (C). FIG. 3 is a top view of a dedicated board on which a reed switch is mounted. It is a block diagram for demonstrating the structure of the capsule endoscope which has a component built-in board | substrate of 1st Embodiment, FIG. 2 (A) is a cross-sectional schematic diagram, FIG.2 (B) is a component built-in board. 2C is a schematic cross-sectional view taken along the line IIC-IIC of the component-embedded substrate of FIG. 2B. It is a block diagram for demonstrating the structure of the component built-in board | substrate of 2nd Embodiment, FIG. 3 (A) is a top view of a component built-in board, FIG.3 (B) is a component of FIG. 3 (A). It is a cross-sectional schematic diagram in the IIIB-IIIB line of a built-in board | substrate. It is a block diagram for demonstrating the structure of the component built-in board | substrate of 3rd Embodiment, FIG. 4 (A) is a top view of a component built-in board, FIG.4 (B) is a component of FIG. 4 (A). It is a cross-sectional schematic diagram in the IVB-IVB line of a built-in substrate.

<First Embodiment>
Hereinafter, the capsule endoscope 1 having the component built-in substrate 10 according to the first embodiment of the present invention will be described with reference to FIG.

  As shown in FIG. 2A, in the same manner as the capsule endoscope 101 described above, many components are arranged in a high density in the casing of the capsule endoscope 1 of the present embodiment. Yes. The capsule endoscope 1 includes a component built-in substrate 10 in which the reed switch 3 is mounted.

  The reed switch 3 has a structure in which two ferromagnetic leads face each other with a gap at one end and are enclosed in a glass tube. That is, the reed switch 3 is a brittle component having a glass tube as a brittle member in the exterior part. Here, the brittle member is a member made of a material that has no plasticity, that is, breaks before permanent distortion occurs, and is made of, for example, glass, silicon, ceramics, or the like. As described above, the brittle part of the present invention is a part having a brittle member in the exterior portion, and the part of the brittle member mainly made of ceramics such as a multilayer chip capacitor is relatively damaged even when an external force is applied. Therefore, it does not fall under the brittle part of the present invention.

  As shown in FIG. 2C, the component-embedded substrate 10 of the capsule endoscope 1 includes a base material 10A and a reed switch 3 embedded in the base material 10A. The base material 10A is made of an insulating resin such as an epoxy resin, a polyimide resin, a bismaleimide triazine resin, a fluorine resin, a PPE resin, or a PPO resin. Also, a bakelite resin obtained by thermosetting a novolak photoresist can be used as the material of the base material 10A.

  2A and 2B, chip components 11A and 11B such as a multilayer chip capacitor are surface-mounted on the surface of the component-embedded substrate 10. The chip components 11A and 11B are connected to wiring (not shown) in the component built-in substrate 10 by a solder reflow process. Although not shown in FIG. 2, a large integrated circuit component (IC) or the like is connected to wiring in the component-embedded substrate 10 in the same manner as the chip component 11A by means such as a flip chip method or a bonding method. The reed switch 3 is buried in the component built-in substrate 10 so as not to interfere with the chip component 11 </ b> A and the like, and its terminal is connected to the wiring in the component built-in substrate 10.

  In the component-embedded substrate 10, the reed switch 3 that is a brittle component is buried in the base material 10 </ b> A made of an insulating resin, so that even if an external force from the spring member 17 or the like acts, it is difficult for damage to occur. High reliability of parts. Further, the component-embedded substrate 10 has high reliability and workability in handling. In addition, since the component-embedded substrate 10 can arrange components three-dimensionally, high-density mounting can be realized.

  That is, the component-embedded substrate 10 of the present embodiment can maintain the function of the mounted brittle component normally even when an external force is applied, and can be mounted with high density.

  The brittle part is not limited to the reed switch 3 but is a so-called MEMS part having an internal mechanical drive unit such as an acceleration sensor or a vibrator produced by MEMS technology based on a silicon substrate. Even if it exists, the effect similar to the said description can be acquired.

  Further, as described above, the capsule endoscope 1 introduced into the subject has a base material 10A made of an insulating resin and an external magnetic field that is a brittle part embedded in the base material 10A. The component-embedded substrate 10 having the reed switch 3 to be detected, an imaging unit that captures an image inside the subject, and a power supply source that supplies power used to drive the imaging unit. And a battery 5 whose power supply is controlled.

