JP2010212598A - Processing liquid supply mechanism, processing liquid supply method, liquid processing apparatus, and storage medium - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid supply mechanism capable of reliably preventing generation of bubbles in a flow controller without causing any trouble to a liquid to be supplied. <P>SOLUTION: The processing liquid supply mechanism 3 includes: a processing liquid tank 21; a processing liquid feeding pipe 22; the flow controller 27 having a variable orifice for changing a cross-sectional area in the flow of the processing liquid; pressure detectors 26, 28 for obtaining the liquid pressure at the primary side in a prior stage of the variable orifice and the liquid pressure at the secondary side in a post stage of the variable orifice; and a control mechanism 30 for obtaining the pressure difference ΔPs between the liquid pressure of the primary side, at which bubbles from the processing liquid start being generated, and the liquid pressure of the secondary side, based on the pre-stored relation of the pressure of the processing liquid and the quantity of the soluble gas component at a corresponding liquid pressure, setting a threshold ΔPt, which is not more than the ΔPs value, determining whether a pressure difference ΔPe value between the actually obtained liquid pressure of the primary side and the secondary side reaches ΔPt, and controlling the state of the processing liquid so as to prevent the generation of bubbles in the processing liquid when the ΔPe value is determined to reach the ΔPt value. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a liquid supply mechanism and a liquid supply method for supplying a predetermined liquid by controlling its flow rate, a liquid processing apparatus including such a liquid supply mechanism, and a storage medium.

  In semiconductor device manufacturing processes and flat panel display (FPD) manufacturing processes, liquid processing such as cleaning processing, resist coating processing, and development processing is performed. In a liquid processing apparatus that performs such liquid processing, a processing liquid is supplied into a processing chamber by a processing liquid supply mechanism to perform a predetermined liquid processing on a substrate to be processed such as a semiconductor wafer.

  Such a processing liquid supply mechanism supplies the processing liquid to the processing chamber through the piping at a predetermined pressure, and the piping is provided with a flow rate controller for controlling the processing liquid to a predetermined flow rate. It has been. As the flow rate controller, one that controls the flow rate by changing the cross-sectional area of the flow path is generally used.

  By the way, if the change amount of the cross-sectional area of the flow path is increased in order to increase the flow rate control range, the pressure difference before and after the flow rate controller increases, and the components dissolved in the processing liquid may be vaporized. Thereby, bubbles are generated in the processing liquid.

  In this type of flow rate controller, when bubbles are generated during processing liquid delivery, the combined volume of the processing liquid and the bubbles is controlled to a predetermined volume, and the flow rate of the processing liquid is higher than the amount to be controlled. It becomes less and it is difficult to perform correct flow control.

  As a technique for preventing such inconvenience, as disclosed in Patent Document 1, a degassing device is provided in the processing liquid supply pipe, and the supplied processing liquid is degassed to suppress the generation of bubbles themselves. Can be mentioned.

JP 2004-49945 A

  However, if the processing liquid is constantly deaerated, there is a problem that depending on the processing liquid, a predetermined component is vaporized during the deaeration. Moreover, even if the bubble component can be removed to some extent by the deaeration process, the generation of bubbles may not be completely prevented depending on the degree of pressure fluctuation before and after the flow rate controller.

The present invention has been made in view of such circumstances, and a liquid supply mechanism and a liquid supply method that can reliably prevent the generation of bubbles in the flow rate controller without causing inconvenience for the liquid to be supplied. An object of the present invention is to provide a liquid processing apparatus including such a liquid supply mechanism.
It is another object of the present invention to provide a recording medium storing a program for performing the above liquid supply method.

  In order to solve the above problems, according to a first aspect of the present invention, there is provided a processing liquid supply mechanism for supplying a processing liquid to a substrate when performing a liquid processing on the substrate, the processing liquid supply source, A processing liquid supply pipe for supplying a processing liquid from a processing liquid supply source; a flow rate controller provided in the processing liquid supply pipe and having a variable orifice section for changing a flow cross-sectional area of the processing liquid; and the variable orifice section A pressure detection mechanism for obtaining the primary side hydraulic pressure and the secondary side hydraulic pressure after the variable orifice, and the pre-stored processing liquid pressure and the processing liquid at the liquid pressure can be dissolved. From the relationship with the amount of the gas component, a differential pressure ΔPs between the primary-side fluid pressure and the secondary-side fluid pressure at which bubbles start to be generated from the processing liquid is obtained, and a threshold value ΔPt equal to or less than the value of this differential pressure ΔPs. The primary hydraulic pressure actually obtained and the second When it is determined whether or not the value of the differential pressure ΔPe with respect to the fluid pressure on the side has reached the threshold value ΔPt, and when it is determined that the value of the differential pressure ΔPe actually obtained has reached the threshold value ΔPt, There is provided a processing liquid supply mechanism comprising a control mechanism for controlling the generation of liquid bubbles.

