JP2010243352A - Method of manufacturing probe card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress a change in XY-coordinate position of a needle point caused by thermal deformation of a support and a probe substrate to the extent possible. <P>SOLUTION: A method of manufacturing a probe card includes the steps of: heating or cooling a card assembly not including a contact to a set temperature; determining a thermal deformation ratio of the probe substrate under the temperature condition; determining a position of mounting the contact on the probe substrate based on the determined thermal deformation ratio; putting the contact on a lower surface of the probe substrate based on the determined mounting position; and obtaining the probe card. The method includes steps of: thereafter heating or cooling the probe card to the set temperature; measuring a needle point position of the contact when the probe card is put under the set temperature; determining whether the measured needle point position is within a reference range; and determining a temperature for using the probe card in testing an object to be tested. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a probe card used for an electrical test of a flat test object such as a semiconductor integrated circuit, and more particularly to a probe card used to connect the test object and an electric circuit of a tester that performs the electrical test.

  In this type of probe card (i.e., electrical connection device), if the height position (i.e., the Z coordinate position) of the needle tip with respect to the object to be inspected is uneven, the overdrive force acting on the needle tip is greatly different, Further, there are contacts (that is, probes) that are not pressed by the electrodes of the object to be inspected. Further, when the position of the needle tip (that is, the XY coordinate position) with respect to the electrode of the object to be inspected in the plane (X, Y coordinates) parallel to the object to be inspected, the contact becomes the electrode of the object to be inspected. Not pressed.

  From the above, the probe card must be manufactured so that the Z coordinate position and the XY coordinate position of the needle tip with respect to the electrode of the object to be inspected are in accordance with the specifications. If even one of these coordinate positions is different from the specification, an accurate test result of the object to be inspected cannot be obtained.

  As one of such probe cards, a support body having a lower surface, a wiring board held on the lower surface of the support body, and a space disposed below the wiring board and using a fixture A probe board attached to a support, an electrical connector disposed between the wiring board and the probe board and attached to the wiring board, and a plurality of contacts attached to the lower surface of the probe board; (For example, Patent Documents 1 and 2).

  In the above probe card, a virtual surface where the height position of the needle tip from the object to be inspected is common so that the plurality of contacts are pressed against the electrode of the object to be inspected with the same force (overdrive force) during the test. The needle tip is correctly adjusted to the XY coordinate position so that the needle tip is in contact with the corresponding electrode of the object to be inspected.

  On the other hand, in a test of an integrated circuit, a test is performed in a state where a device under test is maintained at a high temperature. During a test under such a high temperature environment, the device under test is maintained at a high temperature by a chuck top that holds the device under test or a heating element provided on the chuck top. As a result, the probe card is used in a high temperature environment where the probe card itself is heated from below by heat from an object to be inspected or a chuck top.

  However, when the probe card is used in the high temperature environment as described above, in the conventional probe card, the lower side of the probe board, the wiring board, the support and the like is heated to a higher temperature than the upper side thereof. As a result, the probe substrate, the wiring substrate, the support body, and the like are thermally deformed such that the central portion thereof protrudes downward.

  The above-mentioned thermal deformation of the probe board, wiring board, support body, etc., changes the height position of the needle tip with respect to the electrode of the object to be inspected, so that the center part is low and the peripheral part is high, As a result, the XY coordinate position of the needle tip with respect to the electrode of the object to be inspected is changed. As a result, the overdrive force acting on the needle tip is greatly different, and there is a probe that is not pressed against the electrode of the object to be inspected.

  The problem concerning the height position of the needle tip, and thus the XY coordinate position, caused by the thermal deformation as described above, is to inspect a large number of uncut objects on the semiconductor wafer at one time or in multiple times at the same time. As is the case, the larger the number of contacts to be provided, the larger.

  In order to solve the above problems of the probe card described in Patent Documents 1 and 2, etc., a probe made of a material having a thermal expansion coefficient 1.2 to 1.4 times the thermal expansion coefficient of the probe substrate A card has been proposed (Patent Document 3).

  According to the probe card described in Patent Document 3, the probe substrate heated from the lower side is heated to a higher temperature than the support body arranged on the upper side of the probe substrate. Thereby, the thermal expansion amount of the probe substrate whose thermal expansion coefficient is smaller than that of the support becomes larger than that of the support. As a result, since the thermal deformation of the support and the probe substrate functions to cancel them, the probe substrate is kept flat by suppressing the thermal deformation in which the central portion of the probe substrate protrudes downward. .

  However, for example, as described in Patent Document 4, when the technique of providing the heating element on the probe substrate is applied to the probe card described in Patent Document 3, the probe is caused by the difference in the coefficient of thermal expansion described above. It cannot be avoided that the substrate undergoes thermal deformation in which the central portion is convex upward, thereby changing the XY coordinate position of the needle tip with respect to the electrode of the object to be inspected.

