JP2010236048A - Gas treatment apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a gas treatment apparatus capable of preventing the deterioration of treatment efficiency of the gas treatment apparatus due to replacement of raw material container, in the gas treatment apparatus for performing film forming treatment for a substrate in a treatment container by using a gas in a raw material container or a gas provided by gasifying liquid raw material in the raw material container and, when the number of times of film-forming treatment attains the preset number of times, performing cleaning treatment of the interior of the treatment container by using a cleaning gas. <P>SOLUTION: The gas treatment apparatus includes: a means of calculating an estimated consumption amount of gas up to the subsequent cleaning treatment after completing the cleaning treatment, at every kind of gas based on a treatment recipe to be used and the number of times of film forming; a means of determining whether the raw material container gets empty or not up to the subsequent cleaning treatment based on the remaining amount and the estimated consumption amount of gas; and a means of giving the alarm when being determined that the raw material container gets empty. As the result, such a timing that the raw material container gets empty can be found based on the alarm. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a gas processing apparatus that performs a film forming process on a substrate in a processing container using a gas in a raw material container or a gas obtained by vaporizing a liquid raw material in the raw material container.

  As one of semiconductor manufacturing apparatuses, there is a gas processing apparatus that mounts a semiconductor wafer (hereinafter referred to as a wafer), which is a substrate, on a mounting table in a processing container and performs a film forming process by CVD (chemical vapor deposition) or the like.

  The gas processing apparatus includes a gas supply unit such as a gas shower head for supplying a film forming process gas to a wafer, for example, and the upstream side of the gas supply unit is connected to a gas supply unit. This gas supply device includes a bottle in which a gas supplied to the wafer or a liquid raw material that generates a film forming process gas by being vaporized is stored. The gas or liquid source stored in the bottle in this way is referred to as the contents of the bottle.

  In such a gas processing apparatus, a user supplies a film to a wafer at a flow rate (mL / min) and a flow rate per unit time at a process time from an input / output screen provided in the apparatus. Set whether to perform. The user also sets how many times the set film forming process is repeated, that is, how many wafers are to be processed continuously. Then, when the film forming process is started, the film forming process gas is supplied to the wafer at the set flow rate at each set process stage, and the gas or liquid material in the bottle is consumed. Further, a cleaning process is performed between the film forming process and the film forming process to supply a cleaning gas into the processing container and remove deposits attached to the processing container. Further, after the cleaning process and before the film formation process on the wafer, a precoat process may be performed in which a predetermined film is formed on the inner wall surface of the processing container and the surface of the mounting table on which the wafer is mounted. This pre-coating process is performed in order to condition the inside of the processing container and to suppress processing variations between wafers.

  By the way, when the film forming process proceeds in the gas processing apparatus and the content in the bottle is reduced, it is necessary to replace the bottle with one filled with the content. In order to perform this replacement, for example, the weight of the bottle is constantly measured by a weight measuring device. The weight measuring device generates an alarm when the measured value of the weight of the bottle becomes smaller than a predetermined value in order to notify the user of the timing for replacing the bottle.

  By the way, the film formation process cannot be performed on the wafer while the bottle is replaced. In addition, since the cleaning process takes time, there is a demand to replace the bottle during the cleaning process in order to increase the processing efficiency of the apparatus. However, in the method of measuring the weight of the bottle as described above, it is not possible to make a plan to match the bottle replacement time with the cleaning process.

  The present invention has been made under such circumstances, and its purpose is to perform a film formation process on a substrate in a processing container with a gas in a raw material container or a gas obtained by vaporizing a liquid raw material in a raw material container, In a gas processing apparatus that cleans the inside of a processing container with a cleaning gas when the number of film forming processes reaches a preset number of times, it is to prevent a decrease in processing efficiency of the gas processing apparatus due to replacement of a raw material container. .

According to the gas processing apparatus of the present invention, the film forming process is performed on the substrate in the processing container with the gas in the raw material container or the gas obtained by vaporizing the liquid raw material in the raw material container, and the number of film forming processes is set in advance. In the gas processing apparatus for cleaning the inside of the processing container with the cleaning gas when the number of times is reached,
A recipe storage unit for storing a processing recipe including a gas type, a gas flow rate, and a gas supply time;
The amount of gas consumed from the time of replacement of the raw material container to the time of the cleaning process is calculated for each type of gas based on the processing recipe used, and the mass or volume of the contents and the consumption of the gas when the raw material container is replaced Means for calculating the remaining amount in the raw material container at the time of the cleaning process based on the amount for each type of gas;
Means for calculating an estimated consumption amount of gas from the end of the cleaning process until the next cleaning process for each gas type based on the processing recipe to be used and the number of film forming processes;
Means for determining whether or not the raw material container is emptied by the time of the next cleaning process based on the remaining amount and the estimated consumption of gas;
And means for generating an alarm when it is determined that the raw material container is empty.

