JP2010242152A - Vacuum apparatus and set of susceptor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vacuum apparatus which can isolate a transportation system for a substrate from a high-temperature environment and a dust environment, and can prevent troubles caused by these environments from occurring therein. <P>SOLUTION: The vacuum apparatus includes: a chamber 1 which has first and second projecting portions on its upper part and can be evacuated; a transportation section 8 for transporting first and second susceptors 11 and 21 which mount a plurality of substrates to be treated 10a-10c and 20a-20c respectively thereon and heat the substrates; a treating chamber 4 that is defined to be a closed space formed under the first projecting portion by any one of the first and second susceptors 11 and 21, which partitions a part directly under a region formed by the first projecting portion; and a load lock chamber 7 which is defined to be a closed space formed under the second projecting portion by the other one of the first and second susceptors 11 and 21, which partitions a part directly under a region formed by the second projecting portion. Thereby, the first and second susceptors 11 and 21 are alternately transported between the load lock chamber 7 and the treating chamber 4. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a vacuum apparatus, and more particularly to a vacuum apparatus having a heating unit (heater) and a susceptor set used when a substrate to be processed is carried into the vacuum apparatus.

  A vacuum apparatus such as a chemical vapor deposition (CVD) apparatus is used in a solar cell manufacturing process, a semiconductor manufacturing process, or the like. In the vacuum apparatus, the substrate to be processed is heated to perform a film forming process or the like (see, for example, Patent Documents 1 and 2).

  In a conventional vacuum apparatus, a load lock chamber and a processing chamber are arranged in-line, and a transfer system for transferring a substrate to be processed is installed inside the load lock chamber and the processing chamber.

  Since the load lock chamber and the processing chamber are provided with heaters for heating the substrate and the substrate, respectively, the load lock chamber and the processing chamber are in a high temperature environment. Further, the inside of the processing chamber is a dusty environment such as a powdery by-product or a film peeling piece by a film forming process.

  If the substrate transport system is installed in such an environment, there is a high possibility that troubles in transport driving will occur in a short period of time due to grease deterioration of the bearing, dust trapping, and the like.

JP-A-5-295551 JP 2001-239144 A

  An object of the present invention is to provide a vacuum device that can isolate a substrate transfer system from a high temperature environment and a dust environment and avoid troubles caused by these environments, and a susceptor used when a substrate to be processed is carried into the vacuum device. Is to provide a set.

  According to one aspect of the present invention, (b) a first chamber having first and second protrusions at the top and capable of being evacuated, and (b) a plurality of substrates to be processed are mounted and heated, respectively. And a transport unit that transports the second susceptor, and the first projecting part forms a closed space by partitioning one of the first and second susceptors directly below the region formed by the first projecting part. A processing chamber is defined in the chamber, and a closed space is formed by partitioning a region immediately below the region formed by the second convex portion by any of the other ones of the first and second susceptors. A load lock chamber is defined inside the chamber in the convex portion, and the first and second susceptors are alternately transferred from the load lock chamber side to the processing chamber side, and a plurality of substrates to be processed are processed in the processing chamber. Thereafter, the first and second susceptors are alternately conveyed from the processing chamber side to the load lock chamber side. Vacuum apparatus is provided.

  Another aspect of the present invention relates to a susceptor set including first and second susceptors used in a vacuum apparatus having first and second convex portions on the upper portion and having a chamber that can be evacuated. According to each of the 1st and 2nd susceptor which concerns on this other aspect, (a) The space closed by either the 1st and 2nd susceptor partitioning directly under the area | region which a 1st convex part makes | forms And the processing chamber is defined in the interior of the chamber on the first convex portion, and the area immediately below the region formed by the second convex portion is closed by partitioning one of the other of the first and second susceptors. A vacuum partition plate that defines a space and can define a load lock chamber inside the chamber on the second convex portion, and (b) a vacuum so that a peripheral portion of the vacuum partition plate is exposed as a vacuum seal portion. A substrate mounting unit having a smaller area than the partition plate and disposed above the vacuum partition plate and mounting a plurality of substrates to be processed; and (c) sandwiched between the substrate mounting unit and the vacuum partition plate, And a substrate placement unit for heating each of the substrates to be processed. Then, the first and second susceptors are alternately transferred from the load lock chamber side to the processing chamber side, and a plurality of substrates to be processed are processed in the processing chamber. After the processing, the processing chamber side moves to the load lock chamber side. The first and second susceptors are conveyed alternately.