  The thermal deformation as described above is performed not only when the probe card is used in a high temperature environment in which the support and the probe substrate are heated from below, but also when the object to be inspected is cooled and the support and probe substrate are cooled. This also occurs when the probe card is used in a low temperature environment where the card is cooled from below.

  An object of this invention is to suppress the change of the XY coordinate position of the needle point resulting from the thermal deformation of a support body and a probe board as much as possible.

  As a result of various experiments and researches, the inventors have found that the coefficient of thermal expansion of the completed probe board differs from the coefficient of thermal expansion of the probe board material, depending on the amount and shape of the internal wiring of the probe board. The present invention has been completed by finding that the coefficient of thermal expansion of the completed probe board differs before and after assembling to the probe card depending on whether the probe board is restrained with respect to the fixture and the support.

  The method for manufacturing a probe card according to the present invention includes a first step of attaching a probe board to a lower surface of a support body with a fixture to obtain a card assembly, and a temperature adjustment provided in the support body or the probe board. By supplying power to the member, the card assembly is heated or cooled to a set temperature, and based on the determined second step of determining the thermal deformation rate of the probe substrate at the set temperature, A third step of determining the attachment position of the contact to the probe substrate, a fourth step of attaching the contact to the lower surface of the probe substrate based on the determined attachment position, and obtaining a probe card; Heating or cooling the probe card to the set temperature by supplying power to a heating element, the contact when the probe card is at the set temperature Based on the fifth stroke for measuring the needle tip position, the sixth stroke for determining whether or not the measured needle tip position is within the reference range, and the determination result in the sixth stroke, And a seventh step of determining a temperature when the card is used for testing the object to be inspected.

  The fourth step includes separating the probe substrate from the support before attaching the contact to the probe substrate, and supporting the probe substrate after attaching the contact to the probe substrate. Can include attaching to the body.

  The attachment position is determined as a coordinate position of the contact with respect to the probe substrate when the probe substrate is placed at an attachment temperature different from the set temperature, and the contact is determined by the probe substrate at the attachment temperature. When placed, it can be attached to the probe substrate. The attachment temperature may include room temperature.

  In the seventh step, when the determination result in the sixth step is within the reference range, the set temperature is determined to be a temperature when the probe card is used for a test of an object to be inspected. Can be included.

  In the seventh step, when the determination result in the sixth step is not within the reference range, the temperature of the probe card is set to a new temperature different from the set temperature, and the contact at the new temperature is performed. Measure the needle tip position of the child, determine whether the needle tip position is within the reference range, and based on the result of the determination, determine the temperature when the probe card is used for testing the object to be inspected Can include.

  The thermal deformation rate may be determined based on the measured thermal deformation amount by measuring the thermal deformation amount of the probe board at the set temperature at which the card assembly is heated or cooled.

  In the present invention, before attaching the contact to the lower surface of the probe board, the card assembly is heated or cooled to a set temperature, the thermal deformation rate of the probe board at the set temperature is obtained, and the calculated value is used as a basis. Then, the attachment position of the contact to the probe substrate is determined. Further, after the contact is attached to the lower surface of the probe substrate, the probe card is heated or cooled to the set temperature, and the needle tip position of the contact when the probe card is at the set temperature is measured. Thereafter, it is determined whether or not the measured needle tip position is within the reference range, and based on the determination result, the temperature at which the probe card is used for testing the object to be inspected is determined.

  The temperature of the probe card during the test of the object to be inspected can be the temperature of the probe card when the measured needle tip position is within the reference range. For this reason, according to the present invention, since the probe card can be tested while the probe card is heated or cooled to the determined use temperature, regardless of the difference in thermal expansion coefficient between the support and the probe substrate. The change in the XY coordinate position due to thermal deformation is suppressed.

  Before attaching the contact to the probe board, the probe board is separated from the support, and after the contact is attached to the probe board, the probe board is attached to the support. Installation work becomes easy.

  The mounting position is determined as the coordinate position of the contact with respect to the probe board when the probe board is at a mounting temperature different from the set temperature, and the probe is probed when the probe board is in the mounting temperature state. When the probe is attached to the substrate, the contact can be attached to the probe substrate at a temperature at which the probe substrate is easy to work, and the attachment of the contact to the probe substrate is facilitated.

  When the probe tip position is not within the allowable range, set the probe board temperature to a new temperature different from the set temperature, measure the probe tip position at the new temperature, and use the probe card temperature. Is determined, the temperature at the time of use of the probe card having the needle tip that does not fall within the allowable range at the time of the first determination can be obtained.

