JP2010244785A - Organic el panel and manufacturing method of the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress deterioration in organic EL light-emission characteristics due to leakage of moisture, contained inside an organic resin such as a flattening film of an organic EL panel, to organic EL layers and electrodes with time. <P>SOLUTION: The organic EL panel 10 includes a first substrate 20 and a second substrate 30 facing the first substrate while having each light-emitting region P and a non-light-emitting region outside each light-emitting region. The first substrate 20 has a first substrate body 21, a flattening film 23 above the second substrate side of the first substrate body, one electrode 24 provided on the flattening film so as to include at least the light-emitting region and not to include at least a part of the non-light-emitting region, an organic EL layer 26 provided on the electrode so as to include at least the light-emitting region, and another electrode 27 provided on the organic EL layer so as to include at least the light-emitting region and not to include at least a part of the non-light-emitting region. The second substrate 30 has a second substrate body 31, and a conductive film 32 provided on the first substrate side of the second substrate body so as to be electrically in contact with the another electrode 27. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an organic EL panel and a method for manufacturing the same.

  In recent years, with the diversification of information processing devices, there is an increasing demand for flat panel displays that consume less power than a cathode ray tube (CRT) and can be thinned. An organic EL panel is mentioned as a flat panel display excellent in terms of low voltage driving, all solid-state type, high-speed response, self-luminous property, and the like. In the organic EL panel, for example, a thin film transistor (hereinafter referred to as “TFT”) is provided on a glass substrate, and a planarizing film is provided to planarize and insulate the surface of the thin film transistor. An electrode, an organic EL layer, and a second electrode are sequentially stacked.

  By the way, the flattening film is a novolac resin or an acrylic resin in view of easy permittivity, film thickness, flattening, and easy control of the taper angle of the pattern forming and formed pattern end. And an organic resin material such as polyimide resin. These organic resin materials are likely to accumulate moisture inside compared to materials made of inorganic compounds. Therefore, when the planarizing film is made of an organic resin material, moisture leaks from the planarizing film to reach the electrode or the organic EL layer, and the peripheral portion of the electrode or the organic EL layer is damaged and deteriorated. There is a problem that the brightness of the screen is lowered.

  Patent Document 1 discloses an organic EL panel having a configuration in which a planarizing film is divided for each pixel by a planarizing film dividing unit provided in a display region. According to this configuration, even if moisture leaks from the planarization film in any pixel, moisture cannot move to the planarization film of other pixels, so that moisture leaked from the planarization film is displayed. It is described that it can be prevented from spreading over the entire area.

JP 2005-164818 A

  However, according to the organic EL panel having the configuration of Patent Document 1, although it is possible to prevent moisture contained in the flattening film from moving through the entire display region by the flattening film dividing unit, it is divided and formed. Since each of the planarization films is covered with an inorganic film that is a pixel electrode, moisture remains contained in the planarization film. For this reason, when the organic EL panel is used for a long period of time, it is conceivable that the organic EL characteristics deteriorate due to the pixel electrode being damaged by moisture leaked from the planarization film.

  An object of the present invention is to prevent moisture contained in an organic resin such as a planarizing film from leaking over time and deteriorating the organic EL emission characteristics.

The organic EL panel of the present invention includes a first substrate and a second substrate provided so as to face the first substrate, and has a light emitting region and a non-light emitting region outside thereof,
The first substrate includes a first substrate body, a planarization film provided on the second substrate side of the first substrate body, and at least the light emitting region on the planarization film, and the non-light emitting One electrode provided so as not to include at least part of the region, an organic EL layer provided on the one electrode so as to include at least the light emitting region, and at least the light emitting region on the organic EL layer And another electrode provided so as not to include at least a part of the non-light-emitting region,
The second substrate includes a second substrate body and a conductive film that is provided on the first substrate side of the second substrate body and is in electrical contact with the other electrode of the first substrate.

  Preferably, a region where the other electrode is not provided is formed corresponding to a region where the one electrode is not provided.

  According to the above configuration, the region where no other electrode is provided constitutes an escape path for releasing moisture contained in the organic resin such as a planarizing film to the outside, and is therefore included in the organic resin. The moisture that is discharged is discharged from the inside of the organic resin without leaking into the electrode or the organic EL layer, and as a result, it is possible to suppress the deterioration of the organic EL light emission characteristics due to the moisture leaked from the inside of the organic resin.

  Preferably, the light emitting region has another light emitting region adjacent to the light emitting region via a non-light emitting region including a region where the other electrode is not provided.

  According to the above configuration, the non-light-emitting region that separates one light-emitting region from another light-emitting region adjacent thereto includes a region where no other electrode is provided. The moisture contained in can be discharged.

The first substrate further includes an edge cover provided on the one electrode in the non-light emitting region,
It is preferable that the other electrode is in electrical contact with the conductive film of the second substrate corresponding to the position where the edge cover is provided.

