JP2010256213A - Pressure sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pressure sensor in structure for preventing occurrence of failure because of adhesion of resin to a sensor circuit in secondary formation. <P>SOLUTION: A hollow part 5a of a plate-like mold IC 5 is covered with a shield case 6 or a terminal component 7 to seal the hollow part 5a, thus preventing resin from penetrating the side of the hollow part 5a by the plate-like mold IC 5, the shield case 6, or the terminal component 7 when performing secondary formation and hence forming structure for preventing failure from occurring because of adhesion of resin to the sensor circuit in secondary formation of a pressure sensor 1. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention provides a detection unit on the outer surface of a diaphragm provided on one end side of a shaft of a hollow cylindrical stem, and includes a detection circuit, a sensor circuit provided on a circuit board, and a terminal provided on a terminal component member. The present invention relates to an electrically connected pressure sensor.

  Conventionally, in Patent Document 1, a pressure sensor that can be reduced in size has been proposed. In this pressure sensor, one end of a stem (port fitting) with a male screw groove formed on the outer periphery is used as an opening for the pressure introduction hole, and the partition wall on the other end is a diaphragm. Thus, fixing to the measurement object is performed. A support flange is provided to surround the outer periphery of the stem on the diaphragm side of the male screw groove, and a gauge sensor is disposed on the diaphragm. In addition, an insulating support member is disposed so as to surround the diaphragm side tip of the stem and the gauge sensor, and a flexible circuit board constituting a sensor circuit is provided on the surface of the insulating support member. And the housing member provided with the connector part in which the housing part which comprises a side wall, and the terminal was covered so that the insulation support member in which the diaphragm side end part in a stem, a gauge sensor, and a flexible circuit board were stuck was provided. It has been.

JP 2004-25514 A

  In the above conventional pressure sensor, a housing part having a housing part constituting a side wall and a connector part with a built-in terminal is separately formed, and then the stem, a support flange, and a flexible circuit board are attached to the housing member. The insulating support substrate is fixed to an integrated assembly. Such a structure is only required to be used by attaching the pressure sensor to the object to be measured. For example, after the pressure sensor is attached to the object to be measured, secondary molding is performed. It cannot be applied to the structure of forming a part. Even if it can be applied, it is not possible to adopt a form in which the entire pressure sensor having a large physique is secondarily molded as in the past because of the demand for downsizing in consideration of the vehicle mounting space.

  On the other hand, in the pressure sensor having such a structure, a connector is formed by performing secondary molding on the insulating support substrate to which the integrated stem, support flange, and flexible circuit substrate are attached, before the housing member is attached. It is also possible to form a part. However, since the resin used at the time of secondary molding adheres to the flexible substrate and causes problems such as disconnection, secondary molding cannot be performed. The same applies to the case where the connector part is formed by secondary molding as well as the case where secondary molding is performed after the pressure sensor is fixed to the measurement object.

  In view of the above points, an object of the present invention is to provide a pressure sensor having a structure that can prevent a resin from adhering to a sensor circuit during secondary molding to cause a malfunction.

  In order to achieve the above object, according to the first aspect of the present invention, a bottom portion (2c) constituting a diaphragm that can be deformed by pressure is provided on one end side of the shaft with one direction as an axis. A bottomed hollow cylindrical stem (2) provided with an opening (2b) into which pressure is introduced on the other end side, and provided on an end surface of the stem (2) on the bottom (2c) side, and deformation of the diaphragm And a hollow portion (4a), and the stem (2) is fitted into the hollow portion (4a) from the bottom (2c) side so that the shaft is A circuit board that includes a housing (4) that surrounds the side surface of the stem (2) as a center and is fixed to the stem (2), and a sensor circuit that is electrically connected to the detector (3). 5b) is built-in and the circuit is formed by the resin part (5b). Of the plate-shaped mold IC (5) and the plate-shaped mold IC (5), the plate (5b) is molded and has a hollow portion (5a), and is disposed in close contact with the housing (4). A lid member that is in close contact with the surface (5s) opposite to the surface (5t) to be in close contact with the housing (4) and covers and seals the hollow portion (5a) formed in the plate-shaped mold IC (5). (6, 7).

  Thus, the hollow part (5a) of the plate-shaped mold IC (5) is covered with the lid members (6, 7) so that the hollow part (5a) is sealed. For this reason, when secondary molding is performed, it is possible to prevent the resin from entering the hollow portion (5a) by the plate-shaped mold IC (5) and the lid members (6, 7). Thereby, it can be set as the structure which can prevent that a resin adheres to a detection part (3) and a bonding wire (8), and a malfunction generate | occur | produces at the time of secondary molding of a pressure sensor.

  For example, as described in claim 2, the plate-shaped mold IC (5) is partially provided with a notch in the surface (5s) on the lid member (6, 7) side, and the circuit board is formed from the notch. A part of (5b) is exposed, and the sensor circuit provided on the circuit board (5b) and the detection unit (3) are electrically connected to each other through the bonding wire (8) at the exposed part. It can be a structure.

  In this case, as described in claim 3, a notch is provided only on the inner peripheral side where the hollow portion (5a) is formed with respect to the plate-shaped mold IC (5), and outside the notch, It is preferable that the resin part (5c) has a configuration in which the hollow part (5a) is surrounded by one.

  Further, as described in claim 4, the circuit board (5b) exposed from the notch in the plate-shaped mold IC (5) is connected to the bottom of the stem (2) provided with the detection unit (3) ( It is preferable that it be flush with the end face on the 2c) side. If it does in this way, when electrically connecting a sensor circuit and a detection part (3) with a bonding wire (8), bonding can be performed easily.

  In the invention according to claim 5, in the surface (5s) of the resin part (5c) in the plate-shaped mold IC (5) that is brought into close contact with the lid member (6, 7), the groove part (5r) surrounding the notch It is characterized by being equipped.

  With such a configuration, when an adhesive is used as a means for fixing the plate-shaped mold IC (5) and the shield case (6), the adhesive is notched for exposing the circuit board (5b). Even if it tries to enter the part, it is blocked by the groove part (5r). Further, even if the resin for secondary molding passes through the gap between the resin portion (5c) and the lid member (6, 7) and turns to the notch side for exposing the circuit board (5b), the groove portion Dammed at (5r). For this reason, it is possible to prevent the resin for secondary molding from entering the notch more reliably.

  The invention according to claim 6 is characterized in that the lid member includes a metal shield case (6) that covers the plate-shaped mold IC (5).