  In the capsule endoscope 1, the reed switch 3 can be prevented from being damaged because the reed switch 3 that is a brittle part is embedded in the base material 10A made of an insulating resin. For this reason, the capsule endoscope 1 has high reliability. Moreover, since the capsule endoscope 1 can arrange components three-dimensionally, high-density mounting can be realized.

<Second Embodiment>
Next, the component built-in substrate 20 according to the second embodiment of the present invention will be described with reference to FIG. Since the component-embedded substrate 20 of the present embodiment is similar to the component-embedded substrate 10 of the first embodiment, components having the same function are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 3, the component-embedded substrate 20 of the capsule endoscope 1A according to the present embodiment includes a base material 10A and a coil 21 that is a flexible component embedded in the base material 10A. . The coil 21, which is a winding coil, is disposed inside a hollow portion 21A formed in the base material 10A. The coil 21 has a structure in which a conducting wire is wound in a spiral shape. In order to efficiently receive electromagnetic waves from the outside, it is preferable to increase the cross-sectional area of the magnetic path, that is, the diameter of the coil 21. However, the coil 21 is a flexible part that is easily deformed by an external force, and an inductance that is an electrical characteristic changes due to the deformation. In particular, when the transmission / reception circuit constitutes a resonance circuit, even if the inductance of the coil 21 slightly changes, the resonance frequency deviates from a predetermined resonance frequency, so that the transmission / reception efficiency is drastically lowered.

  However, in the component-embedded substrate 20, the coil 21, which is a flexible component, is buried in the base material 10A made of an insulating resin, so that deformation occurs even when an external force from the spring member 17 or the like is applied. It is difficult and the reliability of parts is high. Further, the component-embedded substrate 20 has high reliability and workability in handling. In addition, since the component-embedded substrate 2 can arrange components three-dimensionally, high-density mounting can be realized.

As shown in FIG. 3B, in the component-embedded substrate 20, not only the coil 21 but also chip components 22A, 22B and the like are embedded in the base material 10A. That is, in the component built-in substrate 20, by arranging the coil 21 in the outer peripheral region, not only the outer peripheral region of the wiring board on which components are difficult to be mounted is effectively used, but also a coil 21 having a large diameter is realized. . Furthermore, in the component-embedded substrate 20, high-density mounting is realized by disposing the chip components 22 </ b> A and 22 </ b> B inside the coil 21.
That is, the coil 21 is a coil having a diameter at which other parts can be disposed at least in the magnetic path.

  3A and 3B, chip components 28A to 28D and a large integrated circuit component 29 are surface-mounted on the surface of the component-embedded substrate 20.

  That is, the component-embedded substrate 20 of the present embodiment can maintain the function of the mounted flexible component normally even when an external force is applied, and can be mounted with high density.

As described above, a flexible part is a part whose shape changes due to an external force, and particularly a part whose characteristics change due to deformation. The flexible component is not limited to the coil 21, and may be a lighting component having flexibility and brittleness such as a cold cathode fluorescent lamp (CCFL) or a plasma tube. The same effect as described above can be obtained.
When the lighting component is disposed inside the component built-in substrate 20, at least a part of the base material 10 </ b> A in contact with the lighting component is made of glass or a translucent resin, and the light is inside the component built-in substrate 20. It has a structure that can transmit light and guide it to the outside. That is, the base material 10A may include not only the insulating resin but also other materials in addition to the insulating resin.

  Further, as described above, the capsule endoscope 1A introduced into the subject includes an imaging unit that captures an image inside the subject and outputs an imaging signal, and a base material 10A made of an insulating resin. And a component-embedded substrate 20 having a coil 21 that transmits and receives imaging signals and the like, which are flexible components embedded in the base material 10A.

  The capsule endoscope 1A is highly reliable because the component-embedded substrate 20 is in a state where the coil 21 which is a flexible component is embedded in a base material 10A made of an insulating resin. Further, since the capsule endoscope 1A can arrange components three-dimensionally, high-density mounting can be realized.

<Third Embodiment>
Next, a component built-in substrate 30 according to a third embodiment of the present invention will be described with reference to FIG. Since the component-embedded substrate 30 of the present embodiment is similar to the component-embedded substrate 10 of the first embodiment, the same reference numerals are given to components having the same functions, and descriptions thereof are omitted.