  In the first aspect described above, further comprising a pressure adjusting mechanism for adjusting the pressure of the processing liquid on the primary side, wherein the control mechanism has a value of the actually obtained differential pressure ΔPe reaching the threshold value ΔPt. When the determination is made, the state of the processing liquid can be controlled by controlling the pressure adjustment of the pressure adjusting mechanism so that the value of the differential pressure is lower than the threshold value ΔPt.

  Further, the apparatus further comprises a degassing mechanism for degassing the primary processing solution, and the control mechanism determines that the value of the actually obtained differential pressure ΔPe has reached the threshold value ΔPt. By controlling the deaeration by the deaeration mechanism so that the value of the differential pressure is lower than the threshold value ΔPt, the state of the processing liquid can be controlled.

  The pressure control mechanism further adjusts the pressure of the processing liquid on the primary side and the degassing mechanism for degassing the processing liquid on the primary side, and the control mechanism has the differential pressure ΔPe actually obtained. Is determined to have reached the threshold value ΔPt, the state of the processing liquid is controlled by controlling the pressure adjustment of the pressure regulating mechanism, and the differential pressure is controlled only by the pressure regulating mechanism. When the pressure does not become lower, the state of the processing liquid can be controlled by operating the deaeration mechanism and controlling the differential pressure value to be lower than the threshold value ΔPt.

  The pressure adjusting mechanism may include a pressure control valve provided on a primary side of the processing liquid supply pipe for controlling the pressure of the processing liquid. The pressure regulating mechanism may be provided on the primary side of the processing liquid supply pipe, and may have an intermediate tank in which the processing liquid is temporarily stored and the processing liquid delivery pressure can be changed. . In this case, the intermediate tank may have a degassing mechanism for degassing the inside.

According to a second aspect of the present invention, there is provided a processing liquid supply method for supplying a processing liquid to a target object when liquid processing is performed on the target object. A step of supplying a processing liquid while controlling a flow rate by a flow rate controller having a variable orifice part that changes a flow cross-sectional area of the supplied processing liquid; a primary side hydraulic pressure preceding the variable orifice part; Bubbles begin to be generated from the processing liquid based on the relationship between the step of obtaining the secondary side hydraulic pressure after the orifice and the amount of the gas component that can be dissolved in the processing liquid at the liquid pressure. Obtaining a differential pressure ΔPs between the primary side hydraulic pressure and the secondary side hydraulic pressure, setting a threshold value ΔPt equal to or less than a value of the differential pressure ΔPs, and the actually obtained primary side hydraulic pressure; Whether the value of the differential pressure ΔPe from the secondary hydraulic pressure has reached the threshold value ΔPt And a step of controlling so as to suppress the generation of bubbles in the processing liquid when it is determined that the value of the actually obtained differential pressure ΔPe has reached the threshold value ΔPt. A process liquid supply method is provided.

  In the second aspect, the step of controlling causes the differential pressure value to be lower than the threshold value ΔPt when it is determined that the actually obtained differential pressure value ΔPe has reached the threshold value ΔPt. In addition, the pressure of the treatment liquid on the primary side can be adjusted.

  Further, in the step of controlling, when it is determined that the value of the actually obtained differential pressure ΔPe has reached the threshold value ΔPt, the primary side is set so that the value of the differential pressure is lower than the threshold value ΔPt. The treatment liquid can be degassed.

  Further, the controlling step adjusts the pressure of the processing liquid on the primary side when it is determined that the value of the actually obtained differential pressure ΔPe has reached the threshold value ΔPt. When the pressure does not become lower than the threshold value ΔPt, the primary-side treatment liquid is deaerated so that the differential pressure becomes lower than the threshold value ΔPt.

