JP2010217636A - Electrooptical device, method for manufacturing the electrooptical device, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce time and effort in manufacturing and to secure electric reliability than in the conventional manner. <P>SOLUTION: An electrooptical device is equipped with: a first substrate 11; a second substrate 12 which is arranged opposite to the first substrate; an electrooptical material 13 which is arranged between the first and second substrates; an opening 12c which is provided on the second substrate, faces the first substrate, opens within a plane range in which the electrooptical material is not arranged, and penetrates from a surface on the side of the first substrate to the opposite side; a conductive film 29 which is provided on the opposite surface of the second substrate, and extends on the inner surface of the opening in a form that the opening is not blocked; a ground electrode 19 which is provided in a position overlapping in plane at least a part of the opening on the surface of the side of the second substrate on the first substrate, and conductively connected to the outside; and a conductive member 14b which is arranged between the first and second substrates and conductively contacts both of the conductive film and the ground electrode. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electro-optical device, a method for manufacturing the electro-optical device, and an electronic apparatus, and more particularly to a configuration of an electro-optical device in which a conductive film is formed on a substrate.

  As one of the conventional electro-optical devices, a horizontal electric field type liquid crystal device has been attracting attention. This method is a method in which the direction of the electric field applied to the liquid crystal is substantially parallel to the substrate, and has an advantage that the viewing angle characteristic is excellent compared to the TN method or the like. Examples of such a horizontal electric field type liquid crystal device include an IPS (In-Plane Switching) method, an FFS (Fringe Field Switching) method, and the like. In this lateral electric field type liquid crystal device, generally, a liquid crystal is sandwiched between a pair of substrates facing each other, and a pixel electrode and a common electrode are provided on one substrate, and the pixel electrode and the common electrode are interposed between the pixel electrode and the common electrode. A transverse electric field is formed.

  By the way, in the lateral electric field type liquid crystal device, the alignment state of the liquid crystal is controlled by adjusting the lateral electric field applied to the liquid crystal by the pixel electrode and the common electrode formed on one substrate. When a vertical electric field is generated by charging the substrate having no electrodes with the static electricity, the alignment state of the liquid crystal is easily affected, and there is a possibility that an appropriate display mode cannot be obtained. Thus, in order to reduce the influence of static electricity, a structure described in Patent Document 1 below has been proposed.

  In the liquid crystal display device described in Patent Document 1, a conductive film such as an adhesive layer in which conductive fine particles are dispersed or an ITO film formed by sputtering is formed between an upper substrate and a polarizing plate. The conductive film is grounded to form a shield against external static electricity. For this reason, since it becomes difficult for the conductive film to be charged with static electricity by the conductive film, it is said that the display mode can be prevented from being abnormal.

Japanese Patent No. 2758864 JP 2009-008971 A

  In the above-mentioned Patent Document 1, as a configuration for grounding the conductive film, the conductive film on the upper substrate and the ground terminal on the lower substrate are conductively connected using a cable at the side of the display region. The conductive film is grounded. However, in this configuration, since the cable connecting the conductive film and the ground terminal needs to be conductively connected to the conductive film and the ground terminal in the vicinity of the end portion of the board, it is necessary to secure a cable connection area on each board. Therefore, it is difficult to make the device compact, and the conductive connection structure is exposed to the outside, so that a process for ensuring reliability is required, and the complicated work of connecting both ends of the cable at the time of manufacture is required. Need

  Further, as shown in FIGS. 12 and 13, a liquid crystal display is formed by enclosing liquid crystal between a lower substrate 1 having a polarizing plate 7 attached and an upper substrate 2 having a polarizing plate 8 attached. In the panel structure, a method of applying a conductive paste 5 from the conductive film 3 on the upper substrate 2 to the ground electrode 4 on the lower substrate 1 is also known. However, in this structure, since the conductive paste 5 is exposed to the outside, it takes time until the conductive paste 5 is cured, so that the manufacturing efficiency is reduced and the flexible wiring board 6 and the like are also reduced. There are problems in manufacturing and reliability, such as the possibility that the conductive paste 5 adheres to the components and the conductive paste 5 may be cut at the corners 2a of the upper substrate 2. Even in this structure, since it is necessary to secure the conductive connection portion between the conductive film 3 and the conductive paste 5 on the upper substrate 2 as described above, it is difficult to make the apparatus compact.

  Further, instead of the above configuration, a through hole is formed at the end of the upper substrate, and the conductive layer is filled with the conductive paste, whereby the conductive layer is formed on the lower substrate through the conductive paste. There has also been proposed an electro-optical device that employs a structure that is conductively connected to an electrode for use (see Patent Document 2).

  In the structure and the manufacturing method described in Patent Document 2, the conductive paste is filled in the through holes in the conductor arranging step after the electro-optical panel is formed. However, in this process, it is necessary not only to fill the fine through-holes with the conductive paste but also to make sure that the grounding electrode in the back of the through-holes is in contact with each other. There is a risk of lowering reliability and reliability.

  The structure for preventing the influence of the electric field due to static electricity as described above is not limited to the above-described lateral electric field type electro-optical device, but is an effective means for reducing the influence of the external electric field. On the other hand, it can be used in common for various electro-optical devices that are operated by applying an electric field.

  SUMMARY OF THE INVENTION The present invention solves the above-described problems, and is to realize an electro-optical device that can reduce labor during manufacturing and can ensure electrical reliability.

  In view of such circumstances, the electro-optical device of the present invention includes a first substrate, a second substrate disposed to face the first substrate, the first substrate, and the second substrate. An electro-optical material disposed between the first substrate and the second substrate, facing the first substrate and opening in a plane area where the electro-optical material is not disposed; An opening penetrating from the surface of the second substrate to the opposite surface, and a conductive film provided on the opposite surface of the second substrate and extending on the inner surface of the opening in a manner not closing the opening A grounding electrode provided on the surface of the first substrate on the second substrate side at a position overlapping with at least a part of the opening and conductively connected to the outside, and the first substrate Between the substrate and the second substrate, the conductive film and the grounding electrode are both Characterized by comprising a conductive material in contact electricity, the.

  According to the present invention, the conductive film formed on the surface of the second substrate opposite to the first substrate is configured to extend on the inner surface of the opening, and the second substrate When the conductive material is in conductive contact with the grounding electrode and the conductive film disposed in a position overlapping with at least a part of the opening on the substrate side surface of the substrate, the conductive film is connected to the grounding electrode via the conductive material. Therefore, the influence on the electro-optical material due to the charging of the second substrate can be reduced. In addition, since the conductive film is formed on the inner surface of the opening in a manner that does not close the opening, the conductive material can easily come into contact with the conductive film in the opening, so that a sufficient conductive contact state can be obtained. Therefore, since the conductive film can be grounded by simply sandwiching the conductive material between the first substrate and the second substrate, it is possible to reduce labor during manufacturing as compared with the conventional method and to provide electrical reliability. Can be increased.

  Here, the conductive material is not limited to a material made of only a conductive material, but, for example, a conductive particle and a ground electrode are conductively connected as a result, such as a conductive particle dispersed in an insulating material. As long as it can be used, it is not particularly limited to the mode exemplified in the embodiments described later. The conductive film is preferably configured to reach the opening edge of the surface of the opening on the first substrate side. Thereby, the conductive contact between the conductive film and the conductive material can be realized more easily and reliably.

  In one aspect of the present invention, the conductive film is formed on the entire inner surface of the opening and reaches the entire circumference of the opening edge of the opening on the first substrate side. According to this, since the cross-sectional area of the part which passes the inside of an opening part among electrically conductive films can be ensured large, the electrical resistance of the said part can be reduced. Further, since the conductive film is formed on the entire periphery of the opening edge, the contact area between the conductive film and the conductive material can be increased, so that a conductive contact state between the two can be obtained more reliably and reliably.

