JP2010238984A - Exposure apparatus, method for adjusting pressure for exposure apparatus and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure apparatus capable of suppressing a variation in pressure. <P>SOLUTION: The exposure apparatus includes a moving body movable along at least one direction on a predetermined plane, and a pressure adjusting device for jetting pressurized air so that the variation in pressure caused by the movement of the moving body may be reduced. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an exposure apparatus, a pressure adjustment method for the exposure apparatus, and a device manufacturing method.

  In the manufacturing process of microdevices such as semiconductor devices and electronic devices, an exposure apparatus that exposes a substrate with exposure light as disclosed in the following patent document is used. The exposure apparatus includes a moving body (for example, a substrate stage that holds a substrate) that moves in a space in which an environment (including at least one of temperature, humidity, pressure, and cleanness) is controlled.

US Pat. No. 6,452,292 US Pat. No. 6,762,820

In order to set the space in a predetermined environment, the space is appropriately sealed (it is not necessarily required to be completely sealed and may be a level that allows the predetermined environment to be maintained). The pressure in the space fluctuates before and after the moving (moving) direction of the moving body (the gas in the space is compressed on the pre-traveling side and the pressure increases, and on the traveling side, the pressure expands and the pressure decreases on the contrary). There is a possibility that.
On the other hand, for measuring the position of the stage, for example, a device that allows measurement light to pass through space, such as a laser interferometer, is used. However, for example, when the optical path through which the measurement light passes is subjected to the pressure fluctuation, the measurement value of the interferometer also fluctuates and the measurement accuracy of the moving body (for example, the substrate stage) changes. Therefore, for example, there is a possibility that an exposure failure occurs or a defective device occurs.

  An object of an aspect of the present invention is to provide an exposure apparatus capable of suppressing pressure fluctuation and a pressure adjustment method for the exposure apparatus. Moreover, the aspect of this invention aims at providing the device manufacturing method which can suppress generation | occurrence | production of a defective device.

  According to the first aspect of the present invention, a movable body that is movable along at least one direction on a predetermined surface, and a pressure that injects pressurized air so as to reduce pressure fluctuation caused by the movement of the movable body. An exposure apparatus comprising an adjustment device is provided.

  According to the second aspect of the present invention, in the pressure adjustment method for an exposure apparatus having a moving body that can move in one direction on a predetermined surface, a predetermined space in which pressure fluctuation has occurred due to the movement of the moving body. Thus, there is provided a pressure adjusting method for an exposure apparatus that reduces the pressure fluctuation by injecting pressurized air.

  According to a third aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the first and second aspects, and developing the exposed substrate. .

  According to the present invention, pressure fluctuation can be suppressed. Further, according to the present invention, it is possible to suppress the occurrence of exposure failure and suppress the occurrence of defective devices.

It is a figure which shows schematic structure of exposure apparatus. It is a top view which shows a part of exposure apparatus. It is a top view which shows an example of the board | substrate hold | maintained at the substrate stage. It is a schematic diagram for demonstrating an example of the drive state of a pressure regulator. It is a figure which shows schematic structure of the exposure apparatus which concerns on a modification. It is a figure which shows schematic structure of the exposure apparatus which concerns on a modification. It is a flowchart for demonstrating an example of the manufacturing process of a microdevice.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. In addition, the rotation (inclination) directions around the X, Y, and Z axes are the θX, θY, and θZ directions, respectively.

  FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX according to an embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. In the present embodiment, water (pure water) is used as the liquid LQ.

  In FIG. 1, an exposure apparatus EX measures a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and exposure light EL without holding the substrate P. A measurement stage 3 that is movable with the measuring instrument C mounted thereon, a drive system 30 for moving the mask stage 1, a drive system 20 for moving the substrate stage 2 and the measurement stage 3, a mask stage 1, An interferometer system 4 that optically measures the positions of the substrate stage 2 and the measurement stage 3, an illumination system IL that illuminates the mask M with the exposure light EL, and an image of the pattern of the mask M illuminated with the exposure light EL. A projection optical system PL that projects onto the substrate P, an immersion member 5 that can form an immersion space so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ, and a space in which the exposure light EL travels. A chamber device 6 to be formed, a transport device 40 capable of transporting the substrate P, a control device 7 that controls the operation of the entire exposure apparatus EX, and a storage device 7M that is connected to the control device 7 and stores various types of information related to exposure. It has.

  Further, the exposure apparatus EX includes a body 8 including, for example, a first column 9 provided on a support surface FL in a clean room and a second column 10 provided on the first column 9. In the present embodiment, a mask stage 1, a substrate stage 2, a measurement stage 3, an illumination system IL, a projection optical system PL, a body 8, and the like are arranged in a space formed by the chamber device 6.

  The first column 9 includes a first support member 14 and a first surface plate 16 supported by the first support member 14 via a vibration isolator 15. The second column 10 includes a second support member 17 disposed on the first surface plate 16 and a second surface plate 19 supported on the second support member 17 via a vibration isolator 18.

The first column 9 forms a first space 11. In the present embodiment, the first column 9 forms a first space 11 with the support surface FL. The first space 11 is substantially closed.
The first space 11 may be defined by the first column 9 and the third surface plate 27 (described later).