  In a third aspect of the present invention, the apparatus includes a substrate processing unit that performs liquid processing on a substrate, and a processing liquid supply mechanism that supplies a processing liquid to the substrate processing unit. Provided is a liquid processing apparatus characterized by being in a viewpoint.

  According to a fourth aspect of the present invention, there is provided a storage medium that operates on a computer and stores a program for controlling a processing liquid supply mechanism, and the program is executed when the processing liquid according to the second aspect is executed. There is provided a storage medium characterized by causing a computer to control a processing device so that a supply method is performed.

  According to the present invention, the primary-side liquid that starts to generate bubbles from the processing liquid based on the relationship between the liquid pressure of the processing liquid stored in advance and the amount of the gas component that can be dissolved in the processing liquid at the liquid pressure. The pressure difference ΔPs between the pressure and the secondary side hydraulic pressure is obtained, a threshold value ΔPt equal to or less than the value of the differential pressure ΔPs is set, and the actually obtained primary side hydraulic pressure and the secondary side hydraulic pressure are set. When the value of the differential pressure ΔPe has reached the threshold value ΔPt, and when it is determined that the actually obtained differential pressure ΔPe has reached the threshold value ΔPt, Since the state of the processing liquid is controlled so as to suppress the generation, there is no inconvenience as in the case of degassing the processing liquid at all times. The generation of bubbles can be reliably prevented.

It is a schematic block diagram which shows the liquid processing apparatus which concerns on one Embodiment of this invention. It is sectional drawing which shows schematic structure of the flow controller in the process liquid supply mechanism of the liquid processing apparatus of FIG. It is a block diagram which shows the structure of the whole control part provided in the liquid processing apparatus of FIG. It is a graph which shows the relationship between the liquid pressure of a process liquid, and the dissolved amount of a gas component. It is a flowchart which shows the control sequence of a process liquid supply. It is a figure which shows collectively the relationship of the various differential pressure | voltage values in embodiment of this invention. It is a flowchart which shows the other example of the control sequence of a process liquid supply. It is a flowchart which shows the further another example of the control sequence of a process liquid supply. It is a schematic block diagram which shows the process liquid supply mechanism in other embodiment of this invention.

  Embodiments of the present invention will be specifically described below with reference to the accompanying drawings. FIG. 1 is a schematic configuration diagram showing a liquid processing apparatus according to an embodiment of the present invention.

  The liquid processing apparatus 1 performs a single wafer type liquid processing such as a cleaning process on a semiconductor wafer (hereinafter simply referred to as a wafer) W which is a substrate to be processed. And a processing liquid supply mechanism 3 that supplies the processing liquid to the processing unit 2.

  The processing unit 2 includes a processing liquid on the processing chamber 11, a spin chuck 12 that rotatably holds the wafer W in the processing chamber 11, a motor 13 that rotates the spin chuck 12, and a wafer W held on the spin chuck 12. And a processing liquid discharge section 15 for discharging the processing liquid from the processing chamber 11. The treatment liquid discharge nozzle 14 can be driven by a drive mechanism 16.

  The processing liquid supply mechanism 3 includes a processing liquid tank 21 that stores the processing liquid, and a processing liquid supply pipe 22 that supplies the processing liquid stored in the processing liquid tank 21 to the processing unit 2. In the treatment liquid supply pipe 22, a pressure control valve 24, a degassing mechanism 25, a primary pressure detector 26, a flow rate controller 27, and a secondary pressure detector 28 are sequentially arranged from the treatment liquid tank 21 side. An open / close valve 29 is provided. Further, the processing liquid supply mechanism 3 includes a controller 30 that controls the pressure control valve 24, the deaeration mechanism 25, the flow rate controller 27, and the like.

  A pressure gas line 31 is connected to the treatment liquid tank 21, and the treatment liquid is passed through the treatment liquid supply pipe 22 by supplying the pressure gas from the pressure gas line 31 into the treatment liquid tank 21. ing. In addition, a drain line 32 is connected to the processing liquid tank 21. Opening and closing valves 33 and 34 are provided on the pressure gas line 31 and the drain line 32, respectively.

  The processing liquid supply pipe 22 extends into the processing chamber 11 of the processing unit 2 and supplies the processing liquid to the processing liquid discharge nozzle 14. The pressure control valve 24 can control the pressure of the processing liquid sent from the processing liquid tank 21 to the processing liquid supply pipe 22 at a predetermined pressure.