  In the gas processing apparatus, when it is determined that the raw material container is emptied, the number of substrates that can be subjected to the film forming process after the cleaning process is finished is determined by the remaining amount in each raw material container and the processing recipe. The difference between the number of processed substrates scheduled from the time of the cleaning process to the time of the next cleaning process and the number of substrates capable of performing the film forming process is equal to or less than a preset number. If it is determined that the material container is replaced, or in addition to the alarm, a means may be provided for indicating that the next cleaning process should be performed earlier than the scheduled time when the material container is replaced. If it is determined that the number of substrates that can be deposited after the next cleaning process is completed, the remaining amount in each material container and the process recipe And a means for indicating that the next cleaning process should be performed at a later time than planned and to be performed when the material container is replaced when it is determined that the number of the substrates is equal to or less than the preset number. May be.

  According to the gas processing apparatus of the present invention, the estimated consumption of gas from the end of the cleaning process to the next cleaning process is determined for each gas type based on the processing recipe to be used and the number of film forming processes. Based on the remaining amount and the estimated consumption of gas, a means for determining whether or not the raw material container is emptied until the next cleaning process, and a determination that the raw material container is empty. Means for generating an alarm when the alarm occurs. Therefore, it is possible to know the timing when the raw material container is empty based on this alarm, and it is possible to replace the raw material container during the cleaning process. As a result, it is possible to prevent the film formation process from being performed by replacing the raw material container, and thus it is possible to suppress a decrease in the processing efficiency of the gas processing apparatus.

It is a longitudinal cross-sectional view of the film-forming apparatus of this invention. It is a block diagram of the control part provided in the said film-forming apparatus. It is a block diagram of the work memory provided in the said control part. It is a schematic diagram of the one part area | region of the said work memory. 3 is a flowchart of the first embodiment. 10 is a flowchart of Example 2. 6 is a time-series graph showing the timing at which a cleaning process is performed in Example 2.

Example 1
A film forming apparatus 1 that performs CVD, which is an example of a gas processing apparatus of the present invention, will be described with reference to FIG. The film forming apparatus 1 includes a processing container 10. The processing container 10 is composed of a plurality of parts. In the figure, reference numeral 10a denotes an O-ring that is interposed between these parts and maintains the airtightness in the processing container 10.

  In the processing container 10, a mounting table 11 for mounting the wafer W horizontally is provided. In the mounting table 11, a heater 11 a that serves as a temperature control unit for the wafer W is provided. Further, the mounting table 11 is provided with three lifting pins 11c (only two are shown for convenience) that can be moved up and down by a lifting mechanism 11b. Via the lifting pins 11c, a conveying means (not shown) and the mounting table 11 are provided. The wafer W is transferred between the two. One end side of an exhaust pipe 12 is connected to the bottom of the processing vessel 10, and an exhaust means 13 composed of a vacuum pump or the like is connected to the other end side of the exhaust pipe 12. While the gas is supplied to the processing container 10 and various processes are performed by the exhaust means 13, the inside of the processing container 10 is controlled to a predetermined pressure. A transfer port 14 that is opened and closed by a gate valve G is formed on the side wall of the processing vessel 10.

  Further, a gas shower head 15 as a gas supply unit is provided on the ceiling of the processing container 10 so as to face the mounting table 11. The gas shower head 15 includes a gas chamber 16, and the gas supplied to the gas chamber 16 is supplied into the processing container 10 from the gas supply holes 17.

  As shown in FIG. 1, the gas shower head 15 includes a film forming process gas supply system 21A for supplying a film forming process gas for performing a film forming process on the wafer W through various pipes, and a gas for pre-coating process. Are connected to a pretreatment gas supply system 21B for supplying a cleaning gas and a cleaning gas supply system 21C for supplying a cleaning gas, and gas is supplied to the gas chamber 16 from each of the supply systems 21A, 21B, and 21C.

