JP2010256115A - Panel instrument - Google Patents

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Publication number
JP2010256115A
JP2010256115A JP2009105022A JP2009105022A JP2010256115A JP 2010256115 A JP2010256115 A JP 2010256115A JP 2009105022 A JP2009105022 A JP 2009105022A JP 2009105022 A JP2009105022 A JP 2009105022A JP 2010256115 A JP2010256115 A JP 2010256115A
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terminal
case
hole
temperature
plate
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JP5233818B2 (en
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Katsuhiko Shimizu
勝彦 清水
Keika Hasegawa
慶華 長谷川
Shigenobu Miyamoto
重信 宮本
Haruo Morita
陽雄 森田
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Yokogawa Electric Corp
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Yokogawa Electric Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a panel instrument which is suited for miniaturization and performs accurate temperature compensation of a thermocouple. <P>SOLUTION: This instrument is an enhanced one of a panel instrument to be arranged in a case to measure the temperature of a terminal to which a thermocouple is connected. This device includes isothermal plates which are attached to a side face of the case and are fitted to terminals. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、ケースに配置され、熱電対が接続される端子の温度を測定するパネル計器に関し、小型化に適し、熱電対の正確な温度補償を行うことができるパネル計器に関するものである。   The present invention relates to a panel instrument that is arranged in a case and measures the temperature of a terminal to which a thermocouple is connected, and more particularly to a panel instrument that is suitable for miniaturization and can perform accurate temperature compensation of a thermocouple.

パネル計器、例えば、温度調節計、温度指示計、温度記録計等は、温度センサで温度を測定し、温度補償を行い、熱電対により温度測定を行っている。このような装置は、例えば下記特許文献1,2等に示されている。   Panel instruments such as a temperature controller, a temperature indicator, and a temperature recorder measure temperature with a temperature sensor, perform temperature compensation, and measure temperature with a thermocouple. Such an apparatus is disclosed in, for example, Patent Documents 1 and 2 below.

近年、技術進歩に伴い、大型のパネル計器も小型化になり、パネル計器内の回路基板に、従来の大型のパネル計器と同等の回路が搭載されるようになり、機器内の発熱量が増加し、機器内の温度上昇を招いた。この温度上昇の影響を受けて、熱電対に接続される端子の温度を測定する温度センサの温度が、実際の端子の温度と誤差を生じ、実際の温度より高い温度測定を行ってしまった。また、複数のパネル計器をパネルに並べて設置すると、パネル計器内部がさらに温められ、さらに誤差が大きくなってしまった。この結果、温度補償が正確に行えなくなり、熱電対の温度測定の精度を悪化させてしまった。   In recent years, with the advancement of technology, large panel instruments have also become smaller, and the circuit board in the panel instrument has been equipped with a circuit equivalent to the conventional large panel instrument, increasing the amount of heat generated in the equipment. As a result, the temperature inside the equipment increased. Under the influence of this temperature rise, the temperature of the temperature sensor that measures the temperature of the terminal connected to the thermocouple causes an error from the actual temperature of the terminal, and the temperature measurement is higher than the actual temperature. Moreover, when a plurality of panel instruments were installed side by side on the panel, the inside of the panel instrument was further warmed, and the error was further increased. As a result, temperature compensation cannot be performed accurately, and the temperature measurement accuracy of the thermocouple is deteriorated.

特開平9−218108号公報JP-A-9-218108 特開平7−209095号公報JP-A-7-209095

本発明の目的は、小型化に適し、熱電対の正確な温度補償を行うことができるパネル計器を実現することにある。   An object of the present invention is to realize a panel instrument suitable for miniaturization and capable of performing accurate temperature compensation of a thermocouple.