  In another aspect of the present invention, the conductive film has a portion that protrudes from the opening edge of the opening on the first substrate side of the second substrate. According to this, since the conductive film has a portion protruding from the opening edge to the periphery, it is possible to more easily and reliably obtain a conductive contact state with the conductive material, and it is also possible to increase the conductive contact area. .

  Another electro-optical device of the present invention is disposed between a first substrate, a second substrate disposed to face the first substrate, and the first substrate and the second substrate. The electro-optic material is provided on the second substrate, faces the first substrate and opens in a plane area where the electro-optic material is not disposed, and is opposite from the surface on the first substrate side. An opening penetrating to the side surface, and an opening on the first substrate side provided on the opposite surface of the second substrate and over the inner surface of the opening portion in a manner that does not close the opening portion A conductive film extending from the edge to the periphery and a surface of the first substrate on the second substrate side are provided at a position that overlaps with at least a part of the conductive film extending to the periphery in a plane. A ground electrode electrically conductively connected between the first substrate and the second substrate; Is arranged, characterized by comprising a conductive material conductively contact with the ground electrode while a conductive contact with the portion projecting from the opening edge of the conductive film.

  According to the present invention, the conductive film formed on the surface of the second substrate opposite to the first substrate projects from the opening edge on the first substrate side to the periphery through the inner surface of the opening. A ground electrode provided at a position overlapping with at least a part of the projecting portion of the surface of the first substrate on the second substrate side, and a projecting portion of the conductive film. When the conductive material comes into conductive contact, the conductive film is conductively connected to the grounding electrode via the conductive material, so that it is possible to reduce the influence on the electro-optical material due to charging of the second substrate. In addition, the conductive film formed on the opposite surface of the second substrate has a portion that passes over the inner surface of the opening and projects onto the surface of the first substrate without blocking the opening. Therefore, a sufficient conductive contact state can be obtained only by interposing a conductive material between the protruding portion and the grounding electrode. Therefore, since the conductive film can be grounded by simply sandwiching the conductive material between the first substrate and the second substrate, it is possible to reduce labor during manufacturing as compared with the conventional method and to provide electrical reliability. Can be increased.

  In the present invention, it is preferable that the conductive material is disposed inside a sealing material formed in a frame shape surrounding the electro-optical material between the first substrate and the second substrate. According to this, since the conductive material can be stabilized by disposing the conductive material inside the sealing material disposed between the first substrate and the second substrate, the stability of the conductive connection state In addition, it is possible to increase electrical reliability, and it is possible to reduce labor during manufacturing in the sealing material placement process and the substrate bonding process.

  In this case, in the sealing material, a plurality of the conductive particles having a diameter corresponding to a substrate interval between the first substrate and the second substrate are dispersedly arranged in the insulating material as the conductive material. More preferably, According to this, it is possible to reliably obtain a conductive connection state in the direction along the distance between the first substrate and the second substrate and to ensure insulation in the planar direction.

  In the present invention, the conductive material is preferably a conductive paste. According to this, since the conductive contact is performed in a state of being flexibly deformed according to the opening and the surface shape of the conductive film, it is possible to further improve the stability and certainty of the conductive connection state.

  In this invention, it is preferable that the said opening edge of the surface on the said opposite side of the said opening part is comprised by inclined surface shape. By making the opening edge of the surface on the opposite side of the opening into an inclined surface, the contact area between the conductive film and the conductive material on the opening edge can be increased and the stability of the contact state can be improved. In addition, when the conductive film has a portion protruding around the opening edge, it is possible to reliably obtain a conductive connection state between the portion formed on the inner surface of the opening and the portion protruding to the periphery of the conductive film. it can. Here, the opening edge is configured to have an inclined surface shape, in which the corner of the opening edge is formed in a chamfered or rounded shape, so that the gap between the inner surface of the opening and the opposite surface is formed. In addition, an inclined surface (not a flat surface or a curved surface) having an intermediate surface orientation different from any of the surface orientations of both surfaces is provided.

  In this invention, it is preferable that the opening edge of the said one side surface of the said opening part is comprised by inclined surface shape. By configuring the opening edge of the surface on one side of the opening to be an inclined surface, the conductivity between the portion on the surface on one side of the second substrate and the portion on the inner surface of the opening of the conductive film. Since the connection state can be obtained reliably, the electrical reliability can be further improved. Here, the opening edge is configured to have an inclined surface shape by forming the corner portion of the opening edge in a chamfered or rounded manner, so that the gap between the inner surface of the opening and the one side surface is formed. In addition, an inclined surface (not a flat surface or a curved surface) having an intermediate orientation different from any of the surface orientations of both surfaces is provided.

  In a different aspect of the present invention, the first substrate has a substrate protruding portion that protrudes outward from the end portion of the second substrate, and the opening is provided at the end portion of the second substrate. The grounding electrode extends from the region overlapping the second substrate in a planar manner onto the substrate overhanging portion, and the conductive material is a region overlapping the second substrate of the grounding electrode in a planar manner. Are in conductive contact. According to this, since the conductive material is in conductive contact with the conductive film and the grounding electrode in the region overlapping the second substrate, the conductive material can be provided in a compact manner. In addition, since the ground electrode extends on the substrate overhanging portion, the ground electrode can be easily connected to a wiring or the like to which a ground potential is supplied. Here, it is preferable that the conductive material and the grounding electrode are arranged in a region overlapping with the opening in a plane, and the conductive film, the conductive material, and the grounding electrode are in conductive contact in the region.

  In a further different aspect of the present invention, the first substrate is provided with both a pixel electrode and a common electrode for applying a lateral electric field along the first substrate to the electro-optic material. The pixel electrode and the common electrode are not provided on the substrate. According to this, when both the pixel electrode and the common electrode are provided on the first substrate, it is not necessary to provide the electrode on the second substrate, but the second substrate on which no electrode is provided. Is charged, the lateral electric field changes due to the charging of the second substrate, and the effect of the electro-optical material is greatly affected. Therefore, in the case of the above configuration, the effect of the present invention is particularly high.

  Next, a method for manufacturing an electro-optical device according to the present invention includes a first substrate, a second substrate disposed to face the first substrate, the first substrate, and the second substrate. An electro-optic device comprising an electro-optic material disposed between the step of forming an opening in the second substrate from one surface to the opposite surface; Forming a conductive film extending on the inner surface of the opening from the opposite surface of the second substrate by depositing a material; on one surface of the first substrate; A step of forming a grounding electrode which is provided at a position overlapping with at least a part of the opening in a planar manner and is conductively connected to the outside; and the one side surface of the first substrate and the second substrate A conductive material is interposed between the one side surfaces so that the conductive material is in conductive contact with the conductive film and the grounding electrode. And forming a panel structure in which the one side surface of the first substrate and the one side surface of the second substrate are arranged to face each other with the electro-optic material interposed therebetween. Features.

  In the present invention, the step of forming the conductive film includes a step of depositing a first conductive film from the opposite surface side of the second substrate to the opposite surface and the inner surface of the opening. And a second step of depositing a second conductive film on the inner surface of the opening from the one side of the second substrate, the first conductive film and the first The conductive film is preferably formed by conductively connecting the two conductive films inside the opening. Here, either the first stage or the second stage may be performed first. According to this, a conductive path that reaches the opening edge on the opposite side from one surface can be reliably formed on the inner surface of the opening as a part of the conductive film.