  According to said structure, the edge cover is provided in the peripheral part of one electrode, and the protruding part of the other electrode of the upper layer of an edge cover can be reliably electrically contacted with the electrically conductive film of a sealing substrate. it can.

  It is preferable that the first substrate has a recess that reaches at least the planarization film in a region where the one electrode is not provided.

  According to the above configuration, the concave portion is formed in the planarization film in the region where the one electrode is not provided, and the planarization film is exposed on the inner wall surface of the concave portion. Both the moisture and the moisture contained in the planarizing film are released to the outside from the exposed portion (wall surface) of the recess. At this time, the moisture contained in the planarization film is directly discharged to the outside without passing through the edge cover, so that the moisture inside the planarization film can be discharged early.

  The recess may be formed through the planarizing film.

  Furthermore, the exposed surface of the planarizing film due to the recesses may be covered with a coating film.

In that case, the first substrate further includes an edge cover provided to include the concave portion on the one electrode in the non-light-emitting region,
It is preferable that the coating film is integrally formed of the same material as the edge cover.

The first substrate is configured such that the other electrode has a raised portion,
The other electrode is preferably in electrical contact with the conductive film of the second substrate at the raised portion.

  According to said structure, even when there exists curvature etc. in a 1st board | substrate or a 2nd board | substrate, the other electrode of a 1st board | substrate and the electrically conductive film of a 2nd board | substrate can be reliably made to contact.

  When the other electrode of the first substrate has a raised portion, it is preferable that two or more raised portions are provided in one continuous light emitting region.

  The organic EL panel of the present invention may be a top emission type in which light is extracted from the second substrate side.

  The organic EL panel of the present invention may be a bottom emission type that extracts light from the first substrate side.

  In the organic EL panel of the present invention, the planarizing film may be formed of a polyimide resin or an acrylic resin.

  Moreover, when the edge cover is formed in the organic EL panel of the present invention, the edge cover may be formed of a polyimide resin or an acrylic resin.

  The manufacturing method of the organic EL panel of the present invention includes a recess forming step of forming a recess by dry etching the planarizing film using one electrode as a mask.

  In the organic EL panel of the present invention, the first substrate has a first substrate body, a planarization film provided on the second substrate side of the first substrate body, and at least the light emission on the planarization film. One electrode provided so as to include a region and not including at least a part of the non-light emitting region, an organic EL layer provided so as to include at least the light emitting region on the one electrode, and the organic EL Another electrode provided so as to include at least the light emitting region on the layer and not include at least a part of the non-light emitting region, a second substrate, a second substrate body, and the second substrate And a conductive film that is provided on the first substrate side of the main body and is in electrical contact with the other electrode of the first substrate, so that a region where the other electrode is not provided is a flattening film or the like Escape to release moisture contained in organic resin to the outside Constitute a. Therefore, the moisture contained in the organic resin is discharged from the inside of the organic resin without leaking into the electrode or the organic EL layer, and as a result, the organic EL light emission characteristics are deteriorated by the moisture leaked from the inside of the organic resin. Can be suppressed.

1 is a schematic cross-sectional view of an organic EL panel according to Embodiment 1. FIG. 1 is a plan view of an organic EL panel according to Embodiment 1. FIG. It is sectional drawing in the III-III line of FIG. (A)-(d) is explanatory drawing which shows the manufacturing method of the organic electroluminescent panel of Embodiment 1. FIG. 6 is a cross-sectional view of an organic EL panel according to Embodiment 2. FIG. (A)-(e) is explanatory drawing which shows the manufacturing method of the organic electroluminescent panel of Embodiment 2. FIG. It is sectional drawing of the organic electroluminescent panel which concerns on Embodiment 3. FIG. 6 is a cross-sectional view of an organic EL panel according to Embodiment 4. FIG. 10 is a cross-sectional view of an organic EL panel according to Embodiment 5. FIG.

  Hereinafter, embodiments of the organic EL panel 10 of the present invention will be described in detail with reference to the drawings.

Embodiment 1
<Organic EL panel>
1-3 show the organic EL panel 10 of the first embodiment. The organic EL panel 10 is used for, for example, a display of a portable information device, a full color high-definition television, or the like.

  The organic EL panel 10 has a configuration in which a TFT substrate 20 (first substrate) and a sealing substrate 30 (second substrate) are provided to face each other. The organic EL panel 10 includes a plurality of pixels arranged in a matrix, and performs a predetermined image display in the display area by the pixels. When the organic EL panel 10 performs RGB full-color display, the plurality of pixels are composed of three types of auxiliary pixels, a red auxiliary pixel, a green auxiliary pixel, and a blue auxiliary pixel. The organic EL panel 10 has, for example, a length of 400 to 500 mm, a width of 300 to 400 mm, and a thickness of 1 to 30 mm.

  The TFT substrate 20 is provided with a planarization film 23 so as to cover the TFT 22 on the TFT substrate body 21, and the first electrode 24 (one electrode), the organic EL layer 26, and the second electrode 27 are formed on the planarization film 23. (Other electrodes) are sequentially stacked. The TFT substrate 20 has, for example, a length of 400 to 500 mm, a width of 300 to 400 mm, and a thickness of 0.3 to 1.1 mm.