The film formation processing gas supply system 21A includes gas supply units 22A to 22E, and the gas supply units 22A to 22E are raw material containers in which gas A to gas E for film formation on the wafer W are stored. Some bottles 23A-23E are included. The gas supply units 22 </ b> A to 22 </ b> E are provided with, for example, a valve for supplying gas into the processing container 10 and a mass flow controller, and are provided with means for pumping the gas in the bottles 23 </ b> A to 23 </ b> E to the gas chamber 16. Each gas is supplied from each bottle 23A to 23E by these gas supply units 22A to 22E at a flow rate set as described later. As an example of the gas, the gas A is a purge gas for purging the inside of the processing vessel 10 such as N ₂ gas. Gas B to gas D are film forming gases containing components to be formed on the wafer W, and gas E is a carrier gas made of Ar or the like for efficiently circulating gas B to gas D into the processing vessel 10. It is.

  The precoat treatment gas supply system 21 </ b> B includes gas supply devices 22 </ b> F to 22 </ b> H, and the gas supply devices 22 </ b> F to 22 </ b> H are gas F to gas H for performing precoat treatment on the inner wall of the processing container 10 and the surface of the mounting table 11. Is included.

  The gas supply units 22F to 22H include, for example, valves for supplying each gas into the processing container 10 and a mass flow controller, and are provided with means for pressure-feeding the gas in the bottles 23F to 23H to the gas chamber 16. And these gas supply devices 22F-22H supply each gas from each bottle 23F-23H with the flow volume set as mentioned later.

  The cleaning process gas supply system 21 </ b> C includes a gas supply unit 22 </ b> I, which removes deposits due to the precoat and film forming gas adhering to the inner wall of the processing container 10 and the surface of the mounting table 11, respectively. The bottle 23I in which the gas I which is the cleaning gas is stored. Since the gas supply unit 22I is configured in the same manner as the supply units 22A to 22E, detailed description thereof is omitted.

  Each of the bottles 23A to 23I can be freely removed from the pipe to which these bottles are connected, and can be removed from the gas supply units 22A to 22I for replacement. The replacement here includes not only replacing the connected bottle with a different bottle but also removing the bottle from the pipe once, filling the contents, and connecting the bottle to the pipe again.

  Next, the control unit 3 composed of, for example, a computer will be described with reference to FIG. The control unit 3 includes a bus 31 and is connected with a program 41 for executing processing described later. The program 41 includes commands (steps) for sending control signals from the control unit 3 to each part of the film forming apparatus 1 to advance processes such as film forming process, pre-coating process, cleaning process and alarm display described later. ing. The program 41 is installed in the control unit 3 while being stored in a program storage unit including a computer-readable storage medium such as a flexible disk, a compact disk, a hard disk, and an MO (magneto-optical disk).

  Further, the CPU 31, the work memory 33, the output screen 5, and the input unit 50 are connected to the bus 31. Numerical values input from the input means 50 are stored in a predetermined area of the work memory 33, and various calculations are performed based on the stored numerical values. That is, the work memory 33 constitutes recipe storage means. Then, the contents of the work memory 33 are output to a predetermined area of the output screen 5. The input means 50 is composed of a keyboard, a mouse and the like.

  FIG. 3 shows an example of the work memory 33. The user of the film forming apparatus 1 can set a film forming process recipe in the film forming process recipe setting area 51 provided in the work memory 33 by using the input unit 50. The recipe setting for this film forming process is a number of steps in which the same gas is continuously supplied at the same flow rate from the start to the end of the process of performing the film forming process on one wafer W. The number of steps is set, and which gas is supplied to the wafer W of the processing container 10 for how many seconds in each step.

  FIG. 4 shows a film forming process recipe setting area 51 and an example of a recipe input to the area 51. In the illustrated example, the film formation process is performed on the wafer W in five stages from Step 1 to Step 5, but the number of steps can be arbitrarily set. In addition, the display of END on the right side of step 5 in the table means that the setting of the film forming process recipe has been completed in step 5, and after the user has completed the setting of step 5 by the input means 50, It is displayed by performing a procedure for completing the setting of the film forming process recipe.

  In the example shown in the figure, gas A is supplied to the processing vessel 10 at 100 mL / min in Step 1 at 100 mL / min, and then Gas B is 200 mL / min, Gas C is 50 mL / min, Gas D is 10 mL / min in Step 2 after that. Then, gas E is supplied at 100 mL / min, and then at step 3, gas A is supplied at 10 mL / min, gas C is supplied at 20 mL / min, gas D is supplied at 50 mL / min, and gas E is supplied at 30 mL / min. Further, in Step 4, gas C is supplied at 20 mL / min for 10 seconds, gas D is supplied at 50 mL / min, and gas E is supplied at 30 mL / min. In Step 5, gas A is supplied at 10 mL / min and gas C is supplied at 20 mL / min for 100 seconds. Gas D is supplied at 50 mL / min, and Gas E is supplied at 30 mL / min.