このような課題を達成するために、本発明のうち請求項1記載の発明は、
ケースに配置され、熱電対が接続される端子の温度を測定するパネル計器において、
前記ケースの側面に取り付けられると共に、前記端子に取り付けられる等温板を備えたことを特徴とするものである。
請求項2記載の発明は、請求項1記載の発明であって、
前記等温板は、周囲の熱を前記端子に伝熱することを特徴とするものである。
請求項3記載の発明は、請求項1または2記載の発明であって、
前記ケースの側面に前記等温板が嵌められる溝部と、
この溝部の端部に形成され、前記端子に前記等温板を導く貫通穴と
を設けたことを特徴とするものである。
請求項4記載の発明は、請求項3記載の発明であって、
前記等温板は、長方形状の板状に略L字で形成され、略L字の短辺を前記貫通穴に挿入し、略L字の短辺に前記端子のネジが挿入される穴を有することを特徴とするものである。
In order to achieve such a problem, the invention according to claim 1 of the present invention is:
In a panel instrument that measures the temperature of a terminal that is placed in a case and connected to a thermocouple,
An isothermal plate attached to the side of the case and attached to the terminal is provided.
Invention of Claim 2 is invention of Claim 1, Comprising:
The isothermal plate transfers ambient heat to the terminal.
Invention of Claim 3 is invention of Claim 1 or 2, Comprising:
A groove part into which the isothermal plate is fitted to a side surface of the case;
A through hole is formed at an end of the groove and leads the isothermal plate to the terminal.
Invention of Claim 4 is invention of Claim 3, Comprising:
The isothermal plate is formed in a substantially L shape in the shape of a rectangular plate, and has a substantially L-shaped short side inserted into the through-hole, and a substantially L-shaped short side having a hole into which the terminal screw is inserted. It is characterized by this.

本発明によれば、等温板が、熱を吸収して端子を温め、端子の温度をケース内の温度に近づけるので、小型化に適し、熱電対の正確な温度補償を行うことができる。   According to the present invention, the isothermal plate absorbs heat to warm the terminal, and the temperature of the terminal is brought close to the temperature in the case, so that it is suitable for downsizing and accurate temperature compensation of the thermocouple can be performed.

本発明の一実施例を示した全体構成図である。It is the whole block diagram which showed one Example of this invention. 図1に示す装置の要部組立断面図である。It is principal part assembly sectional drawing of the apparatus shown in FIG.

以下本発明を、図面を用いて詳細に説明する。図1は本発明の一実施例を示した全体構成図である。図2は図1に示す装置の要部組立断面図である。   Hereinafter, the present invention will be described in detail with reference to the drawings. FIG. 1 is an overall configuration diagram showing an embodiment of the present invention. FIG. 2 is a cross-sectional view of an essential part of the apparatus shown in FIG.

図1において、ケース1は、箱状に形成され、内部に回路を有し、背面に複数の端子が配列して設けられ、前面のカバーに表示部やスイッチ等が設けられている。そして、2つの溝部11は、ケース1の側面に、ケース1の背面から前面へ長方形状に形成される。貫通穴111は、溝部11の背面側の端部に形成される。溝部12は、2つの溝部11を囲むように、溝部11より浅く、長方形状に形成される。溝部13は、溝部11,12を囲み、溝部12より浅く、ケース1の側面のほぼ全域に形成される。   In FIG. 1, a case 1 is formed in a box shape, has a circuit inside, a plurality of terminals are arranged on the back surface, and a display unit, a switch, and the like are provided on the front cover. The two groove portions 11 are formed in a rectangular shape on the side surface of the case 1 from the back surface of the case 1 to the front surface. The through hole 111 is formed at the end on the back side of the groove 11. The groove portion 12 is shallower than the groove portion 11 and is formed in a rectangular shape so as to surround the two groove portions 11. The groove portion 13 surrounds the groove portions 11 and 12, is shallower than the groove portion 12, and is formed in almost the entire side surface of the case 1.

2つの等温板2は、長方形状の金メッキされた銅板で、長辺である長板21、短辺である短板22の略L字状に形成される。長板21は、溝部11に嵌められる。短板22は、穴23が形成され、貫通穴111に挿入される。保護シート3は、ポリカーボネートで形成され、溝部12に貼り付けられる。銘柄シート4は、溝部13に貼り付けられる。   The two isothermal plates 2 are rectangular gold-plated copper plates, and are formed in a substantially L shape of a long plate 21 having a long side and a short plate 22 having a short side. The long plate 21 is fitted in the groove 11. The short plate 22 is formed with a hole 23 and is inserted into the through hole 111. The protective sheet 3 is made of polycarbonate and is attached to the groove 12. The brand sheet 4 is attached to the groove 13.

