JP2010241679A5 - - Google Patents

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JP2010241679A5
JP2010241679A5 JP2010085265A JP2010085265A JP2010241679A5 JP 2010241679 A5 JP2010241679 A5 JP 2010241679A5 JP 2010085265 A JP2010085265 A JP 2010085265A JP 2010085265 A JP2010085265 A JP 2010085265A JP 2010241679 A5 JP2010241679 A5 JP 2010241679A5
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aln
growth
crystal
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JP5543255B2 (en
JP2010241679A (en
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Priority claimed from DE200910016133 external-priority patent/DE102009016133B4/en
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Claims (14)

AlN塊状単結晶(2)を製造するための方法であって、
a)中央中心長手軸線(18)を有する単結晶AlN種結晶(15)が坩堝装置(3)の結晶成長領域(4)内に配置され、
b)成長段階の間に前記結晶成長領域(4)内にAlN成長気相(16)が生成され、前記成長気相は前記坩堝装置(3)の貯蔵領域(5)内にあるAlN原材料(14、21)から少なくとも一部を供給され、前記AlN塊状単結晶(2)は前記AlN成長気相(16)から前記AlN種結晶(15)上に析出させることにより前記中心長手軸線(18)と平行に向いた成長方向(17)に成長し、
c)浄化段階の間に前記AlN原材料(14、21)の少なくとも酸素割合が減らされ、
d)前記坩堝装置(3)が析出室(8)を含み、前記析出室内で前記浄化段階の間に前記AlN原材料(14、21)から蒸発した酸素含有成分が析出され、
e)前記AlN原材料(14、21)は前記浄化段階の終了後、前記成長段階全体の間無酸素雰囲気内で保持される方法。
A method for producing an AlN massive single crystal (2), comprising:
a) a single crystal AlN seed crystal (15) having a central central longitudinal axis (18) is placed in the crystal growth region (4) of the crucible device (3);
b) During the growth phase, an AlN growth gas phase (16) is produced in the crystal growth region (4), which is the AlN raw material (in the storage region (5) of the crucible device (3)). 14, 21), and the AlN bulk single crystal (2) is precipitated on the AlN seed crystal (15) from the AlN growth gas phase (16), thereby the central longitudinal axis (18). Grows in a growth direction (17) oriented parallel to the
c) at least the oxygen proportion of the AlN raw material (14, 21) is reduced during the purification phase;
d) the crucible device (3) includes a precipitation chamber (8), in which oxygen-containing components evaporated from the AlN raw materials (14, 21) during the purification stage are deposited;
e) A method in which the AlN raw materials (14, 21) are kept in an oxygen-free atmosphere during the entire growth phase after the purification phase is completed.
前記浄化段階の間に前記AlN原材料(14、21)から酸素含有成分の非調和蒸発が引き起こされる請求項1記載の方法。   The method according to claim 1, wherein anharmonic evaporation of oxygen-containing components from the AlN raw material (14, 21) is caused during the purification step. 前記浄化段階の終了後、前記析出室(8)と前記結晶成長領域(4)との間での気体交換を阻止するために、前記析出室(8)が前記貯蔵領域(5)および前記結晶成長領域(4)から機械的に分離される請求項1又は2記載の方法。   After the purification step is completed, the precipitation chamber (8) has the storage region (5) and the crystal to prevent gas exchange between the precipitation chamber (8) and the crystal growth region (4). The method according to claim 1 or 2, wherein the method is mechanically separated from the growth region (4). 前記中心長手軸線(18)の方向に見て前記貯蔵領域(5)が前記結晶成長領域(4)と前記析出室(8)との間に配置される請求項1ないし3の1つに記載の方法。   The storage region (5) as viewed in the direction of the central longitudinal axis (18) is arranged between the crystal growth region (4) and the precipitation chamber (8). the method of. 前記浄化段階の間にも前記析出室(8)内で析出温度(T3)が調整され、前記析出温度は前記貯蔵領域(5)内で調整された貯蔵温度(T2)よりも低い請求項1ないし4の1つに記載の方法。 Wherein the deposition chamber even during purification stage (8) in a precipitation temperature (T 3) is adjusted, the precipitation temperature is not lower than the storage area (5) within the adjusted storage temperature (T 2) A method according to one of claims 1 to 4. 前記浄化段階の間に前記AlN種結晶(15)における結晶温度(T1)が調整され、前記結晶温度は前記貯蔵領域(5)内で調整された貯蔵温度(T2)と少なくとも同じである請求項1ないし5の1つに記載の方法。 During the purification step, the crystal temperature (T 1 ) in the AlN seed crystal (15) is adjusted, and the crystal temperature is at least the same as the storage temperature (T 2 ) adjusted in the storage region (5). The method according to one of claims 1 to 5. 前記成長段階の間、成長する前記AlN塊状単結晶(2)の成長界面で結晶温度(T1)が調整され、前記結晶温度は前記貯蔵領域(5)内で調整された貯蔵温度(T2)より低い請求項1ないし6の1つに記載の方法。 During the growth phase, the crystal temperature (T 1 ) is adjusted at the growth interface of the growing AlN bulk single crystal (2), and the crystal temperature is adjusted to the storage temperature (T 2 ) adjusted in the storage region (5). the method according to to one of 6) low had claims 1 Ri good. 前記坩堝装置(3)に付加的プロセスガスが供給され、前記浄化段階の間、前記プロセスガスのプロセスガス分圧は前記成長段階の間よりも低く調整される請求項1ないし7の1つに記載の方法。 Said additional Purosesuga scan the crucible device (3) is supplied during the cleaning step, the process gas partial pressure of the process gas one of claims 1 to 7 is adjusted to be lower than during the growth phase The method described. 前記坩堝装置(3)に付加的プロセスガスが供給され、前記浄化段階の間、前記プロセスガスのプロセスガス分圧は2×102〜105Paの範囲内の値に調整される請求項1ないし8の1つに記載の方法。 Wherein is supplied additionally Purosesuga scan the crucible device (3), during the purification step, the claim process gas partial pressure of the process gas is adjusted to a value in the range of 2 × 10 2 ~10 5 Pa 1 9. The method according to one of items 8 to 8. 前記成長段階は前記浄化段階に直接続いて実行される請求項1ないし9の1つに記載の方法。   The method according to one of the preceding claims, wherein the growth stage is carried out directly following the purification stage. 前記貯蔵領域(5)は前記坩堝装置(3)の内部坩堝挿入体(6)として形成されており、後に前記成長段階用に必要となる前記AlN原材料(14、21)は前記浄化段階の開始前に前記内部坩堝挿入体(6)内に完全に導入される請求項1ないし10の1つに記載の方法。 The storage area (5) is formed as an internal crucible insert (6) of the crucible device (3), and the AlN raw material (14, 21) required for the growth stage later is the start of the purification stage. The method according to one of claims 1 to 10 , wherein the method is completely introduced into the inner crucible insert (6) before. 酸素濃度が最高5×1016cm-3である円盤状の単結晶AlN基板。 A disc-shaped single crystal AlN substrate having an oxygen concentration of 5 × 10 16 cm −3 at maximum. 前記酸素濃度が最高1×1015cm-3である請求項12記載のAlN基板。 The AlN substrate according to claim 12, wherein the oxygen concentration is 1 × 10 15 cm −3 at maximum. 前記AlN基板が基板主表面を有し、前記基板主表面は直径が少なくとも75mmである請求項12又は13記載のAlN基板。
The AlN substrate according to claim 12 or 13, wherein the AlN substrate has a substrate main surface, and the substrate main surface has a diameter of at least 75 mm .
JP2010085265A 2009-04-03 2010-04-01 Method for producing aluminum nitride massive single crystal Expired - Fee Related JP5543255B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009016133.3 2009-04-03
DE200910016133 DE102009016133B4 (en) 2009-04-03 2009-04-03 Production method for an oxygen-poor AlN bulk single crystal