  The sealing substrate 30 has a configuration in which a conductive film 32 is provided in the light emitting region P on the sealing substrate body 31 and a hygroscopic agent 33 is attached to the non-light emitting region. For example, the sealing substrate 30 has a length of 400 to 500 mm, a width of 300 to 400 mm, and a thickness of 0.3 to 1.1 mm.

  The TFT substrate body 21 is provided with a plurality of gate lines on a substrate such as a glass substrate or a plastic substrate in parallel with each other in the horizontal direction, and a plurality of signal lines in a direction perpendicular to the gate lines. . A pixel is formed in a matrix type at a position where the gate line and the signal line intersect, and a TFT 22 is provided so as to be connected to each pixel. The TFT substrate body 21 has a thickness of 0.7 to 1.1 mm, for example.

  The TFT 22 has a function as a switching element in each pixel. Examples of the material constituting the TFT 22 include inorganic semiconductor materials such as amorphous silicon and polycrystalline silicon.

  The planarizing film 23 is provided on the TFT substrate body 21 so as to cover the TFT substrate body 21, the TFT 22 disposed on the TFT substrate body 21, the wiring, and the like. Examples of the material constituting the planarizing film 23 include photosensitive organic resin materials such as acrylic resin, polyimide resin, and novolac resin. Of these, acrylic resins or polyimide resins are preferred because of their low cost. Further, when the organic EL panel 10 has a bottom emission type structure, the TFT substrate 20 is required to be light transmissive. Therefore, the organic EL panel 10 is preferably made of a light transmissive material such as an acrylic resin. The planarizing film 23 is provided with through holes 23 a corresponding to the respective TFTs 22, thereby enabling conduction from the surface of the TFT substrate body 21 to the TFTs 22. For example, the planarizing film 23 preferably has a thickness of 0.5 to 5 μm, and more preferably 1 to 3 μm.

  The first electrode 24 is provided so as to cover the planarizing film 23 and is electrically connected to the TFT 22 through a through hole 23 a formed in the planarizing film 23. The first electrode 24 has a function of injecting holes into the organic EL layer 26. Examples of the material constituting the first electrode 24 include indium tin oxide (ITO) and indium zinc oxide (IZO). In addition, when the organic EL panel 10 has a top emission type structure, the first electrode 24 is configured by a laminated body of a metal film having a high reflectance and a transparent electrode film, or a reflective electrode such as a metal having a high work function. It is preferable. In the former case, for example, the first electrode 24 can be composed of a laminate of a metal film such as Al or Ag and a transparent film such as ITO or IZO. The first electrode 24 has a thickness of 50 to 500 nm, for example.

  An edge cover 25 is provided so as to cover a peripheral portion of the island-like pattern of the first electrode 24 and a region where the first electrode 24 is not provided. The edge cover 25 has a function of preventing the first electrode 24 and the second electrode 27 from being short-circuited. Therefore, it is preferable that the edge cover 25 is provided so as to surround the entire periphery of the first electrode 24. When the edge cover 25 is provided so as to surround the entire periphery of the first electrode 24, the edge cover 25 prevents the released moisture from entering between the second electrode 27 and the conductive film 32. It further has a function to

  Further, since the edge cover 25 is provided on the peripheral edge of the first electrode 24, the raised portion of the second electrode 27 provided on the upper layer of the edge cover 25 is reliably electrically connected to the conductive film 32 of the sealing substrate 30. Can touch. Note that the edge cover 25 may be formed only on a part of the peripheral edge of the first substrate.

  As the material constituting the edge cover 25, the same materials as mentioned as the material constituting the planarizing film 23 are used.

  The organic EL layer 26 is provided so as to cover the first electrode 24. The organic EL layer 26 has a configuration in which a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are stacked from the first electrode 24 side. Of these, it is sufficient that at least a light emitting layer is provided, and the hole injection layer, the hole transport layer, the electron transport layer, and the electron injection layer are in accordance with the characteristics required for the organic EL panel 10 to be manufactured. What is necessary is just to be provided suitably. In addition, the hole injection layer and the hole transport layer, and the electron transport layer and the electron injection layer may each be provided in one layer.

  The hole injection layer and the hole transport layer have a function of increasing hole injection efficiency and hole transport efficiency into the light emitting layer, respectively. Examples of the material for the hole injection layer and the hole transport layer include triphenylamine and derivatives thereof. Each of the hole injection layer and the hole transport layer has a thickness of 10 to 100 nm, for example.

  The light emitting layer has a function of emitting light by recombining holes injected from the first electrode 24 side with electrons injected from the second electrode 27 side. The light emitting layer is provided in an island pattern so that the light emitting materials of the respective light emitting colors correspond to the pixel regions of the respective light emitting colors. The light emitting layer is formed of a material having high light emission efficiency such as a low molecular fluorescent dye, a fluorescent polymer, and a metal complex. Examples of the material for the light emitting layer include anthracene, naphthalene, and derivatives thereof. The light emitting layer has a thickness of 10 to 100 nm, for example.