次に、図2を用いて、図1に示す装置の内部を説明する。図2において、取付穴14は、ケース1の背面に貫通して複数設けられ、挿入溝15を有する。両面テープ16は、等温板2をケース1に貼り付ける。端子5は、ナット部材51,バネ部材52,座金53,ネジ54からなり、熱電対を接続する端子55(図1では図示せず)が取り付けられ、取付穴14に挿入され、取り付けられる。ナット部材51は厚手の板材で形成され、ネジ穴が形成される。バネ部材52は、例えば銅のバネ板で概略コ字形に形成され、内側にナット部材51が取り付けられ、ナット部材51のネジ穴に対応する部分に穴が設けられる。ネジ54は、座金53の穴、端子55の穴、等温板2の穴23、バネ部材52の穴を貫通して、ナット部材51にネジ止めされる。   Next, the inside of the apparatus shown in FIG. 1 will be described with reference to FIG. In FIG. 2, a plurality of attachment holes 14 are provided through the back surface of the case 1 and have insertion grooves 15. The double-sided tape 16 affixes the isothermal plate 2 to the case 1. The terminal 5 includes a nut member 51, a spring member 52, a washer 53, and a screw 54, and a terminal 55 (not shown in FIG. 1) for connecting a thermocouple is attached to the terminal 5 and inserted into the attachment hole 14 and attached. The nut member 51 is formed of a thick plate material, and a screw hole is formed. The spring member 52 is formed of, for example, a copper spring plate in a generally U shape, and the nut member 51 is attached to the inside, and a hole is provided in a portion corresponding to the screw hole of the nut member 51. The screw 54 passes through the hole of the washer 53, the hole of the terminal 55, the hole 23 of the isothermal plate 2, and the hole of the spring member 52, and is screwed to the nut member 51.

回路基板6は、ケース1に格納され、挿入溝15により端子5に導かれ、搭載する回路(図示せず)に接続する電極(図示せず)が、バネ部材52と電気的に接続する。ホルダー7は、断熱材料、例えば、ポリフェニレンサルファイド樹脂などで形成され、バネ部材52と熱的に接続する。温度センサ71をカバー72により保持し、回路基板40に左右スライド可能に取り付けられる。   The circuit board 6 is housed in the case 1, guided to the terminal 5 by the insertion groove 15, and an electrode (not shown) connected to a circuit (not shown) to be mounted is electrically connected to the spring member 52. The holder 7 is formed of a heat insulating material such as polyphenylene sulfide resin, and is thermally connected to the spring member 52. The temperature sensor 71 is held by a cover 72 and is attached to the circuit board 40 so as to be slidable left and right.

このような装置の組立動作を以下に説明する。図2に示すように、ナット部材51とバネ部材52を取付穴14に取り付ける。そして、図1に示すように、等温板2の短板22を貫通穴111に挿入し、長板21を溝部11に嵌め、図2に示すように、両面テープ16により、ケース1に貼り付ける。この上に、保護シート3を溝部12に貼り付けて、等温板2をケース1の側面に固定する。さらに、この上に、銘板シート4を溝部13に貼り付ける。   The assembly operation of such a device will be described below. As shown in FIG. 2, the nut member 51 and the spring member 52 are attached to the attachment hole 14. Then, as shown in FIG. 1, the short plate 22 of the isothermal plate 2 is inserted into the through-hole 111, the long plate 21 is fitted into the groove portion 11, and, as shown in FIG. . On top of this, the protective sheet 3 is affixed to the groove 12 to fix the isothermal plate 2 to the side surface of the case 1. Furthermore, the nameplate sheet 4 is affixed on the groove 13 on this.

そして、図2の左側から右側に挿入溝15に沿って回路基板60が挿入される。これにより、回路基板60の電極にバネ部材52が電気的に接続されると共に、温度センサ71とバネ部材52が熱的に接続される。ネジ54を、座金53の穴、端子55の穴、等温板2の穴23、バネ部材52の穴を貫通して、ネット部材51にネジ止めさせる。   Then, the circuit board 60 is inserted along the insertion groove 15 from the left side to the right side in FIG. Thereby, the spring member 52 is electrically connected to the electrode of the circuit board 60, and the temperature sensor 71 and the spring member 52 are thermally connected. The screw 54 passes through the hole of the washer 53, the hole of the terminal 55, the hole 23 of the isothermal plate 2, and the hole of the spring member 52, and is screwed to the net member 51.

等温板2が、外気の熱を吸収すると共に、ケース1を介して、回路基板40の回路等が発生する熱を吸収する。そして、等温板2は、吸収した熱を端子5に伝熱し、端子5を温める。この端子5の熱が温度センサ71に伝熱する。この温度センサ71が感知する温度により、熱電対の温度補償を行う。   The isothermal plate 2 absorbs heat from the outside air and also absorbs heat generated by the circuit of the circuit board 40 through the case 1. The isothermal plate 2 transfers the absorbed heat to the terminal 5 and warms the terminal 5. The heat of the terminal 5 is transferred to the temperature sensor 71. The temperature of the thermocouple is compensated by the temperature sensed by the temperature sensor 71.