  According to the present invention, a substrate transport system can be isolated from a high temperature environment and a dust environment, and a vacuum device capable of avoiding troubles caused by those environments, and a susceptor used when a substrate to be processed is carried into the vacuum device. Set can be offered.

It is a schematic sectional drawing which shows an example of the vacuum apparatus which concerns on embodiment of this invention. It is a schematic top view which shows an example of the 1st and 2nd susceptor and rotary body of the vacuum apparatus which concerns on embodiment of this invention. It is a flowchart for demonstrating an example of the operating method of the vacuum apparatus which concerns on embodiment of this invention. It is a schematic sectional drawing for demonstrating an example of the operating method of the vacuum apparatus which concerns on embodiment of this invention. FIG. 5 is a schematic cross-sectional view subsequent to FIG. 4 for explaining an example of the operation method of the vacuum apparatus according to the embodiment of the present invention. It is a schematic sectional drawing following FIG. 5 for demonstrating an example of the operating method of the vacuum apparatus which concerns on embodiment of this invention. FIG. 7 is a schematic cross-sectional view subsequent to FIG. 6 for explaining an example of the operation method of the vacuum apparatus according to the embodiment of the present invention. It is a schematic sectional drawing following FIG. 7 for demonstrating an example of the operating method of the vacuum apparatus which concerns on embodiment of this invention. It is a schematic sectional drawing following FIG. 8 for demonstrating an example of the operating method of the vacuum apparatus which concerns on embodiment of this invention. It is a schematic sectional drawing following 94 for demonstrating an example of the operating method of the vacuum apparatus which concerns on embodiment of this invention. It is a schematic sectional drawing following FIG. 10 for demonstrating an example of the operating method of the vacuum apparatus which concerns on embodiment of this invention. It is a schematic sectional drawing following FIG. 11 for demonstrating an example of the operating method of the vacuum apparatus which concerns on embodiment of this invention. It is a schematic sectional drawing following FIG. 12 for demonstrating an example of the operating method of the vacuum apparatus which concerns on embodiment of this invention. It is a schematic sectional drawing following FIG. 13 for demonstrating an example of the operating method of the vacuum apparatus which concerns on embodiment of this invention. It is a schematic sectional drawing following FIG. 14 for demonstrating an example of the operating method of the vacuum apparatus which concerns on embodiment of this invention. FIG. 16 is a schematic cross-sectional view subsequent to FIG. 15 for describing an example of the operation method of the vacuum apparatus according to the embodiment of the present invention.

  Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the relationship between the thickness and the planar dimensions, the ratio of the thickness of each layer, and the like are different from the actual ones. Therefore, specific thicknesses and dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

  Further, the embodiments described below exemplify apparatuses and methods for embodying the technical idea of the present invention, and the technical idea of the present invention includes the material, shape, structure, The layout is not specified as follows. The technical idea of the present invention can be variously modified within the scope of the claims.

(Vacuum device)
As shown in FIG. 1, the vacuum apparatus according to the embodiment of the present invention includes a chamber 1 having first and second convex portions on the upper portion, which can be evacuated, and a plurality of substrates to be processed 10a, 10b, And 10c, 20a, 20b, and 20c, respectively, and a transport unit 8 that transports first and second susceptors (set of susceptors) 11 and 21 for heating. In the vacuum apparatus according to the embodiment of the present invention, a closed space is formed by partitioning one of the first and second susceptors 11 and 21 directly below the region formed by the first protrusion, A processing chamber 4 is defined inside the chamber 1 at the convex portion. Further, a space that is closed by partitioning one of the other portions of the first and second susceptors 11 and 21 directly below the region formed by the second convex portion is formed, and the load lock chamber 7 is formed on the second convex portion. Is defined inside the chamber 1. Note that the “first convex portion” and the “second convex portion” are merely problems of definition, and in FIG. 1, for the sake of convenience, the upper left region of the chamber 30 is referred to as the “first convex portion” and the chamber. 30 is defined as a “second convex portion”, but conversely, the right side of FIG. 1 is a “first convex portion” and the left side of FIG. 1 is a “second convex portion”. Further, the sealed region formed by the first convex portion may be defined as the load lock chamber 7, and the sealed region formed by the second convex portion may be defined as the processing chamber 4.