  The electron transport layer and the electron injection layer have a function of increasing the electron transport efficiency and the electron injection efficiency from the second electrode 27 to the light emitting layer, respectively. Examples of the material for the electron transport layer and the electron injection layer include derivatives thereof such as triazole and oxadiazole. For example, the electron transport layer and the electron injection layer each have a thickness of 10 to 100 nm.

  The second electrode 27 covers the organic EL layer 26 and is formed in an island pattern so as to correspond to the island pattern of the first electrode 24. More specifically, the second electrode 27 is provided in a region including at least the light emitting region P, and the region where the first electrode 24 is not provided coincides with the region where the second electrode 27 is not provided. Is provided in a pattern. By providing the region where the second electrode 27 is not provided corresponding to the region where the first electrode 24 is not provided, the peripheral portion of the first electrode 24 is provided in the region where the second electrode 27 is not provided. Thus, the edge cover 25 formed in the above is exposed. If the organic EL layer 26 is not patterned, the surface of the exposed portion of the edge cover 25 from the region where the second electrode 27 is not provided may be covered with the organic EL layer 26.

  The second electrode 27 has a function of injecting electrons into the organic EL layer 26. Examples of the material constituting the second electrode 27 include aluminum (Al) and magnesium (Mg). When the organic EL panel 10 has a top emission type structure, the second electrode 27 is made of a material having optical transparency such as an ultrathin metal film. Is preferred. In that case, for example, the second electrode 27 can be made of an aluminum alloy (Al: Mg) or the like. Since each of the second electrodes 27 is in electrical contact with the conductive film 32, the material constituting the second electrode 27 itself may have a high resistivity. The second electrode 27 has a thickness of 5 to 100 nm, for example.

  The sealing substrate 30 has a configuration in which a conductive film 32 is provided on the surface of the sealing substrate body 31 on the TFT substrate side so as to correspond to the display region. Further, a hygroscopic agent 33 is affixed to an area other than the display area.

  The sealing substrate body 31 is formed of, for example, a glass substrate or a plastic substrate. The sealing substrate body 31 has a thickness of 0.3 to 1.1 mm, for example.

  The conductive film 32 is in electrical contact with each of the second electrodes 27 provided in the island pattern. The conductive film 32 is made of, for example, a light transmissive material such as ITO or IZO, a metal such as Al, or the like. The conductive film 32 has a thickness of 50 to 500 nm, for example. Since the conductive film 32 is provided so that the raised portion of the second electrode 27 formed on the edge cover 25 is raised toward the sealing substrate 30 side, the TFT substrate 20 and the sealing substrate 30 are warped. Even in this case, the conductive film 32 and the second electrode 27 can be reliably brought into electrical contact.

  The hygroscopic agent 33 has a function of absorbing moisture released by leaking from the organic resin of the planarizing film 23 and the edge cover 25. As the hygroscopic agent 33, for example, powders such as CaO and BaO and those in which these powders are dispersed in a non-woven fabric are used, and the moisture absorbing agent 33 is appropriately formed in a necessary size according to the usage form. In order to attach the hygroscopic agent 33 to the TFT substrate side surface of the sealing substrate body 31, for example, a recess 28 may be provided on the TFT substrate side surface. In that case, the depth of the recessed part 28 is 0.2-0.3 mm, for example.

  The TFT substrate 20 and the sealing substrate 30 are bonded together with a sealing resin 11 such as an ultraviolet curable resin or a thermosetting epoxy resin. And the hollow part sealed with both board | substrates is filled with inert gas, such as dry argon and dry nitrogen.

  A polarizing plate may be provided on each of the outer surfaces of the TFT substrate 20 and the sealing substrate 30.

  In this organic EL panel 10, when the TFT 22 is turned on by signal input from the wiring, holes are injected from the first electrode 24 to the organic EL layer 26 and electrons are injected from the second electrode 27 to the organic EL layer 26. The Then, holes and electrons are recombined in the light emitting layer. The deactivation energy released when the molecule that has been excited by recombination returns to the ground state is extracted as light emission. A predetermined image can be displayed on the organic EL panel 10 by controlling the light emission luminance of each pixel region.

  In the first embodiment, the first electrode 24 is an anode and the second electrode 27 is a cathode. However, the first electrode may be a cathode and the second electrode may be an anode. Electrons are injected into the organic EL layer, and holes are injected from the second electrode into the organic EL layer.

<Method for producing organic EL panel>
Next, the manufacturing method of the organic EL panel 10 is demonstrated using FIG.