このように、等温板2が、周囲の熱を吸収して端子5を温め、端子5の温度をケース1内の温度に近づけるので、小型化に適し、熱電対の正確な温度補償を行うことができる。   In this way, the isothermal plate 2 absorbs ambient heat to warm the terminal 5 and brings the temperature of the terminal 5 close to the temperature in the case 1, which is suitable for miniaturization and performing accurate temperature compensation of the thermocouple. Can do.

なお、本発明はこれに限定されるものではなく、図1ではケース1が熱電対を2つ設ける構成を示し、等温板2を2つ設けた例を示したが、熱電対が1つの場合は、等温板2が1つの構成でよい。   In addition, this invention is not limited to this, In FIG. 1, the case 1 showed the structure which provides two thermocouples, and the example which provided two isothermal plates 2 was shown, but the case where there is one thermocouple The isothermal plate 2 may have a single configuration.

また、ナット部材51とバネ部材52とを別々にした構成を示したが、1つの部材で構成してもよい。   Moreover, although the structure which separated the nut member 51 and the spring member 52 was shown, you may comprise by one member.

また、温度センサ71は、ホルダー7に取り付けられて、回路基板6に搭載される例を示したが、回路基板6に直接取り付ける構成でもよい。   In addition, although the temperature sensor 71 is attached to the holder 7 and mounted on the circuit board 6, the temperature sensor 71 may be directly attached to the circuit board 6.

そして、等温板2が設けられる側面とは、表示部等が設けられる正面、端子が設けられる背面と異なる面を意味する。つまり、ケース1の横側だけでなく、上側、下側に設ける構成でもよい。   And the side surface in which the isothermal plate 2 is provided means a surface different from the front surface in which a display part etc. are provided and the back surface in which a terminal is provided. That is, the configuration may be provided not only on the lateral side of the case 1 but also on the upper side and the lower side.

1 ケース
11 溝部
111 貫通穴
2 等温板
23 穴
5 端子
71 温度センサ
DESCRIPTION OF SYMBOLS 1 Case 11 Groove part 111 Through-hole 2 Isothermal plate 23 Hole 5 Terminal 71 Temperature sensor

Claims (4)

ケースに配置され、熱電対が接続される端子の温度を測定するパネル計器において、
前記ケースの側面に取り付けられると共に、前記端子に取り付けられる等温板を備えたことを特徴とするパネル計器。
In a panel instrument that measures the temperature of a terminal that is placed in a case and connected to a thermocouple,
A panel instrument characterized by comprising an isothermal plate attached to the side of the case and attached to the terminal.
前記等温板は、周囲の熱を前記端子に伝熱することを特徴とする請求項1記載のパネル計器。   The panel instrument according to claim 1, wherein the isothermal plate transfers ambient heat to the terminal. 前記ケースの側面に前記等温板が嵌められる溝部と、
この溝部の端部に形成され、前記端子に前記等温板を導く貫通穴と
を設けたことを特徴とする請求項1または2記載のパネル計器。
A groove part into which the isothermal plate is fitted to a side surface of the case;
The panel instrument according to claim 1 or 2, wherein a through hole is formed at an end of the groove and leads the isothermal plate to the terminal.
前記等温板は、長方形状の板状に略L字で形成され、略L字の短辺を前記貫通穴に挿入し、略L字の短辺に前記端子のネジが挿入される穴を有することを特徴とする請求項3記載のパネル計器。   The isothermal plate is formed in a substantially L shape in the shape of a rectangular plate, and has a substantially L-shaped short side inserted into the through-hole, and a substantially L-shaped short side having a hole into which the terminal screw is inserted. The panel instrument according to claim 3.
JP2009105022A 2009-04-23 2009-04-23 Panel instrument Active JP5233818B2 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59149036U (en) * 1983-03-25 1984-10-05 横河電機株式会社 Isothermal plate for terminal temperature measurement
JPS6187333U (en) * 1984-11-14 1986-06-07
JP2008256571A (en) * 2007-04-06 2008-10-23 Hioki Ee Corp Measuring device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59149036U (en) * 1983-03-25 1984-10-05 横河電機株式会社 Isothermal plate for terminal temperature measurement
JPS6187333U (en) * 1984-11-14 1986-06-07
JP2008256571A (en) * 2007-04-06 2008-10-23 Hioki Ee Corp Measuring device

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