  Then, the first and second susceptors 11 and 21 are alternately transferred from the load lock chamber 7 side to the processing chamber 4 side, and a plurality of substrates 10a, 10b, 10c, 20a, 20b, and 20c are processed in the processing chamber 4. After the processing, the first and second susceptors 11 and 21 are alternately conveyed from the processing chamber 4 side to the load lock chamber 7 side.

As the vacuum apparatus according to the embodiment of the present invention, for example, a silicon oxide film (SiO ₂ film), a phosphorus glass (PSG) film, a boron glass (BSG) film, a boron phosphorous glass (BPSG) film, a silicon nitride film ( A chemical vapor deposition (CVD) apparatus for forming a Si ₃ N ₄ film) or a polysilicon film or the like can be employed.

  As the substrates to be processed 10a, 10b, 10c, 20a, 20b, 20c, a semiconductor substrate such as silicon (Si) can be used in the case of manufacturing a semiconductor device, a solar cell or the like. Further, when manufacturing a liquid crystal display device, a glass substrate or the like is used as a substrate to be processed 10a, 10b, 10c, 20a, 20b, or 20c, when manufacturing an optical recording medium, such as a resin substrate such as polycarbonate. Also good. Of course, various thin films can be formed on these glass substrates and resin substrates as the process proceeds.

  An electrode 5 for plasma discharge is disposed in the processing chamber 4. In the example of the above-described CVD apparatus, the vacuum apparatus according to the embodiment of the present invention supplies the processing chamber 4 with various gases such as a film forming gas and a purge gas, although not shown. A member necessary for a film forming process such as a gas supply unit for detecting the temperature, a temperature sensor for detecting the temperature of the processing chamber 4, and a vacuum pump for evacuating the processing chamber 4 are provided. If the vacuum apparatus according to the embodiment of the present invention is a molecular beam epitaxial (MBE) apparatus, the Knudsen cell is used. If it is a sputtering apparatus, the discharge electrode is used. If it is a vacuum deposition apparatus, the electron beam (EB) apparatus is used. Is provided.

  The load lock chamber 7 includes a mechanism for taking in and out the substrates 10a, 10b, 10c, 20a, 20b, and 20c so as not to open the chamber 1 to the atmosphere. The load lock chamber 7 includes an openable / closable lid 6 connected to the chamber 1 through an O-ring 61. The load lock chamber 7 is provided with a vacuum pump that evacuates the load lock chamber 7 although not shown.

  The first susceptor 11 includes a first vacuum partition plate 12 capable of partitioning a region immediately below the region formed by the first and second protrusions, and a first vacuum partition plate 12 disposed on the first vacuum partition plate 12. A heating unit (heater) 13 and a first substrate mounting unit 14 disposed on the first heating unit 13 and mounting a plurality of substrates to be processed 10a, 10b, 10c, respectively, are provided. The second susceptor 21 includes a second vacuum partition plate 22 capable of partitioning directly under the region formed by the first and second protrusions, and a second vacuum partition plate 22 disposed on the second vacuum partition plate 22. A heating unit (heater) 23 and a second substrate mounting unit 24 disposed on the second heating unit 23 and each mounting a plurality of substrates to be processed 20a, 20b, 20c are provided. As the first and second heating units 13 and 23, a plate heater, a lamp heater, or the like can be used. The first and second heating units 13 and 23 hold the first and second susceptors 11 and 21 at a set temperature (film formation process temperature), respectively. The 1st and 2nd heating parts 13 and 23 are connected to the power supply via the inside of the rotating shaft 2, for example. A flat upper surface of the peripheral portion of the first vacuum partition plate 12 is exposed as a vacuum seal portion, and is connected to a lower portion of the load lock chamber 7 through an O-ring 62 so that the load lock chamber 7 is sealed. The flat upper surface is exposed so that the peripheral portion of the second vacuum partition plate 22 also functions as a vacuum seal portion, and the peripheral portion of the second vacuum partition plate 22 is connected to the lower portion of the processing chamber 4 via the O-ring 41. Then, the processing chamber 4 is sealed.