(Planarization film formation process)
First, as shown in FIG. 4A, a TFT 22 is formed on a glass substrate by a known method, and further, a planarizing film 23 is formed by using a photolithography technique. Specifically, for example, an acrylic resin is applied onto a substrate having a cleaned surface by spin coating, and prebaked at about 80 ° C. for about 20 minutes to form an acrylic resin film. The acrylic resin film is exposed using a photomask, and further developed using, for example, tetramethylammonium hydroxide (TMAH) as a photoresist developer, thereby forming a through hole 23a that is electrically connected to the TFT22. Finally, post-baking is performed at about 200 ° C. for about 2 hours to form the planarizing film 23.

(First electrode forming step)
Next, as shown in FIG. 4B, the first electrode 24 is formed. For example, when the first electrode 24 is formed of ITO, first, an ITO film is formed using a sputtering method, and the first electrode 24 is formed so as to correspond to the pixel region using a photolithography technique.

(Edge cover forming process)
Next, as shown in FIG. 4C, the edge cover 25 is formed by patterning so as to cover the peripheral edge of the first electrode 24 in the same manner as the planarizing film 23.

(Organic EL layer / second electrode forming step)
Subsequently, as shown in FIG. 4D, the organic EL layer 26 and the second electrode 27 are formed.

  First, the organic EL layer 26 is patterned using a known method such as a resistance heating vapor deposition method, an EB vapor deposition method, or an ink jet method. For example, the organic EL layer 26 is formed by vapor-depositing an organic substance in a state where a non-light-emitting region is masked with a vapor deposition mask.

  Next, the second electrode 27 is patterned on the organic EL layer 26 using a known method such as sputtering. At this time, it is preferable to form the second electrode 27 by mask vapor deposition using a vapor deposition mask. This is because in the pattern formation using the photolithography technique, the organic EL layer 26 may be damaged by a chemical solution at the time of etching or resist peeling.

(Sealing substrate preparation process)
Here, the conductive film 32 is formed on the surface of the sealing substrate 30 on the TFT substrate side using a resistance heating vapor deposition method, an electron beam vapor deposition method, a sputtering method, or the like. The conductive film 32 may be formed on the entire surface of the sealing substrate 30 or may be formed in a pattern in an area to be a display region of the organic EL panel 10.

  In addition, a hygroscopic agent 33 is attached to a region other than the display region on the surface of the sealing substrate 30 on the TFT substrate side.

(Sealing process)
Finally, the TFT substrate 20 and the sealing substrate 30 are opposed to each other and bonded together with the sealing resin 11.

  Note that the TFT substrate 20 and the sealing substrate 30 are preferably bonded together in a glove box in order to perform humidity and oxygen concentration under predetermined conditions. The inside of the glove box is filled with an inert gas such as nitrogen or argon, and each of the water concentration and the oxygen concentration is preferably controlled to 10 ppm or less, and more preferably 1 ppm or less.

  Through the above steps, the organic EL panel 10 according to Embodiment 1 can be manufactured.

<Effect of Embodiment 1>
According to the organic EL panel 10 according to the first embodiment, since the second electrode 27 is not provided in the non-light emitting region, the edge cover 25 is not completely covered by the second electrode 27. It has become. Therefore, moisture contained in the edge cover 25 is discharged to the outside from a portion where the edge cover 25 is exposed in a region where the second electrode 27 is not provided, and is provided on the surface of the sealing substrate 30 on the TFT substrate side. The absorbed moisture absorbent 33 absorbs it. Further, as the moisture inside the edge cover 25 is released to the outside, the moisture contained in the planarizing film 23 also moves to the edge cover 25 and is the same as the moisture inside the edge cover 25. To the outside and absorbed by the moisture absorbent 33. As a result, it is possible to suppress the moisture contained in the planarizing film 23 and the edge cover 25 from leaking out and damaging the organic EL layer 26 and the electrode, thereby deteriorating the organic EL emission characteristics.

<< Embodiment 2 >>
<Organic EL panel>
FIG. 5 shows the organic EL panel 10 of the second embodiment. The organic EL panel 10 has the same configuration as that of the first embodiment except that a recess 28 is formed in the planarizing film 23 in a region where the second electrode 27 is not provided. Hereinafter, the configuration of the recess 28 of the organic EL panel 10 will be described.

  The recess 28 is provided in a region where the first electrode 24 is not provided so as to be recessed from the surface of the TFT substrate 20 to the TFT substrate body 21 side. The planarization film 23 is exposed on the inner wall surface of the recess 28, and moisture contained in the planarization film 23 can be discharged from the exposed portion of the planarization film 23 into the recess 28. The moisture released to the recess 28, that is, the outside of the TFT substrate 20 is absorbed by the moisture absorbent 33 provided on the sealing substrate 30.

<Method for producing organic EL panel>
Next, a method for manufacturing the organic EL panel 10 will be described.

(Planarization film / first electrode formation process)
First, the planarization film 23 is formed on the TFT substrate body 21 as in the first embodiment (FIG. 6A), and then the first electrode 24 is formed (FIG. 6B).