  As shown in FIG. 4, the component-embedded substrate 30 of the capsule endoscope 1B according to the present embodiment includes a base material 10A, a chip part 32A that is a solid component embedded in the base material 10A, and the like. And a coolant 31 having a cooling function, which is a fluid component embedded in the base material 10A. The coolant 31 is sealed inside a hollow portion 31A formed in the base material 10A.

Since the capsule endoscope 1B has all components mounted in a hermetically sealed casing as described above, it is important to take measures to dissipate heat generated from the components.
The component-embedded substrate 30 has an appropriate amount of liquid as the coolant 31 sealed in the hollow portion 31A. For this reason, when the integrated circuit component 29 which is mounted on the surface immediately above the cavity portion 31A and is particularly a heat generating component that is likely to generate heat generates heat, the coolant 31 is vaporized. Can be cooled. The shape and the like of the hollow portion 31A are designed to have a pressure resistant structure based on the internal pressure estimated from the assumed temperature.

  In the component-embedded substrate 30, a coolant 31 that has an effect of absorbing and cooling the heat generated from the heat-generating component is sealed in a hollow portion 31A of a base material 10A made of an insulating resin. For this reason, the temperature of the heat generating component rises too much, so that the so-called thermal runaway does not occur, and the reliability of the component is high. Further, the component built-in substrate 20 is also highly reliable. Moreover, since the component-embedded substrate 30 can arrange components three-dimensionally, high-density mounting can be realized.

  As described above, the capsule endoscope 1B introduced into the subject includes the base material 10A made of an insulating resin, the cavity portion 31A formed in the base material 10A, and the cavity portion 31A. A component built-in substrate 20 having a coolant 31 or the like that is a fluid-like component sealed inside and a chip component 32A that is a solid component embedded in the base material 10A, and a component built-in An integrated circuit component 29 that is a heat-generating component that is surface-mounted on the substrate 20 and an imaging unit that captures an image inside the subject are included.

  In the capsule endoscope 1A, a coolant 31 having an effect of absorbing and cooling heat generated by a heat generating component in a component-embedded substrate 30 is sealed in a hollow portion 31A of a base material 10A made of an insulating resin. Therefore, the temperature of the component does not rise too much, so that the so-called thermal runaway does not occur and the reliability is high. In addition, since the component-embedded substrate 30 can arrange components three-dimensionally, the capsule endoscope 1A can realize high-density mounting.

  The present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1, 1A, 1B ... Capsule type | mold endoscope, 3 ... Reed switch, 4 ... Coil, 5 ... Battery, 6 ... Housing | casing main-body part, 6A ... Transparent hemisphere part, 8 ... Lens part, 10 ... Component built-in substrate, 10A DESCRIPTION OF SYMBOLS Base material, 11A ... Chip component, 17 ... Spring member, 20 ... Component built-in board, 21 ... Coil, 21A ... Hollow part, 22A, 22B ... Chip component, 28A-28D ... Chip component, 29 ... Integrated circuit component, 30 DESCRIPTION OF SYMBOLS ... Component built-in substrate, 31 ... Coolant, 31A ... Cavity, 32A ... Chip component, 101 ... Capsule type endoscope, 102 ... Dedicated substrate, 102A ... Hollow-out part, 117 ... Spring member

Claims (9)

A base material made of insulating resin;
A component-embedded substrate having at least one of a flexible component and a brittle component embedded in the base material.   The component-embedded substrate according to claim 1, wherein the brittle component includes a brittle member in an exterior portion or a mechanical drive portion in the interior.   The component built-in substrate according to claim 1, wherein the brittle component is a reed switch.   The component-embedded substrate according to claim 1, wherein the flexible component is a component whose electrical characteristics change due to deformation.   The component built-in substrate according to claim 1, wherein the flexible component is a coil. A base material made of insulating resin;
A solid part embedded in the base material;
A component-embedded substrate comprising: a fluid component embedded in the base material. Having a cavity formed in the base material,
The component built-in substrate according to claim 6, wherein the fluid component is sealed inside the cavity.   8. The component built-in substrate according to claim 6, wherein the fluid component has a cooling function.   The component-embedded substrate according to any one of claims 1 to 8, wherein the component-embedded substrate is for a capsule endoscope.

Images