  The deaeration mechanism 25 has a processing liquid channel and an exhaust pipe connected to the processing liquid channel (both not shown), and exhausts the inside of the channel by a pump 35 through the exhaust pipe. The treatment liquid can be degassed by vacuum.

  As shown in FIG. 2, the flow controller 27 changes the cross-sectional area of the main body 41, the flow path 42 provided in the main body 41, the variable orifice 45 provided in the flow path 42, and the variable orifice 45. It has a flow rate adjusting member 46 that adjusts the flow rate, and an actuator 47 that moves the flow rate adjusting member 46 up and down. Then, the flow rate of the processing liquid introduced into the flow path 42 from the inlet port 43 is controlled by adjusting the cross-sectional area of the variable orifice 45 by the flow rate adjusting member 46, and flows out from the outlet port 44.

  The controller 30 detects the pressure detection value upstream (primary side) of the flow controller 27 from the primary pressure detector 26 and the pressure downstream (secondary side) of the flow controller 27 from the secondary pressure detector 28. These differential pressures are obtained from the detected values. Instead of detecting the secondary side pressure by the secondary side pressure detector 28, the secondary side pressure is calculated from the primary side pressure and the flow rate value of the flow rate regulator 27, and the differential pressure is calculated. Also good. Based on this differential pressure, a control signal is sent to the actuator 47 of the flow rate controller 27 to control the cross-sectional area of the variable orifice 45 by the flow rate adjusting member 46 to control the flow rate of the processing liquid. In addition, the controller 30 stores in advance the relationship between the liquid pressure of the processing liquid and the amount of the gas component that can be dissolved in the processing liquid at the liquid pressure, for each type of processing liquid. From the relationship, a differential pressure value ΔPs between the primary side fluid pressure and the secondary side fluid pressure at which bubbles start to be generated is obtained, and a value equal to or less than ΔPs (ΔPs or a value in the vicinity thereof) is set as the threshold value ΔPt. It is determined whether or not the pressure ΔPe has reached the threshold value ΔPt. Then, when it is determined that the differential pressure value actually obtained has reached the threshold value, the state of the processing liquid is controlled so as to suppress the generation of bubbles in the processing liquid. Specifically, a signal is sent to the pressure control valve 24 to reduce the primary hydraulic pressure, and ΔPe is made smaller than the threshold value ΔPt, thereby suppressing generation of bubbles in the processing liquid. In this case, if the differential pressure between the primary side fluid pressure and the secondary side fluid pressure is too small, the flow rate cannot be controlled. Therefore, the primary side fluid pressure is reduced within a range where ΔPe is within the flow controllable range. Let It is also possible to control the generation of bubbles from the processing liquid by operating the degassing mechanism 25 to degas the processing liquid.

  The liquid processing apparatus 1 includes an overall control unit 50 that controls the entire system. The overall control unit 50 includes a process controller 51, a user interface 52, and a storage unit 53, as shown in the block diagram of FIG. The process controller 51 controls the entire process of the liquid processing apparatus 1. For example, the controller 30 controls the controller 30, valves 29, 33, and 34, supply of pressurized gas, the motor 13, the nozzle drive mechanism 16, and the like. The user interface 52 is connected to the process controller 51 and includes a keyboard on which an operator inputs commands and the like to manage the liquid processing apparatus 1, a display that visualizes and displays the operating status of the liquid processing apparatus 1, and the like. The storage unit 53 is also connected to the process controller 51 and stores therein a control program for controlling a control target of the liquid processing apparatus 1 and a program for causing the liquid processing apparatus 1 to perform a predetermined process, that is, a processing recipe. ing. The processing recipe is stored in a storage medium (not shown) in the storage unit 53. The storage medium may be a fixed medium such as a hard disk or a portable medium such as a CDROM, DVD, or flash memory. Moreover, you may make it transmit a recipe suitably from another apparatus via a dedicated line, for example. Then, the process controller 51 calls and executes an arbitrary processing recipe from the storage unit 53 in accordance with an instruction from the user interface 52 as necessary, whereby predetermined processing is performed under the control of the controller 51. .