  As shown in FIGS. 1 and 2, the first substrate placement unit 14 places the substrates to be processed 10a, 10b, 10c, 10d, 10e, 10f, 10g, 10h, and 10i. The second substrate placement unit 24 places the substrates to be processed 20a, 20b, 20c, 20d, 20e, 20f, 20g, 20h, and 20i. Each of the 1st and 2nd board | substrate mounting parts 14 and 24 is a soaking plate which consists of carbon, for example. In FIG. 2, for convenience, nine substrates to be processed 10a, 10b, 10c, 10d, 10e, 10f, 10g, 10h, and 10i are placed on the first substrate placing portion 14, and the second substrate placing portion. 24 shows a case where nine substrates to be processed 20a, 20b, 20c, 20d, 20e, 20f, 20g, 20h, and 20i are placed, but the first and second substrate placement portions 14 and 24 are shown. The surface size of the substrate, the size and number of substrates to be processed placed on the first and second substrate placement portions 14 and 24 are not particularly limited, but the peripheral portion of the first vacuum partition plate 12 and the second vacuum The first and second substrate mounting portions 14 and 24 have a smaller occupied area than the vacuum partition plates 12 and 22 so that the peripheral portion of the partition plate 22 is exposed as a vacuum seal portion. Is disposed above.

  1 includes first and second susceptor support portions 15 and 25 for supporting the first and second susceptors 11 and 21, and first and second susceptor support portions 15 and 25, respectively. Are mounted on the first and second susceptors 11 and 21, respectively, and the first and second susceptors 11 and 21 are mounted on the first and second susceptors 11 and 21, respectively. The second susceptors 11 and 21 rotate the rotating body 3 and the rotating body that rotate so as to be alternately positioned directly below the area formed by the first protrusion and directly below the area formed by the second protrusion. A rotating shaft 2 is provided. The rotating body 3 is provided with an opening having a size through which the first and second susceptor support portions 15 and 25 penetrate. When the rotating body 3 is rotated, the first and second susceptors 11 and 21 are placed on the upper surface of the rotating body 3. And the 1st and 2nd susceptor support parts 15 and 25 isolate | separate from the 1st and 2nd susceptors 11 and 21, and the 1st and 2nd heating parts 13 and 23, the 1st and 2nd susceptor support parts 15 and 25 are retracted below the rotating body 3.

  The first elevating unit 16 is configured to place one of the first and second susceptors 11 and 21 between the rotating body 3 and the lower portion of the load lock chamber 7 via the first susceptor support unit 15. Move up and down. The second elevating unit 26 elevates or lowers one of the first and second susceptors 11 and 21 from the rotating body 3 to the lower part of the processing chamber 4 via the second susceptor support unit 25. Let The 1st and 2nd raising / lowering parts 16 and 26 may raise / lower the 1st and 2nd susceptors 11 and 21 simultaneously, and can also raise / lower separately.

  A vacuum introduction joint (vacuum pump) 9 is attached to the rotary shaft 2. The inside of the chamber 1 is maintained in a vacuum by the vacuum pump 9. In the embodiment of the present invention, the inside of the processing chamber 4 and the chamber 1 may be individually evacuated by a vacuum pump (not shown) of the processing chamber 4 and the vacuum pump 9 of the chamber 1. Further, the processing chamber 4 and the chamber 1 may be collectively evacuated by the vacuum pump 9. Further, the vacuum pump 9 may be omitted, and the processing chamber 4 and the chamber 1 may be collectively evacuated by a vacuum pump that does not illustrate the processing chamber 4.

(Operation method of vacuum equipment)
Next, an operation method of the vacuum apparatus according to the embodiment of the present invention will be described with reference to the flowchart of FIG.