  According to another electro-optical device manufacturing method of the present invention, a first substrate, a second substrate disposed to face the first substrate, the first substrate, and the second substrate are provided. An electro-optic material disposed between the first substrate and the second substrate, the step of forming an opening penetrating from one surface to the other surface; Forming a conductive film that passes from the surface on the opposite side of the second substrate to the periphery of the opening edge of the one surface by applying a conductive material; And a step of forming a grounding electrode that is provided on a surface of one side of the first substrate so as to planarly overlap at least a part of the conductive film projecting to the periphery and is electrically connected to the outside. A conductive material is interposed between the one side surface of the first substrate and the one side surface of the second substrate. The surface of the one side of the first substrate and the second substrate are in conductive contact with the portion of the conductive film that protrudes around the opening edge of the conductive film and the grounding electrode. Forming a panel structure in which the one side surface of the substrate is opposed to the electro-optical material.

  In the present invention, the step of forming the conductive film includes a step of depositing a first conductive film from the opposite surface side of the second substrate to the opposite surface and the inner surface of the opening. And a second step of depositing a second conductive film from the one side surface side of the second substrate to the peripheral portion of the opening edge of the one side surface and the inner surface of the opening portion. Preferably, the conductive film is formed by conductively connecting the first conductive film and the second conductive film inside the opening. Here, either the first stage or the second stage may be performed first. According to this, a conductive path that reaches the opening edge on the opposite side from one surface can be reliably formed on the inner surface of the opening as a part of the conductive film.

  In the manufacturing method of the present invention, in the step of forming the opening, it is preferable that the opening edge of the surface on the opposite side of the opening is configured to be inclined. Moreover, it is desirable that the opening edge of the one side surface of the opening is also configured to be inclined.

FIG. 3 is an enlarged partial longitudinal sectional view illustrating a part of the electro-optical device according to the first embodiment in an enlarged manner. 1 is a schematic perspective view illustrating an overall configuration of an electro-optical device according to a first embodiment. FIG. 3 is an enlarged plan view illustrating a pixel structure of the electro-optical device according to the first embodiment. FIG. 3 is an enlarged longitudinal sectional view showing a pixel structure of the electro-optical device according to the first embodiment. Enlarged partial longitudinal sectional views (a) and (b) showing an enlarged conductive connection portion of the electro-optical device of the second embodiment. Enlarged partial longitudinal sectional views (a) and (b) showing another conductive connection portion of the electro-optical device of the second embodiment in an enlarged manner. An enlarged partial longitudinal sectional view (a) showing an enlarged conductive connecting portion of the electro-optical device according to the third embodiment and an enlarged partial longitudinal sectional view (b) showing an enlarged conductive connecting portion of the electro-optical device according to the fourth embodiment. ). An enlarged partial vertical sectional view (a) showing an enlarged part of the electro-optical device according to the fifth embodiment and an enlarged partial vertical sectional view (b) showing an enlarged conductive connection part of the electro-optical device according to the sixth embodiment. . FIG. 3 is a schematic plan view schematically showing a panel structure of the electro-optical device according to the first embodiment. 10 is a schematic flowchart schematically showing a method for manufacturing an electro-optical device according to a seventh embodiment. Schematic sectional drawing (a) and (b) which respectively show the manufacturing process of 7th Embodiment. The schematic sectional drawing showing the manufacturing process of a 7th embodiment. FIG. 6 is a schematic perspective view schematically showing an overall configuration of a conventional electro-optical device. FIG. 6 is a schematic partial longitudinal sectional view showing an enlarged part of a conventional electro-optical device. The perspective view which shows the external appearance of an electronic device. The schematic block diagram which shows the structure of the display control system of an electronic device.

  Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[First embodiment]
FIG. 1 is a schematic sectional view schematically showing a part of the configuration of the electro-optical device according to the first embodiment of the present invention, and FIG. 2 is a schematic perspective view showing the overall configuration of the electro-optical device. The electro-optical device according to this embodiment includes a panel structure 10P in which a first substrate 11 and a second substrate 12 are disposed to face each other, and a liquid crystal 13 that is an electro-optical material is disposed therebetween. The panel structure 10P includes a frame-shaped sealing material 14 for bonding the first substrate 11 and the second substrate 12, and the liquid crystal 13 is sealed inside the sealing material 14. Yes.

  On a surface on one side of the first substrate 11 (a surface on the second substrate 12 side, hereinafter simply referred to as “inner surface”) 11 a, an inner surface structure 110 described later is formed inside the sealing material 14. A grounding electrode 19 made of ITO (indium tin oxide) or a metal material is formed on the inner surface 11a. The grounding electrode 19 extends from a region where the first substrate 11 overlaps with the second substrate 12 in a plane (in the illustrated example, a region where the sealing material 14 is formed) to the second substrate 12 of the first substrate 11. It is configured to extend toward the outside of the sealing material 14 up to the substrate overhanging region 11 </ b> T that projects outward from the end of the substrate. The grounding electrode 19 is provided in a region where the first substrate 11 overlaps the second substrate 12 in a plane, particularly at a position where the first substrate 11 overlaps at least a part of an opening 12c described later. Composed.

  An inner surface structure 120 to be described later is formed on the inner surface of the sealing material 14 on one surface of the second substrate 12 (a surface on the first substrate 11 side, hereinafter simply referred to as “inner surface”) 12 a. Further, in the end portion of the second substrate 12 and in a region overlapping with the sealing material 14 in a plane, a surface opposite to the inner surface 12a from the inner surface 12a (hereinafter simply referred to as “outer surface”). An opening 12c that penetrates to 12b is provided. The opening 12c is shown as a hole having a circular opening cross section in the illustrated example. However, the shape of the opening cross section is arbitrary, and for example, the opening 12c may be a square hole having a polygonal opening cross section. The opening 12c may be a notch-like opening opened at the end of the second substrate 12 instead of the hole shown in the example of the drawing.

  A conductive film 29 made of a transparent conductor such as ITO is formed on the outer surface 12 b of the second substrate 12. The conductive film 29 is formed so as to cover at least the entire effective display area A, which will be described later, on the outer surface 12 b of the second substrate 12. The conductive film 29 is conductively connected to the outer portion 29a formed on the outer surface 12b and the outer portion 29a across the opening edge 12e on the outer surface 12b side of the opening 12c, and the inner surface of the opening 12c. And an inner passage portion 29b formed on the inner surface 12d. In the illustrated example, the inner passage portion 29b reaches from the inner surface 12d to the opening edge 12f on the inner surface 12a side of the opening 12c. Further, in the illustrated example, the conductive film 29 is electrically connected to the inner passage portion 29b beyond the opening edge 12f, and includes an inner projecting portion 29c projecting on the inner surface 12a around the opening edge 12f. . The inner passage portion 29b is formed so as not to close the opening 12c. As a result, the inner passage portion 29b is hollow.

  The sealing material 14 is configured in a frame shape (in the illustrated example, a rectangular frame shape) so as to surround the liquid crystal 13. As shown in FIG. 1, the sealing material 14 is in conductive contact with the inner passage portion 29b and the inner overhang portion 29c of the conductive film 29 in a portion overlapping the opening 12c in a plan view. In the case of the illustrated example, the sealing material 14 is obtained by mixing conductive particles 14b in an insulating resin (for example, thermosetting resin) 14a. The conductive particles 14b are connected to the conductive film 29 and the ground electrode 19. Both are in conductive contact. The sealing material 14 is fitted into the opening 12c, and a part of the second substrate 12 side enters into the opening 12c within a range not exceeding the thickness of the second substrate 12. It has become. In the case of the illustrated example, the sealing material 14 covers the entire opening 12c from the inside, whereby the cavity inside the opening 12c is completely closed from the inside.

