JP2010218797A - Metal member built-in base board, battery pack using the same, vehicle, and apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a metal member built-in base board which can stably retain a metal member, such as a bus bar at a desired position and can stably mount a terminal of a single battery and is highly reliable, a battery pack using the metal member built-in base board, a vehicle and an apparatus. <P>SOLUTION: The base board 10 for a power supply device has the metal member (bus bar 20), built into an insulating base material. The bus bar 20 has two or more of fastened sections 35, exposed on front and rear surfaces of the base board and forming first through-holes 21 penetrated in the thickness direction, and a connection section 36 which is arranged between two or more of fastened sections 35 and is thinner than the fastened section since at least one face is recessed in comparison with the fastened section. A second through-hole 22, penetrating the base board in the thickness direction, is formed on a location of the connection section 36 of the bus bar 20, and a wiring pattern conducting to the bus bar 20 through the second through-hole 22 is provided. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a metal member built-in substrate that can be used when, for example, a plurality of batteries are connected to each other to form a battery pack, and a large current can flow. More specifically, the present invention relates to a metal member built-in board in which a bus bar for connecting batteries and a signal line used for controlling each battery are formed in the board, and a battery pack, vehicle and equipment using the board. It is.

  Conventionally, a plurality of unit cells are combined and integrated into a battery pack capable of obtaining a large current and a large voltage. In some cases, a signal line is connected between each unit cell and a control device in order to detect the state of each unit cell in the battery pack. When manufacturing such a battery pack, it is very troublesome to connect the individual cells with wires or the like. Thus, for example, Patent Document 1 proposes to embed bus bars and lead wires for connecting a plurality of single cells and mold them to form an integral terminal board.

  Patent Document 2 proposes a metal circuit board that can cope with high current and high voltage by inserting a metal circuit into a notch portion of a synthetic resin core member. In addition, the upper and lower surfaces of the metal circuit are covered with a synthetic resin, and plated through holes are formed to establish electrical connection with the metal circuit.

Japanese Patent No. 3785499 JP 2007-294656 A

  However, the conventional techniques described above have the following problems. For example, Patent Document 1 does not specifically describe a molding method or a lead wire connecting method. Therefore, it is difficult to manufacture an electrically reliable molded product based only on the content of this document.

  For example, in a battery pack using a large power for automobiles or the like, a bus bar capable of flowing a large current is required. Therefore, a bus bar with a somewhat large cross-sectional area must be used. Furthermore, in order to reduce the size of the battery pack, it is desired to reduce the surface area. Therefore, it is preferable to use a bus bar having a large thickness. However, if an attempt is made to simply mold a bus bar having a large thickness, the bus bar may be displaced as the resin flows. In addition, if a relatively delicate signal line and a thick bus bar are molded simultaneously, there is a problem that the signal line and its connection portion may be damaged due to a filling pressure of the resin.

  Moreover, in the circuit board described in Patent Document 2, resin layers are formed on the upper and lower surfaces in order to stably embed a metal circuit. For this reason, when used as a substrate constituting a battery pack, stable mounting is difficult. For example, there are battery cells for automobiles, etc., whose terminals are screw-shaped. When connecting the unit cell to the substrate, it is usually performed by providing a through hole in the substrate, penetrating the terminal portion, and tightening with a nut from the other side. When such a single cell is attached to the circuit board of Patent Document 2, the resin layer is sandwiched and screwed. For this reason, there is a possibility that the mounting state of the unit cell becomes unstable. In some cases, there is a problem that the reliability of the signal circuit formed on the surface of the circuit board may be impaired.

  The present invention has been made to solve the above-described problems of the prior art. In other words, the problem is that a metal member such as a bus bar can be stably held at a desired position, and the terminal of the unit cell can be stably attached. It is to provide a battery pack, a vehicle, and equipment used.

  The metal member built-in substrate of the present invention made for the purpose of solving this problem is a metal member built-in substrate in which a metal member is built in an insulating base, and the metal member is exposed on the front and back surfaces of the substrate. The first through-hole penetrating in the thickness direction is formed between two or more fastened parts and two or more fastened parts, and at least one surface is a recess compared to the fastened part And the second through hole penetrating the substrate in the thickness direction is formed at the location of the connecting portion of the metal member. The second through hole And having a wiring pattern that is electrically connected to the metal member.