It is a front view shown with the probe card by which one Example of the measuring apparatus used for the manufacturing method which concerns on this invention is manufactured. It is an expanded sectional view which shows one Example of the support state of the probe board | substrate to the support body in the probe card shown in FIG. It is a figure for demonstrating one Example of the manufacturing method which concerns on this invention.

  [Examples of probe card to be manufactured and measuring apparatus thereof]

  Referring to FIG. 1, an electrical connection device, that is, a probe card 10 uses a plurality of integrated circuits formed on a disk-shaped semiconductor wafer as an object to be inspected, and divides these integrated circuits into one or more times. At the same time for testing or testing testers. Each integrated circuit has a plurality of electrodes such as pad electrodes on the top surface.

  In order to determine the coefficient of thermal expansion and the position of the tip of the probe card 10, the measuring device 12 determines the amount of thermal deformation of the probe substrate 40, which will be described later, and the coordinate position of the needle tip of the contactor 42 which will be described later. Measured.

  The measurement device 12 is controlled by the measurement substrate 14, the measurement stage 16 that receives the measurement substrate 14, the signal processing device 18 that controls the probe card 10 and the measurement stage 12, and the signal processing device 18 to drive the measurement stage 16. The signal processing device 18 and the measurement stage 16 are controlled by the driver 20 and the signal processing device 18 to control the probe card 10 and the signal processing device 18 and the probe card 10. And a tester head 22 for passing signals between them.

  The measurement substrate 14 is a disk-shaped semiconductor wafer having a plurality of uncut integrated circuits, and has a plurality of electrodes 14a such as pad electrodes on the upper surface, similarly to the above-mentioned object to be inspected.

  The measurement stage 16 receives the measurement substrate 14 horizontally and chucks the releasable chuck top 24, a stage mechanism 26 that moves the chuck top 24 three-dimensionally, and one or more ones that heat or cool the chuck top 24. The temperature adjustment member 28, one or more temperature sensors 30 for detecting the temperature of the chuck top 24, and a video camera 32 for photographing a reference mark and a needle tip (both will be described later) provided on the probe card 10. Prepare.

  The chuck top 24 is a known one having a function of vacuum-sucking the measurement substrate 14 in a releasable manner. The stage mechanism 26 is also moved in the three-dimensional directions left and right and up and down in a plane parallel to the measurement substrate 14 received by the chuck top 24 and is rotated angularly around the θ axis extending in the up and down direction. It is a known one.

  The temperature adjustment member 28, the temperature sensor 30, and the video camera 32 are all electrically connected to the signal processing device 18 through the driver 20. In the illustrated example, the temperature adjusting member 28 is a heating element that generates heat when supplied with heating power (heating current) from the signal processing device 18. The heating power is supplied to the driver 20 from a power source (not shown) provided in the signal processing device 18.

  The temperature sensor 30 is controlled by the signal processing device 18 and outputs a temperature signal corresponding to the temperature of the chuck top 24. The video camera 32 is an area sensor such as a CCD camera, and is controlled by the signal processing device 18 to photograph a target object such as a reference mark or a needle tip and output an image signal obtained thereby.

  The driver 20 is controlled by the signal processing device 18 to drive the stage mechanism 26 so as to move the chuck top 24 three-dimensionally and to rotate it angularly around the θ axis. The three-dimensional movement amount of the chuck top 24 and the rotation amount around the θ axis are detected by a plurality of sensors (not shown) provided in the stage mechanism, and signal processing is performed from these sensors via the driver 20. Supplied to device 18.

  The driver 20 also supplies heating power instructed by the signal processing device 18 to the temperature adjustment member 28 and outputs a temperature signal from the temperature sensor 30, an image signal from the video camera 32, and the like to the signal processing device 18. . Those functions of the driver 20 are also controlled by the signal processing device 18.

  Referring to FIGS. 1 and 2, the probe card 10 is arranged on a reinforcing member 34 having a flat lower surface, a circular flat circuit board 36 held on the lower surface of the reinforcing member 34, and a lower surface of the wiring board 36. And a plurality of contacts 42 supported in a cantilevered manner on the lower surface of the probe substrate 40.

  In the illustrated example, each contactor 42 uses a plate-like probe having a crank shape and having a tip that can be photographed by the video camera 32 at the tip. Such a contact 42 is a known one described in, for example, Japanese Patent Application Laid-Open No. 2005-201844.

  However, each contact 42 is a probe made from a fine metal wire such as a tungsten wire, a plate-like probe made using a photolithography technique and a deposition technique, or one surface of an electrical insulating sheet such as polyimide. A conventionally known probe or the like may be used, such as a probe in which a plurality of wirings are formed in the wiring and a part of the wirings is used as a contact.