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JP2010241679A JP2010241679A (en) 2010-10-28
JP2010241679A5 true JP2010241679A5 (en) 2013-05-02
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AT516081B1 (en) * 2014-07-16 2018-02-15 Lkr Leichtmetallkompetenzzentrum Ranshofen Gmbh Method and device for cleaning a porous material
DE102014017021B4 (en) 2014-11-19 2021-02-11 Forschungsverbund Berlin E.V. Seed holder of a single crystal growing device and single crystal growing device
CN107829134B (en) * 2017-11-22 2020-06-26 北京大学 Aluminum nitride single crystal growth device and method without seed crystal bonding technology

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JP2004284870A (en) * 2003-03-20 2004-10-14 Univ Waseda Method for manufacturing nitride single crystal and manufacturing apparatus therefor
DE10335538A1 (en) * 2003-07-31 2005-02-24 Sicrystal Ag Process and apparatus for AIN single crystal production with gas permeable crucible wall
JP4991116B2 (en) * 2004-02-13 2012-08-01 フライベルゲル・コンパウンド・マテリアルズ・ゲーエムベーハー Method for producing crack-free group III nitride semiconductor material
JP2005343704A (en) * 2004-05-31 2005-12-15 Sumitomo Electric Ind Ltd METHOD FOR PRODUCING AlxGayIn1-x-yN CRYSTAL
JP4736365B2 (en) * 2004-07-21 2011-07-27 学校法人早稲田大学 Method for producing aluminum nitride single crystal
JP5310669B2 (en) * 2005-04-13 2013-10-09 住友電気工業株式会社 Method for growing AlN single crystal
EP2110366A4 (en) * 2007-02-02 2012-05-30 Tokuyama Corp Aluminum nitride sinter and process for producing the same
JP4992703B2 (en) * 2007-12-25 2012-08-08 住友電気工業株式会社 Group III nitride semiconductor crystal growth method

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