  Thus, if the plate-shaped mold IC (5) is covered with the metal shield case (6), it is possible to take ESD (Electrostatic discharge) countermeasures.

  In the invention according to claim 7, the housing (4) and the stem (2) are made of metal, and the shield case (6) is electrically connected to the housing (4). It is characterized in that it is electrically connected to the stem (2) via the housing (4).

  In this way, if the shield case (6) is connected to the housing (4) and the stem (2), the measurement object is connected to a member connected to the vehicle body when the stem (2) is attached to the measurement object. Thus, the shield case (6) can be body-grounded.

  In the invention described in claim 8, instead of the lid member (6, 7) described in claim 1, an internal space constituted by the stem (2) and the housing (4) and in which the detection part (3) is arranged. Is sealed by a plate-shaped mold IC (5).

  In this way, the internal space in which the detection unit (3) is arranged can be sealed by the plate-shaped mold IC (5). Even with such a structure, it is possible to obtain the same effect as that of the first aspect.

  In this case, as described in claim 9, the circuit board (5b) of the plate-shaped mold IC (5) is exposed on the bottom (2c) side of the stem (2) provided with the detection unit (3), The detection unit (3) and the sensor circuit can be electrically connected to each other at the exposed part.

  For example, as described in claim 10, the bump (12) is disposed between the circuit board (5b) and the detection unit (3), and the sensor circuit and the detection unit (3) of the circuit board (5b) are arranged. It can be set as the structure electrically connected by a stand pump structure.

  In the invention according to claim 11, the housing (4) and the stem (2) are made of metal, the stem (2) is made of a hollow cylinder, and a flange portion ( 2g) and welded at the flange portion (2g) to be joined to the housing (4).

  Thus, a flange part (2g) is provided with respect to a stem (2), and it can join with a housing (4) by welding in a flange part (2g).

  In this case, as described in claim 12, it is preferable that the welded portion of the flange portion (2g) be an inclined surface having an outer diameter that gradually increases toward the bottom portion (2c). More preferably, as described in claim 13, the inclined surface of the flange portion (2g) may have a fillet shape in which the gradient with respect to the axis gradually increases toward the bottom portion (2c).

  The flange portion (2g) may have any shape as long as it can be joined to the housing (4). For example, the flange portion (2g) may have a simple cylindrical shape without an inclined surface. However, in that case, only the outer periphery of the portion in contact with the housing (4) in the cylindrical shape becomes a welded portion, and a recess is formed in the melted portion at the welded portion. If such a dent is formed, cracks due to stress concentration will occur, resulting in a decrease in welding quality. For this reason, by making the flange part (2g) as an inclined surface, it can be welded over a wide range of the flange part (2g), the melted part shape after melting becomes a fillet shape, and no stress concentration part occurs, It becomes possible to improve welding quality.

  In the invention according to claim 14, the plate-shaped mold IC (5) includes external connection terminals (5l to 5o), and the external connection terminals (5l to 5o) are exposed from the resin portion (5c). And a terminal component member (7) obtained by molding a terminal (7a) connected to the external connection terminals (5l to 5o) with a resin portion (7b).

  As described above, the terminal component (7) in which the terminal (7a) is molded with the resin portion (7b) is provided, and the external connection terminals (5l to 5o) are electrically connected to the terminal (7a) of the terminal component (7). By connecting them electrically, it is possible to make a structure that can be electrically connected to the outside via the terminal (7a).

  For example, as shown in claim 15, the terminal (7a) includes a pad portion (7g-7j) for external connection, and the pad portion (7g-7j) is formed from one surface of the resin portion (7b) of the terminal component member (7). ) Can be exposed, electrical connection with the outside can be made through the pad portions (7g to 7j).

  In the invention described in claim 16, the pad portion (7g-7j) is such that the portion exposed from the resin portion (7b) is narrower than the portion embedded in the resin portion (7b). It is a feature.

  As a result, since the resin portion (7b) enters the narrowed portion of each pad portion (7g-7j), the pad portion (7g-7j) is prevented from peeling off and floating from the resin portion (7b). it can.

  In the invention according to claim 17, the circuit board (5b) is provided with circuit parts (5h to 5k) which are constituent parts of the sensor circuit, and the circuit parts (5h to 5h) are provided via the bonding wires (9). And the bonding wire (9) is disposed on the side opposite to the resin injection port at the time of molding the resin part (5c) molding the plate-shaped mold IC (5). Yes.

  In this way, by setting the resin injection port on the side opposite to the position where the bonding wire (9) is disposed, it is possible to gain a distance from the injection port to the bonding wire (9). For this reason, the high-pressure resin injected from the injection port can be reduced in pressure before reaching the bonding wire (9), and the occurrence of problems such as disconnection of the bonding wire (9) due to the resin pressure is suppressed. be able to.

  In addition, the code | symbol in the bracket | parenthesis of each said means shows the correspondence with the specific means as described in embodiment mentioned later.

It is the figure which showed the pressure sensor 1 concerning 1st Embodiment of this invention, (a) is a top view of the pressure sensor 1, (b) is a perspective view of the pressure sensor 1. FIG. It is AA arrow sectional drawing of Fig.1 (a). It is the figure which showed the detailed structure of the housing 4, (a) is a top view of the housing 4, (b) is BOB sectional drawing of the housing 4. FIG. It is the figure which showed the detailed structure of plate-shaped mold IC5, (a) is the top view of plate-shaped mold IC5, (b) is the side view which looked at plate-shaped mold IC5 shown in (a) from the paper surface right side, (C) is the side view which looked at the plate-shaped mold IC5 of (a) from the lower side of the drawing. It is a top view of the circuit board 5b. It is the figure which showed the detailed structure of the shield case 6, (a) is a top view, (b) is CC sectional view taken on the line of (a). It is the figure which showed the detailed structure of the terminal structural member 7, (a) is a top view of the terminal structural member 7, (b) is a side view when (a) is seen from the paper surface right side, (c) is (a) ) Is a side view when viewed from the lower side of the drawing. It is a top view when only the terminal 7a is taken out from the terminal component member 7. FIG. It is the fragmentary sectional perspective view which gave the example at the time of attaching the pressure sensor 1 to the front-end | tip of the injector 10, and forming the connector part 11 by secondary shaping | molding. FIG. 10 is a partially enlarged view of FIG. 9. It is sectional drawing of the pressure sensor 1 concerning 2nd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, the same or equivalent parts are denoted by the same reference numerals in the drawings.