  According to the substrate with a built-in metal member of the present invention, the fastened portion in which the first through hole is formed in the metal member is exposed on the front and back surfaces of the substrate. Therefore, the cell can be stably attached by fastening the cell terminal to the fastened portion. Furthermore, the 2nd through-hole is formed in the connection part which connects a to-be-fastened part. Since the wiring pattern is electrically connected to the metal member through the second through hole, highly reliable wiring is possible regardless of the arrangement of the unit cells. By incorporating this metal member in an insulating base material, a highly reliable metal-embedded substrate is obtained.

Furthermore, in the present invention, it is desirable that the connecting portion has a concave portion on one surface and a flat surface on the other surface, and the wiring pattern is provided on the surface of the substrate on the side having the concave portion. .
With such a configuration, the wiring pattern can be easily arranged and manufactured and handled easily.

Furthermore, in this invention, it has a core layer and an outer core layer as an insulating base material, the core layer is provided only in the outer peripheral side of the metal member, and an outer core layer is the outer peripheral side of a metal member. And the inside of the recess.
If it is such, the arrangement | positioning in the surface of the board | substrate of a metal member can be stably hold | maintained by a core layer, and the arrangement | positioning of the thickness direction of a board | substrate is hold | maintained by an outer core layer. Therefore, it is easy to incorporate the metal member at a desired position in the substrate.

Furthermore, in the present invention, it is desirable that the outer core layer further has an outer circuit layer, and a wiring pattern is formed in the circuit layer.
If it is such, a wiring pattern can be arrange | positioned without being influenced by arrangement | positioning of a metal member. If necessary, a plurality of circuit layers can be formed by further stacking.

  The present invention also extends to a battery pack in which a plurality of unit cells are connected by fastening the terminals of the unit cells to the first through holes of any of the above-described metal member built-in substrates.

Furthermore, the present invention extends to a vehicle that includes a motor that rotates the wheels by receiving power supply, and a power supply unit that supplies power to the motor, and the battery pack is included in the power supply unit.
Furthermore, the present invention extends to a device that includes an operation unit that operates by receiving power supply and a power supply unit that supplies power to the operation unit, and the battery pack is included in the power supply unit.

  According to the metal member built-in substrate of the present invention and the battery pack, vehicle and equipment using the substrate, the metal member such as the bus bar can be stably held at a desired position, and the terminal of the unit cell can be stably attached. And is highly reliable.

It is a top view which shows the front surface of the board | substrate for power supply devices which concerns on this form. It is a top view which shows the back surface of the board | substrate for power supply devices which concerns on this form. It is the elements on larger scale which show the front surface of the board | substrate for power supply devices. It is the elements on larger scale which show the back surface of the board | substrate for power supply devices. It is sectional drawing of the board | substrate for power supply devices. It is a perspective view which shows the shape of a bus bar. It is explanatory drawing which shows a detection circuit formation process (first half). It is explanatory drawing which shows a detection circuit formation process (latter half). It is explanatory drawing which shows a bus-bar embedding process. It is explanatory drawing which shows a secondary shaping | molding process. It is explanatory drawing which shows the state which the secondary molding process was complete | finished. It is explanatory drawing which shows the structural example of the battery pack which uses the board | substrate for power supply devices. It is explanatory drawing which shows the outline of the external shape of a battery. It is a fragmentary sectional view of a battery pack. It is explanatory drawing which shows the vehicle carrying a battery pack. It is explanatory drawing which shows the hammer drill carrying a battery pack. It is sectional drawing which shows another example of the board | substrate for power supply devices. It is sectional drawing which shows another example of the board | substrate for power supply devices. It is sectional drawing which shows another example of the board | substrate for power supply devices.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the best mode for embodying the present invention will be described in detail with reference to the accompanying drawings. In the present embodiment, the present invention is applied to a power supply substrate for connecting a plurality of batteries to form a battery pack.

  As shown in FIGS. 1 to 4, the power supply substrate 10 of this embodiment is a substrate in which a plurality of bus bars 20 are embedded. 1 shows the front surface 10F of the power supply substrate 10, and FIG. 2 shows the back surface 10B. Further, FIG. 3 shows a partially enlarged view of FIG. 1, and FIG. 4 shows a partially enlarged view of FIG. 1 and 2 show a state where the power supply line 12 and the connector 13 are attached to the front surface 10F of the power supply device substrate 10. FIG.