  The reinforcing member 34 is made of a metal material such as a stainless steel plate into a circular flat plate shape. For example, as described in Japanese Patent Application Laid-Open No. 2008-145238, the reinforcing member 34 includes an inner annular portion, an outer annular portion, a plurality of connecting portions that connect both annular portions, and an outer annular portion. It has a plurality of extensions that extend radially outward and a central frame that continues integrally inside the inner annular portion, and has a shape that acts as a space that opens in both the upper and lower directions between these portions. It can have a flat front shape.

  Further, for example, as described in Japanese Patent Application Laid-Open No. 2008-145238, an annular thermal deformation suppressing member that suppresses thermal deformation of the reinforcing member 34 is disposed on the upper side of the reinforcing member 34, and the thermal deformation suppressing member A cover may be placed on top.

  In the illustrated example, the wiring board 36 is manufactured in a disk shape from an electrically insulating resin such as glass-filled epoxy resin, and a plurality of conductive paths, that is, internal wiring 44 ( 2) and a plurality of power supply paths 46 (see FIG. 2) used for supplying heating power (heating current).

  The measurement signal is an electric signal such as a supply signal supplied to the integrated circuit for testing, a response signal from the integrated circuit to the supply signal, and a temperature signal from a temperature sensor 66 described later. The heating power is power supplied to the heating element as the temperature adjustment member 62, and is supplied from a power source (not shown) provided in the signal processing device 18 in the same manner as the power supplied to the temperature adjustment member 28. .

  Measurement signals such as measurement signals, heating power, and temperature signals are exchanged between the probe card 10 and the signal processing device 18 via the tester head 22.

  The tester head 22 has a function of controlling ON / OFF of heating power supplied to the temperature adjusting member 62, a function of controlling the amount of heating power, a temperature sensor 66, in addition to the known functions provided in the tester for integrated circuits. Additional functions such as the function of transmitting the output signal to the signal processing device 18. However, additional functions may be performed by other circuits.

  Each of the internal wiring 44 and the power supply path 46 of the wiring substrate 36 is connected to a tester (not shown) via a connection terminal (not shown) such as a connector terminal or a tester land provided on the annular peripheral portion of the upper surface of the wiring substrate 36. Connected to an electrical circuit or power source (not shown).

  The reinforcing member 34 and the wiring board 36 are coaxially coupled by a plurality of screw members (not shown) in a state where the lower surface of the reinforcing member 34 and the upper surface of the wiring board 36 are in contact with each other.

  The electrical connector 38 is a known one described in, for example, Japanese Patent Application Laid-Open No. 2008-145238. The electrical connector 38 includes a plate-like electrically insulating pin holder 46, a plurality of connection pins 48 such as pogo pins extending through the pin holder 46 in the vertical direction, and a plurality of connection pins 50.

  The electrical connector 38 also connects the internal wiring 44 and the power supply path 46 of the wiring board 36 to the conductive path 52 and the power supply path 54 described after the probe board 40 by connection pins 48 and 50 (both see FIG. 2). ) Is electrically connected.

  The electrical connector 38 includes a plurality of screw members and appropriate members (both not shown) in a state where the upper surface of the pin holder 46 is in contact with the lower surface of the wiring substrate 36, and the lower surface of the wiring substrate 36 in the pin holder 46. Is bound to.

  In the example shown in FIG. 2, each of the connection pins 48 and 50 uses a pogo pin whose upper end and lower end are separated by a spring. Each of the connection pins 48 and 50 has its upper end pressed against a terminal portion (not shown) following the internal wiring 44 of the wiring substrate 36 or the lower end portion of the power supply path 46, and has its lower end electrically conductive to the probe substrate 40. It is pressed by a terminal portion (not shown) following the upper end portion of the path 52 or the feeding path 54.

  In the illustrated example, the probe substrate 40 includes a multilayer wiring sheet, that is, a sheet-like substrate 56 in which an electrically insulating resin such as a polyimide resin is integrally laminated together with an internal wiring 60 described later, and an electrical insulating property. A multilayer plate-like substrate 58 in which the above-described materials are laminated in a multilayer and integrally with a temperature control member 62 to be described later is integrally laminated so that the sheet-like substrate 56 is located on the lower surface of the plate-like substrate 58. The contactor 42 is attached to the lower surface of the sheet-like substrate 56 in a cantilever manner.

  The sheet-like substrate 56 has a plurality of internal wirings 60 (see FIG. 2) inside in multiple layers, and a plurality of probe lands 61 (see FIG. 2) electrically connected to the internal wirings 60 on the lower surface. It is a multilayer substrate having a known shape and structure, and is formed integrally with the plate substrate 58.

  Each contactor 42 is cantilevered on the probe land 61 by a technique such as bonding with a conductive bonding material such as solder, welding with a laser, or the like with its tip (that is, the needle tip) protruding downward. It is attached to.