  (A) In step S11, as shown in FIG. 4, the 1st raising / lowering part 16 is driven and the 1st susceptor 11 is raised. The first vacuum partition plate 12 is connected to the lower portion of the load lock chamber 7 via the O-ring 62, and the load lock chamber 7 is sealed. After returning the inside of the load lock chamber 7 to atmospheric pressure, as shown in FIG. 5, the lid 6 of the load lock chamber 7 is opened, and the first substrate platform 14 is covered with a transfer machine (not shown). The processing substrates 10a, 10b, and 10c are placed. Thereafter, the lid 6 is closed, and the inside of the load lock chamber 7 is evacuated. The first heating unit 13 is always turned on, and the substrates to be processed 10a, 10b, and 10c are heated by the first heating unit 13 via the first substrate mounting unit 14 and set temperature (film forming process temperature). The temperature is instantaneously increased.

  (B) In step S12, when the pressure in the load lock chamber 7 reaches a predetermined pressure, the first elevating unit 16 is driven to lower the first susceptor 11 as shown in FIG. Is introduced into the chamber 1 evacuated in advance. After the first susceptor 11 is lowered onto the rotator 3, as shown in FIG. 7, the rotator 3 is rotated so that the first and second susceptors 11 and 21 are directly below the processing chamber 4 and the load lock chamber 7. The first and second susceptors 11 and 21 are horizontally moved so as to be positioned respectively. Thereafter, as shown in FIG. 8, the first and second elevating parts 16 and 26 are driven to raise the first and second susceptors 11 and 21 simultaneously, respectively. As a result, the peripheral portion of the second vacuum partition plate 22 functioning as a vacuum seal portion is connected to the lower portion of the processing chamber 4 via the O-ring 41, and the processing chamber 4 is sealed. Further, the peripheral portion of the first vacuum partition plate 12 functioning as a vacuum seal portion is connected to the lower portion of the load lock chamber 7 via the O-ring 62, and the load lock chamber 7 is sealed.

  (C) In step S13, a film forming process is performed on the substrates to be processed 10a, 10b, and 10c in the processing chamber 4. The processing chamber 4 is evacuated to a predetermined pressure in advance. Since the substrates 10a, 10b, and 10c to be processed have been heated to a preset temperature (film formation process temperature) in advance, the processing can be started immediately. During the film forming process, the temperature of the substrates 10a, 10b, and 10c to be processed is maintained at a set temperature (film forming process temperature) by the first heating unit 13. On the other hand, on the load lock chamber 7 side, after the load lock chamber 7 is returned to atmospheric pressure in step S14, the lid 6 of the load lock chamber 7 is opened as shown in FIG. Are used to place the substrates to be processed 20a, 20b, 20c on the second substrate placement unit 24. Thereafter, the lid 6 is closed, and the inside of the load lock chamber 7 is evacuated. At this time, the second heating unit 23 is always turned on, and the substrates to be processed 20a, 20b, and 20c are heated by the second heating unit 23 via the second substrate mounting unit 24, and set temperature (film formation). The temperature is instantaneously increased to the process temperature.

  (D) In step S15, when the pressure in the load lock chamber 7 reaches a predetermined pressure, the first elevating unit 16 is driven to lower the second susceptor 21 as shown in FIG. Is introduced into the chamber 1 evacuated in advance. On the other hand, on the processing chamber 4 side, after the film formation process is completed, the second elevating unit 26 is driven to lower the first susceptor 11 and the first susceptor 11 is introduced into the chamber 1 evacuated in advance. To do. After the first and second susceptors 11 and 21 are respectively lowered onto the rotating body 3, the rotating body 3 is rotated as shown in FIG. 11, and the first and second susceptors 11 and 21 are connected to the load lock chamber 7 and The first and second susceptors 11 and 21 are horizontally moved so as to be positioned immediately below the processing chamber 4. Then, as shown in FIG. 12, the 1st and 2nd raising / lowering parts 16 and 26 are driven, and the 1st and 2nd susceptors 11 and 21 are raised, respectively. The second vacuum partition plate 22 is connected to the lower part of the processing chamber 4 via the O-ring 41, and the processing chamber 4 is sealed. Further, the first vacuum partition plate 12 is connected to the lower portion of the load lock chamber 7 via the O-ring 62, and the load lock chamber 7 is sealed.