  As shown in FIG. 3, two large through holes 21 and one small through hole 22 are formed for each bus bar 20 in the power supply device substrate 10 of the present embodiment. When viewed from the front surface 10F, a pedestal portion 23 that is a part of the bus bar 20 is seen around the large through hole 21 in an annular shape. A land 24 connected to the wall surface of the hole is provided around the small through hole 22 as will be described later. Further, a signal line 25 is connected to the land 24 of each bus bar 20. Moreover, as shown in FIG. 4, the external shape of each bus-bar 20 and the through-holes 21 and 22 are visible on the back surface 10B.

  Next, a cross-sectional view of the power supply substrate 10 is shown in FIG. This figure is a cross-sectional view taken along the line AA of FIG. The power supply device substrate 10 includes a bus bar 20 and a multilayer resin layer (a core layer 41, an adhesive layer 42, an outer core layer 43, an adhesive layer 44, and an insulating sheet layer 45) around the bus bar 20. Further, a circuit layer including the land 24 and the signal line 25 shown in FIG. 1 is formed between the adhesive layer 44 and the insulating sheet layer 45.

  As a material of each resin layer (core layer 41, adhesive layer 42, outer core layer 43, adhesive layer 44, insulating sheet layer 45), it is desirable to select a material whose linear expansion coefficient is close to that of bus bar 20. By making such a selection, the power supply device substrate 10 having excellent thermal shock resistance can be obtained. Furthermore, it is desirable to select a resin layer having a high thermal conductivity. In this way, the heat dissipation from the substrate is good. And also when used for a battery pack, the cooling performance of the battery is improved. The resin blend having such performance can be obtained by blending many inorganic base materials such as glass fiber and silica. In this way, mechanical strength, heat resistance, dimensional stability, etc. can be improved.

  As shown in FIG. 5, the bus bar 20 has a thick portion to be fastened 35 (thickness D1) in which the large through hole 21 is formed and a thin connection portion 36 (thickness D2) between them. Is. The bus bar 20 is entirely exposed on the back surface 10B of the power supply substrate 10. Only two through holes 21 and their peripheral portions are exposed on the front surface 10F. That is, the adhesive layer 44 and the insulating sheet layer 45 cover the periphery of the front surface of the fastened portion 35. The remaining exposed portion is a pedestal portion 23.

  The bus bar 20 connects the battery terminals to each other and allows a relatively large current to flow. Therefore, it is integrally formed of a highly conductive metal such as copper and has a large cross-sectional area to some extent. For example, in this embodiment, the cross section of the connecting portion 36 has a thickness (D2) of about 1.5 mm and a width of about 20 mm. Further, the thickness D1 of the fastened portion 35 is about 2.0 mm.

  The small through holes 22 are plated through holes that are opened after the resin layers 41 to 45 are overlaid on the bus bar 20 and molded. That is, the entire through wall 22 is plated with copper. The land 24 and the bus bar 20 are electrically connected by the copper plating. Therefore, in this embodiment, the state value (voltage value, temperature, etc.) of each bus bar 20 can be acquired via the signal line 25.

  Each bus bar 20 before being incorporated in the power supply device substrate 10 has the same shape as shown in FIG. The bus bar 20 is a member whose outer shape is substantially oval in plan view. The upper surface in the figure is arranged on the front surface 10F side. The lower surface 38 of the bus bar 20 is planar. As shown in FIG. 5, the entire lower surface 38 is exposed even when incorporated in the power supply substrate 10. Each bus bar 20 before being incorporated into the power supply substrate 10 does not have a hole corresponding to the small through hole 22.

Next, a method for manufacturing the power supply substrate 10 will be described with reference to FIGS. In this manufacturing method, (1) detection circuit forming step,
(2) Bus bar embedding process,
(3) Secondary molding process,
(4) It has four steps of a through hole forming step. However, the order of (1) the detection circuit forming step and (2) the bus bar embedding step may be reversed. In each drawing showing these steps, the upper side in the drawing shows the side that becomes the front surface 10F of the power supply substrate 10, and the lower side in the drawing shows the side that becomes the back surface 10B.