  A polarizing plate 17 is attached on the surface of the first substrate 11 opposite to the second substrate 12 (hereinafter simply referred to as “outer surface”) 11b, and covers the entire effective display area A. . In addition, a polarizing plate 18 is stuck on the outer surface 12 b of the second substrate 12 to cover the entire effective display area A. In the case of the illustrated example, the opening 12c is completely covered from the outside by the polarizing plate 18, whereby the cavity inside the opening 12c is completely closed from the outside.

  As shown in FIG. 2, the opening 12c is provided at a corner of the second substrate 12 (two corners on the substrate overhanging portion 11T side of the first substrate 11). Since the corners are less likely to deform the first substrate 11 and the second substrate 12 than other parts, the openings 12c are formed in the corners of the second substrate 12 as described above. In addition, since it is difficult for deformation stress to be applied to the conductive connection portions of the conductive film 29, the conductive material (conductive particles) 14b, and the grounding electrode 19, a stable conductive connection state can be ensured and electrical reliability can be improved. Become.

  As shown in FIG. 2, a plurality of display-side wirings 112p, 113p, and 116p led out from the effective display area A together with the grounding electrode 19 extend on the substrate overhanging portion 11T of the first substrate. ing. These display-side wirings 112p, 113p, and 116p are conductively connected to a drive IC 150 that constitutes a drive circuit mounted on the central portion of the substrate extension portion 11T. A plurality of input-side wirings 118p are formed on the substrate overhanging portion 11T, and these input-side wirings 118p are formed by the drive IC 150 and a flexible wiring board mounted on the edge of the substrate overhanging portion 11T. The wiring member 170 is connected. A connection connector 173 to the main body of the electronic device is formed at the tip of the wiring member 170. Here, although the connection connector 173 is disposed on the side in the width direction of the board extending portion 11T, the present invention does not particularly limit the shape of the wiring member 170 in any way.

  This embodiment includes the panel structure 10P that constitutes the liquid crystal display using the liquid crystal 13 as the electro-optical material as described above. However, the present invention can be applied not only to the liquid crystal display but also to various electro-optical devices that are meaningful to reduce the influence of static electricity due to the conductive film 29, such as an electrophoretic display and an organic EL display.

  In addition, the present embodiment has the panel structure 10P constituting the liquid crystal display as described above. Among various liquid crystal displays, the liquid crystal display according to the horizontal electric field method such as the IPS method and the FFS method is used. Since this embodiment has a high effect when applied, an FFS structure will be described below as a configuration example of the panel structure 10P of the present embodiment.

  FIG. 9 is a schematic plan view showing the overall configuration of the panel structure 10P of the present embodiment. In the present embodiment, an effective display area A is provided inside the sealing material 14, and a large number of subpixels SG are arranged in a matrix in the effective display area A vertically and horizontally. In the effective display area A, a plurality of data lines 116 extend in parallel in a direction from the substrate extension portion 11T toward the opposite side in the arrangement direction of the sub-pixels SG. In the effective display area A, a plurality of gate lines 112 and common lines 113 extend in parallel in a direction orthogonal to the data lines 116. In the effective display area A, the sub-pixels SG are respectively formed in planar areas surrounded by the data lines 116, the gate lines 112, and the common lines 113 that are configured in a lattice shape as a whole.

  In the liquid crystal device 10 of the present embodiment, as shown in FIG. 1, the first inner surface structure 110 is formed on the inner surface 11 a of the first substrate 11, and the second inner surface is formed on the inner surface 12 a of the second substrate 12. A structure 120 is formed. The first inner surface structure 110 and the second inner surface structure 120 define each of the sub-pixels SG, and can apply an independent electric field to the liquid crystal 13 in each sub-pixel SG. In the case of configuring a display body capable of color display in the present embodiment, as shown in FIG. 3, filter layers Gr, Gg, Gb of different colors are arranged as will be described later as a plurality of adjacent subpixels SG. The plurality of sub-pixels SG formed as a set constitutes a pixel (pixel; picture element) G.

  As shown in FIGS. 3 and 4, the first inner surface structure 110 includes a gate line 112 and a common line 113 formed on the first substrate 11 with a base insulating layer 111 interposed therebetween, and a conductive line connected to the common line 113. Data that extends in a direction in which the connected common electrode 114, the semiconductor layer 115 such as silicon disposed above the gate line 112 via the gate insulating film 112a, and the gate line 112 and the common line 113 intersect. A source electrode 116a that is conductively connected to the line (source line) 116, the data line 116, and conductively connected to the semiconductor layer 115; and a channel region of the semiconductor layer 115 (a part of the gate line 112) with respect to the source electrode 116a. A drain electrode 116b that is conductively connected to the semiconductor layer 115 across an active region facing a portion to be an electrode), and the drain electrode 116b Together conductively connected, they are arranged to overlap in a plane through the common electrode 114 and the insulating layer 119, and a pixel electrode 117 having an opening 117a in a range planarly overlapping the common electrode 114. Note that the first pixel structure 110 also includes the alignment film 16 described above.

  The gate electrode portion of the gate line 112, the gate insulating film 112a, the semiconductor layer 115, the source electrode 116, and the drain electrode 116b constitute a TFT (thin film transistor) that is a switching element provided for each pixel G, and the potential of the gate line 112 Thus, the potential of the data line 116 is supplied to the pixel electrode 117 through the TFT which is controlled to be turned on / off by. When a potential difference is applied between the common electrode 114 and the pixel electrode 117, a lateral electric field is formed along the surface of the first inner surface structure 110 through the opening 117 a of the pixel electrode 117, and this is applied to the liquid crystal 13. The

  On the other hand, in the second inner surface structure 120, a light shielding film 121 made of Cr, Cr alloy or the like is formed on the second substrate 12, and a non-formation region of the light shielding film 121 defines a sub-pixel SG. The formation region of the light shielding film 121 forms the inter-pixel region H. Further, a color filter 122 is formed thereon. The color filter 122 is an array of filter layers having colors corresponding to the sub-pixels SG. In the illustrated example, a pixel Gr having a red filter layer, a pixel Gg having a green filter layer, and a pixel Gb having a blue filter layer are sequentially arranged. Examples of the arrangement pattern of these filter layers include a stripe arrangement and an oblique mosaic arrangement in the case of the present embodiment. The boundary between the filter layers of each color is disposed in the inter-pixel region H where the light shielding film 121 is provided. The second inner surface structure 120 also includes an alignment film 123.

  As shown in FIG. 9, the gate line 112 is drawn on the substrate extension region 11T to become the display wiring 112p, and the common line 113 is also drawn on the substrate extension region 11T to become the display wiring 113p. The data lines 116 are drawn onto the substrate overhanging region 11T to form the display wirings 116p, which are conductively connected to the driving IC 150, respectively. The input wiring 118p is conductively connected to the driving IC 150 and the wiring member 170, and is conductively connected to a plurality of main wiring patterns 171 provided on the wiring member 170. The ground side electrode 19 is conductively connected to a ground wiring pattern 172 provided on the wiring member 170.

The description will be continued with reference to FIGS. 1 and 2 again. In the present embodiment, the outer portion 29 a of the conductive film 29 completely covers at least the effective display area A of the second substrate 12. In order to allow light to be emitted from the effective display area A, the outer portion 29a of the conductive film 29 has translucency, preferably transparency. Examples of the material constituting the outer portion 29a of the conductive film 29 include transparent conductors such as ITO and SnO ₂ . The outer portion 29a is formed so as to reach at least a part of the opening edge 12e of the opening 12c outside the effective display area A. The opening 12c of the second substrate 12 is formed outside the effective display area A and outside the plane area where the electro-optic material such as the liquid crystal 13 is arranged.