  As shown in FIG. 2, the plate-like substrate 58 includes the above-described multiple conductive paths 52 and the above-described plurality of power supply paths 54, and includes one or more temperature adjusting members 62 that generate or absorb heat by electric power. It is a plate-like multilayer substrate provided inside. In the illustrated example, the plate-like substrate 58 is heated to a high temperature, so that it is a multilayer ceramic substrate mainly made of ceramic.

  In the probe card 10, the temperature adjustment member 62 is a heating element such as a heater that generates heat by heating power, and is formed in one or more layers on the plate-like substrate 58.

  Each conductive path 52 of the plate-like substrate 58 is electrically connected to the internal wiring 60 of the sheet-like substrate 56 and is also electrically connected to the internal wiring 44 of the wiring substrate 36 via the connection pins 48. In addition, together with the internal wirings 44 and 60, it is used for passing measurement signals to the contact 42.

  On the other hand, each power supply path 54 of the plate-like substrate 58 is electrically connected to the internal wiring 46 of the wiring board 36 through the connection pins 50, and together with the connection pins 50 and the internal wiring 46, the temperature is increased. It is used for supplying heating power to the heating element as the adjusting member 62. Heating power is supplied from the power source provided in the signal processing device 18 via the tester head 22.

  The probe substrate 40 also has a plurality of reference marks 64 (see FIG. 1) at a plurality of positions spaced in the left-right direction and the front-rear direction of the lower surface of the sheet-like substrate 56, and the temperature of the plate-like substrate 58. One or more temperature sensors 66 (see FIG. 1) to be detected are provided on the plate-like substrate 58.

  Each fiducial mark 64 has a round shape, a cross shape, or the like whose brightness is different from the surrounding brightness so that the video camera 32 can photograph the reference mark 64 so that it can be distinguished from the surrounding. As will be described later, in order to measure the amount of thermal deformation across a plurality of directions from the position of one specific reference mark 64, it is preferable to provide three or more reference marks 64.

  Each temperature sensor 66 includes an internal wiring (not shown) provided on the plate substrate 58, other connection pins (not shown) provided on the electrical connector 38, an internal wiring (not shown) provided on the wiring board, the tester head 22, and the like. And a temperature signal corresponding to the detected temperature is supplied to the signal processing device 18.

  The signal processing device 18 also determines the temperature of the chuck top 24 (and hence the test substrate 14) and the temperature of the plate-like substrate 58 (and thus the probe substrate 40) based on the temperature signals from the temperature sensors 30 and 66, respectively. The driver 20 and the temperature control members 28 and 62 are supplied with a heating power so as to have a set temperature (test temperature of the test object) corresponding to the heating temperature (or cooling temperature) at the time of testing the test object. The tester head 22 is controlled.

  As shown in FIG. 2, the probe substrate 40 as described above is formed by the spacer 68 and the screw member 70 at each of a plurality of positions in a state where the upper surface of the plate-like substrate 58 is pushed toward the lower surface of the electrical connector 38. The reinforcing member 34 is supported. For this reason, in the illustrated example, the reinforcing member 34 functions as a support for supporting the probe substrate 40.

  In order to support the probe substrate 40 on the reinforcing member 34 as described above, in the illustrated example, a plurality of fixing portions 72 are formed on the upper surface of the probe substrate 40, particularly on the upper surface of the plate substrate 58. Each fixing portion 72 has a top surface with which the lower end of the cylindrical spacer 68 abuts, and a female screw hole 72a opened upward, into which the lower end portion of the bolt-shaped screw member 70 is screwed.

  Each spacer 68 has a head portion 68a in contact with the upper surface of the reinforcing member 34 and a male screw portion 68b screwed into the female screw hole 34a of the reinforcing member 34, and the wiring board 36 and the pin holder. 46 is passed through from the upper side to the lower side, and the lower end is in contact with the top surface of the fixing portion 72.

  Each screw member 70 is passed through the through hole 68c of the spacer 68 from the top to the bottom so that the head portion 70a abuts against the top surface of the head portion 68a of the spacer 68 and the lower end portion of the male screw portion 70b is fixed. It is screwed into the female screw hole 72a of the portion 72. Each spacer 68 is screwed into the female screw hole 34a so that the head 68a and the lower end thereof are pressed against the top surface of the reinforcing member 34 and the top surface of the fixing portion 72, respectively.

  As a result, the probe substrate 40 is supported on the reinforcing member 34 by the spacer 68 and the screw member 70. The spacer 68, the screw member 70, and the fixing portion 72 function as an attachment tool.