(First embodiment)
A first embodiment of the present invention will be described. The pressure sensor 1 according to the present embodiment is used for measuring the supply fuel pressure in the injector and the brake fluid pressure in the brake actuator, using, for example, an injector or a brake actuator in a vehicle as an object to be measured.

  FIG. 1 is a diagram illustrating a pressure sensor 1 according to the present embodiment, in which (a) is a top view of the pressure sensor 1 and (b) is a perspective view of the pressure sensor 1. FIG. 2 is a cross-sectional view taken along line AA in FIG. 3 to 8 are diagrams showing the detailed structures of the components of the pressure sensor 1. Hereinafter, the pressure sensor 1 of the present embodiment will be described with reference to these drawings.

  The pressure sensor 1 shown in FIG. 1 and FIG. 2 is configured to have a stem 2, a sensor chip 3, a housing 4, a plate-shaped mold IC 5, a shield case 6, and a terminal component member 7.

  As shown in FIG. 2, the stem 2 is constituted by a bottomed hollow member made of a metal such as an alloy of iron and nickel. In the present embodiment, the stem 2 has a one-dot chain line in the horizontal direction of FIG. 2 as a central axis, and one end side in the axial direction is an opening 2b of the hollow portion 2a serving as a pressure introduction hole, and the other end side has a predetermined thickness. The bottom 2c is set. The opening 2b is connected to a measurement object to which a pressure medium to be measured is transmitted. Therefore, the measurement medium is transmitted to the bottom 2c through the opening 2b and the hollow 2a. Further, the bottom 2c is set to a predetermined thickness by adjusting the tip position of the hollow portion. The bottom 2c functions as a diaphragm, and the bottom 2c is distorted according to the pressure of the pressure medium transmitted to the bottom 2c through the pressure introduction hole.

  In the present embodiment, the outer shape of the stem 2 is configured such that a cross section cut in the radial direction with respect to the central axis is circular, and a male screw groove 2d is formed on the outer peripheral surface thereof. For this reason, the stem 2 is fixed to the measurement object that transmits the pressure medium in which the female screw groove (not shown) is formed by screwing in the male screw groove 2d.

  Further, the end surface of the stem 2 that is closer to the opening 2b than the male screw groove 2d and surrounds the periphery of the opening 2b is a first seal surface 2e. The first seal surface 2e is a surface perpendicular to the central axis, and when the pressure sensor 1 is fixed to the measurement object, the first seal surface 2e is in contact with the seat surface of the measurement object, and a seal can be secured. Has been.

  A second seal surface 2f is formed between the first seal surface 2e and the male screw groove 2d in the outer peripheral surface of the stem 2. The second seal surface 2f is inclined with respect to the central axis, and is a tapered surface whose diameter decreases as it approaches the opening 2b side. The second seal surface 2f is configured so that pressure can be applied through the opening 2b of the stem 2 at the time of quality inspection or the like of the pressure sensor 1 alone. That is, the inspection instrument is brought into close contact with the second seal surface 2f, and a predetermined pressure can be applied to the bottom 2c functioning as a diaphragm through the opening 2b in a sealed state.

  In addition, although the 1st sealing surface 2e and the 2nd sealing surface 2f were comprised separately here, you may make these also serve as one sealing surface.

  A flange portion 2g in which the outer diameter of the stem 2 is partially enlarged is formed between the male screw groove 2d and the end portion on the bottom portion 2c side of the stem 2. The flange portion 2 g is used for joining the stem 2 and the housing 4. In the present embodiment, the shape of the flange portion 2g is an inclined surface whose outer diameter gradually increases toward the bottom portion 2c, and preferably the gradient of the inclined surface with respect to the central axis is directed toward the bottom portion 2c. The state is changed so as to gradually become larger, that is, a fillet shape in which the inclined surface is recessed. The flange portion 2g may have any shape as long as the flange portion 2g can be joined to the housing 4. For example, the flange portion 2g may have a simple cylindrical shape without an inclined surface. However, in that case, only the outer periphery of the portion in contact with the housing 4 in the cylindrical shape becomes a welded portion, and a dent is formed in the melted portion at the welded portion. If such a dent is formed, cracks due to stress concentration will occur, resulting in a decrease in welding quality. For this reason, in this embodiment, it is made to weld over the wide range of the flange part 2g by making the flange part 2g into an inclined surface, and the welding quality is improved.

  Furthermore, the stem 2 has a stepped outer peripheral surface on the bottom 2c side of the flange 2g in the stem 2. The diameter of the outer peripheral surface of the stem 2 is changed with the stepped shape as a boundary, and the outer diameter of the stem 2 on the bottom 2c side is made smaller than the outer diameter of the flange 2g side. Hereinafter, of the portion of the stem 2 on the bottom 2c side of the flange portion 2g, the flange portion 2g side of the stepped shape portion is referred to as a medium diameter portion 2h, and the bottom portion 2c side is referred to as a small diameter portion 2i.

  The medium diameter portion 2h and the small diameter portion 2i are fitted into a hollow portion 4a formed in the housing 4 described later. The housing 4 is fixed coaxially with respect to the central axis of the stem 2 by the middle diameter portion 2h being in contact with the inner wall of the hollow portion 4a. However, the axial length L1 of the medium diameter portion 2h, that is, the distance from the flange portion 2g in the same direction to the stepped portion of the stem 2 is made shorter than the thickness L2 of the housing 4 described later. Yes. For this reason, the stress and pressure sensor 1 by the thermal cycle test in consideration of the use environment of the pressure sensor 1 are sufficiently determined while the center axis is determined by fitting the middle diameter portion 2h of the stem 2 into the hollow portion 4a of the housing 4. The stress generated when a force is applied to the housing 4 in order to fix it to the measurement object can be minimized. On the other hand, the small-diameter portion 2i is in a state in which the end surface of the bottom portion 2c, which is the tip thereof, protrudes a predetermined amount from the housing 4.

  The sensor chip 3 has a pressure sensitive element formed on a semiconductor substrate such as silicon, for example, and is bonded to the end surface of the bottom 2c of the stem 2 to generate an output corresponding to the distortion of the bottom 2c. It functions as a detector for detecting the pressure of the measurement medium. For example, the pressure sensitive element is constituted by a bridge circuit in which a strain gauge is formed in a bridge shape, and generates an intermediate potential of the bridge circuit as a sensor output. For example, the sensor chip 3 is bonded to the stem 2 by glass bonding, but if the sensor chip 3 is made of silicon and the stem 2 is made of the above-described nickel-iron alloy or the like, the sensor chip 3 The linear expansion coefficient can be approximated to the glass material for joining the stem 2 and the stem 2. For this reason, it can suppress that the stress resulting from the linear expansion coefficient difference of the sensor chip 3 and the stem 2 is transmitted with respect to the sensor chip 3, and the bottom part 2c according to the pressure applied correctly irrespective of temperature. Distortion can be detected by the sensor chip 3.