  The second column 10 forms a second space 12. In the present embodiment, the second column 10 forms a second space 12 with the first surface plate 16. The second space 12 is substantially closed.

  The chamber device 6 forms a third space 13. In the present embodiment, the chamber device 6 forms a third space 13 with the second surface plate 19. The third space 13 is substantially closed.

  In the present embodiment, the exposure apparatus EX controls the environment (at least one of temperature, humidity, pressure, and cleanness) of the first, second, and third spaces 11, 12, and 13. , 22, 23. In the present embodiment, each of the environment control devices 21 to 23 includes a temperature adjustment device that can adjust the temperature of the gas, a filter unit that can remove foreign matters in the gas, and the like. Each of the environment control devices 21 to 23 supplies clean and temperature-adjusted gas to the first to third spaces 11 to 13 in order to control the environment of the first to third spaces 11 to 13.

  In the present embodiment, the control device 7 controls the environment control devices 21 to 23, and the first space 11 has the highest cleanliness among the first to third spaces 11 to 13. Next, the environment of the first to third spaces 11 to 13 is adjusted so that the cleanness of the third space 13 is high and the cleanness of the second space 12 is high next to the third space 13.

  Moreover, in this embodiment, the control apparatus 7 controls the environmental control apparatuses 21-23, and the pressure of the 1st space 11 is the highest among the 1st-3rd spaces 11-13, and 3rd space. The environment of the first to third spaces 11 to 13 is adjusted so that the pressure of 13 is higher than the pressure of the second space 12.

  The illumination system IL illuminates a predetermined illumination region IR with exposure light EL having a uniform illuminance distribution. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F2 laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light is used as the exposure light EL.

  The mask stage 1 is movable in the third space 13 while holding the mask M. The mask stage 1 has a mask holding unit 1H that holds the mask M in a releasable manner. In the present embodiment, the mask holding unit 1H holds the mask M so that the surface (pattern formation surface) of the mask M and the XY plane are substantially parallel.

The mask stage 1 is movable in the third space 13 while holding the mask M.
The mask stage 1 has a mask holding unit 1H that holds the mask M in a releasable manner. In the present embodiment, the mask holding unit 1H holds the mask M so that the surface (pattern formation surface) of the mask M and the XY plane are substantially parallel.

  The mask stage 1 is movable on the guide surface 19G of the second surface plate 19. The guide surface 19G is disposed in the third space 13. The mask stage 1 is movable on the guide surface 19G to the illumination region IR (a position where the exposure light EL from the illumination system IL can be irradiated). The guide surface 19G is substantially parallel to the XY plane. The mask stage 1 is movable on the guide surface 19G in the third space 13 by the operation of the drive system 30. In the present embodiment, the drive system 30 includes a planar motor for moving the mask stage 1 on the guide surface 19G. A planar motor for moving the mask stage 1 includes, for example, a movable element 1M disposed on the mask stage 1 and a fixed surface disposed on the second surface plate 19 as disclosed in US Pat. No. 6,452,292. And a child 19C. In the present embodiment, the mover 1M includes a magnet array, and the stator 19C includes a coil array. The mover 1M may include a coil array, and the stator 19C may include a magnet array. In the present embodiment, the mask stage 1 is movable in six directions including the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions by the operation of the drive system 30 including a planar motor.

The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. A plurality of optical elements of the projection optical system PL are held by the lens barrel 24.
The lens barrel 24 has a flange 24F. The projection optical system PL is supported by the first surface plate 16 via the flange 24F. A vibration isolator can be provided between the first surface plate 16 and the lens barrel 24.

  The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  Of the plurality of optical elements of the projection optical system PL, the terminal optical element 25 closest to the image plane of the projection optical system PL has an exit surface 26 that emits the exposure light EL toward the image plane of the projection optical system PL. The projection region PR includes a position where the exposure light EL emitted from the emission surface 26 of the projection optical system PL (terminal optical element 25) can be irradiated.

  In the present embodiment, among the plurality of optical elements of the projection optical system PL, at least the terminal optical element 25 is disposed in the first space 11. In the present embodiment, the optical path of the exposure light EL emitted from the exit surface 26 of the last optical element 25 is disposed in the first space 11. That is, in the present embodiment, the first space 11 includes an optical path on the image plane side of the projection optical system PL, and includes at least a part of the optical path of the exposure light EL incident on the substrate P.

  The substrate stage 2 is movable in the first space 11 while holding the substrate P. The substrate stage 2 has a substrate holding part 2H that holds the substrate P in a releasable manner. In the present embodiment, the substrate P is held on the upper side (+ Z side) of the substrate holding part 2H. In the present embodiment, the substrate holding unit 2H holds the substrate P so that the surface (exposure surface) of the substrate P and the XY plane are substantially parallel.