  Next, a processing operation when liquid processing of the wafer W is performed by such a liquid processing apparatus 1 will be described. The following processing operations are performed by the process controller 51 controlling each component of the apparatus based on a predetermined processing recipe stored in the storage medium in the storage unit 53 of the overall control unit 50.

  First, the wafer W is loaded into the processing chamber 11 by a transfer arm (not shown) and held on the spin chuck 12. Next, the motor 13 rotates the wafer W together with the spin chuck 12 at a predetermined number of revolutions, and enters the processing chamber 11 of the processing unit 2 from the processing liquid tank 21 of the processing liquid supply mechanism 3 through the processing liquid supply pipe 22. The processing liquid is supplied, and the processing liquid is supplied onto the wafer W from the processing liquid discharge nozzle 14.

  At this time, the controller 30 sends a flow rate control signal to the flow rate controller 27 based on the differential pressure value between the primary side hydraulic pressure and the secondary side hydraulic pressure so that the processing liquid is supplied at a predetermined flow rate, and the actuator The position of the flow rate adjusting member 46 is adjusted by 47 to control the cross-sectional area of the variable orifice 45 to control the flow rate of the processing liquid.

  In this case, when the flow rate of the treatment liquid is controlled by the flow rate controller 27, when the flow rate control range is increased, it is necessary to increase the change amount of the cross-sectional area of the orifice 45, that is, the change amount of the cross-sectional area of the flow path. . However, when the amount of change in the cross-sectional area of the flow path is increased, the pressure difference before and after the flow rate controller 27 increases, and the components dissolved in the processing liquid may be vaporized, thereby causing bubbles in the processing liquid. Occurs.

  That is, since the cross-sectional area of the orifice 45 of the flow controller 27 is smaller than the cross-sectional area of the processing liquid supply pipe 22, the pressure of the processing liquid is lower on the downstream side than on the upstream side of the flow controller 27. However, when the flow rate of the processing liquid is decreased by reducing the cross-sectional area of the flow path of the flow rate controller 27, the pressure on the downstream side becomes lower and the differential pressure increases. On the other hand, according to Henry's law, the amount of gaseous components that can be dissolved in the liquid is approximately proportional to the pressure of the liquid. That is, FIG. 4 is a graph (that is, a vapor pressure curve) in which the horizontal axis represents the liquid pressure of the treatment liquid and the vertical axis represents the dissolved amount of the gas component. As shown in this figure, the pressure increases. As a result, the amount of gas component that can be dissolved increases linearly. Here, the fluid pressure (primary fluid pressure) of the processing liquid upstream of the flow controller 27 is P1, and the fluid pressure (secondary fluid pressure) of the treatment liquid downstream of the flow controller 27 is P2. Since P1> P2 as described above, as shown in FIG. 4, the dissolvable amount of the gas component at P2 is smaller than the dissolvable amount at P1. For this reason, even if the dissolved gas component is G1 in the figure when the primary side hydraulic pressure P1 is, for example, an amount that does not generate bubbles, the gas component cannot be completely dissolved at the secondary side hydraulic pressure P2 and bubbles are generated. It can happen. Then, as the flow rate value controlled by the flow rate controller 27 is smaller, P2 is reduced, the differential pressure ΔP between P1 and P2 is increased, and bubbles are more likely to be generated.

Therefore, in the present embodiment, the generation of bubbles from the processing liquid is suppressed by the following control flow.
Hereinafter, description will be made based on the flowchart of FIG.
First, the controller 30 stores in advance the relationship between the liquid pressure of the processing liquid and the amount of the gas component that can be dissolved in the processing liquid at the liquid pressure (step 1). Determines a differential pressure value ΔPs between P1 and P2 at which bubbles start to be generated from the relationship, and sets a value equal to or less than ΔPs (ΔPs or a value near it) as a threshold value ΔPt (step 2). Note that the threshold value ΔPt is set to be equal to or smaller than ΔPs. When the control is performed with ΔPs, bubbles may actually be generated. Therefore, the threshold value ΔPt is set lower than the safety factor ΔPs that can surely prevent the generation of bubbles. Is taken into account. Then, the actual differential pressure ΔPe is obtained, and it is determined whether or not the value has reached the threshold value ΔPt (step 3). When it is determined that ΔPe has not reached ΔPt, the processing liquid is supplied while controlling the flow rate with the flow rate controller 27 with the initial condition (step 4).