  The work memory 33 includes a bottle content usage amount storage area 52 when the film forming recipe is executed once. When the setting of the film forming process recipe is completed in the setting area 51 as described above, the total time (seconds) required for carrying out one film forming process recipe based on the setting, and for each gas in that case The consumption amount (mL) from the bottle is calculated by the control unit 3 and stored in the storage area 52.

  The total time is a total value of the time set in each step. In this example, the processing time is set to 120 seconds, 10 seconds, 100 seconds, 10 seconds, and 100 seconds in steps 1, 2, 3, 4, and 5, respectively. Therefore, the total value of 340 seconds is displayed as the total time when this film forming recipe is executed once.

  In addition, the content consumption of 23A to 23E from each bottle was obtained by multiplying the gas flow rate per unit time of the gas set for each step by the set processing time of the step. Thereafter, the amount of use between each step is summed up. As shown in the setting area 51 of FIG. 4, when the film forming process recipe is set, the process of calculating the usage amount for the gas A is 2 minutes (120 seconds) × 1 in step 1 100 mL / min = 200 mL, Step 2 0 min (0 sec) × 10 mL / min = 0 mL, Step 3 1/6 min (10 sec) × 100 mL / min = 16.5 mL, Step 4 0 min (0 sec ) × 10 mL / min = 0 mL, 1/5 min (10 seconds) in step 5 × 100 mL / min = 16.5 mL, and the amount used in each step is calculated. To be summed. The total value of 233 mL is stored in the storage area 52 as the consumption amount from the bottle 23A when the gas A film forming process recipe is executed once. Since the gas B to the gas E are calculated in the same manner as the gas A and stored in the storage area 52, the calculation procedure is omitted.

  In the film forming process performed by the film forming apparatus 1, the film forming process set in the film forming process recipe is repeatedly performed on the wafers W that are continuously loaded. The work memory 33 includes a film formation process recipe repetition number setting area 53 for setting the number of wafers W to be processed in succession, that is, how many times the set film formation process recipe is repeated. Yes.

  The work memory 33 includes a precoat process recipe setting area 54 and a cleaning process recipe setting area 55. As in the case of setting the recipe for the film formation process, the number of steps, the flow rate per unit time of each gas (mL / min) for each step, and the execution time (seconds) of each step are set in these areas. By setting, recipes for the precoat process and the cleaning process can be set respectively.

  In addition, the work memory 33 includes number setting areas 56 and 57 for setting the number of times to repeat the precoat processing recipe and the cleaning processing recipe, respectively.

  As a processing procedure by the film forming apparatus 1, the pre-coating process is repeated for the set number of times, then the film forming process is repeated for the set number of times, and then the cleaning process is repeated for the set number of times. After performing the cleaning process, the process is performed again in order from the precoat process. After performing this pre-coating process, the next film-forming process is performed and then the cleaning process is completed as one segment, and the process from the first pre-coating process to the last cleaning process is performed once. I will call it a turn. The work memory 33 is provided with a processing turn number setting area 58. For example, when a processing start button (not shown) is pressed, the processing turn of the set number of turns is repeatedly performed.

  The work memory 33 includes a bottle content remaining amount storage area 61. The bottle content remaining amount storage area 61 stores the remaining amounts (mL) of the respective gases A to E in the bottles 23A to 23E of the film forming process gas supply system 21A. The values stored in the bottle content remaining amount storage area 61 are the values displayed in the area 61 before the execution of the recipe after the processing on the wafer W set in one film forming process recipe is completed. The usage amount of each gas used for processing on one wafer W set in the film forming processing recipe stored in the bottle content usage amount storage area 52 from the remaining amount value of the contents of the bottles 23A to 23E. The value of is subtracted and updated. When the bottles 23 </ b> A to 23 </ b> E are exchanged, the user inputs the amount of gas in the bottle after the exchange from the input unit 50, and stores the inputted amount in the bottle content remaining amount storage area 61. The amount is updated. In addition, the numerical value input here at the time of bottle replacement | exchange may be a mass value, and when calculating later, it may be converted into the volume value corresponding to the mass value, and the calculation may be performed.

  The work memory 33 also includes a processable wafer number storage area 62. The storage area 62 stores wafers W that can be formed before any of the bottles 23A to 23E is emptied based on the set film formation recipe and the remaining amount of gas in each bottle 23A to 23E. Memorize the number of sheets. This number is updated every time the processing on one wafer W set in the film forming recipe is completed.

  Specifically, in this storage area 62, for each bottle, the remaining amount stored in the bottle content remaining amount storage area 61 is stored in the bottle content usage amount storage area 52 of the film forming process recipe. Dividing by the amount used when the processing recipe is executed once, the smallest value among the values calculated in this way is stored.