  The measurement stage 3 is movable in the first space 11 with at least a part of the measuring instrument C mounted thereon. The measuring instrument C can measure the exposure light EL. That is, the measuring instrument C can receive the exposure light EL. As the measuring instrument C mounted on the measuring stage 3, for example, at least a part of an aerial image measuring system capable of measuring an aerial image by the projection optical system PL as disclosed in US Patent Application Publication No. 2002/0041377. For example, at least a part of an illuminance unevenness measurement system capable of measuring the illuminance unevenness of the exposure light EL as disclosed in US Pat. No. 4,465,368, for example, as disclosed in US Pat. No. 6,721,039 At least a part of a measurement system capable of measuring the amount of change in the transmittance of the exposure light EL of the projection optical system PL, for example, an irradiation amount measurement system (for example, as disclosed in US Patent Application Publication No. 2002/0061469) At least part of the illuminance measuring system) and, for example, as disclosed in EP 1079223 At least a portion or the like of the wavefront aberration measuring system can be mentioned. The measuring instrument C also includes a reference member having a reference mark detected by an alignment sensor that detects an alignment mark on the substrate P. Note that a reference mark that is detected by detection light having the same wavelength as the exposure light EL may be provided on the reference member.

  An example of an exposure apparatus including a substrate stage that can move while holding the substrate P, and a measurement stage that can move by mounting the measuring device C that measures the exposure light EL without holding the substrate P is, for example, It is disclosed in US Pat. No. 6,897,963, US Patent Application Publication No. 2007/0127006, and the like.

  Each of the substrate stage 2 and the measurement stage 3 is movable on the guide surface 27G of the third surface plate 27. The guide surface 27G (third surface plate 27) is arranged in the first space 11. Each of the substrate stage 2 and the measurement stage 3 can move to the projection region PR (a position where the exposure light EL from the projection optical system PL can be irradiated) on the guide surface 27G. The guide surface 27G is substantially parallel to the XY plane. The third surface plate 27 is supported on the support surface FL via the vibration isolator 28.

  The substrate stage 2 and the measurement stage 3 are movable on the guide surface 27G in the first space 11 by the operation of the drive system 20. In the present embodiment, the drive system 20 includes a planar motor for moving the substrate stage 2 and the measurement stage 3 on the guide surface 27G. Planar motors for moving the substrate stage 2 and the measurement stage 3 are, for example, movable elements 2M and 3M arranged on the substrate stage 2 and the measurement stage 3 as disclosed in US Pat. No. 6,452,292. And a stator 27C disposed on the third surface plate 27. In the present embodiment, the movers 2M and 3M include a coil array, and the stator 27C includes a magnet array. The movers 2M and 3M may include a magnet array, and the stator 27C may include a coil array. In the present embodiment, each of the substrate stage 2 and the measurement stage 3 is moved in six directions of the X axis, the Y axis, the Z axis, the θX, the θY, and the θZ directions by the operation of the drive system 20 including the planar motor. Is possible.

  The liquid immersion member 5 is disposed in the vicinity of the last optical element 25. The liquid immersion member 5 forms an immersion space so that the optical path of the exposure light EL between the terminal optical element 25 and the object arranged in the projection region PR is filled with the liquid LQ. The immersion space is a portion (space, region) filled with the liquid LQ. In the present embodiment, the object that can be arranged in the projection region PR includes at least one of the substrate stage 2, the substrate P held on the substrate stage 2, the measurement stage 3, and the measuring instrument C mounted on the measurement stage 3. . During the exposure of the substrate P, the immersion member 5 forms an immersion space so that the optical path of the exposure light EL between the last optical element 25 and the substrate P is filled with the liquid LQ.

  The liquid immersion member 5 has a lower surface 29 that can face the object, and a space between the lower surface 29 and the object can hold the liquid LQ. An immersion space is formed by the liquid LQ held between the lower surface 29 and the object. In the present embodiment, during exposure of the substrate P, an immersion space is formed so that a partial region of the surface of the substrate P including the projection region PR is covered with the liquid LQ. During the exposure of the substrate P, the interface (meniscus, edge) of the liquid LQ is formed between the lower surface 29 of the liquid immersion member 5 and the surface of the substrate P. That is, the exposure apparatus EX of the present embodiment employs a local liquid immersion method.

  In the present embodiment, the liquid immersion member 5 is a liquid immersion member as disclosed in, for example, US Patent Application Publication No. 2007/0132976, a supply port for supplying the liquid LQ, and collecting the liquid LQ. A recovery port. The control device 7 executes the liquid recovery operation using the recovery port in parallel with the liquid supply operation using the supply port, so that the terminal optical element 25 and the liquid immersion member 5 on one side, the terminal optical element 25 and the liquid are recovered. A liquid immersion space can be formed with the liquid LQ between the immersion member 5 and the object on the other side facing the immersion member 5.

  The interferometer system 4 includes a first interferometer unit 4A capable of optically measuring position information of the mask stage 1 (mask M) in the XY plane, a substrate stage 2 (substrate P), and a measurement stage 3 in the XY plane. A second interferometer unit 4B capable of optically measuring position information of (measuring instrument C). Each of the first and second interferometer units 4A and 4B has a plurality of laser interferometers. The first interferometer unit 4A irradiates the measurement mirror 1R provided on the mask stage 1 with the measurement light L1, and acquires position information of the mask stage 1 (mask M) regarding the X-axis, Y-axis, and θZ directions. . The second interferometer unit 4B irradiates each of the measurement mirror 2R provided on the substrate stage 2 and the measurement mirror 3R provided on the measurement stage 3 with the measurement light L1, thereby causing X-axis, Y-axis, and θZ directions. Position information of the substrate stage 2 (substrate P) and the measurement stage 3 (measurement device C) is acquired.

