JP2010214579A - Reusable and reproducible polishing pad with auxiliary plate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable a polishing pad to be reused and reproduced which was disposed after being used once conventionally. <P>SOLUTION: The pad with the auxiliary plate is provided by attaching the auxiliary plate on a back side of the polishing pad by utilizing a double coated adhesive tape adhered to the pad. If the auxiliary plate is fixed to a surface plate of a polishing machine by the double coated adhesive tape and the like, the pad does not bend, fold, contract or break even if the pad is removed from the polishing machine and the pad becomes reusable. If a surface of a removed used pad with the auxiliary plate is treated for correction, the pad can be reproduced and used repeatedly. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a technique for reusing and recycling a polishing pad used when polishing the surface of a workpiece requiring high flat processing accuracy, such as a silicon wafer, a semiconductor substrate, and a glass substrate.

  Conventionally, in the flattening process of silicon wafers, semiconductor substrates, and glass substrates, a circular polishing pad such as a resin material is fixed on a surface plate of a polishing machine with double-sided tape, and a polishing liquid containing abrasive grains is supplied. However, a method of performing polishing by relatively rotating the polishing pad and the substrate is used. By the way, the polishing pad used in this method is deteriorated in polishing performance due to clogging when used for a certain period of time. Therefore, the polishing pad surface is dressed with a diamond dresser on the polishing machine to maintain the polishing performance. However, when dressing is repeated, the depth of the groove carved on the surface of the polishing pad becomes shallower in order to improve the polishing performance, or the polishing pad surface is deformed or altered by the polishing process, and the polishing performance deteriorates. . For this reason, it is replaced with a new polishing pad, but the polishing pad is firmly fixed to the surface plate of the polishing machine with double-sided tape. It is discarded without being reused. Further, when the polishing pad is replaced in order to change the type of processing, it is discarded without being reused even though its life has not expired.

JP 2002-011630 A

  The present invention has been made in the background of the above-mentioned circumstances, and the problem to be solved is reuse from the viewpoint of cost reduction, resource saving, and environmental conservation, and regeneration to the same quality as a new polishing pad. It is to provide a possible polishing pad.

  Hereinafter, embodiments of the present invention made to solve the problems will be described. In addition, the component employ | adopted in each aspect as described below is employable by arbitrary combinations as much as possible. In addition, aspects or technical features of the present invention are not limited to those described below, but are described in the entire specification and drawings, or can be understood by those skilled in the art from those descriptions. It should be understood that it is recognized on the basis of.

  The invention according to claim 1 of the present invention removes the polishing pad from the surface plate of the polishing machine by attaching the polishing pad to the auxiliary plate, and further fixing the auxiliary plate to the surface plate of the polishing machine with double-sided tape or the like. However, the polishing pad does not bend, break, shrink, wrinkle, or tear. And if it attaches to a surface plate again, the reuse of a polishing pad is possible.

  The invention according to claim 2 of the present invention provides a polishing pad with an auxiliary plate by replacing a double-sided tape used for fixing the polishing pad with an auxiliary plate on a surface plate of a polishing machine every time it is detached. Even when re-use is repeated, the polishing pad does not lift from the surface plate of the polishing machine, and it is possible to stably perform polishing processing with the same quality as a new polishing pad.

  In the invention according to claim 3 of the present invention, the hardness of the auxiliary plate is made of a material harder than that of the polishing pad, so that the polishing pad is prevented from bending, breaking, shrinkage, and the like. It becomes easy to repeatedly remove and use the pad.

  Further, the invention according to claim 4 of the present invention can be repeatedly attached and detached by integrally molding the polishing pad layer and the auxiliary plate function layer, instead of attaching the polishing pad to the auxiliary plate. Can be used.

  Further, in the invention according to claim 5 of the present invention, instead of attaching the polishing pad to the auxiliary plate, the rigidity is increased by increasing the thickness of the polishing pad, and the polishing pad is used as the auxiliary plate. By giving the same strength as the pasted one, it is possible to repeatedly remove and use it.

  In the invention according to claim 6 of the present invention, the auxiliary plate is made of a metal, so that the polishing pad with the auxiliary plate is prevented from being bent or broken, and can be used after being repeatedly detached over a long period of time. It becomes possible.