(Recess formation process)
Subsequently, as illustrated in FIG. 6C, the planarization film 23 is dry-etched using the first electrode 24 as a mask to form a recess 28. As the etching gas, a mixed gas of CF4 and O2, a mixed gas of SF6 and O2, or the like can be used, and the high frequency power density is set to 0.1 to 10 W / cm2. The etching time varies depending on the film thickness and conditions, but is, for example, 5 to 30 minutes. Thereby, the recess 28 penetrating the planarizing film 23 can be formed.

(Edge cover forming process)
Next, as shown in FIG. 6D, the edge cover 25 is formed by patterning, for example, a photosensitive polyimide resin in the same manner as the planarizing film 23. At this time, the edge cover 25 is formed in a state where the edge cover 25 is covered with a mask so that the edge cover 25 is not formed in the recess 28 provided in the light emitting region P and the planarizing film 23.

(Organic EL layer / second electrode forming step)
Subsequently, the organic EL layer 26 and the second electrode 27 are produced in the same manner as in the first embodiment (FIG. 6E). However, it is not necessary to form a pattern using a mask or the like when the second electrode 27 is formed. Even if the second electrode 27 is formed on the entire surface without pattern formation by covering with a mask or the like, the second electrode 27 is formed in the upper layer of the first electrode 24 in the recess 28 formed in the planarizing film 23. Therefore, a conductive layer made of the material of the second electrode 27 is formed on the bottom of the recess 28. Even if the conductive layer is formed on the bottom surface of the recess 28, the planarization film 23 has a sufficient thickness with respect to the first electrode 24 and the second electrode 27, and thus has no influence on the light emission characteristics of the organic EL panel 10. Absent.

(Sealing process)
Finally, as in the first embodiment, the TFT substrate 20 and the sealing substrate 30 are opposed to each other and bonded together with a sealing resin.

  Through the above steps, the organic EL panel 10 according to Embodiment 1 can be manufactured.

<Effect of Embodiment 2>
According to the organic EL panel 10 according to the second embodiment, the recess 28 is formed in the planarization film 23 in the region where the second electrode 27 is not provided, and the planarization film 23 is formed on the inner wall surface of the recess 28. Since it is exposed, both the moisture contained in the edge cover 25 and the moisture contained in the planarizing film 23 are released to the outside from the exposed portion (wall surface) of the recess 28, and the TFT substrate side surface of the sealing substrate 30. It is absorbed by the hygroscopic agent 33 provided in. Therefore, it is possible to suppress the moisture contained in the planarizing film 23 and the edge cover 25 from leaking and damaging the organic EL layer 26 and the electrode, thereby deteriorating the organic EL light emission characteristics.

  Further, according to the above configuration, the moisture contained in the planarizing film 23 is released directly to the outside without passing through the inside of the edge cover 25, so that the moisture inside the planarizing film 23 is quickly released. Can be discharged.

  Further, even when the edge cover 25 is lower in moisture permeability than the planarizing film 23, for example, when the edge cover 25 is formed of polyimide resin and the planarizing film 23 is formed of epoxy resin, the edge cover 25 The moisture contained in the planarizing film 23 can be released to the outside regardless of the moisture permeability.

<< Embodiment 3 >>
<Organic EL panel>
FIG. 7 shows an organic EL panel 10 according to the third embodiment. The organic EL panel 10 has the same configuration as that of the second embodiment except that the recess 28 does not penetrate the planarizing film 23.

  As in the second embodiment, the concave portion 28 has the planarizing film 23 exposed on the wall surface (that is, the exposed surface of the concave portion 28), and the bottom surface of the concave portion 28 is also composed of the planarizing film 23. The depth of the recess 28 is, for example, 1/5 to 4/5 of the film thickness of the planarizing film 23. The depth at which the recess 28 is formed can be arbitrarily set, but the greater the recess depth, the easier it is to release moisture contained in the planarizing film 23 to the outside.

<Method for producing organic EL panel>
The organic EL panel 10 having the above-described configuration can be manufactured by the same method as in the second embodiment, except that the etching is performed so as not to penetrate the planarizing film 23 in the recess forming step.

<Effect of Embodiment 3>
According to the organic EL panel 10 according to the third embodiment, the recess 28 is formed in the planarization film 23 in the region where the second electrode 27 is not provided, and the planarization film 23 is formed on the inner wall surface of the recess 28. Since it is exposed, both the moisture contained in the edge cover 25 and the moisture contained in the planarizing film 23 are released to the outside from the exposed portion (wall surface) of the recess 28, and the TFT substrate side surface of the sealing substrate 30. It is absorbed by the hygroscopic agent 33 provided in. Therefore, it is possible to suppress the moisture contained in the planarizing film 23 and the edge cover 25 from leaking and damaging the organic EL layer 26 and the electrode, thereby deteriorating the organic EL light emission characteristics.

  Further, according to the above configuration, the moisture contained in the planarizing film 23 is released directly to the outside without passing through the inside of the edge cover 25, so that the moisture inside the planarizing film 23 is quickly released. Can be discharged.