  Although not shown, position information on the surface of the substrate P held on the substrate stage 2 as disclosed in, for example, US Pat. No. 5,448,332 and US Pat. No. 6,327,025 is detected. A focus leveling detection system is arranged. The focus / leveling detection system can detect not only the position information of the surface of the substrate P but also the position information of the upper surface of the substrate stage 2 and the upper surface of the measurement stage 3.

  When executing the exposure processing of the substrate P or when executing the predetermined measurement processing, the control device 7 determines the drive system 20, based on the measurement result of the interferometer system 4 and the detection result of the focus / leveling detection system. 30 is operated to perform position control of the mask stage 1 (mask M), the substrate stage 2 (substrate P), and the measurement stage 3 (measuring instrument C).

  The exposure apparatus EX of the present embodiment includes a pressure adjusting device 60 for suppressing pressure fluctuations that occur in the first space 11 due to the movement of the substrate stage 2. The pressure adjustment device 60 suppresses pressure fluctuations generated in the first space 11 by injecting pressurized air from the injection port 61 in synchronization with the movement of the substrate stage 2. In other words, the pressure adjusting device 60 suppresses pressure fluctuations that occur in the first space 11 by injecting pressurized air into the decompressed space that occurs behind the movement direction of the substrate stage 2.

  The pressure adjusting device 60 includes a plurality of injection ports 61 that inject pressurized air, a pressure pump 63 that sends the pressurized air to each injection port 61 via the tubes 62, and a tube 62 that is connected to each injection port 61. And a solenoid valve 64 that can open and close the flow path of the pressurized air inside (see FIG. 4A). The electromagnetic valve 64 is controlled to be opened and closed by an electrically connected control device 7. That is, the pressure adjustment device 60 intermittently injects pressurized air into the first space 11 from each injection port 61 based on the opening / closing operation of the electromagnetic valve 64.

  In addition, the exposure apparatus EX includes a temperature sensor 56 that measures the temperature in the first space 11. The temperature sensor 56 is electrically connected to the control device 7.

  The control device 7 drives a temperature adjusting device (not shown) based on the measurement result (temperature of the first space 11) by the temperature sensor 56, and pressurizes the compressed air adjusted to substantially the same temperature as the first space 11. Inject from 60 injection ports 61. As a result, the exposure apparatus EX is prevented from causing temperature fluctuations in the first space 11 due to the pressurized air ejected from the pressure adjusting device 60. The temperature adjustment accuracy of the pressurized air can be improved by providing a plurality of temperature sensors 56.

  In addition, the exposure apparatus EX includes a pressure sensor 57 that measures the pressure in the first space 11. The pressure sensor 57 is electrically connected to the control device 7.

  The control device 7 controls the timing of injecting the pressurized air from the injection port 61 (the opening / closing timing of the electromagnetic valve 64) based on the measurement result by the pressure sensor 57 (pressure fluctuation value of the first space 11). Note that there is a slight delay until the electromagnetic valve 64 is opened and pressurized air is injected into the first space 11 to reduce the pressure fluctuation. Furthermore, in this embodiment, after the electromagnetic valve 64 is opened and pressurized air is injected, the delay time until the pressure fluctuation in the first space 11 is alleviated is measured in advance through experiments and the like. Control is performed in consideration of the above. Thereby, pressurized air is injected in the 1st space 11 at a more optimal timing.

  FIG. 2 is a plan view showing a part of the first space 11. In the following description, a position that can be irradiated with the exposure light EL that is emitted from the last optical element 25 and that is included in the projection region PR is appropriately referred to as an exposure position EP.

  Each of the substrate stage 2 and the measurement stage 3 is movable on the guide surface 27G in the first space 11. The substrate stage 2 is movable in the first region 101 on the guide surface 27G including the exposure position EP. The measurement stage 3 can move in the second region 102 on the guide surface 27G including the exposure position EP. The control device 7 can irradiate the exposure light EL onto the substrate P held on the substrate stage 2 when the substrate stage 2 exists in the first region 101.

  The injection port 61 in the pressure adjusting device 60 is disposed along the moving direction (XY direction) of the substrate stage 2. In the present embodiment, as shown in FIG. 2, one set of two ejection ports 61 facing each other is arranged along each of the X direction and the Y direction in which the substrate stage 2 moves.

  Thereby, as will be described later, it is possible to satisfactorily reduce the pressure fluctuation generated in the first space 11 when the substrate stage 2 moves in the X direction or the Y direction. Moreover, each injection port 61 injects pressurized air to the area | region which does not include at least one part of the optical path in the measurement light L1 irradiated from the 2nd interferometer unit 4B or reflected by the measurement mirror 2R.

  Further, the substrate stage 2 is movable in the third region 103 on the guide surface 27G including the substrate exchange position CP. The substrate exchange position CP is a position where at least one of an operation for loading (loading) the substrate P into the substrate stage 2 and an operation for unloading (unloading) the substrate P from the substrate stage 2 can be performed. The substrate stage 2 can be moved to the substrate exchange position CP. The control device 7 moves the substrate stage 2 to the substrate exchange position CP, and uses the transfer device 40 to load the substrate P before exposure onto the substrate stage 2 disposed at the substrate exchange position CP, and after exposure. At least one of the operations of unloading the substrate P from the substrate stage 2 is executed.