  In FIG. 3, 63 is a gas usage amount storage area for each part, 64 is a gas usage reference amount storage area for each part, and 73 and 74 are variation allowable value setting areas. These storage areas and setting areas are examples. Since it is not used in 1, the details will be described later.

  The output screen 5 includes an alarm display area 71 for displaying various alarms.

  Next, description will be made with reference to FIG. 5 which is a flowchart showing the processing steps of the film forming apparatus 1 described above. First, the user of the film forming apparatus 1 attaches the bottles 23A to 23E filled with the gas A to the gas E to the gas supply units 22A to 22E, and sets the contents of each bottle 23A to 23E to the contents of the bottle in the work memory 33. Input to the remaining amount storage area 61 (step S1). However, the content amount may be automatically input to the storage area 61 as a value measured by a measuring instrument (not shown).

  Subsequently, the user inputs the number of steps of the film forming process, the flow rate per unit time of each gas in each step, and the execution time of each step in the film forming process recipe setting area 51 of the work memory 33 to form the film. A processing recipe is set (step S2). When the film forming process recipe is set, the control unit 3 calculates the total time of the recipe and the consumption amount of each gas in the recipe as described above, and the calculation result matches the film forming process recipe. It is stored in the bottle content usage amount storage area 52 when it is executed once. Subsequently, the control unit 3 stores the amount stored in the bottle content usage amount storage area 52 and the amount stored in the bottle content remaining amount storage area 61 when the calculated film forming process recipe is executed once. Then, the processable number of wafers W is calculated, and the calculation result is stored in the processable wafer number storage area 62 (step S3).

  Subsequently, the user similarly inputs the number of steps, the flow rate per unit time of each gas in each step, and the execution time of each step in the precoat process recipe setting area 54 and the cleaning process recipe setting area 55, respectively. A process recipe and a cleaning process recipe are set. Subsequently, after the user inputs arbitrary numerical values to the setting areas 53, 56, and 57 for the number of repetitions of the film forming process, the pre-coating process, and the cleaning process that are continuously performed, and determines the processing contents of one processing turn. The number of times of processing turns is determined by inputting an arbitrary numerical value into the processing turn number setting area 58 (step S4).

  When the user presses a process start button (not shown), the inside of the processing container 10 is controlled to a predetermined pressure, and the precoat process is performed according to the set precoat recipe. Subsequently, the wafer W is carried into the processing container 10 by a transfer means (not shown), and the film forming process defined in the film forming process recipe is performed. When the film forming process is completed for the wafer W, the control unit 3 stores the consumption amount of each gas used in the film forming process recipe stored in the storage area 52 for each bottle stored in the storage area 61. Subtract from the remaining amount of contents and update the subtracted value as the remaining amount of bottle contents. Then, the value of the processable wafer number storage area 62 is also updated in accordance with the change in the remaining amount of the bottle contents. That is, when the film forming process is completed, the number value obtained by subtracting 1 from the number value stored so far is stored (step S5). After the film-formed wafer W is carried out of the processing container 10 by the transfer means, the subsequent wafer W is carried in and the film-forming process is performed. Each time the film forming process is performed, the numerical value in the storage area 62 of the number of wafers W that can be processed and the numerical value in the bottle content remaining amount storage area 61 are updated.

  When the number of repetitions of the film formation process set in the film formation process recipe repetition number setting area 53 is completed, the cleaning process is started, and the control unit 3 stores the number of processable wafers stored in the processable wafer number storage area 62. The value of the recipe repetition count setting area 53 set is subtracted from the value of the value, and it is determined whether or not the calculated value becomes 0 or more. Whether the contents of the bottle are emptied before the cleaning process starts in the next processing turn. It is determined whether or not (step S6). When the calculated value is 0 or more, the control unit 3 does not display an alarm on the assumption that the contents are not emptied in any bottle before the start of the cleaning process in the next processing turn. Thereafter, the cleaning process ends, and one process turn ends. Thereafter, the next processing turn is started, and processing is performed in order from the precoat processing.

  In the process turn repeated in this manner, the control unit 3 at the start of the cleaning process of a certain process turn determines the number of repetitions of the film forming process recipe from the value of the processable wafer number storage area 62 stored in the work memory 33 as described above. When the value set in the setting area 53 is subtracted and the value becomes 0 or less, the control unit 3 determines that the contents of any bottle are emptied by the start of the next cleaning process (step S7).