  In addition, the invention according to claim 7 of the present invention is made of stainless steel as the material of the auxiliary plate, thereby preventing the polishing pad from being bent or broken and also preventing the occurrence of rust caused by the liquid used for polishing. A polishing pad with an auxiliary plate can be reused over a period of time.

  In the invention according to claim 8 of the present invention, the auxiliary plate is made of a material that does not deteriorate with respect to the liquid used for polishing, so that the plate is prevented from being deformed, and the polishing pad with the auxiliary plate is reused for a long period of time. It becomes possible to use.

  According to the ninth aspect of the present invention, the liquid used in the polishing operation penetrates between the polishing pad, the double-sided tape and the auxiliary plate from the outer peripheral portion, and the outer peripheral portion of the polishing pad is peeled off from the auxiliary plate. This makes it possible to reuse the polishing pad with an auxiliary plate for a long period of time.

  The invention according to claim 10 of the present invention uses vacuum suction as a method of fixing the auxiliary plate to the surface plate of the polishing machine. According to this method, the auxiliary plate can be attached and detached in a short time.

  In the eleventh aspect of the present invention, a fixing method using magnetic force is used as a method for fixing the auxiliary plate to the surface plate of the polishing machine. According to this method, the auxiliary plate can be attached and detached in a short time.

  The invention according to claim 12 of the present invention is a method in which the auxiliary plate is fixed to the surface plate of the polishing machine by a mechanical clamp or bolt. According to this method, the auxiliary plate can be reliably fixed in a short time.

  In the invention according to claim 13 of the present invention, the adhesive force of the tape for fixing the polishing pad and the plate is made larger than the adhesive force of the tape for fixing the plate and the surface plate of the polishing machine, and polishing with an auxiliary plate is performed. Since it is possible to prevent the bond between the pad and the plate from being peeled when the pad is peeled off, the polishing pad with the auxiliary plate can be reused for a long period of time.

  In the invention according to claim 14 of the present invention, the polishing pad, the plate, and the double-sided tape are reinforced with a reinforcing material at the outer peripheral portion, so that when the pad with the auxiliary plate is peeled off, it is possible to prevent separation. A polishing pad with an auxiliary plate can be reused stably.

  In the fifteenth aspect of the present invention, the surface of the polishing pad worn by the polishing work can be finished and regenerated to the same quality as a new polishing pad.

  According to the sixteenth aspect of the present invention, the surface of the polishing pad worn by the polishing operation is finished, and a groove or the like of the polishing pad that has become shallower is additionally processed or reworked to be the same as a new polishing pad. It can be played back to a certain quality.

  In addition, the invention according to claim 17 of the present invention finishes the surface of the polishing pad that has reached the end of its life, reprocesses or additionally processes the groove of the polishing pad that has become shallower, and further cleans the polishing pad to clean a new one. It can be regenerated to the same grade as the polishing pad.

  The invention according to claim 18 of the present invention is an apparatus for regenerating a polishing pad with an auxiliary plate by the method according to claims 15 to 17. There is a type in which the regeneration process is divided into each process and a type in which the regeneration process is performed consistently. There are a system in which the apparatus is installed separately from the polishing machine, and a system in which the apparatus is installed integrally with the polishing machine.

  The invention according to claim 19 of the present invention is a method for manufacturing a semiconductor substrate or the like using the regenerated polishing pad according to claims 1 to 17.

  The effect of the present invention is that, as described above, the polishing pad that has been discarded by one-time use can be used repeatedly by attaching an auxiliary plate, and the pad surface and grooves are reworked. It becomes possible to regenerate the polishing pad by restoring the same quality as a new polishing pad.

  It is explanatory drawing which showed the implementation method of the polishing pad with an auxiliary | assistant board. (Example 1)   It is explanatory drawing which showed the implementation method of the polishing pad with an auxiliary | assistant board. (Example 2)   It is explanatory drawing which showed the conventional polishing pad.   It is explanatory drawing which attached the conventional polishing pad to the polisher.   It is explanatory drawing which showed the implementation method of the reproduction | regeneration of the polishing pad with an auxiliary | assistant board. (Example 3)

  Hereinafter, in order to clarify the present invention more specifically, embodiments of the present invention will be described in detail with reference to the drawings.