  On the other hand, when it is determined that ΔPe has reached ΔPt, control is performed to suppress the generation of bubbles in the processing liquid. Specifically, when it is determined that ΔPe has reached ΔPt, a signal is sent to the pressure control valve 24 to reduce the primary hydraulic pressure, and ΔPe is decreased within a flow controllable range (step 5). Then, the determination in step 3 is performed again, and step 5 is repeated until ΔPe does not reach ΔPt. When ΔPe does not reach ΔPt, the processing liquid is supplied while the flow rate is controlled by the flow rate controller 27 under the changed condition in step 5.

  Since the flow rate control cannot be performed if ΔPe is decreased too much and the flow rate control is out of the range, ΔPe is reduced to a range equal to or greater than ΔPn which is a predetermined value equal to or greater than ΔPmin which is the minimum value capable of flow rate control. To do. The reason why ΔPn is set to be equal to or greater than ΔPmin is that if the control is performed with ΔPmin, it is possible that the flow rate control cannot actually be performed. It is a thing. In practice, it is preferable to set the amount of decrease of ΔPe with a sufficient margin from ΔPn so that it becomes difficult to cause the flow rate control.

  The relationship of the differential pressure at this time is shown in FIG. ΔPmax in FIG. 6 indicates the maximum differential pressure value at which the flow rate can be controlled, and the range from ΔPs to ΔPmax is a range in which bubbles are generated.

  In the flow rate control process, if the differential pressure Pe becomes smaller than ΔPmin, the flow rate control cannot be performed. Therefore, when ΔPe decreases to ΔPn with a predetermined safety factor added, ΔPe is increased to a predetermined value smaller than ΔPt. It is preferable to control as described above.

  When the primary side hydraulic pressure cannot be sufficiently reduced by the procedure of FIG. 5 and there is a case where the differential pressure is unlikely to be lower than ΔPt, the control as shown in FIG. 7 is performed. Here, after performing Steps 11 and 12 similar to Steps 1 and 2 in FIG. 5, it is determined whether or not ΔPe has reached ΔPt as in Step 3 (Step 13). If it is determined that ΔPe has not reached ΔPt, the processing liquid is supplied while controlling the flow rate with the flow rate controller 27 with the initial conditions as in step 4 (step 14). If it is determined that ΔPe has reached ΔPt, a signal is sent to the pressure control valve 24 to decrease the primary hydraulic pressure, and ΔPe is decreased within a flow controllable range (step 15). It is determined whether or not this has been repeated a predetermined number of times (step 16). If ΔPe does not become lower than ΔPt even if the number of repetitions reaches the predetermined number of times, the deaeration mechanism 25 is activated and the gas in the processing liquid is Control is performed so as to suppress the generation of bubbles by reducing the components themselves (step 17).

  Also, the control shown in FIG. 8 can be performed. In the control of FIG. 8, after performing Steps 21 and 22 similar to Steps 1 and 2 of FIG. 5, it is determined whether or not ΔPe has reached ΔPt as in Step 3 (Step 23). When it is determined that ΔPe has not reached ΔPt, the processing liquid is supplied while controlling the flow rate with the flow rate controller 27 with the initial conditions as in step 4 (step 24). In step 23, when it is determined that ΔPe has reached ΔPt, the deaeration mechanism 25 is operated to control the generation of bubbles by reducing the gas component itself in the processing liquid (step 25).

  As described above, in the present embodiment, the relationship between the liquid pressure of the processing liquid and the amount of gas components that can be dissolved is stored in advance, and the primary hydraulic pressure P1 and the secondary side where bubbles start to be generated from the processing liquid are stored. A differential pressure ΔPs with respect to the hydraulic pressure P2 is obtained, a threshold value ΔPt equal to or smaller than the value of the differential pressure ΔPs is set, and it is determined whether or not the actually obtained differential pressure ΔPe has reached the threshold value ΔPt. When it is determined that the value of the obtained differential pressure ΔPe has reached the threshold value ΔPt, processing for suppressing the generation of bubbles in the processing liquid is performed, so that inconveniences such as constantly degassing the processing liquid are caused. Therefore, it is possible to reliably prevent the generation of bubbles in the flow rate controller in a state where bubbles are not always generated in the flow rate controller. For this reason, it can prevent that an error generate | occur | produces in flow control, and can perform exact flow control.