  When it is determined that there is an empty bottle, the control unit 3 uses the bottle content usage amount for performing processing on one wafer W set in the film forming recipe stored in the bottle content usage amount storage area 52. And the bottle content remaining amount stored in the bottle content remaining amount storage area 61 and the bottle that is emptied Is detected. Then, an alarm indicating that the bottle needs to be replaced is displayed in the display area 71 (step S8).

  When the alarm is generated, the user replaces the bottle in which the alarm is displayed with one filled with contents while the cleaning process is being performed (step S9). Note that this replacement process does not have to be affected by the film formation process, and may be performed until the precoat process recipe is executed.

  After replacing the bottle, the user inputs the content amount contained in the replaced bottle into the bottle content remaining amount storage area 61 of the work memory 33 by the input unit 50 and updates the replaced bottle. Then, the control unit 3 updates the processable number of wafers based on the input content amount and stores it in the storage area 62 (step S10), and the alarm display stops. When the set number of processing turns are finished, the operation of the film forming apparatus 1 is stopped.

(Example 2)
Next, the second embodiment will be described focusing on the differences from the first embodiment. The number of times defined in the film formation process recipe repetition number setting area 53 is the number of film formation processes that can be repeated until the cleaning process is executed. This number of processable wafer number storage areas 62 depends on the remaining amount of gas. As compared with the number of times specified in (3), the fluctuation is relatively acceptable. For this reason, by changing the number of times of performing the film forming process recipe, it is possible to more closely match the time when the cleaning process is performed and the time when the bottle is replaced. For this reason, in the second embodiment, the number of repetitions of the film forming process recipe can be changed with respect to the numerical value set in the film forming process recipe repetition number setting area 53, and the change range of the work memory 33 is set to the allowable range. This is input to the allowable value setting areas 73 and 74. The numerical value input to the allowable fluctuation value setting area 73 is the first allowable value, and the number of repetitions of the film forming process recipe is allowed to decrease by this value. In addition, the numerical value input to the fluctuation allowable value setting area 74 is the second allowable value, and the number of repetitions is allowed to increase by this value.

  Next, the processing steps of Example 2 will be described with reference to FIG. First, steps similar to steps S1 to S4 are executed, and the contents of the processing turn and the number of processing turns are determined (step T1). In addition, the user sets the first allowable value and the second allowable value in the repetition number variation allowable value setting areas 73 and 74, that is, an allowable value indicating how many times the variation of the number of repetitions of the film forming recipe process can be permitted. Set from the input means 50. For example, if the set number of repetitions of the film forming process recipe is 500 and the first allowable value and the second allowable value are set to 50, the number of repetitions of the film forming process recipe is in the range of 450 to 550 times. Can vary.

  When the processing turn is started, during the film forming process, the bottle contents remaining amount stored in the bottle contents remaining amount storage area 61 and the process stored in the processable wafer number storage area 62 are possible as in the above step S5. The number of wafers is updated. When the cleaning process is started after the film formation process is completed, the control unit 3 determines whether the bottle is not emptied until the start of the cleaning process in the next process turn (step T2). If it is determined that the wafer W is empty, the control unit 3 determines the number of wafers W scheduled to be processed (the number of repetitions of the film forming process recipe set in the setting area 53) and the processable wafer W stored in the storage area 62. It is determined whether or not the difference between the first and second sheets is equal to or smaller than the first allowable value input in the area 73 (step T3).

  When it is determined that the value is equal to or less than the first allowable value, the control unit 3 performs the film forming process recipe for the next processing turn in the alarm display area 71 with a smaller number of repetitions than the number of repetitions set in the setting area 53 and starts the cleaning process. An alarm is displayed to indicate that you want to speed up. Further, as in the first embodiment, bottles that need to be replaced during the next cleaning process are displayed in the alarm display area 71 (step T4). In this processing turn, the cleaning process ends without exchanging the bottle. In the next processing turn started after the determination, the film forming process recipe is performed as many times as possible. That is, after all the film forming process recipes in the next process turn are completed, the number of processable wafers W in the storage area 62 becomes zero. Thereafter, the cleaning process is started. Therefore, if the timing indicated by C1 in FIG. 7A is the start time of the cleaning process in the originally set processing turn, the processing turn in this case is indicated by C1 in FIG. 7B. The start time of the cleaning process will be advanced. When the cleaning process for the next processing turn is started, the user replaces the bottle according to the display in the alarm display area 71, and the remaining amount of the replaced bottle is updated from the input means 50. As in the first embodiment, the number of processable wafers W stored in the storage area 62 is updated, and the alarm display stops. As described above, even when it is determined that the bottle is emptied during the film forming process of the next processing turn, the cleaning process is performed and the bottle needs to be replaced by reducing the number of times the film forming process is not necessary to replace the bottle. It becomes possible to match with the time.