  Further, metal wiring may be provided between the TFT substrate body 21 and the planarizing film 23. In particular, in the case of the bottom emission type organic EL panel 10 that extracts light emission from the TFT substrate side, the light emitting region P needs to be made of a light transmissive or light semi-transmissive material. It is concentrated in the non-light emitting area. In this case, according to the organic EL panel 10 having the configuration of the third embodiment, since the recess 28 is provided at a depth that does not penetrate the planarizing film 23, it is provided between the TFT substrate body 21 and the planarizing film 23. The formed metal wiring remains covered with the planarizing film 23 and is not exposed on the surface of the recess 28. Therefore, the metal wiring is not corroded and damaged by the etching solution or moisture used in the manufacturing process of the organic EL panel 10.

<< Embodiment 4 >>
<Organic EL panel>
FIG. 8 shows an organic EL panel 10 according to the fourth embodiment. The organic EL panel 10 has the same configuration as that of the second embodiment except that the exposed surface of the recess 28 is not the planarizing film 23 but a coating film 25a made of the same material as the edge cover 25. Hereinafter, only the coating film 25a provided on the exposed surface of the recess 28 will be described.

  The coating film 25 a provided on the wall surface of the recess 28 is formed of the same material as the edge cover 25. The coating film 25a may be provided so as to cover the entire wall surface of the recess 28, or may be provided so as to cover a part of the wall surface. In the latter case, the exposed surface of the recess 28 is composed of the coating film 25 a and the planarizing film 23.

<Method for producing organic EL panel>
The organic EL panel 10 having the above-described configuration is the same as that of the second embodiment except that in the edge cover forming step, the covering film 25a is formed at the same time as the edge cover 25 so that the material of the edge cover adheres to the recess 28. It can be manufactured by the method.

<Effect of Embodiment 4>
According to the organic EL panel 10 according to the fourth embodiment, the recess 28 is formed in the planarizing film 23 in the region where the second electrode 27 is not provided, and the organic resin is exposed on the wall surface inside the recess 28. Therefore, both the moisture contained in the edge cover 25 and the moisture contained in the planarizing film 23 are discharged to the outside from the exposed portion (wall surface) of the recess 28 and provided on the surface of the sealing substrate 30 on the TFT substrate side. The absorbed moisture absorbent 33 absorbs it. Therefore, it is possible to suppress the moisture contained in the planarizing film 23 and the edge cover 25 from leaking and damaging the organic EL layer 26 and the electrode, thereby deteriorating the organic EL light emission characteristics.

  The configuration in which the coating film 25a is formed on the surface of the concave portion 28 is used when the deposition mask is not aligned with high precision in the edge cover forming process or when the opening is not provided with high precision in the deposition mask itself. Often obtained. In order to prevent the edge cover 25 from being formed in the recess 28 as in the organic EL panel 10 of the second and third embodiments, the deposition mask is aligned with high accuracy, or the vapor deposition mask with openings provided with high accuracy is used. Although it is necessary to use, the structure of the fourth embodiment that can be manufactured at a lower cost than those can also obtain the effect of releasing moisture contained in the planarizing film 23 and the like to the outside. .

<< Embodiment 5 >>
<Organic EL panel>
FIG. 9 shows an organic EL panel 10 according to the fifth embodiment. The organic EL panel 10 has the same configuration as that of the second embodiment except that a protrusion 29 is formed on the surface of the first electrode 24 instead of providing an edge cover. Hereinafter, the protrusion 29 formed on the surface of the first electrode 24 will be described.

  One or a plurality of protrusions 29 are provided per light emitting region P between the first electrode 24 and the organic EL layer 26. The protrusion 29 is made of an organic resin material such as a photosensitive epoxy resin or polyimide resin, for example, like the planarizing film 23 and the edge cover 25. The protrusion 29 has a circular bottom surface with a diameter of 1 to 10 μm, for example, and is formed in a semi-cylindrical or hemispherical shape with a thickness of 1 to 5 μm. In the portion where the protruding portion 29 is provided, the organic EL layer 26 and the second electrode 27 are laminated on the upper portion of the protruding portion 29, whereby the second electrode 27 is raised on the sealing substrate 30 side. It is formed. The raised portion 29 a of the second electrode 27 constitutes a portion that is in electrical contact with the conductive film 32 provided on the TFT substrate side of the sealing substrate body 31.

  It is preferable that two or more protrusions 29 are provided per light emitting region P. Even when the TFT substrate 20 or the sealing substrate 30 is warped, two or more raised portions 29 a on the second electrode 27 are formed by providing two or more projections 29, so that the second electrode 27 This is because the conductive film 32 and the conductive film 32 can contact with each other more reliably.

<Method for producing organic EL panel>
In the manufacturing method of the organic EL panel 10 according to the fifth embodiment, the protruding portion 29 is provided on the surface of the first electrode 24 by performing the protruding portion forming step instead of the edge cover forming step in the manufacturing method of the organic EL panel 10 according to the second embodiment. It is a thing. Hereinafter, the protrusion forming process will be described.