  In the present embodiment, the position where the opening 12c is formed is outside the plane range where the electro-optical material is arranged, and overlaps the area where the sealing material 14 is arranged in a plane. This is because the conductive material of the present embodiment is the conductive particles 14 b disposed inside the sealing material 14. However, in general, the position where the opening 12c is formed may be arranged on the outer side of the sealing material 14, and the conductive material may be provided on the outer side of the sealing material 14. In the illustrated example, the sealing material 14 is formed by dispersing the conductive particles 14b in the insulating resin 14a. However, for example, the sealing material 14 may be made of a conductive material such as a conductive paste. In this case, as shown in FIG. 9, an insulating layer 14x for insulating the various wirings 112p, 113p, and 116p is formed.

  In the most preferred embodiment, the outer portion 29a is provided so as to cover the entire opening edge 12e of the opening 12c. In this case, the inner passage portion 29b is also preferably configured to cover the entire inner surface 12d of the opening 12c. In this way, the outer portion 29a and the inner passage portion 29b of the conductive film 29 are conductively connected over the entire circumference of the opening edge 12e, so that the electrical resistance of the portion of the conductive film 29 can be reduced. . In addition, the aspect which carries out conductive connection through the electrically conductive film formed in the whole inner surface 12d of the opening part 12c as mentioned above reduces an electrical resistance by ensuring a conductive contact area, comprising a conductive connection part compactly. The above configuration is preferable.

  Note that it is not necessary that all the conductive films 29 are integrally formed of the same material. For example, the outer portion 29a, the inner passage portion 29b, and the inner overhang portion 29c may be formed of different materials. For example, any part may be made of a material different from other parts. For example, typically, the portion in the effective display area A may be made of a transparent conductor, and the portion other than the effective display area A may be made of a metal material. Further, regardless of whether the entire conductive film 29 is formed of the same material or two or more different materials, the conductive film 29 may be formed in a single process, or It may be formed by two or more steps.

  In the present embodiment, various modes of conductive contact between the conductive film 29 and the conductive particles 14b can be considered in the positional relationship with the opening 12c. In the illustrated example, the conductive particles 14b are arranged at a position overlapping with at least a part of the opening 12c in a plane, and the conductive particles 14b are in conductive contact with the inner passage portion 29b and the inner overhang portion 29c. At this time, since the inner passage portion 29b and the inner overhang portion 29c are formed over the entire circumference of the opening edge 12f of the opening 12c, a conductive contact state with the conductive particles 14b can be reliably obtained. Here, it is electrically connected that the conductive particles 14b are disposed in a position overlapping the entire opening region of the opening 12c in a planar manner and are in conductive contact with the conductive film 29 formed on the entire circumference of the opening edge 12f. It is preferable for reducing the resistance. However, it is not always easy to dispose the conductive particles 14b included in the sealing material 14 at a position that exactly coincides with the opening 12c in a plan view. In this case, when the conductive material is formed of a material that can be regarded as a homogeneous conductor such as a conductive paste described later, it is possible to easily arrange the conductive paste so as to include a range that overlaps the opening 12c in a plane. .

  In the present embodiment configured as described above, the opening portion 12c is provided in the second substrate 12, and the inner passage portion of the conductive film 29 formed on the inner surface 12d of the opening portion 12c and reaching the opening edge 12f. 29b and an inner projecting portion 29c further projecting from the inner passage portion 29b are in conductive contact with the conductive particles 14b which are the conductive material of the sealing material 14, and the conductive particles 14b are further in conductive contact with the grounding electrode 19. Yes. Therefore, the conductive film 29 provided on the second substrate 12 is conductively connected to the grounding electrode 19 through the conductive particles 14b in the sealing material 14 which is a conductive material, so that the second conductive film 29 is electrically connected to the second electrode due to external static electricity or the like. It is possible to prevent the substrate 12 from being charged, thereby avoiding abnormalities in the electric field in the effective display area A and optimizing the display mode.

  Further, since the grounding electrode 19 includes a region that overlaps at least a part of the opening 12c in a plan view, the grounding electrode 19 and the grounding electrode 19 can be grounded only by placing a conductive material as the conductive particles 14b therebetween. The electrode 19 can be easily and reliably conducted.

  In particular, the outer portion 29a of the conductive film 29 formed on the outer surface 12b of the second substrate 12 passes through the opening 12c and is disposed between the first substrate 11 and the second substrate 12. Since the conductive connection is made to the material (conductive particles 14b), the conductive connection structure is not exposed to the outside as in the conventional conductive connection structure shown in Patent Document 1 and FIGS. Since the second substrate 12 passes through the opening 12c and is grounded via the conductive material between the first substrate 11 and the second substrate 12, the possibility of disconnection can be reduced and the apparatus can be made compact. It becomes possible.

  Further, in the present embodiment, as described in the conventional patent document 2, in order to ground the conductive film, a conductive material such as a conductive paste is made to reach the first substrate further through the through hole of the second substrate. There is no need to conduct the conductive material disposed between the first substrate 11 and the second substrate 12 to the conductive film 29 on the opening edge of the opening 12c provided on the second substrate 12 or on the periphery thereof. Since only the contact is sufficient, the conductive connection structure can be easily formed and the electrical reliability can be improved.

  Further, in the present embodiment, the sealing material 14 is disposed at a position overlapping the opening 12c in a plane, and a part of the sealing material 14 extends from the opening edge 12f to the inside of the opening 12c. Since the conductive film 29 and the conductive particles 14b are in conductive contact in a manner that does not exceed the thickness, the conductive connection structure can be easily realized and the conductive connection state can be stabilized, and the electrical reliability can be improved. Further improvement is possible.

  In the present embodiment, an inner passage portion 29b, which is a part of the conductive film 29, is formed on the inner surface 12d of the opening portion 12c. The inner passage portion 29c does not close the opening portion 12c, that is, the inner passage portion. Even if the portion 29c is formed, a passage (cavity) from the inner surface 12a to the outer surface 12b is secured inside the opening 12c. This also makes it possible to configure the conductive material such as the conductive particles 14b to be in direct conductive contact with the inner passage portion 29b. This is particularly useful when using a conductive material that can enter the opening 12c, such as a conductive paste, within a range not exceeding the thickness of the second substrate 12, as will be described later. In this case, it is not necessary to provide the inner overhanging portion 29c in the conductive film 29, and it is sufficient if the inner passage portion 29b is formed to a certain degree close to the inner surface 12a.

  Further, in the illustrated example, a part of the sealing material 14 enters the inside of the opening 12c. However, this stabilizes the conductive contact state between the conductive film 29 and the conductive particles 14b, and the electrical reliability. Can be increased. However, it is preferable that the sealing material 14 is configured so that the inside of the opening 12c is not completely filled, that is, the cavity remains in the opening 12c (at least at the upper part). In particular, it is desirable that the sealing material 14 that has entered the opening 12c is configured not to protrude outward at least from the opening edge 12e on the outer surface 12b side.

[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to FIG. Since the second embodiment is the same as the first embodiment except for the cross-sectional shape of the opening 12c, the same portions are denoted by the same reference numerals, and the description thereof is omitted.

  In the present embodiment, the opening edges 12e and 12f of the opening 12c in the first embodiment are formed in an inclined surface shape. Here, the opening edges 12e 'and 12f' shown in FIG. 5 (a) have the same shape as when rounded, and the opening edges 12e "and 12f" shown in FIG. 5 (b) are chamfered. It is made into the same shape as. Here, the inclined shape means an inclination having an intermediate inclined surface orientation different from the orientation of any surface at the opening edge between the outer surface 12b or inner surface 12a of the second substrate 12 and the inner surface 12d of the opening 12c. Say that a surface will be provided. Here, the inclined surface does not need to be flat, and may have a curved surface shape (convex curved surface shape) whose orientation changes as shown in FIG.