  (1) In the detection circuit forming step, as shown in FIGS. 7 and 8, the detection circuit is formed on one surface of the film-like insulating member 51, thereby forming the insulating sheet layer 45 provided with the circuit layer 46. Is a step of forming. First, as shown in the upper part of FIG. 7, a sheet-like insulating member 51 is prepared and punched out so that the entire shape thereof becomes the shape of the power supply device substrate 10. As a result, as shown in the lower part of the figure, through holes are formed in places. At this time, a through hole 52 having a slightly smaller diameter is formed at a position concentric with the fastened portion 35 at a place where the fastened portion 35 of the bus bar 20 is disposed. Further, a through hole 53 having an exposed diameter of the land 24 is also formed at a location to be the land 24 later.

  Subsequently, as shown in the upper part of FIG. 8, a copper foil 54 is bonded to the back surface of the insulating member 51 by a molding press. Then, after joining, the copper foil 54 is processed into the shape of the detection circuit by etching. As a result, it becomes as shown in the lower part of the figure. In this figure, only the portion of the copper foil 54 remaining on the bottom surface of the through hole 53 is visible, but the circuit portion that will later become the signal line 25 is also formed. That is, the portion of the copper foil 54 left in this step will later correspond to a circuit layer.

  (2) In the bus bar embedding step, first, a core resin 55 made of a cured resin in the shape of the power supply substrate 10 is prepared. For example, an epoxy resin containing glass fiber is suitable. A necessary number of bus bars 20 are prepared. As shown in FIG. 9, the thickness D3 of the core resin 55 is substantially equal to the thickness D2 of the connecting portion 36 of the bus bar 20. Furthermore, a through hole 56 having a size that is the same as or slightly smaller than the outer shape of the bus bar 20 is formed in a necessary portion of the core resin 55. Then, the bus bar 20 is fitted into the through hole 56. The lower surface 38 of the bus bar 20 and the lower surface 57 of the core resin 55 in the drawing are on the same plane. This core resin 55 will later become the core layer 41.

  (3) In the secondary molding process, as shown in FIG. 10, the outer core is the shape of the power supply device substrate 10, and the arrangement, size, and shape of the through-holes of the fastened portion 35 of the bus bar 20 are formed. A member 58 is prepared. The outer core member 58 is a cured glass fiber-containing epoxy resin. This outer core member 58 will later become the outer core layer 43. Further, a prepreg 61 formed in the same planar shape as that of the outer core member 58 and a prepreg 62 slightly smaller than only the through hole at the portion to be fastened 35 are prepared. The through hole at the location of the fastened portion 35 of the prepreg 62 is the same size as the through hole 52 of the insulating member 51. The prepregs 61 and 62 are uncured resin members obtained by impregnating glass fibers or the like with an epoxy resin or the like.

  Then, as shown in FIG. 10, (2) the prepreg 61, the outer core member 58, the prepreg 62, and the insulating member 51 are sequentially stacked on the front surface of the core resin 55 after the completion of the bus bar embedding process. . The total thickness of the prepreg 61 and the outer core member 58 is approximately equal to the difference between the thickness D1 of the fastened portion 35 of the bus bar 20 and the thickness D2 of the connecting portion 36. Therefore, by overlapping these, the upper surfaces of the fastened portion 35 of the bus bar 20 and the outer core member 58 become substantially the same surface. The insulating member 51 and the prepreg 62 are overlaid on the surface.

  Then, these are stacked and heated and pressed. As a result, the prepregs 61 and 62 are cured to form an integrated substrate as shown in FIG. As a result, the prepregs 61 and 62 became adhesive layers 42 and 44 for adhering the adjacent members. Further, the core resin 55 becomes the core layer 41, the insulating member 51 becomes the insulating sheet layer 45, and the outer core member 58 becomes the outer core layer 43.

  In addition, a part of the copper foil 54 remaining in the (1) detection circuit forming step is exposed from the through hole 53. As described above, the through hole 52 formed in the insulating sheet layer 45 is slightly smaller than the upper surface of the fastened portion 35 of the bus bar 20. Therefore, as shown in FIG. 11, the insulating sheet layer 45 and the adhesive layer 44 cover the boundary between the fastened portion 35 and the outer core layer 43 and cover the periphery of the fastened portion 35 to some extent. And the part which is not covered with them among the upper surfaces of the to-be-fastened part 35 is exposed, and becomes the base part 23. FIG.