  3A and 3B are diagrams illustrating a detailed structure of the housing 4, in which FIG. 3A is a top view of the housing 4, and FIG. As shown in FIG. 3A, the housing 4 is a plate-shaped ring member having a hollow portion 4a. In the present embodiment, the housing 4 has a hexagonal outer shape and a circular hollow portion 4a. The hexagonal portion of the outer shape of the housing 4 is used for fixing the pressure sensor 1 to an object to be measured with a hexagon wrench. As described above, the hollow portion 4a of the housing 4 is fitted with the medium diameter portion 2h and the small diameter portion 2i of the stem 2, and the inner peripheral surface of the hollow portion 4a and the outer peripheral surface of the medium diameter portion 2h are brought into contact with each other. 4 and the center axis of the stem 2 are made to coincide. Although the thickness of the housing 4 is arbitrary, in this embodiment, it is thicker than the axial direction length of the medium diameter part 2h.

  The housing 4 is made of, for example, a metal such as iron (for example, SUS430), and the flange portion 2g of the stem 2 is fixed to the end surface 4b by welding all around. A positioning hole 4d is formed in the end surface 4c on the opposite side of the end surface 4b to which the flange portion 2g is welded in the housing 4. In this embodiment, three positioning holes 4d are formed. The three positioning holes 4d are not arranged on the same straight line, and are arranged so as to form a triangle as shown in FIG. 3A, and are arranged so as to surround the hollow portion 4a. . In the present embodiment, the positioning hole 4d is a through-hole that penetrates in the thickness direction of the housing 4 and reaches the both end faces 4b and 4c. However, it may be any hole that is recessed at least from the end face 4c side.

  4A and 4B are diagrams showing the detailed structure of the plate mold IC5. FIG. 4A is a top view of the plate mold IC5, and FIG. 4B is a view of the plate mold IC5 shown in FIG. (C) is the side view which looked at the plate-shaped mold IC5 of (a) from the lower side of the drawing.

  As can be seen from FIGS. 2 and 4 (a), the plate-shaped mold IC5 is constituted by an annular member having a hollow portion 5a such as a circular shape or a polygonal shape (a polygon obtained by chamfering each corner of a heptagon in the figure). The outer shape is a size that fits in the hexagon corresponding to the shape of the housing 4. The plate-shaped mold IC 5 is firmly fixed in a state of being positioned with respect to the housing 4 with an adhesive or the like (not shown). This plate-shaped mold IC5 is formed by molding a circuit board 5b constituting a sensor circuit in the pressure sensor 1 with a resin portion 5c.

  FIG. 5 is a top view of the circuit board 5b. The circuit board 5 b includes a power supply terminal 5 d that applies a driving voltage Vs (for example, 5 V) to the bridge circuit provided in the sensor chip 3, a GND terminal 5 e that is connected to the GND, and the sensor chip 3. The first and second input terminals 5f and 5g for inputting the two midpoint potentials of the bridge circuit are provided. These terminals 5 d to 5 g are electrically connected to various parts of the sensor chip 3 through bonding wires 8.

  The circuit board 5b is provided with circuit components such as an integrated processing IC 5h, an EEPROM 5i, a CERALOCK 5j, and a chip capacitor 5k, and these are mounted at high density. The integrated processing IC 5h is an IC in which an integrated circuit including a sensor signal processing circuit, a communication circuit, a power supply driver, and the like is incorporated. For example, the power supply driver generates a driving voltage Vs based on a voltage from a battery (not shown), and applies the driving voltage Vs to the sensor chip 3. The sensor signal processing circuit plays a role of inputting the sensor output output from the sensor chip 3, processing the signal, and outputting the signal to the outside. The communication circuit communicates with the EEPROM and the outside in order to store data in the EEPROM. The EEPROM 5i stores predetermined data via the communication circuit of the integrated processing IC 5h. Using this data as, for example, correction data, the total processing IC 5h performs signal processing while correcting individual differences of the measurement object in the sensor signal processing circuit. The Ceralock 5j generates a clock signal, and the sensor signal processing circuit is driven based on this clock signal. The chip capacitor 5k is provided for noise countermeasures.

  Further, the circuit board 5b includes a communication terminal 5l, a GND terminal 5m, a power supply terminal (+ B terminal) 5n, a sensor output terminal 5o, and a body GND terminal 5p connected to the total processing IC 5h.

  And, including between the overall processing IC 5h and the terminals 5d to 5g connected to the sensor chip 3 described above, the EEPROM 5i, the CERALOCK 5j, and the terminals 5l to 5o connected to the outside, and between the GND terminal 5m and the body GND terminal 5p, A desired part is electrically connected through the bonding wire 9. Thus, a sensor circuit is configured. The terminals 5d to 5g, 5l to 5o, etc. are formed by punching a metal plate or patterning by etching, so that all terminals are arranged in the same plane, but the layout design is optimized. As a result, the area of the circuit board 5b is reduced.

  The circuit board 5b configured as described above is prepared in advance, and is molded by resin molding so as to cover the circuit board 5b except for a part of the resin part 5c, thereby forming the plate-shaped mold IC5. The resin portion 5 c is dimensioned so as to be accommodated in a hexagon that is the outer shape of the housing 4. And the part in which the terminals 5d-5g used for connection with the sensor chip 3 are arranged in the resin part 5c is cut out, so that a part of the terminals 5d-5g lacking from the cutout part is exposed. ing. In addition, the broken line in FIG. 5 has shown the notch part of the resin part 5c as a reference, and the hollow part 5a side becomes an exposed part of the circuit board 5b rather than this broken line. As shown in FIG. 2, the exposed portion is flush with the end surface of the stem 2 on which the sensor chip 3 is mounted on the bottom 2c side when the plate-shaped mold IC 5 is brought into contact with the housing 4 to which the stem 2 is fixed. It becomes. For this reason, when each terminal 5d and the sensor chip 3 are electrically connected by the bonding wires 8, bonding can be easily performed.