  (E) In step S16, a film forming process is performed on the substrates 20a, 20b, and 20c in the processing chamber 4. The processing chamber 4 is evacuated to a predetermined pressure in advance. Since the substrates 20a, 20b, and 20c to be processed have been heated to a preset temperature (film formation process temperature) in advance, the processing can be started immediately. During the film formation process, the temperature of the substrates 20a, 20b, and 20c to be processed is maintained at the set temperature (film formation process temperature) by the second heating unit 23. On the other hand, on the load lock chamber 7 side, after the inside of the load lock chamber 7 is returned to the atmospheric pressure in step S17, the lid 6 of the load lock chamber 7 is opened, and a substrate to be processed is used using a transfer machine (not shown). 10a, 10b, and 10c are collected. In step S18, if there is an unprocessed substrate to be processed, in step S19, an unprocessed substrate 30a that is not processed in the first substrate platform 14 as shown in FIG. , 30b, 30c are placed.

  (F) In step S20, when the inside of the load lock chamber 7 reaches a predetermined pressure, the first elevating unit 16 is driven to lower the first susceptor 11 as shown in FIG. Is introduced into the chamber 1 evacuated in advance. On the other hand, on the processing chamber 4 side, after the film formation process is completed, the second elevating unit 26 is driven to lower the second susceptor 21 and the second susceptor 21 is introduced into the chamber 1 that has been evacuated in advance. To do. After the first and second susceptors 11 and 21 are respectively lowered onto the rotating body 3, the rotating body 3 is rotated as shown in FIG. 15, and the first and second susceptors 11 and 21 are moved to the processing chamber 4 and the load. The first and second susceptors 11 and 21 are horizontally moved so as to be positioned directly below the lock chamber 7, respectively. Thereafter, as shown in FIG. 16, the first and second elevating parts 16 and 26 are driven to raise the first and second susceptors 11 and 21, respectively. The first vacuum partition plate 12 is connected to the lower part of the processing chamber 4 via the O-ring 41, and the processing chamber 4 is sealed. Further, the second vacuum partition plate 22 is connected to the lower portion of the load lock chamber 7 via the O-ring 62, and the load lock chamber 7 is sealed.

  (G) On the processing chamber 4 side, the process returns to step S13, and after the inside of the processing chamber 4 is evacuated to a predetermined pressure, the substrates 30a, 30b, 30c to be processed are held at a predetermined temperature by the heating unit, and the film forming process is performed. Done. On the other hand, on the load lock chamber 7 side, after the inside of the load lock chamber 7 is returned to atmospheric pressure in step S21, the lid 6 of the load lock chamber 7 is opened, and a substrate to be processed is used using a transfer machine (not shown). 20a, 20b, and 20c are collected. If there is an unprocessed substrate to be processed in step S22, the process returns to step S14, and an unprocessed substrate is placed on the first substrate platform 14 using the transfer machine. In this way, the film forming process in the processing chamber 4 is sequentially repeated to perform the film forming process for a predetermined number of lots.

  As described above, according to the embodiment of the present invention, the transport unit 8 is isolated from the first and second heating units 13 and 23 that form a high temperature environment and the processing chamber 4 that is a dust environment. Compared with the case where the load lock chamber and the processing chamber are arranged in-line, the frequency of the grease deterioration of the conveying system bearing and the dust trapping can be reduced. Therefore, troubles in transport driving can be avoided, and the life of the transport system can be extended.

  Further, since the first and second susceptors 11 and 21 have the first and second heating units, the substrate 10a to be processed placed on the first and second substrate placement units 14 and 24, 10b, 10c, 20a, 20b, 20c, 30a, 30b, and 30c can be heated instantaneously. Therefore, the tact time can be shortened and the production amount can be increased.