  In Step T3, when it is determined that the difference in the number of sheets is larger than the first allowable value, the cleaning process start timing (the number of wafers W in the next process turn) in the next process turn does not vary and is executed. As in Example 1, an alarm indicating that there is an empty bottle by the next cleaning process is displayed (step T5), and during the cleaning process during the current process turn in which this alarm is displayed as in Example 1. The user replaces the bottle.

  If it is determined in step T2 that the bottle is not emptied by the start of the cleaning process of the next processing turn, the control unit 3 stores the film formation recipe in the storage area 62 after all the film forming recipes of the next processing turn are completed. It is determined whether the number of wafers that can be processed is equal to or less than the second allowable value (step T6).

  If it is determined that the value is equal to or less than the second allowable value, the control unit 3 performs the film forming process recipe for the next processing turn in the alarm display area 71 with a number of repetitions larger than the set number of times, and delays the start of the cleaning process The alarm display area 71 displays that there is a bottle that needs to be replaced during the cleaning process (step T7).

  In the next processing turn, the film forming process recipe is performed as many times as the number of processes that can be stored in the storage area 62. That is, after the film formation recipe of this processing turn is completed, the number of processable wafers W in the storage area 62 becomes zero. Thereafter, the cleaning process is started. Accordingly, in this case, the cleaning process start time is delayed as shown by C1 in FIG. 7C, compared to the original cleaning process start time of FIG. 7A. When the cleaning process is started, the user replaces the bottle, and the remaining amount of the replaced bottle is updated from the input unit 50. As in the first embodiment, the number of wafers W that can be processed is updated, and the alarm display stops. As described above, by increasing the number of film forming processes until the bottle needs to be replaced, it is possible to match the time when the cleaning process is performed and the time when the bottle needs to be replaced.

  If it is determined in step T6 that the number of wafers is not less than or equal to the second allowable value, the control unit 3 does not display an alarm and does not change the number of repetitions of the film forming process (step T8). After the determination, when the cleaning process is completed, the next process turn is started. Then, when the processing turn is completed by the number set in the same manner as in Example 1, the operation of the film forming apparatus 1 is stopped.

Example 3
Next, the third embodiment will be described focusing on the differences from the first and second embodiments. Here, it is assumed that the film forming apparatus 1 is composed of novel parts. The gas use amount storage area 63 of the work memory 33 used in the third embodiment will be described. This storage area 63 is counted from the time of replacement of the parts constituting the film forming apparatus 1 and accumulated use of a predetermined gas. This is an area for storing the quantity. In this example, the O-ring 10a and the elevating pins 11c are easily deteriorated by being exposed to the gas B and the gas C, respectively, and the accumulated usage amounts of the O-ring 10a and the elevating pins 11c with respect to the gas B and the gas C are stored in the memory. It is stored and managed in area 63. The value stored in the storage area 63 is also updated in real time during the execution of the film forming process, and once the film forming process recipe is completed, the value before execution of the recipe is stored in the bottle content usage storage area 52. The usage value of each gas is added and updated. When the part is exchanged, the user sets (resets) the gas usage amount for the replaced part in the gas usage amount storage area 63 from the input means 50 to 0 mL.

  Further, in the work memory 33, the gas use reference amount setting area 64 for each part stores the reference amounts for the cumulative use of the gas B and the gas C with respect to the O-ring 10a and the lifting pins 11c. When the accumulated usage amount of gas stored in the gas usage amount storage area 63 exceeds the reference amount stored in the setting area 64, the durability of the O-ring 10a and the elevating pins 11c is lowered, and the replacement time is reduced. An alarm indicating that it has come is output.

  Below, the process of Example 3 is demonstrated. First, the user inputs the reference amounts for the cumulative use of the gas B and gas C to the O-ring 10a and the lifting pins 11c in the gas use reference amount setting area 64, and thereafter, the same processing as in the first and second embodiments is performed. Set the contents of the turn and the number of processing turns. Here, since new parts are used, the user inputs 0 for the gas B usage amount for the O-ring 10a and the gas C usage amount for the lifting pins 11c in the gas usage amount storage area 63. When the user presses a process start button (not shown), a process turn is started.

  Each time one film forming process recipe is performed on the wafer W, the consumption amounts of the gas B and gas C set in the recipe become the numerical values displayed before the recipe in the gas usage amount storage area 63 is executed. It is added and updated.