  Further, in this resin portion 5c, external connection terminals 5l to 5o protrude from the outer peripheral portion opposite to the notches for exposing the terminals 5d to 5g across the central axis. In FIGS. 4A and 5, the terminals 5l to 5o are projected in parallel with the surface of the circuit board 5b. Of these terminals 5l to 5o, the communication terminal 5l, the GND terminal 5m, and the power supply terminal 5n. The sensor output terminal 5o is bent toward the terminal component 7 as shown in FIGS. 2 and 4C. The body GND terminal 5p is bent toward the housing 4 as shown in FIG. 2, and is electrically connected to the housing 4 by welding or the like. For this reason, when the stem 2 is attached to the measurement object, the measurement object is connected to a member connected to the vehicle body, so that the body GND terminal 5p is body-grounded.

  Such a resin part 5c has a structure that surrounds the outer edge of the plate-shaped mold IC5 around the outer side (opposite to the hollow part 5a) of the notch for exposing the terminals 5d to 5g. For this reason, when the shield case 6 is attached to the plate mold IC 5 as will be described later, the hollow portion 5a of the plate mold IC 5 is closed by the shield case 6 and sealed. Therefore, if the pressure sensor 1 is secondarily molded after being assembled to the object to be measured, the outer periphery of the resin portion 5c is in contact with the shield case 6 without any gap, so that the resin for secondary molding is a hollow portion. 5a can be prevented from entering. As a result, the resin for secondary molding penetrates into the notch of the resin portion 5c, so that it adheres to the bonding wire 8 connecting the sensor chip 3 and the terminals 5d to 5g, and the bonding wire 8 is attached when the temperature changes. This prevents problems such as cutting.

  Further, a groove 5r is formed on the surface 5q of the resin part 5c on the shield case 6 side so as to surround a notch for exposing the terminals 5d to 5g. For this reason, if an adhesive is used as a means for fixing the plate-shaped mold IC 5 and the shield case 6, even if the adhesive tries to enter the notch for exposing the circuit board 5b, it is blocked by the groove 5r. It can be stopped. Even if the resin for secondary molding passes through the gap between the resin portion 5c and the shield case 6 and turns to the notch side for exposing the terminals 5d to 5g, the resin is blocked by the groove portion 5r. For this reason, it is possible to prevent the resin for secondary molding from entering the notch more reliably.

  A positioning projection 5u is formed on a surface 5t of the resin portion 5c that contacts the housing 4. There are three protrusions 5u, which are provided at positions corresponding to the positioning holes 4d of the housing 4, respectively. The protrusion 5u enters the positioning hole 4d, whereby the housing 4 and the plate mold IC 5 are positioned. Further, a positioning projection 5v is also formed on the surface 5q on the shield case 6 side of the resin portion 5c. There are also three protrusions 5v, all of which are not arranged on the same straight line, and are arranged so as to form a triangle as shown in FIG. 4A, and are arranged so as to surround the hollow portion 5a. Each protrusion 5v is arranged in a place where the influence is likely to occur, for example, an EEPROM 5i, etc., so as not to damage an internal circuit component or the like when a load is applied to the tip thereof.

  6A and 6B are diagrams illustrating a detailed structure of the shield case 6, in which FIG. 6A is a top view and FIG. 6B is a cross-sectional view taken along the line CC in FIG. The shield case 6 is a metal lid member that covers at least the hollow portion of the plate-shaped mold IC5, and is tightly fixed to the plate-shaped mold IC5 with an adhesive or the like (not shown). Thus, ESD measures can be performed by covering the plate-shaped mold IC 5 with the shield case 6.

  As shown in FIG. 6A, the shield case 6 has a shape corresponding to the outer shape of the plate-shaped mold IC5. Specifically, the shield case 6 has an upper surface shape in which one of the hexagonal corners is chamfered, and a portion of the hexagon corresponding to the external connection terminals 5l to 5o of the plate-shaped mold IC5 is cut out. The upper surface portion 6a having a shape, the side surface portion 6b provided outside the upper surface portion 6a except for the terminals 5l to 5o, and the GND terminal 6c extending from the side surface portion 6b are provided. Yes.

  A positioning hole 6d is formed in the upper surface portion 6a at a location corresponding to the positioning projection 5v of the plate mold IC5. The positioning projection 5v enters the positioning hole 6d, thereby positioning the shield case 6 and the plate-shaped mold IC5.

  The GND terminal 6c is partially recessed toward the housing 4, and the GND terminal 6c is electrically connected to the end surface 4c by resistance welding at the recessed portion, so that the shield case 6 is body earthed. Has been.

  FIG. 7 is a diagram showing a detailed structure of the terminal component member 7, (a) is a top view of the terminal component member 7, (b) is a side view when (a) is viewed from the right side of the page, (c) ) Is a side view when (a) is viewed from the lower side of the drawing.

  As shown in FIGS. 2 and 7, the terminal component member 7 is formed by covering a metal terminal 7 a with a resin portion 7 b and integrating them, and is formed by insert molding or the like. The terminal component member 7 is tightly fixed to the shield case 6 via an adhesive or the like (not shown).

  FIG. 8 is a top view when only the terminal 7 a is taken out from the terminal component 7. As shown in this figure, the terminal 7a is arranged in a concentric circular arc shape around a linear portion 7c to 7f and a circular portion provided at the tip of the terminal 7e, and is connected to each terminal 7c to 7f. It is comprised by the plate electrode parts 7g-7j which function as a pad part for external connection.

  Each terminal 7c-7f has a tip portion opposite to the tip on which the plate electrode portions 7g-7j are arranged protruding from the resin portion 7b and exposed. And the protrusion which protruded in the housing 4 side is formed in the front-end | tip of the part exposed from the resin part 7b among each terminal 7c-7f, and each terminal 7c-7f protruded from the plate-shaped mold IC5 in this protrusion part. Each of the terminals 5l to 5o is resistance welded. Accordingly, the terminals 7c to 7f and the terminals 5l to 5o are electrically connected, and the plate electrode portions 7g to 7j are electrically connected to various portions of the circuit board 5b disposed in the plate mold IC5.

  Each flat-plate-electrode part 7g-7j protrudes in the side which is separated from the housing 4 rather than the terminals 7c-7f by making it thicker than the terminals 7c-7f. In the protruding portion, the plate electrode portions 7g to 7j are exposed from the resin portion 7b, and the terminals 7c to 7d that are recessed are embedded in the resin portion 7b. Each of these plate electrode portions 7g to 7j is basically formed with the same width, but as shown in FIG. 2, a portion that is partially exposed from the resin portion 7b is embedded in the resin portion 7b. It is narrower than. Thereby, since the resin part 7b enters into the narrow part of each of the plate electrode parts 7g to 7j, it is possible to prevent the plate electrode parts 7g to 7j from being peeled off and lifted from the resin part 7b.