  At least a part of the first region 101 to which the substrate stage 2 can move is arranged on the −Y side from the second region 102 to which the measurement stage 3 can move.

  In the present embodiment, the substrate stage 2 has an upper surface 2T that is disposed around the substrate holder 2H and can face the terminal optical element 25 and the liquid immersion member 5. The upper surface 2T of the substrate stage 2 is flat and substantially parallel to the XY plane. The measurement stage 3 has an upper surface 3T that can face the terminal optical element 25 and the liquid immersion member 5. The upper surface 3T of the measurement stage 3 is flat and substantially parallel to the XY plane.

  For example, when executing the measurement process using the measuring instrument C, the control device 7 makes the terminal optical element 25 and the liquid immersion member 5 and the measuring stage 3 face each other, and the optical path between the terminal optical element 25 and the measuring instrument C. An immersion space is formed so that is filled with the liquid LQ. The control device 7 irradiates the measuring device C with the exposure light EL via the projection optical system PL and the liquid LQ, and executes measurement processing using the measuring device C. The result of the measurement process is reflected in the subsequent exposure process of the substrate P.

  FIG. 3 is a diagram illustrating an example of the substrate P held on the substrate stage 2. In the present embodiment, a plurality of shot areas S1 to S21, which are exposure target areas, are arranged on the substrate P in a matrix. In the present embodiment, during the exposure of the substrate P held on the substrate stage 2, the plurality of shot regions S1 to S21 of the substrate P are sequentially exposed. An immersion space is formed on the substrate P so that the optical path of the exposure light EL on the exit surface 26 side of the last optical element 25 is filled with the liquid LQ during the exposure of the substrate P held on the substrate stage 2.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. When the substrate P is exposed, the control device 7 controls the mask stage 1 and the substrate stage 2 to move the mask M and the substrate P in a predetermined scanning direction in the XY plane. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction.

  For example, in order to expose the first shot region S1 on the substrate P, the control device 7 moves the substrate P (first shot region S1) in the Y-axis direction with respect to the projection region PR of the projection optical system PL. In synchronization with the movement of the substrate P in the Y-axis direction, the liquid in the immersion space on the projection optical system PL and the substrate P is moved while moving the mask M in the Y-axis direction with respect to the illumination region IR of the illumination system IL. The first shot region S1 is irradiated with the exposure light EL through LQ. Thereby, the pattern image of the mask M is projected onto the first shot region S1 of the substrate P, and the first shot region S1 is exposed with the exposure light EL from the projection optical system PL. After the exposure of the first shot region S1 is completed, the control device 7 moves the substrate P in the X-axis direction (or XY) with the immersion space formed in order to start the exposure of the next second shot region S2. An operation of moving in the plane in a direction inclined with respect to the X-axis direction) is performed to move the second shot region S2 to the exposure start position. And the control apparatus 7 starts exposure of 2nd shot area | region S2.

  The controller 7 exposes the shot area while moving the shot area in the Y-axis direction relative to the projection area PR, and moves the next shot area to the exposure start position after the exposure of the shot area is completed. The plurality of shot areas on the substrate P are sequentially exposed while repeating the operation for performing the operation.

  In the following description, in order to expose the shot area S, moving the substrate P in the Y-axis direction with respect to the last optical element 25 is appropriately referred to as scan movement. In addition, after the exposure for a certain shot area is completed, the substrate P with respect to the last optical element 25 is arranged so that the projection area PR is arranged at the exposure start position of the next shot area in order to expose the next shot area. Is referred to as step movement as appropriate.

  In the present embodiment, at least a part of the operation of the exposure apparatus EX is executed based on predetermined control information (exposure control information) related to exposure. The exposure control information includes a control command group that defines the operation of the exposure apparatus EX, and is also called an exposure recipe. In the following description, the control information related to exposure is appropriately referred to as an exposure recipe.

  The exposure recipe is stored in advance in the storage device 7M. The control device 7 controls the operation of the exposure apparatus EX based on the exposure recipe.

  The exposure recipe includes moving conditions of the substrate stage 2 (substrate P) with respect to the last optical element 25 and the liquid immersion member 5. The movement condition includes at least one of the position, movement direction, movement distance, speed, acceleration (deceleration), and movement locus of the substrate stage 2 (substrate P) with respect to the last optical element 25 and the liquid immersion member 5.

  In the present embodiment, the control device 7 moves the substrate stage 2 so that the projection region PR of the projection optical system PL and the substrate P relatively move along the movement locus indicated by the arrow R1 in FIG. 3, for example. While moving, the projection region PR is irradiated with the exposure light EL to sequentially expose each of the shot regions S1 to S21 on the substrate P.

Next, an example of the operation of the exposure apparatus EX will be described.
In order to start the exposure operation of the substrate P, the control device 7 moves the substrate stage 2 to the substrate replacement position CP, and uses the transfer device 40 to expose the substrate stage 2 arranged at the substrate replacement position CP. Load the previous substrate P. The measurement stage 3 is disposed at a position facing the last optical element 25 and the liquid immersion member 5, and an immersion space is formed with the liquid LQ between the last optical element 25 and the liquid immersion member 5 and the measurement stage 3. ing. The control device 7 performs a measurement operation using the measurement stage 3 as necessary.