  Further, as shown in FIG. 6 (a), the inner surface 12d 'may be an inclined surface over the entire axial direction in such a manner that the opening 12c' expands from the outer surface 12b side toward the inner surface 12a side. On the contrary, as shown in FIG. 6 (b), the inner surface 12d ″ is inclined over the entire axial direction in such a manner that the opening 12c ″ expands from the inner surface 12a toward the outer surface 12b. It may be a surface. That is, the inner surfaces 12d ′ and 12d ″ may be inclined surfaces extending from one of the outer surface 12b and the inner surface 12a to the other.

  In the example shown in FIG. 6, the opening edges 12g, 12g ′, 12h, and 12h ′ are shown in a rounded state. However, the present invention is not limited to this, and the chamfered shape may be used. Such an inclined surface may not be provided.

  By providing the inclined edges 12e ′, 12e ″, 12f ′, 12f ″,... As described above, the conductive film 29 can be easily formed on the opening edges. 29a or the inner overhanging portion 29c and the inner passage portion 29b can be easily secured, so that it is possible to prevent the occurrence of disconnection in the conductive path passing through the inside of the opening 12c, and to improve electrical reliability. Can be increased.

  In particular, when the conductive film 29 is formed by the method of depositing from the outside and the inside as will be described later, the material of the conductive film 29 is made of the opening 12c by providing the opening edge having the inclined surface as described above. Since it becomes easy to enter the inside, the inner passage portion 29b of the conductive film 29 can be reliably formed. In the above configuration, only one of the opening edge on the inner surface 12a of the opening 12c and the opening edge on the outer surface 12b may be formed in an inclined surface shape as described above. Moreover, the above structure of this embodiment is applicable also to other embodiment in this specification.

  In the present embodiment, the sealing material 14 easily enters the inside of the opening 12c by the opening edges 12f ′ and 12f ″, so that the stability of the sealing material 14 with respect to the opening 12c is improved. There is also an effect that the reliability of the conductive contact state of the conductive particles 14b can be increased.

“Third Embodiment”
Next, a third embodiment according to the present invention will be described with reference to FIG. In this embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. This embodiment is the same as the previous first and second embodiments in that the opening 12c and the sealing material 14 'are arranged at a position where they overlap in a plane. However, a conductive material 14c such as a conductive paste is disposed in a region overlapping the opening 12c in the inside of the sealing material 14 'made of an insulating material such as an insulating resin, and the conductive material 14c is an opening of the opening 12c. The difference is that the conductive film 29 (the inner passage portion 29b and the inner overhang portion 29c) on the edge 12f is in conductive contact.

  In this embodiment, the conductive material 14c is disposed over the entire area overlapping the opening 21c in a plane, and the conductive material 14c is in conductive contact with the conductive film 29 on the opening edge 12f over the entire circumference, so that the electrical resistance is reduced. The electrical reliability can be improved because the conductive connection state can be obtained with certainty while being reduced. In the illustrated example, the conductive material 14c is made of a conductive paste, and a part of the conductive material 14c enters the opening 12c within a range not exceeding the thickness of the second substrate 12. 29, the stability of the conductive connection portion between the conductive material 14c and the conductive material 14c is improved, and the conductive contact area is further increased.

  As described above, the configuration in which the conductive material is in direct conductive contact with the inner passage portion 29b described in the first embodiment and the point that the inner overhang region 29c does not have to be provided are the same in this embodiment. The same applies to the second embodiment and the sixth embodiment described later.

[Fourth Embodiment]
Next, a fourth embodiment according to the present invention will be described with reference to FIG. In this embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. This embodiment is the same as the first embodiment in that the sealing material 14 includes conductive particles 14b in the insulating material 14a. However, the difference is that the opening 12c is disposed at a position where it does not overlap the sealing material 14 in a plan view, in the illustrated example, on the outer side (opposite to the effective display area A) than the sealing material 14.

  Then, the inner overhanging portion 29c formed on the inner surface of the opening 12c and conductively connected to the inner overhanging portion 29c extends to a position where it overlaps with the sealing material 14, and this inner overhanging portion 29c, The grounding electrode 19 on one substrate 11 is configured to overlap in a plane. The inner overhanging portion 29 c and the grounding electrode 19 are in conductive contact via the conductive particles 14 b in the sealing material 14.

  In the present embodiment, since the inner overhanging portion 29c of the conductive film 29 and the grounding electrode 19 are conductively connected via a conductive material, the effect obtained by grounding the conductive film 29 as described above can be obtained. Can do. Thus, in the present invention, it is not necessary for the opening 12c and the conductive material to overlap in a plane, and as a result, the first substrate 11 and the first substrate 11 via the inner passage portion 29b formed on the inner surface of the opening 12c. The conductive film 29 only needs to be conductively connected to the grounding electrode 19 by a conductive material disposed between the second substrates 12.

[Fifth Embodiment]
Next, a fifth embodiment according to the present invention will be described with reference to FIG. In this embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. In the present embodiment, the opening 12c and the sealing material 14 ″ are arranged at a position where they overlap in a plane, and the sealing material 14 is in contact with the conductive film 29 on the opening edge 12f of the opening 12c. However, since the sealing material 14 ″ of the present embodiment is composed only of an insulating material, it does not have a function of conducting conductive connection with the conductive film 29.

  In the present embodiment, the inner overhanging portion 29c of the conductive film 29 extends to a region that does not overlap with the sealing material 14 ″ in a plane, and overlaps with the ground electrode 19 on the first substrate 11 in that region. Then, the conductive material 15 disposed between the first substrate 11 and the second substrate 12 electrically connects the inner overhanging portion 29c and the grounding electrode 19 at a position different from the sealing material 14 ″. ing. In the case of the illustrated example, the conductive material 15 is disposed on the outer side opposite to the effective display area A with respect to the sealing material 14 ″. The conductive material 15 is made of a conductive paste or the like.

[Sixth Embodiment]
Next, a sixth embodiment according to the present invention will be described with reference to FIG. In this embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. In the present embodiment, the opening 12c and the conductive material 15 are arranged at a position where they overlap in a plane, and the conductive material 15 is connected to the inner passage portion 29b on the opening edge 12f of the opening 12c and the inner overhanging portion 29c around it. Conductive contact. The sealing material 14 ″ is made of only an insulating material as in the fifth embodiment, and the opening 12c and the conductive material 15 are arranged outside the sealing material 14 ″ (on the side opposite to the effective display area A). . The conductive material 15 is made of a conductive paste or the like as in the fifth embodiment. Further, the conductive material 15 is fitted into the opening 12c so as to enter the opening 12c within a range not exceeding the thickness of the second substrate 12.

  In the present embodiment, the opening 12c and the conductive material 15 are arranged at a position where they overlap in a plane, and the conductive film 29 and the conductive material 15 are in conductive contact in a state of being fitted into the opening 12c. Since the conductive connection structure can be stabilized while increasing the electrical reliability, it is possible to further increase the electrical reliability. In this case, since the conductive connection structure can be configured without being restricted by the position of the sealing material 14 ″, there is an advantage that the degree of freedom in design can be increased.