  For example, although the terminal 7a is formed by pressing a single metal plate, processing for changing the thickness of the terminals 7c to 7f and the flat plate electrode portions 7g to 7j or a part of the flat plate electrode portions 7g to 7j during the press processing. Can be processed, and a process of providing protrusions at the tips of the terminals 7c to 7f can be performed.

  As described above, the pressure sensor 1 according to the present embodiment is configured. Then, the manufacturing method of the pressure sensor 1 of this embodiment is demonstrated.

  First, the stem 2 and the sensor chip 3 are prepared, and after the glass paste or the like is printed on the end surface of the stem 2 on the bottom 2c side, the sensor chip 3 is mounted, and a firing process or the like is performed, so that the sensor chip 3 is attached to the stem 2. Assemble. Next, after preparing the housing 4, after inserting the medium diameter part 2h and the small diameter part 2i of the stem 2 and the sensor chip 3 into the hollow part 4a of the housing 4, the hollow part 4a contacts the inner wall of the medium diameter part 2h. So that the housing 4 is in contact with the flange portion 2g. At this time, the medium diameter part 2h may be press-fitted into the hollow part 4a by making the outer dimension of the medium diameter part 2h slightly larger than the inner dimension of the hollow part 4a.

  Then, the housing 4 and the stem 2 are fixed at the flange portion 2g by laser welding or the like. At the time of laser welding, the inclined surface of the flange portion 2g is gently depressed to form a fillet shape.

  Subsequently, a plate mold IC 5 is prepared. The plate-shaped mold IC 5 is formed by preparing a circuit board 5b on which circuit components are mounted, placing the circuit board 5b in a molding die, and injecting a resin into the molding die and curing it. At this time, since the resin injection port is located on the opposite side to the location indicated by the arrow in FIG. 5, for example, the integrated processing IC 5h and the bonding wire 9 that electrically connects each part, A distance can be earned up to the bonding wire 9. For this reason, the high-pressure resin injected from the injection port can be reduced in pressure before reaching the bonding wire 9, and it is possible to suppress the occurrence of problems such as disconnection of the bonding wire 9 due to the resin pressure. In particular, since the bonding wires 9 connected to the terminals 5d to 5f and 5l to 5o are directed in the direction along the flow of the resin, it is possible to make the bonding wires 9 less susceptible to the resin pressure.

  Such a plate-shaped mold IC 5 is arranged such that each positioning projection 5 u is fitted into a positioning hole 4 d formed in the housing 4, and is bonded via an adhesive. Since the positioning projection 5u and the positioning hole 4d are provided, the plate-shaped mold IC 5 can be easily assembled to the housing 4. Then, the plate-shaped mold IC 5 is firmly fixed to the housing 4 by performing a heat treatment for curing the adhesive.

  Thereafter, using a bonding tool, the terminals 5d to 5g exposed from the plate mold IC 5 are electrically connected to various portions of the sensor chip 3 via bonding wires 8. At this time, the end surface of the bottom 2c of the stem 2 and the circuit board 5b are arranged on the same plane, and the sensor chip 3 arranged on the end surface of the bottom 2c is also almost on the same plane, so that bonding can be easily performed. It can be carried out. Then, as necessary, after surface protection is performed by applying silicone gel or the like to the surface of the sensor chip 3 and the surface of the bonding wire 8, an adhesive is applied to the surface 5 s of the plate-shaped mold IC 5, and the shield case 6. Is placed on the plate-shaped mold IC5. Also at this time, the shield case 6 can be easily assembled to the plate mold IC 5 by fitting the projection 5v of the plate mold IC 5 into the positioning hole 6d provided in the shield case 6. . In this way, the shield case 6 is firmly fixed to the plate mold IC 5 without a gap.

  Furthermore, a terminal component member 7 is prepared, an adhesive is applied to the front surface of the shield case 6 or the back surface of the terminal component member 7, and the shield case 6 and the terminal component member 7 are bonded together. Thereby, the shield case 6 and the terminal component member 7 are closely fixed without a gap.

  When the shield case 6 and the plate-shaped mold IC 5 are closely fixed with an adhesive, and when the shield case 6 and the terminal component member 7 are firmly fixed with an adhesive, each adhesive is cured. Heat treatment or the like may be performed separately, but if performed at the same time, the curing process can be completed once.

  Finally, the terminals 5l to 5o of the plate mold IC 5 and the terminals 7c to 7f of the terminal component member 7 are electrically connected by resistance welding, and the terminal 5p is resistance welded to the housing 4, and further the shield case 6 The GND terminal 6 c is resistance-welded to the housing 4. In this way, the pressure sensor 1 of the present embodiment is completed.

  In the pressure sensor 1 of the present embodiment described above, the hollow portion 5a of the plate mold IC 5 is covered with the shield case 6 or the terminal component member 7 so that the hollow portion 5a is sealed. For this reason, when secondary molding is performed, it is possible to prevent the resin from entering the hollow portion 5a side by the plate-shaped mold IC5, the shield case 6, or the terminal constituent member 7. Thereby, it can be set as the structure which can prevent that the resin adheres to a sensor circuit at the time of secondary molding, and a malfunction generate | occur | produces.

  In addition, since the connector housing portion with the built-in terminal does not cover the circuit board 5b, the sensor chip 3, and the like, the size of the physique can be reduced as much as the connector housing portion can be eliminated. Further, when the connector housing portion is fixed to the stem 2 or the housing 4, a seal structure such as an O-ring is required. However, since it can be eliminated, the number of parts can be reduced and the cost can be reduced. Furthermore, since expensive parts such as a housing having a large physique and a ceramic substrate are not used, the cost can be further reduced.

  Next, an application example of this embodiment will be described. Here, an injector is taken as an example of the measurement object, and a case where the pressure sensor 1 is attached to the injector will be described.

  FIG. 9 is a partial cross-sectional perspective view illustrating an example in which the pressure sensor 1 according to the present embodiment is attached to the tip of the injector 10 and the connector portion 11 is formed by secondary molding. FIG. 10 is a partially enlarged view of FIG.

  The injector 10 shown in FIG. 9 includes a supply port 10a, an injection hole 10b, and a discharge port 10c. The injector 10 is supplied with high-pressure fuel through a supply port 10a through a common rail (not shown), and injects fuel from the injection hole 10b into a combustion chamber (not shown), while supplying excess fuel to the common rail again through the discharge port 10c. The operation of current transformation is performed. The pressure sensor 1 according to this embodiment is provided as a means for measuring the supply fuel pressure in the injector 10.