  In order to execute the exposure operation of the substrate P, the control device 7 forms an immersion space with the liquid LQ between the terminal optical element 25 and the immersion member 5 and the surface of the substrate P. Then, the control device 7 starts an operation of sequentially exposing each of the plurality of shot areas S1 to S21 of the substrate P.

  In the present embodiment, when the plurality of shot areas S1 to S21 of the substrate P are sequentially exposed, the control device 7 uses the arrow R1 in FIG. 3 on the guide surface 27G in the first space 11 based on the exposure recipe. As shown, the substrate stage 2 is moved by scanning and stepping.

  As described above, in the present embodiment, the moving condition of the substrate stage 2 when sequentially exposing each of the plurality of shot areas S1 to S21 of the substrate P is predetermined by the exposure recipe. In the present embodiment, the driving condition of the pressure adjusting device 60 is determined based on the predetermined moving condition of the substrate stage 2. That is, in the present embodiment, the pressure adjusting device 60 for sequentially exposing each of the plurality of shot regions S1 to S21 of the substrate P based on the exposure recipe so that the pressure in the first space 11 is adjusted. These movement conditions are determined in advance.

  When the shot areas S1 to S21 of the substrate P are exposed, the substrate stage 2 scans and moves as described above. That is, when exposing the substrate P, the substrate stage 2 moves at least in the Y-axis direction. In the present embodiment, when the substrate stage 2 moves in the first region 101, the measurement stage 3 is disposed on the + Y side of the substrate stage 2. That is, while the shot areas S1 to S21 of the substrate P are exposed, the measuring instrument C mounted on the measuring stage 3 is not used, and the apparatus waits in the second area 102 so as not to contact the substrate stage 2. Yes.

In the present embodiment, the first, third, fifth, seventh, tenth, twelfth, fifteenth, seventeenth and twentieth shot regions S1, S3, S5, S7, S10, S12, S15, S17, When the exposure of S20 is executed, the substrate stage 2 scans in the -Y direction, and the other shot areas S2, S4, S6, S8, S9, S11, S13, S14, S16, S18, S19, S21. When this exposure is performed, the substrate stage 2 scans in the + Y direction.
Thus, in this embodiment, the substrate stage 2 reciprocates in the Y axis direction.

The movement of the substrate stage 2 during the exposure period in which the plurality of shot areas S1 to S21 are exposed includes step movement. That is, the reciprocating movement (scanning movement) of the substrate stage 2 with respect to the Y-axis direction during the exposure period is a step in the X-axis direction (or a direction inclined with respect to the X-axis direction in the XY plane, hereinafter referred to as an inclination direction). It is performed while moving.
As described above, exposure is performed on all the shot areas S1 to S21.

  After the exposure of the last 21st shot area S21 is completed, the control device 7 operates the drive system 20 to unload the exposed substrate P from the substrate stage 2, and the last optical element 25 and the liquid immersion member 5 are operated. The state is changed from the state where the substrate stage 2 and the substrate stage 2 face each other to the state where the terminal optical element 25 and the liquid immersion member 5 and the measurement stage 3 face each other. Thereby, the measurement stage 3 moves to the exposure position EP.

  After moving the measurement stage 3 to the exposure position EP, the control device 7 moves the substrate stage 2 to the substrate exchange position CP. The control device 7 uses the transport device 40 to unload the exposed substrate P from the substrate stage 2 arranged at the substrate exchange position CP. Thereafter, the control device 7 loads the substrate P before exposure onto the substrate stage 2 using the transport device 40. Thereafter, the same processing as described above is repeated.

  By the way, when the substrate stage 2 moves in the substantially closed first space 11 during the exposure process described above, the pressure in the first space 11 fluctuates or the pressure distribution in the first space 11 becomes non-uniform. There is a possibility of becoming. Therefore, in this embodiment, the control device 7 reduces the pressure fluctuation in the first space 11 by injecting pressurized air from the injection port 61 of the pressure adjusting device 60.

  Specifically, the pressure adjusting device 60 injects pressurized air into the decompressed space generated behind the substrate stage 2 in synchronization with the movement of the substrate stage 2. The pressurized air injection from the injection port 61 for adjusting the pressure in the first space 11 is performed at least during the movement of the substrate stage 2.

  FIG. 4 is a schematic diagram for explaining an example of a driving state of the pressure adjusting device 60. FIG. 4A shows a driving state of the pressure adjustment device 60 when the substrate stage 2 scans in one direction (for example, + Y direction) in the Y-axis direction in order to expose a shot region S on the substrate P. 4B shows a driving state of the pressure adjusting device 60 when the substrate stage 2 scans in the other of the Y-axis directions (for example, the −Y direction) in order to expose a shot region S on the substrate P.

  When the substrate stage 2 moves in the + Y direction, as shown in FIG. 4A, the pressure in the rear (−Y direction) with respect to the moving direction of the substrate stage 2 decreases, and a decompression space G1 is generated. Further, not only the space between the substrate stage 2 and the measurement stage 3 but also at least a part of the pressure in the first space 11 may fluctuate due to the scanning movement of the substrate stage 2.