[Seventh Embodiment]
Next, a method for manufacturing an electro-optical device according to the present invention will be described as a seventh embodiment with reference to FIGS. In the present embodiment, as shown in FIG. 10, a drilling process S1 for forming the opening 12c in the second substrate 12 and a conductive film forming process S2 for forming the conductive film 29 on the second substrate 12 are included. . Further, the method includes a step S3 of forming the second inner surface structure 120 on the inner surface 12a of the second substrate 12, and a step S4 of forming the first inner surface structure 110 on the inner surface 11a of the first substrate 11. Further, after that, the inner surface 11a of the first substrate 11 and the inner surface 12a of the second substrate 12 face each other, and the sealing materials 14, 14 ', 14 "are arranged on one of the inner surfaces, so that both With the sealing material interposed between the substrates and the conductive materials 14c and 15 as necessary, the step S5 for bonding the substrates is performed to form the panel structure 10P. The IC 150 and the wiring member 170 are mounted (step S6).

  The drilling step S1 can be performed by, for example, blasting (sandblasting) in which hard particles such as ceramics are sprayed to perform drilling. It can also be carried out by wet etching or dry etching. Such a processing method is possible regardless of whether the second substrate 12 is made of any material such as glass, quartz, or plastic. In the case of a plastic substrate, the opening 12c can also be formed by drilling, heat forming, or the like. In addition, the opening edge having an inclined surface as in the second embodiment can be easily formed by extending the processing range by the above processing method to the periphery in addition to mechanical processing and thermoforming.

  In the conductive film forming step S2, as shown in FIG. 11A, the conductive film 29 is applied to the outer surface 12b of the second substrate 12 from the outer surface 12b side (outer side, upper side in the drawing). . The conductive film 29 is formed, for example, by depositing a transparent conductive film on the outer surface 12b by a sputtering method. At this time, the conductive film 29 is deposited on the outer surface 12b to form the outer portion 29a, and is also deposited on the inner surface 12d of the opening 12c to form a part 29b-1 of the inner passage portion 29b. The

  In the conductive film forming step S2, a CVD method or a vapor deposition method can be used in addition to the sputtering method. In addition, any material that can be applied, such as a conductive paste, can be formed by applying a conductive material. However, at least a portion of the conductive film 29 formed in the effective display area A needs to be formed of a light-transmitting material.

  Here, in the first stage shown in FIG. 11A, if the inner passage portion 29b formed on the inner surface 12d of the opening 12c reaches the vicinity of the opening edge 12f on the inner surface 12a side, The conductive film forming step S2 can then be completed. However, as described above, when the portion 29-1 of the conductive film 29 is formed only on the inner surface 12d on the outer surface 12b side of the opening 12c, and the conductive film 29 does not reach the vicinity of the opening edge 12f on the inner surface 12a side. Thereafter, as shown in FIG. 10B, a second step of depositing the conductive film 29 from the inside is performed.

  In the second stage, the conductive film 29 is deposited in the same manner as described above from the inner surface 12a side (inner side, lower side in the drawing) of the second substrate 12, and the inner surface 12d of the opening 12c (including the upper edge 12f). The other portion 29b-2 of the inner passage portion 29b is formed. Here, the part 29b-2 is configured to be in a conductive connection state with at least the part 29b-1. In the second stage, it is preferable to form the inner overhanging portion 29c around the opening edge 12f on the inner surface 12a as in the illustrated example. However, the inwardly extending portion 29c is not an essential configuration in the first embodiment, the third embodiment, and the sixth embodiment. However, even in these cases, it is preferable that the inner passage portion 29b is configured to reach the opening edge 12f as a result.

  Note that the second stage may be performed simultaneously with at least one stage in the process of forming the second inner surface structure 120 on the inner surface of the second substrate 12. For example, in the first embodiment, since the step of forming the light shielding film 121 is provided on the inner surface 12 a of the second substrate 12, the part 29 b-2 and the inner overhanging part 29 c are arranged on the light shielding film 121. Can be formed simultaneously with the same material and in the same manner. Here, the light shielding film 121 may be formed of a metal such as Cr, or may be formed by a vapor deposition method or a sputtering method. In these cases, the portion 29b-2 and the inner overhang portion 29c are formed. Can be formed simultaneously with the light-shielding film 121 using the same metal material and the same film formation method. In this way, there is no need to newly provide a second stage.

  As for the conductive film 29, as described above, at least a portion formed on the outer surface 12b (the effective display area A) of the second substrate 12 needs to have translucency, and the other portions are conductive. Therefore, it is preferable to form the portion formed in the first stage with a transparent conductor such as ITO and the portion formed in the second stage with a metal material.

  Step S4 for forming the first inner surface structure 110 on the inner surface 11a of the first substrate 11 and step S3 for forming the second inner surface structure 120 on the inner surface 12a of the second substrate 12 are performed by known means. It can implement suitably. In this case, steps S3 and S4 may be performed in parallel, and either may be performed first. Here, it is preferable that the grounding electrode 19 is simultaneously formed in at least one stage in the process of forming the first inner surface structure 110 on the first substrate 11. Since the grounding electrode 19 needs to be made of a conductive material, a step of forming the wiring of the first inner surface structure 110, another electrode (for example, a pixel electrode, a common electrode, a transistor gate electrode, etc.) are formed. It can be formed simultaneously with the process. This eliminates the need to newly provide a step of forming the grounding electrode 19.

  Thereafter, as shown in FIG. 12, in step S5, the inner surface 11a of the first substrate 11 and the inner surface 12a of the second substrate 12 are bonded together with the sealing materials 14, 14 ′, 14 ″ interposed therebetween. If necessary, the above-described conductive materials 14c and 15 are also sandwiched between the two substrates. In any case, the sealing materials 14, 14 ', 14 "and the conductive materials 14c, 15 are used as the first substrate. 11 and the second substrate 12 so as to be pressed against the inner surfaces 11a and 12a of both substrates, whereby the conductive film 29 and the grounding electrode 19 are sealed by the sealing material 14 and the conductive materials 14c and 15. Conductive connection. In this way, it is not necessary to newly provide a step for bringing the conductive material (including the conductive particles 14 b) into conductive contact with the conductive film 29 and the grounding electrode 19.

  Thereafter, in step S6, the driving IC 150 and the wiring member 170 shown in FIGS. 1 and 2 are mounted, the polarizing plates 17 and 18 are attached, and the panel structure 10P is completed. In the manufacturing method of this embodiment, when the normal panel structure 10P is completed, the conductive film 29 is already conductively connected to the ground electrode 19, and the conductive connection structure is hidden inside. Since there is no need to wait until the conductive paste 5 exposed to the outside is cured as in the structure shown in FIGS. 13 and 14, it can be manufactured quickly and easily, and the apparatus can also be configured compactly.

[Electronics]
Finally, with reference to FIGS. 15 and 16, an embodiment of an electronic apparatus including the electro-optical device 100 will be described. The electronic apparatus 200 includes the electro-optical device 100 including the panel structure 10P described above. FIG. 15 illustrates a mobile phone as an example of the electronic apparatus 200.

  The electronic device 200 includes an operation unit 201 having a plurality of operation buttons, a mouthpiece, and the like, and a display unit 202 having an earpiece, and the electro-optical device 100 is incorporated inside the display unit 202. Become. The effective display area A (see FIG. 8) of the panel structure 10P of the electro-optical device 100 can be visually recognized on the surface (inner surface) of the display unit 202. In this case, a display control circuit to be described later for controlling the electro-optical device 100 is provided inside the electronic apparatus 200. The display control circuit sends a predetermined control signal to the drive circuit 150 that drives the panel structure 10P to determine the display mode of the electro-optical device 100.

  FIG. 16 is a schematic configuration diagram illustrating an overall configuration of a control system (display control system) for the electro-optical device 100 mounted on the electronic apparatus 200. The electronic device 200 shown here includes a display information output source 291, a display information processing circuit 292, a power supply circuit 293, a timing generator 294, and a light source control circuit 295 that supplies power to the lighting device 160. A circuit 290 is included. The electro-optical device 100 is provided with a panel structure 10P having the above-described configuration, a drive circuit 150 that drives the panel 10P, and an illumination device (backlight) 160 that illuminates the panel structure 10P.