  First of all, claim 1 of the present invention refers to the one in which at least the polishing pad 1 and the auxiliary plate 3 are integrated. As a specific embodiment, the polishing pad 1 and the auxiliary plate 3 are bonded together with a double-sided tape 2 in FIG. Furthermore, sectional drawing of what stuck the double-sided tape 4 for grinder fixing to the lower surface of an auxiliary | assistant board is shown. Although not shown in the figure, the adhesive surface of the double-sided tape 4 is usually protected by a film or the like, and is used by being peeled off when being fixed to a surface plate of a polishing machine. In this figure, the four layers from the polishing pad 1 to the double-sided tape 4 are shown as the polishing pad 5 with the auxiliary plate, but as another form, the three layers from the polishing pad 1 to the auxiliary plate 3 are attached. There is also.

  FIG. 2 shows a state where the polishing pad 5 with an auxiliary plate is fixed to the surface plate 6 of the polishing machine with the double-sided tape 4. When removing the polishing pad with auxiliary plate from the surface plate of the polishing machine, the polishing pad and auxiliary plate can be separated from the surface plate of the polishing machine in one state, so the polishing pad will not be bent, bent or torn, It can be used again.

  In a commercially available polishing pad, a double-sided tape for fixing to a surface plate of a polishing machine is usually bonded to the back surface of the pad, and this double-sided tape can be used for attachment to an auxiliary plate.

  As shown in FIG. 3, a normal polishing pad has a double-sided tape 2 attached to a polishing pad 1. In the IC1000 pad commercially available from Nitta Haas, the polishing pad is made of urethane and has a thickness of about 1.3 mm. And the thickness of a double-sided tape is about 0.2 mm. And as shown in FIG. 4, it fixes to the surface plate 6 of a grinder with a double-sided tape. Therefore, when the polishing pad is peeled off, the polishing pad is bent, broken, or torn and cannot be used again.

  By the way, when the auxiliary plate is peeled off from the surface plate, the adhesiveness of the double-sided tape decreases. According to claim 2, each time the polishing pad with the auxiliary plate is reused, a fixed fixing force is maintained by replacing the double-sided tape of the fixing surface to the surface plate of the auxiliary plate with a new one. It is possible to maintain the polished performance. The adhesiveness of the double-sided tape is preferably the minimum necessary. If the degree of adhesion is too high, it will be difficult to peel off the auxiliary plate, and the plate may be bent. It is also difficult to replace the double-sided tape. It is most desirable to use a double-faced tape that can hold the polishing pad to the extent that it does not slip due to polishing stress during polishing, and has a characteristic that it is easy to peel off in the lifting direction.

  Further, according to the third, sixth, and seventh aspects, the flatness of the polishing pad can be maintained by making the auxiliary plate material harder than the polishing pad. The specific thickness of the auxiliary plate is preferably 1 mm to 5 mm when the diameter of the polishing pad is 500 mm to 800 mm. If the thickness is increased, the flatness of the pad is maintained, but the pad becomes too heavy and difficult to handle, and the weight applied to the polishing machine changes greatly. If it is made thinner, it will bend when it is peeled off from the surface plate of the polishing machine. The flatness of the plate is preferably within 0.02 mm. If the error is large, the dressing performed on the polishing machine takes too much time and the efficiency is poor.

  Further, according to the fourth and fifth aspects, the polishing pad itself has the function of an auxiliary plate, and the labor for attaching the auxiliary plate becomes unnecessary. In either case, if the polishing pad layer is increased, the polishing pad can be regenerated and used for a considerable period of time. However, if the polishing pad thickness is increased too much, the polishing pad rigidity decreases and the polishing pressure is lowered. Consideration is necessary because the polishing efficiency is reduced. The structure of claim 4 includes a type in which the polishing layer and the reinforcing layer are clearly separated and a type in which the change from the polishing layer to the reinforcing layer is unclear. In the case of claim 5, it is necessary to make the material of the polishing pad harder than a normal polishing pad.