  As shown in FIG. 10, the flat plate electrode portions 7 g to 7 j exposed from the terminal component member 7 and wiring (not shown) for driving the injector 10 are electrically connected to the upper portion of the pressure sensor 1. A terminal 11a to be connected is provided. A resin portion 11b is provided so as to cover the pressure sensor 1 and the terminal 11a while leaving a part of the terminal 11a. The resin part 11b and the terminal 11a constitute a connector part 11.

  The structure in which the pressure sensor 1 is assembled to the injector 10 in this way is manufactured as follows.

  First, the injector 10 is prepared, and the pressure sensor 1 is fixed to the injector 10. The pressure sensor 1 is fixed by screwing a male screw groove 2d formed in the stem 2 into a female screw hole 10d formed in an end portion of the injector 10 opposite to the injection hole 10b. The pressure sensor 1 is fixed to the injector 10 by turning the housing 4 having a hexagonal shape using a hexagon wrench. At this time, since the length of the middle diameter portion 2h of the stem 2 is shortened with respect to the thickness of the housing 4, the force of turning the housing 4 with a hexagon wrench is ensured while ensuring the fitting between the housing 4 and the stem 2. It is possible to minimize the transmission of the generated stress to the stem 2 as much as possible.

  Next, after electrically connecting the flat electrode portions 7g to 7j exposed from the terminal component 7 at the upper portion of the pressure sensor 1 and the wiring (not shown) exposed from the injector 10, to the terminal 11a, The pressure sensor 1 and the terminal 11a are arranged in the mold. Then, by injecting the resin into the mold and curing it, the injector 10 in which one end side where the pressure sensor 1 and the terminal 11a are arranged is molded by the resin portion 11b is completed.

  The structure in which the pressure sensor 1 is integrated with the injector 10 as the measurement object is manufactured by performing secondary molding after fixing the pressure sensor 1 to the injector 10. At this time, since the hollow portion of the plate-shaped mold IC 5 provided in the pressure sensor 1 is sealed by the shield case 6 and the terminal component member 7, the resin passes between the plate-shaped mold IC 5 and the shield case 6 during secondary molding. It can be prevented from entering. In particular, since the groove portion 5r is formed in the resin portion 5c of the plate-shaped mold IC5, even if the resin enters through between the plate-shaped mold IC5 and the shield case 6 at the time of secondary molding, at least each of the terminals 5d to 5d. It is possible to prevent intrusion to the portion where 5 g is exposed. For this reason, it becomes possible to prevent the resin from adhering to the sensor circuit during the secondary molding and causing a problem.

(Second Embodiment)
A second embodiment of the present invention will be described. In the present embodiment, the structure of the plate-shaped mold IC 5 of the first embodiment is changed, and the other parts are the same as those of the first embodiment. Therefore, only different portions from the first embodiment will be described.

  FIG. 11 is a cross-sectional view of the pressure sensor 1 according to the present embodiment. As shown in this figure, in the pressure sensor 1 of the present embodiment, the plate-shaped mold IC 5 is not formed in a hollow shape, but is configured by a plate-shaped member without a hollow portion 5a in which a portion corresponding to the stem 2 is recessed. . As in the first embodiment, the plate-shaped mold IC 5 includes a circuit board 5b. Of the circuit board 5b, the terminals 5d to 5g to be connected to the sensor chip 3 are, for example, the back surface of the circuit board 5b. Is also a via hole that can be electrically connected. Then, on the back surface of the circuit board 5b, metal bumps 12 such as Au bumps are used, and the stand bumps in which the terminals 5d to 5g and each part of the sensor chip 3 are electrically connected by flip chip bonding by ultrasonic vibration or the like. It is structured.

  As described above, the plate-shaped mold IC 5 can be configured by a plate-shaped member having no hollow portion 5a. In this case, since the internal space where the sensor chip 3 is arranged can be sealed from the outside by the plate-shaped mold IC 5, the plate-shaped mold IC 5 also functions as a lid, and the resin is connected to the sensor chip 3 and the circuit during the secondary molding. It can prevent adhering to a junction part with the board | substrate 5b. Thereby, the effect similar to 1st Embodiment can be acquired.

(Other embodiments)
In each of the above-described embodiments, an example of the structure of the pressure sensor 1 has been described. However, the design of each component constituting the pressure sensor 1 can be changed as appropriate.

  For example, in the above embodiment, the outer shape of the plate-shaped mold IC5 is a shape obtained by cutting out a part of the hexagonal shape, but other shapes may be used. For example, the outer shape of the plate-shaped mold IC5 may be configured by another polygon shape or a circle, or a shape that combines a polygon and a circle such that a half is a polygon and the remaining half is a circle. Similarly, the hollow portion 5a of the plate-shaped mold IC5 is not limited to a polygonal shape, but may be a circular shape or a combination of a polygonal shape and a circular shape. Of course, similarly to the plate-shaped mold IC5, the outer shape of the shield case 6 and the outer shape of the terminal component member 7 can be appropriately changed. For example, the same shape as the plate-shaped mold IC5 can be adopted. .

  Further, with respect to the plate-shaped mold IC 5, the resin portion 5 c surrounds the entire outer periphery of the hollow portion 5 a so as to be in contact with the shield case 6. However, a part of the resin part 5c surrounding the hollow part 5a may be cut out, and a part of the resin part 5c may be replaced with another seal member. In addition, the surfaces 5t and 5s that contact the housing 4 and the shield case 6 of the plate-shaped mold IC 5 do not necessarily have to be flat, and instead of the protrusions 5u and 5v, a recess that is partially recessed in the surfaces 5t and 5s is formed. In addition, the housing 4 and the shield case 6 may be positioned by providing a convex portion corresponding to the recess. Even in this case, if the surfaces 5t and 5s are in close contact with the housing 4 and the shield case 6, the problem that the resin enters during secondary molding does not occur.

  In the first embodiment, the shield case 6 functions as a lid member for sealing the hollow portion 5a of the plate-shaped mold IC5. On the other hand, when it is set as the structure which eliminated the shield case 6, you may make it the terminal component member 7 function as a cover member by sticking the terminal component member 7 with plate-shaped mold IC5. For example, when the pressure sensor 1 is applied to a measurement object that does not need to consider ESD countermeasures, or when ESD countermeasures can be performed with other objects, for example, the pressure sensor 1 or other parts are covered entirely. The case where a shield case is arrange | positioned can be considered. Further, in the case of the second embodiment, since the plate-shaped mold IC 5 itself can seal the internal space in which the sensor chip 3 and the like are arranged from the outside, the terminal component member 7 can be eliminated.