  In the probe card 10 described above, the reinforcing member 34 and the probe substrate 40, particularly the plate-like substrate 58, are made of materials having substantially the same thermal expansion coefficient, preferably the thermal expansion coefficient of the reinforcing member 34 is the thermal expansion coefficient of the probe substrate 40. On the other hand, it is made of a material in the range of 0.75 to 1.12 times, more preferably in the range of 0.9 to 1.12 times.

  As the above materials, the reinforcing member 34 is stainless steel (SUS410) having a thermal expansion coefficient of 10.4 ppm / ° C, and the plate-like substrate 58 is forsterite (fine fine material having a thermal expansion coefficient of 10.0 ppm / ° C). Ceramic).

  As another material, the reinforcing member 34 is an austenitic material such as Niresto (type 5) having a thermal expansion coefficient of 5 to 6 ppm / ° C, and the plate-like substrate 58 has a thermal expansion coefficient of 5.5 ppm / ° C. Examples thereof include glass alumina.

  Further, as another material, the reinforcing member 34 is a low thermal expansion material such as novinite having a thermal expansion coefficient of 2.5 to 3.5, preferably 3 to 3.5 ppm / ° C. Mention may be made of silicon having a coefficient of thermal expansion of 3.4 ppm / ° C.

  However, the thermal expansion coefficient of the probe substrate 40, particularly the plate-shaped substrate 58, differs from the thermal expansion coefficient of the main material of the probe substrate depending on the amount and shape of the internal wirings 52 and 54.

  [Example of manufacturing method]

  Hereinafter, an embodiment of a probe card manufacturing method will be described with reference to FIGS.

  First, the above-described various parts necessary for manufacturing the probe card 10 are prepared (step 100). The contact 42 is prepared before it is attached to the probe board 40. However, the contact 42 may be prepared in step 100.

  The reinforcing plate 34, the wiring board 36, the electrical connector 38, and the probe board 40 prepared in step 100 are all the same in shape, structure, and structure as described above, except that the contact 42 is not attached to the probe board 40. It has a function.

  Next, the probe board 40 which is coupled to the wiring board 36 and the electrical connector 38 and is not attached with the contact 42 is attached to the reinforcing plate 34 as a support (step 101). Thereby, the card assembly which is not provided with the contact 40 is assembled.

  Next, the heating power is supplied from the signal processing device 18 to the temperature adjusting members 28 and 62, and the chuck top 24 (measurement board 14) and the probe card 10 (the card board described above) are heated to the set temperature described above. The coefficient of thermal expansion of the probe substrate 30 in the state is determined (step 102).

The coefficient of thermal expansion of the probe substrate 30 can be calculated as follows.
(1) An appropriate one reference mark 64 is photographed by the video camera 32, and the XY coordinate value of the reference mark is obtained by the signal processing device 18.
(2) The chuck top 24 is moved to a position where the video camera 32 captures another reference mark 64 by the stage mechanism 26, and the XY coordinate value of the other reference mark is obtained by the signal processing device 18.
(3) The movement amount (the amount of thermal deformation before and after heating) of the chuck top 24 at that time is obtained by the signal processing device 18.
(4) The coefficient of thermal expansion is calculated by the signal processing device 18 from the obtained amount of movement and the distance between the reference marks 64 before heating (at room temperature).

  In the above (2) and (3), by using a plurality of other reference marks, the chuck top 24 is moved from the first reference mark to a position where the other reference mark 64 is photographed by moving the chuck top 24 to another reference mark. By calculating the XY coordinate value of the mark and determining the amount of movement of the chuck top 24 at that time for each other reference mark, the coefficient of thermal expansion in a plurality of directions can be calculated from the first reference mark. Good.

  In step 102, the heating power is not supplied to the temperature adjustment member 28, that is, the chuck top 24 may not be heated. Further, instead of using the reference mark 64, a plurality of appropriate probe lands 61, preferably a plurality of probe lands 61 located at the end may be used.

  In step 102, a known measuring device having a precise optical microscope is used in place of the measuring stage 16, and in this measuring device, the probe substrate 40 is heated and one appropriate optical microscope is used. The relative movement of the probe substrate 40 and the optical microscope is obtained from the position where the position of the reference mark can be confirmed to the position where the position of the other reference mark can be confirmed, the relative movement amount of both is obtained, and the obtained movement The coefficient of thermal expansion may be calculated from the amount and the distance between both reference marks 64 before heating.

  Next, based on the obtained thermal expansion coefficient, set temperature (test temperature of the object to be inspected), XY coordinate position of the electrode of the object to be inspected, dimensions of each contactor 42, etc., contact with the probe substrate 40 The XY coordinate position of each contact 42 to the probe substrate 40 when the child 42 is attached (at the normal temperature state) is determined by the signal processing device 18 as the attachment position.