  Further, claims 8 and 9 can prevent the flatness of the polishing pad from being deteriorated due to deterioration of the plate due to water or chemicals used in polishing. The polishing liquid is used by diluting an acidic or alkaline chemical with abrasive grains in pure water, and further contains an additive. It is necessary to select a material that is chemically stable with respect to these drugs as the material of the plate and the protective material.

  By the way, if the auxiliary plate and the surface plate of the polishing machine can be fixed without using a double-sided tape, the attaching / detaching operation becomes very easy. A method of vacuum suction between the auxiliary plate and the surface plate as described in claim 10, a method of performing magnetic force as described in claim 11, and a mechanical clamp or bolt fixing according to claim 12. There is a way to do it. These methods require an additional function of the polishing machine, but it is not necessary to replace the double-sided tape every time it is attached / detached, and the pad with the auxiliary plate can be attached / detached in a very short time.

  Further, when the polishing pad fixed to the surface plate of the polishing machine is peeled off with the double-sided tape, if the gap between the polishing pad and the auxiliary plate is peeled off, the polishing pad cannot be reused. Therefore, as described in claim 13, the peeling force is increased by making the adhesive force of the double-sided tape that fixes the polishing pad and the auxiliary plate larger than the adhesive force of the double-sided tape that fixes the auxiliary plate and the surface plate of the polishing machine. Even if it adds, a polishing pad and an auxiliary | assistant board can maintain the state of integral. Furthermore, as described in claim 14, if the polishing pad, the double-sided tape, and the outer peripheral portion of the auxiliary plate are integrated with a reinforcing material or the like, there is no fear that they are separated by the peeling force.

  By the way, if the polishing operation is continued for a certain time, the surface of the polishing pad is clogged. Therefore, the polishing operation is continued while the surface of the pad is gradually removed and corrected by a diamond dresser on the polishing machine. In order to improve the quality and efficiency of polishing, the grooves processed on the surface of the polishing pad become shallow, or the polishing pad is deformed by polishing load, so that the polishing performance is significantly reduced and the life of the polishing pad is shortened. Welcome.

  According to the fifteenth aspect of the present invention, since the polishing pad can be easily removed while being fixed to the auxiliary plate, for example, a mounting tool 8 is used on a surface plate 7 of a pad processing apparatus as shown in FIG. If the surface is lathe processed, the polishing pad surface becomes the same quality as a new pad, so that the polishing pad can be regenerated. In this example, the auxiliary plate 3 and the surface plate 7 of the processing apparatus are fixed by vacuum suction or the like. As the surface finishing method, for example, turning can be performed using a diamond tool, whereby high surface flatness can be obtained with high efficiency. The surface finishing allowance is an amount obtained by inspecting the surface of the polishing pad in advance and adding a deteriorated layer generated by polishing work from the most recessed portion. For example, if the maximum dent is 0.05 mm and the altered layer is 0.05 mm, the finishing allowance is 0.1 mm in total.

  Furthermore, according to the sixteenth aspect, the surface of the polishing pad can be corrected, and the polishing pad can be regenerated by processing or correcting a groove or the like on the surface of the polishing pad. Usually, various shapes of grooves and holes are processed on the surface of the polishing pad in order to improve polishing performance. However, when the polishing pad is used for polishing work, these depths become shallow due to dressing. Further, when the pad surface is finished, the corresponding portion becomes shallower, and in some cases, a groove or the like may be lost. Specifically, the depth of grooves and other specifications of a new polishing pad are checked when they are new, and grooves or the like are reworked or reworked on the refinished surface. If an auxiliary plate is selected, workability is improved.

  According to claim 17, in addition to claim 16, the polishing pad is cleaned. By removing the polishing liquid and polishing debris used in the polishing operation from the pad surface by cleaning, it is possible to regenerate the same as a new polishing pad. There are various cleaning methods such as spraying high-pressure pure water on the surface of the polishing pad, using a cleaning solution, or rubbing with a brush.