(Other embodiments)
As described above, the present invention has been described according to the embodiment. However, it should not be understood that the description and drawings constituting a part of this disclosure limit the present invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art. The vacuum apparatus according to the embodiment of the present invention reflows, for example, a thermal oxidation apparatus that forms a SiO ₂ film, an ion implantation apparatus, an impurity diffusion apparatus, a PSG film, a BSG film, and a BPSG film in addition to a CVD apparatus. The present invention can be applied to a thermal vacuum apparatus for melting (melting), a thermal vacuum apparatus for densifying a CVD oxide film, a thermal vacuum apparatus for forming a silicide film, and a sputtering apparatus for depositing a metal wiring layer. As described above, the present invention naturally includes various embodiments not described herein. Therefore, the technical scope of the present invention is defined only by the invention specifying matters according to the scope of claims reasonable from the above description.

DESCRIPTION OF SYMBOLS 1 ... Chamber 2 ... Rotating shaft 3 ... Rotating body 4 ... Processing chamber 5 ... Electrode 6 ... Cover 7 ... Load lock chamber 8 ... Transfer part 9 ... Vacuum pump 10a, 10b, 10c, 10d, 10e, 10f, 10g, 10h, 10i, 20a, 20b, 20c, 20d, 20e, 20f, 20g, 20h, 20i, 30a, 30b, 30c ... Substrate 11 ... First susceptor 12 ... First vacuum partition plate 13 ... First heating section DESCRIPTION OF SYMBOLS 14 ... 1st board | substrate mounting part 15 ... 1st susceptor support part 16 ... 1st raising / lowering part 21 ... 2nd susceptor 22 ... 2nd vacuum partition plate 23 ... 2nd heating part 24 ... 2nd Substrate placing part 25 ... second susceptor support part 26 ... second lifting part 41, 61, 62 ... O-ring

Claims (5)

A chamber having first and second protrusions at the top and capable of being evacuated;
A transport unit that transports the first and second susceptors that place and heat the plurality of substrates to be processed, respectively;
Inside the chamber, a space closed by either one of the first and second susceptors is formed immediately below a region formed by the first convex portion, and a processing chamber is formed in the first convex portion. Define
Inside the chamber, a space that is closed by partitioning one of the other of the first and second susceptors directly below the region formed by the second protrusion is formed on the second protrusion. Define a load lock room,
The first and second susceptors are alternately transported from the load lock chamber side to the processing chamber side, the plurality of substrates to be processed are processed in the processing chamber, and after the processing, the load is transferred from the processing chamber side. A vacuum apparatus characterized in that the first and second susceptors are alternately conveyed to the lock chamber side. The transport unit is
First and second elevating parts for supporting the first and second susceptors and raising and lowering the first and second susceptors, respectively;
The first and second susceptors are provided with rotating bodies that rotate so as to be alternately positioned immediately below a region formed by the first convex portion and immediately below a region formed by the second convex portion. The vacuum apparatus according to claim 1.   The vacuum apparatus according to claim 2, wherein the first and second elevating parts elevate and lower the first and second susceptors simultaneously. The first and second susceptors are lifted, and either the first or second susceptor partitions the region immediately below the region formed by the first protrusions;
The vacuum apparatus according to any one of claims 1 to 3, wherein any one of the first and second susceptors partitions a region directly below the second convex portion. A set of susceptors including first and second susceptors for use in a vacuum apparatus having first and second convex portions on top and having a chamber capable of being evacuated,
Each of the first and second susceptors is
Inside the chamber, a space closed by either one of the first and second susceptors is formed immediately below a region formed by the first convex portion, and a processing chamber is formed in the first convex portion. A space that is defined by partitioning a region immediately below the region formed by the second convex portion by one of the other of the first and second susceptors, and a load-lock chamber formed in the second convex portion. A vacuum partition plate that can be defined, and
Substrate mounting that is arranged above the vacuum partition plate and has a plurality of substrates to be processed, each having a smaller dedicated area than the vacuum partition plate so that the peripheral portion of the vacuum partition plate is exposed as a vacuum seal portion And
A substrate platform that is sandwiched between the substrate platform and the vacuum partition plate and that heats the plurality of substrates to be processed, respectively, and the first and second susceptors are connected to the process from the load lock chamber side. The plurality of substrates to be processed are processed alternately in the processing chamber, and after the processing, the first and second susceptors are alternately transferred from the processing chamber side to the load lock chamber side. A set of susceptors characterized by

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