  As for the attachment position, a result is obtained in which the probe tip of each contactor 42 is in contact with the electrode of the object to be inspected when the probe substrate 40 and the object to be inspected are heated to the use temperature (that is, the test temperature). The XY coordinate position is the XY coordinate position of the contact 42 on the probe board 40 when the contact 42 is attached to the probe board 40.

  The XY coordinate position of the electrode of the object to be inspected and the test temperature of the object to be inspected are the heating temperature of the probe substrate at the time of manufacturing the probe card in this embodiment, and are described as the set temperature.

  The test temperature is determined in advance on the user side of the probe card 10. The dimension of each contact 42, in particular, the dimension from the attachment position of each contact to the probe substrate 40 to the needle tip is a known value. The coefficient of thermal expansion of the object to be inspected is also known, but may be measured in the same manner as the probe substrate 40.

  For this reason, for example, the attachment position is based on the various fixed values as described above, to the probe tip of each contactor 42 and the probe substrate 40 when the probe substrate 40 and the measurement substrate 14 are heated to the set temperature. It is possible to obtain an ideal XY coordinate value of the attachment location of the, and obtain from the obtained ideal XY coordinate value, the obtained coefficient of thermal expansion, the set temperature, and the like.

  Next, the probe substrate 40 that does not include the contacts 42 is removed from the reinforcing member 34 that is the support, and the plurality of contacts 42 are attached to the removed probe substrate 40 (step 104).

  When the contact 42 is attached to the probe board 40, the reinforcing member 34, the wiring board 36, the electrical connector 38, etc. do not hinder the work of attaching the contact 42 to the probe board 40, and the probe board 40 is easy to work. Since the contact 42 can be attached to the probe substrate 40 at a temperature, for example, room temperature, the attaching operation of the contact 42 to the probe substrate 40 is facilitated.

  Next, the probe board 40 including the contacts 42 is attached to the reinforcing member 34, and the probe card 10 is assembled (step 105).

  Next, the heating power is supplied from the signal processing device 18 to the temperature adjusting members 28 and 62, and the heating power is supplied to the temperature adjusting members 28 and 62, so that the chuck top 24 (measurement substrate 14) and the probe card 10 (probe substrate 40) are described above. It is heated again to the set temperature, the XY coordinate position of the needle tip of each contactor 42 in that temperature state is measured, and the XY coordinate position is determined as the needle tip position in the signal processing device 18 (step 106).

  The XY coordinate position of the needle point of each contact 42 is measured by obtaining the XY coordinate value in the signal processing device 18 using the output signal while photographing the needle point of each contact 42 with the video camera 32. be able to.

  Also in step 106, the heating power is not supplied to the temperature adjustment member 28, and therefore the chuck top 24 does not have to be heated. For this reason, in step 106 described above, in a known measuring apparatus equipped with a precise optical microscope, the probe substrate 40 and the optical fiber are checked with the probe substrate 40 while the probe substrate 40 is heated and the probe tip of each contact 42 is confirmed with the optical microscope. The needle tip position may be obtained by relatively moving the microscope and obtaining the XY coordinate position of the confirmed needle tip.

  Next, a determination is made in the signal processing device 18 as to whether or not the needle tip position of each contactor 42 is within a predetermined allowable range (step 107).

  If the determination result in step 107 is outside the allowable range, the heating temperature of the probe card 10 is changed to a temperature different from the set temperature, and the XY coordinate position of the needle tip of each contactor 42 in that temperature state is measured. The XY coordinate position is determined as the needle tip position in the signal processing device 18 (step 108), and then the process returns to step 107.

  Steps 107 and 108 are repeated until the needle tip positions of all the contacts 42 are within a predetermined allowable range.

  If the determination result in step 107 is within the allowable range, the heating temperature of the probe substrate 40 at that time is determined by the temperature at which the probe card 10 is used, that is, the use temperature and the signal processing device 18 (step 109).

  In the probe card 10, the temperature at the time of testing the object to be inspected is the temperature when the measured needle tip position is within the reference range. For this reason, since the probe card 10 can test the inspected object in a state heated to the determined use temperature, the height position and XY coordinate position of the needle tip of each contactor 42 at that time are: As a result, regardless of the difference in thermal expansion coefficient between the reinforcing member 34 and the probe substrate 40, changes in the XY coordinate position due to thermal deformation are suppressed.

  In the case of a probe card used for a tester that tests an object to be inspected at an extremely low temperature such as minus several tens of degrees C, a thermostat that is cooled by cooling power instead of a heating element is used as the temperature adjustment member 62 as described above. An endothermic body (cooling body) such as a module (trade name) is provided in the probe substrate 40, particularly the plate-like substrate 58.