  In addition, it is desirable that the polishing pad regeneration device with an auxiliary plate be able to work in a timely manner without moving the pad in the vicinity of the polishing machine of the semiconductor production line or in the factory, and moreover, the necessary work can be performed consistently. More desirable. The reproducing apparatus according to claim 18 adds a polishing pad cleaning function, a double-sided tape laminating function, a peeling function, an inspection function, etc. to a conventional pad groove processing machine (Japanese Patent Laid-Open No. 2002-011630). It is a thing.

  Further, as shown in claim 19, if the polishing pad can be reused a plurality of times by using the polishing pad with an auxiliary plate in the manufacturing process of the semiconductor substrate or the like, the cost of the manufacturing process of the semiconductor substrate or the like can be greatly reduced. It can contribute to environmental conservation by saving resources for manufacturing and reducing the amount of polishing pad discarded.

DESCRIPTION OF SYMBOLS 1 Polishing pad 2 Double-sided tape 3 Auxiliary plate 4 Double-sided tape 5 Polishing pad with auxiliary plate 6 Polishing machine surface plate 7 Recycling device of polishing with auxiliary plate 8 Byte

Claims (19)

  A polishing pad with an auxiliary plate, wherein a polishing pad such as a semiconductor substrate is attached to an auxiliary plate, and the auxiliary plate is fixed on a surface plate of a polishing machine, so that it can be reused even when it is detached.   2. The polishing pad with an auxiliary plate according to claim 1, wherein each time the auxiliary plate is fixed to the surface plate of the polishing machine, the double-sided tape for fixing the auxiliary plate is reapplied to a new tape so that it can be reused.   3. The polishing pad with an auxiliary plate according to claim 1, wherein the hardness of the auxiliary plate is higher than the hardness of the pad.   A polishing pad formed by integrating a polishing pad layer and a layer having the function of an auxiliary plate.   A polishing pad that has increased rigidity by increasing the thickness of the polishing pad, and the pad itself has the function of an auxiliary plate.   4. A polishing pad with an auxiliary plate according to claim 1, wherein the auxiliary plate is made of metal.   4. A polishing pad with an auxiliary plate according to claim 1, wherein the auxiliary plate is made of stainless steel.   4. A polishing pad with an auxiliary plate according to claim 1, wherein the auxiliary plate is made of a material that does not deteriorate with respect to a liquid used in a polishing operation.   9. The polishing pad with an auxiliary plate according to claim 1, wherein the outer peripheral portion of each layer of the polishing pad, the auxiliary plate, etc. and the double-sided tape is protected from penetrating the liquid used in the polishing operation.   10. The method for reusing a polishing pad with an auxiliary plate according to claim 1, wherein vacuum suction is used to fix the auxiliary plate or the like to the surface plate of the polishing machine.   10. The method for reusing a polishing pad with an auxiliary plate using magnetic force in order to fix the auxiliary plate or the like to a surface plate of a polishing machine.   10. The method for reusing a polishing pad with an auxiliary plate according to claim 1, wherein a mechanical clamp, a bolt, or the like is used to fix the auxiliary plate or the like to the surface plate of the polishing machine.   10. The auxiliary plate according to claim 1, wherein the adhesive force of the double-sided tape that fixes the polishing pad and the auxiliary plate is larger than the adhesive force of the double-sided tape that fixes the auxiliary plate and the surface plate of the polishing machine. With polishing pad.   14. The outer periphery of each layer of the polishing pad, the auxiliary plate, etc. and the double-sided tape is reinforced so that the polishing pad, the auxiliary plate, and the double-sided tape are not separated at the time of removal. A polishing pad with an auxiliary plate.   15. The method for regenerating a polishing pad according to claim 1, wherein the surface of the pad used for the polishing operation is modified.   15. The method of regenerating a polishing pad according to claim 1, wherein the surface of the pad used for the polishing operation is corrected, and a groove or the like processed on the surface of the pad is corrected or additionally processed.   15. The method according to claim 1, wherein the surface of the pad used for the polishing operation is corrected, the groove or the like processed on the surface of the pad is corrected or additionally processed, the pad is cleaned, and the polishing pad is regenerated.   An apparatus for regenerating a polishing pad by the method of claims 15-17.   A method for manufacturing a semiconductor substrate or the like using the polishing pad according to claim 1.

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