(4) In the through hole forming step, a plated through hole is formed in a range where the copper foil 54 is exposed from the through hole 53 in FIG. That is, all the holes from the copper foil 54 to the lower surface 38 of the bus bar 20 are penetrated to form a through hole, and copper plating is applied to the wall surface. This plated through hole becomes the small through hole 22 shown in FIG. Further, the portion of the copper foil 54 remaining on the upper surface after forming the through hole became the land 24. Thus, the power supply substrate 10 shown in FIG. 5 was completed. Above, description of the manufacturing method of the board | substrate 10 for power supply devices is complete | finished.

  The power supply device substrate 10 according to the present embodiment is a member used for configuring the battery pack 100 as shown in FIG. This battery pack 100 is for connecting a plurality of cylindrical batteries 110 to each other and using a large power. This figure shows the state before assembly. In the battery pack 100, a plurality of cylindrical batteries 110 housed in a battery holder 81 are attached to the power supply substrate 10 and the back substrate 82 by nuts 83, respectively.

  Compared with the power supply device substrate 10, the rear substrate 82 is not provided with the small through holes 22, lands 24, and signal lines 25, but basically has the same configuration. Further, the circuit layer 46 and the insulating sheet layer 45 are also unnecessary. FIG. 12 shows the back surface of the back substrate 82 and only the outer shape of the bus bar 20 and the large through hole 21 are visible. The arrangement of the bus bars 20 on the rear substrate 82 is slightly different from that of the power supply substrate 10. Further, the power supply line 12 and the connector 13 are not attached to the back substrate 82.

  As shown in FIG. 13, the cylindrical battery 110 used here has positive and negative electrodes 112 and 113 protruding from both ends of a cylindrical main body 111. Each of the electrodes 112 and 113 has a thread formed on the outer peripheral surface thereof. Further, the battery holder 81 is for accommodating a large number of cylindrical batteries 110 with as little gap as possible. The electrodes 112 and 113 of the stored cylindrical batteries 110 are arranged so as to protrude outward from both side surfaces of the battery holder 81.

  When manufacturing the battery pack 100, first, the plurality of cylindrical batteries 110 are stored in the battery holder 81. Then, the power supply substrate 10 and the rear substrate 82 are projected from both outer sides of the battery holder 81, and the electrodes 112 and 113 project through the large through holes 21 of the power supply substrate 10 or the rear substrate 82. Arrange as follows. Further, the electrodes 112 and 113 are tightened from both outsides using a number of nuts 83. Thus, the power supply substrate 10 can be sandwiched and fixed by the cylindrical battery 110 and the nut 83.

  As a result, as shown in FIG. 14, the cylindrical battery 110 and the nut 83 are fastened with only the bus bar 20 interposed therebetween. Accordingly, the resin is not sandwiched between the fastening portions, and the fastening can be performed stably and strongly. Moreover, since the cross-sectional area of the bus bar 20 is large, a large current can flow.

  In the battery pack 100 of this embodiment, since the signal line 25 is provided on the power supply substrate 10, a signal can be received from the bus bar 20 via the land 24. Thereby, the battery voltage for every two cylindrical batteries 110 can be detected. Furthermore, if the back substrate is provided with a small through hole or a signal line, the battery voltage can be detected for each cylindrical battery 110. An appropriate back substrate may be selected according to the system configuration of the battery pack.

  The battery pack 100 can be used by being mounted on a vehicle 200 as shown in FIG. 15, for example. The vehicle 200 is a hybrid vehicle that is driven by using an engine 240, a front motor 220, and a rear motor 230 in combination. This vehicle 200 includes a vehicle body 290, an engine 240, a front motor 220, a rear motor 230, a cable 250, an inverter 260, and a battery pack 100 having a plurality of batteries 101 therein.

  The vehicle may be a vehicle that uses battery-generated electric energy for all or a part of its power source. For example, an electric vehicle, a hybrid vehicle, a plug-in hybrid vehicle, a hybrid railway vehicle, a forklift, an electric vehicle Wheelchairs, electric assist bicycles, electric scooters, etc. are listed.

  Alternatively, as shown in FIG. 16, the battery pack 100 can be used for a device in which a battery is mounted. Shown in this figure is a hammer drill 300 equipped with a battery pack 100 including the battery 101 of this embodiment. This hammer drill 300 is a device having a battery pack 100 and a main body 320. The battery pack 100 is detachably accommodated in the bottom 321 of the main body 320 of the hammer drill 300.