  Further, the housing 4 is also configured to have a hexagonal shape in consideration of the assembly of the pressure sensor 1 to the measurement object with a hexagon wrench, but may be another polygonal shape or a circular shape. Moreover, although the housing 4 and the stem 2 are made into separate members in consideration of workability, these may be constituted by one member.

DESCRIPTION OF SYMBOLS 1 Pressure sensor 2 Stem 2a Hollow part 2b Opening part 2c Bottom part 2g Flange part 3 Sensor chip 4 Housing 4a Hollow part 5 Plate-shaped mold IC
5a Hollow part 5b Circuit board 5c Resin part 5r Groove part 6 Shield case 7 Terminal component 7a Terminal 7b Resin part 8, 9 Bonding wire 12 Metal bump

Claims (17)

An opening (2b) in which a bottom (2c) constituting a diaphragm deformable by pressure is provided on one end side of the shaft with one direction as an axis, and the pressure is introduced to the other end side of the shaft. A bottomed hollow cylindrical stem (2) provided with:
A detection unit (3) provided on an end surface of the stem (2) on the bottom (2c) side and outputting an electrical signal corresponding to the deformation of the diaphragm;
A hollow portion (4a), and the stem (2) is fitted into the hollow portion (4a) from the bottom (2c) side so as to surround the side surface of the stem (2) around the axis; And a housing (4) fixed to the stem (2);
A circuit board (5b) provided with a sensor circuit that is electrically connected to the detection part (3) is incorporated, and the circuit board (5b) is molded by the resin part (5b) and is hollow. A plate-shaped mold IC (5) having a portion (5a) and arranged in close contact with the housing (4);
Of the plate-shaped mold IC (5), the plate-shaped mold IC (5) is formed in close contact with the surface (5s) opposite to the surface (5t) that is in close contact with the housing (4). And a lid member (6, 7) for covering and sealing the hollow portion (5a).   The plate-shaped mold IC (5) has a notch partially provided on the surface (5s) on the lid member (6, 7) side, so that a part of the circuit board (5b) can be formed from the notch. The sensor circuit and the detection unit (3) provided on the circuit board (5b) are electrically connected to each other through a bonding wire (8) at the exposed portion. The pressure sensor according to claim 1.   The plate-shaped mold IC (5) is provided with the cutout only on the inner peripheral side where the hollow portion (5a) is formed, and on the resin portion (5c) outside the cutout. The pressure sensor according to claim 2, wherein the hollow portion (5 a) is surrounded by one.   The circuit board (5b) exposed from the notch in the plate-shaped mold IC (5) is an end surface on the bottom (2c) side of the stem (2) provided with the detection unit (3). The pressure sensor according to claim 2, wherein the pressure sensor is coplanar.   Of the resin part (5c) in the plate-shaped mold IC (5), a surface (5s) to be in close contact with the lid members (6, 7) is provided with a groove part (5r) surrounding the notch. The pressure sensor according to any one of claims 2 to 4, wherein:   The pressure according to any one of claims 1 to 5, wherein the lid member includes a metal shield case (6) that covers the plate-shaped mold IC (5). Sensor. The housing (4) and the stem (2) are made of metal,
The shield case (6) is electrically connected to the stem (2) via the housing (4) by being electrically connected to the housing (4). The pressure sensor according to claim 6. An opening (2b) in which a bottom (2c) constituting a diaphragm deformable by pressure is provided on one end side of the shaft with one direction as an axis, and the pressure is introduced to the other end side of the shaft. A bottomed hollow cylindrical stem (2) provided with:
A detection unit (3) provided on an end surface of the stem (2) on the bottom (2c) side and outputting an electrical signal corresponding to the deformation of the diaphragm;
A hollow portion (4a), and the stem (2) is fitted into the hollow portion (4a) from the bottom (2c) side so as to surround the side surface of the stem (2) around the axis; And a housing (4) fixed to the stem (2);
A circuit board (5b) provided with a sensor circuit electrically connected to the detection unit (3) is incorporated, and the circuit board (5b) is molded by the resin part (5b), and the housing ( 4) a plate-shaped mold IC (5) disposed in close contact with the substrate,
A pressure sensor comprising the stem (2) and the housing (4), wherein an internal space in which the detection part (3) is arranged is sealed by the plate-shaped mold IC (5).   The circuit board (5b) of the plate-shaped mold IC (5) is exposed at the bottom (2c) side of the stem (2) provided with the detection unit (3), and is exposed. The pressure sensor according to claim 8, wherein the detection unit (3) and the sensor circuit are electrically connected to each other.   A bump (12) is arranged between the circuit board (5b) and the detection unit (3), and the sensor circuit and the detection unit (3) of the circuit board (5b) have a stand-pump structure. The pressure sensor according to claim 9, wherein the pressure sensor is electrically connected. The housing (4) and the stem (2) are made of metal,
The stem (2) has a hollow cylindrical shape,
The outer periphery of the stem (2) is provided with a flange portion (2g), and is joined to the housing (4) by welding at the flange portion (2g). The pressure sensor according to any one of 1 to 10.   The pressure sensor according to claim 11, wherein the welded portion of the flange portion (2g) has an inclined surface with an outer diameter gradually expanding toward the bottom portion (2c).   The pressure sensor according to claim 12, wherein the inclined surface of the flange portion (2g) has a fillet shape in which a gradient with respect to the axis gradually increases toward the bottom portion (2c). The plate-shaped mold IC (5) includes external connection terminals (51 to 5o), and the external connection terminals (51 to 5o) are exposed from the resin portion (5c).
The terminal component (7) which molded the terminal (7a) connected to the said external connection terminal (5l-5o) in the resin part (7b) is included, The one of Claim 1 thru | or 13 characterized by the above-mentioned. The pressure sensor according to one. The terminal (7a) has a pad portion (7g-7j) for external connection,
The pressure sensor according to claim 14, wherein the pad portions (7g to 7j) are exposed from one surface of the resin portion (7b) of the terminal component member (7).   The pad portion (7g-7j) is characterized in that a portion exposed from the resin portion (7b) is narrower than a portion embedded in the resin portion (7b). The described pressure sensor.   The circuit board (5b) is provided with circuit components (5h to 5k) that are components of the sensor circuit, and the circuit components (5h to 5h) are connected via bonding wires (9), The bonding wire (9) is arranged on the side opposite to the resin injection port at the time of molding of the resin part (5c) molding the plate-shaped mold IC (5). The pressure sensor according to any one of 16.

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