  The display information output source 291 includes a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), a storage unit such as a magnetic recording disk or an optical recording disk, and a tuning circuit that tunes and outputs a digital image signal. The display information is supplied to the display information processing circuit 292 in the form of an image signal or the like of a predetermined format based on various clock signals generated by the timing generator 294.

  The display information processing circuit 292 includes various known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit, and executes processing of input display information to obtain image information. Are supplied to the drive circuit 150 together with the clock signal CLK. The drive circuit 150 includes a scanning line drive circuit, a signal line drive circuit, and an inspection circuit. The power supply circuit 293 supplies a predetermined voltage to each of the above-described components.

  The light source control circuit 295 supplies power to the light source of the illumination device 160 based on the voltage supplied from the power supply circuit 293, and controls whether or not the light source is turned on and its brightness based on a predetermined control signal. ing.

  In addition to the mobile phone shown in FIG. 15, examples of the electronic apparatus according to the present invention include a liquid crystal television, a car navigation device, an electronic notebook, a calculator, a workstation, a videophone, and a POS terminal. The electro-optical device according to the present invention can be used as a display unit of these various electronic devices. However, since the present invention has a feature that does not hinder downsizing (compacting) of the electro-optical device 100, it is particularly effective when used in portable electronic devices such as a mobile phone, an electronic watch, and a portable information terminal. .

  Note that the electro-optical device, the manufacturing method thereof, and the electronic apparatus of the present invention are not limited to the illustrated examples described above, and various modifications can be made without departing from the scope of the present invention. . For example, in the above-described embodiment, the panel structure 10P in which the first substrate 11 is disposed behind and the second substrate 12 is disposed on the viewing side has been described, but conversely, the first substrate 11 is visually recognized. On the side, the second substrate 12 may be disposed behind.

DESCRIPTION OF SYMBOLS 10P ... Panel structure, 100 ... Electro-optical apparatus, 11 ... 1st board | substrate, 12 ... 2nd board | substrate, 12c ... Opening part, 12d ... Inner surface of opening part, 13 ... Liquid crystal, 14, 14 ', 14 "... Seal 14c, 15 ... conductive material, 19 ... ground electrode, 29 ... conductive film, 29a ... outer part, 29b ... inner passage part, 29c ... inner overhang part, 110 ... first inner surface structure, 120 ... second 150 ... Drive IC, 160 ... Lighting device, 170 ... Wiring member, 200 ... Electronic equipment

Claims (13)

A first substrate;
A second substrate disposed opposite the first substrate;
An electro-optic material disposed between the first substrate and the second substrate;
Provided on the second substrate, facing the first substrate, opening in a plane area where the electro-optic material is not disposed, and penetrating from the surface on the first substrate side to the surface on the opposite side. An opening,
A conductive film provided on the opposite surface of the second substrate and extending on the inner surface of the opening in a manner that does not close the opening;
A grounding electrode provided on the surface of the first substrate on the second substrate side at a position overlapping with at least a part of the opening and conductively connected to the outside;
A conductive material disposed between the first substrate and the second substrate and in conductive contact with the conductive film and the grounding electrode;
An electro-optical device comprising:   The electro-optical device according to claim 1, wherein the conductive film is formed on the entire inner surface of the opening and reaches the entire periphery of the opening edge of the opening on the first substrate side. .   The said electrically conductive film has a part which protrudes on the surface by the side of the said 1st board | substrate of the said 2nd board | substrate from the opening edge by the side of the said 1st board | substrate of the said opening part. The electro-optical device according to 1. A first substrate;
A second substrate disposed opposite the first substrate;
An electro-optic material disposed between the first substrate and the second substrate;
Provided on the second substrate, facing the first substrate, opening in a plane area where the electro-optic material is not disposed, and penetrating from the surface on the first substrate side to the surface on the opposite side. An opening,
A conductive film provided on the opposite surface of the second substrate and projecting from the opening edge on the first substrate side through the inner surface of the opening in a manner that does not close the opening;
A grounding electrode provided on the surface of the first substrate on the second substrate side at a position overlapping with at least a part of the conductive film projecting to the periphery in a planar manner and electrically connected to the outside;
A conductive material disposed between the first substrate and the second substrate and in conductive contact with the grounding electrode;
An electro-optical device comprising:   The conductive material is disposed inside a sealing material formed in a frame shape surrounding the electro-optical material between the first substrate and the second substrate. 5. The electro-optical device according to claim 4.   The sealing material is a material in which a plurality of conductive particles having a diameter corresponding to a substrate interval between the first substrate and the second substrate are dispersedly arranged in an insulating material as the conductive material. The electro-optical device according to claim 5.   The electro-optical device according to claim 1, wherein the conductive material is a conductive paste.   The electro-optical device according to claim 1, wherein the opening edge of the surface on the opposite side of the opening is configured to be an inclined surface.   9. The electro-optical device according to claim 1, wherein an opening edge of the one side surface of the opening is configured to be an inclined surface. An electric comprising: a first substrate; a second substrate disposed opposite to the first substrate; and an electro-optic material disposed between the first substrate and the second substrate. An optical device manufacturing method comprising:
Forming an opening penetrating from one surface to the opposite surface in the second substrate;
Forming a conductive film extending on the inner surface of the opening from the opposite surface of the second substrate by depositing a conductive material;
Forming a grounding electrode provided on a surface of one side of the first substrate at a position overlapping with at least a part of the opening and conductively connected to the outside;
A conductive material is interposed between the one side surface of the first substrate and the one side surface of the second substrate, and the conductive material is in conductive contact with the conductive film and the grounding electrode together. And forming a panel structure in which the one side surface of the first substrate and the one side surface of the second substrate are arranged to face each other with the electro-optic material interposed therebetween;
A method for manufacturing an electro-optical device.   The step of forming the conductive film includes a first step of depositing a first conductive film from the opposite surface side of the second substrate to the opposite surface and the inner surface of the opening; A second step of depositing a second conductive film on the inner surface of the opening from the one surface side of the second substrate, wherein the first conductive film and the second conductive film are The method of manufacturing an electro-optical device according to claim 10, wherein the conductive film is formed by conductive connection inside the opening. An electric comprising: a first substrate; a second substrate disposed opposite to the first substrate; and an electro-optic material disposed between the first substrate and the second substrate. An optical device manufacturing method comprising:
Forming an opening penetrating from one surface to the opposite surface in the second substrate;
Forming a conductive film that passes from above the opposite surface of the second substrate over the inner surface of the opening and extends around the opening edge of the one surface by applying a conductive material; When,
Forming a grounding electrode provided on a surface of one side of the first substrate so as to planarly overlap with at least a part of the conductive film projecting to the periphery and electrically connected to the outside;
A portion in which a conductive material is interposed between the one side surface of the first substrate and the one side surface of the second substrate, and the conductive material projects around the opening edge of the conductive film. A panel in which the one-side surface of the first substrate and the one-side surface of the second substrate are arranged to face each other with the electro-optic material in conductive contact with the grounding electrode. Forming a structure;
A method for manufacturing an electro-optical device.   The step of forming the conductive film includes a first step of depositing a first conductive film from the opposite surface side of the second substrate to the opposite surface and the inner surface of the opening; A second step of depositing a second conductive film on the peripheral portion of the opening edge of the one side surface and the inner surface of the opening from the one surface side of the second substrate; The method of manufacturing an electro-optical device according to claim 12, wherein the conductive film is formed by conductively connecting the first conductive film and the second conductive film inside the opening. .

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