  7 and 8, the deaeration mechanism 25 is operated as in the conventional case. However, unlike the conventional case, the deaeration mechanism 25 is not always operated, so that there is almost no adverse effect on the processing liquid.

Next, another embodiment of the present invention will be described.
FIG. 9 is a schematic configuration diagram showing a processing liquid supply mechanism of a liquid processing apparatus according to another embodiment of the present invention. Here, instead of providing the pressure control valve 24 as the primary side pressure adjusting mechanism, a pressurizing intermediate tank 61 capable of adjusting pressure is provided. The intermediate tank 61 has a pressurization pipe 62 inserted therein, and by changing the gas pressure of the pressurization gas from the pressurization pipe 62 by the pressure regulator 63, the primary side liquid upstream of the flow rate controller 27. The pressure P1 can be adjusted. Further, a decompression pipe 64 is inserted in the intermediate tank 61, and the processing liquid can be evacuated by operating a vacuum pump 65 connected thereto. Therefore, by providing such a pressurized intermediate tank 61, the primary side hydraulic pressure P1 is reduced to reduce the differential pressure, and the generation of bubbles by degassing the treatment liquid is prevented. In addition, it is possible to perform any of the prevention of the generation of bubbles by the combined use thereof.

  In addition, this invention is not limited to the said embodiment, A various deformation | transformation is possible. For example, in the above-described embodiment, the processing liquid supply mechanism that supplies one processing liquid is shown. However, the number of processing liquids may be two or more. In that case, for example, the processing liquid tank and the processing liquid supply A plurality of pipes may be provided.

  Furthermore, in the said embodiment, although shown about the case where a semiconductor wafer was applied as a to-be-processed substrate, it is not restricted to this, For example, other substrates, such as a flat panel display substrate represented by the glass substrate for liquid crystal display devices, It can also be applied to a substrate.

DESCRIPTION OF SYMBOLS 1; Liquid processing apparatus 2; Processing part 3; Processing liquid supply mechanism 11; Processing chamber 12; Spin chuck 13; Motor 14; Nozzle 21; Processing liquid tank 22; Processing liquid supply piping 24;
25; Deaeration mechanism 26; Primary pressure detector 27; Flow controller 28; Secondary pressure detector 30; Controller 35; Pump 41; Main body 42; Flow path 45; Variable orifice 46; 50; Overall control unit 51; Process controller 52; User interface 53; Storage unit (storage medium)
61; pressurization type intermediate tank 62; pressurization pipe 63; pressure regulator 64; decompression pipe 65; vacuum pump W; semiconductor wafer (substrate to be processed)

Claims (13)