  In the above case, the probe substrate 40 is cooled from below by the object to be inspected and the inspection stage, and is also cooled by the heat absorbing body as the temperature adjusting member 62, and is maintained at a temperature corresponding to the temperature of the object to be inspected. The

  When the probe card 10 is selectively used in one of a heating state and a cooling state, the above-described two types of temperature adjusting members 62 of the heating element and the cooling body are arranged on the probe substrate.

  In the probe card 10, another temperature adjusting member 70 (see FIG. 1) such as a heating element (or heat absorbing body) that generates heat (or absorbs heat) when receiving electric power may be provided inside the reinforcing member 34. . By doing so, the reinforcing member 34 is also heated or cooled by the other temperature adjusting member 70, and the reinforcing member 34 is maintained at a temperature corresponding to the temperatures of the device under test and the probe substrate 40.

  Thereby, not only the thermal deformation of the reinforcing member 34 and the probe substrate 40 whose center part is convex downward or upward is more effectively suppressed, but also the thermal deformation of the probe substrate 40 is more effectively suppressed. The temperatures of the reinforcing member 34 and the probe substrate 40 can be easily adjusted. This temperature adjustment is also controlled by the control device based on the detection signal of the temperature sensor 66.

  In the probe card 10, the temperature adjustment member 62 provided on the probe substrate 40 may be omitted, and the temperature adjustment member 62 may be provided inside the reinforcing member 34 instead. In this case, the probe substrate 40 is heated or cooled from the lower side by the measurement substrate 14 and the measurement stage 16 and is heated or cooled from the upper side by the temperature adjusting member 62 to rapidly heat the probe substrate 40 to the temperature of the measurement substrate 14. Or it is cooled and maintained at that temperature.

  Instead of supporting the probe board 40 by the reinforcing member 34, the probe board 40 may be supported by the wiring board 36. In this case, the reinforcing member 34 can be omitted, and the wiring board 36 acts as a support. On the contrary, the wiring board 36 or the electrical connector 38 may be omitted.

  The present invention can also be implemented using another apparatus such as the above-described measuring apparatus instead of the measuring stage 16.

  The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit described in the claims.

DESCRIPTION OF SYMBOLS 10 Probe card 12 Measurement apparatus 14 Measurement board 16 Measurement stage 18 Signal processing apparatus 20 Driver 22 Test head 24 Chuck top 26 Stage mechanism 28, 62, 70 Temperature adjustment member 30, 66 Temperature sensor 32 Video camera 34 Reinforcement member 36 Wiring board 38 Electrical connector 40 Probe board 42 Contactor 64 Reference mark

WO 2007/046153 WO 2008/114464 Japanese Patent Laid-Open No. 11-51972 JP 2008-298749 A

Claims (7)

A first step of attaching the probe substrate to the lower surface of the support with a fixture to obtain a card assembly;
A power is supplied to a temperature adjusting member provided on the support or the probe board to heat or cool the card assembly to a set temperature, and a second thermal deformation rate of the probe board at the set temperature is determined. And the process of
Based on the determined thermal deformation rate, a third step of determining the attachment position of the contact to the probe substrate;
A fourth step of attaching the contact to the lower surface of the probe substrate based on the determined attachment position, and obtaining a probe card;
The probe card is heated or cooled to the set temperature by supplying power to the heating element, and a probe tip position of the contact when the probe card is at the set temperature is measured. The process,
A sixth step of determining whether or not the measured needle tip position is within the reference range;
And a seventh step of determining a temperature when the probe card is used for a test of an object to be inspected based on a determination result in the sixth step.   The fourth step includes separating the probe substrate from the support before attaching the contact to the probe substrate, and supporting the probe substrate after attaching the contact to the probe substrate. The manufacturing method of Claim 1 including attaching to a body.   The attachment position is determined as a coordinate position of the contact with respect to the probe substrate when the probe substrate is placed at an attachment temperature different from the set temperature, and the contact is determined by the probe substrate at the attachment temperature. The manufacturing method according to claim 1, wherein the method is attached to the probe substrate when placed.   The manufacturing method according to claim 3, wherein the attachment temperature includes normal temperature.   In the seventh step, when the determination result in the sixth step is within the reference range, the set temperature is determined to be a temperature when the probe card is used for a test of an object to be inspected. The manufacturing method of any one of Claim 1 to 4 containing.   In the seventh step, when the determination result in the sixth step is not within the reference range, the temperature of the probe card is set to a new temperature different from the set temperature, and the contact at the new temperature is performed. Measure the needle tip position of the child, determine whether the needle tip position is within the reference range, and based on the result of the determination, determine the temperature when the probe card is used for testing the object to be inspected The manufacturing method of any one of Claim 1 to 5 including doing.   The thermal deformation rate is determined based on the measured thermal deformation amount by measuring the thermal deformation amount of the probe board at the set temperature at which the card assembly is heated or cooled. The production method according to item.

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