  Further, when the substrate stage 2 moves in the −Y direction, as shown in FIG. 4B, the pressure in the rear (+ Y direction) with respect to the moving direction of the substrate stage 2 decreases, and the decompression space G1 is generated. Further, not only the space between the substrate stage 2 and the measurement stage 3 but also at least a part of the pressure in the first space 11 may fluctuate due to the scanning movement of the substrate stage 2.

  When at least a part of the pressure in the first space 11 fluctuates, for example, a force due to the pressure fluctuation is applied to a member arranged in the first space 11. For example, a support member on which a measurement device (for example, at least a part of a focus / leveling detection system) that performs measurement processing related to exposure of the substrate P is prevented from being maintained in a stable state. In many cases, the position is controlled by the vibration device 15.

  However, for example, if a force resulting from pressure fluctuation acts from below the member due to pressure fluctuation, an unsteady force (disturbance) is generated. Therefore, the control performance of the vibration isolator 15 may be deteriorated.

  In contrast, the exposure apparatus EX of the present embodiment injects pressurized air from the corresponding injection port 61 into the decompression space G1 as shown in FIGS. 4 (a) and 4 (b). Here, the corresponding injection port 61 means the injection port 61 closest to the decompression space G1. Thus, the exposure apparatus EX can reduce the pressure fluctuation which has arisen in the 1st space 11 by injecting pressurized air from the injection opening 61 to the decompression space G1. In the present embodiment, pressurized air adjusted to substantially the same temperature as the first space 11 is injected from the injection port 61. Thereby, it can prevent that a temperature fluctuation arises in the 1st space 11 by injection of pressurized air.

  Further, the exposure apparatus EX ejects pressurized air from the ejection port 61 at an optimal timing based on the measurement result by the pressure sensor 57. Therefore, the pressure fluctuation generated in the first space 11 can be reduced in a short time.

  Further, since the exposure apparatus EX injects pressurized air to a region that does not include at least a part of the optical path in the measurement light L1 irradiated from the second interferometer unit 4B or reflected by the measurement mirror 2R. It can prevent that the measurement accuracy of the 2nd interferometer unit 4B falls because air is injected in the optical path of measurement light L1.

  In the exposure apparatus EX, the stage substrate 2 moves in the X-axis direction by step movement during exposure. Even in this case, the pressure behind the substrate stage 2 in the moving direction is reduced, and a decompressed space is generated. Similarly, the exposure apparatus EX injects pressurized air from the corresponding injection port 61 in the pressure adjusting device 60 into the decompression space G1. Thereby, the exposure apparatus EX can suppress the pressure fluctuation generated in the first space 11 due to the movement of the stage substrate 2, and can prevent the generation of a defective device due to the exposure failure caused by the pressure fluctuation.

In the above-described embodiment, a case has been described in which one pair of the two injection ports 61 facing each other is disposed along each of the X direction and the Y direction in which the substrate stage 2 moves. It is not limited to this. In each of the shot areas S1 to S21 arranged in a matrix, the positions where the decompression space G1 is generated when the substrate stage 2 moves are slightly different.
In such a case, as shown in FIG. 5, a plurality of sets (for example, 6 sets) of two injection ports 61 facing each other can be arranged along each of the X direction and the Y direction. According to this configuration, it is possible to reliably inject pressurized air from the injection port 61 arranged at an optimal position with respect to the decompression space G1 generated at a slightly different position depending on each of the shot regions S1 to S21. it can.

  Moreover, in the above-mentioned embodiment, although the case where pressurized air was injected as the pressure adjustment apparatus 60 was demonstrated, in addition to the injection mechanism which injects pressurized air as shown in FIG. The thing provided with the exhaust mechanism which exhausts the inside of the 1st space 11 can be used. The pressure adjusting device 69 injects pressurized air into the decompression space G1 generated behind in the movement direction of the substrate stage 2 and exhausts the decompression space G2 generated in the front in the movement direction of the substrate stage 2 to reduce the pressure. As a result, the pressure adjusting device 69 reduces the pressure of the pressure increasing space G2 in which the pressure is relatively increased in the first space 11, and the pressure reducing space in which the pressure is relatively low in the first space 11. The pressure of G1 can be increased. Therefore, the pressure adjusting device 69 can reliably reduce the pressure fluctuation generated in the first space 11, and suppresses the pressure fluctuation generated in the first space 11 as in the above-described embodiment, resulting in the pressure fluctuation. It is possible to prevent a defective device from being generated due to an exposure failure that occurs.

  In each of the above-described embodiments, the optical path on the exit side (image plane side) of the terminal optical element 25 of the projection optical system PL is filled with the liquid LQ. For example, this is disclosed in International Publication No. 2004/019128. As described above, a projection optical system in which the optical path on the incident side (object plane side) of the terminal optical element 25 is also filled with the liquid LQ can be employed.

  In addition, although the liquid LQ of each above-mentioned embodiment is water, liquids other than water may be sufficient. For example, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, or the like can be used as the liquid LQ. In addition, various fluids such as a supercritical fluid can be used as the liquid LQ.

  Further, as the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  In addition, each of the above-described embodiments is a multi-stage type including a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. It can be applied to the exposure apparatus. Three or more substrate stages can be arranged.