A processing liquid supply mechanism for supplying a processing liquid to a target object when performing liquid processing on the target object,
A treatment liquid supply source;
A treatment liquid supply pipe for supplying a treatment liquid from the treatment liquid supply source;
A flow rate controller provided in the processing liquid supply pipe and having a variable orifice section for changing a flow cross-sectional area of the processing liquid;
A pressure detection mechanism for obtaining a hydraulic pressure on the primary side upstream from the variable orifice portion and a hydraulic pressure on the secondary side downstream from the variable orifice portion;
From the relationship between the liquid pressure of the processing liquid stored in advance and the amount of the gas component that can be dissolved in the processing liquid at the liquid pressure, the liquid pressure on the primary side and the secondary side that start to generate bubbles from the processing liquid And a threshold value ΔPt that is equal to or smaller than the value of the differential pressure ΔPs is set, and the actual pressure difference ΔPe between the primary hydraulic pressure and the secondary hydraulic pressure is determined. It is determined whether or not the value has reached the threshold value ΔPt, and when it is determined that the actually obtained differential pressure ΔPe has reached the threshold value ΔPt, the generation of bubbles in the processing liquid is suppressed. And a control mechanism for controlling the state of the processing liquid.   The pressure control mechanism further adjusts the pressure of the processing liquid on the primary side, and the control mechanism determines that the difference when the value of the actually obtained differential pressure ΔPe has reached the threshold value ΔPt. The processing liquid supply mechanism according to claim 1, wherein the state of the processing liquid is controlled by controlling pressure adjustment of the pressure adjusting mechanism so that a pressure value becomes lower than the threshold value ΔPt.   A degassing mechanism for degassing the primary processing solution, and the control mechanism determines that the differential pressure ΔPe has reached the threshold value ΔPt when the value of the actually determined differential pressure ΔPe has reached the threshold value ΔPt; 2. The processing liquid supply mechanism according to claim 1, wherein the state of the processing liquid is controlled by controlling the deaeration by the deaeration mechanism so that the value of is lower than the threshold value ΔPt.   A pressure adjusting mechanism for adjusting the pressure of the primary-side treatment liquid; and a deaeration mechanism for degassing the primary-side treatment liquid, wherein the control mechanism has a value of the differential pressure ΔPe actually obtained. When the pressure reaches the threshold value ΔPt, the pressure of the pressure adjusting mechanism is controlled to control the state of the processing liquid, and the pressure difference is lower than the threshold value ΔPt only by controlling the pressure adjusting mechanism. 2. The processing liquid according to claim 1, wherein the state of the processing liquid is controlled by operating the deaeration mechanism and controlling the value of the differential pressure to be lower than the threshold value ΔPt when not. Supply mechanism.   5. The processing liquid supply mechanism according to claim 2, wherein the pressure adjusting mechanism includes a pressure control valve provided on a primary side of the processing liquid supply pipe to control the pressure of the processing liquid. .   3. The pressure adjusting mechanism is provided on a primary side of the processing liquid supply pipe, and has an intermediate tank in which the processing liquid is temporarily stored and a processing liquid delivery pressure can be changed. The processing liquid supply mechanism described in 1.   The processing liquid supply mechanism according to claim 6, wherein the intermediate tank has a degassing mechanism for degassing the inside thereof. A processing liquid supply method for supplying a processing liquid to a target object when performing liquid processing on the target object,
Supplying the processing liquid while controlling the flow rate by a flow rate controller having a variable orifice part that changes the flow cross-sectional area of the processing liquid supplied from the processing liquid supply source to the substrate via the pipe;
Obtaining a primary side hydraulic pressure upstream of the variable orifice and a secondary secondary hydraulic pressure downstream of the variable orifice;
From the relationship between the liquid pressure of the treatment liquid and the amount of the gas component that can be dissolved in the treatment liquid at the liquid pressure, the liquid pressure on the primary side and the liquid pressure on the secondary side where bubbles start to be generated from the treatment liquid. Obtaining a differential pressure ΔPs and setting a threshold value ΔPt equal to or less than the value of the differential pressure ΔPs;
Determining whether the value of the differential pressure ΔPe between the primary side hydraulic pressure and the secondary side hydraulic pressure actually obtained has reached the threshold value ΔPt;
And a step of controlling the state of the processing liquid so as to suppress the generation of bubbles of the processing liquid when it is determined that the value of the actually obtained differential pressure ΔPe has reached the threshold value ΔPt. Processing liquid supply method.   In the controlling step, when it is determined that the value of the actually obtained differential pressure ΔPe has reached the threshold value ΔPt, the primary side processing is performed so that the differential pressure value becomes lower than the threshold value ΔPt. The processing liquid supply method according to claim 8, wherein the pressure of the liquid is adjusted.   In the controlling step, when it is determined that the value of the actually obtained differential pressure ΔPe has reached the threshold value ΔPt, the primary side processing is performed so that the differential pressure value becomes lower than the threshold value ΔPt. The process liquid supply method according to claim 8, wherein the liquid is degassed.   The controlling step adjusts the pressure of the processing liquid on the primary side when it is determined that the value of the actually obtained differential pressure ΔPe has reached the threshold value ΔPt. 9. The processing liquid supply method according to claim 8, wherein when the pressure does not become lower than ΔPt, the processing liquid on the primary side is deaerated so that the differential pressure becomes lower than the threshold value ΔPt. A substrate processing unit for performing liquid processing on the substrate;
A processing liquid supply mechanism for supplying a processing liquid to the substrate processing unit;
The liquid processing apparatus according to claim 1, wherein the processing liquid supply mechanism is the one described in any one of claims 1 to 7. 12. A storage medium that operates on a computer and stores a program for controlling a processing liquid supply mechanism, wherein the program is executed at the time of execution. A storage medium that causes a computer to control a processing device so that the processing is performed.

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