  When the numerical value in the gas usage amount storage area 63 is updated in this way, the control unit 3 determines whether or not the updated numerical value for each gas exceeds the reference amount stored in the storage area 64. When it is determined that none of the parts exceeds the reference amount, the control unit 3 does not display an alarm. Even after the set number of processing turns is completed, the numerical value in the usage amount storage area 63 is maintained without being reset, and when the processing turn is set again and the processing turn is executed, the maintained numerical value is maintained. Each time the wafer W is processed, the recipe gas usage amount set anew is added.

  When the control unit 3 determines that the usage amount stored in one or both of the storage areas 63 exceeds the reference amount stored in the storage area 64, the usage amount is set to the reference amount. An alarm is displayed in the display area 71 informing that it is time to replace the parts that have passed.

When the alarm is displayed, the user replaces the part for which the alarm is displayed, for example, after the currently executed processing turn is completed, and the replaced part is stored in the storage area 63 from the input means 50. Reset the used amount to 0 mL. Then, after the next processing turn is set again, the film forming process is performed.

  When the first embodiment is executed by the film forming apparatus 1, any one of the bottles 23A to 23E is not emptied until the next cleaning process at the start of the cleaning process, and the set number of times. It is determined whether or not the wafer W can be processed by executing the film forming process recipe. When it is determined that the film forming process recipe cannot be executed for the set number of times, an alarm prompting the replacement of the bottle is displayed on the output screen 5. Is done. Therefore, since the bottle can be replaced during the cleaning process based on the alarm, it is possible to prevent the film formation process from being stopped due to the bottle replacement. As a result, a decrease in processing efficiency of the apparatus can be suppressed.

  When Example 2 is executed by the film forming apparatus 1, the number of times of performing the film forming process recipe is changed to match the timing for performing the cleaning process and the time for replacing the bottle. Accordingly, it is possible to more reliably suppress a decrease in processing efficiency of the apparatus.

  When Example 3 is executed by the film forming apparatus 1, the accumulated value of the gas usage after the replacement of the components constituting the apparatus can be managed. Accordingly, it is possible to suppress the occurrence of defects in the film forming process by replacing the parts earlier than the original durability time and increasing the cost, or using the parts beyond the original durability time. Further, in the above example, each bottle shows an example in which gas is stored as the contents, but liquid raw materials that generate gas by being heated are stored, and the remaining amount of the liquid raw material in the bottle is It may be managed in the same manner as the remaining amount in the gas bottle.

W Semiconductor wafer 1 Deposition apparatus 10 Processing vessel 15 Gas shower heads 22A to 22I Gas supply units 23A to 23I Bottle 21A Deposition process gas supply system 3 Control unit 33 Work memory 50 Input means 71 Alarm display area

Claims (3)

A film is formed on the substrate in the processing container with the gas in the raw material container or the gas obtained by vaporizing the liquid raw material in the raw material container. When the number of film forming processes reaches a preset number of times, the film is processed with the cleaning gas. In the gas processing apparatus for cleaning the inside of the container,
A recipe storage unit for storing a processing recipe including a gas type, a gas flow rate, and a gas supply time;
The amount of gas consumed from the time of replacement of the raw material container to the time of the cleaning process is calculated for each type of gas based on the processing recipe used, and the mass or volume of the contents and the consumption of the gas when the raw material container is replaced Means for calculating the remaining amount in the raw material container at the time of the cleaning process based on the amount for each type of gas;
Means for calculating an estimated consumption amount of gas from the end of the cleaning process to the next cleaning process for each gas type based on the processing recipe to be used and the number of film forming processes;
Means for determining whether or not the raw material container is emptied by the time of the next cleaning process based on the remaining amount and the estimated consumption of gas;
And a means for generating an alarm when it is determined that the raw material container is emptied.   When it is determined that the raw material container is empty, the number of substrates that can be subjected to film formation after the cleaning process is calculated based on the remaining amount in each raw material container and the processing recipe, When it is determined that the difference between the number of substrates to be processed from the time of the cleaning process to the next cleaning process and the number of substrates on which the film forming process can be performed is equal to or less than a preset number, 2. The gas processing apparatus according to claim 1, further comprising means for displaying that the next cleaning process is performed at the time of replacement of the raw material container earlier than scheduled, instead of or together with the alarm.   When it is determined that the raw material container does not become empty, the number of substrates that can be subjected to film formation after the next cleaning process is calculated based on the remaining amount in each raw material container and the processing recipe. When it is determined that the number of the substrates is equal to or less than a preset number, there is provided a means for displaying that the next cleaning process is performed later than the schedule and is performed when the material container is replaced. The gas processing apparatus according to claim 1 or 2.

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