  The type of exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto a substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). In addition, the present invention can be widely applied to an exposure apparatus for manufacturing a micromachine, MEMS, DNA chip, reticle, mask, or the like.

  In each of the above-described embodiments, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in Japanese Patent No. 6778257, a variable shaped mask (also known as an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. May be used). The variable shaping mask includes, for example, a DMD (Digital Micro-mirror Device) which is a kind of non-light emitting image display element (spatial light modulator). Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element. As a self-luminous type image display element, for example, CRT (Cathode Ray Tube), inorganic EL display, organic EL display (OLED: Organic Light Emitting Diode), LED display, LD display, field emission display (FED: Field Emission Display) And a plasma display panel (PDP).

  In addition, the requirements of each of the above-described embodiments are that line and space patterns are formed on the substrate P by forming interference fringes on the substrate P as disclosed in, for example, WO 2001/035168. The present invention can also be applied to an exposure apparatus (lithography system) that exposes.

  As shown in FIG. 7, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device. Manufacturing step 203, substrate processing step 204 including exposing the substrate with exposure light using a mask pattern according to the above-described embodiment, and developing the exposed substrate, device assembly step (dicing process, (Including processing processes such as a bonding process and a packaging process) 205, an inspection step 206, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

DESCRIPTION OF SYMBOLS 2 ... Substrate stage, 4 ... Interferometer system, 8 ... Body, 11 ... 1st space, 56 ... Temperature sensor, 57 ... Pressure sensor, 60, 69 ... Pressure regulator, 61 ... Injection port, 64 ... Solenoid valve, EL ... exposure light, EP ... exposure position, EX ... exposure device, P ... substrate

Claims (22)

A movable body movable along at least one direction on a predetermined surface;
An exposure apparatus comprising: a pressure adjusting device that injects pressurized air so as to reduce pressure fluctuation caused by the movement of the moving body.   The exposure apparatus according to claim 1, wherein the pressure adjusting device injects the pressurized air into a decompressed space generated behind the moving body in the moving direction.   The exposure apparatus according to claim 1, wherein the pressure adjusting device performs the injection of the pressurized air in synchronization with the movement of the moving body.   The exposure apparatus according to any one of claims 1 to 3, wherein the pressure adjusting device intermittently injects the pressurized air based on an opening / closing operation of a solenoid valve.   The exposure apparatus according to claim 1, further comprising a structural member that sets a moving space of the moving body.   The exposure apparatus according to claim 1, further comprising a temperature sensor that measures a temperature in the moving space.   The exposure apparatus according to claim 6, wherein the pressure adjusting device ejects the pressurized air adjusted to the temperature of the moving space based on a measurement result of the temperature sensor.   The pressure sensor which measures the pressure in the said movement space is provided, and the timing which injects the said pressurized air from the said injection port based on the measurement result of the said pressure sensor is controlled to any one of Claims 5-7. The exposure apparatus described.   The exposure apparatus according to any one of claims 1 to 8, wherein a timing of injecting the pressurized air is controlled based on predetermined data set in advance.   2. A position sensor that obtains information on the position of the moving body using measurement light, and the pressure adjusting device injects the pressurized air into a region that does not include at least a part of an optical path in the measurement light. The exposure apparatus according to claim 9.   The exposure apparatus according to any one of claims 1 to 10, wherein the pressure adjusting device has a plurality of injection ports for injecting the pressurized air.   The exposure apparatus according to any one of claims 1 to 11, wherein the plurality of ejection openings are arranged at least along a moving direction of the moving body. In a pressure adjustment method for an exposure apparatus having a movable body that is movable along one direction on a predetermined surface,
An exposure apparatus pressure adjustment method for reducing pressure fluctuation by injecting pressurized air into a predetermined space in which pressure fluctuation has occurred due to movement of the moving body.   The pressure adjustment method for an exposure apparatus according to claim 13, wherein the pressurized air is jetted into a decompressed space generated behind the moving body in the moving direction.   15. The pressure adjustment method for an exposure apparatus according to claim 13, wherein the pressurized air is ejected in synchronization with the movement of the moving body.   The pressure adjustment method for an exposure apparatus according to any one of claims 13 to 15, wherein the pressurized air is intermittently injected based on an opening / closing operation of a solenoid valve.   The temperature of a moving space in which the moving body moves is measured, and the pressurized air is injected in a state adjusted to the same temperature as the moving space based on the measurement result. Exposure apparatus pressure adjustment method.   The pressure adjustment method for an exposure apparatus according to any one of claims 13 to 17, wherein the pressure of a moving space in which the moving body moves is measured, and the injection timing of the pressurized air is adjusted based on the measurement result.   The pressure adjustment method for an exposure apparatus according to any one of claims 13 to 18, wherein a timing of jetting the pressurized air is adjusted based on predetermined data set in advance.   The pressure adjustment of the exposure apparatus according to any one of claims 13 to 19, wherein the pressurized air is jetted onto a region that does not include at least a part of an optical path in measurement light for measuring the position of the moving body. Method.   21. The pressure adjustment method for an exposure apparatus according to any one of claims 13 to 20, wherein the pressurized air is jetted from a plurality of directions with respect to the predetermined region.   A device manufacturing method, comprising: exposing a substrate using the exposure apparatus according to any one of claims 1 to 12; and developing the exposed substrate.

Images