(Protrusion formation process)
Using the same method as the planarization film 23 and the edge cover 25, the projections 29 are pattern-formed on the TFT substrate body 21 provided with the planarization film 23 and the first electrode 24.

  After the protrusion forming process, the organic EL panel 10 can be manufactured through the same process as in the second embodiment.

<Effect of Embodiment 5>
According to the organic EL panel 10 according to the fifth embodiment, the recess 28 is formed in the planarization film 23 in the region where the second electrode 27 is not provided, and the planarization film 23 is formed on the inner wall surface of the recess 28. Since it is exposed, the moisture contained in the planarizing film 23 is released from the exposed portion (wall surface) of the recess 28 to the outside and is absorbed by the moisture absorbent 33 provided on the surface of the sealing substrate 30 on the TFT substrate side. The Therefore, it is possible to suppress the moisture contained in the planarizing film 23 from leaking out and damaging the organic EL layer 26 and the electrode and deteriorating the organic EL light emission characteristics.

  Further, according to the organic EL panel 10 according to the fifth embodiment, since the raised portion 29a of the second electrode 27 is configured by the protruding portion 29, it is compared with the case where the raised portion 29a is configured on the edge cover 25. Thus, the second electrode 27 and the conductive film 32 can be brought into electrical contact with more certainty. The edge cover 25 may vary in height or the shape of the tip may be collapsed. In this case, the heights of the raised portions 29a of the second electrode 27 are not uniform, but on the first electrode 24 This is because the protruding portions 29 provided on the surface are easily formed so as to have a uniform height, and the raised portions 29a are also likely to have a uniform height.

  The present invention is useful for an organic EL panel and a method for manufacturing the same.

P Light emitting area 10 Organic EL panel 20 TFT substrate (first substrate)
23 planarization film 24 first electrode (one electrode)
25 Edge cover 25a Coating film 26 Second electrode (other electrode)
28 Concave portion 29a Raised portion 30 Sealing substrate (second substrate)
32 conductive film

Claims (15)

An organic EL panel comprising a first substrate and a second substrate provided to face the first substrate, and having a light emitting region and a non-light emitting region outside thereof,
The first substrate includes a first substrate body, a planarization film provided on the second substrate side of the first substrate body, and at least the light emitting region on the planarization film, and the non-light emitting One electrode provided so as not to include at least part of the region, an organic EL layer provided on the one electrode so as to include at least the light emitting region, and at least the light emitting region on the organic EL layer And another electrode provided so as not to include at least a part of the non-light-emitting region,
The second substrate is an organic having a second substrate body and a conductive film provided on the first substrate side of the second substrate body and in electrical contact with the other electrode of the first substrate. EL panel. The organic EL panel according to claim 1,
An organic EL panel in which a region where the other electrode is not provided is formed corresponding to a region where the one electrode is not provided. In the organic EL panel according to claim 1 or 2,
An organic EL panel having another light emitting region adjacent to the light emitting region through a non-light emitting region including a region where the other electrode is not provided. The organic EL panel according to any one of claims 1 to 3,
The first substrate further includes an edge cover provided on the one electrode in the non-light emitting region,
The organic EL panel in which the other electrode is in electrical contact with the conductive film of the second substrate corresponding to the position where the edge cover is provided. The organic EL panel according to any one of claims 1 to 4,
The first substrate is an organic EL panel in which a recess reaching at least the planarizing film is formed in a region where the one electrode is not provided. The organic EL panel according to claim 5,
The organic EL panel in which the concave portion is formed so as to penetrate the planarizing film. In the organic EL panel according to claim 5 or 6,
An organic EL panel in which an exposed surface of the flattening film by the concave portion is covered with a coating film. The organic EL panel according to claim 7,
The first substrate further includes an edge cover provided to include the concave portion on the one electrode in the non-light-emitting region,
The organic EL panel in which the coating film is integrally formed of the same material as the edge cover. In the organic EL panel according to any one of claims 1 to 8,
The first substrate is configured such that the other electrode has a raised portion,
The other electrode is an organic EL panel in electrical contact with the conductive film of the second substrate at the raised portion. The organic EL panel according to claim 9,
2. The organic EL panel according to claim 1, wherein two or more raised portions are provided in one continuous light emitting region.   The organic EL panel according to any one of claims 1 to 10, which is a top emission type in which light is extracted from the second substrate side.   The organic EL panel according to claim 1, wherein the organic EL panel is a bottom emission type in which light is extracted from the first substrate side. The organic EL panel according to any one of claims 1 to 12,
An organic EL panel, wherein the planarizing film is formed of a polyimide resin or an acrylic resin. In the organic EL panel according to claim 4 or 8,
An organic EL panel, wherein the edge cover is formed of a polyimide resin or an acrylic resin. It is a manufacturing method of the organic EL panel according to any one of claims 5 to 8,
A method for manufacturing an organic EL panel, comprising: a recess forming step of forming a recess by dry etching the planarizing film using one electrode as a mask.

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