  In addition, as a device equipped with a battery, any device equipped with a battery and using this as at least one energy source may be used. For example, a personal computer, a mobile phone, a battery-driven electric tool, an uninterruptible power supply, etc. , Various home appliances powered by batteries, office equipment, industrial equipment.

  As described above in detail, according to the power supply device substrate 10 of the present embodiment, the bus bar 20 that is a thick metal member is fitted into the core layer 41, and the large through hole 21 and its periphery are exposed. Therefore, for example, even when the cell is screwed through the large through hole 21, it can be stably fixed. Further, the connecting portion 36 and the core layer 41 of the bus bar 20 are covered with an adhesive layer 42, an outer core layer 43, an adhesive layer 44, and an insulating sheet layer 45. A circuit layer including the land 24 is formed on the lower surface of the insulating sheet layer 45. Therefore, the circuit layer is protected from both sides by the outer core layer 43 and the insulating sheet layer 45, and is not deformed even when the unit cell is screwed, so that the reliability is high. Accordingly, a thick metal member such as a bus bar can be stably held at a desired position, and the terminals of the unit cells can be stably attached, thereby providing a highly reliable substrate.

In addition, this form is only a mere illustration and does not limit this invention at all. Therefore, the present invention can naturally be improved and modified in various ways without departing from the gist thereof.
For example, not only a circuit layer including the land 24 but also a further multilayer can be formed. Further, for example, as shown in FIG. 17, the same uneven shape as that on the upper surface side is formed on the lower surface side of the bus bar, and each resin layer is formed on the rear surface side, and further circuit layers may be formed therebetween. Good. Further, as shown in FIG. 18, the shape of the bus bar may be left as it is, and the lower surface side may be simply covered with a resin layer. In addition, a circuit layer can be provided between the layers on the lower surface side. Further, as shown in FIG. 19, the upper surface of the fastened portion and the upper surface of the insulating sheet layer 45 may be flush with each other.

  Alternatively, the relationship between the thicknesses of the resin layers and bus bars is not limited to that shown in the drawing. Instead of the large through hole 21, a screw hole may be formed in the bus bar. Further, for example, the target battery is not limited to the cylindrical battery of the above form. It is not limited to those having terminals at both ends. If the battery has terminals only on one side, the back substrate is not necessary. Then, the bus bar arrangement may be appropriately adjusted according to the shape of the battery and the terminal arrangement.

DESCRIPTION OF SYMBOLS 10 Power supply substrate 20 Bus bar 21 Large through hole 22 Small through hole 25 Signal line 35 Fastened portion 36 Connection portion 41 Core layer 43 Outer core layer 54 Copper foil

Claims (7)

In a metal member built-in substrate in which a metal member is built in an insulating substrate,
The metal member is
Two or more to-be-fastened portions that are exposed on the front and back surfaces of the substrate and that have a first through hole penetrating in the thickness direction;
A connecting portion that is provided between the two or more fastened portions, and at least one surface of which is a concave portion compared to the fastened portion, and is thinner than the fastened portion;
A second through hole penetrating the substrate in the thickness direction at the location of the connecting portion in the metal member is formed;
A metal member-embedded substrate having a wiring pattern that conducts to the metal member through the second through hole. The substrate with a built-in metal member according to claim 1,
The connecting part has a concave part on one side and a flat side on the other side,
The wiring member built-in board according to claim 1, wherein the wiring pattern is provided on a surface of the board on the side having the concave portion. The metal member built-in substrate according to claim 1 or 2,
As the insulating substrate, it has a core layer and an outer core layer,
The core layer is provided only on the outer peripheral side of the metal member,
The outer core layer is provided over the outer peripheral side of the metal member and the inside of the recess. The metal member built-in substrate according to claim 3,
An outer circuit layer further than the outer core layer;
The metal member-embedded substrate, wherein the wiring pattern is formed on the circuit layer. A plurality of unit cells are connected by fastening the terminals of the unit cells to the first through holes of the metal member built-in substrate according to any one of claims 1 to 4. Battery pack. A motor that rotates the wheel by receiving power,
A power supply for supplying power to the motor,
The vehicle according to claim 5, wherein the power supply unit includes the battery pack according to claim 5. An operating unit that operates upon receiving power supply;
A power supply unit for supplying power to the operating unit,
A device comprising the battery pack according to claim 5 in the power supply unit.

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